A method for printing a white block on a circuit board

Abstract

The present application provides a kind of circuit board white block's jet printing method, white block position of printing drawing data is identified and print data is generated using CAM workstation;Jet printing data is divided into multiple separated print groups along the longitudinal direction of substrate, and the jet printing data of each print group is allocated to a group of print nozzles;According to the printing range of each print nozzle, a separation line is generated on the drawing data, and the overlapping separation line shows the splicing center line of the adjacent two print nozzles. By adjusting the position of the separation line, the two print nozzles can be separated by a certain distance, and the two print groups do not interfere with each other, thereby effectively solving the step, trace and defect of white block appearance. After jet printing the white block by the jet printing method provided by the present process, the exposure and development process is reduced, the production cycle is reduced, and the carding problem and developing waste liquid generated in this process can be avoided, reducing scrap and production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the circuit board surface text printing technology, specifically a kind of circuit board white block's jet printing method. BACKGROUND

[0002] Circuit board is a common electrical component, which is widely used in various electronic products. With the development of intelligent technology, many enterprises need to attach two-dimensional code identification information on the surface of the circuit board, and the white block attached by the two-dimensional code is printed on the surface of the circuit board by ink printing. In order to accurately identify the two-dimensional code information, the surface finish of the circuit board needs to be ensured.

[0003] In the prior art, two methods are generally used to print white blocks. One is to use printing screen printing, and then process the white block printed by screen printing through heat setting or exposure development. However, the exposure development type ink often has abnormal conditions such as frequent pull-out, damage, low level of code scanning and poor washing resistance, and the exposure development type process is long, which takes 5 hours for off-the-ground production, affects the delivery cycle, and the other method is to process through digital jet printing, which prints white blocks by collecting ink. Since the substrate range supporting the white block is large, multiple printing heads are needed to jointly jet print the white block to form an apparent bright surface. However, multiple printing heads will cause the phenomenon of step-shaped trace at the joint position due to secondary ink deposition, which needs to observe the product surface and then fine-tune the position of each printing head, which seriously affects the work efficiency of jet printing. SUMMARY

[0004] To solve the above technical problems, the present application provides a jet printing method for white blocks of circuit boards, comprising the following steps: S1, importing printing paper data by using a CAM workstation, identifying the position of the white block on the paper data, and generating jet printing data of the white block corresponding to the printing position;

[0005] S2, dividing the jet printing data into multiple separated printing groups along the longitudinal direction of the substrate, and allocating the jet printing data of each printing group to a group of printing heads, and defining the printing range of each printing group by a separation line with longitudinal coordinate information recorded on the paper data;

[0006] S3, adjusting the position of each separation line so that the adjacent two groups of separation lines coincide, and the coinciding separation lines avoid the printing position of the white block, and previewing the adjustment result;

[0007] S4, controlling each group of printing heads to move horizontally in each printing group according to the jet printing data, and completing the printing of the white block on the substrate.

[0008] Further, in the S1 stage, the identification of the paper data includes the identification of the longitudinal coordinates of the positions of the adjacent two groups of white blocks, and the minimum distance of the two groups of longitudinal coordinates is generated.

[0009] Further, the separation line is located on the center line of the white block position of the adjacent two groups.

[0010] Further, the printing data includes thickness data of the printing position, and the ink output of each printing head is controlled according to the thickness data.

[0011] Further, the thickness of the printing position is 33±5um.

[0012] Further, the printing data includes frequency data of the printing position, and the printing head is controlled to spray the white block position once in the transverse direction; the printing head is controlled to return to the initial position, and the printing head is controlled to spray multiple times according to the frequency data.

[0013] The present application provides a printing method for a white block of a circuit board, which comprises the following steps: a CAM workstation is used to identify the white block position of printed paper data and generate printing data; the printing data is divided into multiple separated printing groups along the longitudinal direction of the substrate, and the printing data of each printing group is allocated to a group of printing heads; a separation line is generated on the paper data according to the printing range of each printing head, and the overlapping separation lines show the splicing center line of the adjacent two printing heads. By adjusting the position of the separation line, the two printing heads can be separated by a certain distance, and the two printing groups do not interfere with each other, thereby effectively solving the step, trace and flaw defects of the white block.

[0014] After the white block is sprayed by the printing method provided by the present application, the exposure and development process is reduced, the production cycle is reduced, and the card board problem and the waste liquid of the developing chemical in the process can be avoided, thereby reducing the scrap and production cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic diagram of the separation of each printing group in the printing method for a white block of a circuit board. DETAILED DESCRIPTION

[0016] A printing method for a white block of a circuit board, comprising the following steps:

[0017] S1, a CAM workstation is used to import printed paper data, identify the white block position on the paper data, and generate printing data of the white block corresponding to the printing position;

[0018] S2, the printing data is divided into multiple separated printing groups along the longitudinal direction of the substrate, the printing data of each printing group is allocated to a group of printing heads, and the printing range of each printing group is defined by a separation line with longitudinal coordinate information recorded on the paper data;

[0019] S3, the position of each separation line is adjusted, the adjacent two separation lines are overlapped, and the overlapped separation lines avoid the printing position of the white block, and the adjustment result is previewed;

[0020] S4, according to the printing data, controlling each group of printing nozzles to move along the lateral path in each printing group to complete the printing of the white block on the substrate.

[0021] Different regions of the printed substrate are printed by multiple printing nozzles, and the white block in each printing group is printed by multiple nozzles on one printing nozzle, as shown in Figure 1 According to the printing range of each printing nozzle, a separation line is generated on the drawing data, and the overlapping separation lines show the splicing center line of the adjacent two printing nozzles. By adjusting the position of the separation line, the two printing nozzles can be separated by a certain distance, and the two printing groups do not interfere with each other.

[0022] In the S1 stage, the identification of the drawing data includes the identification of the longitudinal coordinates of the positions of the adjacent two groups of white blocks, and the minimum distance between the two groups of longitudinal coordinates is generated. The minimum distance can show the width range that the overlapping separation line can be adjusted. According to the minimum distance, the printing range of each printing group is fine-tuned so that each group of separation lines can avoid the printing position of the white block.

[0023] Further, the separation line is located on the center line between the positions of the adjacent two groups of white blocks, so that each printing nozzle has a substantially uniform printing range.

[0024] Further, the printing data includes thickness data of the printing position, and the ink output of each printing nozzle is controlled according to the thickness data.

[0025] Further, the thickness of the printing position is 33±5um.

[0026] Further, the printing data includes the number of times of printing the position of the white block in the lateral direction; the printing nozzle is controlled to return to the initial position, and the printing is repeated multiple times according to the number of times.

[0027] According to the one-time soldering prevention, pre-baking, nickel and palladium plating, and plasma treatment of the substrate, the white block is printed on the substrate according to the above process, and the substrate is baked at high temperature. The surface of the printed white block has no step and trace phenomenon, and the two-dimensional code on the printing can be easily identified.

[0028] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A method of inkjet printing of a white patch on a circuit board, characterized by: The method comprises the following steps: S1, importing the printing paper data by using the CAM workstation, identifying the white block position on the paper data, and generating the jet printing data of the white block corresponding to the printing position; S2, dividing the jet printing data into multiple separated printing groups along the longitudinal direction of the substrate, and distributing the jet printing data of each printing group to a group of printing nozzles, and defining the printing range of each printing group by the separation lines with longitudinal coordinate information recorded on the paper data; S3, adjusting the position of each separation line, making the adjacent two groups of separation lines coincide, and making the coincided separation lines avoid the printing position of the white block, and previewing the adjustment result; S4, controlling each group of printing nozzles to move horizontally in each printing group according to the jet printing data, and completing the printing of the white block on the substrate.

2. The inkjet printing method for white blocks on a circuit board as described in claim 1, characterized in that: In the S1 stage, the identification of the white block position on the paper data comprises the identification of the longitudinal coordinates of the adjacent two groups of white block positions, and the minimum distance of the two groups of longitudinal coordinates is generated.

3. The inkjet printing method for white blocks on a circuit board as described in claim 1, characterized in that: The separation line is located on the center line between the adjacent two groups of white block positions.

4. The inkjet printing method for white blocks on a circuit board as described in claim 1, characterized in that: The jet printing data comprises the thickness data of the printing position, and the ink output of each printing nozzle is controlled according to the thickness data.

5. The method of claim 4, wherein: the circuit board panel is a white panel. The thickness of the printing position is 33±5um.

6. The inkjet printing method for white blocks on a circuit board as described in claim 1, characterized in that: The jet printing data comprises the number data of the printing position, the printing nozzle is controlled to jet print the white block position once along the horizontal direction, the printing nozzle is controlled to return to the initial position, and the jet printing is repeated multiple times according to the number data.

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