A chip placement device for semiconductor chip processing

Abstract

The present invention discloses a patch device for semiconductor chip processing, comprising a workbench, a control device is arranged on one side of the workbench, a support column is arranged on the upper part of the workbench, a substrate conveying groove is arranged on one side of the support column, a heating groove is arranged on the other side, a first heating plate is arranged on the inner surface of the heating groove, a chip conveying groove is arranged on the upper part of the workbench between the support column and the heating groove, and a conveyor belt mechanism is arranged on the inner surface of both longitudinal sides of the substrate conveying groove and the chip conveying groove. The beneficial effects of the present invention are: the present invention has a reasonable design, a stable and firm overall structure, strong practicality, can increase the speed of chip heating, and can avoid the substrate from heating up quickly and having a large local temperature difference when the conductive silver paste is solidified after patching, thereby avoiding the situation where the substrate is prone to warping, ensuring the stability of the quality of the finished product, and in addition, the chip heating and chip patching operations can be performed simultaneously, thereby greatly improving the efficiency of patch processing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production and processing, and in particular to a chip mounting device for semiconductor chip processing. Background Art

[0002] The integrated circuit (IC) industry is a high-growth point in the current global economic development. Among them, the advancement of semiconductor manufacturing technology and the rapid growth of market demand for tiny chips have made the chip I / O density higher and higher, and the chip lead spacing and pad diameter continue to decrease. At the same time, in order to improve production efficiency, the packaging speed has increased year by year, which has put forward extremely high requirements on the positioning accuracy and operating speed of post-packaging equipment. The chip mounting equipment determines the accuracy, efficiency and stability of the chip mounting process and is the key equipment in the chip packaging process.

[0003] Chinese patent CN115424947A discloses a semiconductor chip mounting process and equipment, which coats or drips conductive glue on a base island of a substrate, then sucks and places a wafer with a metal layer on the back side onto the base island so that the metal layer contacts the conductive glue, and finally heats the wafer and the substrate together to a preset curing temperature so that the conductive glue is cured to bond the wafer and the base island; in the above scheme, the semiconductor chip is sucked and placed on a substrate coated or dripped with conductive glue, and then the chip and the substrate are sent into a baking oven for curing. Not only is the efficiency of the mounting process low, but it is also easy to cause the substrate to warp due to heat, affecting the quality of the finished product, and further development and improvement are needed. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor chip processing bonding device in order to solve the problem that the existing equipment used for semiconductor chip bonding not only has low bonding processing efficiency, but also easily causes the substrate to warp due to heat, thus affecting the quality of the finished product.

[0005] The present invention achieves the above-mentioned purpose through the following technical solutions: a chip placement device for semiconductor chip processing, comprising a workbench, a control device is arranged on one side of the workbench, a support column is arranged on the upper part of the workbench, a substrate conveying groove is arranged on one side of the support column, and a heating groove is arranged on the other side, a first heating plate is arranged on the inner surface of the heating groove, a chip conveying groove is arranged on the upper part of the workbench between the support column and the heating groove, conveyor belt mechanisms are arranged on the inner surfaces of the longitudinal sides of the substrate conveying groove and the chip conveying groove, a preheating component is arranged on the inner surface of the bottom of the substrate conveying groove and the chip conveying groove between the conveyor belt mechanisms, and the work A cleaning assembly is provided at the loading end of the substrate conveying slot and the chip conveying slot on the upper part of the workbench, and a grouting assembly is provided above the substrate conveying slot on one side of the cleaning assembly transversely close to the support column, one side of the support column has a first rectangular hollowing out, and a first rotating motor is provided on the inner surface of the bottom of the first rectangular hollowing out, a first rotating shaft is provided between the top of the support column and the first rectangular hollowing out, the bottom of the first rotating shaft is connected to the first rotating motor, a rotating support beam is provided on the circumferential outer surface of the first rotating shaft above the support column, and the upper part of the rotating support beam is located on both sides of the support column and is slidably connected with patch assemblies.

[0006] Furthermore, the preheating assembly includes a supporting base, a bearing seat is arranged on the top of the supporting base, a bearing groove is provided on the top of the bearing seat, a second heating plate is arranged in the bearing groove, an insulation plate is arranged between the second heating plate and the inner surface of the bearing groove, and a temperature sensor is recessed on the top of the second heating plate.

[0007] Furthermore, the cleaning assembly includes a bellows body, the bottom of which is connected to the upper part of the workbench, material guide grooves are provided on both lateral sides of the bellows body and located inside the substrate conveying groove and the chip conveying groove, an ion blower is provided on the top of the bellows body, and the ion blower is connected to the interior of the bellows body, a number of air outlets are equidistantly provided on both longitudinal sides of the bellows body from top to bottom, and an air equalizing plate is provided between the inner surface of the top of the bellows body and the air outlet.

[0008] Further, the grouting assembly includes a movable support frame arranged above the substrate conveying groove, the movable support frame is connected to the upper part of the workbench in a transverse sliding manner, a conductive silver paste storage box is arranged on the upper part of the workbench on one longitudinal side of the movable support frame, and a first transmission rack is arranged on the upper part of the workbench on the other side, and a power pump is arranged on the upper part of the conductive silver paste storage box, a second rotating motor is arranged on the transverse side of the movable support frame, a first transmission gear is installed at one end of the second rotating motor, and the first transmission gear is meshed with the first transmission rack, a first movable support plate is connected to the top of the movable support frame in a longitudinal sliding manner, a first lifting device is arranged on the top of the first movable support plate located on the transverse side of the movable support frame, and a third rotating motor is arranged at the other end, a grouting head is installed at one end of the bottom of the first lifting device through the first movable support plate, one end of the power pump is connected to the conductive silver paste storage box, and the other end is connected to the grouting head, a second transmission gear is installed at one end of the bottom of the third rotating motor through the first movable support plate, and a second transmission rack is arranged at the transverse side of the movable support frame corresponding to the second transmission gear, and the second transmission gear is meshed with the second transmission rack.

[0009] Furthermore, the patch assembly includes a second movable support plate, the second movable support plate is slidably connected to the top of the rotating support beam, the top of the second movable support plate is located on one side of the rotating support beam and is provided with a fourth rotating motor, and the other side is provided with a second lifting device, the top of the second movable support plate is located between the fourth rotating motor and the second lifting device and is provided with a vacuum pump, one end of the bottom of the fourth rotating motor passes through the second movable support plate and is installed with a third transmission gear, a third transmission rack is provided on one side of the rotating support beam corresponding to the position of the third transmission gear, the third transmission gear is meshed with the third transmission rack, one end of the bottom of the second lifting device passes through the second movable support plate and is installed with a lifting support plate, the top of the lifting support plate is located on one side of the second lifting device and is provided with a first guide plug rod, and the other side is provided with a third lifting device, the One end of the first guide plug rod is plugged into the second moving support plate, and one end of the bottom of the third lifting device passes through the lifting support plate and is installed with a lifting support seat, the bottom of the lifting support plate is located at one side of the lifting support seat and a supporting connecting rod is arranged, and a vacuum suction cup is arranged at the bottom of the supporting connecting rod, and the vacuum pump is communicated with the vacuum suction cup. The top of the lifting support seat is located at one side of the third lifting device and a second guide plug rod is arranged, one end of the second guide plug rod is plugged into the lifting support plate, and one side of the lifting support seat has a second rectangular hollowing out, and a fifth rotating motor is arranged on the inner surface of the top of the second rectangular hollowing out, a second rotating shaft is arranged between the bottom of the lifting support seat and the second rectangular hollowing out, the top of the second rotating shaft is connected to the fifth rotating motor, and a third heating plate is installed at one end of the second rotating shaft below the lifting support seat.

[0010] Furthermore, the workbench and the support column are fixedly connected by welding.

[0011] Furthermore, a rotary bearing is provided between the first rotary shaft and the support column and between the second rotary shaft and the lifting support seat.

[0012] Furthermore, a heat-insulating connecting block is provided between the third heating plate and the second rotating shaft.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The invention has a reasonable design, a stable and firm overall structure, and strong practicability. By preheating the substrate and the chip during the loading process, the heating speed of the chip is improved, and at the same time, it can avoid the situation where there is a large temperature difference between the local parts of the substrate when the conductive silver paste is solidified after the patch, thereby avoiding the situation where the substrate is prone to warping, and ensuring the stability of the quality of the finished product. In addition, by rotating the patch components arranged on both sides of the support column of the support beam, the chip heating and chip patch operations can be performed simultaneously, thereby greatly improving the efficiency of the patch processing;

[0015] By setting the preheating components on the inner surface of the bottom of the substrate transmission groove and the chip transmission groove, the chips and substrates being transmitted can be preheated, which not only enables the preheated chips to be quickly heated to the specified temperature in the heating groove, thereby improving the efficiency of patch processing, but also prevents the substrate from being easily warped due to excessive temperature differences between local areas when the conductive silver paste is solidified, thereby ensuring the quality of the finished product. In addition, the heat preservation plate set therein can prevent the heat generated by the second heating plate from being lost in other directions, thereby ensuring the utilization rate of the heat generated by the second heating plate, and saving energy and reducing emissions;

[0016] The cleaning component can send airflow with positive and negative charges through the top of the bellows body through the ion blower therein to eliminate static electricity on the substrate and chip, and prevent dust or other foreign matter from being adsorbed on the surface due to static electricity, thereby facilitating the blowing away of dust or other foreign matter on the substrate and chip, thereby avoiding the presence of foreign matter such as dust at the bonding point, which may easily lead to short circuit or burning during later use, and further ensuring the stability of quality;

[0017] The grouting assembly is provided to coat the conductive silver paste on the substrate, the movable support frame can reciprocate in the horizontal direction, the first movable support plate can reciprocate in the vertical direction, and the grouting head can move to different horizontal positions, different vertical positions and be lifted to different heights with the cooperation of the first lifting device, so that the conductive silver paste can be coated on the substrate in different shapes, which is suitable for patch processing of chips of different sizes and specifications, thereby improving the scope of application;

[0018] By arranging the patch components on both sides of the support column, the chip can be heated and bonded respectively, which greatly improves the efficiency of the patch processing. After the chip is heated to the specified temperature, the third heating plate can be lowered and rotated to the bottom of the chip, and the chip is kept warm during the process of rotating and moving from the heating tank to the top of the substrate to avoid temperature loss during rotation. At the same time, after the chip is bonded to the substrate, the third heating plate can rise and rotate to the top of the chip to continue heating and keeping it warm, so that the conductive silver paste can be quickly heated to the curing temperature, further improving the efficiency of the chip patch processing. At the same time, by heating the chip to achieve the curing of the conductive silver paste, the warping of the substrate can be effectively reduced, further ensuring product quality and improving product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the preheating component in the present invention;

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the cleaning component in the present invention;

[0023] Figure 5 It is a three-dimensional structural schematic diagram of the grouting assembly in the present invention;

[0024] Figure 6 It is a schematic diagram of the three-dimensional structure of the patch component in the present invention;

[0025] Figure 7 It is a front view of the patch assembly in the present invention;

[0026] Figure 8 for Figure 7 Enlarged view of part B in the middle.

[0027] In the figure: 1-workbench, 2-control device, 3-support column, 4-substrate conveying slot, 5-heating slot, 6-first heating plate, 7-chip conveying slot, 8-conveyor belt mechanism, 9-preheating component, 10-cleaning component, 11-grouting component, 12-first rectangular hollow, 13-first rotating motor, 14-first rotating shaft, 15-rotating support beam, 16-patch component;

[0028] Support base, 902-bearing seat, 903-bearing slot, 904-second heating plate, 905-insulation plate, 906-temperature sensor;

[0029] Bellows body, 1002- material guide trough, 1003- ion fan, 1004- air outlet, 1005- air distribution plate;

[0030] Mobile support frame, 1102-conductive silver paste storage box, 1103-first transmission rack, 1104-power pump, 1105-second rotating motor, 1106-first transmission gear, 1107-first mobile support plate, 1108-first lifting device, 1109-third rotating motor, 1110-grouting head, 1111-second transmission gear, 1112-second transmission rack;

[0031] 1601-second movable support plate, 1602-fourth rotating motor, 1603-second lifting device, 1604-vacuum pump, 1605-third transmission gear, 1606-third transmission rack, 1607-lifting support plate, 1608-first guide plug rod, 1609-third lifting device, 1610-lifting support seat, 1611-support connecting rod, 1612-vacuum suction cup, 1613-second guide plug rod, 1614-second rectangular hollow, 1615-fifth rotating motor, 1616-second rotating axis, 1617-third heating plate. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] Combination Figure 1 to Figure 2A chip placement device for semiconductor chip processing shown in the figure comprises a workbench 1, a control device 2 is arranged on one side of the workbench 1, a support column 3 is arranged on the upper part of the workbench 1, a substrate conveying groove 4 is arranged on one side of the support column 3, and a heating groove 5 is arranged on the other side, and a first heating plate 6 is arranged on the inner surface of the heating groove 5, a chip conveying groove 7 is arranged on the upper part of the workbench 1 between the support column 3 and the heating groove 5, a conveyor belt mechanism 8 is arranged on the inner surfaces of the substrate conveying groove 4 and the chip conveying groove 7 on both sides in the longitudinal direction, a preheating component 9 is arranged on the inner surface of the bottom of the substrate conveying groove 4 and the chip conveying groove 7 between the conveyor belt mechanism 8, and the upper part of the workbench 1 is located between the substrate conveying groove 4 and A cleaning component 10 is provided at the loading end of the chip conveying groove 7, and a grouting component 11 is provided above the substrate conveying groove 4 on one side of the cleaning component 10, which is laterally close to the support column 3. One side of the support column 3 has a first rectangular hollow 12, and a first rotating motor 13 is provided on the inner surface of the bottom of the first rectangular hollow 12. A first rotating shaft 14 is provided between the top of the support column 3 and the first rectangular hollow 12, and the bottom of the first rotating shaft 14 is connected to the first rotating motor 13. A rotating support beam 15 is provided on the circumferential outer surface of the first rotating shaft 14 above the support column 3, and the upper part of the rotating support beam 15 is located on both sides of the support column 3 and is slidably connected with a patch component 16.

[0035] like Figure 3 As shown, the preheating component 9 includes a support base 901, a bearing seat 902 is arranged on the top of the support base 901, a bearing groove 903 is arranged on the top of the bearing seat 902, and a second heating plate 904 is arranged in the bearing groove 903. The heat generated by the second heating plate 904 is used to preheat the chip and the substrate in transmission, so that the preheated chip can be quickly heated to the specified temperature in the heating groove 5, thereby improving the efficiency of the patch processing, and at the same time, it can also avoid the situation where the substrate is prone to warping due to excessive temperature difference between local areas when the conductive silver paste is solidified; an insulation plate 905 is arranged between the second heating plate 904 and the inner surface of the bearing groove 903, which can prevent the heat generated by the second heating plate from being lost in other directions, ensure the utilization rate of the heat generated by the second heating plate, and save energy and reduce emissions; a temperature sensor 906 is recessed on the top of the second heating plate 904, which is convenient for real-time monitoring of the preheating temperature of the chip and the substrate in transmission, ensuring the preheating effect, and controlling the preheating temperature within a safe range to ensure the quality stability of the substrate. The specific parameters can be set according to the actual processing conditions.

[0036] like Figure 4As shown, the cleaning component 10 includes a bellows body 1001, the bottom of the bellows body 1001 is connected to the upper part of the workbench 1, and guide grooves 1002 are arranged on the inner sides of the substrate conveying groove 4 and the chip conveying groove 7 on both sides of the bellows body 1001, so that the chips and substrates can pass through the guide grooves 1002 to pass through the bellows body 1001; an ion fan 1003 is arranged on the top of the bellows body 1001, and the ion fan 1003 is connected to the inside of the bellows body 1001, and the air flow with positive and negative charges is sent into the bellows body from the top through the ion fan 1003. A plurality of air outlets 1004 are equidistantly arranged on both sides of the bellows body 1001 from top to bottom in the longitudinal direction, and an air distribution plate 1005 is arranged between the inner surface of the top of the bellows body 1001 and the air outlet 1004. After being processed by the air distribution plate 1005, the air is evenly blown to the substrate and the chip to eliminate the static electricity on the substrate and the chip, and then the dust or other foreign matter on the surface thereof is blown away;

[0037] like Figure 5As shown, the grouting assembly 11 includes a mobile support frame 1101 arranged above the substrate conveying groove 4, the mobile support frame 1101 is connected to the upper part of the workbench 1 in a lateral sliding manner, a conductive silver paste storage box 1102 is arranged on the upper part of the workbench 1 on one longitudinal side of the mobile support frame 1101, a first transmission rack 1103 is arranged on the upper part of the workbench 1 on the other side, a power pump 1104 is arranged on the upper part of the conductive silver paste storage box 1102, a second rotating motor 1105 is arranged on one lateral side of the mobile support frame 1101, and the second rotating motor 1105 is arranged on the upper part of the workbench 1 A first transmission gear 1106 is installed at one end of the motor 1105, and the first transmission gear 1106 is meshed with the first transmission rack 1103 to realize driving the mobile support frame 1101 to reciprocate in the lateral direction. The top of the mobile support frame 1101 is connected to a first mobile support plate 1107 in a longitudinal sliding manner. The top of the first mobile support plate 1107 is located on one side of the lateral side of the mobile support frame 1101. A first lifting device 1108 is arranged on the top of the first mobile support plate 1107, and a third rotating motor 1109 is arranged at the other end. The bottom of the first lifting device 1108 One end of the third rotating motor 1109 passes through the first movable support plate 1107 and is installed with a grouting head 1110, which can drive the grouting head 1110 to rise and fall to different heights. One end of the power pump 1104 is connected to the conductive silver paste storage box 1102, and the other end is connected to the grouting head 1110, which is used to transport the conductive silver paste to the grouting head 1110, and the conductive silver paste is coated on the substrate through the grouting head 1110. One end of the bottom of the third rotating motor 1109 passes through the first movable support plate 1107 and is installed with a second transmission gear 1111. The movable support frame 11 01 A second transmission rack 1112 is arranged on one lateral side corresponding to the second transmission gear 1111, and the second transmission gear 1111 is meshed with the second transmission rack 1112, so as to drive the first movable support plate 1107 to reciprocate longitudinally, thereby enabling the grouting head 1110 to move to different lateral positions, different longitudinal positions and to be lifted or lowered to different heights, so as to realize coating of the conductive silver paste on the substrate in different shapes, which is suitable for patch processing of chips of different sizes and specifications, thereby improving the scope of application.

[0038] like Figures 6 to 8As shown, the patch assembly 16 includes a second movable support plate 1601, the second movable support plate 1601 is slidably connected to the top of the rotating support beam 15, the top of the second movable support plate 1601 is located on one side of the rotating support beam 15 and is provided with a fourth rotating motor 1602, and the other side is provided with a second lifting device 1603, the top of the second movable support plate 1601 is located between the fourth rotating motor 1602 and the second lifting device 1603 and is provided with a vacuum pump 1604, one end of the bottom of the fourth rotating motor 1602 passes through the second movable support plate 1601 and is installed with a third transmission gear 1605, and a third transmission rack 1606 is provided on one side of the rotating support beam 15 corresponding to the position of the third transmission gear 1605, and the third transmission gear 1605 and the third transmission rack 1606 are connected. 606 are meshed with each other to realize driving the second movable support plate 1601 to make reciprocating motion along the length direction of the rotating support beam 15, one end of the bottom of the second lifting device 1603 passes through the second movable support plate 1601 and is installed with a lifting support plate 1607, the top of the lifting support plate 1607 is located on one side of the second lifting device 1603 and is provided with a first guide plug rod 1608, and the other side is provided with a third lifting device 1609, one end of the first guide plug rod 1608 is plug-connected with the second movable support plate 1601 to realize driving the lifting support plate 1607 to be lifted to different heights, one end of the bottom of the third lifting device 1609 passes through the lifting support plate 1607 and is installed with a lifting support seat 1610, and the bottom of the lifting support plate 1607 is located at the lifting support seat A supporting connecting rod 1611 is provided on one side of 1610 to drive the lifting support seat 1610 to different heights. A vacuum suction cup 1612 is provided at the bottom of the supporting connecting rod 1611. The vacuum pump 1604 is connected to the vacuum suction cup 1612, thereby driving the vacuum suction cup 1612 to adsorb the chip, and then the chip is sucked up from the conveyor belt mechanism 8 and sent to the heating tank 5 for heating and heating. A second guide plug-in rod 1613 is provided on the top of the lifting support seat 1610 on one side of the third lifting device 1609. One end of the second guide plug-in rod 1613 is plug-connected with the lifting support plate 1607. A second rectangular hollow 1614 is provided on one side of the lifting support seat 1610. The inner surface of the top of the second rectangular hollow 1614 is provided with a fifth rotary The rotating motor 1615, a second rotating shaft 1616 is arranged between the bottom of the lifting support seat 1610 and the second rectangular hollow 1614, the top of the second rotating shaft 1616 is connected to the fifth rotating motor 1615, and the second rotating shaft 1616 is located at one end below the lifting support seat 1610. A third heating plate 1617 is installed to drive the third heating plate 1617 to be lifted to different heights and rotated to different angles. After the chip is heated to a specified temperature, the third heating plate 1617 can be lowered and rotated to the bottom of the chip to keep the chip warm during the process of rotating and moving the chip from the heating slot 5 to the top of the substrate. At the same time, after the chip is attached to the substrate, the third heating plate 1617 can be raised and rotated to the top of the chip to continue heating it.This allows the conductive silver paste to quickly heat up to the curing temperature, further improving the efficiency of chip placement processing.

[0039] The workbench 1 and the support column 3 are fixedly connected by welding, which improves the stability and firmness of the connection structure between them, thereby improving the safety of use and the service life; a rotating bearing is provided between the first rotating shaft 14 and the support column 3 and between the second rotating shaft 1616 and the lifting support seat 1610, so as to facilitate the smooth rotation of the first rotating shaft 14 and the second rotating shaft 1616; a heat-insulating connecting block is provided between the third heating plate 1617 and the second rotating shaft 1616, which reduces heat loss and avoids heat transfer to the fifth rotating motor 1615 through the second rotating shaft 1616, thereby ensuring the fifth rotating motor 1615 The stability of normal operation; linear bearings are arranged between the first guide plug rod 1608 and the second movable support plate 1601 and between the second guide plug rod 1613 and the lifting support plate 1607 to ensure smooth lifting of the lifting support plate 1607 and the lifting support seat 1610; the conveyor belt mechanism 8 is composed of a conveyor belt, a rotating roller, a supporting bearing seat and a driving motor. The rotating roller is arranged at both ends of the inner side of the conveyor belt. The rotating roller is installed on the inner surface of the longitudinal side of the substrate conveying groove 4 and the chip conveying groove 7 through the supporting bearing seat. The driving motor is connected to the rotating roller to realize driving the substrate and the chip in the substrate conveying groove 4 and the chip conveying groove 7. The first heating plate 6, the first rotating motor 13, the second heating plate 904, the temperature sensor 906, the ion fan 1003, the power pump 1104, the second rotating motor 1105, the first lifting device 1108, the third rotating motor 1109, the fourth rotating motor 1602, the second lifting device 1603, the vacuum pump 1604, the third lifting device 1609, the fifth rotating motor 1615 and the third heating plate 1617 are all electrically connected to the control device 3 for controlling their respective working states and receiving transmitted signals, wherein the first rotating motor 13, the second rotating motor 1105 ... The rotating motor 1109, the fourth rotating motor 1602 and the fifth rotating motor 1615 are all servo motors, which are convenient for controlling their rotation direction, rotation speed and start and stop. The first lifting device 1108, the second lifting device 1603 and the third lifting device 1609 are one of the servo electric cylinders or electric telescopic rods, which are convenient for controlling their lifting stroke. In addition, a temperature sensor is also provided on one side of the vacuum suction cup 1612 and is electrically connected to the control device 3. The temperature sensor provided on one side of the vacuum suction cup 1612 is connected to the supporting connecting rod 1611 through a connecting frame, which is convenient for real-time monitoring of the real-time temperature data of the chip adsorbed by the vacuum suction cup 1612.

[0040] Working principle: The substrate and chip are arranged in sequence on the upper part of the conveyor belt mechanism in the substrate conveying slot and the chip conveying slot for transmission. The substrate and chip enter the bellows body through the guide slot. The ion fan sends airflow with positive and negative charges into the bellows body. Under the action of the air distribution plate, the airflow is evenly blown to the substrate and chip respectively, eliminating the static electricity on the substrate and chip, and blowing away the dust or other foreign matter on the surface. Then, it leaves the bellows body through the guide slot on the other side of the bellows body and is transmitted to the bottom of the grouting component. The conductive silver paste is coated on the patch position through the grouting head in the grouting component. Then, when the substrate and chip are transmitted to the top of the preheating component, the heat is released through the second heating plate set in the preheating component, and then the work is performed. Used for substrates and chips, so that the substrates and chips are preheated to a specified temperature. Under the action of the first rotating motor and the first rotating shaft, the rotating support beam is rotated to an angle parallel to the longitudinal direction of the workbench, and then the substrate and the chip are respectively transferred to the bottom of the vacuum suction cups on both sides of the support column. Then, the second lifting device in the loading assembly above the chip drives the lifting support plate to descend, so that the vacuum suction cup contacts the chip, and under the action of the vacuum pump, the chip is adsorbed, and then the chip is driven up by the second lifting device. Then, with the cooperation of the fourth rotating motor, the third transmission gear and the third transmission rack, the chip is moved to the top of the heating tank, and then the chip is sent to the heating tank for heating through the second lifting device until it is heated to a specified temperature. After that, the chip is driven to rise above the heating tank, and then the third lifting device is controlled to drive the lifting support seat to descend, so that the third heating plate is descended to the bottom of the chip, and then with the cooperation of the fifth rotating motor and the second rotating shaft, the third heating plate is rotated to the bottom of the chip to heat and keep the chip warm, and then the first rotating motor can be controlled, and with the cooperation of the first rotating shaft, the chip is rotated to the top of the substrate coated with the conductive silver paste, and then the above method and steps are reversed to make the third heating plate rise and rotate to the top of one side of the chip, and then the second lifting device can be controlled to drive the chip to descend, and the chip is placed on the position coated with the conductive silver paste on the substrate for bonding, and then the vacuum pump stops working, and the second lifting device drives the vacuum suction cup to rise Then, with the cooperation of the third lifting device, the fifth rotating motor and the second rotating shaft, the third heating plate is lowered and rotated to the top of the chip, and the chip position is continued to be heated to accelerate the curing of the conductive silver paste between the chip and the substrate. At the same time, the loading component close to the chip conveying slot repeats the above groove to adsorb and heat the next chip to be mounted. After the above conductive silver paste is cured, the mounting process of the semiconductor chip is completed, and it can be sent away by the conveyor belt mechanism, and the next substrate to be mounted is sent. At the same time, with the cooperation of the first rotating motor and the first rotating shaft, the heated chip on the loading component close to the chip conveying slot is rotated to the top of the substrate for mounting operation, and then the reciprocating cycle operation is carried out, which greatly improves the efficiency of mounting processing.

[0041] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0042] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip bonding device for semiconductor chip processing, comprising a workbench (1), wherein a control device (2) is provided on one side of the workbench (1), characterized in that: The workbench (1) is provided with a support column (3) on the upper part, a substrate conveying groove (4) is provided on one side of the support column (3), and a heating groove (5) is provided on the other side, and a first heating plate (6) is provided on the inner surface of the heating groove (5); a chip conveying groove (7) is provided on the upper part of the workbench (1) between the support column (3) and the heating groove (5); conveyor belt mechanisms (8) are provided on the inner surfaces of both longitudinal sides of the substrate conveying groove (4) and the chip conveying groove (7); a preheating component (9) is provided on the inner surface of the bottom of the substrate conveying groove (4) and the chip conveying groove (7) between the conveyor belt mechanisms (8); a cleaning component (9) is provided on the upper part of the workbench (1) at the loading end positions of the substrate conveying groove (4) and the chip conveying groove (7); A component (10), wherein a grouting component (11) is arranged above the substrate conveying groove (4) on one side of the cleaning component (10) and is laterally close to the support column (3); one side of the support column (3) has a first rectangular hollow (12); a first rotating motor (13) is arranged on the inner surface of the bottom of the first rectangular hollow (12); a first rotating shaft (14) is arranged between the top of the support column (3) and the first rectangular hollow (12); the bottom of the first rotating shaft (14) is connected to the first rotating motor (13); a rotating support beam (15) is arranged on the outer surface of the circumference of the first rotating shaft (14) located above the support column (3); and the upper part of the rotating support beam (15) is located on both sides of the support column (3) and is slidably connected to patch components (16); The preheating component (9) comprises a support base (901), a bearing seat (902) is arranged on the top of the support base (901), a bearing groove (903) is provided on the top of the bearing seat (902), a second heating plate (904) is arranged in the bearing groove (903), a heat preservation plate (905) is arranged between the second heating plate (904) and the inner surface of the bearing groove (903), and a temperature sensor (906) is recessed on the top of the second heating plate (904).

2. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The cleaning assembly (10) comprises a bellows body (1001), the bottom of the bellows body (1001) is connected to the upper part of the workbench (1), the bellows body (1001) is provided with material guide grooves (1002) on both lateral sides located inside the substrate conveying groove (4) and the chip conveying groove (7), the top of the bellows body (1001) is provided with an ion fan (1003), the ion fan (1003) is connected to the inside of the bellows body (1001), the bellows body (1001) is provided with a plurality of air outlets (1004) equidistantly arranged on both longitudinal sides from top to bottom, and an air distribution plate (1005) is provided between the inner surface of the top of the bellows body (1001) and the air outlet (1004).

3. A chip bonding device for semiconductor chip processing according to claim 2, characterized in that: The grouting assembly (11) comprises a movable support frame (1101) arranged above the substrate conveying groove (4), the movable support frame (1101) being slidably connected to the upper part of the workbench (1) in the transverse direction, a conductive silver paste storage box (1102) being arranged on the upper part of the workbench (1) on one longitudinal side of the movable support frame (1101), a first transmission rack (1103) being arranged on the upper part of the workbench (1) on the other side, a power pump (1104) being arranged on the upper part of the conductive silver paste storage box (1102), a second rotating motor (1105) being arranged on one lateral side of the movable support frame (1101), a first transmission gear (1106) being mounted on one end of the second rotating motor (1105), the first transmission gear (1106) being meshed with the first transmission rack (1103), and a first movable support plate (1104) being slidably connected to the top of the movable support frame (1101) in the longitudinal direction. 07), a first lifting device (1108) is arranged on the top of the first movable support plate (1107) on one lateral side of the movable support frame (1101), and a third rotating motor (1109) is arranged on the other end; a grouting head (1110) is installed on one end of the bottom of the first lifting device (1108) through the first movable support plate (1107); one end of the power pump (1104) is connected to the conductive silver paste storage box (1102), and the other end is connected to the grouting head (1110); a second transmission gear (1111) is installed on one end of the bottom of the third rotating motor (1109) through the first movable support plate (1107); a second transmission rack (1112) is arranged on one lateral side of the movable support frame (1101) corresponding to the second transmission gear (1111); the second transmission gear (1111) is meshed with the second transmission rack (1112).

4. A chip bonding device for semiconductor chip processing according to claim 3, characterized in that: The patch assembly (16) comprises a second movable support plate (1601), the second movable support plate (1601) being slidably connected to the top of the rotating support beam (15), the top of the second movable support plate (1601) being located on one side of the rotating support beam (15) and having a fourth rotating motor (1602), and the other side being located on a second lifting device (1603), the top of the second movable support plate (1601) being located between the fourth rotating motor (1602) and the second lifting device (1603) and having a vacuum pump (1604), the bottom end of the fourth rotating motor (1602) passing through the second movable support plate (1601) and being arranged A third transmission gear (1605) is installed, and a third transmission rack (1606) is arranged on one side of the rotating support beam (15) corresponding to the position of the third transmission gear (1605), and the third transmission gear (1605) is meshed with the third transmission rack (1606). A lifting support plate (1607) is installed on one end of the bottom of the second lifting device (1603) through the second movable support plate (1601), and a first guide plug rod (1608) is arranged on the top of the lifting support plate (1607) on one side of the second lifting device (1603), and a third lifting device (1609) is arranged on the other side. The first guide plug rod (1608) ) is plugged into the second movable support plate (1601), one end of the bottom of the third lifting device (1609) passes through the lifting support plate (1607) and is equipped with a lifting support seat (1610), the bottom of the lifting support plate (1607) is located on one side of the lifting support seat (1610) and is provided with a supporting connecting rod (1611), the bottom of the supporting connecting rod (1611) is provided with a vacuum suction cup (1612), the vacuum pump (1604) is connected to the vacuum suction cup (1612), the top of the lifting support seat (1610) is located on one side of the third lifting device (1609) and is provided with a second guide plug-in rod (1613), the One end of the second guide plug-in rod (1613) is plug-connected to the lifting support plate (1607); one side of the lifting support seat (1610) has a second rectangular hollow (1614); a fifth rotating motor (1615) is arranged on the top inner surface of the second rectangular hollow (1614); a second rotating shaft (1616) is arranged between the bottom of the lifting support seat (1610) and the second rectangular hollow (1614); the top of the second rotating shaft (1616) is connected to the fifth rotating motor (1615); and a third heating plate (1617) is installed at one end of the second rotating shaft (1616) located below the lifting support seat (1610).

5. The chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The workbench (1) and the support column (3) are fixedly connected by welding.

6. A chip bonding device for semiconductor chip processing according to claim 4, characterized in that: Rotary bearings are provided between the first rotating shaft (14) and the support column (3), and between the second rotating shaft (1616) and the lifting support seat (1610).

7. A chip bonding device for semiconductor chip processing according to claim 4, characterized in that: A heat-insulating connection block is provided between the third heating plate (1617) and the second rotating shaft (1616).

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