A power assembly and a power converter
By incorporating a wiring structure with a fixed component and elastic conductive elements in the converter, the problem of stress transmission in IGBT device wiring is solved, improving device reliability and lifespan, and optimizing layout and heat dissipation efficiency.
Patent Information
- Application Number
- CN202311594568.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-24
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2043-11-24
AI Technical Summary
In existing converters, the terminals of IGBT devices are directly connected to the semiconductor part, causing stress to be transmitted to the IGBT device, reducing its reliability and making it prone to failure.
A fixing part and a wiring component are set on the heat sink. The wiring terminals of the switching device and the semiconductor part are connected by an elastic conductive element. The stress is buffered by elastic deformation. A fixing position is set at the wiring part of the DC terminal block and the capacitor busbar to ensure the stable installation of the switching device.
It effectively mitigates the impact of wiring stress on switching devices, improves the reliability and lifespan of IGBT devices, and optimizes the layout and heat dissipation efficiency of switching devices, while reducing the size and stray inductance of power components.
Smart Images

Figure CN117879305B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of converter, in particular to a power assembly and a converter. BACKGROUND
[0002] The converter is widely used in the fields of power system, rail transit, military industry, petroleum machinery, new energy vehicle, wind power generation, solar photovoltaic, etc. The converter is connected between the battery system and the power grid, and is used for realizing bidirectional conversion of electric energy, controlling the charging and discharging process of the battery, converting AC and DC, and directly supplying power to AC load in the case of no power grid. At the same time, the NPC (Neutral Point Clamp) or ANPC (Active Neutral Point Clamp) three-level topology can use low blocking voltage IGBT devices to increase the DC bus voltage, thereby improving the AC output voltage and expanding the system power level, so it is widely used in the converter.
[0003] Conventionally, the converter mainly includes a power assembly, which is used for realizing bidirectional conversion of DC and AC. The power assembly in the converter generally includes a DC module and a power module. The DC module mainly includes a DC capacitor bank and a capacitor busbar, and the power module mainly includes a power tube group and a heat sink. The power tube group is installed on the heat sink, and then connected with the DC busbar through an input bus. Specifically, referring to Figure 1 which shows the structure of the power assembly in the converter in the prior art. The power assembly can include a capacitor busbar 01, a DC capacitor bank 02, an input bus 03, a power tube group 04, an output bus 05, and a heat sink 06. The input bus 03, the power tube group 04, and the output bus 05 form the above-mentioned power module. The power tube group 04 is installed on the heat sink 06, and the heat sink 06 is a air-cooled heat sink with heat dissipation fins on the back, so the input bus 03, the power tube group 04, and the output bus 05 are installed on the front of the heat sink 06. Since the output of the power device is three-phase AC, the power module includes three power tube groups 04 and three corresponding heat sinks 06. Each power tube group 04 is installed on a heat sink 06, and the input buses 03 in the three power modules are connected to the capacitor busbar 01. Further, the capacitor busbar 01 includes positive plates, negative plates, and neutral plates, which are stacked and separated from each other by insulation plates. Correspondingly, the input bus 03 in each power module also includes positive plates, negative plates, and neutral plates, which are connected to the plates in the capacitor busbar 01.
[0004] Referring to Figure 2Fig. 1 shows a circuit diagram of a three-level topology in the prior art. For a power assembly using a three-level topology, the power tube group 04 generally includes three IGBT devices corresponding to Figure 2 In the circuit shown, tube 1 and tube 2 are an input tube, tube 3 and tube 4 are an input tube, and tube 5 and tube 6 are an output tube. The first end of tube 1 is connected to the positive plate of the capacitor bus, the first end of tube 2 is connected to the neutral plate of the capacitor bus, and the second ends of tube 1 and tube 2 are connected and then connected to the first end of tube 5. The first end of tube 3 is connected to the negative plate of the capacitor bus, the first end of tube 4 is connected to the neutral plate of the capacitor bus, and the second ends of tube 3 and tube 4 are connected and then connected to the first end of tube 6. The second ends of tube 5 and tube 6 are connected to the output bus. The capacitor cells connected to the capacitor bus are also divided into two parts, corresponding to C1 and C2 in Figure 2
[0005] Referring to Figure 3 , in the prior art power assembly, the selection of IGBT devices generally uses this structure, i.e. the wiring terminals of the IGBT devices are located at the upper end and the lower end of the IGBT devices, which facilitates the connection and installation of the input bus and the output bus. However, in some cases, IGBT devices as shown in Figure 6 are required to be selected, in which the wiring terminals of the devices are all located at the top of the device body and are directly connected to the semiconductor part inside the IGBT device, which results in that the stress of the copper bus is directly transmitted to the semiconductor part inside the IGBT device when the input bus and the output bus are installed, thereby reducing the reliability of the IGBT device and causing faults. SUMMARY
[0006] The purpose of the present application is to overcome the above-mentioned defects or problems in the background art, and to provide a power assembly and a converter, which can alleviate the stress transmission of the wiring components to the semiconductor part of the switching device on the wiring terminals of the switching device.
[0007] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:
[0008] Technical solution one: a power assembly, comprising: a heat sink having a mounting surface, and a plurality of fixing portions protruding from the mounting surface; a wiring component comprising a wiring strip, the wiring strip being locked and fixed to the heat sink through each fixing portion; and a plurality of switching devices fixed to the mounting surface; the switching device comprising a switching body and a plurality of wiring terminals exposed to the switching body; the switching body is provided with a semiconductor portion and an elastic conductive member; the elastic conductive member electrically connects the semiconductor portion and the wiring terminal, and defines a first direction and a second direction perpendicular to each other according to the elastic deformation direction thereof, the elastic conductive member is adapted to buffer the wiring stress of the wiring terminal to the semiconductor portion in the first direction and the second direction; the plurality of wiring terminals on the switching device are arranged in sequence along the second direction; the first direction is perpendicular to the mounting surface; the wiring strip electrically connects the wiring terminals on the switching device, and its relative switching body of the switching device is away from the mounting surface; the first direction or the second direction is a vertical direction.
[0009] Technical solution two based on technical solution one: further comprising a capacitor busbar; in the switching device, the part connected to the capacitor busbar through the wiring component is a direct current side switching device, and the part connected to the alternating current side of the power assembly is an alternating current side switching device; in the wiring strip, the part connecting the direct current side switching device and the capacitor busbar is a direct current wiring strip, and the direct current wiring strip connects the corresponding wiring terminal on the direct current side switching device; the mounting surface of the heat sink is perpendicular to the capacitor busbar; the wiring part of the direct current wiring strip and the capacitor busbar is located on one side of the second direction in the plane where the mounting surface of the heat sink is located, and the extension direction of the part of the direct current wiring strip corresponding to the position of the direct current side switching device is perpendicular to the first direction and the second direction.
[0010] Technical solution three based on technical solution one: further comprising a capacitor busbar; in the switching device, the part connected to the capacitor busbar through the wiring component is a direct current side switching device, and the part connected to the alternating current side of the power assembly is an alternating current side switching device; in the wiring strip, the part connecting the direct current side switching device and the capacitor busbar is a direct current wiring strip, and the direct current wiring strip connects the corresponding wiring terminal on the direct current side switching device; the mounting surface of the heat sink is parallel to the capacitor busbar; the wiring part of the direct current wiring strip and the capacitor busbar is located at one end of the second direction in the plane where the mounting surface of the heat sink is located, and the extension direction of the part of the direct current wiring strip corresponding to the position of the direct current side switching device is parallel to the second direction.
[0011] The fourth technical solution based on the second or third technical solution: the DC side switching device and the AC side switching device cooperate to form a switching module, and multiple switching modules cooperate to form a single-phase switching tube group; in each single-phase switching tube group, the DC side switching device and the AC side switching device are arranged in the third direction in sequence, and the third direction is perpendicular to the first direction and the second direction.
[0012] The fifth technical solution based on the fourth technical solution: in each single-phase switching tube group, the DC side switching device and the AC side switching device are located on the same mounting surface, and each DC side switching device is located above the AC side switching device; in the fixing part of the heat sink, part is located above the DC side switching device, part is located between the DC side switching device and the AC side switching device, and part is located between adjacent AC side switching devices; and the second direction is parallel to the up-down direction of the power assembly.
[0013] The sixth technical solution based on the fourth technical solution: each switching module is divided into a part including only a DC side switching device and a part including a DC side switching device and an AC side switching device; the heat sink includes two opposite mounting surfaces, and any mounting surface includes only a part of the switching module; in the fixing part of the heat sink, part is located above the DC side switching device, and part is located between the DC side switching device and the AC side switching device; and the second direction is parallel to the up-down direction of the power assembly.
[0014] The seventh technical solution based on the fifth or sixth technical solution: in each switching module, two DC side switching devices and one AC side switching device are included; when the switching module is located on two mounting surfaces, the DC side switching device and the AC side switching device located on the same mounting surface correspond in the second direction, and the DC side switching devices located on different mounting surfaces correspond in the first direction; the DC side switching device and the AC side switching device located on different mounting surfaces are connected through a connecting row in the wiring component, and the connecting row penetrates the heat sink.
[0015] The eighth technical solution based on the seventh technical solution: in the wiring component, the DC wiring row includes multiple polar plates arranged in layers.
[0016] The ninth technical solution based on the eighth technical solution: in the DC wiring row, the polar plate farther from the wiring terminal of the switching device is connected to the corresponding wiring terminal through an electrical connector.
[0017] The tenth technical solution: a converter includes a main body and a power assembly according to any one of the first to ninth technical solutions, and the power assembly is fixedly installed in the main body; when the mounting surface is a horizontal plane, the second direction is a vertical direction; and when the mounting surface is a vertical plane, the first direction is a vertical direction.
[0018] From the above description of the present application, relative to the prior art, the present application has the following beneficial effects:
[0019] 1、The power assembly provided by the present application is provided with protruding fixing parts on the heat sink, and the wiring rows in the wiring components are locked and fixed on the heat sink through the fixing parts, so that the position of the wiring rows is fixed and not easy to shake during transportation or use, thereby avoiding the influence of the wiring rows on the switching device; in the power assembly, the switching device adopted has a switching body and a wiring terminal exposed on the switching body, the wiring row is connected to the wiring terminal, a semiconductor part and an elastic conductive part are arranged in the switching body, the semiconductor part is used to realize the basic function of the switching device, the elastic conductive part connects the wiring terminal and the semiconductor part and plays a stress buffering role to avoid the influence of the wiring terminal on the semiconductor part when the wiring terminal is stressed; the elastic conductive part is affected by the direction of its elastic deformation and can provide stress buffering in the first direction and the second direction; further, one of the first direction and the second direction is a vertical direction, so that when the switching device on the power assembly is in a vertical or lying state, even if the connection between the wiring row and the fixing part is detached or fails, the influence of the semiconductor part can be reduced through the stress buffering role of the elastic conductive part in the first direction and the second direction when the wiring row is stressed during wiring operation or under the action of gravity, thereby ensuring the use safety of the semiconductor part and improving the service life of the switching device.
[0020] 2、The power assembly includes a capacitor busbar, and the capacitor busbar is fixedly connected with the DC wiring row at a wiring position to play a certain positioning role on the wiring row; when the mounting surface of the heat sink is perpendicular to the capacitor busbar, the extension direction of the DC wiring row is perpendicular to the first direction and the second direction, and if the switching device is in a vertical posture at this time, the end of the DC wiring row will easily sag, but since the mounting posture of the switching device is limited, even if the end of the DC wiring row sags, the sagging direction is the second direction, and the elastic conductive part can buffer the stress in this direction.
[0021] 3、When the mounting surface of the heat sink is parallel to the capacitor busbar, the extension direction of the DC wiring row is parallel to the second direction, and if the switching device is in a vertical posture at this time, the DC wiring row is easy to move downward under the action of gravity, but at this time, the moving direction of the DC wiring row is the second direction, and the elastic conductive part can still buffer the stress in this direction; regardless of whether the mounting surface of the heat sink is perpendicular or parallel to the capacitor busbar, when the switching device is in a lying posture, the DC wiring row will have a tendency to move downward along the first direction, but this tendency can be buffered and offset by the elastic deformation of the elastic conductive part in the first direction, and will not affect the semiconductor part.
[0022] 4. Both DC-side and AC-side switching devices are arranged sequentially along the third direction, which is equivalent to arranging them perpendicular to the second direction. The switching devices are arranged side by side in the width direction, making the layout of the switching devices on the heat sink more compact and reducing the size of the power components.
[0023] 5. Placing both the DC-side and AC-side switching devices in a single-phase switchgear group on the same mounting surface facilitates the use of air-cooled heat sinks. However, liquid-cooled heat sinks can also adopt this layout, which can improve the heat dissipation efficiency of liquid-cooled heat sinks. When the switching devices are located on the same mounting surface, the DC-side switching devices are placed above the AC-side switching devices. Separating the two facilitates the installation and connection of wiring components. At the same time, setting fixing parts in multiple locations can improve the stability of the terminal block when installed on the heat sink.
[0024] 6. The switch module is divided into two parts, which are located on the two mounting surfaces of the heat sink. This improves the space utilization efficiency of the heat sink. At the same time, fixing parts are set in multiple positions to improve the stability of the terminal block when installed on the heat sink.
[0025] 7. A switching module includes two DC-side switching devices and one AC-side switching device. When the switching module consists of two separate parts, the two DC-side switching devices can be positioned on two mounting surfaces, and one AC-side switching device can be positioned below one of the mounting surfaces. The DC-side switching devices and AC-side switching devices on different mounting surfaces can be connected through the heat sink via the connecting strip in the wiring component. This improves the space utilization efficiency of the heat sink, shortens the commutation loop, and reduces stray inductance in the circuit.
[0026] 8. Stacking the plates in the DC terminal block facilitates the connection between the terminal block and the switching device, and also reduces stray inductance in parts of the circuit far from the capacitor busbar.
[0027] 9. Install electrical connectors to connect the terminals and corresponding plates of switching devices when there is a distance between them, thereby eliminating the influence of this distance on the wiring.
[0028] 10. The present invention provides a converter in which a power component is installed and fixed inside the main body of the converter. Regardless of whether the mounting surface is a horizontal plane or a vertical plane, the second direction or the first direction of the switching device can be configured to be vertical, that is, the switching device in the power component is in a lying position or in a vertical position. In these two positions, the elastic conductive element in the switching device can buffer the force exerted on the terminal block by the terminal block, so as to avoid affecting the semiconductor part in the switching device. Attached Figure Description
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiment description are briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0030] Figure 1 A schematic diagram of the existing power assembly in the background art;
[0031] Figure 2 A circuit diagram of the existing three-level topology in the background art;
[0032] Figure 3 A structural schematic diagram of the IGBT device in the existing power assembly in the background art;
[0033] Figure 4 A structural schematic of the power assembly provided by the embodiment 1 of the present application Figure 1 ;
[0034] Figure 5 A structural schematic of the power assembly provided by the embodiment 1 of the present application Figure 2 ;
[0035] Figure 6 A structural schematic diagram of the switching device in the power assembly provided by the embodiment 1 of the present application;
[0036] Figure 7 A structural schematic diagram of the internal structure of the switching device in the Figure 6 ;
[0037] Figure 8 A structural schematic diagram of the elastic conductive member in the switching device in the Figure 7 ;
[0038] Figure 9 A structural schematic of the power assembly provided by the embodiment 2 of the present application Figure 1 ;
[0039] Figure 10 A structural schematic of the power assembly provided by the embodiment 2 of the present application Figure 2 ;
[0040] Figure 11 A structural schematic of the power assembly provided by the embodiment 2 of the present application Figure 3 .
[0041] Main drawing mark explanation:
[0042] Capacitor module 10; DC capacitor bank 11; capacitor busbar 12;
[0043] Power module 20; unidirectional switch tube group 21; wiring component 22; DC wiring row 221; connection row 222; AC wiring row 223; radiator 23; fixing part 231; through hole 232; mounting surface 233; switch device 24; switch body 241; wiring terminal 242; DC side switch device 243; AC side switch device 244; semiconductor part 245; elastic conductive part 246. DETAILED DESCRIPTION
[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are preferred embodiments of the present application, and should not be regarded as exclusion of other embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0045] In the claims, the specification, and the above drawings of the present application, unless otherwise explicitly limited, the terms such as "first", "second", or "third" are used only to distinguish different objects, and are not used to describe a particular order.
[0046] In the claims, the specification, and the above drawings of the present application, unless otherwise explicitly limited, for orientation words, such as the terms "center", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "back", "left", "right", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation and position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, so it cannot be understood as limiting the specific protection scope of the present application.
[0047] In the claims, the specification, and the above drawings of the present application, unless otherwise explicitly limited, such as the terms "fixedly connected" or "fixedly connected", should be broadly understood as any connection mode between the two without displacement relationship and relative rotation relationship, that is, it includes non-detachable fixed connection, detachable fixed connection, integration and fixed connection through other devices or elements.
[0048] In the claims, the specification, and the above drawings of the present application, the terms "include", "have" and their variants are intended to mean "include but not limited to".
[0049] Example 1
[0050] Reference Figure 4 and Figure 5The power assembly mainly comprises a capacitor module and a power module, wherein the capacitor module comprises a direct-current capacitor bank 11 and a capacitor busbar 12, and the power module comprises a heat sink 23, a wiring component 22 and a plurality of switching devices 24.
[0051] Referring to Figure 4 , the first direction is the front-rear direction, the second direction is the up-down direction, and the third direction is the left-right direction.
[0052] Referring to Figure 4 , in the capacitor module, the main body is a vertical capacitor busbar 12, a plurality of capacitors are fixedly connected to the left surface of the capacitor busbar 12, and the capacitors form the direct-current capacitor bank 11; the lower end of the capacitor busbar 12 forms a terminal for connecting the direct-current side wiring of the power assembly; the wiring component 22 in the power module is connected to the capacitor busbar 12, and then the power module is connected to the alternating-current side wiring of the power assembly, so as to realize a complete loop of the power assembly.
[0053] In the capacitor module, the capacitors correspond to the capacitors C1 and C2 in Figure 2 . Meanwhile, the capacitor busbar 12 comprises three polar plates arranged in layers, which are arranged from left to right and are respectively a positive polar plate, a neutral polar plate and a negative polar plate.
[0054] In the power module, the heat sink 23 has a mounting surface 233, and a plurality of fixing portions 231 are protrudingly arranged on the mounting surface 233. Referring to Figure 4 and Figure 5 , in the embodiment, the heat sink 23 is a forced air cooling heat sink 23, the front surface thereof forms the mounting surface 233, and the rear surface is provided with heat dissipation fins. A plurality of fixing portions 231 are protrudingly arranged on the front mounting surface 233 of the heat sink 23, and the end portions of the fixing portions 231 form front supporting surfaces.
[0055] Referring to Figure 4 and Figure 5 , the wiring component 22 comprises a wiring busbar, and the wiring busbar is locked and fixed to the heat sink 23 through the fixing portions 231. The wiring busbar comprises a direct-current wiring busbar 221, a connecting busbar 222 and an alternating-current wiring busbar 223, the direct-current wiring busbar 221 is connected to the capacitor busbar 12 and the switching devices 24, the connecting busbar 222 is used for forming electrical connections between the switching devices 24, and the alternating-current wiring busbar 223 is connected to the switching devices 24 and the alternating-current side of the power assembly.
[0056] Referring to Figure 4 , the plurality of switching devices 24 are fixed to the mounting surface 233 of the heat sink 23. Referring to Figure 6The switch device 24 includes a switch body 241 and a plurality of terminal posts 242 exposed on the switch body 241. In this embodiment, the number of terminal posts 242 is three, and the three terminal posts 242 are arranged in the second direction in sequence. Referring to Figure 7 The switch body 241 is provided with a semiconductor part 245 and an elastic conductive part 246. The semiconductor part 245 is a semiconductor wafer of the switch device, which is easy to be damaged when subjected to certain stress. The elastic conductive part 246 connects the semiconductor part 245 and the terminal posts 242. Referring to Figure 7 and Figure 8 The elastic conductive part 246 has a wavy shape in the cross section in the front-rear direction. Therefore, the elastic conductive part 246 can provide elastic deformation in the first direction and the second direction, and does not provide elastic deformation in the third direction, i.e., the left-right direction. Thus, the elastic conductive part 246 is suitable for buffering the wiring stress of the terminal posts 242 to the semiconductor part 245 in the first direction and the second direction. In short, as an example in the direction shown in Figure 6 , the terminal posts 242 can be slightly pulled or pressed in the front-rear direction, or slightly pushed in the up-down direction. In these cases, the elastic conductive part 246 can use its own elastic deformation to reduce or eliminate the influence of the position change of the terminal posts 242 on the semiconductor part 245, while not affecting the electrical connection between the terminal posts 242 and the semiconductor part 245.
[0057] The terminal strip is electrically connected to the terminal posts 242 of the switch device 24, and is away from the mounting surface 233 of the switch body 241 of the switch device 24. That is, the terminal strip covers the switch device 24 to form a connection with the terminal posts 242.
[0058] Referring to Figure 4 and Figure 5 In the switch device 24, the part connected to the capacitor busbar 12 through the wiring part 22 is a direct current side switch device 243, and the part connected to the alternating current side of the power assembly is an alternating current side switch device 244. In the terminal strip, the part connecting the direct current side switch device 243 and the capacitor busbar 12 is a direct current terminal strip 221, and the direct current terminal strip 221 is connected to the corresponding terminal posts 242 of the direct current side switch device 243. In this embodiment, the mounting surface 233 of the heat sink 23 is perpendicular to the capacitor busbar 12. The wiring part of the direct current terminal strip 221 and the capacitor busbar is located on the second direction side in the plane where the mounting surface 233 of the heat sink 23 is located, and the extension direction of the part of the direct current terminal strip 221 corresponding to the position of the direct current side switch device 243 is perpendicular to the first direction and the second direction.
[0059] The DC side switching device 243 cooperates with the AC side switching device 244 to form a switching module, and multiple switching modules cooperate to form a single-phase switching tube group; in each single-phase switching tube group, the DC side switching device 243 and the AC side switching device 244 are arranged in the third direction in sequence.
[0060] Specifically, in the embodiment, each switching module includes two DC side switching devices 243 and one AC side switching device 244, four switching modules cooperate to form a single-phase switching tube group, and three single-phase switching tube groups correspond to three phases of the AC side respectively. Three heat sinks 23 are provided at the same time, and each heat sink 23 is installed with all switching devices 24 in a single-phase switching tube group. In a single-phase switching tube group, the DC side switching device 243 is located on the upper side of the mounting surface 233, the AC side switching device 244 is located on the lower side of the mounting surface 233, and the DC side switching device 243 and the AC side switching device 244 have a certain space, and the AC side switching devices 244 also have a certain space in the left-right direction. The fixing part 231 on the heat sink 23 is divided into three parts, one part is arranged above the DC side switching device 243, one part is arranged between the DC side switching device 243 and the AC side switching device 244, and one part is arranged between the AC side switching devices 244.
[0061] The wiring component 22 includes a DC wiring row 221, a connecting row 222, and an AC wiring row 223. The DC wiring row 221 corresponds to the three polar plates of the capacitor busbar 12 and also has three polar plates, which are arranged in layers and are connected to the corresponding wiring terminals 242 in the DC side switching device 243 respectively. Specifically, in a switching module, the two DC side switching devices 243 have six wiring terminals 242, of which the two wiring terminals 242 at the upper position of one DC side switching device 243 are connected to the positive plate and the neutral plate in the DC wiring row 221 respectively, and the two wiring terminals 242 at the upper position of the other DC side switching device 243 are connected to the negative plate and the neutral plate in the DC wiring row 221 respectively. In addition, the lowermost wiring terminal 242 of the two DC side switching devices 243 is connected to the connecting row 222, and the connecting row 222 is connected to the two wiring terminals 242 at the upper position of the corresponding AC side switching device 244 respectively. The AC wiring row 223 is connected to the wiring terminals 242 at the lower position of the AC side switching device 244. Among them, referring to Figure 5 , the connecting row 222 is arranged in layers with the DC wiring row 221, and is arranged in layers with the AC wiring row 223.
[0062] The DC wiring row 221 is locked and fixed with the fixed part 231 of the upper position and the middle position, and the connecting row 222 is locked and fixed with the fixed part 231 of the middle position and the lower position. In the embodiment, the left end of the DC wiring row 221 is connected and fixed with the capacitor busbar 12, and then the DC wiring row 221 extends to the right until the rightmost DC side switch device 243.
[0063] In the assembling of the power assembly, the switch device 24 is first installed and fixed in the vertical posture on the mounting surface 233 of the heat sink 23, then the wiring component 22 is attached on the support surface of the corresponding fixed part 231 and locked and fixed by the fastener, and finally the wiring component 22 is connected with the corresponding wiring terminal 242 on the switch device 24. Through the installation sequence, the excessive stress on the wiring terminal 242 on the switch device 24 caused by the locking and fixing of the wiring component 22 can be avoided. In the embodiment, the switch device 24 is fixed on the heat sink 23 in the vertical posture, so that even if the connection between the wiring component 22 and the fixed part 231 is loose, the downward movement of the wiring component 22 can be eliminated by the elastic deformation of the elastic conductive part 246 in the vertical direction, avoiding the influence on the semiconductor part 245.
[0064] Embodiment 2
[0065] Embodiment 2 is based on Embodiment 1, and the difference points between the two are described below.
[0066] In Embodiment 2, referring to Figure 11 , the mounting surface 233 of the heat sink 23 is parallel to the capacitor busbar 12, and the wiring part of the DC wiring row 221 and the capacitor busbar 12 is located at one end of the plane where the mounting surface 233 of the heat sink 23 is located in the second direction, and the extension direction of the part of the DC wiring row 221 corresponding to the position of the DC side switch device 243 is parallel to the second direction.
[0067] Referring to Figure 9 and Figure 10Each of the switch modules is divided into a part including only the DC side switching device 243 and a part including the DC side switching device 243 and the AC side switching device 244; the heat sink 23 includes two opposite mounting surfaces 233, either of which includes only a part of the switch modules; in the fixing part 231 of the heat sink 23, a part is located above the DC side switching device 243 and a part is located between the DC side switching device 243 and the AC side switching device 244. When the switch modules are located on the two mounting surfaces 233 respectively, the DC side switching device 243 and the AC side switching device 244 located on the same mounting surface 233 correspond in the second direction, and the DC side switching devices 243 located on different mounting surfaces 233 correspond in the first direction; the DC side switching device 243 and the AC side switching device 244 located on different mounting surfaces 233 are connected through the connecting row 222 in the wiring component 22, and the connecting row 222 penetrates the heat sink 23.
[0068] With reference to Figure 9 In this embodiment, the switching device 24 is also installed on the heat sink 23 in an upright posture, at this time the first direction is the front-back direction, the second direction is the up-down direction, and the third direction is the left-right direction.
[0069] The number of the heat sink 23 is one, and the three single-phase switch tube groups are all arranged on one heat sink 23. Each single-phase switch tube group includes four switch modules, in each of which one DC side switching device 243 is located on the front mounting surface 233, one DC side switching device 243 is located on the rear mounting surface 233, and the AC side switching device 244 is located on the front mounting surface 233 and below the corresponding DC side switching device 243. In the middle position of the heat sink 23, that is, the position between the DC side switching device 243 and the AC side switching device 244, a through hole 232 is arranged, with reference to Figure 10 The connecting row 222 penetrates the through hole 232 to connect the DC side switching device 243 on the rear mounting surface 233 and the AC side switching device 244 on the front mounting surface 233.
[0070] With reference to Figure 10 and Figure 11 In this embodiment, the wiring component 22 also includes a wiring column. The DC side switching device 243 located on the front mounting surface 233 is connected with the capacitor busbar 12 through the DC wiring row 221 arranged in layers, and the DC wiring row 221 here corresponds to the positive plate and the neutral plate; the DC side switching device 243 located on the rear mounting surface 233 is directly connected with the capacitor busbar 12 through the wiring column, which is divided into two kinds corresponding to the negative plate and the neutral plate.
[0071] In addition, in the embodiment, the electric connecting pieces are arranged. When the two polar plates of the DC connecting bar 221 are connected with the DC side switching device 243 on the front mounting surface 233, the polar plate far from the connecting terminal 242 of the switching device 24 is connected with the corresponding connecting terminal 242 through the electric connecting piece. Since the connecting terminal 242 protrudes from the switching body 241 with the same height, when the polar plate close to the switching device 24 is connected with the corresponding connecting terminal 242, there is a gap between the polar plate far from the switching device 24 and the corresponding connecting terminal 242. At this time, the gap is eliminated through the electric connecting piece, and the polar plate in the DC connecting bar 221 is connected with the corresponding connecting terminal 242.
[0072] Embodiment 3
[0073] The embodiment 3 of the application provides a converter, which comprises a main body and the power assembly in the embodiment 1 or the embodiment 2, the power assembly is fixedly installed in the main body, and the first direction is a vertical direction or the second direction is a vertical direction.
[0074] Specifically, in the converter, the power assembly can be installed in two postures. One posture is that the first direction is a vertical direction, that is, the heat sink 23 is installed in a lying posture, at this time, the switching device 24 on the heat sink 23 is also in a lying posture, and the connecting part 22 is located above the switching device 24, so that the protruding part can support the connecting part 22. The other posture is that the second direction is a vertical direction, that is, the heat sink 23 is installed in an upright posture, at this time, the switching device 24 on the heat sink 23 is also in an upright posture, and the connecting part 22 is located at the side of the switching device 24, and the direction of the gravity of the connecting part 22 is consistent with the second direction, that is, even if the connecting part 22 has a downward trend, the switching device 24 can buffer the stress of the connecting terminal 242 through the internal elastic conductive piece 246.
[0075] The above description and the embodiment are used to explain the protection scope of the application, but do not constitute the limitation of the protection scope of the application. Through the inspiration of the application or the above embodiment, the modification, equivalent replacement or other improvement of the embodiment of the application or one part of the technical features can be obtained by the ordinary skilled in the art combining with the common knowledge, the ordinary technical knowledge in the art and / or the prior art through the logical analysis, reasoning or limited test, and should be included in the protection scope of the application.
Claims
1. A power assembly, comprising: a heat sink (23) having a mounting surface (233) and a plurality of fixing portions (231) protruding from the mounting surface (233); a wiring member (22) including a wiring strip, the wiring strip being locked and fixed to the heat sink (23) through the fixing portions (231); and a plurality of switching devices (24) fixed to the mounting surface (233), the switching device (24) including a switching body (241) and a plurality of terminal pins (242) exposed from the switching body (241), the switching body (241) being provided with a semiconductor portion (245) and an elastic conductive member (246), the elastic conductive member (246) electrically connecting the semiconductor portion (245) and the terminal pin (242) and being defined with a first direction and a second direction perpendicular to each other according to a direction of elastic deformation thereof, the elastic conductive member (246) being adapted to buffer a wiring stress of the terminal pin (242) to the semiconductor portion (245) in the first direction and the second direction, the terminal pins (242) on the switching device (24) being arranged in sequence in the second direction, the first direction being perpendicular to the mounting surface (233); the wiring strip electrically connecting the terminal pins (242) on the switching device (24) and being away from the mounting surface (233) relative to the switching body (241) of the switching device (24), the first direction or the second direction being a vertical direction; further comprising a capacitor busbar (12); the switching device (24) being divided into a DC side switching device (243) connected to the capacitor busbar (12) through the wiring member (22) and an AC side switching device (244) connected to an AC side of the power assembly; the wiring strip being divided into a DC wiring strip (221) connecting the DC side switching device (243) and the capacitor busbar (12), the DC wiring strip (221) connecting corresponding terminal pins (242) on the DC side switching device (243); the mounting surface (233) of the heat sink (23) being perpendicular to the capacitor busbar (12), a wiring portion of the DC wiring strip (221) and the capacitor busbar (12) being located on one side of the second direction in a plane where the mounting surface (233) of the heat sink (23) is located, and an extension direction of a portion of the DC wiring strip (221) corresponding to a position where the DC side switching device (243) is located being perpendicular to the first direction and the second direction; or the mounting surface (233) of the heat sink (23) being parallel to the capacitor busbar (12), the wiring portion of the DC wiring strip (221) and the capacitor busbar (12) being located at one end of the second direction in the plane where the mounting surface (233) of the heat sink (23) is located, and the extension direction of the portion of the DC wiring strip (221) corresponding to the position where the DC side switching device (243) is located being parallel to the second direction. 2. A power pack as claimed in claim 1, characterised in that The direct current side switching device (243) and the alternating current side switching device (244) cooperate to form a switching module, and a plurality of switching modules cooperate to form a single-phase switching tube group; in each single-phase switching tube group, the direct current side switching device (243) and the alternating current side switching device (244) are arranged in the third direction in sequence, and the third direction is perpendicular to the first direction and the second direction.
3. A power pack as claimed in claim 2, characterised in that In each single-phase switching tube group, each of the direct current side switching device (243) and the alternating current side switching device (244) is located on the same mounting surface (233), and each of the direct current side switching device (243) is located above the alternating current side switching device (244); in the fixing portion (231) of the heat sink (23), part is located above the direct current side switching device (243), part is located between the direct current side switching device (243) and the alternating current side switching device (244), and part is located between adjacent alternating current side switching devices (244); the second direction is parallel to the up-down direction of the power assembly.
4. A power pack as claimed in claim 2, characterised in that Each of the switching modules is divided into a part including only the direct current side switching device (243) and a part including the direct current side switching device (243) and the alternating current side switching device (244); the heat sink (23) includes two opposite mounting surfaces (233), and any one of the mounting surfaces (233) includes only a part of the switching module; in the fixing portion (231) of the heat sink (23), part is located above the direct current side switching device (243), and part is located between the direct current side switching device (243) and the alternating current side switching device (244); the second direction is parallel to the up-down direction of the power assembly.
5. A power pack as claimed in claim 3 or 4, characterised in that, In each of the switching modules, two direct current side switching devices (243) and one alternating current side switching device (244) are included; when the switching modules are located on two mounting surfaces (233) respectively, the direct current side switching device (243) and the alternating current side switching device (244) located on the same mounting surface (233) correspond in the second direction, and the direct current side switching devices (243) located on different mounting surfaces (233) correspond in the first direction; the direct current side switching device (243) and the alternating current side switching device (244) located on different mounting surfaces (233) are connected through the connecting row (222) in the wiring component (22), and the connecting row (222) penetrates the heat sink (23).
6. A power pack as claimed in claim 5, characterised in that In the wiring component (22), the direct current wiring row (221) includes a plurality of stacked polar plates.
7. A power pack as claimed in claim 6, characterised in that In the direct current wiring row (221), the polar plate farther from the wiring terminal (242) of the switching device (24) is connected with the corresponding wiring terminal (242) through an electrical connector.
8. A current transformer characterized by The power assembly includes a main body and a power assembly as claimed in any one of claims 1-7, and the power assembly is fixedly installed in the main body; wherein, when the mounting surface is a horizontal plane, the second direction is a vertical direction; and when the mounting surface is a vertical plane, the first direction is a vertical direction.
Citation Information
Patent Citations
Stacked module, power assembly and converter device
CN112701934A
Wind energy converter and power module thereof
CN205336092U