Antenna microsystem structure

Abstract

The application discloses an antenna microsystem structure, which comprises an antenna radiation structure, a circuit module and a feeding structure, the antenna radiation structure is internally provided with a mounting cavity, the circuit module is arranged in the mounting cavity, the feeding structure is led out from the circuit module to excite the antenna radiation structure, and the antenna radiation structure comprises a first radiator, a second radiator and an electric connecting piece, the first radiator and the second radiator are connected in communication through the electric connecting piece, the first radiator is arranged on the second radiator, and the mounting cavity is formed between the first radiator and the second radiator. Through the above arrangement, the antenna system structure can be highly integrated, and the problem of difficult heat dissipation caused by high integration can be solved simultaneously.

Description

Technical Field

[0001] This invention relates to the field of communications, and in particular to an antenna microsystem structure. Background Technology

[0002] As communication modules become increasingly miniaturized, the heat dissipation problem caused by circuit modules is becoming more and more serious. In traditional structures, circuit modules are often placed outside the antenna radiation structure. This is because in the radio frequency link, the antenna is responsible for transmitting and receiving electromagnetic waves and must be located on the outermost, unobstructed side of the system. However, the circuit module, as the main source of heat, is structurally located inside the system and cannot dissipate the heat it generates. The heat generated by the circuit module often requires the addition of heat sinks, which is detrimental to the high integration of the system structure. If the impact of heat is ignored, it may lead to a deterioration in system performance, and in severe cases, it may cause the system to malfunction. Therefore, how to ensure excellent heat dissipation while maintaining high integration has become a pressing contradiction that needs to be resolved. Summary of the Invention

[0003] The main objective of this invention is to propose an antenna microsystem structure that aims to solve the aforementioned technical problems.

[0004] To achieve the above objectives, the present invention proposes an antenna microsystem structure, comprising:

[0005] An antenna radiating structure, wherein a mounting cavity is provided within the antenna radiating structure;

[0006] The circuit module is disposed in the mounting cavity;

[0007] A power supply structure, which is led out from the circuit module, is provided to excite the antenna radiating structure.

[0008] In one embodiment, the antenna radiating structure includes a first radiator, a second radiator, and an electrical connector. The first radiator and the second radiator are connected in communication through the electrical connector. The first radiator is disposed on the second radiator, and the mounting cavity is formed between the first radiator and the second radiator.

[0009] In one embodiment, the second radiator is a metal structure on the side of the circuit module away from the first radiator.

[0010] In one embodiment, the first radiator has an extension edge around its periphery, the extension edge extending along the direction of the first radiator toward the circuit module, and the first radiator and the extension edge together form the mounting cavity.

[0011] In one embodiment, the antenna radiating structure is provided with heat dissipation holes, which are used to allow the mounting cavity to communicate with the external environment.

[0012] In one embodiment, a heat-conducting layer is provided inside the mounting cavity to allow the circuit module to be indirectly attached to the cavity wall.

[0013] In one embodiment, the electrical connector is disposed around the periphery of the circuit module, the bottom of the electrical connector is connected to the second radiator, and the top of the electrical connector abuts against the extension edge, so that the first radiator and the second radiator are electrically connected.

[0014] In one embodiment, a shielding metal structure is provided on the second radiator, and a wire is provided inside the shielding metal structure. The wire is connected to an external DC power supply to power the circuit module.

[0015] In one embodiment, the shielding metal structure is provided with SMA connectors on both sides. The SMA connector includes an outer conductor and an inner conductor. The outer conductor is insulated from the inner conductor and connected to the second radiator. The inner conductor is connected to the circuit module.

[0016] In one embodiment, the antenna radiating structure further includes a reflective ground plane disposed on the side of the second radiator away from the first radiator, the shielding metal structure disposed on the reflective ground plane, and the SMA connector passing through the reflective ground plane so that the reflective ground plane is connected to the second radiator through the outer conductor.

[0017] In one embodiment, the SMA connector protrudes from the reflector ground plane and supports the circuit module along with the shielding metal structure, thereby creating a gap between the circuit module and the reflector ground plane. The gap depends on the operating frequency of the antenna radiating structure and the dielectric material between the circuit module and the reflector ground plane.

[0018] In one embodiment, a nylon screw is provided on the circuit module, and a nylon nut is provided on the side of the reflective ground away from the second radiator, the nylon nut being used for threaded connection with the nylon screw.

[0019] In one embodiment, the circuit module includes a PCB board and an analog circuit, the analog circuit being disposed on the PCB board, and the circuit module further includes digital circuits and / or mixed-signal circuits.

[0020] The technical solution of this invention uses a first radiator and a second radiator to form an antenna radiation structure, and the circuit module is set between the first radiator and the second radiator. When the circuit module is put into use, the circuit module can dissipate heat to the outside through the first radiator and the second radiator as heat dissipation components. This arrangement allows the circuit module to be highly integrated with the antenna radiation structure, and can simultaneously solve the problem of heat dissipation difficulties caused by the high integration of the circuit module and the antenna radiation structure. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of an embodiment of the antenna radiation structure of the present invention;

[0023] Figure 2 This is a schematic diagram of an embodiment of the antenna radiation structure of the present invention after removing the reflective floor;

[0024] Figure 3 for Figure 2 A top-view schematic diagram of the antenna radiating structure after removing the reflector floor;

[0025] Figure 4 This is a schematic diagram of the antenna radiating structure of the present invention, including a reflective ground plane;

[0026] Figure 5 for Figure 4 A schematic diagram of the antenna radiation structure after removing the first radiator.

[0027] Figure 6 for Figure 4 A schematic diagram of the structure after removing the first radiator and the circuit module;

[0028] Figure 7 for Figure 4 Mid-top view of the structure;

[0029] Figure 8 This is a schematic diagram of the antenna radiation structure array of the present invention.

[0030] Explanation of reference numerals: 100, Antenna microsystem structure; 110, First radiator; 111, Cover plate body; 112, Extension edge; 120, Circuit module; 121, PCB board; 122, Filter; 123, RF switch; 124, Low-noise amplifier; 125, Power amplifier; 126, Electrical connector; 130, Second radiator; 140, Screw connector; 150, SMA connector; 160, Nylon screw; 161, Lead screw; 162, Nylon nut; 170, Feed structure; 180, Connection through hole; 190, Reflector ground plane; 191, Shielding metal structure; 192, Through hole; 200, Metal through hole.

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0034] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0035] An antenna microsystem structure includes an antenna radiating structure, a circuit module 120, and a feeding structure 170. The antenna radiating structure has a mounting cavity; the circuit module 120 is located in the mounting cavity; and the feeding structure 170 is led out from the circuit module 120 to excite the antenna radiating structure.

[0036] In this embodiment, as Figures 1 to 2 As shown, the antenna microsystem structure 100 includes an antenna radiating structure, a circuit module 120, and a feed structure 170. The antenna radiating structure has a mounting cavity, which can be a raised section in the middle of the antenna radiating structure with a hollowed-out periphery. This raised section can be detachably connected to the lower part of the antenna radiating structure or integrally formed. The circuit module 120 is detachably mounted within this mounting cavity. Since the middle part of the antenna radiating structure covers the circuit module 120, the antenna radiating structure provides shielding for the circuit module 120. The circuit module 120 has a feed structure 170 facing the antenna radiating structure, which is connected to the antenna radiating structure. 70 can be a metal probe. In other embodiments, the above-mentioned feeding structure 170 can be replaced by a coupled feeding method. When the circuit module 120 needs to emit radio frequency signals to the outside through the antenna radiating structure, the circuit module 120 transmits the signal to the antenna radiating structure through the feeding structure 170, and then radiates the signal to the outside through the antenna radiating structure. With this setting, the circuit module 120 and the antenna radiating structure can be highly integrated. When the circuit module 120 generates heat due to operation, the circuit module 120 can dissipate heat to the outside through the antenna radiating structure. Thus, after the circuit module 120 is highly integrated with the antenna radiating structure, it can still dissipate heat to the outside through the antenna radiating structure, thereby achieving a better performance.

[0037] For ease of explanation, this application will use a patch radiating antenna as an example to describe in detail the technical solutions of the embodiments of this application.

[0038] In one embodiment, such as Figures 1 to 2As shown, in this embodiment, the antenna radiation structure includes a radiator and a reflector ground 190. The radiator includes a first radiator 110, a second radiator 130, and an electrical connector 126. The first radiator 110 and the second radiator 130 are connected by the electrical connector 126. The first radiator 110 is disposed on the second radiator 130, and the mounting cavity is formed between the first radiator 110 and the second radiator 130. In this embodiment, the first radiator 110 is placed on top of the second radiator 130, with a gap between them. The mounting cavity refers to the gap between the first radiator 110 and the second radiator 130. Then, the circuit module 120 is installed between the first radiator 110 and the second radiator 130. When fixing the circuit module 120, it can be detachably installed with the first radiator 110 or with the second radiator 130. No further limitations are made here. In this embodiment, the second radiator 130, the circuit module 120, and the first radiator 110 are connected by a screw connector 140. The electrical connector 126 is used to electrically connect the first radiator 110 and the second radiator 130. The electrical connector can be implemented by conductor contact, metal welding, or other methods.

[0039] In one embodiment, such as Figures 1 to 2 As shown, the second radiator 130 is a metal structure on the side of the circuit module 120 away from the first radiator 110. In this embodiment, the metal structure is a metal coating provided on the side of the circuit module 120 away from the first radiator 110, and this metal coating is the aforementioned second radiator 130. In this embodiment, the metal coating provided on the circuit module 120 away from the first radiator 110 is both part of the circuit module 120 and part of the radiator. This metal coating can cooperate with the first radiator 110 to excite the circuit module 120 to radiate signals outward through the power supply structure 170, and can also provide zero potential for the circuit module 120. Of course, in other embodiments, the metal structure can also be a metal layer detachably installed on the side of the circuit module 120 away from the first radiator 110, which is not limited here.

[0040] In one embodiment, such as Figures 1 to 2As shown, the first radiator 110 is provided with an extension edge 112 around its periphery. The extension edge 112 extends along the direction of the first radiator 110 toward the circuit module 120, and the first radiator 110 and the extension edge 112 enclose and form an installation cavity. In this embodiment, to further enhance the shielding effect of the first radiator 110 on the circuit module 120, an extension edge 112 is provided around the cover body 111 of the first radiator 110. The extension edge 112 is positioned in the direction of the second radiator 130. Due to the extension edge 112, the cover body 111 and the extension edge 112 enclose the aforementioned mounting cavity. When installing the circuit module 120, the circuit module 120 can be installed in the mounting cavity. Since the second radiator 130 is installed at the bottom of the circuit module 120 after it is installed in the mounting cavity, the circuit module 120 is surrounded by the radiating structure. At this time, the antenna radiating structure can provide a better shielding effect for the circuit module 120, so that when the circuit module 120 is installed in the antenna radiating structure and put into use, it can effectively shield the interference of external signals through the antenna radiating structure located on the periphery.

[0041] In another embodiment (not shown in the figure), in order to further improve the heat dissipation effect of the circuit module 120 while ensuring the shielding effect, the antenna radiation structure is provided with heat dissipation holes for the mounting cavity to communicate with the external environment. In this embodiment, the heat dissipation holes can be set along the extension direction of the extension edge 112, or in a direction perpendicular to the extension direction of the extension edge 112, or on the cover plate body 111. Of course, in order to make the heat dissipation holes better connect the mounting cavity with the external environment, multiple heat dissipation holes can be set on at least one side of the extension edge 112, or one heat dissipation hole can be set on each side of the extension edge 112, so that the external gas can flow through the relatively set heat dissipation holes. In order to improve the connection between the mounting cavity and the external environment, the heat dissipation holes are not limited to the above-mentioned methods. In other embodiments, heat dissipation holes can also be set on the cover plate body 111. In order to ensure that the shielding effect is not weakened, the diameter of the heat dissipation holes can be set with reference to 0.1 wavelengths less than the system operating frequency band. The shape of the heat dissipation holes is not limited. The heat dissipation holes can be elongated or slit-shaped.

[0042] In one embodiment, a heat-conducting layer is provided inside the mounting cavity to indirectly bond the circuit module 120 to the cavity wall. Since the circuit module 120 has multiple electronic components that generate heat during use, and because the circuit module 120 is not in contact with the bottom of the first radiator 110 when mounted inside the first radiator 110, the heat exchange between the electronic components and the first radiator 110 will be poor. Therefore, to solve this problem, a heat-conducting layer (not shown in the figure) is added between the first radiator 110 and the circuit module 120. This heat-conducting layer mainly protects the circuit module 120 from heat. The heat generated by multiple electronic components on the circuit module 120 is exchanged more quickly with the first radiator 110, and then dissipated by the first radiator 110. In this embodiment, the thermal interface material is used for the thermal conductive layer. The thermal interface material is mostly a flexible material, such as a gel or silicone grease. In other embodiments, a heat dissipation structure can be provided on the side of the first radiator 110 away from the circuit module 120. The heat dissipation structure can be a heat dissipation fin. This heat dissipation structure can effectively improve the heat exchange between the first radiator 110 and the external environment, thereby achieving a better heat dissipation effect.

[0043] In one embodiment, an electrical connector 126 is disposed around the periphery of the circuit module 120. The bottom of the electrical connector 126 is connected to the second radiator 130, and the top of the electrical connector 126 abuts against the extension edge 112, so that the first radiator 110 and the second radiator 130 are electrically connected. In this embodiment, the electrical connector is a metal through-hole 200. The metal through-hole 200 passes through the circuit module, and multiple metal through-holes 200 are provided. Multiple metal through-holes 200 are opened around the periphery of the circuit module 120. When the first radiator 110 covers the top of the metal through-hole 200, the extension edge 112 disposed around the first radiator 110 abuts against the metal through-hole 200, thereby enabling the first radiator 110 and the second radiator 130 to be connected through the metal through-hole 200. Of course, in other embodiments, the electrical connector 126 can also be a metal connector disposed around the circuit module 120 in a covering manner.

[0044] In one embodiment, such as Figure 2As shown, a shielding metal structure 191 is provided in the middle of the second radiator 130, and a wire is provided in the middle of the shielding metal structure 191. The wire is connected to an external DC power supply to supply power to the circuit module 120. In this embodiment, the shielding metal structure 191 is a shielding metal pillar. In other embodiments, the shielding metal structure 191 can also be a shielding metal pillar of other shapes. In this embodiment, a connecting through hole 180 is provided in the middle of the second radiator 130. The connecting through hole 180 is used for the shielding metal structure 191 to be inserted so that the shielding metal structure 191 can be connected to the circuit module 120. A wire is passed through the shielding metal structure 191. The wire is used to electrically connect to an external power supply and is electrically connected to the circuit module 120, thereby providing power to the circuit module 120. The reason for choosing to place the shielding metal structure 191 at the center of the second radiator 130, which is also the center of the circuit module 120, is that this is the virtual short-circuit point of the patch radiating antenna, and its impact on radiation performance is small. In this embodiment, since the wire is passed through the inside of the shielding metal pillar, the shielding metal pillar can reduce the impact of the wire on the radiation performance of the radiating antenna structure.

[0045] In one embodiment, SMA connectors 150 are provided on both sides of the shielding metal structure 191. Each SMA connector 150 includes an outer conductor and an inner conductor, which are insulated from and connected together. The outer conductor is connected to the second radiator 130, and the inner conductor is connected to the circuit module 120. The SMA connector 150 has an inner conductor and an outer conductor. The inner conductor is used for electrical connection to the circuit module 120, while the outer conductor is used for electrical connection between the circuit module 120 and the second radiator 130. In this embodiment, two SMA connectors 150 are provided, one for signal output and one for signal input, and the SMA connectors 150 are located at both ends of the circuit in the circuit module 120.

[0046] In one embodiment, such as Figures 3 to 6 As shown, the antenna radiating structure also includes a reflector 190, which is disposed on the side of the second radiator 130 away from the first radiator 110. A shielding metal structure 191 is disposed on the reflector 190, and an SMA connector 150 passes through the reflector 190 so that the reflector 190 is connected to the second radiator 130 through an outer conductor. In this embodiment, the antenna radiating structure consists of a reflector 190 and the aforementioned radiator formed by the first radiator 110 and the second radiator 130. The reflector 190 is disposed on the side of the second radiator 130 away from the first radiator 110, and the shielding metal structure 191 is disposed in the middle of the reflector 190. The SMA connector 150 passes through the reflector 190 and is connected to the second radiator 130 through an outer conductor. When the antenna radiating structure is put into use, the reflector 190 can cooperate with the first radiator 110 and the second radiator 130 to transmit signals.

[0047] In one embodiment, such as Figure 5 As shown, the SMA connector 150 protrudes from the reflector ground 190 and supports the circuit module 120 with the shielding metal structure 191, so that there is a gap between the circuit module 120 and the reflector ground 190. The SMA connector 150 protruding from the reflector ground 190 creates a gap between the reflector ground 190 and the second radiator 130. The size of the gap is related to the operating frequency of the system and the intermediate medium. The relationship is that the higher the operating frequency of the antenna microsystem, the smaller the gap between the two. In this embodiment, the intermediate medium is air. Of course, in other embodiments, the intermediate medium can be replaced with a dielectric substrate.

[0048] To further improve the connection stability between the circuit module 120 and the reflective ground plane 190, such as Figures 4 to 6 As shown, a nylon screw 160 passes through the circuit module 120, and a nylon nut 162 is provided on the side of the reflector 190 away from the second radiator 130. The nylon nut 162 is used for threaded connection with the nylon screw 160. In this embodiment, a nylon screw 160 passes through the circuit module 120. The nylon screw 160 includes a lead screw 161. The second radiator 130 and the reflector 190 have connecting through holes 180 for the lead screw 161 to pass through. A nylon nut 162 is provided on the side of the reflector 190 away from the second radiator 130, so that the lead screw 161 of the nylon screw 160 is threadedly connected to the nylon nut 162 after passing through the circuit module 120, the second radiator 130, and the reflector 190, thereby further improving the connection stability between the reflector 190, the second radiator 130, and the circuit module 120.

[0049] In one embodiment, the circuit module 120 includes a PCB board 121 and an analog circuit, the analog circuit being disposed on the PCB board 121, such as... Figure 4 As shown, the circuit module 120 includes a PCB board 121 and an analog circuit. The analog circuit includes an RF circuit module, which includes the PCB board 121, a filter 122, an RF switch 123, a power amplifier 125, and a low-noise amplifier 124. The filter 122, the RF switch 123, the power amplifier 125, and the low-noise amplifier 124 are mounted on the PCB board 121. During normal use, the analog circuit has two states: First, when the first radiating plate receives a signal, the signal passes sequentially through the filter 122, the RF switch 123, and the low-noise amplifier in the RF circuit module of the analog circuit, and then outputs a signal; Second, when the circuit module 120 issues an output signal command, the signal enters the power amplifier 125 for amplification, then passes through the switch, and finally connects to the antenna for radiation.

[0050] In another embodiment, circuit module 120 further includes digital circuits and / or mixed-signal circuits. To further expand the functionality of the antenna microsystem structure 100, digital circuits and / or mixed-signal circuits are also provided on the PCB board 121. The digital circuits include digital signal processing circuits and storage circuits; the mixed-signal circuits include analog-to-digital conversion circuits and digital-to-analog conversion circuits. Circuit module 120 can be implemented with multiple discrete chips, or it can be implemented in the form of a System-on-Chip (SOC) composed of any of the above circuits. The digital circuits are mainly used to process digital signals, and the mixed-signal circuits are mainly used to convert analog signals into digital signals or digital signals into analog signals. When circuit module 120 is put into use, the analog circuits, digital circuits, and / or mixed-signal circuits cooperate with each other to achieve multiple functions.

[0051] In another embodiment, the antenna microsystem structure 100 is an omnidirectional antenna. When the antenna microsystem structure 100 is an omnidirectional antenna, the antenna radiating structure does not include the reflector ground plane 190. Since the omnidirectional antenna adopts all the technical solutions of the radiator in all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0052] In another embodiment, such as Figure 7 As shown, multiple antenna microsystem structures 100 are arranged in an array.

[0053] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An antenna microsystem structure, characterized by The application relates to an antenna radiation structure. The antenna radiation structure comprises a first radiator and a second radiator, the first radiator is arranged on the second radiator, and the mounting cavity is formed between the first radiator and the second radiator; the periphery of the first radiator is provided with an extension edge which extends along the first radiator towards the direction of the circuit module, and the first radiator and the second radiator jointly enclose the mounting cavity through the extension edge and the second radiator; and the circuit module excites the first radiator and the second radiator through the feeding structure. The second radiator is a metal structural member away from the first radiator on the side of the circuit module. The antenna radiation structure is provided with a heat dissipation hole for communication between the mounting cavity and the external environment. The mounting cavity is provided with a heat conduction layer for indirectly connecting the circuit module and the cavity wall of the mounting cavity.

2. The antenna microsystem structure of claim 1, wherein, The second radiator is provided with a shielding metal structure, the inside of the shielding metal structure is provided with a wire, and the wire is connected with an external direct current power supply to supply power to the circuit module.

3. The antenna microsystem structure of claim 1, wherein, The two sides of the shielding metal structure are provided with SMA joints, the SMA joint comprises an outer conductor and an inner conductor, the outer conductor and the inner conductor are insulatedly connected, the outer conductor is connected with the second radiator, and the inner conductor is connected with the circuit module.

4. The antenna microsystem structure of claim 1, wherein, The antenna radiation structure further comprises a reflecting floor, the reflecting floor is arranged on the side of the second radiator away from the first radiator, the shielding metal structure is arranged on the reflecting floor, and the SMA joint penetrates through the reflecting floor to connect the reflecting floor with the second radiator through the outer conductor.

5. The antenna microsystem structure according to any of claims 1 to 4, characterized in that, The SMA joint protrudes from the reflecting floor and supports the circuit module together with the shielding metal structure, so that a spacing exists between the circuit module and the reflecting floor.

6. The antenna microsystem structure of claim 5, wherein, The circuit module is provided with a nylon screw, and the side of the reflecting floor away from the second radiator is provided with a nylon nut which is used for screwing with the nylon screw.

7. The antenna microsystem structure of claim 6, wherein The circuit module comprises a PCB and an analog circuit, the analog circuit is arranged on the PCB, and the circuit module further comprises a digital circuit and / or a digital-analog hybrid circuit.

8. The antenna microsystem structure of claim 7, wherein ​ 9. The antenna microsystem structure of claim 7, wherein, ​ 10. The antenna microsystem structure according to any of claims 1 to 4, characterized in that ​

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