A quartz boat heat treatment device

Abstract

The present invention discloses a quartz boat heat treatment device, which belongs to semiconductor processing. A quartz boat heat treatment device includes a heating chamber, a quartz boat for carrying wafers, and a heating mechanism for heating the quartz boat and the wafers; the quartz boat includes a connecting piece, two symmetrically arranged rotating halves rotatably mounted on the connecting piece; the rotating halves are provided with card slots at equal intervals; when the two rotating halves move to a position close to each other, the wafers on the quartz boat are coaxially arranged, and at this time, the interval between the two adjacent wafers on the quartz boat is a first distance; after the two rotating halves are separated, the two adjacent wafers on the quartz boat are located on different rotating halves. In this solution, the two rotating halves are separated, so that the wafers with odd and even digits are located on different rotating halves, increasing the distance between the wafers, allowing heat to enter between the wafers more conveniently, and improving the efficiency of wafer heat treatment.

Description

Technical Field

[0001] The present invention belongs to semiconductor processing, and more specifically, relates to a quartz boat heat treatment device. Background Art

[0002] Quartz boats are often used to carry wafers. Their high temperature resistance makes them suitable for heat treatment. Quartz boats have slots for placing wafers. When wafers are arranged on the quartz boat, they are closely distributed with small spacing. During the heat treatment process, heat will be hindered when entering between two wafers. If the wafers are too sparse on the quartz boat, it will be difficult to place more wafers on the quartz boat, affecting work efficiency. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a quartz boat heat treatment device, which can increase the interval between wafers and improve the heat treatment efficiency.

[0004] A quartz boat heat treatment device of the present invention comprises a heating chamber, a quartz boat for carrying wafers, and a heating mechanism for heating the quartz boat and the wafers; the quartz boat comprises a connecting piece and two symmetrically arranged rotating halves rotatably mounted on the connecting piece; the rotating halves are provided with card slots at equal intervals; when the two rotating halves move to a position close to each other, the wafers on the quartz boat are coaxially arranged, and at this time, the interval between the two adjacent wafers on the quartz boat is a first distance; after the two rotating halves are separated, the two adjacent wafers on the quartz boat are located on different rotating halves.

[0005] As a further improvement of the present invention, the heating mechanism includes a side plate fixed in the heating chamber and two clamping rods symmetrically sliding on the side plate for pressing against the wafer.

[0006] The side plate is provided with two tracks which slide with the clamping rods respectively; the tracks include a vertically arranged longitudinal slide groove and an arc-shaped arc groove which communicates with the longitudinal slide groove.

[0007] When the clamping rod is located in the arc groove, the clamping rod is pressed against the wafer and drives the wafer and the rotating half body to rotate.

[0008] As a further improvement of the present invention, the side wall of the clamping rod is equidistantly provided with a plurality of groups of containing grooves; the containing grooves include clamping grooves for pressing against the side wall of the wafer and avoidance grooves that do not contact the wafer.

[0009] As a further improvement of the present invention, the heating mechanism also includes a sliding frame that slides longitudinally on the side plate and a heating frame fixedly connected to the sliding frame; each of the clamping rods is slidably connected to the sliding frame in the horizontal direction; and a plurality of heating plates are evenly installed at the lower end of the heating frame.

[0010] As a further improvement of the present invention, the side wall of the heating plate is provided with an elastic push piece for pushing the wafer toward the rotating half body.

[0011] As a further improvement of the present invention, a limited rotation groove is arranged on the rotating half body; a limit plug plate is longitudinally slidably connected to the connecting member and can be plugged into the limited rotation groove to prevent the rotating half body from rotating; a lifting frame is installed in the heating chamber below the heating mechanism to drive the limit plug plate to separate from the limited rotation groove.

[0012] As a further improvement of the present invention, two feed screws are rotatably connected to the heating chamber below the quartz boat to drive the quartz boat to move; a semicircular threaded sleeve cooperating with the feed screw is provided at the lower end of the connecting piece.

[0013] As a further improvement of the present invention, a driving mechanism is installed in the heating chamber; the driving mechanism includes a motor and a driving gear slidably connected to an output shaft of the motor along an axis.

[0014] When the driving gear is located at the first position, the driving gear is connected to the feed screw in a transmission manner; when the driving gear is located at the second position, the driving gear is meshed with the heating gear, and the driving gear drives the clamping rod to move.

[0015] As a further improvement of the present invention, a feed door panel is installed on one side of the heating chamber, and a discharge door panel is installed on the other side; the driving mechanism also includes a switching plate for driving the driving gear to move; a spring is provided between the switching plate and the heating chamber to drive the switching plate and the discharge door panel to resist each other.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the two rotating halves of the present invention are separated, so that the wafers with odd and even positions are located on different rotating halves, the spacing between the wafers is increased, and heat can enter between the wafers more conveniently, thereby improving the efficiency of wafer heat treatment. In addition, the present invention improves efficiency by directly inserting the heating plate between the wafers to directly heat treat the wafer surface.

[0017] This solution controls the movement of the sliding frame so that the clamping rod can be pressed against the wafer and drive the wafer to move. It can also move the heating plate and insert the heating plate into the heating slot pair to perform heat treatment on the wafer.

[0018] In this solution, the heating plate can not only heat the wafer, but also generate thrust on the wafer through the elastic push plate, so that the wafer can move with the rotating half body.

[0019] This solution changes the position of the driving gear so that the motor can drive the feed screw to rotate, thereby moving the quartz boat in the heating chamber, and can also drive the sliding frame to move longitudinally, thereby facilitating heat treatment of the quartz boat and wafers. There is no need to install two motors, thus saving costs.

[0020] This solution facilitates the placement and removal of the quartz boat in the heating chamber by opening and closing the discharge door panel. The position of the drive gear can also be changed by cooperating with the switching plate so that the motor drives different components to work, thereby improving work efficiency, eliminating the need for additional electrical components, and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 The figure is a schematic diagram of the exploded structure of the quartz boat of the present invention;

[0023] Figure 3 It is a schematic diagram of the structure of the present invention after the two rotating halves are separated;

[0024] Figure 4 It is a schematic diagram of the exploded structure of the heating mechanism of the present invention.

[0025] Figure 5 It is a schematic diagram of the cross-sectional structure of the clamping rod of the present invention.

[0026] Figure 6 It is a schematic structural diagram of the quartz boat of the present invention when it is located in the heating mechanism.

[0027] Figure 7 It is a schematic diagram of the structure of heating the wafer and the quartz boat according to the present invention.

[0028] Figure 8 , Fig. 9 It is a structural schematic diagram of the driving mechanism of the present invention.

[0029] Description of the numbers in the figure:

[0030] 1. Heating chamber; 11. Feed door panel; 12. Discharge door panel; 13. Lifting frame; 2. Quartz boat; 21. Rotating half body; 211. Limiting groove; 212. Card slot; 213. Positioning rod; 22. Connector; 221. Threaded sleeve; 23. Limiting plug plate; 24. Wafer; 241. Heating groove; 3. Heating mechanism; 31. Side panel; 311. Longitudinal slide groove; 312. Arc groove; 32. Sliding frame; 33. Clamping rod; 331. Clamping groove; 332. Avoiding groove; 34. Heating frame; 35. Heating plate; 351. Elastic push piece; 4. Feed screw; 5. Driving mechanism; 51. Motor; 52. Driving gear; 53. Feed gear; 54. Heating gear; 55. Lifting screw; 56. Switching plate; 57. Spring. DETAILED DESCRIPTION

[0031] Specific embodiment 1: Please refer to Figure 1-Figure 9A quartz boat heat treatment device comprises a heating chamber 1, a quartz boat 2 for carrying wafers 24, and a heating mechanism 3 for heating the quartz boat 2 and the wafers 24; the quartz boat 2 comprises a connecting piece 22, two symmetrically arranged rotating halves 21 rotatably mounted on the connecting piece 22; the rotating halves 21 are provided with slots 212 at equal intervals; when the two rotating halves 21 move to a position close to each other, the wafers on the quartz boat 2 are coaxially arranged, and at this time, the interval between the two adjacent wafers on the quartz boat 2 is a first distance; after the two rotating halves 21 are separated, the two adjacent wafers 24 on the quartz boat 2 are located on different rotating halves 21, and at this time, the wafers on the quartz boat 2 will be divided into two groups distributed on the left and right, and the space between the wafers 24 on one rotating half 21 is a heating groove 241, and the width of the heating groove is twice the first distance.

[0032] The rotating shaft of the rotating half body 21 is arranged along the length direction of the quartz boat 2 .

[0033] The wafers 24 on the quartz boat 2 can be divided into two groups: odd-numbered bits and even-numbered bits. For example, the first and third wafers belong to odd-numbered bits, and the second and fourth wafers belong to even-numbered bits.

[0034] After the two rotating halves 21 are separated, the odd-numbered wafers are all located on the left rotating half 21 , and the even-numbered wafers are all located on the right rotating half 21 .

[0035] A torsion spring is provided between the rotating half body 21 and the connecting member 22 to drive the rotating half body 21 to return to its original position.

[0036] The heating mechanism 3 includes a side plate 31 fixed in the heating chamber 1 and two clamping rods 33 symmetrically sliding on the side plate 31 for pressing against the wafer 24 ; two positioning rods 213 are arranged on the rotating half body 21 ; and the clamping grooves 212 are evenly arranged on the positioning rods 213 .

[0037] The side plate 31 is provided with two tracks which slide with the clamping rod 33 respectively; the tracks include a vertically arranged longitudinal slide groove 311 and an arc-shaped arc groove 312 which communicates with the longitudinal slide groove 311 and is in a circular arc shape.

[0038] When the clamping rod 33 is located in the arc groove 312 , the clamping rod 33 is pressed against the wafer, and the clamping rod 33 and the two positioning plates 213 press and fix the wafer and the rotating half body, and drive the wafer and the rotating half body 21 to rotate.

[0039] There are two side plates 31 . When the quartz boat 2 is located in the heating mechanism 3 , the quartz boat 2 is located between the two side plates 31 . The arc groove 312 is coaxially arranged with the corresponding rotating half body 21 . One clamping rod 33 corresponds to one rotating half body 21 .

[0040] When the clamping rod 33 is located in the longitudinal slide groove 311 , the clamping rod 33 is located directly above each wafer and does not contact the wafer, so that the quartz boat 2 can drive the wafer into the heating mechanism 3 .

[0041] The side wall of the clamping rod 33 is equidistantly provided with a plurality of groups of containing grooves; the containing grooves include a clamping groove 331 for pressing against the side wall of the wafer 24 and an avoidance groove 332 that does not contact the wafer 24 .

[0042] The distance between the clamping groove 331 and the avoiding groove 332 is equal to the distance between two adjacent clamping grooves 212 .

[0043] When the clamping rod 33 is located in the arc groove 312, each clamping groove 331 on the left clamping rod 33 presses against the odd-numbered wafers 24, and each avoidance groove 332 is opposite to the even-numbered wafers, while each clamping groove 331 on the right clamping rod 33 presses against the even-numbered wafers, and each avoidance groove 332 is opposite to the odd-numbered wafers 24, so that the clamping rod fixes the odd-numbered wafers on the rotating half 21 on the left, and fixes the even-numbered wafers on the rotating half 21 on the right.

[0044] The heating mechanism 3 also includes a sliding frame 32 that slides longitudinally on the side plate 31 and a heating frame 34 that is fixedly connected to the sliding frame 32; each of the clamping rods 33 is slidably connected to the sliding frame 32 along the horizontal direction; and a plurality of heating plates 35 are evenly installed at the lower end of the heating frame 34.

[0045] The heating plates 35 on the heating rack 34 can be divided into two groups distributed on the left and right. The distance between two adjacent heating plates 35 in each group is equal to the width of the heating groove 241, and each heating plate 35 is located directly above the corresponding heating groove 241. When the rotating half bodies 21 move away from each other, the heating plates 35 are inserted into the heating grooves 241 for heating convenience.

[0046] The side wall of the heating plate 35 is provided with an elastic push piece 351 for pushing the wafer 24 toward the rotating half body 21 .

[0047] The elastic push piece 351 is made of a heat-resistant flexible material. When the heating rack 34 moves downward, the elastic push piece 351 abuts against the wafer 24. At this time, the elastic push piece 351 on the left heating plate 35 will push the even-numbered wafers to move to the right, so that the wafers rotate synchronously with the rotating half body on the right. Similarly, the elastic push piece on the right heating plate will push the odd-numbered wafers to move to the left, so that the wafers rotate synchronously with the rotating half body on the left.

[0048] A limited rotation groove 211 is provided on the rotating half body 21; a limit plug plate 23 is longitudinally slidably connected to the connecting member 22 and can be plugged into the limited rotation groove 211 to prevent the rotating half body 21 from rotating; a lifting frame 13 is installed in the heating chamber 1 below the heating mechanism 3 to drive the limit plug plate 23 to separate from the limited rotation groove 211.

[0049] The lower part of the limit plug plate 23 extends to below the connecting member 22 ; the upper end of the lifting frame 13 is provided with a lifting inclined surface for driving the limit plug plate 23 to move upward.

[0050] Two feed screws 4 are rotatably connected below the quartz boat 2 in the heating chamber 1 to drive the quartz boat 2 to move. A semicircular threaded sleeve 221 matching the feed screw 4 is disposed at the lower end of the connecting member 22 .

[0051] The threads on the two feed screws 4 rotate in opposite directions; a screw gear is coaxially arranged on the feed screw 4; the two screw gears mesh with each other; when the quartz boat 2 is placed in the heating chamber 1, the threaded sleeve 221 is placed on the feed screw 4, and the feed screw 4 rotates to drive the quartz boat 2 to move.

[0052] A driving mechanism 5 is installed in the heating chamber 1 ; the driving mechanism 5 comprises a motor 51 and a driving gear 52 slidably connected to the output shaft of the motor 51 along the axis; the driving gear 52 rotates synchronously with the output shaft of the motor 51 in the circumferential direction.

[0053] Four lifting screws 55 are rotatably connected in the heating chamber 1 to drive the corresponding sliding frames 32 to move longitudinally; the lifting screws 55 are connected to each other through a synchronous belt transmission; and a heating gear 54 is rotatably connected in the heating chamber to mesh with a lifting screw 55 for transmission.

[0054] A feed gear 53 is rotatably connected in the heating chamber to a feed screw 4 via a drive belt transmission.

[0055] When the driving gear 52 is located at the first position, the driving gear 52 is engaged with the feed gear 53, and the driving gear 52 is connected to the feed screw 4 by transmission; when the driving gear 52 is located at the second position, the driving gear 52 is engaged with the heating gear 54, and the driving gear 52 drives the sliding frame 32 to move longitudinally, and then the clamping rod 33 moves.

[0056] A feed door plate 11 is installed on one side of the heating chamber 1, and a discharge door plate 12 is installed on the other side; the driving mechanism 5 also includes a switching plate 56 for driving the driving gear 52 to move; a spring 57 is provided between the switching plate 56 and the heating chamber 1 to drive the switching plate 56 to resist the discharge door plate 12.

[0057] When the discharge door plate 12 is closed, the discharge door plate 12 pushes the switching plate 56 and the driving gear 52 to be located at the second position; when the discharge door plate 12 is opened, the switching plate 56 and the driving gear 52 are located at the first position.

[0058] In the initial state, the clamping rod 33 is located in the longitudinal slot 311 , and the heating plate 35 is located above the wafer 24 .

[0059] When in use, the feed door plate 11 and the discharge door plate 12 are first opened, and the switch plate 56 drives the drive gear 52 to move to the first position under the action of the spring 57, and the drive gear is meshed with the feed gear 53.

[0060] Place the quartz boat 2 with the wafer 24 from the feed door panel 11 onto the feed screw 4. Then the motor 51 starts working, driving the feed screw 4 to rotate, and the quartz boat 2 moves toward the heating mechanism 3. At the same time, the quartz boat 2 that has been heated last time leaves the heating mechanism 3 and moves toward the discharge door panel 12. Finally, the new quartz boat 2 moves into the heating mechanism 3, and at the same time, the lifting frame 13 pushes the limit plate 23 to move upward, and the limit plate 23 separates from the rotation limiting groove 211. The heated quartz boat 2 approaches the discharge door panel 12, and the limit plate 23 is plugged into the rotation limiting groove 211 under the action of its own gravity, and the rotating half 21 cannot rotate. Then, the heated quartz boat 2 is taken out from the heating chamber 1.

[0061] Then, the feed door plate 11 and the discharge door plate 12 are closed, and the discharge door plate 12 pushes the switching plate 56 to drive the driving gear 52 to move to the second position, and the driving gear 52 is meshed with the lifting screw 55 .

[0062] The motor 51 works, and each lifting screw 55 drives the sliding frame 32 to move downward, and then the clamping rod 33 moves from the longitudinal slide groove 311 to the arc groove 312. At this time, the clamping rod 33 on the left side presses the odd-numbered wafers, and the clamping rod 33 on the right side presses the even-numbered wafers. At the same time, the elastic push piece 351 on the left side of the heating plate 35 presses against the even-numbered wafers, and the even-numbered wafers have a tendency to move to the right. The elastic push piece 351 on the right side of the heating plate 35 presses against the odd-numbered wafers, and the odd-numbered wafers have a tendency to move to the left.

[0063] Then the sliding frame 32 continues to move downward, each clamping rod 33 moves along the arc groove 312, and each elastic push piece 351 pushes the corresponding wafer to move in the specified direction, so that the two rotating halves 21 separate from each other, and the odd-numbered wafers 24 move with the rotating half body 21 on the left, and the even-numbered wafers 24 move with the rotating half body 21 on the right, and at the same time, each heating plate 35 is inserted into the heating groove 241.

[0064] Finally, the two rotating halves 21 move to positions away from each other, and at this time, the wafers at odd positions and the wafers at even positions do not overlap each other.

[0065] Then the heating plate 35 starts working to heat the wafer 24. After the heat treatment of the wafer is completed, the heating plate 35 stops working, the motor 51 works in the reverse direction, the sliding frame 32 moves upward, and the clamping rod 33 pushes the wafer 24 upward, thereby reducing the pressure of the wafer on the rotating half body 21, so that the rotating half body 21 rotates upward and resets under the action of the torsion spring. Finally, the two rotating half bodies 21 approach each other, the clamping rod 33 moves into the longitudinal slide groove 311, and the heating plate 35 is located above the wafer.

[0066] The feeding door plate 11 and the discharging door plate 12 are opened, and a new quartz boat is replaced. The above process is repeated to continuously heat-treat the quartz boat 2 and the wafer 24 .

Claims

1. A quartz boat heat treatment device, characterized in that: The invention comprises a heating chamber (1), a quartz boat (2) for carrying wafers (24), and a heating mechanism (3) for heating the quartz boat (2) and the wafers (24); the quartz boat (2) comprises a connecting member (22), and two symmetrically arranged rotating halves (21) rotatably mounted on the connecting member (22); the rotating halves (21) are provided with slots (212) at equal intervals; when the two rotating halves (21) move to a position close to each other, the wafers on the quartz boat (2) are coaxially arranged, and at this time, the interval between two adjacent wafers on the quartz boat (2) is a first distance; after the two rotating halves (21) are separated, the two adjacent wafers (24) on the quartz boat (2) are located on different rotating halves (21); The heating mechanism (3) comprises a side plate (31) fixed in the heating chamber (1), and two clamping rods (33) symmetrically sliding on the side plate (31) and used for pressing against the wafer (24); The side plate (31) is provided with two tracks that slide with the clamping rod (33) respectively; the tracks include a vertically arranged longitudinal slide groove (311) and an arc-shaped arc groove (312) that communicates with the longitudinal slide groove (311); When the clamping rod (33) is located in the arc-shaped groove (312), the clamping rod (33) is pressed against the wafer and drives the wafer and the rotating half body (21) to rotate; The heating mechanism (3) further comprises a sliding frame (32) that slides longitudinally on the side plate (31), and a heating frame (34) that is fixedly connected to the sliding frame (32); each of the clamping rods (33) is slidably connected to the sliding frame (32) in a horizontal direction; and a plurality of heating plates (35) are evenly mounted on the lower end of the heating frame (34).

2. A quartz boat heat treatment device according to claim 1, characterized in that: The side wall of the clamping rod (33) is provided with a plurality of groups of containing grooves at equal intervals; the containing grooves include a clamping groove (331) for pressing against the side wall of the wafer (24) and an avoidance groove (332) that does not contact the wafer (24).

3. A quartz boat heat treatment device according to claim 1, characterized in that: The side wall of the heating plate (35) is provided with an elastic push piece (351) for pushing the wafer (24) towards the rotating half body (21).

4. The quartz boat heat treatment device according to claim 1, characterized in that: The rotating half body (21) is provided with a limited rotation groove (211); the connecting member (22) is longitudinally slidably connected with a limit plug plate (23) capable of plugging into the limited rotation groove (211) to prevent the rotating half body (21) from rotating; and a lifting frame (13) for driving the limit plug plate (23) to separate from the limited rotation groove (211) is installed below the heating mechanism (3) in the heating chamber (1).

5. The quartz boat heat treatment device according to claim 1, characterized in that: Two feed screws (4) are rotatably connected to the heating chamber (1) below the quartz boat (2) and drive the quartz boat (2) to move; a semicircular threaded sleeve (221) cooperating with the feed screws (4) is provided at the lower end of the connecting piece (22).

6. A quartz boat heat treatment device according to claim 5, characterized in that: A driving mechanism (5) is installed in the heating chamber (1); the driving mechanism (5) comprises a motor (51) and a driving gear (52) slidably connected to an output shaft of the motor (51) along an axis; When the driving gear (52) is located at the first position, the driving gear (52) is in transmission connection with the feed screw (4); when the driving gear (52) is located at the second position, the driving gear (52) is meshed with the heating gear (54), and the driving gear (52) drives the clamping rod (33) to move.

7. A quartz boat heat treatment device according to claim 6, characterized in that: A feed door plate (11) is installed on one side of the heating chamber (1), and a discharge door plate (12) is installed on the other side; the driving mechanism (5) further comprises a switching plate (56) for driving the driving gear (52) to move; and a spring (57) is provided between the switching plate (56) and the heating chamber (1) for driving the switching plate (56) to abut against the discharge door plate (12).

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