Process chamber, semiconductor process equipment and control method thereof

Abstract

The present application discloses a process chamber, semiconductor process equipment and a control method thereof, and relates to the technical field of coating equipment. The disclosed process chamber includes a chamber body, and the chamber body includes a first chamber and a second chamber, and the second chamber is arranged in the first chamber, and the second chamber is used to accommodate a carrier boat. By adding a second chamber in the first chamber, the carrier boat and the reaction gas are both accommodated in the second chamber, and the reaction gas is not easy to contact the inner wall of the first chamber, thereby protecting the first chamber and improving the durability of the process chamber.

Description

Technical Field

[0001] The present application relates to the technical field of coating equipment, and in particular to a process chamber, semiconductor process equipment and a control method thereof. Background Art

[0002] PECVD (Plasma-Enhanced Chemical Vapor Deposition) is a thin film material preparation method commonly used in semiconductor manufacturing processes, and is used to deposit semiconductor materials such as silicon dioxide and silicon nitride.

[0003] In the related art, the PECVD process needs to be carried out in a process chamber. However, during the process, the reaction gas in the process chamber will inevitably cause corrosion and damage to the inner wall of the process chamber, resulting in reduced durability of the process chamber. Summary of the invention

[0004] The present application discloses a process chamber, semiconductor process equipment and a control method thereof, in order to solve the problem in the related art that the reaction gas in the process chamber will inevitably cause corrosion and damage to the inner wall of the process chamber, resulting in reduced durability of the process chamber.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application discloses a process chamber, which is applied to a semiconductor process equipment, wherein the semiconductor process equipment includes a carrier boat, and the process chamber includes a chamber body;

[0007] The chamber body includes a first chamber and a second chamber, wherein the second chamber is disposed in the first chamber and is used to accommodate the carrying boat.

[0008] In a second aspect, an embodiment of the present application discloses a semiconductor process equipment, which includes a conveying mechanism, a carrier boat and the above-mentioned process chamber, wherein the conveying mechanism extends into the chamber body and is used to transfer the carrier boat to the chamber body.

[0009] In a third aspect, an embodiment of the present application discloses a control method for semiconductor process equipment, which is applied to the above-mentioned semiconductor process equipment. The control method includes:

[0010] Acquiring position information of the carrier boat in the process chamber;

[0011] If it is determined according to the position information that the carrying boat is at a preset position, the carrying boat is controlled to stop running.

[0012] The technical solution adopted in this application can achieve the following technical effects:

[0013] The process chamber disclosed in the embodiment of the present application improves the related technology. The process chamber includes a chamber body, and the chamber body includes a first chamber and a second chamber, and the second chamber is arranged in the first chamber. By adding the second chamber in the first chamber, the carrier boat and the reaction gas are both accommodated in the second chamber, and the reaction gas is not easy to contact the inner wall of the first chamber, thereby protecting the first chamber and improving the durability of the process chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present application;

[0015] Figure 2 This is one of the schematic diagrams of the assembly structure of the process chamber, the through-beam sensor and the sleeve disclosed in the embodiment of the present application;

[0016] Figure 3 This is a second schematic diagram of the assembly structure of the process chamber, the through-beam sensor and the sleeve disclosed in the embodiment of the present application;

[0017] Figure 4 This is a schematic diagram of the structure of the sleeve disclosed in the embodiment of the present application;

[0018] Figure 5 This is one of the schematic diagrams of the assembly structure of the process chamber, electrode rod and baffle mechanism disclosed in the embodiment of the present application;

[0019] Figure 6 This is a second schematic diagram of the assembly structure of the process chamber, electrode rod and baffle mechanism disclosed in the embodiment of the present application;

[0020] Figure 7 This is one of the cross-sectional structural schematic diagrams of the process chamber, electrode rod and baffle mechanism disclosed in the embodiment of the present application;

[0021] Figure 8 The second schematic cross-sectional structure diagram of the process chamber, electrode rod and baffle mechanism disclosed in the embodiment of the present application;

[0022] Fig. 9 This is a flow chart of a control method for semiconductor process equipment disclosed in an embodiment of the present application.

[0023] Description of reference numerals:

[0024] 100-process chamber, 110-chamber body, 111-first chamber, 112-second chamber, 1121-guide wheel, 113-support, 114-heat insulation, 115-electrode rod, 116-blocking mechanism, 1161-driving member, 1162-transmission shaft, 1163-blocking body, 120-transmission mechanism, 121-loading area, 122-first driving mechanism, 123-second driving mechanism, 124-encoder, 130-sensor assembly, 13 1-first sensor group, 1311-attitude sensor, 1312-displacement sensor, 132-second sensor group, 1321-opposite-shooting sensor, 1321a-transmitting end, 1321b-receiving end, 1322-first opposite-shooting sensor, 1323-second opposite-shooting sensor, 133-sleeve, 1331-first sleeve, 1332-second sleeve, 1333-third sleeve, 1334-seal, 1335-first flange, 1336-second flange;

[0025] 200-Carrying boat. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0027] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0028] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0029] Please refer to Figures 1 to 8The embodiment of the present application discloses a process chamber 100, which is applied to semiconductor process equipment. The semiconductor process equipment may include a carrier boat 200. The carrier boat 200 is used as a carrier for chemical vapor deposition, mainly used to carry the parts to be plated. The carrier boat 200 can be made of high-temperature resistant conductive materials such as graphite, and the parts to be plated can be chips, solar cells, etc. Exemplarily, PECVD technology is applied to the processing procedures of solar cells. A layer of dark blue silicon nitride film, i.e., anti-reflection film, is deposited on the surface of the solar cell through the carrier boat 200, a radio frequency power supply, and an appropriate amount of reaction gas, which can significantly improve the photoelectric conversion efficiency of the solar cell.

[0030] The PECVD process needs to be carried out in a process chamber 100. The process chamber 100 may include a chamber body 110. The chamber body 110 may be a single-chamber structure or a double-chamber structure. Taking the double-chamber structure as an example, the chamber body 110 may include a first chamber 111 and a second chamber 112. The first chamber 111 is a supporting frame of the chamber body 110 and may be welded with stainless steel material, which has good machinability and structural strength. The second chamber 112 is arranged in the first chamber 111 to form a nested structure. The second chamber 112 may be made of aluminum. The reaction gas, plasma and the carrying boat 200 in the PECVD process are distributed in the second chamber 112. The second chamber 112 made of aluminum has good weather resistance and is not easily damaged by the reaction gas and plasma.

[0031] Since aluminum is not easy to process and weld, the second chamber 112 can be formed by splicing, riveting, etc., and combined with the first chamber 111 made of stainless steel, it not only ensures the structural strength of the chamber body 110, but also reduces the difficulty and cost of production.

[0032] It should be noted that the inner wall of the first chamber 111 and the outer wall of the second chamber 112 may be fitted together or there may be a certain gap. In order to improve the heat insulation effect of the chamber body 110, a certain gap may be set between the inner wall of the first chamber 111 and the outer wall of the second chamber 112 to block the transfer of heat to a certain extent.

[0033] From the above description, it can be known that the process chamber 100 disclosed in the embodiment of the present application improves the relevant technology by adding a second chamber 112 in the first chamber 111, so that the carrier boat 200 and the reaction gas are both contained in the second chamber 112, and the reaction gas is not easy to contact with the inner wall of the first chamber 111, thereby protecting the first chamber 111 and improving the durability of the process chamber 100.

[0034] like Figure 2As shown, in order to ensure the stability of the second chamber 112, the first chamber 111 can be used to support the second chamber 112. Specifically, the chamber body 110 can also include a support member 113, which is arranged between the inner wall of the first chamber 111 and the outer wall of the second chamber 112 to support the second chamber 112 so that the second chamber 112 is relatively fixed to the first chamber 111. The shape of the support member 113 can be block-shaped, column-shaped, etc., and the connection between the support member 113 and the inner wall of the first chamber 111 and the outer wall of the second chamber 112 can be welding, clamping, etc.

[0035] like Figure 2 As shown, taking the rectangular chamber body 110 as an example, the support member 113 can be arranged between the bottom surface of the first chamber 111 and the bottom surface of the second chamber 112. Due to the gravity of the second chamber 112 itself, the second chamber 112 can be directly overlapped on the support member 113; or, the support member 113 can also be arranged between the side of the first chamber 111 and the side of the second chamber 112, and connected to the side of the first chamber 111 and the side of the second chamber 112 respectively by welding, clamping, etc., so as to support the second chamber 112.

[0036] like Figure 2 As shown, since high temperature will be generated inside the second chamber 112 during the process, in order to avoid the high temperature affecting the components outside the second chamber 112, the chamber body 110 may also include a heat insulating member 114. The heat insulating member 114 is arranged between the support member 113 and the outer wall of the second chamber 112. The heat insulating member 114 may be in the form of a sheet, a block, etc., and may be made of ceramic, graphite, or other materials.

[0037] In some optional embodiments, a certain gap may be provided between the inner wall of the first chamber 111 and the outer wall of the second chamber 112, and the air pressure value of the first chamber 111 is not less than the air pressure value of the second chamber 112. By differentially controlling the air pressure of the first chamber 111 and the second chamber 112, it is possible to prevent the reaction gas in the second chamber 112 from leaking into the first cavity or even the external environment, thereby improving the sealing of the second chamber 112 to a certain extent.

[0038] Please refer to Figures 1 to 8The embodiment of the present application also discloses a semiconductor process equipment, which may include a conveying mechanism 120, a carrier boat 200 and the above-mentioned process chamber 100. The conveying mechanism 120 is used to transfer the carrier boat 200 to the chamber body 110. The conveying mechanism 120 may be a conveyor belt, a conveyor roller, etc. The conveying mechanism 120 may extend into the chamber body 110. For example, the conveying mechanism 120 may extend only into the second chamber 112, or may extend into the first chamber 111 and the second chamber 112 at the same time, that is, one part of the conveying mechanism 120 is located in the second chamber 112, and the other part is located in the first chamber 111. In order to ensure the sealing of the chamber body 110, a chamber door may be provided on the chamber body 110. When the carrier boat 200 needs to enter and exit the chamber body 110, the chamber door is in an open state; when the process is performed in the chamber body 110, the chamber door may be closed.

[0039] like Figure 1 As shown, in order to avoid interference with the opening and closing of the chamber door, the conveying mechanism 120 may include a plurality of conveying rollers, wherein the plurality of conveying rollers include a driving shaft and a driven shaft, wherein the driving shaft is used to provide a driving force for the transmission of the carrier boat 200, and the driven shaft is used to support the carrier boat 200. The plurality of conveying rollers are arranged at intervals along the transmission direction of the carrier boat 200, and the interval between the conveying rollers may be appropriately increased near the chamber door to avoid interference with the chamber door.

[0040] It should be supplemented that the two ends of the conveying roller located outside the chamber body 110 can be overlapped on the bracket, and the two ends of the conveying roller located inside the chamber body 110 need to pass through the side wall of the chamber body 110 and then overlap on the bracket. In order to ensure the sealing of the chamber body 110, a sealing bearing or a sealing gasket can be set between the conveying roller and the side wall of the chamber body 110.

[0041] like Figures 1 to 3 As shown, during the transmission process of the carrier boat 200, in order to grasp the position, operating posture and other parameters of the carrier boat 200, the semiconductor process equipment may also include a sensor component 130. The sensor component 130 may include a photoelectric sensor, a Hall sensor, etc. The sensor component 130 is arranged on the side walls of the conveying mechanism 120 and the chamber body 110, and may be specifically arranged on the side walls of the first chamber 111, or on the side walls of the second chamber 112.

[0042] The sensor assembly 130 can be used to detect the position information of the carrying boat 200, which includes but is not limited to the position, running posture, running speed, etc. of the carrying boat 200. The sensor assembly 130 may include a plurality of sensors, which are arranged at intervals along the transmission direction of the carrying boat 200, and can obtain the position information of the carrying boat 200 in real time during the transmission process of the carrying boat 200. The connection between the plurality of sensors and the side wall of the conveying mechanism 120 or the chamber body 110 may be bolted, clamped, etc.

[0043] Before the carrier boat 200 enters the second chamber 112, the parts to be plated need to be loaded into the carrier boat 200. A loading area 121 may be provided on the conveying mechanism 120, and the loading area 121 is located outside the chamber body 110. After the carrier boat 200 is loaded with the parts to be plated, the conveying mechanism 120 will transfer the carrier boat 200 to a designated position of the chamber body 110 to start the process. When the process is completed, the conveying mechanism 120 will transfer the carrier boat 200 to the loading area 121 again.

[0044] like Figure 1 As shown, the loading area 121 is provided with a first driving mechanism 122 and a first sensor group 131. The first sensor group 131 is used to detect the position information of the carrying boat 200 when it is in the loading area 121. The first sensor group 131 may include a plurality of sensors, and the plurality of sensors are respectively located at different positions of the loading area 121; the first driving mechanism 122 can control the movement or stop of the carrying boat 200 according to the position information. If the sensor for detecting the position of the carrying boat 200 and the sensor for detecting the posture of the carrying boat 200 in the first sensor group 131 are both triggered, that is, the position and posture of the carrying boat 200 are both in a normal state, then the first sensor group 131 and the first driving mechanism 122 will be linked, and the first driving mechanism 122 will start and drive the carrying boat 200 to move; if the sensor for detecting the position of the carrying boat 200 and the sensor for detecting the posture of the carrying boat 200 in the first sensor group 131 are not triggered at the same time, it is necessary to adjust the position or posture of the carrying boat 200, and at this time, the first driving mechanism 122 is not started. The first driving mechanism 122 can be a motor, a rotary cylinder, etc.

[0045] like Figure 1 As shown, according to the functional division, the first sensor group 131 can be divided into a posture sensor 1311 and a displacement sensor 1312. The posture sensor 1311 is used to detect whether the carrying boat 200 is offset, and the displacement sensor 1312 is used to detect the displacement distance of the carrying boat 200. At the same time, the posture sensor 1311 and the displacement sensor 1312 can also detect whether the carrying boat 200 passes through a preset position according to whether they are triggered. The preset position can be the position where the posture sensor 1311 or the displacement sensor 1312 is located.

[0046] For example, Figure 1 As shown, multiple sensors are numbered from right to left, namely A, B, C, D, E, F, G, H, I, and J. Four sensors are arranged in the loading area 121, namely A, B, C, and D, wherein A and B are displacement sensors 1312, and C and D are attitude sensors 1311. When the carrying boat 200 is located in the loading area 121, the above four sensors can be covered. Sensors C and D can detect whether the carrying boat 200 is offset. When the two attitude sensors 1311 are not fully triggered, it means that the carrying boat 200 has been offset; when the two attitude sensors 1311 are both triggered, it means that the carrying boat 200 is in the correct position of the loading area 121. At this time, the first driving mechanism 122 can be linked to drive the carrying boat 200 to move forward. When the carrying boat 200 moves, sensors A and B will be released from the triggered state in turn, thereby obtaining the displacement distance of the carrying boat 200. It should be supplemented that the two displacement sensors 1312 can also be linked with the first driving mechanism 122. If the carrying boat 200 has passed sensor A (sensor A is released from the triggered state), the first driving mechanism 122 can reduce the rotation speed or maintain a constant speed; if the carrying boat 200 has passed sensor B (sensor B is released from the triggered state), the first driving mechanism 122 can reduce the rotation speed to ensure that the carrying boat 200 can smoothly enter the chamber body 110.

[0047] After the carrying boat 200 enters the chamber body 110, it still needs to move a certain distance and reach the preset position of the chamber body 110. Therefore, it is also necessary to set the sensor assembly 130 in the chamber body 110. Specifically, the sensor assembly 130 can also include a second sensor group 132 arranged on the side wall of the chamber body 110, which can be arranged on the side wall of the first chamber 111 or the side wall of the second chamber 112. The second sensor group 132 can include multiple sensors, and the multiple sensors are respectively located at different positions on the side wall of the chamber body 110. Figure 1 In the embodiment, the second sensor group 132 may include six sensors E, F, G, H, I, and J.

[0048] In addition, if Figure 1 As shown, a second driving mechanism 123 is also provided in the chamber body 110. The second driving mechanism 123 may be a motor, a rotary cylinder, etc. The second driving mechanism 123 can control the movement or stop of the carrying boat 200 according to the position information of the carrying boat 200. The first driving mechanism 122, the second driving mechanism 123, the first sensor group 131 and the second sensor group 132 have the following coordination relationship:

[0049] When the carrying boat 200 starts to move from the loading area 121, the first driving mechanism 122 starts to operate. When the carrying boat 200 passes the sensor B (sensor B is in the untriggered state), the front end of the carrying boat 200 begins to enter the chamber body 110. At this time, the second driving mechanism 123 starts to operate and maintains the same speed as the first driving mechanism 122, so that the carrying boat 200 smoothly transitions between the first driving mechanism 122 and the second driving mechanism 123. When the carrying boat 200 passes the sensor C (sensor C is in the untriggered state), the first driving mechanism 122 stops operating, and the second driving mechanism 123 continues to operate. At this time, the second driving mechanism 123 can provide driving force for the carrying boat 200. When the carrying boat 200 passes the sensor G (sensor G is in the triggered state), the second driving mechanism 123 can decelerate to reduce the influence of inertia on the carrying boat 200 and prepare for the position control of the carrying boat 200. When the carrying boat 200 passes the sensor H (sensor H trigger state), the second driving mechanism 123 performs position control. When the position control ends, it determines whether the position is correct and whether the sensor I and the sensor E are triggered at the same time. If both conditions are met, the carrying boat 200 has reached the preset position, and the second driving mechanism 123 stops running. If the sensor J is triggered or any of the above two conditions is not met, it means that the carrying boat 200 has left the preset position. At this time, the second driving mechanism 123 can be controlled to stop running and an alarm prompt is issued.

[0050] like Figures 1 to 3 As shown, in the second sensor group 132, sensors E, F, G, H, I, and J can be photoelectric sensors, Hall sensors, etc. Taking photoelectric sensors as an example, the second sensor group 132 includes at least two opposing beam sensors 1321. Among the sensors E, F, G, H, I, and J, all of them can use opposing beam sensors 1321, or some of them can use opposing beam sensors 1321.

[0051] Each of the beam sensors 1321 includes a transmitting end 1321a and a receiving end 1321b, which are respectively arranged on two opposite side walls of the first chamber 111. The transmitting end 1321a and the receiving end 1321b are connected to the side walls of the first chamber 111 by welding, bonding, bolting, etc.

[0052] The operating principle of the through-beam sensor 1321 is that when there is no obstruction between the transmitting end 1321a and the receiving end 1321b, the receiving end 1321b can normally receive the light excited by the transmitting end 1321a; when there is an obstruction between the transmitting end 1321a and the receiving end 1321b, the receiving end 1321b cannot normally receive the light excited by the transmitting end 1321a.

[0053] To ensure that the optical path between the transmitting end 1321a and the receiving end 1321b is unobstructed, first light-transmitting holes are respectively provided on the two opposite side walls of the first chamber 111, and second light-transmitting holes are respectively provided on the two opposite side walls of the second chamber 112. The first light-transmitting hole and the second light-transmitting hole are coaxially arranged, and the transmitting end 1321a and the receiving end 1321b realize transmission and reception through the first light-transmitting hole and the second light-transmitting hole.

[0054] In some optional embodiments, the process chamber 100 is provided with a beam sensor 1321, which includes a transmitting end 1321a and a receiving end 1321b; first light-transmitting holes are respectively provided on two opposite side walls of the first chamber 111, and second light-transmitting holes are respectively provided on two opposite side walls of the second chamber 112, and the first light-transmitting holes and the second light-transmitting holes are coaxially arranged; the transmitting end 1321a and the receiving end 1321b are respectively arranged on two opposite side walls of the first chamber 111, and emission and reception are realized through the first light-transmitting holes and the second light-transmitting holes.

[0055] like Figures 2 to 4 As shown, the process chamber 100 is further provided with a sleeve 133, and the two ends of the sleeve 133 are respectively connected to the inner wall of the first chamber 111 and the outer wall of the second chamber 112, and the specific connection method can be welding, bolt connection, etc. The two ends of the sleeve 133 are respectively connected to the first light-transmitting hole and the second light-transmitting hole, and the transmitting end 1321a and the receiving end 1321b of the corresponding sensor 1321 can realize transmission and reception through the sleeve 133, the first light-transmitting hole and the second light-transmitting hole. Since the plating material in the second chamber 112 will enter the first chamber 111 through the second light-transmitting hole, and be plated on the surface of the transmitting end 1321a and the receiving end 1321b through the first light-transmitting hole, the sensitivity of the corresponding sensor 1321 will be reduced, causing the sensor signal to fail or be triggered incorrectly, thereby affecting the transmission of the carrier boat.

[0056] By providing the sleeve 133 , the plating material escaping from the light-transmitting hole can be preferentially plated on the inner wall of the sleeve 133 , thereby reducing the plating on the transmitting end 1321 a and the receiving end 1321 b , thereby improving the accuracy and durability of the through-beam sensor 1321 .

[0057] like Figures 2 to 4As shown, considering the large temperature change in the chamber body 110, in order to avoid the sleeve 133 from being damaged due to thermal expansion and contraction, the sleeve 133 can adopt a split structure, which can specifically include a first sleeve 1331, a second sleeve 1332 and a third sleeve 1333. The inner diameter of the third sleeve 1333 is slightly larger than the outer diameters of the first sleeve 1331 and the second sleeve 1332, so that the third sleeve 1333 can be sleeved on the first sleeve 1331 and the second sleeve 1332, and the first sleeve 1331 and the second sleeve 1332 can be slidably connected to the third sleeve 1333 respectively. The sleeve 133 adopts the above-mentioned split structure, and the relative sliding between the first sleeve 1331 and the third sleeve 1333, and the second sleeve 1332 and the third sleeve 1333 can overcome the deformation of the sleeve 133 caused by thermal expansion and contraction, thereby improving the durability of the sleeve 133.

[0058] like Figures 2 to 4 As shown, the first sleeve 1331 and the second sleeve 1332 are respectively connected to the first chamber 111 and the second chamber 112. Specifically, a first flange 1335 can be set at the end of the first sleeve 1331 facing away from the second sleeve 1332, and a second flange 1336 can be set at the end of the second sleeve 1332 facing away from the first sleeve 1331. Mounting holes are respectively set on the first flange 1335 and the second flange 1336. The first sleeve 1331 can be connected to the inner wall of the first chamber 111 through the first flange 1335 and bolts, and the second sleeve 1332 can be connected to the outer wall of the second chamber 112 through the second flange 1336 and bolts.

[0059] like Figure 3 As shown, in order to prevent the plating material escaping from the second light-transmitting hole from leaking out of the assembly gap between the first sleeve 1331 and the third sleeve 1333, and the second sleeve 1332 and the third sleeve 1333, the sleeve 133 may further include a sealing member 1334, which is disposed in the assembly gap between the first sleeve 1331 and the third sleeve 1333, and / or the second sleeve 1332 and the third sleeve 1333. The sealing member 1334 may be made of materials such as silicone and rubber.

[0060] Furthermore, if Figure 1As shown, the conveying mechanism 120 may further include an encoder 124 and a controller, and the controller is electrically connected to the encoder 124. The encoder 124 may be disposed on the outer wall of the chamber body 110 and partially extend into the chamber body 110. When the carrying boat 200 passes through the encoder 124, the encoder 124 may count the displacement information of the carrying boat 200, and the controller may obtain the above displacement information and compare the displacement information with the preset displacement information stored in the controller. If the displacement information matches the preset displacement information, it indicates that the position of the carrying boat 200 is accurate and the next step may be performed. If the displacement information does not match the preset displacement information, it indicates that the carrying boat 200 has a position deviation during the displacement process, and the position of the carrying boat 200 needs to be corrected.

[0061] In addition, if Figure 1 As shown, the position of the carrier boat 200 can also be checked twice. Specifically, the second sensor group 132 can include a first beam sensor 1322 and a second beam sensor 1323, which correspond to Figure 1 For the sensor E and the sensor I in the transmission direction of the transmission mechanism 120, the distance between the first pairing sensor 1322 and the second pairing sensor 1323 is equal to the length of the carrying boat 200. It should be noted that the length of the carrying boat 200 refers to the size of the carrying boat 200 along the transmission direction of the transmission mechanism. Since the distance between the first pairing sensor 1322 and the second pairing sensor 1323 is equal to the length of the carrying boat 200, the position of the carrying boat 200 can be verified twice by judging the triggering state of the first pairing sensor 1322 and the second pairing sensor 1323. If both the first pairing sensor 1322 and the second pairing sensor 1323 are in the triggering state, it means that the position of the carrying boat 200 is accurate; if both the first pairing sensor 1322 and the second pairing sensor 1323 are not in the triggering state, it means that the position of the carrying boat 200 is inaccurate. After the carrying boat 200 passes the above two position verifications, the next step can be performed.

[0062] like Figures 5 to 8 As shown, when the carrier boat 200 is in the chamber body 110, the process circuit needs to be connected with the aid of electrodes. Specifically, Figures 5 to 8 As shown, the semiconductor process equipment may further include an electrode rod 115, which is telescopically arranged on the outer wall of the first chamber 111, and the telescopic movement of the electrode rod 115 can be controlled by a cylinder. The electrode rod 115 is provided with a plug-in end, and the carrying boat 200 is provided with an electrode hole. The plug-in end can be extended into the second chamber 112 and plugged into the electrode hole to conduct the process loop.

[0063] When the carrier boat 200 is not in the preset position of the chamber body 110, if the electrode rod 115 is extended into the second chamber 112, the electrode hole of the carrier boat 200 may be damaged. For this reason, the semiconductor process equipment may further include a baffle mechanism 116, which is connected to the side wall of the chamber body 110, specifically, it may be connected to the side wall of the first chamber 111, and it may also be connected to the side wall of the second chamber 112. At least part of the baffle mechanism 116 extends into the second chamber 112. The baffle mechanism 116 has a first position and a second position relative to the electrode rod 115. When the baffle mechanism 116 is in the first position, the baffle mechanism 116 abuts against the plug-in end of the electrode rod 115 to prevent the plug-in end from extending into the electrode hole of the carrier boat 200. When the baffle mechanism 116 is in the second position, the baffle mechanism 116 is separated from the plug-in end, so that the plug-in end can extend into the electrode hole, thereby protecting the carrier boat 200.

[0064] like Figures 5 to 8 As shown, the baffle mechanism 116 may specifically include a driving member 1161, a transmission shaft 1162 and a baffle body 1163. The driving member 1161 is disposed on the side wall of the chamber body 110, and may specifically be disposed on the outer wall of the first chamber 111. The transmission shaft 1162 is disposed through the side wall of the chamber body 110, that is, the transmission shaft 1162 passes through the side wall of the first chamber 111 and the side wall of the second chamber 112, respectively, and is connected to the output end of the driving member 1161, and at least part of the transmission shaft 1162 extends into the second chamber 112. The baffle body 1163 is connected to one end of the transmission shaft 1162 away from the driving member 1161, and the driving member 1161 drives the baffle body 1163 to abut or separate from the plug-in end of the electrode rod 115 through the transmission shaft 1162. The driving member 1161 may specifically be a cylinder, a motor, etc., and the baffle body 1163 may be in the shape of a plate, a block, etc.

[0065] like Figure 1 As shown, in order to make the carrying boat 200 run smoothly in the second chamber 112, a guide wheel 1121 can also be set on the inner wall of the second chamber 112. The guide wheel 1121 and the inner wall of the second chamber 112 can rotate relative to each other, so as to cooperate with the guide of the carrying boat 200.

[0066] Please refer to Fig. 9 The embodiment of the present application further discloses a control method for semiconductor process equipment, which is applied to the above-mentioned semiconductor process equipment. The disclosed control method may include:

[0067] Step 101 : obtaining position information of the carrier boat 200 in the process chamber 100 .

[0068] Specifically, Figure 1As shown, the position information of the carrier boat 200 located in the process chamber 100 can be obtained through the second sensor group 132. The position information may include the operating position, operating speed, operating posture, etc. of the carrier boat 200. By way of example, the second sensor group 132 includes sensors E, F, G, H, I, and J. The operating position of the carrier boat 200 can be obtained by obtaining the triggering status of sensors E, F, G, H, I, and J. If sensor E is triggered and remains in the triggered state, it can be known that the bow of the carrier boat 200 has just passed sensor E; if sensor F is triggered and remains in the triggered state, it can be known that the bow of the carrier boat 200 has just passed sensor F.

[0069] For the running speed, the running speed of the carrying boat 200 can be calculated by obtaining the time interval between the two sensors and the distance between the two sensors. For the running posture, it can be judged by the triggering state of the sensor C and the sensor D located in the loading area 121, or it can be judged according to the triggering state of the sensor E and the sensor I.

[0070] Step 102: judging that the carrying boat 200 is at a preset position according to the position information, and then controlling the carrying boat 200 to stop running.

[0071] Specifically, Figure 1 As shown, after the position information of the carrying boat 200 is obtained through the sensor group, it can be determined whether the carrying boat 200 is in the preset position according to the position information. For example, if the sensor 1 is triggered, it can be considered that the carrying boat 200 has moved to the preset position, and at this time, the second driving mechanism 123 can be controlled to stop running, thereby controlling the carrying boat 200 to stop running.

[0072] Based on the above control method, such as Figures 5 to 8 As shown, the semiconductor process equipment may include an electrode rod 115, which is telescopically arranged on the outer wall of the first chamber 111, and the electrode rod 115 is provided with a plug-in end, and the supporting boat 200 is provided with an electrode hole, and the plug-in end is used to extend into the second chamber 112 and plug into the electrode hole to conduct the process loop.

[0073] After determining that the carrying boat 200 is at the preset position according to the position information and controlling the carrying boat 200 to stop running, the control method further includes:

[0074] Step 103 , controlling the electrode rod 115 to extend into the electrode hole of the carrying boat 200 .

[0075] In the embodiments of the present application, Figures 5 to 8As shown, one of the purposes of ensuring that the carrier boat 200 is in the preset position is to enable the electrode rod 115 to smoothly extend into the electrode hole of the carrier boat 200 to conduct the process circuit. If the position of the carrier boat 200 is inaccurate, the electrode rod 115 is likely to cause damage to the electrode hole or even the carrier boat 200. Therefore, after obtaining the position information of the carrier boat 200 through the sensor group, and judging that the carrier boat 200 is in the preset position according to the position information, the electrode rod 115 is controlled to extend into the electrode hole of the carrier boat 200, so that the carrier boat 200 can be protected.

[0076] In addition, if Figures 5 to 8 As shown, in order to further protect the carrier boat 200, the semiconductor process equipment may further include a baffle mechanism 116, which is connected to the side wall of the chamber body 110 and at least partially extends into the second chamber 112. The baffle mechanism 116 and the inner wall of the second chamber may be made of the same material. The baffle mechanism 116 has a first position and a second position relative to the electrode rod 115. When the baffle mechanism 116 is in the first position, the baffle mechanism 116 abuts against the plug-in end of the electrode rod 115 to prevent the plug-in end from extending into the electrode hole. When the baffle mechanism 116 is in the second position, the baffle mechanism 116 is separated from the plug-in end of the electrode rod 115 so that the plug-in end can extend into the electrode hole of the carrier boat 200.

[0077] Based on the above functions of the baffle mechanism 116, the baffle mechanism 116 can be linked with the position of the carrying boat 200. After the carrying boat 200 is controlled to stop running and before the electrode rod 115 is controlled to extend into the electrode hole of the carrying boat 200, when it is determined that the carrying boat 200 is at a preset position according to the position information, the control method can further include:

[0078] Step 104 , verifying the position of the carrier boat 200 .

[0079] For the verification of the position of the carrier boat 200, Figure 1 As shown, the determination can be made by determining whether the sensor 1 is triggered. If the sensor 1 is in a triggered state, it is determined that the carrying boat 200 is in the preset position. If the sensor 1 is in an untriggered state, it is determined that the carrying boat 200 is not in the preset position. However, there is a great risk in verifying the position of the carrying boat 200 by the above single method.

[0080] In order to make the position of the carrying boat 200 more accurate and reliable, on the one hand, Figure 1As shown, the encoder 124 and the controller can be used to verify the position of the carrying boat 200. When the carrying boat 200 passes through the encoder 124, the encoder 124 can count the displacement information of the carrying boat 200, and the controller can obtain the above displacement information and compare the displacement information with the preset displacement information stored in the controller. If the displacement information matches the preset displacement information, it means that the position of the carrying boat 200 is accurate and the next step can be executed. If the displacement information does not match the preset displacement information, it means that the carrying boat 200 has a position deviation during the displacement process, and the position of the carrying boat 200 needs to be corrected.

[0081] On the other hand, Figure 1 As shown, the position of the carrying boat 200 can also be verified by using the sensor E and the sensor I. The distance between the sensor E and the sensor I is equal to the length of the carrying boat 200. The position of the carrying boat 200 can be verified by judging the triggering state of the sensor E and the sensor I. If the sensor E and the sensor I are both in the triggering state, it means that the position of the carrying boat 200 is accurate; if the sensor E and the sensor I are not all in the triggering state, it means that the position of the carrying boat 200 is inaccurate.

[0082] The above two methods of verifying the position of the carrier boat 200 may be used either alone or in combination to achieve a secondary verification, thereby further improving the accuracy of the position of the carrier boat 200 .

[0083] Step 105: If the position of the carrying boat 200 passes the verification, the blocking mechanism 116 is controlled to be in the second position.

[0084] like Figures 5 to 8 As shown, if the position of the carrier boat 200 passes the verification, it means that the carrier boat 200 is in the preset position of the chamber body 110, and the baffle mechanism 116 can be controlled to be in the second position, and the baffle mechanism 116 is separated from the plug-in end of the electrode rod 115, so that the plug-in end can be extended into the electrode hole to realize the conduction of the process circuit.

[0085] If the position of the carrying boat 200 fails to pass the verification, it means that there is a deviation in the position of the carrying boat 200. In this case, the baffle mechanism 116 can be controlled to be in the first position, and the baffle mechanism 116 abuts against the plug-in end of the electrode rod 115 to block the plug-in end from extending into the electrode hole of the carrying boat 200, thereby preventing the electrode rod 115 from being inserted incorrectly and causing damage to the electrode hole or even the carrying boat 200.

[0086] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0087] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process equipment, characterized in that: It comprises a conveying mechanism (120), a carrying boat (200) and a process chamber (100); The process chamber (100) comprises a chamber body (110), wherein the chamber body (110) comprises a first chamber (111) and a second chamber (112), wherein the second chamber (112) is arranged in the first chamber (111), and the second chamber (112) is used to accommodate the carrier boat (200), and the conveying mechanism (120) extends into the chamber body (110) and is used to convey the carrier boat (200) into the chamber body (110); The process chamber (100) is provided with a beam sensor (1321), and the beam sensor (1321) comprises a transmitting end (1321a) and a receiving end (1321b); Two opposite side walls of the first chamber (111) are respectively provided with a first light-transmitting hole, and two opposite side walls of the second chamber (112) are respectively provided with a second light-transmitting hole, and the first light-transmitting hole and the second light-transmitting hole are coaxially arranged; The transmitting end (1321a) and the receiving end (1321b) are respectively arranged on two opposite side walls of the first chamber (111), and transmitting and receiving are achieved through the first light-transmitting hole and the second light-transmitting hole; The process chamber (100) is further provided with a sleeve (133), the two ends of which are respectively connected to the inner wall of the first chamber (111) and the outer wall of the second chamber (112), and the two ends of which are respectively connected to the first light-transmitting hole and the second light-transmitting hole.

2. The semiconductor process equipment according to claim 1, characterized in that: The chamber body (110) further comprises a support member (113), wherein the support member (113) is disposed between an inner wall of the first chamber (111) and an outer wall of the second chamber (112) and is used to support the second chamber (112).

3. The semiconductor process equipment according to claim 2, characterized in that: The chamber body (110) further comprises a heat insulating member (114), wherein the heat insulating member (114) is disposed between the support member (113) and an outer wall of the second chamber (112).

4. The semiconductor process equipment according to claim 1, characterized in that: The air pressure value of the first chamber (111) is not less than the air pressure value of the second chamber (112).

5. The semiconductor process equipment according to claim 1, characterized in that: It also includes a sensor component (130), which is respectively arranged on the side wall of the conveying mechanism (120) and the chamber body (110) and is used to detect the position information of the carrying boat (200).

6. The semiconductor process equipment according to claim 5, characterized in that: The conveying mechanism (120) comprises a loading area (121) and a first driving mechanism (122) arranged in the loading area (121), and the loading area (121) is located outside the chamber body (110); The sensor assembly (130) comprises a first sensor group (131) arranged in the loading area (121), the first sensor group (131) is used to detect position information of the supporting boat (200), and the first driving mechanism (122) is used to control the movement or stop of the supporting boat (200) according to the position information.

7. The semiconductor process equipment according to claim 6, characterized in that: The first sensor group (131) comprises a posture sensor (1311) and a displacement sensor (1312); the posture sensor (1311) is used to detect whether the carrying boat (200) is offset; and the displacement sensor (1312) is used to detect the displacement distance of the carrying boat (200).

8. The semiconductor process equipment according to claim 5, characterized in that: The sensor assembly (130) also includes a second sensor group (132) arranged on the side wall of the chamber body (110), and the conveying mechanism (120) includes a second driving mechanism (123) penetrating the chamber body (110), and the second sensor group (132) is used to detect the position information of the supporting boat (200), and the second driving mechanism (123) is used to control the movement or stop of the supporting boat (200) according to the position information.

9. The semiconductor process equipment according to claim 8, characterized in that: The second sensor group (132) includes at least two opposing beam sensors (1321), and the opposing beam sensors (1321) include a transmitting end (1321a) and a receiving end (1321b); Two opposite side walls of the first chamber (111) are respectively provided with a first light-transmitting hole, and two opposite side walls of the second chamber (112) are respectively provided with a second light-transmitting hole, and the first light-transmitting hole and the second light-transmitting hole are coaxially arranged; The transmitting end (1321a) and the receiving end (1321b) are respectively arranged on two opposite side walls of the first chamber (111), and transmitting and receiving are achieved through the first light-transmitting hole and the second light-transmitting hole.

10. The semiconductor process equipment according to claim 1, characterized in that: The sleeve (133) comprises a first sleeve (1331), a second sleeve (1332) and a third sleeve (1333); the third sleeve (1333) is sleeved on the first sleeve (1331) and the second sleeve (1332), and is slidably connected to the first sleeve (1331) and the second sleeve (1332) respectively; A first flange (1335) is provided at one end of the first sleeve (1331) facing away from the second sleeve (1332), and the first sleeve (1331) is connected to the inner wall of the first chamber (111) via the first flange (1335); A second flange (1336) is provided at one end of the second sleeve (1332) facing away from the first sleeve (1331), and the second sleeve (1332) is connected to the outer wall of the second chamber (112) via the second flange (1336).

11. The semiconductor process equipment according to claim 10, characterized in that: The sleeve (133) further comprises a sealing member (1334), wherein the sealing member (1334) is arranged in an assembly gap between the first sleeve (1331) and the third sleeve (1333), and / or between the second sleeve (1332) and the third sleeve (1333).

12. The semiconductor process equipment according to claim 1, characterized in that: The transmission mechanism (120) further comprises an encoder (124) and a controller, wherein the controller is electrically connected to the encoder (124), the encoder (124) is used to collect statistics on displacement information of the carrying boat (200), and the controller is used to obtain the displacement information and compare the displacement information with preset displacement information.

13. The semiconductor process equipment according to claim 9, characterized in that: The second sensor group (132) includes a first counter-radiation sensor (1322) and a second counter-radiation sensor (1323). Along the transmission direction of the conveying mechanism (120), the distance between the first counter-radiation sensor (1322) and the second counter-radiation sensor (1323) is equal to the length of the supporting boat (200).

14. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises an electrode rod (115) and a baffle mechanism (116); the electrode rod (115) is telescopically arranged on the outer wall of the first chamber (111); the electrode rod (115) is provided with a plug-in end; the carrying boat (200) is provided with an electrode hole; the plug-in end is used to extend into the second chamber (112) and be plugged into the electrode hole; The baffle mechanism (116) is connected to the side wall of the chamber body (110) and at least partially extends into the second chamber (112). The baffle mechanism (116) has a first position and a second position relative to the electrode rod (115). When the baffle mechanism (116) is in the first position, the baffle mechanism (116) abuts against the plug-in end to prevent the plug-in end from extending into the electrode hole. When the baffle mechanism (116) is in the second position, the baffle mechanism (116) is separated from the plug-in end to allow the plug-in end to extend into the electrode hole.

15. The semiconductor process equipment according to claim 14, characterized in that: The baffle mechanism (116) comprises a driving member (1161), a transmission shaft (1162) and a baffle body (1163); The driving member (1161) is arranged on the side wall of the chamber body (110), the transmission shaft (1162) is penetrated through the side wall of the chamber body (110) and is connected to the output end of the driving member (1161), and at least a portion of the transmission shaft (1162) extends into the second chamber (112), the baffle body (1163) is connected to one end of the transmission shaft (1162) away from the driving member (1161), and the driving member (1161) drives the baffle body (1163) to abut or separate from the plug-in end through the transmission shaft (1162).

16. The semiconductor process equipment according to claim 14, characterized in that: The inner wall of the second chamber (112) is provided with a guide wheel (1121), and the guide wheel (1121) is used for guiding and cooperating with the carrying boat (200).

17. A control method for semiconductor process equipment, applied to the semiconductor process equipment according to any one of claims 1 to 16, characterized in that: The control method comprises: Acquiring position information of the carrier boat (200) located in the process chamber (100); When it is determined according to the position information that the carrying boat (200) is at a preset position, the carrying boat (200) is controlled to stop running.

18. The control method according to claim 17, wherein the semiconductor process equipment comprises an electrode rod (115), wherein the electrode rod (115) is telescopically arranged on the outer wall of the first chamber (111), wherein the electrode rod (115) is provided with a plug-in end, and the carrying boat (200) is provided with an electrode hole, wherein the plug-in end is used to extend into the second chamber (112) and be plugged into the electrode hole, wherein: After determining that the carrying boat (200) is at a preset position according to the position information and controlling the carrying boat (200) to stop running, the control method further comprises: The electrode rod (115) is controlled to extend into the electrode hole of the carrying boat (200).

19. The control method according to claim 18, wherein the semiconductor process equipment further comprises a baffle mechanism (116), wherein the baffle mechanism (116) is connected to a side wall of the chamber body (110) and at least partially extends into the second chamber (112), wherein the baffle mechanism (116) has a first position and a second position relative to the electrode rod (115), wherein when the baffle mechanism (116) is in the first position, the baffle mechanism (116) abuts against the plug-in end to prevent the plug-in end from extending into the electrode hole, and when the baffle mechanism (116) is in the second position, the baffle mechanism (116) is separated from the plug-in end to allow the plug-in end to extend into the electrode hole, wherein: After determining that the carrying boat (200) is at a preset position according to the position information, and then controlling the carrying boat (200) to stop running, and before controlling the electrode rod (115) to extend into the electrode hole of the carrying boat (200), the control method further comprises: Verifying the position of the carrying boat (200); If the position of the carrying boat (200) passes the verification, the baffle mechanism (116) is controlled to be in the second position.

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