A silicon wafer cutting fluid filtration device

Abstract

This invention discloses a silicon wafer cutting fluid filtration device, specifically comprising: a base, a purification device movably connected to the top right side of the base, a housing fixedly installed on the top side of the base away from the purification device, and the housing and the purification device being opposite to each other; a partition plate fixedly connected to the top of the housing; a movable rod accessory on the side of the purification device near the center of the partition plate; and a dispensing device rotatably installed in the center of the partition plate via the movable rod accessory. This invention relates to the field of filtration technology. This silicon wafer cutting fluid filtration device uses the bottom left side of the central support frame as a support point. The wheel rim vibrates, and the vibration on the wheel rim gradually moves in conjunction with the ring plate. The upper surface of the ring plate gradually vibrates accordingly, and the vibration of the ring plate gradually adjusts the position of the top silicon wafer workpiece, reducing the accumulation of silicon wafers in one place, thus reducing the reduction in filtration efficiency and the accumulation of cutting fluid in one place, further improving the silicon wafer filtration effect.

Description

Technical Field

[0001] This invention relates to the field of filtration technology, specifically to a silicon wafer cutting fluid filtration device. Background Technology

[0002] In the process of cutting photovoltaic solar silicon wafers, silicon wafer cutting fluid is an essential auxiliary consumable product. Its usage has expanded with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. Cutting fluids are mainly classified into two categories according to their composition: oil-based cutting fluids and water-based cutting fluids. Water-based cutting fluids can be dissolved in water or dispersed in water. Water can be used to clean silicon wafers without the need for organic solvents, and they are harmless to humans and the environment. The filtration of cutting fluids is crucial.

[0003] According to Chinese Patent No. CN201510639714.1, a filter water tank for a silicon wafer cutting machine includes a shell with an inner cavity. The upper end of the shell has an opening communicating with the inner cavity. A cover is fixed to the shell to close the opening. A filter screen is provided inside the shell, dividing the inner cavity into an upper cavity and a lower cavity. The shell has an inlet and an outlet, with the inlet communicating with the upper cavity and the outlet communicating with the lower cavity. A primary filtration device is also provided in the upper cavity. The primary filtration device includes a support. The upper part is rotatably connected to a turntable, which has several through-holes. Each of the through-holes contains a primary filter element. The support has a column, and the turntable has holes that mate with the columns. All the through-holes are equidistant from the through-holes. A guide pipe communicating with the water inlet is also fixed to the housing. The drain outlet of the guide pipe is located directly above one of the through-holes on the turntable. The turntable is locked to the support by a locking pin. Both the turntable and the support have pin holes. A pressure relief valve is also provided on the cover.

[0004] In summary, the drawback of the prior art is that although it can improve the filtration effect, impurities in the cutting fluid will accumulate on the surface of the cutting fluid supply unit and the inner wall of the pipes, which can easily cause scratches and wear, and may also lead to blockages and clogging, thus affecting the stability of the cutting fluid. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the technical solution adopted by this invention to solve its technical problems is as follows:

[0006] A silicon wafer cutting fluid filtration device, specifically comprising:

[0007] The base has a movably connected impurity removal device on the top right side of its front. This device is used to adjust the state of impurities in the silicon wafer cutting fluid. A housing is fixedly installed on the top side of the base away from the impurity removal device, and the housing and the impurity removal device are opposite to each other. A partition plate is fixedly connected to the top of the housing. The impurity removal device has a movable rod accessory on the side near the center of the partition plate. A dispensing device is rotatably installed in the center of the partition plate via the movable rod accessory. This dispensing device is used to adjust the state of the silicon wafer. The dispensing device is located above the partition plate. A baffle is fixedly installed on the outer surface of the dispensing device. A filter device is embedded in the top of the dispensing device. This filter device is used to adjust the state of the silicon wafer filtration.

[0008] The dispensing device includes a wheel rim, a support shaft that rotates and gradually moves in conjunction with a support seat, the support seat that rotates and moves a vertical arc, the vertical arc rotates and moves along the inner cavity groove of the wheel rim, the vertical arc gradually accommodates the cutting fluid flowing down the gap of the ring plate, the vertical arc is slidably installed in the inner cavity of the wheel rim, the bottom end of the vertical arc is fixedly connected to a support seat, the top of the inner surface of the wheel rim is movably installed on a ring plate, the bottom of the ring plate is connected to a top plate through a movable rod accessory, the top plate is connected to the support seat through a movable rod accessory, and a processing device is fixedly connected to the top of the ring plate.

[0009] Furthermore, the wheel rim is circular, and the ring plate corresponds to the inner surface dimensions of the wheel rim. A vertical arc is snapped onto the top of the support. The center lines of the top plate and the ring plate are on the same straight line. The processing device also includes a block. The support shaft drives the ring plate to move synchronously. The rotation of the ring plate gradually acts on the block, causing it to move synchronously. As the block rotates, it gradually rotates, gradually pressing against the sleeve. The sleeve itself has a certain angle. Diagonal strips are fixedly inserted into both sides of the top of the block. The rotation of the diagonal strips is linked to the synchronous movement of the central through-bar, which in turn moves synchronously with the limiting frame. There is a gap between the through strip and the limiting frame. A decorative piece is fixedly connected to the bottom of the block. A support strip is inserted into the inner surface of the decorative piece. A wiping piece is fixedly connected to the end of the support strip away from the decorative piece. A central through strip is movably inserted into the end of the diagonal strip away from the block. A limiting frame is movably fitted onto the outer surface of the central through strip. The thickness of the diagonal strip is greater than the thickness of the central through strip. The block is connected to the central through strip through the diagonal strip. A space corresponding to the central through strip is reserved inside the limiting frame. The diagonal strip is made of stainless steel. The support strip is embedded inside the decorative piece. A groove corresponding to the support strip is opened inside the decorative piece.

[0010] Furthermore, the filtration device includes a support plate, on which a main cylinder is movably mounted with a slot. A rotating shaft is fixedly connected to the top center of the main cylinder, and a pressure plate is fixedly connected to the top of the rotating shaft. A traction bar is fixedly mounted on one side of the bottom of the pressure plate, and the traction bar is located on the side near the wheel hub. The output end of the traction bar is fixedly connected to an arc cylinder. When the arc cylinder moves synchronously, the pressure plate, through the traction bar, tractions the arc cylinder to prevent it from falling. The guide tube gradually slides downward from inside the sleeve to prevent the arc cylinder from falling. The guide tube gradually slides downward from inside the sleeve and is inserted into the inside of the main cylinder. When the sleeve shakes, filtered water flows out from inside the main cylinder. A sleeve is fixedly connected to the bottom of the arc cylinder, and a guide tube is slidably mounted inside the sleeve. The sleeve has a slot corresponding to the guide tube. The rotating shaft is embedded in the bottom of the inner cavity of the main cylinder. The traction bar itself is an elastic structure, and the guide tube is inserted into the top of the main cylinder.

[0011] Furthermore, the impurity removal device includes a stand, with a plate fixedly connected to the top of the stand. A middle support frame is movably installed on the side of the plate away from the stand, and a rope is driven to be installed on the side of the plate away from the stand. The rope rotates and gradually drags the middle support frame. The bottom left side of the front of the middle support frame is a support point, and the top right side of the front of the middle support frame deforms to the left. The top cover of the plate is lifted, and the plate drives the shaft to move upward. A support shaft is movably installed on the top of the rope, and a wheel is fixedly connected to the top of the support shaft. A shaft is fixedly connected to the middle of the bottom of the plate. The shaft is located inside the stand, and the top of the stand has a slot corresponding to the shaft. The bottom of the outer surface of the support shaft has a gear, and adhesive is coated between the wheel and the support shaft.

[0012] This invention provides a silicon wafer cutting fluid filtration device. It has the following beneficial effects:

[0013] 1. This silicon wafer cutting fluid filtration device uses the output gear in the partition plate motor to mesh with the gear on the outer surface of the bottom end of the support shaft. The support shaft rotates counterclockwise due to the meshing action. The rotation of the support shaft links the ring plate and operates synchronously. The top plate twists accordingly, thereby ensuring that the equipment has the basic conditions for rapid swing processing, laying a good foundation for subsequent processing.

[0014] 2. This silicon wafer cutting fluid filtration device uses a rotating block to gradually press against a sleeve. The sleeve itself has a certain angle, and the sleeve vibrates due to the impact of the oblique force. The arc cylinder undergoes synchronous displacement, and the pressure plate, through the traction bar, pulls the arc cylinder to prevent it from falling. The guide tube gradually slides down from inside the sleeve and is inserted into the inside of the main cylinder. When the sleeve vibrates, the filtered water inside the main cylinder flows out and gradually flows through the inner cavity of the guide tube to the outer surface of the ring plate. The outer surface of the ring plate is cleaned by the filtered water, thus ensuring that the equipment can quickly filter silicon wafer cutting fluid and improving the convenience of filtration.

[0015] 3. This silicon wafer cutting fluid filtration device uses the bottom left side of the front of the central support frame as a support point. The top right side of the front of the central support frame deforms to the left, causing the top cover of the flat plate to open. The flat plate drives the shaft to move upward. There is a space reserved between the partition plate and the shaft. The flat plate moves towards the top plate and impacts the wheel rim, causing the wheel rim to vibrate. The vibration on the wheel rim gradually links with the movement of the ring plate. The upper surface of the ring plate gradually vibrates accordingly. The vibration of the ring plate gradually adjusts the position of the top silicon wafer workpiece, reducing the accumulation of silicon wafers in one place, which would reduce the filtration efficiency, and reducing the accumulation of cutting fluid in one place, which would form marks, thus further improving the silicon wafer filtration effect.

[0016] 4. This silicon wafer cutting fluid filtration device prevents splashing by using a vertical arc. The cutting fluid gradually flows into the area between the vertical arc and the support, preventing waste. When the cutting fluid needs to be transferred, the vertical arc is manually pulled upwards, separating it from the support. The cutting fluid gradually flows out from between the vertical arc and the support, thus ensuring that the equipment can quickly collect the cutting fluid, prevent the cutting fluid from splashing everywhere and dirtying the inner wall, and improve the convenience of silicon wafer cutting fluid transfer.

[0017] 5. This silicon wafer cutting fluid filtration device moves through a ring plate influenced by a support shaft. The ring plate rotates, gradually driving the block to operate. The block drives the swinging component to move synchronously, causing the swinging component to twist. The swinging component swings under the action of the support, and the wiping component moves accordingly. The wiping component gradually wipes away impurities in the silicon wafer cutting fluid on the top of the ring plate, thereby ensuring that the equipment can quickly and cleanly process the fluid and maintain its cleanliness.

[0018] 6. In the case of poor filtration of silicon wafer cutting fluid, the rotating block gradually drives the inclined bar and the swing piece to move synchronously. The inclined bar gradually rotates and moves, and the rotation of the inclined bar is linked to the synchronous movement of the central bar. The central bar is linked to the movement of the limiting frame and moves synchronously. There is a gap between the central bar and the limiting frame. When the central bar rotates, it shakes and hits the limiting frame to operate. The collision between the limiting frame and the central bar produces a crisp sound, which can attract people's attention and prevent people from making mistakes during work. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural schematic diagram of the flat plate of the present invention;

[0021] Figure 3 This is a three-dimensional schematic diagram of the support shaft structure of the present invention;

[0022] Figure 4 This is a three-dimensional schematic diagram of the structure of the wheel of the present invention;

[0023] Figure 5 This is a three-dimensional schematic diagram of the support plate structure of the present invention;

[0024] Figure 6 This is a three-dimensional schematic diagram of the pressure plate structure of the present invention;

[0025] Figure 7 This is a three-dimensional schematic diagram of the folded strip structure of the present invention;

[0026] Figure 8 This is a three-dimensional schematic diagram of the support structure of the present invention;

[0027] Figure 9 This is a three-dimensional schematic diagram of the structure of the vertical arc of the present invention;

[0028] Figure 10 This is a three-dimensional structural schematic diagram of the wheel rim of the present invention;

[0029] Figure 11 This is a three-dimensional schematic diagram of the oblique strip structure of the present invention;

[0030] Figure 12 For the present invention Figure 11 A partially enlarged schematic diagram of the central support bar structure.

[0031] In the diagram: 1. Base; 2. Impurity removal device; 3. Shell; 4. Partition plate; 5. Mixing device; 6. Filtering device; 7. Baffle; 21. Stand; 22. Flat plate; 23. Central support frame; 24. Rope; 25. Shaft; 26. Support shaft; 27. Wheel; 51. Wheel rim; 52. Support seat; 53. Vertical arc; 55. Top plate; 56. Ring plate; 57. Processing device; 571. Block; 572. Diagonal bar; 573. Central through bar; 574. Limiting frame; 575. Ornament; 576. Support bar; 577. Wiping component; 61. Support plate; 62. Main cylinder; 63. Rotating shaft; 64. Pressure plate; 65. Traction bar; 66. Arc cylinder; 67. Sleeve; 68. Guide tube. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Examples of the invention are given for illustrative and descriptive purposes only and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0033] Example 1: Please refer to Figures 1-4 The present invention provides a technical solution: a silicon wafer cutting fluid filtration device, specifically comprising:

[0034] The base 1 has a movably connected impurity removal device 2 at the top right side of the front of the base 1. The impurity removal device 2 is used to adjust the state of impurities in the silicon wafer cutting fluid.

[0035] The impurity removal device 2 includes a frame 21, with a flat plate 22 fixedly connected to the top of the frame 21. A middle support frame 23 is movably installed on the side of the flat plate 22 away from the frame 21. A rope 24 is driven to be installed on the side of the flat plate 22 away from the frame 21. The rope 24 rotates and gradually drags the middle support frame 23. The bottom left side of the front of the middle support frame 23 is a support point. The top right side of the front of the middle support frame 23 deforms to the left, and the top cover of the flat plate 22 is lifted. The flat plate 22 drives the shaft 25 to move upward. A support shaft 26 is movably installed on the top of the rope 24. A wheel 27 is fixedly connected to the top of the support shaft 26. A shaft 25 is fixedly connected to the middle of the bottom of the flat plate 22. The shaft 25 is located inside the frame 21, and the top of the frame 21 has a slot corresponding to the shaft 25. The bottom of the outer surface of the support shaft 26 has a gear. Adhesive is coated between the wheel 27 and the support shaft 26.

[0036] Because the silicon wafers are placed on the ring plate 56, the centrifugal force caused by the rotation of the ring plate 56 can easily lead to the accumulation of impurities in the silicon wafers and cutting fluid, which is not conducive to better filtration. When it is necessary to adjust the position of the silicon wafers during filtration, the support shaft 26 is rotated by the partition plate 4, which drives the rope 24 to operate. The rope 24 gradually rotates, and the rotation of the rope 24 gradually drags the intermediate support frame 23. The bottom left side of the front of the intermediate support frame 23 is the support point, and the top right side of the front of the intermediate support frame 23 deforms to the left, and the top cover of the plate 22 is lifted. The plate 22 drives the shaft 25 to move upward. There is a space reserved between the partition plate 4 and the shaft 25. The plate 22 moves towards the top plate and impacts the wheel rim 51, causing the wheel rim 51 to vibrate. The vibration on the wheel rim 51 gradually links with the movement of the ring plate 56. The upper surface of the ring plate 56 gradually vibrates. The vibration of the ring plate 56 causes the top silicon wafer workpiece to gradually adjust its position, reducing the accumulation of silicon wafers in one place, which would reduce the filtration efficiency, and reducing the accumulation of cutting fluid in one place, which would form marks, thus further improving the silicon wafer filtration effect.

[0037] Example 2: Please refer to Figure 1 , Figure 2 , Figures 4-9 , Figure 12 The present invention provides a technical solution: a housing 3 is fixedly installed on the top side of the base 1 away from the impurity removal device 2, and the housing 3 and the impurity removal device 2 are opposite to each other. A partition plate 4 is fixedly connected to the top of the housing 3. The impurity removal device 2 has a movable rod accessory on the side near the middle of the partition plate 4. An adjustment device 5 is rotatably installed in the middle of the partition plate 4 through the movable rod accessory. The adjustment device 5 is used to adjust the state of the silicon wafer.

[0038] The dispensing device 5 includes a wheel rim 51. The support shaft 26 rotates and gradually moves in conjunction with the support seat 52. The support seat 52 rotates and moves the vertical arc 53. The vertical arc 53 rotates and moves along the inner cavity groove of the wheel rim 51. The vertical arc 53 gradually accommodates the cutting fluid flowing down the gap of the ring plate 56. The vertical arc 53 is slidably installed in the inner cavity of the wheel rim 51. The support seat 52 is fixedly connected to the bottom end of the vertical arc 53. The ring plate 56 is movably installed on the top of the inner surface of the wheel rim 51. The bottom of the ring plate 56 is connected to the top plate 55 through a movable rod accessory. The top plate 55 is connected to the support seat 52 through a movable rod accessory. The processing device 57 is fixedly connected to the top of the ring plate 56.

[0039] The wheel rim 51 is circular, and the inner surface dimensions of the ring plate 56 correspond to those of the wheel rim 51. A vertical arc 53 is snapped onto the top of the support 52. The center lines of the top plate 55 and the ring plate 56 are on the same straight line. The processing device 57 also includes a block 571. The support shaft 26 drives the ring plate 56 to move synchronously. The rotation of the ring plate 56 gradually acts on the block 571, causing it to move synchronously. As the block 571 rotates, it gradually rotates and presses against the sleeve 67. The sleeve 67 itself has a certain slope. Diagonal strips 572 are fixedly inserted into both sides of the top of the block 571. The rotation of the diagonal strips 572 is linked to the movement of the central through strip 573, which in turn moves synchronously. The central through strip 573 is linked to the movement of the limiting frame 574, and the central through strip 573 and the limiting frame move synchronously. There is a gap between 574. The bottom of the block 571 is fixedly connected to the ornament 575. The inner surface of the ornament 575 is inserted and installed with the support bar 576. The end of the support bar 576 away from the ornament 575 is fixedly connected to the wiping piece 577. The end of the diagonal bar 572 away from the block 571 is movably inserted with the central through bar 573. The outer surface of the central through bar 573 is movably fitted with the limiting frame 574. The thickness of the diagonal bar 572 is thicker than the thickness of the central through bar 573. The block 571 is connected to the central through bar 573 through the diagonal bar 572. The limiting frame 574 has a space reserved inside that corresponds to the central through bar 573. The diagonal bar 572 is made of stainless steel. The support bar 576 is embedded in the interior of the ornament 575. The interior of the ornament 575 has a slot corresponding to the support bar 576.

[0040] When the silicon wafer cutting fluid needs to be filtered, the support shaft 26 rotates and gradually moves in conjunction with the support base 52. The rotation of the support base 52 causes the vertical arc 53 to move. The vertical arc 53 rotates and moves along the inner cavity groove of the wheel rim 51. The vertical arc 53 gradually contains the cutting fluid flowing down from the gap of the ring plate 56, preventing splashing. The cutting fluid gradually flows into the area between the vertical arc 53 and the support base 52, preventing waste. When the cutting fluid needs to be transferred, the vertical arc 53 is manually pulled upwards, separating the vertical arc 53 from the support base 52. The cutting fluid gradually flows out from between the vertical arc 53 and the support base 52, thus ensuring that the equipment can quickly collect the cutting fluid, prevent the cutting fluid from splashing everywhere and dirtying the inner wall, and improve the convenience of silicon wafer cutting fluid transfer.

[0041] After the silicon wafers are filtered, impurities in the silicon wafer cutting fluid at the top of the ring plate 56 will remain. When it is necessary to clean the cutting fluid of the auxiliary consumables of the ring plate 56, the ring plate 56 moves under the linkage of the support shaft 26. The ring plate 56 rotates and gradually drives the block 571 to operate. The block 571 drives the swing component 575 to move synchronously. The swing component 575 shows a twisting tendency. The swing component 575 swings under the action of the support bar 576. The wiping component 577 moves accordingly. The wiping component 577 gradually wipes the impurities in the silicon wafer cutting fluid at the top of the ring plate 56, thereby ensuring that the equipment has the purpose of rapid and clean treatment and maintaining the cleanliness of the cutting fluid.

[0042] Because a large number of silicon wafers need to be processed during the filtration process, and the work is relatively tedious, it is easy to become drowsy or lose focus, resulting in reduced work efficiency and poor filtration of the silicon wafer cutting fluid. Therefore, the rotation of the block 571 gradually drives the inclined bar 572 and the ornament 575 to move synchronously. The inclined bar 572 gradually rotates and shifts, and the rotation of the inclined bar 572 is linked to the synchronous movement of the central through bar 573. The central through bar 573 is linked to the synchronous movement of the limiting frame 574. There is a gap between the central through bar 573 and the limiting frame 574. When the central through bar 573 rotates, it shakes and hits the limiting frame 574 to operate. The collision between the limiting frame 574 and the central through bar 573 produces a crisp sound, which serves to attract people's attention and prevent errors during work.

[0043] Example 3: Please refer to Figures 1-12 The present invention provides a technical solution: Based on embodiment 1, the mixing device 5 is located above the partition plate 4, and a baffle 7 is fixedly installed on the outer surface of the mixing device 5. A filter device 6 is embedded in the top of the mixing device 5. The filter device 6 is used to adjust the stabilization state of the silicon wafer filtration.

[0044] The filter device 6 includes a support plate 61, with a main cylinder 62 movably mounted at a slot on the support plate 61. A rotating shaft 63 is fixedly connected to the top center of the main cylinder 62, and a pressure plate 64 is fixedly connected to the top of the rotating shaft 63. A traction bar 65 is fixedly mounted on one side of the bottom of the pressure plate 64, and the traction bar 65 is located on the side near the axis of the wheel rim 51. The output end of the traction bar 65 is fixedly connected to an arc cylinder 66. When the arc cylinder 66 moves synchronously, the pressure plate 64, through the traction bar 65, pulls the arc cylinder 66 to prevent it from falling. The guide tube 68 gradually... The tube 68 gradually slides down from inside the sleeve 67 to prevent the arc cylinder 66 from falling off. The tube 68 gradually slides down from inside the sleeve 67 and is inserted into the inside of the main cylinder 62. When the sleeve 67 shakes, the filtered water inside the main cylinder 62 flows out. The bottom end of the arc cylinder 66 is fixedly connected to the sleeve 67. The tube 68 is slidably installed inside the sleeve 67. The sleeve 67 has a slot corresponding to the tube 68. The rotating shaft 63 is embedded in the bottom of the inner cavity of the main cylinder 62. The traction bar 65 itself is an elastic structure. The tube 68 is inserted into the top of the main cylinder 62.

[0045] In use, the silicon wafer is first placed in the area formed between the ring plate 56 and the wheel rim 51, and an appropriate amount of auxiliary cutting fluid is added. The partition plate 4 contains a motor. The output gear of the motor in the partition plate 4 meshes with the gear on the outer surface of the bottom end of the support shaft 26. The support shaft 26 rotates counterclockwise due to the meshing action. The rotation of the support shaft 26 links the ring plate 56 to operate synchronously, and the top plate 55 twists accordingly, thereby ensuring that the equipment has the basic conditions for rapid swing processing, laying a good foundation for subsequent processing.

[0046] When the silicon wafer needs to be filtered, the support shaft 26 is rotated by the output rod gear in the partition plate 4. The support shaft 26 drives the ring plate 56 to move synchronously. The rotation of the ring plate 56 gradually acts on the block 571 to move synchronously. As the block 571 rotates, it gradually rotates and gradually squeezes against the sleeve 67. The sleeve 67 itself has a certain inclination. The sleeve 67 is impacted by the inclination force and shakes. The arc cylinder 66 undergoes synchronous displacement. The pressure plate 64 plays the role of pulling the arc cylinder 66 through the traction bar 65 to prevent the arc cylinder 66 from falling. The guide tube 68 gradually slides down from the inside of the sleeve 67 and is inserted into the inside of the main cylinder 62. When the sleeve 67 shakes, the filtered water inside the main cylinder 62 flows out. The filtered water inside the main cylinder 62 gradually flows through the inner cavity of the guide tube 68 to the outer surface of the ring plate 56. The outer surface of the ring plate 56 is cleaned by the filtered water, thereby ensuring that the equipment can quickly filter the silicon wafer cutting fluid and improving the convenience of filtration.

[0047] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A silicon wafer cutting fluid filtration device, specifically comprising: A base (1) is provided with a cleaning device (2) movably connected to the top right side of the front of the base (1). The cleaning device (2) is used to adjust the state of impurities in the silicon wafer cutting fluid. A housing (3) is fixedly installed on the top side of the base (1) away from the cleaning device (2). The housing (3) and the cleaning device (2) are opposite to each other. A partition plate (4) is fixedly connected to the top of the housing (3). The cleaning device (2) has a movable rod accessory on the side near the middle of the partition plate (4). A dispensing device (5) is rotatably installed in the middle of the partition plate (4) through the movable rod accessory. The dispensing device (5) is used to adjust the state of the silicon wafer. The dispensing device (5) is located above the partition plate (4). A baffle (7) is fixedly installed on the outer surface of the dispensing device (5). A filter device (6) is embedded in the top of the dispensing device (5). The filter device (6) is used to adjust the state of the silicon wafer filtration. The mixing device (5) includes a wheel rim (51), a vertical arc (53) is slidably installed in the inner cavity of the wheel rim (51), a support (52) is fixedly connected to the bottom end of the vertical arc (53), a ring plate (56) is movably installed on the top of the inner surface of the wheel rim (51), the bottom of the ring plate (56) is connected to the top plate (55) through a movable rod accessory, the top plate (55) is connected to the support (52) through a movable rod accessory, and a processing device (57) is fixedly connected to the top of the ring plate (56). The filter device (6) includes a support plate (61), a main cylinder (62) is movably installed at the slot of the support plate (61), a rotating shaft (63) is fixedly connected to the top middle of the main cylinder (62), a pressure plate (64) is fixedly connected to the top of the rotating shaft (63), a traction bar (65) is fixedly installed on one side of the bottom of the pressure plate (64), and the traction bar (65) is located on the side near the axis of the wheel rim (51), the output end of the traction bar (65) is fixedly connected to an arc cylinder (66), a sleeve (67) is fixedly connected to the bottom end of the arc cylinder (66), and a guide tube (68) is slidably installed inside the sleeve (67).

2. The apparatus of claim 1, wherein: The wheel rim (51) is circular, and the ring plate (56) corresponds to the inner surface dimensions of the wheel rim (51). The top of the support (52) is fitted with a vertical arc (53), and the center lines of the top plate (55) and the ring plate (56) are on the same straight line.

3. The silicon wafer cutting fluid filtration device according to claim 1, characterized in that: The processing device (57) also includes a block (571), on which diagonal strips (572) are fixedly inserted at both sides of the top of the block (571), and a pendant (575) is fixedly connected to the bottom of the block (571). A support strip (576) is inserted and installed on the inner surface of the pendant (575). A wiping piece (577) is fixedly connected to the end of the support strip (576) away from the pendant (575). A central through strip (573) is movably inserted to the end of the diagonal strip (572) away from the block (571). A limiting frame (574) is movably sleeved on the outer surface of the central through strip (573).

4. The silicon wafer cutting fluid filtration device according to claim 3, characterized in that: The thickness of the diagonal strip (572) is greater than that of the central strip (573). The block (571) is connected to the central strip (573) through the diagonal strip (572). The limiting frame (574) has a space reserved inside that corresponds to the central strip (573).

5. A silicon wafer cutting fluid filtration device according to claim 3, characterized in that: The diagonal bar (572) is made of stainless steel, and the support bar (576) is embedded in the interior of the ornament (575). The interior of the ornament (575) has a slot corresponding to the support bar (576).

6. The silicon wafer cutting fluid filtration device according to claim 1, characterized in that: The sleeve (67) has a slot corresponding to the guide tube (68) inside. The rotating shaft (63) is embedded in the bottom of the inner cavity of the main cylinder (62). The traction bar (65) itself is an elastic structure. The guide tube (68) is inserted into the top of the main cylinder (62).

7. A silicon wafer cutting fluid filtration device according to claim 1, characterized in that: The impurity removal device (2) includes a stand (21), a plate (22) is fixedly connected to the top of the stand (21), a middle frame (23) is movably installed on the side of the plate (22) away from the stand (21), a rope (24) is driven on the side of the plate (22) away from the stand (21), a support shaft (26) is movably installed on the top of the rope (24), a wheel (27) is fixedly connected to the top of the support shaft (26), and a shaft (25) is fixedly connected to the middle of the bottom end of the plate (22).

8. A silicon wafer cutting fluid filtration device according to claim 7, characterized in that: The shaft (25) is located inside the frame (21), and the top of the frame (21) has a slot corresponding to the shaft (25). The bottom of the outer surface of the support shaft (26) has a gear, and the wheel (27) and the support shaft (26) are coated with adhesive.

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