A method and device for adjusting the height of a cutting knife of a dicing saw and a dicing saw

Abstract

The application provides a cutting knife height adjustment method and device for a dicing machine and the dicing machine, wherein the method comprises: acquiring a target image; the target image comprises images corresponding to two film marks respectively, which are formed by the cutting knives located on both sides of a chip and point cutting on the adhesive film according to a preset height; obtaining detection length values corresponding to the two film marks respectively according to the analysis of the target image; determining a predicted length value of a target film mark according to a preset ratio and the detection length values corresponding to the two film marks respectively; the target film mark is a film mark formed by the cutting knives on the adhesive film at the highest position, and the depth value of the film mark is less than the thickness value of the adhesive film; obtaining a height adjustment value corresponding to the cutting knife according to the predicted length value, the preset height and the radius of the cutting knife, so as to adjust the height of the cutting knife by the height adjustment value. The application can improve the height adjustment efficiency and cutting precision of the cutting knife.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of dicing saw, in particular to a cutting knife height adjusting method and device for a dicing saw and the dicing saw. BACKGROUND

[0002] During the working of the dicing saw, the chip needs to be cut by the cutting knife, so that the height of the cutting knife needs to be adjusted during the dicing process of the dicing saw.

[0003] In the prior art, the height of the cutting knife of the dicing saw is generally manually adjusted by experience or adjusted by detecting the width of the film mark. Among them, manually adjusting the height of the cutting knife not only requires the operator to have rich experience, but also the efficiency of manually adjusting the height of the cutting knife is very low; and adjusting the height of the cutting knife by the width of the film mark is easily affected by the outside world, such as the unstable width of the film mark caused by the vibration of the main shaft of the dicing saw during the cutting process, thereby the accuracy and stability of the height adjustment of the cutting knife will be poor. SUMMARY

[0004] The present application provides a cutting knife height adjusting method and device for a dicing saw and the dicing saw, which can improve the height adjustment efficiency and cutting accuracy of the cutting knife.

[0005] In a first aspect, a cutting knife height adjusting method for a dicing saw is provided, comprising:

[0006] obtaining a target image; the target image includes images corresponding to two film marks respectively cut by the cutting knives located on both sides of the chip on the adhesive film according to a preset height;

[0007] According to the analysis of the target image, the detection length values of the two film marks are obtained respectively;

[0008] According to the preset ratio and the detection length values of the two film marks respectively, the predicted length value of the target film mark is determined; the target film mark is a film mark cut by the cutting knife on the adhesive film at the highest position, and the depth value of the film mark is less than the thickness value of the adhesive film;

[0009] According to the predicted length value, the preset height and the radius of the cutting knife, the height adjustment value corresponding to the cutting knife is obtained to adjust the height of the cutting knife by the height adjustment value.

[0010] Optionally, it further comprises:

[0011] controlling the cutting knives located on both sides of the chip to perform point cutting on the adhesive film according to the preset height, so that the adhesive films located on both sides of the chip are respectively cut to form film marks;

[0012] The image acquisition module is controlled to sequentially acquire images of local areas of the film mark to obtain a plurality of local film mark images.

[0013] The plurality of local film mark images are spliced to obtain a target image with a complete film mark.

[0014] Optionally, the image acquisition module is controlled to sequentially acquire images of local areas of the film mark along a preset path to obtain a plurality of local film mark images, including:

[0015] The area of the film mark on the adhesive film along the length direction of the film mark is divided into a plurality of shooting areas;

[0016] The image acquisition module is controlled to sequentially move into each shooting area to acquire images of local areas of the film mark to obtain local film mark images corresponding to each shooting area respectively; wherein, when the image acquisition module acquires images of local areas of the film mark, the distance between the image acquisition module and the adhesive film is the same.

[0017] Optionally, according to the analysis of the target image, a detection length value of the film mark is obtained, including:

[0018] A corresponding area of the film mark in the target image is determined;

[0019] According to the pixel point coordinates corresponding to both ends of the corresponding area of the film mark, the number of pixels between both ends of the corresponding area of the film mark is determined;

[0020] According to the number of pixels between both ends of the corresponding area of the film mark and the size corresponding to the pixels, a detection length value of the film mark is obtained.

[0021] Optionally, according to the preset proportion and the detection length values corresponding to the two film marks, a predicted length value of the target film mark is determined, including:

[0022] According to the preset proportion and the detection length values corresponding to the two film marks, a preset threshold value corresponding to each of the two film marks is determined;

[0023] According to the product of the detection length values corresponding to the two film marks and the preset threshold value, a predicted length value of the target film mark is determined.

[0024] Optionally, according to the predicted length value, the preset height and the radius of the cutting knife, a height adjustment value corresponding to the cutting knife is obtained to adjust the height of the cutting knife by the height adjustment value, including:

[0025] According to the predicted length value and the radius of the cutting knife, the distance between the center point of the cutting knife and the adhesive film is obtained;

[0026] According to the radius of the cutting knife and the distance between the center point of the cutting knife and the adhesive film, a predicted depth of the film mark is obtained.

[0027] determine a target depth of the film mark according to the preset height and a radius of the cutting knife;

[0028] determine the height adjustment value corresponding to the cutting knife according to the predicted depth and the target depth.

[0029] Optionally, the height adjustment value corresponding to the cutting knife is obtained according to the predicted length value, the preset height and the radius of the cutting knife, so as to adjust the height of the cutting knife by the height adjustment value, including:

[0030] determine whether the height adjustment value is greater than a preset adjustment threshold value;

[0031] If the height adjustment value is greater than the preset adjustment threshold value, control the cutting knives located on both sides of the chip to point-cut two film marks on the adhesive film according to a new preset height, and repeat the steps of obtaining the target image to determining the height adjustment value corresponding to the cutting knife until the height adjustment value is less than the preset adjustment threshold value; the new preset height is the height of the cutting knife after the height adjustment.

[0032] In a second aspect, a cutting knife height adjustment device for a dicing machine is provided, including:

[0033] an obtaining module configured to obtain a target image; the target image includes images corresponding to two film marks respectively, which are point-cut on an adhesive film by cutting knives located on both sides of a chip according to a preset height;

[0034] a film mark analysis module configured to obtain detection length values corresponding to the two film marks respectively according to analysis of the target image;

[0035] a predicted length value calculation module configured to determine a predicted length value of a target film mark according to a preset ratio and the detection length values corresponding to the two film marks respectively; the target film mark is a film mark point-cut by the cutting knife on the adhesive film at the highest position, and the depth value of the film mark is less than the thickness value of the adhesive film;

[0036] a height adjustment value calculation module configured to obtain a height adjustment value corresponding to the cutting knife according to the predicted length value, the preset height and the radius of the cutting knife, so as to adjust the height of the cutting knife by the height adjustment value.

[0037] In a third aspect, a dicing machine is provided, including a processor and a memory for storing a computer program, the processor being configured to call and run the computer program stored in the memory to execute the method in the first aspect or the implementation manners thereof.

[0038] In a fourth aspect, a computer readable storage medium is provided for storing a computer program, the computer program enabling a computer to execute the method in the first aspect or the implementation manners thereof.

[0039] By the technical scheme provided in the application, the detection length values respectively corresponding to the two film traces cut out by the cutting knives located on two sides of the chip on the adhesive film according to the preset height are obtained by analyzing the target image, and then the prediction length value of the target film trace is determined according to the preset proportion and the detection length values respectively corresponding to the two film traces, so that the cutting knives can complete the cutting of the chip by the depth value corresponding to the prediction length value; finally, the height adjustment value corresponding to the cutting knives is obtained according to the prediction length value, the preset height and the radius of the cutting knives, so that the cutting knives can be adjusted in height by the height adjustment value, and the height adjustment efficiency and the cutting precision of the cutting knives are improved. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0041] Figure 1 An application scenario diagram of an embodiment provided by the present application;

[0042] Figure 2 A flowchart of a cutting knife height adjustment method for a chip ruling machine according to an embodiment provided by the present application;

[0043] Figure 3 A top view of an adhesive film on which film traces are cut according to an embodiment provided by the present application;

[0044] Figure 4 A front view of an adhesive film on which film traces are cut according to an embodiment provided by the present application;

[0045] Figure 5 A splicing schematic diagram of a partial film trace image according to an embodiment provided by the present application;

[0046] Figure 6 A schematic diagram of a spliced target image according to an embodiment provided by the present application;

[0047] Figure 7 A schematic diagram of the position relationship between a target film trace and a cutting knife according to an embodiment provided by the present application;

[0048] Figure 8 A schematic diagram of a cutting knife height adjustment device for a chip ruling machine according to an embodiment provided by the present application;

[0049] Figure 9 A schematic block diagram of a chip ruling machine according to an embodiment provided by the present application. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0051] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0052] As mentioned above, in existing technologies, the height of the dicing machine's cutting blade is typically adjusted manually based on experience, or by detecting the width of the cut mark (the mark left by the cutting blade on the film) using image analysis. Manually adjusting the cutting blade height requires highly skilled and experienced operators, and is also inefficient. Adjusting the cutting blade height based on the cut mark width is influenced by many factors. After the film is vacuum-adsorbed onto the worktable, it has a certain tension. Therefore, vibrations from the dicing machine's spindle during the cutting process can affect the width of the cut mark, causing instability and consequently reducing the accuracy and stability of the cutting blade height adjustment.

[0053] To address the aforementioned technical problems, the inventive concept of this application is as follows: A dicing machine can analyze a target image to obtain the detection length values ​​corresponding to the two film marks made by the dicing blades on both sides of the chip at a preset height on the adhesive film. Then, based on a preset ratio and the detection length values ​​corresponding to the two film marks, a predicted length value for the target film mark is determined, enabling the dicing blades to cut the chip through a depth value corresponding to the predicted length value. Finally, based on the predicted length value, the preset height, and the radius of the dicing blades, a height adjustment value corresponding to the dicing blades is obtained, allowing the dicing blades to be adjusted in height. This improves the efficiency of dicing blade height adjustment and the cutting accuracy.

[0054] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to:

[0055] In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include a dicing machine 110 and a network device 120. The dicing machine 110 can establish a connection with the network device 120 via a wired network or a wireless network.

[0056] For example, the dicing machine 110 can send a request message to the network device 120, which can be used to acquire a target image. Furthermore, the dicing machine 110 can receive a response message sent by the network device 120, which includes acquiring the target image.

[0057] also, Figure 1 An electronic device and a network device are given as examples, but in practice, other numbers of electronic devices and network devices may be included, and this application does not limit this.

[0058] In other possible implementations, the technical solution of this application can also be executed by the dicing machine 110, or by the network device 120, and this application does not limit this.

[0059] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below:

[0060] Figure 2 A flowchart illustrating a method for adjusting the cutting blade height of a dicing machine, provided in this application embodiment, is available. This method can be performed by, for example... Figure 1 The dicing machine 110 shown performs the operation, but is not limited to this. For example... Figure 2 As shown, the method may include the following steps:

[0061] S210. Obtain the target image.

[0062] Here, the target image includes the images corresponding to the two film marks made by the dicing blades located on both sides of the chip at a preset height on the adhesive film.

[0063] like Figure 3 and Figure 4 As shown, the adhesive film is located on the worktable of the dicing machine, the chip is located above the adhesive film, and two dicing blades are located on opposite sides of the chip; the dicing blades are circular blade wheels.

[0064] It should be noted that the preset height of the cutting knife can be determined according to the target depth, for example, if the target depth is 1 / 3 to 1 / 4 of the thickness of the adhesive film, the preset height of the cutting knife is determined as the height at which the cutting knife can point-cut a depth of 2 / 3 to 3 / 4 of the thickness of the adhesive film on the adhesive film.

[0065] S220, according to the analysis of the target image, the detection length value corresponding to each of the two film marks is obtained.

[0066] Although controlling the cutting knife to point-cut on the adhesive film according to the preset height can obtain a theoretical film mark length value, and the theoretical film mark length value here is an ideal value obtained on the basis that the adhesive film is parallel to the horizontal plane, there is a certain precision difference between the actual level and the plane of the workbench, that is, there is a certain angle between the workbench and the horizontal plane. Since the position of the adhesive film relative to the workbench remains unchanged when the cutting knife point-cuts the adhesive film, and there is a certain angle between the adhesive film and the horizontal plane, there is also a certain difference between the film mark length obtained by controlling the cutting knife to point-cut on the adhesive film according to the preset height and the theoretical film mark length. Therefore, by analyzing the target image, the detection length value corresponding to each of the two film marks is obtained, that is, the actual film mark length value corresponding to each of the two film marks is obtained, so that the height of the cutting knife can be adjusted according to the actual film mark length value in the subsequent steps.

[0067] S230, according to the preset ratio and the detection length value corresponding to each of the two film marks, the predicted length value of the target film mark is determined.

[0068] Here, the target film mark is a film mark with a depth value less than the thickness of the adhesive film, which is point-cut by the cutting knife on the adhesive film at the highest position.

[0069] It should be noted that the staff can choose to cut or half-cut the chip by controlling the cutting knife, and the cutting depth value corresponding to the cutting of the chip corresponds to the cutting depth value corresponding to the half-cutting of the chip. Therefore, according to the depth value selection of the staff for the target film mark, it can be determined whether the chip is cut or half-cut.

[0070] In addition, there is a certain precision difference between the actual level and the plane of the workbench of the scriber, and the distance between the cutting knives on both sides of the chip and the adhesive film also has a certain difference, so the film mark length cut by the cutting knives on both sides of the chip also has a certain difference. Therefore, in order to cut the entire chip, the point-cutting of the cutting knives on the highest position and the lowest position of the adhesive film needs to be analyzed, so that the cutting knife needs to point-cut a film mark with a depth value less than the thickness of the adhesive film on the adhesive film at the highest position, thereby avoiding the adhesive film being cut by the cutting knife.

[0071] For example, the film marks cut by the cutting knives located on the left side of the chip are 10 mm respectively, and the film marks cut by the cutting knives located on the right side of the chip are 8 mm respectively. It can be seen that the height of the adhesive film located on the left side of the chip is greater than the height of the adhesive film located on the right side of the chip. At this time, if the preset ratio set by the worker is 7:3, the worker selects the cutting form of the chip as half-cutting, and the target film mark is a film mark with a cutting depth value less than the thickness value of the adhesive film, the prediction length value of the target film mark can be determined as 9.4 mm through 10*0.7+8*0.3=9.4 mm. Here, the preset ratio is determined by the worker according to experience.

[0072] In S240, a height adjustment value corresponding to the cutting knife is obtained according to the prediction length value, the preset height and the radius of the cutting knife, so that the height of the cutting knife is adjusted by the height adjustment value.

[0073] It should be noted that the distance between the cutting knife and the target film mark can be calculated through the prediction length value of the target film mark and the radius of the cutting knife, and the height adjustment value corresponding to the cutting knife can be obtained according to the distance between the cutting knife and the target film mark and the preset height, so that the height of the cutting knife can be adjusted by the height adjustment value.

[0074] In the embodiment, by analyzing the target image, the detection length values of the two film marks respectively corresponding to the two cutting knives located on the two sides of the chip are obtained, the prediction length value of the target film mark is determined according to the preset ratio and the detection length values of the two film marks, so that the cutting knife can complete the cutting of the chip by the depth value corresponding to the prediction length value; finally, the height adjustment value corresponding to the cutting knife is obtained according to the prediction length value, the preset height and the radius of the cutting knife, so that the height of the cutting knife is adjusted by the height adjustment value, and the height adjustment efficiency and the cutting precision of the cutting knife are improved.

[0075] In some possible implementation examples, the cutting knife height adjustment method for the dicing machine further includes:

[0076] In S310, the cutting knives located on the two sides of the chip are controlled to perform point cutting on the adhesive film according to the preset height, so that the adhesive films located on the two sides of the chip are respectively cut to form film marks.

[0077] In S320, the image acquisition module is controlled to sequentially perform image acquisition on the local regions of the film marks, and a plurality of local film mark images are obtained.

[0078] Here, the image acquisition module can be an industrial camera that can move above the adhesive film, and the distance between the industrial camera and the adhesive film is the same when the industrial camera performs image acquisition on the local regions of the film marks.

[0079] The local area of the film mark is sequentially imaged by the image acquisition module, and each local area of the film mark can correspond to a local film mark image, so that the multiple local film mark images obtained in this step can be spliced to obtain a complete film mark with the same actual length value as the film mark, thereby facilitating the determination of the detection length value of the film mark.

[0080] S330, splicing multiple local film mark images to obtain a target image with a complete film mark.

[0081] It should be noted that when splicing multiple local film mark images, the multiple local film mark images are spliced according to the shooting positions of the image acquisition modules corresponding to the local film mark images, so that the film mark in the target image corresponds to the actual film mark.

[0082] In this embodiment, by controlling the image acquisition module to sequentially image the local area of the film mark, multiple local film mark images are obtained, and then by splicing the multiple local film mark images, a target image with a complete film mark is obtained, so that the film mark in the target image can completely restore the shape and size of the film mark on the adhesive film, thereby facilitating the accurate calculation of the detection length value of the film mark in the subsequent steps.

[0083] Further, controlling the image acquisition module to sequentially image the local area of the film mark to obtain multiple local film mark images can include the following steps:

[0084] S410, dividing the area of the film mark on the adhesive film into multiple shooting areas along the length direction of the film mark.

[0085] Here, the area of the film mark on the adhesive film is divided into multiple shooting areas with the same area, so that the size of the local film mark image acquired by the image acquisition module in each shooting area is the same, thereby facilitating the splicing of multiple local film mark images.

[0086] S420, controlling the image acquisition module to sequentially move into each shooting area to image the local area of the film mark, and obtaining a local film mark image corresponding to each shooting area.

[0087] Wherein, when the image acquisition module images the local area of the film mark, the distance between the image acquisition module and the adhesive film is the same.

[0088] The image acquisition module is sequentially placed in each shooting area from the left side, and pictures one, two, three and four corresponding to each shooting area are obtained, as shown in Figure 5As shown, when the four pictures are spliced, the pictures are spliced according to the shooting positions corresponding to the pictures. In the moving process, the distance between the image acquisition module and the adhesive film is kept the same, so that the widths of the local adhesive marks in the local adhesive mark images corresponding to the respective shooting areas correspond to each other, so that the size and shape of the complete adhesive mark spliced from the multiple local adhesive mark images are consistent with those of the actual adhesive mark.

[0089] In this embodiment, by dividing the area of the adhesive mark on the adhesive film into multiple shooting areas along the length direction of the adhesive mark, and then controlling the image acquisition module to move into each shooting area to acquire images of the local area of the adhesive mark, local adhesive mark images corresponding to the respective shooting areas are obtained. The multiple local adhesive mark images can be spliced smoothly, and the size of the adhesive mark spliced from the multiple local adhesive mark images is consistent with that of the actual adhesive mark, so that the detection length value of the adhesive mark obtained from the target image is more accurate.

[0090] In some possible implementation embodiments, obtaining the detection length value of the adhesive mark according to the analysis of the target image can include the following steps:

[0091] S510, determining the corresponding area of the adhesive mark in the target image.

[0092] As shown in the figure, the area presenting grayish white in the target image is the corresponding area of the adhesive film, and the area presenting black is the corresponding area of the adhesive mark. Therefore, it can be determined that the area presenting black is the corresponding area of the adhesive mark in the target image. Figure 6

[0093] S520, determining the number of pixels between the two ends of the corresponding area of the adhesive mark according to the pixel point coordinates corresponding to the two ends of the corresponding area of the adhesive mark.

[0094] Here, after the pixel point coordinates at the left and right ends of the adhesive mark are determined, the number of pixels between the two ends of the corresponding area of the adhesive mark can be calculated by subtracting the pixel point coordinate at the left end from the pixel point coordinate at the right end.

[0095] S530, obtaining the detection length value of the adhesive mark according to the number of pixels between the two ends of the corresponding area of the adhesive mark and the size corresponding to the pixels.

[0096] It should be noted that the local adhesive mark image acquired by the image acquisition module has the same size as the corresponding area of the adhesive mark on the adhesive film in each shooting area. Therefore, the detection length value of the adhesive mark can be accurately obtained by the number of pixels between the two ends of the corresponding area of the adhesive mark and the size corresponding to the pixels.

[0097] ​In the embodiment, after the corresponding area of the film mark in the target image is determined, the number of pixels between the two ends of the corresponding area of the film mark is determined according to the pixel coordinates corresponding to the two ends of the corresponding area of the film mark; finally, the detection length value of the film mark is obtained according to the number of pixels between the two ends of the corresponding area of the film mark and the size corresponding to the pixels.

[0098] In some possible implementation embodiments, determining the predicted length value of the target film mark according to the preset ratio and the detection length values corresponding to the two film marks can include the following steps:

[0099] S610, determining the preset threshold value corresponding to each of the two film marks according to the preset ratio and the detection length values corresponding to the two film marks.

[0100] Here, the sum of the preset threshold values corresponding to the two film marks is 1.

[0101] It should be noted that before the preset threshold values corresponding to the two film marks are determined, the height relationship between the two film marks is determined according to the detection length values of the two film marks, for example, the length value of the film mark 1 is 10 mm, and the length value of the film mark 2 is 8 mm, it can be determined that the height of the film mark 1 is greater than the height of the film mark 2, and the preset threshold value corresponding to the film mark 1 is selected as the larger preset threshold value, and the preset threshold value corresponding to the film mark 2 is selected as the smaller preset threshold value, when the preset ratio is 7:3, the preset threshold value corresponding to the film mark 1 is 0.7, and the preset threshold value corresponding to the film mark 2 is 0.3.

[0102] S620, determining the predicted length value of the target film mark according to the product of the detection length values corresponding to the two film marks and the preset threshold values.

[0103] For example, the length value of the film mark 1 is 10 mm, the length value of the film mark 2 is 8 mm, the preset threshold value corresponding to the film mark 1 is 0.7, and the preset threshold value corresponding to the film mark 2 is 0.3, then the predicted length value of the target film mark is 9.4 mm.

[0104] In the embodiment, by determining the preset threshold value corresponding to each of the two film marks according to the preset ratio and the detection length values corresponding to the two film marks, and then determining the predicted length value of the target film mark according to the product of the detection length values corresponding to the two film marks and the preset threshold values, the height of the target film mark cut at any position point of the adhesive film according to the predicted length value of the target film mark is less than the thickness value of the adhesive film, and then the cutting knife adjusted by the height adjustment value determined according to the predicted length value of the target film mark can cut the chip.

[0105] In some possible implementation embodiments, the height adjustment value corresponding to the cutting knife is obtained according to the predicted length value, the preset height, and the radius of the cutting knife, and the cutting knife is adjusted in height by the height adjustment value, which can include the following steps:

[0106] S710, obtaining the distance between the center point of the cutting knife and the adhesive film according to the predicted length value and the radius of the cutting knife.

[0107] It should be noted that since there is a certain precision difference between the actual levelness of the workbench of the scribe machine and the plane, and the precision difference is very small, in this step, the plane where the upper surface of the target film mark is located is regarded as parallel to the horizontal plane.

[0108] As shown in Figure 7 , the distance (D) between the center point of the cutting knife and the adhesive film can be calculated by using the Pythagorean theorem on half of the predicted length value (L / 2) and the radius (R) of the cutting knife.

[0109] S720, obtaining the predicted depth of the film mark according to the radius of the cutting knife and the distance between the center point of the cutting knife and the adhesive film.

[0110] S730, determining the target depth of the film mark according to the preset height and the radius of the cutting knife.

[0111] Since the target depth of the film mark can be calculated according to the difference between the radius of the cutting knife and the preset height.

[0112] S740, determining the height adjustment value corresponding to the cutting knife according to the predicted depth and the target depth.

[0113] Here, the height adjustment value corresponding to the cutting knife is determined by calculating the difference between the predicted depth and the target depth.

[0114] In this embodiment, the distance between the center point of the cutting knife and the adhesive film is obtained according to the predicted length value and the radius of the cutting knife; the predicted depth of the film mark is obtained according to the radius of the cutting knife and the distance between the center point of the cutting knife and the adhesive film; the target depth of the film mark is determined according to the preset height and the radius of the cutting knife; and finally, the height adjustment value that can make the adjustment accuracy of the cutting knife higher is obtained according to the predicted depth and the target depth.

[0115] In some possible implementation embodiments, obtaining the height adjustment value corresponding to the cutting knife according to the predicted length value, the preset height and the radius of the cutting knife, so as to adjust the height of the cutting knife by the height adjustment value, can include the following steps:

[0116] S810, determining whether the height adjustment value is greater than a preset adjustment threshold.

[0117] Here, if the height adjustment value is greater than the preset adjustment threshold, it can be considered that the difference between the actual height of the cutting knife and the preset height is large, and therefore, the height of the cutting knife needs to be adjusted multiple times to complete more accurate height adjustment of the cutting knife.

[0118] S820, if the height adjustment value is greater than the preset adjustment threshold, controlling the cutting knives located on both sides of the chip to point-cut two film marks on the adhesive film according to a new preset height, and repeating the steps of acquiring the target image to determining the height adjustment value corresponding to the cutting knife until the height adjustment value is less than the preset adjustment threshold; the new preset height is the height of the cutting knife after height adjustment.

[0119] In the embodiment, by judging whether the height adjustment value is greater than the preset adjustment threshold, and when the height adjustment value is greater than the preset adjustment threshold, controlling the cutting knives located on both sides of the chip to point-cut two film marks on the adhesive film according to a new preset height, and repeating the steps S210 to S240 until the height adjustment value is less than the preset adjustment threshold, the more accurate height adjustment of the cutting knife can be completed.

[0120] Figure 8 is a schematic diagram of a cutting knife height adjustment device 900 for a dicing machine according to an embodiment of the present application. As shown in Figure 8 , the device 900 includes:

[0121] The acquisition module 910 is configured to acquire a target image; the target image includes images corresponding to two film marks respectively, which are point-cut on the adhesive film by the cutting knives located on both sides of the chip according to a preset height.

[0122] The film mark analysis module 920 is configured to obtain detection length values corresponding to the two film marks respectively according to analysis of the target image.

[0123] The predicted length value calculation module 930 is configured to determine a predicted length value of the film mark according to a preset ratio and the detection length values corresponding to the two film marks respectively; the target film mark is a film mark point-cut by the cutting knife on the adhesive film at the highest position, and the depth value of the film mark is less than the thickness value of the adhesive film.

[0124] The height adjustment value calculation module 940 is configured to obtain a height adjustment value corresponding to the cutting knife according to the predicted length value, the preset height and the radius of the cutting knife, so as to adjust the height of the cutting knife by the height adjustment value.

[0125] In some implementable manners, the device 900 includes:

[0126] The point-cut control module is configured to control the cutting knives located on both sides of the chip to point-cut on the adhesive film according to the preset height, so that the adhesive films located on both sides of the chip are respectively cut to form film marks.

[0127] The image acquisition control module is configured to control the image acquisition module to sequentially acquire images of local regions of the film marks, so as to obtain a plurality of local film mark images.

[0128] An image splicing module is configured to splice a plurality of local film mark images to obtain a target image with a complete film mark.

[0129] In some implementations, the image acquisition control module includes:

[0130] A shooting area division unit is configured to divide the area of the film mark on the adhesive film into a plurality of shooting areas along the length direction of the film mark.

[0131] A shooting unit is configured to control the image acquisition module to move into each shooting area in sequence to acquire images of the local area of the film mark, and obtain a local film mark image corresponding to each shooting area; wherein the distance between the image acquisition module and the adhesive film is the same when the image acquisition module acquires images of the local area of the film mark.

[0132] In some implementations, the film mark analysis module 920 includes:

[0133] A region determination unit is configured to determine the corresponding region of the film mark in the target image.

[0134] A pixel number determination unit is configured to determine the number of pixels between the two ends of the corresponding region of the film mark according to the pixel coordinates corresponding to the two ends of the corresponding region of the film mark.

[0135] A detection length value determination unit is configured to obtain the detection length value of the film mark according to the number of pixels between the two ends of the corresponding region of the film mark and the size corresponding to the pixels.

[0136] In some implementations, the predicted length value calculation module 930 includes:

[0137] A preset threshold determination unit is configured to determine the preset threshold corresponding to each of the two film marks according to the preset ratio and the detection length value corresponding to each of the two film marks.

[0138] A predicted length value determination unit is configured to determine the predicted length value of the target film mark according to the product of the detection length value corresponding to each of the two film marks and the preset threshold.

[0139] In some implementations, the height adjustment value calculation module 940 includes:

[0140] A distance determination unit is configured to obtain the distance between the center point of the cutting knife and the adhesive film according to the predicted length value and the radius of the cutting knife.

[0141] A predicted depth determination unit is configured to obtain the predicted depth of the film mark according to the radius of the cutting knife and the distance between the center point of the cutting knife and the adhesive film.

[0142] A target depth determination unit is configured to determine the target depth of the film mark according to the preset height and the radius of the cutting knife.

[0143] a height adjustment value determination unit configured to determine a height adjustment value corresponding to the cutting knife according to the predicted depth and the target depth.

[0144] In some implementable manners, the height adjustment value calculation module 940 comprises:

[0145] a judgment unit configured to judge whether the height adjustment value is greater than a preset adjustment threshold value;

[0146] a repeated execution unit configured to, if the height adjustment value is greater than the preset adjustment threshold value, control the cutting knives located at two sides of the chip to point-cut two film traces on the adhesive film according to a new preset height of the cutting knives, and repeatedly execute the steps of acquiring the target image to determining the height adjustment value corresponding to the cutting knife until the height adjustment value is less than the preset adjustment threshold value; the new preset height is the height of the cutting knife after height adjustment.

[0147] It should be understood that the device embodiment and the cutting knife height adjustment method embodiment for the dicing saw can correspond to each other, and similar descriptions can be referred to the cutting knife height adjustment method embodiment for the dicing saw. To avoid repetition, details are not described here. Specifically, Figure 8 The device 900 shown can execute the above-mentioned cutting knife height adjustment method embodiment for the dicing saw, and the aforementioned and other operations and / or functions of each module in the device 900 are respectively to realize the corresponding processes in the above-mentioned cutting knife height adjustment method for the dicing saw. To be brief, details are not described here.

[0148] The device 900 of the embodiment of the application is described above in the functional module aspect. It should be understood that the functional module can be realized by hardware, or by instructions in the form of software, or by a combination of hardware and software modules. Specifically, each step of the cutting knife height adjustment method embodiment for the dicing saw in the embodiment of the application can be completed by the integrated logic circuit of hardware and / or instructions in the form of software in the processor. The steps of the cutting knife height adjustment method for the dicing saw disclosed in the embodiment of the application can be directly embodied as hardware decoding processor execution completion, or executed by a combination of hardware and software modules in the decoding processor. Alternatively, the software module can be located in a mature storage medium in the field, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, register, etc. The storage medium is located in the memory, and the processor reads the information in the memory, and combines the hardware to complete the steps in the above-mentioned cutting knife height adjustment method embodiment for the dicing saw.

[0149] Figure 9 is a schematic block diagram of a dicing saw 110 of one embodiment provided by the application.

[0150] AsFigure 9 As shown, the dicing machine 110 can include:

[0151] The memory 1101 is configured to store a computer program and transmit the program code to the processor 1102. In other words, the processor 1102 can call and run the computer program from the memory 1101 to implement the method in the embodiments of the present application.

[0152] For example, the processor 1102 can be configured to execute the above-mentioned method embodiments according to the instructions in the computer program.

[0153] In some embodiments of the present application, the dicing machine 110 can include but is not limited to:

[0154] General processor, digital signal processor (DSP), application specific integrated circuit (ASIC), field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, etc.

[0155] In some embodiments of the present application, the memory 1101 includes but is not limited to:

[0156] Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0157] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0158] like Figure 4 As shown, the dicing machine 110 may further include:

[0159] Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0160] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0161] It should be understood that the various components within the electronic device are connected by a bus system, which includes, in addition to a data bus, a power bus, a control bus, and a state signal bus.

[0162] The present application also provides a computer storage medium, which stores a computer program, and the computer program enables a computer to execute the method of the above-mentioned method embodiment when executed by the computer. Alternatively, one embodiment of the present application also provides a computer program product containing instructions, and the instructions enable a computer to execute the method of the above-mentioned method embodiment when executed by the computer.

[0163] When implemented by using software, the computer program product can be implemented in the form of a computer program product in whole or in part. The computer program product includes one or more computer instructions. When loaded and executed by a computer, the computer program instructions produce the flow or function of the embodiment of the present application in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions can be transferred from one website, computer, server or data center to another website, computer, server or data center through wired (for example, coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (for example, infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. integrated with one or more available media. The available medium can be a magnetic medium (for example, floppy disk, hard disk, magnetic tape), an optical medium (for example, digital video disc (DVD)), or a semiconductor medium (for example, solid state disk (SSD)) and the like.

[0164] Those skilled in the art can realize that the modules and algorithm steps of the examples described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized by hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0165] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. For example, the division of the above-described device embodiments is merely a logical function division, and there can be another division manner for the actual implementation, for example, multiple devices or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different parts can be indirect couplings or communication connections through some interfaces, devices or modules, and can be in electrical, mechanical or other forms.

[0166] The modules described as separated parts can or can not be physically separated, and the parts shown as modules can or can not be physical modules, i.e., can be located in one place, or can be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purposes of the embodiments. For example, the functional modules in the embodiments of the present application can be integrated in one processing module, or can be physically separated, or two or more modules can be integrated in one module.

[0167] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for adjusting the height of a cutting blade in a dicing machine, characterized in that, include: Acquire the target image; the target image includes the images corresponding to the two film marks made by the dicing blades located on both sides of the chip at a preset height on the adhesive film; Based on the analysis of the target image, the detection length values ​​corresponding to the two membrane marks are obtained; Based on the preset ratio and the detection length values ​​corresponding to the two membrane marks, the predicted length value of the target membrane mark is determined; the target membrane mark is the membrane mark where the cutting depth of the cutting blade at the highest position of the adhesive film point is less than the thickness value of the adhesive film. Based on the predicted length value, the preset height, and the radius of the cutting blade, a height adjustment value corresponding to the cutting blade is obtained, so as to adjust the height of the cutting blade according to the height adjustment value; The step of determining the predicted length value of the target membrane scar based on a preset ratio and the detection length values ​​corresponding to the two membrane scars includes: Based on the preset ratio and the detection length values ​​corresponding to each of the two membrane marks, a preset threshold corresponding to each of the two membrane marks is determined; wherein, the sum of the preset thresholds corresponding to each of the two membrane marks is 1; before determining the preset thresholds corresponding to each of the two membrane marks, the height relationship between the two membrane marks is determined based on the detection length values ​​of the two membrane marks, the preset threshold corresponding to the membrane mark with the larger height is selected as the larger preset threshold, the preset threshold corresponding to the membrane mark with the smaller height is selected as the smaller preset threshold, and the preset threshold ratio is equal to the preset ratio; The predicted length value of the target membrane mark is determined by multiplying the detection length values ​​corresponding to the two membrane marks and a preset threshold; wherein the predicted length value of the target membrane mark is equal to the sum of the products of the detection length values ​​corresponding to the two membrane marks and the preset threshold.

2. The method according to claim 1, characterized in that, Also includes: The cutting blades located on both sides of the chip are controlled to make spot cuts on the adhesive film at a preset height, so that the adhesive film on both sides of the chip is cut with film marks respectively. The image acquisition module is controlled to sequentially acquire images of local areas of the membrane scar, thereby obtaining multiple local images of the membrane scar; Multiple images of the local membrane scar are stitched together to obtain a target image with the complete membrane scar.

3. The method according to claim 2, characterized in that, The image acquisition module sequentially acquires images of local areas of the membrane scar, obtaining multiple local images of the membrane scar, including: The area of ​​the film trace on the adhesive film is divided into multiple shooting areas along the length direction of the film trace; The image acquisition module is controlled to move sequentially to each of the shooting areas to acquire images of local areas of the membrane scar, thereby obtaining local membrane scar images corresponding to each of the shooting areas; wherein, when the image acquisition module acquires images of local areas of the membrane scar, the distance between the image acquisition module and the adhesive film is always the same.

4. The method according to claim 1, characterized in that, The step of obtaining the detection length value of the membrane scar based on the analysis of the target image includes: Determine the corresponding region of the membrane scar in the target image; The number of pixels between the two ends of the corresponding region of the membrane scar is determined based on the pixel coordinates at each end of the corresponding region of the membrane scar. The detection length value of the membrane scar is obtained based on the number of pixels between the two ends of the corresponding region of the membrane scar and the size of the corresponding pixels.

5. The method according to claim 1, characterized in that, The step of obtaining a height adjustment value for the cutting blade based on the predicted length value, the preset height, and the radius of the cutting blade, and adjusting the height of the cutting blade using the height adjustment value, includes: Based on the predicted length value and the radius of the cutting blade, the distance between the center point of the cutting blade and the adhesive film is obtained; The predicted depth of the film mark is obtained based on the radius of the cutting blade and the distance between the center point of the cutting blade and the adhesive film. The target depth of the membrane mark is determined based on the preset height and the radius of the cutting blade; Based on the predicted depth and the target depth, the height adjustment value corresponding to the cutting blade is determined.

6. The method according to claim 1, characterized in that, The step of obtaining a height adjustment value for the cutting blade based on the predicted length value, the preset height, and the radius of the cutting blade, and adjusting the height of the cutting blade using the height adjustment value, includes: Determine whether the height adjustment value is greater than a preset adjustment threshold; If the height adjustment value is greater than the preset adjustment threshold, the cutting blades located on both sides of the chip are controlled to make two film marks on the adhesive film at a new preset height, and the steps of acquiring the target image and determining the height adjustment value corresponding to the cutting blade are repeated until the height adjustment value is less than the preset adjustment threshold; the new preset height is the height of the cutting blade after height adjustment.

7. A cutting blade height adjustment device for a dicing machine, characterized in that, include: An acquisition module is used to acquire a target image; the target image includes images corresponding to two film marks made by dicing blades located on both sides of the chip at a preset height on the adhesive film. The membrane scar analysis module is used to obtain the detection length values ​​corresponding to the two membrane scars based on the analysis of the target image. The predicted length value calculation module is used to determine the predicted length value of the target membrane mark based on a preset ratio and the detection length values ​​corresponding to the two membrane marks respectively; the target membrane mark is the membrane mark where the cutting depth of the cutting blade at the highest position of the adhesive film point is less than the thickness value of the adhesive film; The height adjustment value calculation module is used to obtain the height adjustment value corresponding to the cutting blade based on the predicted length value, the preset height and the radius of the cutting blade, so as to adjust the height of the cutting blade according to the height adjustment value; The predicted length value calculation module includes: A preset threshold determination unit is used to determine a preset threshold corresponding to each of the two membrane marks based on the preset ratio and the detection length values ​​corresponding to each of the two membrane marks; wherein the sum of the preset thresholds corresponding to each of the two membrane marks is 1; before determining the preset thresholds corresponding to each of the two membrane marks, the height relationship between the two membrane marks is determined based on the detection length values ​​of the two membrane marks, and the preset threshold corresponding to the membrane mark with the larger height is selected as the larger preset threshold, and the preset threshold corresponding to the membrane mark with the smaller height is selected as the smaller preset threshold, and the preset threshold ratio is equal to the preset ratio; The predicted length value determination unit is used to determine the predicted length value of the target membrane scar based on the product of the detection length values ​​corresponding to the two membrane scars and a preset threshold; wherein, the predicted length value of the target membrane scar is equal to the sum of the products of the detection length values ​​corresponding to the two membrane scars and the preset threshold.

8. A dicing machine, characterized in that, It includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the steps of the method according to any one of claims 1-6.

9. A storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the steps of the method described in any one of claims 1-6.

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