A processing device for a semiconductor chip

By designing semiconductor chip processing devices, using hydraulic push rods, electro-hydraulic push rods, spray pipes and drying covers, the problems of low loading and unloading efficiency and low processing quality in the existing technology are solved, and precise loading and unloading, uniform spraying and rapid drying are achieved, and processing efficiency and quality are improved.

CN117878005BActive Publication Date: 2025-05-30SHENZHEN SHILIJIA TECH CO LTD
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Patent Information

Application Number
CN202310350687.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-04
Publication Date
2025-05-30
Estimated Expiration
2043-04-04

AI Technical Summary

Technical Problem

The existing semiconductor chip processing technology is inefficient when loading and unloading and it is difficult to accurately determine the chip position, resulting in waste of photoresist and reduced processing quality.

Method used

A semiconductor chip processing device is designed, including a feeding table, a mobile table, a spray pipe and a drying mechanism. Through the cooperation of hydraulic push rods and electro-hydraulic push rods, precise loading and automatic discharge of semiconductor chips are achieved; spray pipes and drying covers are used to achieve uniform spraying and rapid drying of photoresist liquid.

Benefits of technology

It improves the loading and unloading efficiency of semiconductor chips, reduces the waste of photoresist, improves processing quality, and speeds up the subsequent processing process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a processing device for semiconductor chips, including a bottom plate. A loading table is fixedly connected to the top of the bottom plate near the left side, and a rectangular plate is fixedly connected to the middle position of the top of the loading table. A loading mechanism is provided on the top of the loading table. When the present invention is in use, the semiconductor chip is placed in the rectangular plate on the top of the loading table. Then, the hydraulic push rod is started to push the cross plate downward, and the two connecting plates are driven to move downward, so that the two rubber clamping plates move to the left and right sides of the semiconductor chip respectively. Then, the two first electric telescopic rods are started to push the two rubber clamping plates to move relatively, so as to clamp and fix the semiconductor chip. The hydraulic push rod is started to pull the cross plate upward, and the rotating arm is rotated counterclockwise by 180 degrees, so that the semiconductor chip is located directly above the moving table, and the semiconductor chip is placed on the top of the moving table, thus completing precise loading.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip processing, and specifically relates to a processing device for semiconductor chips. Background Art

[0002] A semiconductor chip is a semiconductor device that is etched and wired on a semiconductor sheet and can achieve a certain function. Semiconductor chips are not only silicon chips, but also commonly include semiconductor materials such as gallium arsenide and germanium.

[0003] When processing existing semiconductor chips, photoresist liquid is usually sprayed on their surfaces to improve the performance of the semiconductor chips. However, the efficiency is low during the loading and unloading of semiconductor chips, and it is difficult to accurately determine the position of the chips, which not only easily causes waste of photoresist liquid, but also reduces the processing quality. In addition, the chips after spraying photoresist liquid are difficult to dry quickly, which will affect the subsequent working efficiency. Summary of the Invention

[0004] The technical problem solved by the present invention is to overcome the defects of the prior art and provide a processing device for semiconductor chips.

[0005] To achieve the above object, the present invention provides the following technical solution: A processing device for semiconductor chips, including a bottom plate. A loading table is fixedly connected to the top of the bottom plate near the left side, and a U-shaped plate is fixedly connected to the middle position of the top of the loading table. A loading mechanism is arranged on the top of the loading table. A moving table is arranged on the top of the bottom plate near the left side, and grooves are opened on both sides near the left and right sides of the top of the moving table. An anti-displacement mechanism is arranged on the top of the moving table. A moving mechanism is arranged at the bottom of the moving table. A mounting seat is fixedly connected to the top of the bottom plate near the left side, and a first vertical plate is fixedly connected to the right side of the mounting seat. An n-shaped plate is fixedly connected to the top of the bottom plate near the right side, and a liquid storage tank is fixedly connected to the top of the inner cavity of the n-shaped plate near the left side. Drainage plates are fixedly connected to both the left and right sides of the bottom of the inner cavity of the liquid storage tank. A liquid injection pipe is inserted into the top of the liquid storage tank, and the top of the liquid injection pipe penetrates through the top of the n-shaped plate and extends to the top of the n-shaped plate. A pipe valve is arranged on the liquid injection pipe. A round hole is opened at the middle position of the bottom of the liquid storage tank, and a liquid outlet pipe is inserted into the inner cavity of the round hole. The top of the liquid outlet pipe is fixedly connected with a sealing ring, and the bottom of the sealing ring is attached to the bottom of the inner cavity of the liquid storage tank. The bottom of the liquid outlet pipe is fixedly connected with a liquid extraction pump, and the bottom of the liquid extraction pump is fixedly connected with a connecting pipe. The bottom of the connecting pipe is fixedly connected with a spray pipe, and several nozzles are fixedly connected to the bottom of the spray pipe. A rotating mechanism is arranged on the outer side of the liquid outlet pipe. A drying mechanism is arranged in the inner cavity of the n-shaped plate near the right side. An electrostatic generator is fixedly installed at the top of the inner cavity of the n-shaped plate near the right side. A second vertical plate is fixedly connected to the top of the bottom plate near the right side.

[0006] Preferably, the feeding mechanism includes a rotating arm, and the rotating arm is rotatably connected to the top of the bottom plate near the left side. A hydraulic push rod is fixedly installed at the bottom of the rotating arm near the left side, and the power end of the hydraulic push rod is fixedly connected to a horizontal plate. Connecting plates are fixedly connected to both the left and right sides of the bottom of the horizontal plate, and first electric telescopic rods are installed through the connecting plates. The power ends of the two first electric telescopic rods are both fixedly connected to rubber clamping plates.

[0007] Preferably, the anti-displacement mechanism includes two electro-hydraulic push rods, and the two electro-hydraulic push rods are respectively fixedly installed at the middle positions of the bottoms of the two grooves. The power ends of the two electro-hydraulic push rods are both fixedly connected to a lifting plate, and a limiting plate is fixedly connected to the top of the lifting plate.

[0008] Preferably, the moving mechanism includes a rotating plate, and the rotating plate is fixedly connected to the bottom of the moving platform near the left side. A rotating shaft is commonly penetrated through the front and rear sides of the rotating plate, and bearing plates are rotatably connected to both the front and rear ends of the rotating shaft. A moving plate is fixedly connected to the bottoms of the two bearing plates, and moving blocks are fixedly connected to both the front and rear sides of the bottom of the moving plate. A through hole is formed in the moving block located at the rear side, and a cross bar is penetrated through the inner cavity of the through hole. The left and right ends of the cross bar are respectively fixedly connected to the first vertical plate and the second vertical plate. A threaded hole is formed in the moving block located at the front side, and a first threaded rod is penetrated through the inner cavity of the threaded hole. The right end of the first threaded rod is rotatably connected to the left side of the second vertical plate. A first bearing is fixedly connected to the first vertical plate, and a first servo motor is fixedly installed on the top of the mounting seat. The left end of the first threaded rod penetrates through the inner cavity of the first bearing and is fixedly connected to the power output end of the first servo motor.

[0009] Preferably, a second electric telescopic rod is fixedly installed at the top of the moving plate near the left side, and the power end of the second electric telescopic rod is fixedly connected to a movable block. A connecting rod is hinged to the right side of the movable block, and the other end of the connecting rod is rotatably connected to the bottom of the moving platform near the right side. A first slider is fixedly connected to the bottom of the movable block, a first sliding groove is formed in the top of the moving plate, and the first slider is movably connected to the inner cavity of the first sliding groove.

[0010] Preferably, the drying mechanism includes a drying cover, and the drying cover is located at the middle position near the top inside the n-shaped plate. Weight-bearing columns are fixedly connected to the four corners of the top of the drying cover, and the top ends of the weight-bearing columns are fixedly connected to the top inside the n-shaped plate. A baking fan is fixedly installed at the top inside the drying cover. Two sector plates are attached to the bottom of the drying cover, and the two sector plates are attached to each other left and right. Second sliding grooves are formed at the tops of the two sector plates, and second sliders are movably connected inside the second sliding grooves. The tops of the two second sliders are respectively fixedly connected to the left and right sides of the bottom of the drying cover. Fixed rods are fixedly connected to the adjacent sides of the tops of the two sector plates, and threaded sleeves are fixedly connected to the top ends of the fixed rods. The threading directions of the two threaded sleeves are opposite, and a second threaded rod penetrates through the two threaded sleeves. The right end of the second threaded rod is rotatably connected to the right side wall inside the drying cover. A second bearing is fixedly connected to the left side of the drying cover, and the left end of the second threaded rod penetrates through the inside of the second bearing and is fixedly connected to a driven bevel gear. A driving bevel gear meshes with the top of the driven bevel gear, and a transmission rod is fixedly connected to the center of the top of the driving bevel gear. A second servo motor is fixedly connected to the top inside the n-shaped plate near the left side, and the top end of the transmission rod is fixedly connected to the power output end of the second servo motor.

[0011] Preferably, the rotating mechanism includes a driven wheel, and the driven wheel is sleeved and fixed on the outer side wall of the liquid outlet pipe. A driving wheel is sleeved and fixed on the outer side wall of the transmission rod. A belt is arranged between the driving wheel and the driven wheel, and the driving wheel and the driven wheel are connected by belt drive.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] 1. In the present invention, the semiconductor chip is placed in the U-shaped plate on the top of the loading table. Then, the hydraulic push rod is started to push the cross plate downward, and the two connecting plates are driven to move downward, so that the two rubber clamping plates move to the left and right sides of the semiconductor chip respectively. Then, the two first electric telescopic rods are started to push the two rubber clamping plates to move relatively, so as to clamp and fix the semiconductor chip. The hydraulic push rod is started to pull the cross plate upward, and the rotating arm is rotated counterclockwise by 180 degrees, so that the semiconductor chip is located directly above the moving table, and the semiconductor chip is placed on the top of the moving table, thus completing precise loading. When discharging after processing is completed, the first servo motor is started to drive the first threaded rod to rotate, and the moving table is driven to move to the top near the right side of the bottom plate. Then, the second electric telescopic rod is started to pull the movable block to move leftward, and the right side of the moving table is pulled to turn downward through the connecting rod, so as to realize automatic unloading, improve the efficiency of loading and unloading, avoid waste of photoresist liquid, and improve the processing quality at the same time;

[0014] 2. After the semiconductor chip is placed on the top of the mobile station, by starting two electro-hydraulic push rods to push the adjacent lifting plates upward, the two limiting plates can be driven to move upward, and the left and right sides of the semiconductor chip can be limited. When the mobile station moves to the lower part of the spray pipe, by starting the liquid extraction pump, the photoresist liquid in the liquid storage tank can be pumped into the spray pipe, and the photoresist liquid can be sprayed onto the top of the semiconductor chip through several nozzles. Then, by starting the second servo motor, the transmission rod can be driven to rotate, and the driving wheel can be driven to rotate. The driving wheel rotates to drive the driven wheel to rotate through the belt, and the discharge pipe can be driven to rotate, so that the spray pipe can be driven to rotate, making the spray more uniform and conducive to improving the processing quality.

[0015] 3. When the second servo motor drives the transmission rod to rotate, the second threaded rod can be driven to rotate through the meshing of the driving conical gear and the driven conical gear. The rotation of the second threaded rod drives the two threaded sleeves to move away from each other, and drives the two sector plates to move away from each other through the two fixed rods, thus opening the drying hood. Through the work of the baking fan, the semiconductor chip after spraying the photoresist liquid can be quickly dried, which is conducive to improving the subsequent processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present invention;

[0017] Figure 2 is a top view of the bottom plate of the components of the present invention;

[0018] Figure 3 is a three-dimensional view of the loading table of the components of the present invention;

[0019] Figure 4 is a three-dimensional structural schematic diagram of the unfolded limiting plate of the components of the present invention;

[0020] Figure 5 is a left view of the mobile station of the components of the present invention;

[0021] Figure 6 is a left view of the liquid extraction pump of the components of the present invention;

[0022] Figure 7 is Figure 1 an enlarged view of part A in

[0023] Figure 8 is Figure 1 an enlarged view of part B in

[0024] Reference numerals in the figure: 1, bottom plate; 2, loading table; 3, return plate; 4, rotating arm; 5, hydraulic push rod; 6, horizontal plate; 7, first electric telescopic rod; 8, rubber clamping plate; 9, moving table; 10, moving plate; 11, moving block; 12, first threaded rod; 13, first servo motor; 14, cross bar; 15, second electric telescopic rod; 16, movable block; 17, connecting rod; 18, n-shaped plate; 19, liquid storage tank; 20, drainage plate; 21, liquid injection pipe; 22, load-bearing column; 23, drying hood; 24, baking fan; 25, sector plate; 26, fixed rod; 27, threaded sleeve; 28, second threaded rod; 29, driven bevel gear; 30, driving bevel gear; 31, transmission rod; 32, second servo motor; 33, electrostatic generator; 34, driving wheel; 35, limiting plate; 36, rotating plate; 37, rotating shaft; 38, load-bearing plate; 39, liquid extraction pump; 40, liquid outlet pipe; 41, sealing ring; 42, connecting pipe; 43, spray pipe; 44, nozzle; 45, electro-hydraulic push rod; 46, lifting plate; 47, driven wheel. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] Please refer to Figure 1-8, the present invention provides a technical solution: a processing device for a semiconductor chip, including a bottom plate 1. A feeding table 2 is fixedly connected to the top of the bottom plate 1 near the left side, and a rectangular plate 3 is fixedly connected to the middle position of the top of the feeding table 2. A feeding mechanism is provided on the top of the feeding table 2. A moving table 9 is provided on the top of the bottom plate 1 near the left side, and grooves are formed at both left and right sides near the top of the moving table 9. An anti-displacement mechanism is provided on the top of the moving table 9, and a moving mechanism is provided at the bottom of the moving table 9. A mounting seat is fixedly connected to the top of the bottom plate 1 near the left side, and a first vertical plate is fixedly connected to the right side of the mounting seat. An n-shaped plate 18 is fixedly connected to the top of the bottom plate 1 near the right side, and a liquid storage tank 19 is fixedly connected to the top inner cavity of the n-shaped plate 18 near the left side. Drainage plates 20 are fixedly connected to both left and right sides of the bottom inner cavity of the liquid storage tank 19. A liquid injection pipe 21 is inserted into the top of the liquid storage tank 19, and the top end of the liquid injection pipe 21 penetrates through the top of the n-shaped plate 18 and extends to the top of the n-shaped plate 18. A pipe valve is provided on the liquid injection pipe 21. A round hole is formed at the middle position of the bottom of the liquid storage tank 19, and a liquid outlet pipe 40 is inserted into the inner cavity of the round hole. The top end of the liquid outlet pipe 40 is fixedly connected with a sealing ring 41, and the bottom of the sealing ring 41 is attached to the bottom inner cavity of the liquid storage tank 19. The bottom end of the liquid outlet pipe 40 is fixedly connected with a liquid extraction pump 39, and the bottom of the liquid extraction pump 39 is fixedly connected with a connecting pipe 42. The bottom end of the connecting pipe 42 is fixedly connected with a spray pipe 43, and a plurality of nozzles 44 are fixedly connected to the bottom of the spray pipe 43. A rotating mechanism is provided on the outer side of the liquid outlet pipe 40. A drying mechanism is provided in the inner cavity of the n-shaped plate 18 near the right side. An electrostatic generator 33 is fixedly installed at the top inner cavity of the n-shaped plate 18 near the right side. A second vertical plate is fixedly connected to the top of the bottom plate 1 near the right side;

[0027] The feeding mechanism includes a rotating arm 4, and the rotating arm 4 is rotatably connected to the top of the bottom plate 1 near the left side. A hydraulic push rod 5 is fixedly installed at the bottom of the rotating arm 4 near the left side, and the power end of the hydraulic push rod 5 is fixedly connected with a cross plate 6. Connecting plates are fixedly connected to both left and right sides of the bottom of the cross plate 6, and first electric telescopic rods 7 are installed through the connecting plates. The power ends of the two first electric telescopic rods 7 are both fixedly connected with rubber clamping plates 8, which realizes precise feeding, avoids waste of photoresist liquid, and improves the processing quality at the same time;

[0028] The anti-displacement mechanism includes two electro-hydraulic push rods 45, and the two electro-hydraulic push rods 45 are respectively fixedly installed at the middle positions of the bottoms of the two groove inner cavities. The power ends of the two electro-hydraulic push rods 45 are both fixedly connected with lifting plates 46, and a limiting plate 35 is fixedly connected to the top of the lifting plate 46, which avoids displacement and sliding of the semiconductor chip during the moving process and affects the processing quality;

[0029] The moving mechanism includes a rotating plate 36, and the rotating plate 36 is fixedly connected to the bottom of the moving platform 9 near the left side. Both the front and rear sides of the rotating plate 36 are commonly penetrated by a rotating shaft 37, and both the front and rear ends of the rotating shaft 37 are rotatably connected to a load-bearing plate 38. The bottoms of the two load-bearing plates 38 are commonly fixedly connected to a moving plate 10, and moving blocks 11 are fixedly connected to the bottom of the moving plate 10 near both the front and rear sides. A perforation is formed in the moving block 11 located at the rear side, and a cross bar 14 is penetrated through the inner cavity of the perforation. The left and right ends of the cross bar 14 are respectively fixedly connected to the first vertical plate and the second vertical plate. A threaded hole is formed in the moving block 11 located at the front side, and a first threaded rod 12 is penetrated through the inner cavity of the threaded hole. The right end of the first threaded rod 12 is rotatably connected to the left side of the second vertical plate. A first bearing is fixedly connected to the first vertical plate, and a first servo motor 13 is fixedly installed on the top of the mounting seat. The left end of the first threaded rod 12 penetrates through the inner cavity of the first bearing and is fixedly connected to the power output end of the first servo motor 13. A second electric telescopic rod 15 is fixedly installed on the top of the moving plate 10 near the left side, and a movable block 16 is fixedly connected to the power end of the second electric telescopic rod 15. A connecting rod 17 is hinged to the right side of the movable block 16, and the other end of the connecting rod 17 is rotatably connected to the bottom of the moving platform 9 near the right side. A first slider is fixedly connected to the bottom of the movable block 16. A first sliding groove is formed in the top of the moving plate 10, and the first slider is movably connected to the inner cavity of the first sliding groove, realizing the convenience of loading, unloading, spraying, and drying;

[0030] The drying mechanism includes a drying cover 23, and the drying cover 23 is located at the middle position near the top in the inner cavity of the n-shaped plate 18. Load-bearing columns 22 are fixedly connected to the four corners of the top of the drying cover 23, and the top ends of the load-bearing columns 22 are fixedly connected to the top of the inner cavity of the n-shaped plate 18. A baking fan 24 is fixedly installed at the top of the inner cavity of the drying cover 23. Two sector plates 25 are attached to the bottom of the drying cover 23, and the two sector plates 25 are attached to each other left and right. Second chutes are formed at the tops of the two sector plates 25, and second sliders are movably connected in the inner cavities of the second chutes. The top ends of the two second sliders are respectively fixedly connected to the left and right sides of the bottom of the drying cover 23. Fixed rods 26 are fixedly connected to the adjacent sides of the tops of the two sector plates 25, and threaded sleeves 27 are fixedly connected to the top ends of the fixed rods 26. The internal thread directions of the two threaded sleeves 27 are opposite, and a second threaded rod 28 penetrates through the inner cavities of the two threaded sleeves 27. The right end of the second threaded rod 28 is rotatably connected to the right side wall of the inner cavity of the drying cover 23. A second bearing is fixedly connected to the left side of the drying cover 23, and the left end of the second threaded rod 28 penetrates through the inner cavity of the second bearing and is fixedly connected to a driven bevel gear 29. A driving bevel gear 30 meshes with the top of the driven bevel gear 29, and a transmission rod 31 is fixedly connected to the center of the top of the driving bevel gear 30. A second servo motor 32 is fixedly connected to the top of the inner cavity of the n-shaped plate 18 near the left side, and the top end of the transmission rod 31 is fixedly connected to the power output end of the second servo motor 32 to accelerate the subsequent processing process;

[0031] The rotating mechanism includes a driven wheel 47, and the driven wheel 47 is sleeved and fixed on the outer side wall of the liquid outlet pipe 40. A driving wheel 34 is sleeved and fixed on the outer side wall of the transmission rod 31. A belt is provided between the driving wheel 34 and the driven wheel 47, and the driving wheel 34 and the driven wheel 47 are connected by belt drive to improve the uniformity of photoresist liquid spraying.

[0032] Working principle: When the present invention is in use, a semiconductor chip is placed in the loop plate 3 on the top of the loading table 2. Then, the hydraulic push rod 5 is started to push the cross plate 6 downward, and drive the two connecting plates to move downward, so that the two rubber clamping plates 8 respectively move to the left and right sides of the semiconductor chip. Then, the two first electric telescopic rods 7 are started to push the two rubber clamping plates 8 to move relatively, so as to clamp and fix the semiconductor chip. The hydraulic push rod 5 is started to pull the cross plate 6 upward, and the rotating arm 4 is rotated counterclockwise by 180 degrees, so that the semiconductor chip is located directly above the moving table 9, and the semiconductor chip is placed on the top of the moving table 9, thus completing precise feeding. Then, by starting the two electro-hydraulic push rods 45 to push the adjacent lifting plates 46 upward, the two limiting plates 35 can be driven to move upward, and the left and right sides of the semiconductor chip are limited. When the moving table 9 moves below the spray pipe 43, by starting the liquid pumping pump 39, the photoresist liquid in the liquid storage tank 19 can be pumped into the spray pipe 43, and the photoresist liquid is sprayed onto the top of the semiconductor chip through a plurality of nozzles 44. Then, by starting the second servo motor 32, the transmission rod 31 can be driven to rotate, and the driving wheel 34 can be driven to rotate. The driving wheel 34 rotates to drive the driven wheel 47 to rotate through the belt, and drives the liquid outlet pipe 40 to rotate, so as to drive the spray pipe 43 to rotate, making the spraying more uniform, which is beneficial to improving the processing quality. When the spraying is finished, the first servo motor 13 is continued to work, and the moving table 9 is moved directly below the drying hood 23. The rotation of the transmission rod 31 can drive the transmission bevel gear 30 to rotate. The transmission bevel gear 30 rotates to drive the driven bevel gear 29 to rotate. The driven bevel gear 29 rotates to drive the second threaded rod 28 to rotate. The second threaded rod 28 rotates to drive the two threaded sleeves 27 to move away from each other, and drives the two sector plates 25 to move away from each other through the two fixing rods 26, so as to open the drying hood 23. Through the work of the baking fan 24, the semiconductor chip after spraying the photoresist liquid can be quickly dried, which is beneficial to improving the subsequent processing efficiency. In addition, during the loading and unloading process, the drying hood 23 is hermetically arranged to avoid heat dissipation and increase the electricity cost. When the moving table 9 moves to the top of the bottom plate 1 near the right side, then, by starting the second electric telescopic rod 15 to pull the movable block 16 to move leftward, and pulling the right side of the moving table 9 to turn downward through the connecting rod 17, automatic unloading can be realized, improving the loading and unloading efficiency, avoiding waste of photoresist liquid, and at the same time improving the processing quality.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A processing device for a semiconductor chip, comprising a bottom plate (1), characterized in that: A feeding table (2) is fixedly connected to the top of the bottom plate (1) near the left side, and a rectangular plate (3) is fixedly connected to the middle position of the top of the feeding table (2). A feeding mechanism is arranged on the top of the feeding table (2). A moving table (9) is arranged on the top of the bottom plate (1) near the left side, and grooves are formed on both sides of the top of the moving table (9) near the left and right sides. An anti-displacement mechanism is arranged on the top of the moving table (9), and a moving mechanism is arranged at the bottom of the moving table (9). A mounting seat is fixedly connected to the top of the bottom plate (1) near the left side, and a first vertical plate is fixedly connected to the right side of the mounting seat. An n-shaped plate (18) is fixedly connected to the top of the bottom plate (1) near the right side, and a liquid storage tank (19) is fixedly connected to the top of the inner cavity of the n-shaped plate (18) near the left side. Drainage plates (20) are fixedly connected to both the left and right sides of the bottom of the inner cavity of the liquid storage tank (19). A liquid injection pipe (21) is inserted into the top of the liquid storage tank (19), and the top of the liquid injection pipe (21) penetrates through the top of the n-shaped plate (18) and extends to the top of the n-shaped plate (18). A pipe valve is arranged on the liquid injection pipe (21). A round hole is formed in the middle position of the bottom of the liquid storage tank (19), and a liquid outlet pipe (40) is inserted into the inner cavity of the round hole. The top of the liquid outlet pipe (40) is fixedly connected with a sealing ring (41), and the bottom of the sealing ring (41) is attached to the bottom of the inner cavity of the liquid storage tank (19). The bottom of the liquid outlet pipe (40) is fixedly connected with a liquid extraction pump (39), and the bottom of the liquid extraction pump (39) is fixedly connected with a connecting pipe (42). The bottom of the connecting pipe (42) is fixedly connected with a spray pipe (43), and a plurality of nozzles (44) are fixedly connected to the bottom of the spray pipe (43). A rotating mechanism is arranged on the outer side of the liquid outlet pipe (40). A drying mechanism is arranged in the inner cavity of the n-shaped plate (18) near the right side. An electrostatic generator (33) is fixedly installed at the top of the inner cavity of the n-shaped plate (18) near the right side. A second vertical plate is fixedly connected to the top of the bottom plate (1) near the right side; The feeding mechanism includes a rotating arm (4), and the rotating arm (4) is rotatably connected to the top of the bottom plate (1) near the left side. A hydraulic push rod (5) is fixedly installed at the bottom of the rotating arm (4) near the left side, and the power end of the hydraulic push rod (5) is fixedly connected with a cross plate (6). Connecting plates are fixedly connected to both the left and right sides of the bottom of the cross plate (6), and a first electric telescopic rod (7) is installed through the connecting plates. The power ends of the two first electric telescopic rods (7) are fixedly connected with rubber clamping plates (8); The moving mechanism includes a rotating plate (36), and the rotating plate (36) is fixedly connected to the bottom of the moving platform (9) near the left side. A rotating shaft (37) is commonly penetrated through the front and rear sides of the rotating plate (36), and load-bearing plates (38) are rotatably connected to both the front and rear ends of the rotating shaft (37). A moving plate (10) is fixedly connected to the bottom of the two load-bearing plates (38), and moving blocks (11) are fixedly connected to both the front and rear sides near the bottom of the moving plate (10). A through hole is formed in the moving block (11) located at the rear side, and a cross bar (14) is penetrated through the inner cavity of the through hole. The left and right ends of the cross bar (14) are respectively fixedly connected to the first vertical plate and the second vertical plate. A threaded hole is formed in the moving block (11) located at the front side, and a first threaded rod (12) is penetrated through the inner cavity of the threaded hole. The right end of the first threaded rod (12) is rotatably connected to the left side of the second vertical plate. A first bearing is fixedly connected to the first vertical plate, and a first servo motor (13) is fixedly installed on the top of the mounting seat. The left end of the first threaded rod (12) penetrates through the inner cavity of the first bearing and is fixedly connected to the power output end of the first servo motor (13); A second electric telescopic rod (15) is fixedly installed on the top of the moving plate (10) near the left side, and a movable block (16) is fixedly connected to the power end of the second electric telescopic rod (15). A connecting rod (17) is hinged to the right side of the movable block (16), and the other end of the connecting rod (17) is rotatably connected to the bottom of the moving platform (9) near the right side. A first slider is fixedly connected to the bottom of the movable block (16), a first sliding groove is formed in the top of the moving plate (10), and the first slider is movably connected to the inner cavity of the first sliding groove; The drying mechanism includes a drying cover (23), and the drying cover (23) is located at the middle position near the top inside the n-shaped plate (18). At the four corners near the top of the drying cover (23), load-bearing columns (22) are fixedly connected, and the tops of the load-bearing columns (22) are fixedly connected to the top inside wall of the n-shaped plate (18). A baking fan (24) is fixedly installed at the top inside the drying cover (23). Two sector plates (25) are attached to the bottom of the drying cover (23), and the two sector plates (25) are attached to each other left and right. Second sliding grooves are formed at the tops of the two sector plates (25), and second sliders are movably connected inside the second sliding grooves. The tops of the two second sliders are respectively fixedly connected to the left and right sides at the bottom of the drying cover (23). Fixed rods (26) are fixedly connected to the adjacent sides at the tops of the two sector plates (25), and threaded sleeves (27) are fixedly connected to the tops of the fixed rods (26). The threading directions inside the two threaded sleeves (27) are opposite, and a second threaded rod (28) is commonly passed through the inside cavities of the two threaded sleeves (27). The right end of the second threaded rod (28) is rotatably connected to the right side inside wall of the drying cover (23). A second bearing is fixedly connected to the left side of the drying cover (23), and the left end of the second threaded rod (28) passes through the inside cavity of the second bearing and is fixedly connected to a driven bevel gear (29). A driving bevel gear (30) meshes with the top of the driven bevel gear (29), and a transmission rod (31) is fixedly connected to the center of the top of the driving bevel gear (30). A second servo motor (32) is fixedly connected to the top inside wall of the n-shaped plate (18) near the left side, and the top of the transmission rod (31) is fixedly connected to the power output end of the second servo motor (32).

2. The processing device for a semiconductor chip according to claim 1, wherein: The anti-displacement mechanism includes two electro-hydraulic push rods (45), and the two electro-hydraulic push rods (45) are respectively fixedly installed at the middle positions at the bottoms of the two grooves. The power ends of the two electro-hydraulic push rods (45) are fixedly connected to lifting plates (46), and a limiting plate (35) is fixedly connected to the top of the lifting plate (46).

3. The processing device for a semiconductor chip according to claim 2, wherein: The rotating mechanism includes a driven wheel (47), and the driven wheel (47) is sleeved and fixed on the outer side wall of the liquid outlet pipe (40). A driving wheel (34) is sleeved and fixed on the outer side wall of the transmission rod (31). A belt is provided between the driving wheel (34) and the driven wheel (47), and the driving wheel (34) and the driven wheel (47) are connected by belt drive.

Citation Information

Patent Citations

  • Automatic wafer gluing machine

    CN115178435A