A heat dissipation architecture of an optoelectronic module and an electronic device

Abstract

The application relates to the technical field of photoelectric modules, and discloses a heat dissipation architecture of a photoelectric module and electronic equipment, the heat dissipation architecture of the photoelectric module comprising an electric chip and multiple light engines, the multiple light engines being distributed along the periphery of the electric chip; further comprising a main cold plate for dissipating heat for the electric chip, a secondary cold plate for dissipating heat for each light engine, and a heat pipe assembly corresponding to the secondary cold plate in a one-to-one manner, the evaporation end of the heat pipe assembly being connected with the secondary cold plate, the condensation end of the heat pipe assembly being connected with the main cold plate, and the main cold plate being provided with a flow channel for dissipating heat for each heat pipe assembly; wherein the secondary cold plate has a maintenance station, and when the secondary cold plate is at the maintenance station, the secondary cold plate and the corresponding light engine have an operation space for maintaining the light engine. The heat dissipation architecture of the photoelectric module and the electronic equipment improve the problem that when a certain light module is replaced, the whole cold plate needs to be disassembled, and the replacement process of the light engine is relatively complicated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optoelectronic modules, and in particular to a heat dissipation architecture of an optoelectronic module and an electronic device. BACKGROUND

[0002] Under the strong pull of technologies such as high-performance computing (HPC) and artificial intelligence (AI), the electronic device optical device co-packaged optics (CPO) and near-packaged optics (NPO) technology route is rapidly evolving, which has brought about a major change in the heat source distribution of the optoelectronic module in the electronic device. Taking an optoelectronic module including an ASIC chip and 16 optical engines (OEs) closely surrounding the ASIC chip as an example, the total heat dissipation power of the optoelectronic module is as high as 1100-1850W. It can be seen that the heat dissipation of the optoelectronic module has become a challenge and restricts the landing application of the CPO / NPO technology.

[0003] In the prior art, a cold plate liquid cooling technology is used to achieve the heat dissipation of the optoelectronic module. However, in actual application, the optical engines often need to be replaced, but when the existing cold plate liquid cooling technology is used, the entire cold plate needs to be removed when replacing a certain optical engine, making the replacement process of the optical engine relatively cumbersome. SUMMARY

[0004] The present application provides a heat dissipation architecture of an optoelectronic module and an electronic device, which can improve the problem that the entire cold plate needs to be removed when replacing a certain optical module, making the replacement process of the optical engine relatively cumbersome.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] A heat dissipation architecture of an optoelectronic module includes an electric chip and a plurality of optical engines, the plurality of optical engines are distributed along the circumference of the electric chip; further includes a main cold plate for dissipating heat for the electric chip, a secondary cold plate for dissipating heat for each of the optical engines, and a heat pipe assembly corresponding to each of the secondary cold plates, the evaporation end of the heat pipe assembly is connected with the secondary cold plate, the condensation end of the heat pipe assembly is connected with the main cold plate, and the main cold plate is provided with a flow channel for dissipating heat for each of the heat pipe assemblies;

[0007] Among them, the secondary cold plate has a maintenance station, when the secondary cold plate is in the maintenance station, the secondary cold plate and the corresponding optical engine have an operation space for maintaining the optical engine.

[0008] The heat dissipation architecture of the photoelectric module provided by the application is characterized in that the main cold plate is used to dissipate heat of the electric chip, the evaporation end of the heat pipe is used to carry away heat of the auxiliary cold plate, the condensation end of the heat pipe is cooled by the main cold plate, and the light engine is cooled.

[0009] In addition, in the heat dissipation architecture of the photoelectric module provided by the application, the connection between the main cold plate and the auxiliary cold plate does not introduce a liquid pipeline and a joint, so that the connection between the main cold plate and the auxiliary cold plate does not have the risk of leakage of the cooling liquid, and is more conducive to safe operation of the electronic device provided with the heat dissipation architecture.

[0010] Optionally, the electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group includes a plurality of light engines arranged along the length direction of the corresponding side of the electric chip.

[0011] The auxiliary cold plate corresponds to the light engine group one by one, and the heat pipe assembly includes two first heat pipes arranged at intervals along the length direction of the corresponding side of the electric chip, each of the two first heat pipes including the evaporation end rotatably arranged on the auxiliary cold plate, the condensation end rotatably arranged on the main cold plate, and the connecting segment connecting the evaporation end and the condensation end.

[0012] The two first heat pipes in the same heat pipe assembly, the main cold plate, and the corresponding auxiliary cold plate together form a double-crank mechanism, and the line between the two condensation ends on the main cold plate is the rack of the double-crank mechanism, so that the auxiliary cold plate can be switched from the installation station to the maintenance station.

[0013] Optionally, the double-crank mechanism is an unequal-length double-crank mechanism or an equal-length double-crank mechanism.

[0014] Optionally, the heat pipe assembly includes a virtual constraint heat pipe, the virtual constraint heat pipe including the evaporation end arranged on the corresponding auxiliary cold plate, the condensation end arranged on the main cold plate, and the connecting segment connecting the evaporation end and the condensation end, and the virtual constraint heat pipe forms a virtual constraint between the main cold plate and the corresponding auxiliary cold plate.

[0015] Optionally, the electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group comprises a plurality of light engines arranged along the length direction of the corresponding side of the electric chip.

[0016] The auxiliary cold plate corresponds to the light engine group one by one, and the heat pipe assembly comprises a second heat pipe, the second heat pipe comprises a first part rotatably arranged at one end of the main cold plate and a second part connected to the first part away from the one end of the main cold plate, and the second part is fixedly connected to the corresponding auxiliary cold plate.

[0017] Optionally, the length direction of the auxiliary cold plate is parallel to the length direction of the corresponding side of the electric chip.

[0018] The first part and the corresponding second part form an included angle, and the first part and the corresponding auxiliary cold plate are arranged in sequence in the length direction of the auxiliary cold plate.

[0019] Optionally, the electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group comprises a plurality of light engines arranged along the length direction of the corresponding side of the electric chip.

[0020] The auxiliary cold plate corresponds to the light engine group one by one, and the heat pipe assembly comprises at least one third heat pipe, the third heat pipe comprises a third part detachably connected to the main cold plate and a fourth part connected to the third part away from the one end of the main cold plate, and the fourth part is fixedly connected to the corresponding auxiliary cold plate.

[0021] Optionally, the light engine corresponds to the auxiliary cold plate one by one, and the heat pipe assembly comprises at least one fourth heat pipe, the fourth heat pipe comprises a fifth part detachably connected to the main cold plate and a sixth part connected to the fifth part away from the one end of the main cold plate, and the sixth part is fixedly connected to the corresponding auxiliary cold plate.

[0022] Optionally, the main cold plate is provided with a first limiting insertion hole corresponding to the condensing end of each heat pipe, the condensing end of each heat pipe is inserted into the corresponding first limiting insertion hole, and the inner wall of each first limiting insertion hole or the outer circumferential surface of each heat pipe is provided with a first heat conduction layer.

[0023] And / or, the auxiliary cold plate is provided with a second limiting insertion hole corresponding to the evaporating end of each heat pipe in the corresponding heat pipe assembly, the evaporating end of each heat pipe is inserted into the corresponding second limiting insertion hole, and the inner wall of each second limiting insertion hole or the outer circumferential surface of each heat pipe is provided with a second heat conduction layer.

[0024] Optionally, the flow channel corresponds to each heat pipe one by one, and each flow channel is arranged around the outer periphery of the corresponding heat pipe to achieve heat dissipation of the electric chip and each heat pipe.

[0025] Optionally, the main cold plate is a rectangular cold plate, each heat pipe is connected to the periphery of the rectangular cold plate, and a heat radiator is arranged in the middle of the rectangular cold plate.

[0026] The application also provides an electronic device comprising the heat dissipation architecture of the photoelectric module.

[0027] The electronic device provided by the application comprises the heat dissipation architecture of the photoelectric module, in which the main cold plate is used for heat dissipation of the electric chip, the evaporation end of the heat pipe is used for heat dissipation of the auxiliary cold plate, the condensation end of the heat pipe is cooled by the main cold plate, and the auxiliary cold plate is used for heat dissipation of each light engine. The auxiliary cold plate has a maintenance station, and when the auxiliary cold plate is in the maintenance station, the auxiliary cold plate and the corresponding light engine have an operation space for maintenance of the light engine. When the light engine is maintained (for example, repaired or replaced), the entire cold plate system does not need to be disassembled, and the auxiliary cold plate is in the maintenance station, so that the replacement and maintenance of the light engine are more convenient and faster compared with the prior art.

[0028] In addition, in the heat dissipation architecture of the photoelectric module, the connection between the main cold plate and the auxiliary cold plate does not introduce a liquid pipeline and a joint, so that the connection between the main cold plate and the auxiliary cold plate does not have the risk of leakage of the cooling liquid, and is more conducive to safe operation of the electronic device provided with the heat dissipation architecture. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 FIG. 1 is a schematic diagram of a heat dissipation architecture of a photoelectric module provided by an embodiment of the application;

[0030] Figure 2 FIG. 2 is a schematic diagram of another heat dissipation architecture of a photoelectric module provided by an embodiment of the application;

[0031] Figure 3 FIG. 3 is a schematic diagram of a heat dissipation architecture of a photoelectric module provided by an embodiment of the application; Figure 2 FIG. 4 is a side view of the heat dissipation architecture of the photoelectric module shown in FIG. 3;

[0032] Figure 4 FIG. 5 is a schematic diagram of a heat dissipation architecture of a photoelectric module provided by an embodiment of the application; Figure 1 FIG. 6 is a schematic diagram of a heat dissipation architecture of a photoelectric module provided by an embodiment of the application, in which the auxiliary cold plate is in the installation station and the maintenance station;

[0033] Figure 5 FIG. 7 is a schematic diagram of another heat dissipation architecture of a photoelectric module provided by an embodiment of the application;

[0034] Figure 6 FIG. 8 is a schematic diagram of another heat dissipation architecture of a photoelectric module provided by an embodiment of the application;

[0035] Figure 7 Another schematic diagram of a heat dissipation architecture of an optoelectronic module provided by an embodiment of the present application is shown in FIG. 3.

[0036] Figure 8 A partial structural schematic diagram of the heat dissipation architecture of the optoelectronic module shown in FIG. 3 is shown in FIG. 4. Figure 1

[0037] FIG. 1: 1-main cold plate; 2-secondary cold plate; 3-heat pipe assembly; 31-first heat pipe; 32-virtual constraint heat pipe; 33-second heat pipe; 34-third heat pipe; 35-fourth heat pipe; 41-first heat conduction layer; 42-second heat conduction layer; 5-radiator; 6-flow channel; 7-coolant inlet; 8-coolant outlet; 91-liquid separation structure; 92-liquid collection structure. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0039] The heat dissipation architecture of the optoelectronic module provided by the present embodiment includes an electric chip (for example, an ASIC chip) and a plurality of optical engines OE (Optical Engine) distributed along the periphery of the electric chip, and further includes a main cold plate 1 for dissipating heat of the electric chip, a secondary cold plate 2 for dissipating heat of each optical engine, and a heat pipe assembly 3 corresponding to each secondary cold plate 2. The evaporation end of the heat pipe assembly 3 is connected with the secondary cold plate 2, the condensation end of the heat pipe assembly 3 is connected with the main cold plate 1, and the main cold plate 1 is provided with a flow channel 6 for dissipating heat of each heat pipe assembly 3.

[0040] The secondary cold plate 2 has a maintenance station, and when the secondary cold plate 2 is at the maintenance station, the secondary cold plate 2 and the corresponding optical engine have an operation space for maintaining the optical engine.

[0041] In the heat dissipation architecture of the optoelectronic module provided by the present embodiment, the electric chip is cooled by the main cold plate 1, the heat of the secondary cold plate 2 is taken away by the evaporation end of the heat pipe, and the condensation end of the heat pipe is cooled by the main cold plate 1, so as to cool each optical engine. The secondary cold plate 2 has a maintenance station, and when the secondary cold plate 2 is at the maintenance station, the secondary cold plate 2 and the corresponding optical engine have an operation space for maintaining the optical engine. When the optical engine is maintained (for example, repaired or replaced), the entire cold plate system does not need to be disassembled, and the secondary cold plate 2 can be placed at the maintenance station. Compared with the prior art, the replacement and maintenance of the optical engine are more convenient and fast.

[0042] ​In addition, in the heat dissipation architecture of the optoelectronic module provided in the embodiment, the connection between the main cold plate 1 and the auxiliary cold plate 2 does not introduce liquid pipelines and joints, so that the connection between the main cold plate 1 and the auxiliary cold plate 2 does not have the risk of leakage of the cooling liquid, and is more conducive to the safe operation of the electronic device provided with the heat dissipation architecture.

[0043] The auxiliary cold plate 2 mentioned in the embodiment can be a metal plate with good heat conduction performance, for example, a copper plate or an aluminum plate, etc. The main cold plate 1 can be fixed on the related structure by screws, and the person skilled in the art knows that the main cold plate 1 does not need to be disassembled when maintaining the light engine.

[0044] The electric chip is usually a polygonal structure. In an optional implementation, a plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group includes a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. Figures 1-3 As shown in the figure, the auxiliary cold plate 2 corresponds to one light engine group, and the heat pipe assembly 3 includes:

[0045] Two first heat pipes 31 arranged at intervals along the length direction of the corresponding side of the electric chip, each of the two first heat pipes 31 includes an evaporation end rotatably arranged on the auxiliary cold plate 2, a condensation end rotatably arranged on the main cold plate 1, and a connecting segment connecting the evaporation end and the condensation end; the two first heat pipes 31, the main cold plate 1 and the auxiliary cold plate 2 together constitute a double-crank mechanism, and the line between the two condensation ends on the main cold plate 1 is the rack of the double-crank mechanism, so that when one or more light engines in a certain light engine group need to be repaired or replaced, the corresponding auxiliary cold plate 2 is flipped in a direction away from the corresponding light engine after the connection between the auxiliary cold plate 2 and the related structure is released (i.e., the auxiliary cold plate 2 can be switched from the installation station to the maintenance station), that is, the corresponding light engine can be exposed. Figure 4 For example, the auxiliary cold plate 2 in the horizontal state in the figure is in the installation station, and the auxiliary cold plate 2 above is switched to the maintenance station after being flipped.

[0046] In addition, the two first heat pipes 31, the main cold plate 1 and the auxiliary cold plate 2 together constitute a double-crank mechanism, and the part (i.e., the connecting segment) between the main cold plate 1 and the corresponding auxiliary cold plate 2 is conducive to absorbing the height difference between the main cold plate 1 and the auxiliary cold plate 2, so that the installation of the heat dissipation architecture of the optoelectronic module provided in the embodiment is easier.

[0047] The two first heat pipes 31 in the same heat pipe assembly 3 and the main cold plate 1 and the corresponding secondary cold plate 2 jointly constitute a double-crank mechanism, and the line between the two condensing ends on the main cold plate 1 is the frame of the double-crank mechanism. Specifically, the part of the two first heat pipes in the same heat pipe assembly 3 between the main cold plate 1 and the corresponding secondary cold plate 2 is a connecting frame rod, and the line between the evaporation ends of the two first heat pipes is a connecting rod. In order to facilitate description, the frame is denoted as S, the longer one of the two connecting frame rods is denoted as L, the shorter one is denoted as P, and the connecting rod is denoted as Q. The above-mentioned double-crank mechanism satisfies: S+L=P+Q.

[0048] Exemplarily, the above-mentioned double-crank mechanism can be an unequal-length double-crank mechanism or an equal-length double-crank mechanism; and the connecting sections of the heat pipes in each heat pipe assembly 3 can all be linear or all be bent.

[0049] The pipe shell of each heat pipe can be of metal material, and at the same time, the heat pipe can be of a three-section structure with two 90°-135° bends. Since metal itself has certain ductility and elasticity, it can better eliminate the height difference, unevenness and thermal stress between the cold plate and the heat source plane caused by processing errors, actual assembly tolerances and thermal expansion and contraction, etc., which are not conducive to cooperation and heat dissipation.

[0050] If the space is still insufficient, the secondary cold plate can be pulled out from the main cold plate together with the heat pipes inserted into the main cold plate, and after the light engine replacement is completed, each heat pipe is inserted into the main cold plate and rotated back to the horizontal angle to be fastened.

[0051] Exemplarily, the secondary cold plate can be fixed to the relevant structure by buckling.

[0052] Please continue to refer to Figure 2 When the above-mentioned heat pipe assembly 3 is specifically set, in an optional implementation manner, the heat pipe assembly 3 further includes a virtual constraint heat pipe 32, the virtual constraint heat pipe 32 includes an evaporation end arranged on the corresponding secondary cold plate 2, a condensing end arranged on the main cold plate 1, and a connecting section connecting the evaporation end and the condensing end, and the virtual constraint heat pipe 32 forms a virtual constraint between the main cold plate 1 and the corresponding secondary cold plate 2.

[0053] The virtual constraint heat pipe 32 forms a virtual constraint between the main cold plate 1 and the corresponding secondary cold plate 2, that is, the constraint formed by the virtual constraint heat pipe 32 between the main cold plate 1 and the corresponding secondary cold plate 2 is repeated with the constraint of the other kinematic pair, and the virtual constraint heat pipe 32 actually does not play a role in constraint for the movement of the mechanism.

[0054] Exemplarily, in an optional implementation, the connecting section of the virtual constraint heat pipe 32 can be in a bellows shape, so that the virtual constraint heat pipe 32 forms a virtual constraint between the main cold plate 1 and the corresponding secondary cold plate 2; in another optional implementation, the hole on the secondary cold plate 2 for connecting with the corresponding virtual constraint heat pipe 32 is an oblong hole, so that the virtual constraint heat pipe 32 forms a virtual constraint between the main cold plate 1 and the corresponding secondary cold plate 2.

[0055] Still taking the electric chip as a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group includes a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. For example, in an optional implementation, as shown in Figure 5 Fig. 2, the secondary cold plate 2 corresponds to one light engine group, and the heat pipe assembly 3 includes a second heat pipe 33. The second heat pipe 33 includes a first part rotatably arranged at one end of the main cold plate 1 and a second part connected to the end of the first part away from the main cold plate 1. The second part is fixedly connected (for example, by brazing) to the corresponding secondary cold plate 2.

[0056] At this time, the first part forms a flip axis of the corresponding secondary cold plate 2. When one or more light engines in a certain light engine group need to be repaired or replaced, the corresponding secondary cold plate 2 is flipped in a direction away from the corresponding light engine (i.e., the secondary cold plate 2 can be switched from a mounting station to a maintenance station), that is, the corresponding light engine can be exposed.

[0057] Further, in an optional implementation, the length direction of the secondary cold plate 2 is parallel to the length direction of the corresponding side of the electric chip, the first part and the corresponding second part form an included angle, and the first part and the corresponding second part are arranged in sequence in the length direction of the corresponding secondary cold plate 2. That is, the rotation axis of the secondary cold plate 2 is located on the outside of the secondary cold plate 2, so that the contact area between the second part and the corresponding secondary cold plate 2 is increased, the connection reliability between the second part and the corresponding secondary cold plate 2 is stronger, and the secondary cold plate 2 does not interfere with the light engine and other components during the flipping process.

[0058] Still taking the electric chip as a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group includes a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. For example, in an optional implementation, as shown in Figure 6 Fig. 3, the heat pipe assembly 3 includes at least one third heat pipe 34. The third heat pipe 34 includes a third part detachably connected to the main cold plate 1 and a fourth part connected to the end of the third part away from the main cold plate 1. The fourth part is fixedly connected (for example, by brazing) to the corresponding secondary cold plate 2.

[0059] At this time, when it is necessary to repair or replace one or more light engines in a certain light engine group, disconnect the connection between the corresponding third heat pipe 34 and the main cold plate 1, and then disconnect the connection between the secondary cold plate 2 and the surrounding components. This allows the secondary cold plate 2 and the third heat pipe 34 to be removed, exposing the corresponding light engine.

[0060] Specifically, the number of third heat pipes can be one, two, or three, etc.

[0061] The third heat pipe 34 is detachably connected to the main cold plate 1. For example, the main cold plate may have corresponding insertion holes for each of the third heat pipes, with the condenser end of the third heat pipe 34 inserted into the corresponding insertion hole. Alternatively, the main cold plate may have corresponding limiting grooves for each of the third heat pipes, with the condenser end of the third heat pipe 34 positioned in the corresponding limiting groove and fixed in the corresponding limiting groove by a cover plate with fasteners (e.g., snap-fit). Specifically, one cover plate can be provided for each heat pipe or for each heat pipe assembly. When the light engine needs to be replaced, the corresponding snap-fit ​​can be opened, allowing the cover plate to be removed (the limiting groove is replaced by a hinge) for maintenance or replacement of the corresponding light engine.

[0062] It should be noted that when the cover plate is fixed in the limiting groove by the fastener and the hinge, the corresponding buckle can be flipped open when the light engine needs to be replaced.

[0063] like Figure 7 As shown, in another optional implementation, the light engine corresponds one-to-one with the secondary cold plate 2, and the heat pipe assembly 3 includes at least one fourth heat pipe 35. The fourth heat pipe 35 includes a fifth part that is detachably connected to the main cold plate 1 and a sixth part connected to the end of the fifth part away from the main cold plate 1. The sixth part is fixedly connected to the corresponding secondary cold plate 2 (e.g., by brazing).

[0064] At this time, when it is necessary to repair or replace one or more light engines in a certain light engine group, disconnect the connection between the corresponding fourth heat pipe 35 and the main cold plate 1, and then disconnect the connection between the secondary cold plate 2 and the surrounding components. This allows the secondary cold plate 2 and the fourth heat pipe 35 to be removed, exposing the corresponding light engine.

[0065] Specifically, the number of fourth heat pipes can be one, two, or three, etc.

[0066] The fourth heat pipe 35 is detachably connected with the main cold plate 1. Exemplarily, the main cold plate can be provided with a plurality of insertion holes corresponding to the fourth heat pipes 35, and the condensing ends of the fourth heat pipes 35 are inserted into the corresponding insertion holes. Alternatively, the main cold plate can be provided with a plurality of limiting grooves corresponding to the fourth heat pipes 35, and the condensing ends of the fourth heat pipes 35 are arranged in the corresponding limiting grooves and fixed in the corresponding limiting grooves by a cover plate provided with buckles (for example, buckles).

[0067] It should be noted that when the cover plate is fixed in the limiting groove by the buckles and the hinges, the buckles corresponding to the light engines to be replaced can be opened.

[0068] In an alternative implementation, the main cold plate 1 is provided with a plurality of first limiting insertion holes corresponding to the condensing ends of the heat pipes, and the condensing ends of the heat pipes are inserted into the corresponding first limiting insertion holes. The inner wall of each first limiting insertion hole or the outer circumferential surface of each heat pipe is provided with a first heat conduction layer 41, so that the main cold plate 1 can more quickly and effectively dissipate heat from the heat pipes.

[0069] In an alternative implementation, the auxiliary cold plate is provided with a plurality of second limiting insertion holes corresponding to the evaporating ends of the heat pipes in the corresponding heat pipe assembly, and the evaporating ends of the heat pipes are inserted into the corresponding second limiting insertion holes. The inner wall of each second limiting insertion hole or the outer circumferential surface of each heat pipe is provided with a second heat conduction layer 42.

[0070] Exemplarily, the material of the heat conduction layer can be high-thermal-conductivity carbon fiber, and the heat conduction layer can be a barrel-shaped structure with one end open and sleeved on the heat pipe.

[0071] As shown in Figure 8 In an alternative implementation, each flow channel 6 corresponds to a heat pipe, and each flow channel 6 is arranged around the outer periphery of the corresponding heat pipe to dissipate heat from the electric chip and the heat pipes.

[0072] Exemplarily, the main cold plate is provided with a cooling liquid inlet 7 and a cooling liquid outlet 8, and each flow channel is in communication with the cooling liquid inlet 7 at one end and the cooling liquid outlet 8 at the other end.

[0073] Further, the cooling liquid inlet 7 can be in communication with each flow channel through a liquid distribution structure 91, and the cooling liquid outlet 8 can be in communication with each flow channel through a liquid collection structure 92. Please continue to refer to Figure 8In one alternative implementation, the coolant flows from the heat dissipation channels of the two heat pipes on the left to the heat dissipation channels of the two heat pipes below via a bypass channel. This bypass channel bypasses the heat pipe limiting holes and is not connected to the heat pipes. The flowing coolant provides heat dissipation for the ASIC chip and the heat pipes, while the two heat pipes on each side provide heat dissipation for the corresponding four optical engines. Of course, other series-parallel designs can also be used for the flow channels.

[0074] Furthermore, in one optional implementation, the main cold plate 1 is a rectangular cold plate, and each heat pipe is connected to the periphery of the rectangular cold plate. A heat sink 5 is provided in the middle of the rectangular cold plate to increase the effective area of ​​the heat dissipation architecture of the optoelectronic module provided in this embodiment, and to dissipate heat from the optoelectronic module more efficiently and quickly.

[0075] by Figure 8 For example, to maximize the length of the heat pipe inserted into the main cold plate (i.e., the heat exchange area), each heat pipe is positioned near the corresponding edge of the main cold plate, with the toothed radiator in the center and the heat pipes around it. In this case, the contact length between the heat pipe and the main cold plate is close to 70% of the side length of the main cold plate. However, if the heat pipe is positioned in the center of the corresponding edge of the main cold plate, the contact length between the heat pipe and the main cold plate will not exceed 50% of the side length of the main cold plate. Furthermore, positioning the limiting holes at the edge of the main cold plate helps reduce its thickness.

[0076] For example, the radiator 5 described above can be a shovel-tooth radiator.

[0077] This embodiment provides an electronic device including the aforementioned heat dissipation architecture for the optoelectronic module. In this architecture, the main cold plate 1 dissipates heat from the electronic chip, the evaporation end of the heat pipe carries away heat from the secondary cold plate 2, and the main cold plate 1 cools the condensation end of the heat pipe, thereby dissipating heat from each optical engine. The secondary cold plate 2 has a maintenance bay, and when in the maintenance bay, there is an operating space between the secondary cold plate 2 and the corresponding optical engine for maintaining the optical engine. When maintaining (e.g., repairing or replacing) the optical engine, it is not necessary to disassemble the entire cold plate system; simply placing the secondary cold plate 2 in the maintenance bay is sufficient. Compared to existing technologies, the replacement and maintenance of the optical engine is simpler and faster.

[0078] The electronic devices mentioned in this embodiment can be switches, servers, etc., and multi-heat source cold plate heat dissipation systems that require maintenance.

[0079] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A heat dissipation architecture for optoelectronic modules, characterized in that, The application relates to an electric chip and a plurality of light engines distributed along the periphery of the electric chip; further comprising a main cold plate for dissipating heat for the electric chip, a plurality of sub-cold plates for dissipating heat for the light engines, and a plurality of heat pipe assemblies corresponding to the sub-cold plates, the evaporation end of the heat pipe assembly being connected to the sub-cold plate, and the condensation end of the heat pipe assembly being connected to the main cold plate, and the main cold plate being provided with flow channels for dissipating heat for the heat pipe assemblies. The sub-cold plate has a maintenance station, and when the sub-cold plate is in the maintenance station, the sub-cold plate and the corresponding light engine have an operation space for maintaining the light engine.

2. The heat dissipation architecture of claim 1, wherein, The electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group comprises a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. The sub-cold plate corresponds to the light engine group, the heat pipe assembly comprises two first heat pipes arranged at intervals along the length direction of the corresponding side of the electric chip, and each first heat pipe comprises an evaporation end rotatably arranged on the sub-cold plate, a condensation end rotatably arranged on the main cold plate, and a connecting section connecting the evaporation end and the condensation end. The two first heat pipes in the same heat pipe assembly and the main cold plate and the corresponding sub-cold plate jointly form a double-crank mechanism, and the line between the two condensation ends on the main cold plate is the frame of the double-crank mechanism, so that the sub-cold plate can be switched from the installation station to the maintenance station.

3. The heat dissipation architecture of claim 2, wherein, The double-crank mechanism is an unequal-length double-crank mechanism or an equal-length double-crank mechanism.

4. The heat dissipation architecture of claim 2, wherein, The heat pipe assembly comprises a virtual constraint heat pipe, the virtual constraint heat pipe comprises an evaporation end arranged on the corresponding sub-cold plate, a condensation end arranged on the main cold plate, and a connecting section connecting the evaporation end and the condensation end, and the virtual constraint heat pipe forms a virtual constraint between the main cold plate and the corresponding sub-cold plate.

5. The heat dissipation architecture of claim 1, wherein, The electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group comprises a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. The sub-cold plate corresponds to the light engine group, the heat pipe assembly comprises a second heat pipe, the second heat pipe comprises a first part rotatably arranged on one end of the main cold plate and a second part connected to the first part away from the one end of the main cold plate, and the second part is fixedly connected to the corresponding sub-cold plate.

6. The heat dissipation architecture of claim 5, wherein, The length direction of the sub-cold plate is parallel to the length direction of the corresponding side of the electric chip. The first part and the corresponding second part form an included angle, and the first part and the corresponding sub-cold plate are arranged in sequence in the length direction of the sub-cold plate.

7. The heat dissipation architecture of claim 1, wherein, The electric chip is in a polygonal structure, the plurality of light engines are divided into a plurality of light engine groups, different light engine groups correspond to different sides of the electric chip, and each light engine group comprises a plurality of light engines arranged along the length direction of the corresponding side of the electric chip. The sub-cool plate corresponds to the light engine group one by one, the heat pipe assembly includes at least one third heat pipe, the third heat pipe includes a third part which is detachably connected with the main cold plate and a fourth part which is connected to the end of the third part away from the main cold plate, and the fourth part is fixedly connected with the corresponding sub-cool plate.

8. The heat dissipation architecture of claim 1, wherein, The light engine corresponds to the sub-cool plate one by one, the heat pipe assembly includes at least one fourth heat pipe, the fourth heat pipe includes a fifth part which is detachably connected with the main cold plate and a sixth part which is connected to the end of the fifth part away from the main cold plate, and the sixth part is fixedly connected with the corresponding sub-cool plate.

9. The heat dissipation architecture of any of claims 2-8, wherein, The main cold plate is provided with a first limiting insertion hole corresponding to the condensing end of each heat pipe, the condensing end of each heat pipe is inserted into the corresponding first limiting insertion hole, and the inner wall of each first limiting insertion hole or the outer peripheral surface of each heat pipe is provided with a first heat conduction layer. And / or, the sub-cool plate is provided with a second limiting insertion hole corresponding to the evaporating end of each heat pipe in the corresponding heat pipe assembly, the evaporating end of each heat pipe is inserted into the corresponding second limiting insertion hole, and the inner wall of each second limiting insertion hole or the outer peripheral surface of each heat pipe is provided with a second heat conduction layer.

10. The heat dissipation architecture of any of claims 2-8, wherein, The flow channel corresponds to each heat pipe one by one, and each flow channel is arranged around the outer periphery of the corresponding heat pipe to realize heat dissipation of the electric chip and each heat pipe.

11. The heat dissipation architecture of claim 10, wherein, The main cold plate is a rectangular cold plate, each heat pipe is connected to the periphery of the rectangular cold plate, and the middle part of the rectangular cold plate is provided with a radiator.

12. An electronic device, comprising: A heat dissipation structure including the optoelectronic module of any one of claims 1-11.

Images