A method and device for removing residual glue in NPTH hole of circuit board

Abstract

The present invention relates to the technical field of circuit boards, and specifically discloses a method and device for removing residual glue in a NPTH hole of a circuit board. The present application first performs displacement alignment between the NPTH hole of the circuit board and the laser emitter, and after alignment, obtains the laser power information, pulse frequency information, and plane focus position information of the laser emitter during the beam focusing operation according to the volume of the residual glue, so that a customized laser generated according to the operating parameters of multiple beam focusing operations can accurately remove the residual glue in the NPTH hole of the circuit board, and a specific laser can be used to accurately and adaptively remove residual glue of different sizes, and while removing the residual glue, it can avoid damaging the body of the NPTH hole.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a method and a device for removing residual glue in a NPTH hole of a circuit board. Background Art

[0002] Circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. In the process of circuit board production, NPTH hole operation is required for the circuit board. Among them, NPTH hole is also called non-metallized hole. Non-metallized hole does not participate in the electrical connection of PCB, that is, its hole wall is not copper-plated. These holes are generally used for positioning or installing screws, etc.

[0003] During the manufacturing process of NPTH holes, steel wires need to be used to prevent dust from entering the holes and affecting installation. In the process of combining the NPTH holes and the steel wires, high-flow glue is needed to connect them. After the high-flow glue combines the NPTH holes and the steel wires, a certain amount of residual glue will remain. The remaining residual glue will affect the use of screws for connecting the NPTH holes in the later stage. The existing laser flooding method for removing residual glue cannot adaptively remove residual glue of different sizes in a targeted manner, which will damage the body of the NPTH hole during the process of removing the residual glue. Therefore, a method for removing residual glue in NPTH holes of circuit boards is needed to remove the residual glue in the NPTH holes. Summary of the invention

[0004] The object of the present invention is to provide a method and device for removing residual glue in NPTH holes of a circuit board, so as to solve the technical problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A method for removing residual glue in a NPTH hole of a circuit board, characterized by comprising:

[0007] Obtaining a first aperture space coordinate of an NPTH hole of a circuit board, and setting the first aperture space coordinate as an origin coordinate, wherein there is residual glue in the NPTH hole;

[0008] Acquire the first spatial coordinates of the laser emitter, and displace the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the displaced first spatial coordinates are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates;

[0009] The sonic scanner obtains the position information of the residual glue, and obtains the volume of the residual glue according to the position information of the residual glue, wherein the sonic scanner is installed on the laser transmitter;

[0010] Acquiring operating parameters of the laser transmitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information;

[0011] The laser transmitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and directionally removes the residual glue in the NPTH hole of the circuit board according to the cleaning laser.

[0012] Preferably, before the step of using the ultrasonic scanner to obtain the position information of the residual adhesive, the method comprises:

[0013] Obtain top view plane image information of the NPTH hole of the circuit board;

[0014] Graying and binarizing the inner diameter area of ​​the NPTH hole in the top-view plane image information to obtain a black image and a white image, wherein the black image is the residual glue and the white image is the blank area of ​​the inner diameter of the NPTH hole;

[0015] The black image adhesive residue is subjected to fluorescence calibration to obtain fluorescence calibration information, and the acoustic wave scanner obtains the position information of the adhesive residue according to the fluorescence calibration information.

[0016] Preferably, the step of obtaining the volume of the residual glue according to the position information of the residual glue comprises:

[0017] The sonic scanner transmits a plurality of sonic pulse signals to the residual glue, and receives a plurality of rebound signals returned after the sonic pulse signals hit the residual glue, and obtains a plurality of return distances from the sonic scanner to the residual glue according to the plurality of rebound signals, and sets the end point of any one of the return distances as the coordinate reference origin;

[0018] The end point coordinates of the remaining multiple return distances are obtained in sequence based on the coordinate reference origin, and the end point coordinates of the multiple return distances are input into the UGNX three-dimensional software to obtain a residual glue three-dimensional model;

[0019] The displacement of the residual glue three-dimensional model is calculated based on the displacement method, where the displacement is equal to the volume of the residual glue.

[0020] Preferably, the step of obtaining the operating parameters of the laser emitter during the beam focusing operation according to the volume of the residual adhesive comprises:

[0021] Get the contour information of residual glue;

[0022] Performing edge detection and analysis on the contour information of the residual glue based on an edge detection algorithm to obtain residual glue edge segmentation information;

[0023] Acquiring residual glue image information according to the residual glue edge segmentation information;

[0024] Acquire a plurality of pixel points according to the residual glue image information, wherein the residual glue image is a set composed of a plurality of pixel points;

[0025] Obtain multiple plane positioning coordinates of multiple pixel points in the residual glue image;

[0026] Acquire the total number of pixel points in the residual glue image according to the multiple pixel points;

[0027] The center plane position coordinates of the residual glue are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is:

[0028]

[0029] C(x, y) is the center plane position coordinate of the residual glue, Xi is the coordinate value of the pixel point on the X axis, Ai is the pixel point on the X axis, yi is the coordinate value of the pixel point on the Y axis, Bi is the pixel point on the Y axis, M is the total pixel points in the residual glue image, where i is the number of multiple residual glue points, i=1, 2, 3...n;

[0030] The center plane position coordinates of the residual glue are defined as the plane focus position information.

[0031] Preferably, the step of generating a clearing laser by the laser emitter according to the operating parameters of the beam focusing operation comprises:

[0032] Quantitatively output power to the residual adhesive according to the laser power information to obtain a rated output power;

[0033] Acquire the number of pulses applied to the residual adhesive according to the pulse frequency information;

[0034] Obtaining the center of mass of the residual glue according to the volume of the residual glue;

[0035] Obtain the laser emission distance from the laser emitter source to the center of mass of the residual glue;

[0036] Obtaining the initial light intensity of the laser beam when it is initially emitted;

[0037] Calculate the initial light intensity enhancement coefficient corresponding to the laser emission distance based on the Beer-Lambert law;

[0038] The clearing parameter value is calculated based on the rated output power, the number of pulses and the initial light intensity reinforcement coefficient, where the calculation formula is:

[0039] X=F*N*Q*ε

[0040] X is the clearing parameter value, F is the rated output power, N is the number of pulses, Q is the initial light intensity, and ε is the initial light intensity reinforcement coefficient;

[0041] The laser emitter generates a clearing laser according to the clearing parameter value.

[0042] Preferably, after the step of directionally removing the residual glue in the NPTH hole of the circuit board by using a laser, the method further comprises:

[0043] Obtain the repair image in the NPTH hole of the circuit board after directional removal of residual glue, and determine whether the repair image meets the preset standard;

[0044] If the repaired image meets the preset standard, the operating parameters of the beam focusing operation corresponding to the repaired image are stored and marked as standard operating parameters;

[0045] The volume of the residual glue corresponding to the repaired image is stored and marked as a sample volume;

[0046] Repeat the steps of obtaining the first aperture spatial coordinates of the NPTH hole of the circuit board to the step of obtaining the volume of the residual glue according to the position information of the residual glue, so as to obtain the volume of the residual glue in the NPTH hole of the next circuit board;

[0047] Determine whether the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset range;

[0048] If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset interval, the standard operating parameters corresponding to the sample volume are used as operating parameters of the beam focusing operation of the NPTH hole of the circuit board;

[0049] Return to the step of generating a cleaning laser by the laser transmitter according to the operating parameters of the beam focusing operation and performing directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser;

[0050] If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is not within the preset range;

[0051] Return to the step of obtaining the operating parameters of the laser transmitter beam focusing operation according to the volume of the residual adhesive.

[0052] Preferably, the laser transmitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and the step of directionally cleaning the residual glue in the NPTH hole of the circuit board according to the cleaning laser comprises:

[0053] Acquire a power value for removing residual adhesive according to the laser power information;

[0054] Acquire the number of times residual glue is removed according to the pulse frequency information;

[0055] Determine the center point of the residual glue in the NPTH hole of the circuit board according to the plane focus position information, and obtain the residual glue removal point;

[0056] A cleaning laser is generated according to the residual glue cleaning power value and the number of residual glue cleaning times, and the cleaning laser performs a fixed-point cleaning operation on the residual glue cleaning point.

[0057] The present application also provides a device for removing residual glue in a NPTH hole of a circuit board, comprising:

[0058] A first acquisition module is used to acquire a first aperture space coordinate of an NPTH hole of a circuit board and set the first aperture space coordinate as an origin coordinate, wherein there is residual glue in the NPTH hole;

[0059] a first moving module, used for acquiring the first spatial coordinates of the laser emitter, and displacing the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the first spatial coordinates after the displacement are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates;

[0060] A second acquisition module is used for acquiring the position information of the residual glue by an acoustic wave scanner, and acquiring the volume of the residual glue according to the position information of the residual glue, wherein the acoustic wave scanner is installed on the laser transmitter;

[0061] A third acquisition module is used to acquire the operating parameters of the laser emitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information;

[0062] The first cleaning module is used for the laser transmitter to generate a cleaning laser according to the operating parameters of the beam focusing operation, and to perform directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser.

[0063] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0064] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0065] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0066] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0067] The beneficial effects of the present application are as follows: the present application first obtains the first aperture space coordinates of the NPTH hole of the circuit board, and sets the first aperture space coordinates as the origin coordinates, wherein there is residual glue in the NPTH hole, and then obtains the first space coordinates of the laser emitter, and displaces the position of the laser emitter according to the origin coordinates and the first space coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the first space coordinates after the displacement are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates, so that the laser emitter and the NPTH hole can be quickly positioned, and the Z-axis is the distance between the laser emitter and the NPTH hole, and then the position information of the residual glue is obtained by the ultrasonic scanner, and the volume of the residual glue is obtained according to the position information of the residual glue, wherein the ultrasonic scanner is installed on the laser emitter, and then the residual glue is located according to the residual glue. The volume of the glue is used to obtain the operating parameters of the laser transmitter during the beam focusing operation, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information, so that exclusive lasers can be customized for residual glue of different sizes according to the volume of the residual glue to prevent excessive laser from damaging the inner wall of the NPTH hole, and then after the first residual glue is removed, the volume of the residual glue remaining in the NPTH hole of the circuit board is re-acquired in turn to obtain multiple residual glue volumes, and multiple operating parameters for the beam focusing operation are generated according to the multiple residual glue volumes, and clearing lasers are generated in turn according to the operating parameters of the multiple beam focusing operations to clean the remaining residual glue in the NPTH hole of the circuit board in turn, so that the generated customized laser can accurately remove the residual glue in the NPTH hole of the circuit board, and the specific laser can accurately and adaptively remove residual glue of different sizes, and while removing the residual glue, it can avoid damaging the body of the NPTH hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 The figure is a schematic diagram of a method flow of an embodiment of the present application.

[0069] Figure 2 Schematic diagram of the device structure of an embodiment of the present application.

[0070] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0071] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0072] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0073] like Figure 1-3 As shown, the present application provides a method and device for removing residual glue in a NPTH hole of a circuit board, comprising:

[0074] S1, obtaining the first aperture space coordinate of the NPTH hole of the circuit board, and setting the first aperture space coordinate as the origin coordinate, wherein there is residual glue in the NPTH hole;

[0075] S2. Obtain the first spatial coordinates of the laser emitter, and displace the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the first spatial coordinates after the displacement are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates;

[0076] S3, an acoustic wave scanner obtains the position information of the residual glue, and obtains the volume of the residual glue according to the position information of the residual glue, wherein the acoustic wave scanner is installed on the laser transmitter;

[0077] S4, obtaining operating parameters of the laser emitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information;

[0078] S5. The laser transmitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and directionally removes the residual glue in the NPTH hole of the circuit board according to the cleaning laser.

[0079] As described in the above steps S1-S5, during the manufacturing process of the NPTH hole, a steel wire needs to be used to prevent dust from entering the NPTH hole and affecting the installation. In the process of combining the NPTH hole and the steel wire, they need to be connected through high-flow glue. After the high-flow glue combines the NPTH hole and the steel wire, there will be a certain amount of residual glue, and the remaining residual glue will affect the later use of the NPTH hole to connect the screws. The existing laser flooding to remove residual glue cannot adaptively remove residual glue of different sizes in a targeted manner, which will cause damage to the body of the NPTH hole during the process of removing the residual glue. Based on this, the present application first obtains the first aperture space coordinates of the NPTH hole of the circuit board, and sets the first aperture space coordinates as the origin coordinates, wherein there is residual glue in the NPTH hole, and then obtains the first space coordinates of the laser emitter, and displaces the position of the laser emitter according to the origin coordinates and the first space coordinates, wherein when the laser emitter is displaced, the laser emitter is displaced according to the origin coordinates. The X-axis and Y-axis of the emitter are moved so that the values ​​corresponding to the X-axis and the Y-axis in the first spatial coordinates after the displacement are equal to the values ​​corresponding to the X-axis and the Y-axis in the origin coordinates, so that the laser emitter and the NPTH hole can be quickly positioned, and the Z-axis is the distance between the laser emitter and the NPTH hole, and then the position information of the residual glue is obtained by the acoustic wave scanner, and the volume of the residual glue is obtained according to the position information of the residual glue, wherein the acoustic wave scanner is installed on the laser emitter, and then the operating parameters of the laser emitter during the beam focusing operation are obtained according to the volume of the residual glue, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information, so that exclusive lasers can be customized for residual glue of different sizes according to the volume of the residual glue, and the specific laser can be used to accurately and adaptively remove residual glue of different sizes, and while removing the residual glue, it can avoid damaging the body of the NPTH hole.

[0080] In one embodiment, before step S2 of obtaining the position information of the residual adhesive by the ultrasonic scanner, the following steps are included:

[0081] S101, obtaining top view plane image information of a NPTH hole of a circuit board;

[0082] S102, graying and binarizing the inner diameter area of ​​the NPTH hole in the top-view plane image information to obtain a black image and a white image, wherein the black image is residual glue and the white image is a blank area of ​​the inner diameter of the NPTH hole;

[0083] S103, performing fluorescence calibration on the residual glue of the black image to obtain fluorescence calibration information, and using an acoustic wave scanner to obtain position information of the residual glue according to the fluorescence calibration information.

[0084] As described in the above steps S101-S103, since the residual glue inside the NPTH hole is affected by light, the position of the residual glue inside the NPTH hole determined by the laser sensor is limited, thereby increasing the error in determining the residual glue position under dark light conditions. Therefore, it is necessary to mark the residual glue to facilitate rapid positioning of the residual glue, so that the residual glue can be quickly cleaned by the laser. First, the top view plane image information of the NPTH hole of the circuit board is obtained, and then the inner diameter area of ​​the NPTH hole in the top view plane image information is grayed and binarized to obtain a black image and a white image, wherein, The black image is the residual glue, and the white image is the blank area of ​​the inner diameter of the NPTH hole. Since the residual glue has high roughness and weak light reflection ability, after processing the captured picture, the residual glue area is dark, and the dark color corresponds to black in the photo. The light color represents the smooth inner wall of the aperture, and the light color corresponds to white in the photo. Then, the residual glue in the black image is fluorescently calibrated to obtain the fluorescent calibration information. The ultrasonic scanner obtains the position information of the residual glue according to the fluorescent calibration information, so that the laser can accurately locate the residual glue according to the fluorescent calibration information to facilitate the rapid cleaning of the residual glue.

[0085] In one embodiment, the step S3 of obtaining the volume of the residual glue according to the position information of the residual glue comprises:

[0086] S301, the sonic scanner transmits a plurality of sonic pulse signals to the residual glue, and receives a plurality of rebound signals returned after the sonic pulse signals hit the residual glue, obtains a plurality of return distances from the sonic scanner to the residual glue according to the plurality of rebound signals, and sets an end point of any one of the return distances as a coordinate reference origin;

[0087] S302, sequentially acquiring the end point coordinates of the remaining multiple return distances based on the coordinate reference origin, and inputting the end point coordinates of the multiple return distances into UGNX three-dimensional software to obtain a residual glue three-dimensional model;

[0088] S303, calculating the displacement of the residual glue three-dimensional model based on the displacement method, wherein the displacement is equal to the volume of the residual glue.

[0089] As described in the above steps S301-S303, since the residual glue exists in the NPTH hole, it is difficult to obtain the volume of the residual glue. Therefore, an acoustic wave scanner is used to transmit multiple acoustic wave pulse signals to the residual glue, and multiple rebound signals returned after the acoustic wave pulse signals hit the residual glue are received. According to the multiple rebound signals, multiple return distances from the acoustic wave scanner to the residual glue are obtained, and the end point of any one of the return distances is established as the coordinate reference origin. Then, based on the coordinate reference origin, the end point coordinates of the remaining multiple return distances are obtained in turn, and the end point coordinates of the multiple return distances are input into the UGNX three-dimensional software. The UGNX three-dimensional software is a software that can be used through The UGNX 3D software is used for modeling with coordinates. The three-dimensional model of the residual glue can be obtained through the end point coordinates of multiple return distances. The UGNX 3D software is provided with a fluid simulation mode. The fluid simulation mode can put the three-dimensional model of the residual glue into a measuring cup container filled with water for fluid simulation. In this way, the water will overflow out of the measuring cup container after being squeezed by the three-dimensional model of the residual glue, and then the water level can be judged by the scale line of the measuring cup. Then, the amount of water squeezed out of the residual glue can be obtained by subtracting the stock water level from the full cup water level, and the volume of the irregular residual glue can be obtained, that is, the water displacement is equal to the volume of the residual glue. Then, the volume of the residual glue can be quickly simulated by the UGNX 3D software, so as to facilitate the acquisition of the volume of the residual glue under irregular shapes.

[0090] In one embodiment, the step S4 of obtaining the operating parameters of the laser emitter beam focusing operation according to the volume of the residual adhesive includes:

[0091] S401, obtaining the contour information of the residual adhesive;

[0092] S402, performing edge detection and analysis on the contour information of the residual glue based on an edge detection algorithm to obtain residual glue edge segmentation information;

[0093] S403, obtaining residual glue image information according to the residual glue edge segmentation information;

[0094] S404, acquiring a plurality of pixel points according to the residual glue image information, wherein the residual glue image is a set consisting of a plurality of pixel points;

[0095] S405, obtaining multiple plane positioning coordinates of multiple pixel points in the residual glue image;

[0096] S406, obtaining the total number of pixel points in the residual glue image according to the plurality of pixel points;

[0097] S407, calculating the center plane position coordinates of the residual glue according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is:

[0098]

[0099] C(x, y) is the center plane position coordinate of the residual glue, Xi is the coordinate value of the pixel point on the X axis, Ai is the pixel point on the X axis, yi is the coordinate value of the pixel point on the Y axis, Bi is the pixel point on the Y axis, M is the total pixel points in the residual glue image, where i is the number of multiple residual glue points, i=1, 2, 3...n;

[0100] S408, defining the center plane position coordinates of the residual adhesive as plane focus position information.

[0101] As described in the above steps S401-S408, since the thickness of each residual glue is different, the same power source laser will cause the thinner residual glue to be removed too quickly, and then the residual laser will damage the inner wall of the NPTH hole. Based on this, the contour information of the residual glue is first obtained, and then the contour information of the residual glue is edge detected and analyzed based on the edge detection algorithm to obtain the residual glue edge segmentation information, and then the residual glue image information is obtained according to the residual glue edge segmentation information, and a plurality of pixel points are obtained according to the residual glue image information, wherein the residual glue image is a set of a plurality of pixel points, and a plurality of plane positioning coordinates of the plurality of pixel points in the residual glue image are obtained, and then the total number of pixel points in the residual glue image is obtained according to the plurality of pixel points, and then the center plane position coordinates of the residual glue are calculated according to the plurality of pixel points, the plurality of plane positioning coordinates and the total pixel points. In this way, after the center plane position coordinates of the residual glue are calculated, the laser energy point can be determined to gather at the center position of the residual glue surface according to the center plane position coordinates of the residual glue, without generating unnecessary laser spillover effects on the surrounding area, thereby avoiding the damage to the NPTH hole.

[0102] In one embodiment, the step S5 of generating a cleaning laser by the laser emitter according to the operating parameters of the beam focusing operation comprises:

[0103] S501, performing quantitative power output on the residual adhesive according to the laser power information to obtain a rated output power;

[0104] S502, obtaining the number of pulses applied to the residual adhesive according to the pulse frequency information;

[0105] S503, obtaining the centroid of the residual glue according to the volume of the residual glue;

[0106] S504, obtaining the laser emission distance from the laser emitter source to the center of mass of the residual glue;

[0107] S505, obtaining the initial light intensity of the laser beam when it is initially emitted;

[0108] S506, calculating the initial light intensity reinforcement coefficient corresponding to the laser emission distance based on the Beer-Lambert law;

[0109] S507, calculating the clearing parameter value according to the rated output power, the number of pulses and the initial light intensity reinforcement coefficient, wherein the calculation formula is:

[0110] X=F*N*Q*ε

[0111] X is the clearing parameter value, F is the rated output power, N is the number of pulses, Q is the initial light intensity, and ε is the initial light intensity reinforcement coefficient;

[0112] S508. The laser transmitter generates a clearing laser according to the clearing parameter value.

[0113] As described in the above steps S501-S508, since there is energy attenuation from the laser to the center of mass of the residual glue, it is necessary to calculate the initial light intensity reinforcement coefficient corresponding to the laser emission distance based on the Beer-Lambert law, and then first obtain the number of pulses for the residual glue according to the pulse frequency information, and then obtain the center of mass of the residual glue according to the volume of the residual glue, and then obtain the laser emission distance from the laser emitter source to the center of mass of the residual glue, and then obtain the initial light intensity of the laser beam when it is initially emitted, and then calculate the cleaning parameter value according to the rated output power, the number of pulses and the initial light intensity reinforcement coefficient. The cleaning parameter value obtained in this way can clean the residual glue more accurately, and the generated cleaning laser can carry out directionally cleaning of the residual glue in the NPTH hole of the circuit board, and then the precise cleaning parameter value can make the residual glue removal more thorough.

[0114] In one embodiment, after the step S5 of directionally removing the residual glue in the NPTH hole of the circuit board according to the laser removal method, the method includes:

[0115] S6, obtaining a repair image in the NPTH hole of the circuit board after the residual adhesive is removed in a directional manner, and determining whether the repair image meets a preset standard;

[0116] If the repaired image meets the preset standard, the operating parameters of the beam focusing operation corresponding to the repaired image are stored and marked as standard operating parameters;

[0117] S7, storing the volume of the residual glue corresponding to the repaired image and marking it as a sample volume;

[0118] S8, repeating the steps of obtaining the first aperture spatial coordinates of the NPTH hole of the circuit board to the step of obtaining the volume of the residual glue according to the position information of the residual glue, so as to obtain the volume of the residual glue in the NPTH hole of the next circuit board;

[0119] S9, determining whether the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset range;

[0120] If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset interval, the standard operating parameters corresponding to the sample volume are used as operating parameters of the beam focusing operation of the NPTH hole of the circuit board;

[0121] S10, returning to the step of generating a cleaning laser by the laser transmitter according to the operating parameters of the beam focusing operation and performing directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser;

[0122] If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is not within the preset range;

[0123] S11, returning to the step of obtaining the operating parameters of the laser emitter beam focusing operation according to the volume of the residual adhesive.

[0124] As described in the above step S6-11, after the residual glue in the NPTH hole of the circuit board is directionally removed according to the cleaning laser, a repair image in the NPTH hole of the circuit board after the directionally removing the residual glue is first obtained, and it is determined whether the repair image meets the preset standard. If the repair image meets the preset standard, the operating parameters of the beam focusing operation corresponding to the repair image are stored and marked as standard operating parameters, and then the volume of the residual glue corresponding to the repair image is stored and marked as a sample volume, so that the laser operating parameters of the residual glue perfectly repaired in the NPTH hole can be used as a sample, and then the laser operating parameters can be quickly provided for the residual glue with a subsequent volume within the error range, so as to improve the efficiency of laser removing the residual glue, and then the steps of obtaining the first aperture space coordinates of the NPTH hole of the circuit board to the steps of obtaining the volume of the residual glue according to the position information of the residual glue are repeated to obtain the volume of the residual glue in the NPTH hole of the next circuit board, and then it is determined whether the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within the preset range. If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within the preset interval, the standard operating parameters corresponding to the sample volume are used as the operating parameters of the beam focusing operation of the NPTH hole of the circuit board. The volume of the next residual glue is repeatedly obtained, and the current volume of the residual glue is compared with the previous volume of the residual glue. If the current volume of the residual glue and the previously processed residual glue volume are within the error range, the step of returning to the step of generating a clearing laser according to the operating parameters of the beam focusing operation by the laser emitter and performing directionally clearing of the residual glue in the NPTH hole of the circuit board according to the clearing laser is returned. If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is not within the preset interval, the step of returning to the step of obtaining the operating parameters of the laser emitter beam focusing operation according to the volume of the residual glue. In this way, the operating parameters of the beam focusing operation for the previous residual glue removal can be used as a reference for the operating parameters for cleaning the residual glue in the subsequent NPTH hole of the circuit board, thereby accelerating the efficiency of the subsequent residual glue cleaning in the NPTH hole of the circuit board.

[0125] In one embodiment, the laser emitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and the step S5 of directionally cleaning the residual glue in the NPTH hole of the circuit board according to the cleaning laser includes:

[0126] S506, obtaining a power value for removing residual adhesive according to the laser power information;

[0127] S507, obtaining the number of times residual adhesive is removed according to the pulse frequency information;

[0128] S508, determining the center point position of the residual glue in the NPTH hole of the circuit board according to the plane focus position information, and obtaining the residual glue removal point;

[0129] S509, generating a removal laser according to the residual glue removal power value and the number of residual glue removal operations, and the removal laser performs a fixed-point removal operation on the residual glue removal point.

[0130] As described in the above steps S506-S509, when the residual glue in the NPTH hole is directionally removed, the power value for removing the residual glue is first obtained according to the laser power information, so that the laser power can be configured according to the removed residual glue, thereby avoiding excess laser overflow, and then the center point position of the residual glue in the NPTH hole of the circuit board is determined according to the plane focus position information to obtain the residual glue removal point, so that the laser can start cleaning according to the residual glue removal point, and then the number of residual glue removal times is obtained according to the pulse frequency information, so that the residual glue can be accurately removed according to the number of laser emissions, avoiding excess laser emission to damage the inner wall of the NPTH hole of the circuit board.

[0131] The present application also provides a device for removing residual glue in a NPTH hole of a circuit board, comprising:

[0132] A first acquisition module 1 is used to acquire a first aperture space coordinate of an NPTH hole of a circuit board and set the first aperture space coordinate as an origin coordinate, wherein there is residual glue in the NPTH hole;

[0133] A first moving module 2 is used to obtain the first spatial coordinates of the laser emitter, and to displace the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the first spatial coordinates after the displacement are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates;

[0134] The second acquisition module 3 is used for acquiring the position information of the residual glue by an acoustic wave scanner, and acquiring the volume of the residual glue according to the position information of the residual glue, wherein the acoustic wave scanner is installed on the laser transmitter;

[0135] A third acquisition module 4 is used to acquire the operating parameters of the laser emitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information;

[0136] The first cleaning module 5 is used for the laser transmitter to generate a cleaning laser according to the operating parameters of the beam focusing operation, and to perform directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser.

[0137] like Figure 3 As shown, the present application also provides a computer device, which may be a server, and its internal structure may be as shown in Figure 3As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor designed by the computer is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used for all data required for the process of the method for removing residual glue in the NPTH hole of the circuit board. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the method for removing residual glue in the NPTH hole of the circuit board is implemented.

[0138] Those skilled in the art will understand that Figure 3 The structure shown in is merely a block diagram of a portion of the structure related to the present application solution and does not constitute a limitation on the computer device to which the present application solution is applied.

[0139] An embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, any of the above-mentioned methods and devices for removing residual glue in the NPTH hole of a circuit board is implemented.

[0140] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0141] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0142] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for removing residual glue in NPTH holes of a circuit board, characterized in that: include: Obtaining a first aperture space coordinate of an NPTH hole of a circuit board, and setting the first aperture space coordinate as an origin coordinate, wherein there is residual glue in the NPTH hole; Acquire the first spatial coordinates of the laser emitter, and displace the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the displaced first spatial coordinates are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates; The sonic scanner obtains the position information of the residual glue, and obtains the volume of the residual glue according to the position information of the residual glue, wherein the sonic scanner is installed on the laser transmitter; Acquiring operating parameters of the laser transmitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information; Get the contour information of residual glue; Performing edge detection and analysis on the contour information of the residual glue based on an edge detection algorithm to obtain residual glue edge segmentation information; Acquiring residual glue image information according to the residual glue edge segmentation information; Acquire a plurality of pixel points according to the residual glue image information, wherein the residual glue image is a set composed of a plurality of pixel points; Obtain multiple plane positioning coordinates of multiple pixel points in the residual glue image; Acquire the total number of pixel points in the residual glue image according to the multiple pixel points; The center plane position coordinates of the residual glue are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is: ； C(x, y) is the center plane position coordinate of the residual glue, Xi is the coordinate value of the pixel point on the X axis, Ai is the pixel point on the X axis, yi is the coordinate value of the pixel point on the Y axis, Bi is the pixel point on the Y axis, M is the total pixel points in the residual glue image, where i is the number of multiple residual glue points, i=1, 2, 3...n; The center plane position coordinates of the residual glue are defined as plane focus position information; The laser transmitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and directionally removes the residual glue in the NPTH hole of the circuit board according to the cleaning laser.

2. The method for removing residual glue in NPTH hole of circuit board according to claim 1, characterized in that: Before the step of using the acoustic wave scanner to obtain the position information of the residual adhesive, the method includes: Obtain top view plane image information of the NPTH hole of the circuit board; Graying and binarizing the inner diameter area of ​​the NPTH hole in the top-view plane image information to obtain a black image and a white image, wherein the black image is the residual glue and the white image is the blank area of ​​the inner diameter of the NPTH hole; The black image adhesive residue is subjected to fluorescence calibration to obtain fluorescence calibration information, and the acoustic wave scanner obtains the position information of the adhesive residue according to the fluorescence calibration information.

3. The method for removing residual glue in NPTH hole of circuit board according to claim 1, characterized in that: The step of obtaining the volume of the residual glue according to the position information of the residual glue comprises: The sonic scanner transmits a plurality of sonic pulse signals to the residual glue, and receives a plurality of rebound signals returned after the sonic pulse signals hit the residual glue, and obtains a plurality of return distances from the sonic scanner to the residual glue according to the plurality of rebound signals, and sets the end point of any one of the return distances as the coordinate reference origin; The end point coordinates of the remaining multiple return distances are obtained in sequence based on the coordinate reference origin, and the end point coordinates of the multiple return distances are input into the UGNX three-dimensional software to obtain a residual glue three-dimensional model; The displacement of the residual glue three-dimensional model is calculated based on the displacement method, where the displacement is equal to the volume of the residual glue.

4. The method for removing residual glue in NPTH hole of circuit board according to claim 1, characterized in that: The step of the laser transmitter generating a cleaning laser according to the operating parameters of the beam focusing operation comprises: Quantitatively output power to the residual adhesive according to the laser power information to obtain a rated output power; Acquire the number of pulses applied to the residual adhesive according to the pulse frequency information; Obtaining the center of mass of the residual glue according to the volume of the residual glue; Obtain the laser emission distance from the laser emitter source to the center of mass of the residual glue; Obtaining the initial light intensity of the laser beam when it is initially emitted; Calculate the initial light intensity enhancement coefficient corresponding to the laser emission distance based on the Beer-Lambert law; The clearing parameter value is calculated based on the rated output power, the number of pulses and the initial light intensity reinforcement coefficient, where the calculation formula is: ； X is the clearing parameter value, F is the rated output power, N is the number of pulses, Q is the initial light intensity, and ε is the initial light intensity reinforcement coefficient; The laser emitter generates a clearing laser according to the clearing parameter value.

5. The method for removing residual glue in NPTH hole of circuit board according to claim 1, characterized in that: After the step of directionally removing the residual glue in the NPTH hole of the circuit board according to the removal laser, the method includes: Obtain the repair image in the NPTH hole of the circuit board after directional removal of residual glue, and determine whether the repair image meets the preset standard; If the repaired image meets the preset standard, the operating parameters of the beam focusing operation corresponding to the repaired image are stored and marked as standard operating parameters; The volume of the residual glue corresponding to the repaired image is stored and marked as a sample volume; Repeat the steps of obtaining the first aperture spatial coordinates of the NPTH hole of the circuit board to the step of obtaining the volume of the residual glue according to the position information of the residual glue, so as to obtain the volume of the residual glue in the NPTH hole of the next circuit board; Determine whether the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset range; If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is within a preset interval, the standard operating parameters corresponding to the sample volume are used as operating parameters of the beam focusing operation of the NPTH hole of the circuit board; Return to the step of generating a cleaning laser by the laser transmitter according to the operating parameters of the beam focusing operation and performing directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser; If the difference between the volume of the residual glue obtained according to the position information of the residual glue and the sample volume is not within the preset range; Return to the step of obtaining the operating parameters of the laser transmitter beam focusing operation according to the volume of the residual adhesive.

6. The method for removing residual glue in NPTH holes of a circuit board according to claim 1, characterized in that: The laser transmitter generates a cleaning laser according to the operating parameters of the beam focusing operation, and the steps of directionally cleaning the residual glue in the NPTH hole of the circuit board according to the cleaning laser include: Acquire a power value for removing residual adhesive according to the laser power information; Acquire the number of times residual glue is removed according to the pulse frequency information; Determine the center point of the residual glue in the NPTH hole of the circuit board according to the plane focus position information, and obtain the residual glue removal point; A cleaning laser is generated according to the residual glue cleaning power value and the number of residual glue cleaning times, and the cleaning laser performs a fixed-point cleaning operation on the residual glue cleaning point.

7. A device for removing residual glue in NPTH holes of a circuit board, characterized in that: include: A first acquisition module is used to acquire a first aperture space coordinate of an NPTH hole of a circuit board and set the first aperture space coordinate as an origin coordinate, wherein there is residual glue in the NPTH hole; a first moving module, used for acquiring the first spatial coordinates of the laser emitter, and displacing the position of the laser emitter according to the origin coordinates and the first spatial coordinates, wherein when the laser emitter is displaced, the X-axis and Y-axis of the laser emitter are moved according to the origin coordinates, so that the value corresponding to the X-axis and the value corresponding to the Y-axis in the first spatial coordinates after the displacement are equal to the value corresponding to the X-axis and the value corresponding to the Y-axis in the origin coordinates; A second acquisition module is used for acquiring the position information of the residual glue by an acoustic wave scanner, and acquiring the volume of the residual glue according to the position information of the residual glue, wherein the acoustic wave scanner is installed on the laser transmitter; A third acquisition module is used to acquire the operating parameters of the laser emitter during the beam focusing operation according to the volume of the residual adhesive, wherein the operating parameters during the beam focusing operation include laser power information, pulse frequency information and plane focus position information; Get the contour information of residual glue; Performing edge detection and analysis on the contour information of the residual glue based on an edge detection algorithm to obtain residual glue edge segmentation information; Acquiring residual glue image information according to the residual glue edge segmentation information; Acquire a plurality of pixel points according to the residual glue image information, wherein the residual glue image is a set composed of a plurality of pixel points; Obtain multiple plane positioning coordinates of multiple pixel points in the residual glue image; Acquire the total number of pixel points in the residual glue image according to the multiple pixel points; The center plane position coordinates of the residual glue are calculated according to the multiple pixel points, the multiple plane positioning coordinates and the total pixel points, wherein the calculation formula is: ； C(x, y) is the center plane position coordinate of the residual glue, Xi is the coordinate value of the pixel point on the X axis, Ai is the pixel point on the X axis, yi is the coordinate value of the pixel point on the Y axis, Bi is the pixel point on the Y axis, M is the total pixel points in the residual glue image, where i is the number of multiple residual glue points, i=1, 2, 3...n; The center plane position coordinates of the residual glue are defined as plane focus position information; The first cleaning module is used for the laser transmitter to generate a cleaning laser according to the operating parameters of the beam focusing operation, and to perform directionally cleaning of residual glue in the NPTH hole of the circuit board according to the cleaning laser.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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