Wafer slice etching equipment and method

Abstract

The invention discloses wafer slice etching equipment and a wafer slice etching method, and relates to the technical field of wafer etching. The device comprises an etching machine table and a machine base, the machine base is fixedly arranged on the lower surface of the etching machine table, an equipment cover is arranged on the upper surface of the etching machine table, and an electric sliding rail is fixedly arranged on the upper surface of the etching machine table; according to the wafer cleaning device, the device cover is driven to move to the position above the cleaning tank, the lifting cleaning mechanism drives the multiple wafers to make contact with cleaning liquid or be separated continuously, the swing cleaning mechanism drives the multiple wafers to swing in a reciprocating mode, swing cleaning is conducted on the multiple wafers, and therefore lifting and swing cleaning of the wafers is conveniently achieved; the cleaning effect and the cleaning efficiency of the wafer are effectively improved; in the wafer cleaning process, the cleaning liquid around the cleaning tank is lifted and stirred through the stirring and cleaning mechanism, so that the cleaning liquid moves, the condition of precipitation is avoided, stirring of the cleaning liquid in the wafer cleaning process is conveniently achieved, and the wafer cleaning effect is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer etching, and particularly to a wafer slicing etching device and method. Background Art

[0002] Wafer etching is a technology that removes some materials by using chemical reactions or physical impacts. Etching technology can be divided into two categories: wet etching and dry etching;

[0003] Among them, wet etching is a pure chemical reaction. Chemical reagents are used to react with the etched material to generate soluble substances or volatile substances. The selected etching solution should have the ability to evenly remove the surface layer of the wafer without damaging the next layer of material. Its general steps are generally as follows: Immerse the wafer in the etching tank of the etching machine. The etching tank is filled with the etching solution. After a certain period of time, it is sent to the cleaning equipment to remove the residual pollutants, and then sent to the drying equipment for drying;

[0004] Although the etching machines in the prior art have functions such as wet etching, cleaning, and drying, there are still some defects in the process of wafer cleaning:

[0005] In the process of wafer cleaning, most of the etching machines in the prior art use ultrasonic waves to slightly vibrate the cleaning solution to achieve the purpose of cleaning. However, such a cleaning method cannot fully clean the pollutants remaining on the wafer. At the same time, the cleaning method using ultrasonic vibration requires a long cleaning time, resulting in poor cleaning effect of the wafer and low cleaning efficiency.

[0006] In view of the above problems, the inventor proposes a wafer slicing etching device and method to solve the above problems. Summary of the Invention

[0007] In order to solve the above problems; the purpose of the present invention is to provide a wafer slicing etching device and method.

[0008] To solve the above technical problems, the present invention adopts the following technical solution: A wafer slicing etching device includes an etching machine table and a machine base. The machine base is fixedly arranged on the lower surface of the etching machine table. An equipment cover is arranged on the upper surface of the etching machine table. An electric slide rail is fixedly arranged on the upper surface of the etching machine table. One end of the electric slide rail is slidably provided with a slider. One side of the slider is fixedly connected to one side of the equipment cover;

[0009] A sealing ring is fixedly arranged at the lower end of the equipment cover. The lower surface of the sealing ring is in movable contact with the upper surface of the etching machine table;

[0010] An etching tank, a cleaning tank, and a drying tank are respectively fixedly arranged on the machine base. A fixing component, a lifting cleaning mechanism, a swinging cleaning mechanism, and a stirring cleaning mechanism are respectively arranged in the equipment cover.

[0011] Preferably, a first liquid inlet pipe is fixedly arranged at the upper end of the etching tank, a first liquid discharge pipe is fixedly arranged at the bottom of the etching tank, a second liquid inlet pipe is fixedly arranged at the upper end of the cleaning tank, and a second liquid discharge pipe is fixedly arranged at the bottom of the cleaning tank.

[0012] Preferably, the fixing assembly includes two fixing plates. A semi-circular supporting plate is fixedly arranged between the two fixing plates. A plurality of liquid inlet grooves are arranged in an annular array on the semi-circular supporting plate. A plurality of limiting retaining rings are fixedly arranged at equal intervals on the inner wall of the semi-circular supporting plate. Rubber pads are fixedly arranged on both sides of the plurality of limiting retaining rings.

[0013] Preferably, the lifting and cleaning mechanism includes two L-shaped frame plates. The two L-shaped frame plates are symmetrically fixedly arranged on the side wall of the equipment cover. Guide grooves are arranged on both of the two L-shaped frame plates. Guide blocks are slidably arranged at one end of the two guide grooves. Rotating shafts are rotatably installed on the opposite sides of the two guide blocks. A U-shaped fixing frame is fixedly arranged between the two rotating shafts. The two fixing plates are fixedly arranged at one end of the U-shaped fixing frame;

[0014] Reciprocating lead screws are rotatably installed on one side of the two L-shaped frame plates. Connecting shafts are fixedly arranged on one side of the two guide blocks. Moving blocks are rotatably installed at one end of the two connecting shafts. The moving blocks are in movable contact with the thread groove walls of the reciprocating lead screws.

[0015] Preferably, a motor is fixedly arranged at one end of the equipment cover. A first rotating rod is fixedly arranged at the driving output end of the motor. Transmission gears are fixedly arranged at one end of the first rotating rod and one end of one of the reciprocating lead screws. The two transmission gears are meshed and connected. Synchronous wheels are fixedly arranged at one end of the first rotating rod and one end of the other reciprocating lead screw. A synchronous belt is installed in a transmission manner between the two synchronous wheels.

[0016] Preferably, the swinging cleaning mechanism includes a rotating shaft. First fixing rods are fixedly arranged on the opposite sides of the two guide blocks. The rotating shaft is rotatably connected to the ends of the two first fixing rods. A driving handle is fixedly arranged at one end of the rotating shaft. A push-pull shaft is fixedly arranged at one end of the driving handle. A connecting groove is arranged on the upper end surface of the U-shaped fixing frame. One end of the push-pull shaft is in movable contact with one end of the connecting groove.

[0017] Preferably, a second rotating rod is rotatably installed on one side of one of the guide blocks. Bevel gears are fixedly arranged at one end of the second rotating rod and the middle of the rotating shaft. The two bevel gears are meshed with each other. A driving gear is fixedly arranged at the other end of the second rotating rod. A toothed plate is fixedly arranged on the other side of one of the L-shaped frame plates. The driving gear is meshed and connected with the toothed plate.

[0018] Preferably, the stirring and cleaning mechanism includes a stirring shaft. There are four stirring shafts. At one end of each of the two first fixing rods, two second fixing rods are fixedly arranged. The ends of the stirring shafts are rotatably connected to the second fixing rods. At one end of each of the four stirring shafts, a plurality of stirring paddles are fixedly arranged.

[0019] Preferably, at the other end of each of the four stirring shafts, a first transmission wheel is fixedly arranged. Between adjacent two of the first transmission wheels, a first transmission belt is installed for transmission. At the other end of the rotating shaft and at the other end of one of the stirring shafts, a second transmission wheel is fixedly arranged. Between the two second transmission wheels, a second transmission belt is installed for transmission. At the other end of the rotating shaft and at the other end of the other stirring shaft, a third transmission wheel is fixedly arranged. Between the two third transmission wheels, a third transmission belt is installed for transmission.

[0020] The present invention also provides a method for a wafer slicing and etching device, including the following steps:

[0021] S1. By adding an etching solution into the etching tank, inserting a plurality of wafers one by one between two adjacent limiting retaining rings, and driving the semi-circular supporting plate to vertically descend through the lifting and cleaning mechanism, the plurality of wafers in the semi-circular supporting plate synchronously descend into the etching tank and are immersed in the etching solution, and wet etching is performed in the etching solution.

[0022] S2. By driving the equipment cover to move above the cleaning tank through the electric slide rail and the slider, driving the plurality of wafers to continuously contact or separate from the cleaning liquid through the lifting and cleaning mechanism, driving the plurality of wafers to reciprocally swing through the swinging cleaning mechanism, performing swinging cleaning on the plurality of wafers, and at the same time, driving the cleaning liquid around the cleaning tank to lift and stir through the stirring and cleaning mechanism to make the cleaning liquid move and avoid precipitation.

[0023] S3. By driving the equipment cover to move above the drying tank through the electric slide rail and the slider, driving the plurality of wafers to vertically descend into the drying tank through the lifting and cleaning mechanism, and drying the plurality of wafers after cleaning in the drying tank.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] 1. In the present invention, by driving the equipment cover to move above the cleaning tank, driving the plurality of wafers to continuously contact or separate from the cleaning liquid through the lifting and cleaning mechanism, and driving the plurality of wafers to reciprocally swing through the swinging cleaning mechanism, swinging cleaning of the plurality of wafers is conveniently realized, thereby effectively improving the cleaning effect and cleaning efficiency of the wafers.

[0026] 2. In the present invention, during the process of wafer cleaning, the cleaning liquid around the cleaning tank is lifted and stirred by the stirring cleaning mechanism, so that the cleaning liquid moves, avoiding precipitation, thus conveniently realizing the stirring of the cleaning liquid during the wafer cleaning process and further improving the cleaning effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a schematic diagram of the overall structure of a wafer slicing and etching device of the present invention.

[0029] Figure 2 It is another schematic diagram of the overall structure of a wafer slicing and etching device of the present invention.

[0030] Figure 3 It is a schematic diagram of the sectional structure of the device cover of the present invention.

[0031] Figure 4 It is a schematic diagram of the sectional structure of the device cover and the cleaning tank of the present invention.

[0032] Figure 5 It is a schematic diagram of the structure of the fixing component of the present invention.

[0033] Figure 6 It is a schematic diagram of the structures of the lifting cleaning mechanism, the swinging cleaning mechanism and the stirring cleaning mechanism of the present invention.

[0034] Figure 7 It is a schematic diagram of the connection structure between the lifting cleaning mechanism and the swinging cleaning mechanism and the fixing component of the present invention.

[0035] Figure 8 It is a schematic diagram of the connection structure between the stirring cleaning mechanism and the swinging cleaning mechanism and the fixing component of the present invention.

[0036] Figure 9 It is a schematic diagram of the connection structure between the guiding block and the reciprocating lead screw of the present invention.

[0037] In the figure: 1. Etching machine; 11. Machine base; 12. Equipment cover; 13. Sealing ring; 15. Electric slide rail; 16. Slide block; 2. Etching tank; 21. First liquid inlet pipe; 22. First liquid discharge pipe; 3. Cleaning tank; 31. Second liquid inlet pipe; 32. Second liquid discharge pipe; 4. Drying tank; 5. Fixing component; 51. Fixing plate; 52. Semi-circular supporting plate; 53. Liquid inlet groove; 54. Limit retaining ring; 55. Rubber pad; 6. Lifting and cleaning mechanism; 61. L-shaped frame plate; 62. Guide groove; 63. Guide block; 64. Reciprocating lead screw; 65. Connecting shaft; 66. Moving block; 67. Rotating shaft; 68. U-shaped fixing frame; 69. Motor; 7. First rotating rod; 71. Driving gear; 72. Synchronous pulley; 73. Synchronous belt; 8. Oscillating cleaning mechanism; 81. Rotating shaft; 82. First fixing rod; 83. Driving handle; 84. Push-pull shaft; 85. Connecting groove; 86. Second rotating rod; 87. Bevel gear; 88. Driving gear; 89. Rack; 9. Stirring cleaning mechanism; 91. Stirring shaft; 92. Second fixing rod; 93. Stirring paddle; 94. First transmission wheel; 95. First transmission belt; 96. Second transmission wheel; 97. Second transmission belt; 98. Third transmission wheel; 99. Third transmission belt. Detailed implementation mode

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] Embodiment: As Figures 1-9 shown, the present invention provides a wafer slicing and etching device, including an etching machine 1 and a machine base 11. The machine base 11 is fixedly arranged on the lower surface of the etching machine 1. An equipment cover 12 is arranged on the upper surface of the etching machine 1. A door panel is hingedly installed on the front side of the equipment cover 12. An electric slide rail 15 is fixedly arranged on the upper surface of the etching machine 1. One end of the electric slide rail 15 is slidably provided with a slide block 16. When the electric slide rail 15 operates, it drives the slide block 16 to slide horizontally on the electric slide rail 15, so that the equipment cover 12 follows and moves horizontally synchronously. One side of the slide block 16 is fixedly connected to one side of the equipment cover 12;

[0040] A sealing ring 13 is fixedly arranged at the lower end of the equipment cover 12. The lower surface of the sealing ring 13 is in movable contact with the upper surface of the etching machine 1. By setting the sealing ring 13, the sealing ring 13 can improve the sealing performance between the equipment cover 12 and the upper surface of the etching machine 1, and avoid the overflow of the etching solution for wet etching and the cleaning solution during the cleaning process;

[0041] An etching tank 2, a cleaning tank 3 and a drying tank 4 are respectively and fixedly arranged on the machine base 11. A first liquid inlet pipe 21 is fixedly arranged at the upper end of the etching tank 2, and a first liquid discharge pipe 22 is fixedly arranged at the bottom of the etching tank 2. By providing the first liquid inlet pipe 21 and the first liquid discharge pipe 22, the etching solution in the wet etching process can enter the etching tank 2 through the first liquid inlet pipe 21, and the etching solution in the etching tank 2 can be discharged out through the first liquid discharge pipe 22. A second liquid inlet pipe 31 is fixedly arranged at the upper end of the cleaning tank 3, and a second liquid discharge pipe 32 is fixedly arranged at the bottom of the cleaning tank 3. By providing the second liquid inlet pipe 31 and the second liquid discharge pipe 32, the cleaning solution in the wafer cleaning process can enter the cleaning tank 3 through the second liquid inlet pipe 31, and the cleaning solution in the cleaning tank 3 can be discharged out through the second liquid discharge pipe 32. A dryer is assembled at the bottom of the drying tank 4. By providing the dryer, after the cleaned wafer enters the interior of the drying tank 4, the operation of the dryer can dry the cleaned wafer. A fixing component 5, a lifting cleaning mechanism 6, a swinging cleaning mechanism 8 and a stirring cleaning mechanism 9 are respectively arranged in the equipment cover 12. By providing the fixing component 5, the fixing component 5 can facilitate the operator to place multiple wafers to be etched, and at the same time can place the multiple wafers separately to avoid the wafers contacting each other, thereby improving the etching effect and cleaning effect of the wafers. By providing the lifting cleaning mechanism 6, the swinging cleaning mechanism 8 and the stirring cleaning mechanism 9, when the equipment cover 12 is located above the cleaning tank 3, the lifting cleaning mechanism 6 can make the wafer vertically descend into the cleaning tank 3 through the fixing component 5 for lifting and cleaning in the cleaning tank 3. The swinging cleaning mechanism 8 can make the multiple wafers swing reciprocally during the cleaning process through the fixing component 5, and the stirring cleaning mechanism 9 can stir the cleaning solution in the cleaning tank 3 to fully mix the configured cleaning solution and avoid precipitation, thereby improving the cleaning effect and cleaning efficiency of the wafers.

[0042] The fixing component 5 includes two fixing disks 51. A semi-circular supporting plate 52 is fixedly arranged between the two fixing disks 51. Multiple wafers to be etched can be placed in the semi-circular supporting plate 52. A plurality of liquid inlet grooves 53 distributed in a circular array are formed on the semi-circular supporting plate 52. By providing the liquid inlet grooves 53, the etching solution in the etching process and the cleaning solution in the cleaning process can contact the wafers through the liquid inlet grooves 53. A plurality of limiting retaining rings 54 are fixedly arranged on the inner wall of the semi-circular supporting plate 52 at equal intervals. Rubber pads 55 are fixedly arranged on both sides of the plurality of limiting retaining rings 54. By providing the limiting retaining rings 54 and the rubber pads 55, after the wafer is vertically inserted between the two limiting retaining rings 54, the side surface of the wafer contacts the rubber pads 55. During the insertion process, the wafer squeezes the rubber pads 55 to deform, so that the wafer is fixed between the two limiting retaining rings 54 in an interference fit manner.

[0043] The lifting and cleaning mechanism 6 includes two L-shaped frame plates 61, which are symmetrically and fixedly arranged on the side wall of the equipment cover 12. Guide grooves 62 are formed on both of the two L-shaped frame plates 61. Guide blocks 63 are slidably arranged at one end of each of the two guide grooves 62. Rotating shafts 67 are rotatably installed on the opposite sides of the two guide blocks 63. A U-shaped fixing frame 68 is fixedly arranged between the two rotating shafts 67. Two fixing disks 51 are fixedly arranged at one end of the U-shaped fixing frame 68. By driving the guide blocks 63 to slide vertically in the guide grooves 62, the guide blocks 63 can make the fixing assembly 5 lift and lower vertically through the rotating shafts 67 and the U-shaped fixing frame 68, so that the placed wafers can be lifted and lowered synchronously;

[0044] One side of each of the two L-shaped frame plates 61 is rotatably installed with a reciprocating lead screw 64. One end of each of two connecting shafts 65 is fixedly arranged on one side of each of the two guide blocks 63. One end of each of the two connecting shafts 65 is rotatably installed with a moving block 66. The moving block 66 is in movable contact with the thread groove wall of the reciprocating lead screw 64. By driving the reciprocating lead screw 64 to rotate, the rotation of the reciprocating lead screw 64 can make the moving block 66 move in a single thread groove (there are two mirror-image thread grooves on the reciprocating lead screw 64). When the moving block 66 moves to the end of a single thread groove, the moving block 66 rotates itself into another thread groove, so that the moving block 66 keeps reciprocating up and down. The moving block 66 makes the guide block 63 slide reciprocally in the guide groove 62 through the connecting shaft 65.

[0045] A motor 69 is fixedly arranged at one end of the equipment cover 12. A first rotating rod 7 is fixedly arranged at the driving output end of the motor 69. Transmission gears 71 are fixedly arranged at one end of the first rotating rod 7 and one end of one of the reciprocating lead screws 64 respectively. The two transmission gears 71 are meshed and connected. Synchronous wheels 72 are fixedly arranged at one end of the first rotating rod 7 and one end of the other reciprocating lead screw 64 respectively. A synchronous belt 73 is installed for transmission between the two synchronous wheels 72. By starting the motor 69, the driving shaft of the motor 69 can make the first rotating rod 7 rotate. The first rotating rod 7 can make one reciprocating lead screw 64 rotate synchronously and reversely through the meshing of the two transmission gears 71. The first rotating rod 7 can make the other reciprocating lead screw 64 rotate synchronously and in the same direction through the two synchronous wheels 72 and the synchronous belt 73, so that the two reciprocating lead screws 64 rotate synchronously and reversely, and the two moving blocks 66 keep rising or falling synchronously.

[0046] The swing cleaning mechanism 8 includes a rotating shaft 81. One end of each of two guiding blocks 63 is fixedly provided with a first fixing rod 82. The rotating shaft 81 is rotatably connected to the ends of the two first fixing rods 82. One end of the rotating shaft 81 is fixedly provided with a driving handle 83, and one end of the driving handle 83 is fixedly provided with a push-pull shaft 84. A connecting groove 85 is formed on the upper end surface of the U-shaped fixing bracket 68. One end of the push-pull shaft 84 is in movable contact with one end of the connecting groove 85. By providing the first fixing rod 82, the first fixing rod 82 and the rotating shaft 81 can slide up and down synchronously with the guiding block 63. By driving the rotation of the rotating shaft 81, the rotating shaft 81 can make the push-pull shaft 84 revolve around the axis of the rotating shaft 81 through the driving handle 83. The position of the push-pull shaft 84 changes in the connecting groove 85, and through the connecting groove 85, the U-shaped fixing bracket 68 swings reciprocally around the axis of the rotating shaft 67, so that the wafer swings reciprocally.

[0047] One side of one of the guiding blocks 63 is rotatably installed with a second rotating rod 86. One end of the second rotating rod 86 and the middle part of the rotating shaft 81 are both fixedly provided with bevel gears 87. The two bevel gears 87 mesh with each other. The other end of the second rotating rod 86 is fixedly provided with a driving gear 88. The other side of one of the L-shaped frame plates 61 is fixedly provided with a toothed plate 89. The driving gear 88 is meshed with the toothed plate 89. The second rotating rod 86 can slide up and down synchronously with the guiding block 63. Under the action of the driving gear 88 and the toothed plate 89, the driving gear 88 rotates self, so that the second rotating rod 86 rotates synchronously. The second rotating rod 86 can make the rotating shaft 81 rotate through the bevel gear 87.

[0048] The stirring cleaning mechanism 9 includes a stirring shaft 91. Four stirring shafts 91 are provided. One end of each of the two first fixing rods 82 is fixedly provided with two second fixing rods 92. The stirring shaft 91 is rotatably connected to the ends of the second fixing rods 92. One end of each of the four stirring shafts 91 is fixedly provided with a number of stirring paddles 93. By driving the rotation of the four stirring shafts 91, the stirring shaft 91 can make the stirring paddles 93 rotate. The four stirring paddles 93 can stir the cleaning liquid around the cleaning tank 3, so that the cleaning liquid moves and the situation of precipitation is avoided.

[0049] One end of each of the four stirring shafts 91 is fixedly provided with a first driving wheel 94. A first transmission belt 95 is installed between every two adjacent first driving wheels 94 in a transmission manner. One end of the rotating shaft 81 and one end of one of the stirring shafts 91 are both fixedly provided with a second driving wheel 96. A second transmission belt 97 is installed between the two second driving wheels 96 in a transmission manner. One end of the rotating shaft 81 and one end of the other stirring shaft 91 are both fixedly provided with a third driving wheel 98. A third transmission belt 99 is installed between the two third driving wheels 98 in a transmission manner. When the rotating shaft 81 rotates, the rotating shaft 81 can make the four stirring shafts 91 rotate synchronously through the two second driving wheels 96, the second transmission belt 97, the two third driving wheels 98 and the third transmission belt 99, the four first driving wheels 94 and the first transmission belt 95.

[0050] The present invention also provides a method for a wafer slicing and etching device, comprising the following steps:

[0051] S1. By adding an etching solution into the etching tank 2, inserting multiple wafers one by one between two adjacent limiting retaining rings 54, and driving the semi-circular supporting plate 52 to vertically descend through the lifting and cleaning mechanism 6, the multiple wafers in the semi-circular supporting plate 52 descend synchronously into the etching tank 2 and are immersed in the etching solution, and wet etching is performed in the etching solution;

[0052] S2. By driving the device cover 12 to move above the cleaning tank 3 through the electric slide rail 15 and the slider 16, driving the multiple wafers to continuously contact or separate from the cleaning liquid through the lifting and cleaning mechanism 6, driving the multiple wafers to reciprocally swing through the swinging cleaning mechanism 8, performing swinging cleaning on the multiple wafers, and at the same time, driving the cleaning liquid around the cleaning tank 3 to lift and stir through the stirring and cleaning mechanism 9 to make the cleaning liquid move and avoid precipitation;

[0053] S3. By driving the device cover 12 to move above the drying tank 4 through the electric slide rail 15 and the slider 16, driving the multiple wafers to vertically descend into the drying tank 4 through the lifting and cleaning mechanism 6, and drying the multiple wafers after cleaning in the drying tank 4.

[0054] Working principle: During the wet etching process of the wafer, the operator first injects the etching solution into the etching tank 2 through the first liquid inlet pipe 21, and then opens the door panel on the front side of the device cover 12, and inserts a batch of wafers one by one between two adjacent limiting retaining rings 54. During the insertion process, the wafer squeezes the rubber pad 55 to deform, and the wafer is fixed between the two limiting retaining rings 54 in an interference fit manner;

[0055] Subsequently, the operator turns on the motor 69. The drive shaft of the motor 69 causes the first rotating rod 7 to rotate. The first rotating rod 7 causes a reciprocating lead screw 64 to rotate synchronously and in the opposite direction through the meshing of two transmission gears 71. At the same time, the first rotating rod 7 causes another reciprocating lead screw 64 to rotate synchronously and in the same direction through two synchronous pulleys 72 and a synchronous belt 73. At this time, the synchronous and opposite rotation of the two reciprocating lead screws 64 causes the two moving blocks 66 to descend synchronously. The two moving blocks 66 cause the two guiding blocks 63 to descend vertically along the inner walls of the corresponding guiding grooves 62 through two connecting shafts 65. The two guiding blocks 63 cause multiple wafers in the semi-circular support plate 52 to descend synchronously through two rotating shafts 67 and a U-shaped fixing bracket 68. After multiple wafers are completely immersed in the etching solution, the motor 69 is turned off, and the multiple wafers are subjected to wet etching in the etching solution;

[0056] After the etching of multiple wafers is completed, the operator turns on the motor 69 again, causing the drive shaft of the motor 69 to rotate in the reverse direction, raising the multiple wafers above the etching machine table 1, then turning off the motor 69 and starting the electric slide rail 15. The electric slide rail 15 moves the equipment cover 12 above the cleaning tank 3 through the slider 16. At this time, the multiple wafers are located above the cleaning tank 3. Then, the cleaning liquid is injected into the cleaning tank 3 through the second liquid inlet pipe 31, and the motor 69 is turned on again to cause the multiple wafers to descend vertically into the cleaning tank 3 and come into contact with the cleaning liquid in the cleaning tank 3;

[0057] During this process, since the reciprocating lead screw 64 causes the guiding block 63 to reciprocate up and down through the moving block 66 and the connecting shaft 65, the multiple wafers follow the reciprocating up and down movement, and the multiple wafers are constantly in contact with and separated from the cleaning liquid;

[0058] At the same time, the drive gear 88 and the second rotating rod 86 follow the reciprocating up and down movement of the guiding block 63. Under the action of the toothed plate 89, the drive gear 88 causes the second rotating rod 86 to rotate. The second rotating rod 86 causes the rotating shaft 81 to rotate through two bevel gears 87. The rotating shaft 81 causes the push-pull shaft 84 to revolve around the axis of the rotating shaft 81. The push-pull shaft 84 causes the U-shaped fixing bracket 68 to perform a reciprocating swinging operation around the axis of the rotating shaft 67 through the connecting groove 85. At this time, the multiple wafers in the semi-circular support plate 52 follow the reciprocating swinging movement, and the multiple wafers are cleaned during the reciprocating swinging operation;

[0059] Meanwhile, the four stirring shafts 91 rise and fall synchronously following the guide blocks 63. The rotating shaft 81 enables the four stirring shafts 91 to rotate synchronously through two second driving wheels 96, a second transmission belt 97, two third driving wheels 98 and a third transmission belt 99, and four first driving wheels 94 and a first transmission belt 95. The four stirring shafts 91 enable multiple stirring paddles 93 to rotate synchronously. The multiple stirring paddles 93 lift and stir the cleaning liquid around the cleaning tank 3, causing the cleaning liquid to move and preventing precipitation. Thus, the lifting and swinging cleaning of the wafer, as well as the stirring of the cleaning liquid during the cleaning process, are conveniently achieved, thereby effectively improving the cleaning effect and cleaning efficiency of the wafer.

[0060] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer slicing and etching device, comprising an etching machine table (1) and a machine base (11), the machine base (11) being fixedly arranged on the lower surface of the etching machine table (1), characterized in that: The upper surface of the etching machine table (1) is provided with an equipment cover (12). The upper surface of the etching machine table (1) is fixedly provided with an electric slide rail (15). One end of the electric slide rail (15) is slidably provided with a slider (16), and one side of the slider (16) is fixedly connected to one side of the equipment cover (12). The lower end of the equipment cover (12) is fixedly provided with a sealing ring (13), and the lower surface of the sealing ring (13) is in movable contact with the upper surface of the etching machine table (1). An etching tank (2), a cleaning tank (3) and a drying tank (4) are respectively fixedly arranged on the machine base (11). A fixing component (5), a lifting cleaning mechanism (6), a swinging cleaning mechanism (8) and a stirring cleaning mechanism (9) are respectively arranged in the equipment cover (12).

2. The wafer slicing and etching equipment according to claim 1, characterized in that A first liquid inlet pipe (21) is fixedly arranged at the upper end of the etching tank (2), and a first liquid discharge pipe (22) is fixedly arranged at the bottom of the etching tank (2). A second liquid inlet pipe (31) is fixedly arranged at the upper end of the cleaning tank (3), and a second liquid discharge pipe (32) is fixedly arranged at the bottom of the cleaning tank (3).

3. A wafer slicing and etching device according to claim 1, characterized in that, The fixing component (5) includes two fixing disks (51). A semi-circular support plate (52) is fixedly arranged between the two fixing disks (51). A plurality of liquid inlet grooves (53) distributed in a circular array are formed in the semi-circular support plate (52). A plurality of limiting retaining rings (54) are fixedly arranged on the inner wall of the semi-circular support plate (52) at equal intervals. Rubber pads (55) are fixedly arranged on both sides of the plurality of limiting retaining rings (54).

4. The wafer slicing and etching equipment according to claim 3, characterized in that, The lifting cleaning mechanism (6) includes two L-shaped frame plates (61). The two L-shaped frame plates (61) are symmetrically and fixedly arranged on the side wall of the equipment cover (12). Guide grooves (62) are formed in both of the two L-shaped frame plates (61). One end of each of the two guide grooves (62) is slidably provided with a guide block (63). A rotating shaft (67) is rotatably installed on the opposite side of the two guide blocks (63). A U-shaped fixing frame (68) is fixedly arranged between the two rotating shafts (67). The two fixing disks (51) are fixedly arranged at one end of the U-shaped fixing frame (68). A reciprocating lead screw (64) is rotatably installed on one side of each of the two L-shaped frame plates (61). A connecting shaft (65) is fixedly arranged on one side of each of the two guide blocks (63). A moving block (66) is rotatably installed at one end of each of the two connecting shafts (65). The moving block (66) is in movable contact with the thread groove wall of the reciprocating lead screw (64).

5. The wafer slicing and etching equipment according to claim 4, characterized in that A motor (69) is fixedly arranged at one end of the equipment cover (12). A first rotating rod (7) is fixedly arranged at the driving output end of the motor (69). Transmission gears (71) are fixedly arranged at one end of the first rotating rod (7) and one end of one of the reciprocating lead screws (64). The two transmission gears (71) are meshed and connected. Synchronous wheels (72) are fixedly arranged at one end of the first rotating rod (7) and one end of the other reciprocating lead screw (64). A synchronous belt (73) is installed in a transmission manner between the two synchronous wheels (72).

6. The wafer slicing and etching equipment according to claim 4, wherein The swing cleaning mechanism (8) includes a rotating shaft (81). One end of each of the two guiding blocks (63) is fixedly provided with a first fixing rod (82). The rotating shaft (81) is rotatably connected to the ends of the two first fixing rods (82). One end of the rotating shaft (81) is fixedly provided with a driving handle (83). One end of the driving handle (83) is fixedly provided with a push-pull shaft (84). A connecting groove (85) is formed in the upper end surface of the U-shaped fixing bracket (68). One end of the push-pull shaft (84) is in movable contact with one end of the connecting groove (85).

7. The wafer slicing and etching equipment according to claim 6, characterized in that, One side of one of the guiding blocks (63) is rotatably provided with a second rotating rod (86). One end of the second rotating rod (86) and the middle of the rotating shaft (81) are both fixedly provided with bevel gears (87). The two bevel gears (87) are meshed with each other. The other end of the second rotating rod (86) is fixedly provided with a driving gear (88). One side of one of the L-shaped frame plates (61) is fixedly provided with a toothed plate (89). The driving gear (88) is meshed with the toothed plate (89).

8. A wafer slicing and etching device as claimed in claim 6, wherein, The stirring cleaning mechanism (9) includes a stirring shaft (91). There are four stirring shafts (91). One end of each of the two first fixing rods (82) is fixedly provided with two second fixing rods (92). The stirring shaft (91) is rotatably connected to the ends of the second fixing rods (92). A plurality of stirring paddles (93) are fixedly provided at one end of each of the four stirring shafts (91).

9. A wafer slicing and etching device according to claim 8, wherein, One end of each of the four stirring shafts (91) is fixedly provided with a first transmission wheel (94). A first transmission belt (95) is installed between adjacent two of the first transmission wheels (94). One end of the rotating shaft (81) and one end of one of the stirring shafts (91) are both fixedly provided with a second transmission wheel (96). A second transmission belt (97) is installed between the two second transmission wheels (96). One end of the rotating shaft (81) and one end of the other stirring shaft (91) are both fixedly provided with a third transmission wheel (98). A third transmission belt (99) is installed between the two third transmission wheels (98).

10. A method applied to the wafer slicing and etching equipment described in any one of claims 1-9, characterized in that, Including the following steps: S1. By pouring the etching solution into the etching tank (2), inserting a plurality of wafers one by one between two adjacent limiting retaining rings (54), and driving the semi-circular supporting plate (52) to vertically descend through the lifting cleaning mechanism (6), the plurality of wafers in the semi-circular supporting plate (52) synchronously descend into the etching tank (2) and are immersed in the etching solution for wet etching in the etching solution. S2. By driving the equipment cover (12) to move above the cleaning tank (3) through the electric slide rail (15) and the slider (16), driving the plurality of wafers to continuously contact or separate from the cleaning liquid through the lifting cleaning mechanism (6), driving the plurality of wafers to swing reciprocally through the swing cleaning mechanism (8) to perform swing cleaning on the plurality of wafers, and at the same time, driving the cleaning liquid around the cleaning tank (3) to lift and stir through the stirring cleaning mechanism (9) to make the cleaning liquid move and avoid precipitation. S3. Drive the equipment cover (12) to move above the drying tank (4) through the electric slide rail (15) and the slider (16), and drive multiple wafers to vertically descend into the drying tank (4) by the lifting cleaning mechanism (6), and dry the multiple cleaned wafers in the drying tank (4).

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