Temperature sensor and method for manufacturing the same

Abstract

A thin temperature sensor is provided which can maintain the connection of the conductor between the first supporting film and the second supporting film even if the air existing between the first supporting film and the second supporting film expands during the manufacturing process accompanied by the bonding by heating. The temperature sensor (1) of the present invention comprises: a first supporting film (30) and a second supporting film (50) which are made of an electrically insulating material and are arranged opposite to each other; a heat-sensitive body (11) which is provided between the first supporting film (30) and the second supporting film (50) and whose electrical characteristics change with temperature; and a bonding body (54) which bonds the first supporting film (30) and the second supporting film (50). The first supporting film (30) and the second supporting film (50) have a width direction (W) and a length direction (L). The bonding body (54) is provided on both sides of the width direction (W) with the heat-sensitive body (11) sandwiched therebetween.

Description

Technical Field

[0001] The present invention relates to a temperature sensor that can be made thinner. Background Art

[0002] There are temperature sensors that detect temperature using thermistors (short for thermally sensitive resistors) that have electrical properties such as resistance that changes depending on temperature. There are various objects to be measured by this temperature sensor, and the temperature sensor is required to have tolerance corresponding to the environment in which it is used. Examples of tolerance include heat resistance, water resistance, chemical resistance, and oil resistance. In addition, depending on the relationship with the object to be measured, there are also requirements for the size and shape of the temperature sensor. Regarding size and shape, for example, there is a requirement for a thin temperature sensor that can be inserted into a very small space to measure the temperature of the object to be measured.

[0003] As a thin temperature sensor, there is a device disclosed in Patent Document 1, for example. The temperature sensor disclosed in Patent Document 1 includes: a first supporting film made of an electrically insulating material; a second supporting film laminated on the first supporting film and made of an electrically insulating material; and a sensor element provided between the first supporting film and the second supporting film. The temperature sensor is arranged so that the first supporting film and the second supporting film are opposed to each other in a region where a heat-sensitive body is provided. The temperature sensor of Patent Document 1 is easy to manufacture and thin.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2021 / 145088 Summary of the invention

[0007] Problems to be solved by the invention

[0008] Patent Document 1 discloses a case where the first supporting film and the second supporting film are laminated by bonding accompanied by heating. Since the temperature sensor of Patent Document 1 has a thickness of 0.5 mm or less, preferably thinner, 0.3 mm or less, if air enters between the first supporting film and the second supporting film during bonding, it is possible that the connection of the conductor between the first supporting film and the second supporting film is adversely affected by expansion due to heating.

[0009] In view of the above, an object of the present invention is to provide a thin temperature sensor capable of maintaining connection of a conductor between a first supporting film and a second supporting film even if air existing between the first supporting film and the second supporting film expands during a manufacturing process involving bonding by heating.

[0010] Means used to solve problems

[0011] The temperature sensor of the present invention comprises: a first supporting film and a second supporting film, which are made of an electrically insulating material and are arranged opposite to each other; a sensor element, which is provided between the first supporting film and the second supporting film and includes a heat-sensitive body whose electrical characteristics change with temperature; and a bonding body, which bonds the first supporting film and the second supporting film around the heat-sensitive body.

[0012] The bonded body is provided in at least two regions which sandwich the heat-sensitive body and are spaced apart by a predetermined distance in the planar direction of the first supporting film and the second supporting film.

[0013] In the temperature sensor of the present invention, preferably, a protection body made of an electrically insulating resin material and covering the heat sensitive body is provided in a region surrounded by the bonded body.

[0014] In the temperature sensor of the present invention, preferably, the second supporting film has a smaller dimension in the longitudinal direction than the first supporting film, and the junction body is provided on both sides separated by a gap in the width direction.

[0015] In the temperature sensor of the present invention, it is preferable that one or both of the first supporting film and the second supporting film have an insertion path penetrating in a thickness direction thereof and filled with a resin material constituting the protective body.

[0016] In the temperature sensor of the present invention, it is preferred that the sensor element comprises a first lead pattern and a second lead pattern which are attached to a first supporting film and a second supporting film on the same plane facing each other. The first supporting film comprises: a first conductive pad supporting a heat-sensitive body and electrically connected to the first lead pattern; and a second conductive pad electrically connected to the second lead pattern; the second supporting film comprises a third conductive pad on a surface facing a region where the heat-sensitive body is provided; and a dummy conductor corresponding to the heat-sensitive body is provided between the second conductive pad and the third conductive pad.

[0017] The manufacturing method of the temperature sensor of the present invention comprises: a first step of stacking a first supporting film composed of an electrically insulating material and having a sensor element having a heat-sensitive body attached to one side and a second supporting film composed of an electrically insulating material in a state where one side is placed on the second supporting film; and a second step of bonding the first supporting film and the second supporting film using a bonding body.

[0018] In the second step of the present invention, the bonded bodies are provided so as to sandwich the heat-sensitive body and have a passage communicating between the heat-sensitive body and the outside.

[0019] The method for manufacturing a temperature sensor of the present invention preferably includes a third step of supplying a resin material composed of an electrically insulating material around the heat sensitive body and between the first supporting film and the second supporting film to form a protective body.

[0020] In the manufacturing method of the temperature sensor of the present invention, it is preferred that, in the first step, the first supporting film and the second supporting film have a width direction and a length direction, and the second supporting film has a smaller dimension in the length direction than the first supporting film; in the second step, the assembly is arranged on both sides separated by a gap in the width direction.

[0021] In the method for manufacturing a temperature sensor of the present invention, preferably, in the first step, an insertion passage penetrating in the thickness direction of the first supporting film or the second supporting film is provided on one or both of the first supporting film and the second supporting film; and in the third step, the resin material is supplied through the insertion passage.

[0022] Effects of the Invention

[0023] According to the present invention, before the protection body is provided, there is a passage without a bonding body between the first supporting film and the second supporting film. Therefore, even if air expands between the first supporting film and the second supporting film, the air is discharged to the outside through the passage according to the amount of expansion. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A temperature sensor according to the first embodiment is shown. Figure 1 (a) is a top view, Figure 1 (b) is a bottom view.

[0025] Figure 2 1 shows elements constituting a first supporting film of the temperature sensor according to the first embodiment. Figure 2 (a) is a top view of the base. Figure 2 (b) is a top view of the cover.

[0026] Figure 3 1 shows elements constituting the second supporting film of the temperature sensor according to the first embodiment. Figure 3 (a) is a top view of the base. Figure 3 (b) is a top view of the cover.

[0027] Figure 4 The temperature sensor according to the first embodiment is shown in FIG. Figure 1 Sectional view taken along line IV-IV.

[0028] Figure 5 The temperature sensor according to the first embodiment is shown in FIG. Figure 1 Sectional view along the V-V line.

[0029] Figure 6 The temperature sensor according to the first embodiment is shown in FIG. Figure 1 Sectional view taken along line VI-VI.

[0030] Figure 7The three views are a plan view (PV), a side view (SV), and a front view (FV) showing the thermistor used in the temperature sensor according to the first embodiment.

[0031] Figure 8 This is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment and a process for manufacturing the first supporting film.

[0032] Fig. 9 This is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, and a process for manufacturing the second supporting film.

[0033] Fig.10 This is a diagram showing a procedure for manufacturing the temperature sensor according to the first embodiment, and a step of bonding a first supporting film and a second supporting film.

[0034] Fig.11 A temperature sensor according to a second embodiment is shown. Fig.11 (a) is a top view, Fig.11 (b) is a bottom view.

[0035] Fig.12 The temperature sensor according to the second embodiment is shown in FIG. Figure 1 Sectional view taken along line XII-XII.

[0036] Fig.13 A temperature sensor according to the second embodiment is shown. Figure 1 Sectional view taken along line XIII-XIII.

[0037] Fig.14 (a) is a top view showing a temperature sensor according to an embodiment of the present invention, Fig.14 (b) is a plan view showing an extension support film connected to the temperature sensor.

[0038] Fig.15 A diagram showing a procedure for connecting an extension support film to a temperature sensor according to an embodiment. DETAILED DESCRIPTION

[0039] Below, while referring to the attached Figure 1 A temperature sensor according to the present embodiment will be described below. A temperature sensor 1 according to the first embodiment and a temperature sensor 2 according to the second embodiment will be described below.

[0040] <First Embodiment>

[0041] [Overall structure of temperature sensor 1: Figure 1 ]

[0042] like Figure 1As shown in FIG. 1 , the temperature sensor 1 includes a sensor element 10, a first supporting film 30, and a second supporting film 50 laminated by bonding to the first supporting film 30. In the following description, the first supporting film 30 and the second supporting film 50 are formed into rectangular shapes in a plan view, and the planar surface area of ​​the second supporting film 50 is set smaller than that of the first supporting film 30. Therefore, the second supporting film 50 covers only a portion of the front of the first supporting film 30 including the area where the heat-sensitive body 11 is provided.

[0043] In temperature sensor 1, if Figure 1 As shown, the side of the sensor element 10 where the heat-sensitive body 11 is provided is defined as the front (F), and the opposite side of the front (F) is defined as the back (B). The front (F) is referred to as the front (F), the front end (F), etc. depending on the situation. The same applies to the back (B).

[0044] Furthermore, in the temperature sensor 1, as Figure 1 As shown, a width direction (W) and a length direction (L) are defined.

[0045] Furthermore, in the temperature sensor 1 , the side where the second supporting film 50 is provided is defined as the front side, and the opposite side is defined as the back side.

[0046] [Sensor element 10: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 ]

[0047] Between the first supporting film 30 and the second supporting film 50 , a main portion of the sensor element 10 is provided as described below.

[0048] The sensor element 10 is Figure 1 and Figure 2 As shown in the figure, the sensor element 10 includes a first conductive pad 14 made of copper foil, a heat-sensitive body 11 having a thermistor as a component electrically connected to the first conductive pad 14, and a first lead pattern 12 electrically connected to the heat-sensitive body 11. In addition, the sensor element 10 includes a second conductive pad 15 made of copper foil and a second lead pattern 16 electrically connected to the second conductive pad 15. The sensor element 10 includes a pseudo conductor 9 electrically connected to the second conductive pad 15. The pseudo conductor 9 is provided corresponding to the heat-sensitive body 11.

[0049] The heat-sensitive body 11 and the first conductive pad 14 are as follows Figure 1 and Figure 4As shown in FIG. 1 , the second conductive pad 15 is arranged near the front end (F) of the temperature sensor 1 and in the center of the width direction (W). In addition, the second conductive pad 15 is arranged near the rear end (B) of the heat-sensitive body 11 and in the center of the width direction (W). That is, the heat-sensitive body 11 (first conductive pad 14) and the pseudo conductor 9 (second conductive pad 15) are spaced apart in the length direction (L), and are arranged in the order of the heat-sensitive body 11 and the second conductive pad 15 from the front end (F) side at a position that divides the temperature sensor 1 into two equal parts in the width direction (W).

[0050] The first lead pattern 12 is as follows Figure 1 and Figure 2 As shown, the heat-sensitive body 11 (first conductive pad 14) is extended in one direction in the width direction (W) (in Figure 1 After being led out (right in (a), it extends straight toward the rear end (B) and has an L-shaped shape when viewed from above. The first terminal pad 13 is electrically connected to the rear end (B) side of the first lead pattern 12. The first terminal pad 13 is formed to be wider than the first lead pattern 12 and is connected to an external terminal or the like.

[0051] The second lead pattern 16 is as follows Figure 1 and Figure 2 As shown, the second conductive pad 15 is extended from the pseudo conductor 9 (second conductive pad 15) to the other side in the width direction (W) (in Figure 1 The second lead pattern 16 is led out (left side in (a)), extends straight toward the rear end (B), and has an L-shaped shape when viewed from above. The rear end (B) side of the second lead pattern 16 is electrically connected to the second terminal pad 17. The second terminal pad 17 is formed to be wider than the second lead pattern 16 and is connected to an external terminal or the like.

[0052] The first lead pattern 12 and the second lead pattern 16 are as shown in FIG. Figure 1 and Figure 2 As shown, as an example, they have the same width and are arranged in parallel with each other. The first lead pattern 12 and the second lead pattern 16 are formed of a conductive material formed on the first support film 30, for example, a foil formed of a copper alloy. The first support film 30 and the second support film 50 are formed of a so-called single-sided FPC (Flexible Printed Circuits), and the first lead pattern 12, the first terminal pad 13, the second lead pattern 16 and the second terminal pad 17 correspond to the circuit portion of the FPC.

[0053] The first lead pattern 12 and the second lead pattern 16 are sandwiched between a base 31 and a cover 33 described later, and are buried inside the thickness direction of the first supporting film 30. In contrast, the first terminal pad 13 and the second terminal pad 17 connected to the first lead pattern 12 and the second lead pattern 16 are interrupted by the cover 33 near the rear end (B) of the first supporting film 30 and are opened to the surface side.

[0054] The sensor element 10 is Figure 1 and Figure 3 As shown in the figure, the 3A conductive pad 18, the 3B conductive pad 19 and the 3C conductive pad 21 are provided to electrically connect the heat-sensitive body 11 (first conductive pad 14) and the second conductive pad 15. The 3A conductive pad 18 is provided at a position corresponding to the heat-sensitive body 11 and the first conductive pad 14, and the second lead pattern 16 and the 3A conductive pad 18 are electrically connected with the heat-sensitive body 11 sandwiched therebetween. In addition, the 3B conductive pad 19 is provided at a position corresponding to the second conductive pad 15, and the second conductive pad 15 and the third conductive pad 19 are electrically connected. The 3A conductive pad 18 and the 3B conductive pad 19 are electrically connected by the 3C conductive pad 21. The 3A conductive pad 18, the 3B conductive pad 19 and the 3C conductive pad 21 are integrally formed and attached to the second support film 50.

[0055] Thermosensitive body 11 Figure 7 As shown in FIG. 1 , the temperature sensor 1 includes a thermistor 11A, a first electrode 11B provided on one side of the thermistor 11A, and a second electrode 11C provided on the other side of the thermistor 11A. The heat-sensitive body 11 is arranged, for example, with the first electrode 11B facing the first conductive pad 14 and the second electrode 11C facing the third conductive pad 18. That is, the heat-sensitive body 11 is arranged with the first electrode 11B and the second electrode 11C along the front and back sides of the temperature sensor 1. Regardless of the arrangement of the heat-sensitive body 11, the first lead pattern 12 and the second lead pattern 16 of the temperature sensor 1 are formed on the same plane.

[0056] The thermistor 11A has a characteristic that the resistance changes greatly with temperature changes. Among the thermistors, there are NTC (Negative Temperature Coefficient) thermistors whose resistance value decreases when the temperature rises, and PTC (Positive Temperature Coefficient) thermistors whose resistance value is constant within a certain temperature and whose resistance value increases sharply at a certain temperature. In the thermistor 11A of this embodiment, either NTC or PTC thermistors can be used.

[0057] The first electrode 11B and the first electrode 11B are made of gold, silver, copper, platinum, or the like, and are formed on both the front and back surfaces of the thermistor 11A by vapor deposition or the like.

[0058] The thermistor 11A of the present embodiment has dimensions in the width direction (W), length direction (L), and thickness direction, for example, ranging from 0.3 to 0.5 mm. The heat-sensitive body 11 is not provided with a protective layer such as glass that covers the thermistor 11A, the first electrode 11B, and the second electrode 11C from the periphery. Thus, the size of the heat-sensitive body 11 is reduced.

[0059] [First supporting film 30: Figure 2 , Figure 4 , Figure 5 , Figure 6 ]

[0060] Next, the first supporting film 30 provided on the rear side of the temperature sensor 1 will be described.

[0061] The first supporting film 30 is an element for supporting the sensor element 10, and is composed of an FPC as an example. Figure 2 , Figures 4 to 6 As shown in the figure, the sensor element 10 includes a base 31, a cover 33 disposed opposite to the base 31, and a conductive pattern 35 in the receiving holes 43 and 45 cut out on the surface of the base 31 and the cover 33. The first lead pattern 12, the first terminal pad 13, the first conductive pad 14, the second conductive pad 15, the second lead pattern 16, and the second terminal pad 17, which are components of the sensor element 10, are constituted by the conductive pattern 35. That is, they are disposed on the same plane on the surface side of the first lead pattern 12 and the second lead pattern 16. Figure 4 and Figure 5 The shapes and thicknesses of the base 31, cover 33, and conductive pattern 35 in the above-mentioned examples do not reflect the entity. In addition, in the present embodiment, the film refers to a component that is sufficiently thin relative to the area. In the FPC, the base 31, cover 33, and conductive pattern 35 are, for example, 50 μm or less, preferably 30 μm or less, and more preferably 20 μm or less, respectively, but their area is sufficiently greater than 50 mm. 2 The membrane of this embodiment is not directly related to its rigidity. That is, when it is made into a cantilever structure, it includes the degree from which the supporting part is bent due to its own weight and cannot maintain the original flat shape to the degree that it can maintain the flat state.

[0062] The base 31 and the cover 33 are made of an electrically insulating material, for example, polyimide, and the conductive pattern 35 is made of copper foil for example. The manufacturing process of FPC is well known, so the description here is omitted. In addition, there is a case where a bonding layer of an adhesive is formed between the base 31 and the conductive pattern 35 and between the cover 33 and the conductive pattern 35, but in Figure 4 , Figure 5 and Figure 6 The record is omitted.

[0063] [Second supporting film 50: Figure 3 , Figure 4 , Figure 5 , Figure 6 ]

[0064] Next, the second supporting film 50 provided on the front side of the temperature sensor 1 will be described.

[0065] The second supporting film 50 is a component for electrically connecting the heat sensitive body 11 and the second conductive pad 15 .

[0066] The second supporting film 50 is also made of FPC like the first supporting film 30. Figure 3 , Figures 4 to 6 As shown, the second supporting film 50 includes a base 51, a cover 53 disposed opposite to the base 51, and a conductive pattern 55. The conductive pattern 55 on the second supporting film 50 is electrically connected to the second conductive pad 15 in addition to being electrically connected to the heat-sensitive body 11.

[0067] The 3A conductive pad 18, 3B conductive pad 19, and 3C conductive pad 21, which are components of the sensor element 10, are formed by the conductive pattern 55. Therefore, the 3A conductive pad 18, 3B conductive pad 19, and 3C conductive pad 21 are bonded to the same plane of the second supporting film 50 that faces the first supporting film 30.

[0068] Next, the conductive pattern 55 is as shown in FIG. Figure 3 As shown in FIG. 1 , the 3A conductive pad 18, the 3B conductive pad 19, and the 3C conductive pad 21, which are components of the sensor element 10, are formed. An insulating gap 56 is formed between the 3A conductive pad 18 and the 3B conductive pad 19 on the conductive pattern 55. The insulating gap 56 penetrates not only the conductive pattern 55 but also the base 51 in the thickness direction. When the base 51 and the cover 53 are stacked, the insulating gap 56 is arranged between the receiving hole 63 and the receiving hole 65 of the cover 53 in the length direction (L).

[0069] [Lamination structure of the first supporting film 30 and the second supporting film 50: Figure 1 , Figure 4 , Figure 5 , Figure 6 ]

[0070] The first supporting film 30 and the second supporting film 50 are bonded together using a double-sided tape 54 as a bonding body.

[0071] Double-sided tape 54 Figure 1 , Figure 5 and Figure 6As shown in FIG. 1 , the first supporting film 30 and the second supporting film 50 are respectively provided on both sides of the width direction (W) to bond the first supporting film 30 and the second supporting film 50. The double-sided tape 54 is only bonded on both sides of the width direction (W), so as shown in FIG. Figure 4 , Figure 5 and Figure 6 As shown, there is a gap connected to the length direction (L) between the double-sided tapes 54, 54 on both sides of the width direction (W). In the gap, there is a protective body 7 made of an electrically insulating resin material, which covers the pseudo conductor 9, the heat-sensitive body 11, and the surroundings of the bonding bodies 37, 39, 57, and 59. The protective body 7 is obtained by injecting a resin material into the gap after manufacturing the temperature sensor 1 having the gap. In this way, the double-sided tapes 54, 54 on both sides of the width direction (W) bond the first supporting film 30 to the second supporting film 50 around the heat-sensitive body 11. The resin material constituting the protective body 7 is not limited, and it is preferred to use, for example, epoxy resin, silicone resin, silicone paint, etc. In addition, the second supporting film 50 has the same size in the width direction (W) as the first supporting film 30, but a smaller size in the length direction (L).

[0072] The gap between the first supporting film 30 and the second supporting film 50 performs two functions.

[0073] The first function is to discharge the air between the first supporting film 30 and the second supporting film 50 to the outside when the first supporting film 30 and the second supporting film 50 are bonded together. Since the bonding is accompanied by heating, the air is discharged according to the thermal expansion.

[0074] The second function is to discharge the air between the first supporting film 30 and the second supporting film 50 to the outside when the protective body 7 is provided. The resin material constituting the protective body 7 is injected into the narrow gap, but the air is discharged to the outside through the gap according to the injected resin material.

[0075] As described above, the gap between the first supporting film 30 and the second supporting film 50 that exists before the protection body 7 is formed can be said to be a passage for exhausting air.

[0076] [Electrical connection relationship: Figure 4 , Figure 5 , Figure 6 ]

[0077] like Figure 4 and Figure 5 As shown in FIG. 1 , a conductive bonding body 37 is provided between the heat-sensitive body 11 and the first conductive pad 14, and a conductive bonding body 57 is provided between the heat-sensitive body 11 and the conductive pattern 55. Figure 6As shown in FIG. 1 , a conductive bonding body 39, a bonding body 59, and a pseudo conductor 9 are provided between the second conductive pad 15 and the conductive pattern 55. In this way, the sensor element 10 forms a circuit by the first lead pattern 12, the heat-sensitive body 11, the pseudo conductor 9, and the second lead pattern 16. That is, the sensor element 10 is electrically connected in the order of the first lead pattern 12, the pseudo conductor 9, the 3B conductive pad 19, the 3C conductive pad 21, the 3A conductive pad 18, the heat-sensitive body 11, the first conductive pad 14, the second conductive pad 15, and the second lead pattern 16.

[0078] The material used in the joint bodies 57, 59, etc. is arbitrary, for example, a conductive adhesive is selected. Conductive adhesives are widely used materials in which conductive additives are dispersed in adhesive resins such as epoxy and polyurethane, and these additives form a conductive path after bonding to achieve conductive bonding. As conductive additives, in addition to metal powders such as copper, nickel, and silver, carbon-based materials such as graphite or CNT (carbon nanotubes) can also be used.

[0079] [Method of Manufacturing Temperature Sensor 1]

[0080] Next, refer to Figure 8 to Figure 10 , describing the procedure for manufacturing the temperature sensor 1.

[0081] [First supporting film 30: Figure 8 ]

[0082] First, refer to Figure 8 The first supporting film 30 will be described.

[0083] like Figure 8 As shown in (a), the first FPC 41 as the precursor of the first supporting film 30 is prepared. In the first FPC 41, the receiving holes 43 and 45 of the heat-sensitive body 11 and the bonding bodies 37 and 39 are already formed. The receiving holes 43 and 45 are formed by etching the cover 33. In addition, in the first FPC 41, the same reference numerals as those of the first supporting film 30 are given to the same components as those of the first supporting film 30, and their descriptions are omitted.

[0084] like Figure 8 As shown in (b), the bonding bodies 37 and 39 are applied to the receiving holes 43 and 45 provided in the first FPC 41. The bonding bodies 37 and 39 are electrically connected to the surfaces of the first and second via pads 14 and 15 in the receiving holes 43 and 45, respectively.

[0085] Then, if Figure 8 As shown in (c), the heat-sensitive body 11 is placed on the top of the bonding body 37 disposed in the receiving hole 43. The heat-sensitive body 11 has one of the first electrode 11B and the second electrode 11C (not shown) in contact with the bonding body 37. Figure 8As shown in (c), the pseudo conductor 9 is placed on the top of the joint 39 arranged in the receiving hole 45. The pseudo conductor 9 is made of a conductive material having the same shape and size as the heat-sensitive body 11. The pseudo conductor 9 is provided in order to make the dimensions of the portion where the heat-sensitive body 11 is provided and the portion where the pseudo conductor 9 is provided equal in the thickness direction (T).

[0086] The first FPC 41 as a precursor of the first supporting film 30 obtained in the above manner is provided for bonding with the second FPC 61 as a precursor of the second supporting film 50 .

[0087] [Second supporting film 50: Fig. 9 ]

[0088] Next, refer to Fig. 9 , the second supporting film 50 will be described.

[0089] like Fig. 9 As shown in (a), a second FPC 61 as a precursor of the second supporting film 50 is prepared. In the second FPC 61, receiving holes 63 and 65 for arranging the bonding bodies 57 and 59 are pre-formed. The receiving holes 63 and 65 are formed by laser processing the cover 53 as an example. In addition, in the second FPC 61, the same reference numerals as those of the second supporting film 50 are given to the same components as those of the second supporting film 50, and their descriptions are omitted.

[0090] like Fig. 9 As shown in (b), the bonding bodies 57 and 59 are applied to the receiving holes 63 and 65 of the second FPC 61, respectively. The bonding bodies 57 and 59 are electrically connected to the surface of the 3B conductive pad 19 in the receiving holes 63 and 65. In addition, on the second FPC 61, the double-sided tape 54 is attached to the cover 53. The double-sided tape 54 is as shown in FIG. Figure 5 As shown in the figure, it is arranged on both sides in the width direction (W).

[0091] The second FPC 61 obtained as described above is bonded to the first FPC 41 .

[0092] [The bonding of the first FPC41 and the second FPC61: Fig.10 ]

[0093] Then, if Fig.10 As shown in (a), the first FPC 41 and the second FPC 61 are aligned. The first FPC 41 and the second FPC 61 are arranged in a manner that the cover 33 and the cover 53 (double-sided tape 54) are opposite to each other. This alignment means that the joint bodies 37, 39 of the first FPC 41 and the joint bodies 57, 59 of the second FPC 61 are placed in the same position in the length direction (L).

[0094] After the first FPC 41 and the second FPC 61 are aligned, the first FPC 41 and the second FPC 61 are stacked (first step). Fig.10 As shown in (b), the bonded body 57 is in contact with the heat-sensitive body 11, and the bonded body 59 is in contact with the dummy conductor 9. In the stacked state, the cover 33 of the first FPC 41 and the cover 53 of the second FPC 61 are bonded (second step). This bonding is performed via the double-sided tape 54.

[0095] Then, the resin material RM for forming the protection body 7 is injected into the passage AP which is the gap between the cover 33 and the cover 53. The injected resin material RM is hardened to form a Figures 4 to 6 The protective body 7 shown in FIG. 1 is formed (third step). By forming the protective body 7, the passage AP is filled with the resin material RM.

[0096] Through the above-mentioned procedures, the temperature sensor 1 is obtained.

[0097] [Effects of the First Embodiment]

[0098] Next, the effects achieved by the temperature sensor 1 will be described.

[0099] [First effect: gap in the length direction (L)]

[0100] In the temperature sensor 1, only the ends of the first supporting film 30 and the second supporting film 50 in the width direction (W) are bonded by the double-sided tape 54 along the length direction (L). Before the resin material for the protective body 7 is supplied, a gap is provided throughout the length direction (L) of the temperature sensor 1 except for the portion of the double-sided tape 54. That is, the temperature sensor 1 forms a passage AP connected in the length direction (L) between the first supporting film 30 and the second supporting film 50.

[0101] Here, if ventilation in the width direction (W) and the length direction (L) is cut off between the first supporting film 30 and the second supporting film 50, the expanded air has no place to escape, and pressure may be applied to the conductive portion by the expanded air, causing poor connection.

[0102] On the other hand, according to the temperature sensor 1 including the passage AP in the longitudinal direction (L), even if air expands between the first supporting film 30 and the second supporting film 50 , the air is discharged to the outside through the passage AP in an amount corresponding to the expansion.

[0103] [Second effect: Elimination of step difference]

[0104] The temperature sensor 1 is provided with a pseudo conductor 9 having the same thickness as the heat-sensitive body 11 between the junction body 39 and the junction body 59. Thus, the dimension in the thickness direction (T) from the junction body 37 with the heat-sensitive body 11 therebetween to the junction body 57 can be made equal to the dimension in the thickness direction (T) from the junction body 39 with the pseudo conductor 9 therebetween to the junction body 59. Thus, the temperature sensor 1 includes a portion where the heat-sensitive body 11 is arranged and a portion where the pseudo conductor 9 is arranged, and the dimension in the thickness direction (T) can be made uniform.

[0105] Here, if the pseudo conductor 9 is present, the size of the portion where the heat-sensitive body 11 is disposed in the thickness direction (T) becomes larger than that of other portions. In this case, when the first supporting film 30 and the second supporting film 50 are thermally pressed together, stress based on the size is generated on the second supporting film 50, so that the portion where the heat-sensitive body 11 is disposed becomes difficult to bond.

[0106] On the other hand, the temperature sensor 1 can have a uniform dimension in the thickness direction (T) including the portion where the heat-sensitive body 11 is arranged and the portion where the dummy conductor 9 is arranged, so that stress that becomes an obstacle to bonding is less likely to occur.

[0107] [Third effect: Thinning]

[0108] The temperature sensor 1 does not have a protective layer such as glass on the heat-sensitive body 11 , and can achieve a thinner overall thickness of 0.5 mm or less, preferably 0.3 mm or less, including the first supporting film 30 and the second supporting film 50 , by utilizing FPC technology.

[0109] [Fourth effect: Fitting range]

[0110] Next, the temperature sensor 1 is formed by laminating the first supporting film 30 and the second supporting film 50, but the second supporting film 50 covers a portion of the first supporting film 30, especially the first supporting film 30 limited to the area that electrically connects the heat-sensitive body 11 and the first lead pattern 12 and the second lead pattern 16.

[0111] Here, when two films are bonded together, the larger the area of ​​the film, the more difficult it is to bond together, and the possibility of causing problems such as wrinkles increases. In addition, the larger the area of ​​the film, the higher the material cost.

[0112] In contrast to the above, in the temperature sensor 1 , since the surface area of ​​the second supporting film 50 is small, the bonding operation with the first supporting film 30 becomes easy and the material cost can be suppressed.

[0113] [Fifth Effect: Position of Heat-Sensing Body 11]

[0114] The heat-sensitive body 11 of the temperature sensor 1 is provided at a position closer to the front end (F) than the second conductive pad 15. Thus, as long as the heat-sensitive body 11 is closest to the front end (F), even if there is a temperature measurement object in the back of a narrow space, the heat-sensitive body 11 can be brought close to the measurement object by inserting the temperature sensor 1 into the space from the front end (F). Thus, the temperature sensor 1 can measure the temperature of the measurement object with good accuracy.

[0115] In addition, the temperature sensor 1 has a heat-sensitive body 11 disposed at the center in the width direction (W). Therefore, if the heat-sensitive body 11 is positioned at the center of the heat source of the measurement object, the heat from the heat source can be efficiently absorbed. Thus, the temperature sensor 1 can also measure the temperature of the measurement object with good accuracy.

[0116] However, the temperature sensor of the present invention is not limited to these positions, and the heat-sensitive body 11 can be arranged at other positions. For example, based on the position of the object to be measured, the positions of the first conductive pad 14 and the second conductive pad 15 electrically connected to the heat-sensitive body 11 can be set to be opposite in the length direction L, or the position of the heat-sensitive body 11 can be displaced from the center in the width direction (W).

[0117] [Sixth Effect: Positional Relationship between the First Lead Pattern 12 and the Second Lead Pattern 16]

[0118] Next, the temperature sensor 1 has the first lead pattern 12 and the second lead pattern 16 formed between the base 31 of the first supporting film 30 and the cover 33. That is, the first lead pattern 12 and the second lead pattern 16 are provided on the same plane. Thus, the connection operation of the wires from one side of the temperature sensor 1 to the first terminal pad 13 and the second terminal pad 17 can be performed.

[0119] The above-mentioned electrical connection relationship is adopted in order to provide the first lead pattern 12 and the second lead pattern 16 on the same plane.

[0120] <Second embodiment: Figure 11 to Figure 13 >

[0121] Next, refer to Figure 11 to Figure 13 The temperature sensor 2 according to the second embodiment will be described. The temperature sensor 2 will be described below with respect to the differences from the temperature sensor 1 according to the first embodiment, and the parts identical to the temperature sensor 1 will be described below. Figure 11 to Figure 13 The same reference numerals as those of the temperature sensor 1 are given and the description thereof is omitted.

[0122] The temperature sensor 2 is provided with a resin material for forming the protection body 7, such as Fig.11 and Fig.12As shown in FIG. 1 , a resin material insertion path 52 is provided on the second supporting film 50. The insertion path 52 may be provided on the first supporting film 30 or on both the first supporting film 30 and the second supporting film 50.

[0123] Insertion passage 52 as Fig.11 As shown in FIG. 1 , the insertion passage 52 is provided in front (F) of the sensor element 10 of the temperature sensor 2 and in the center in the width direction (W). Fig.12 As shown in FIG. 1 , the front and back sides of the second supporting film 50 are penetrated and connected to the passage AP. Fig.12 and Fig.13 The protective body 7 is shown in FIG. 1 . However, when the first supporting film 30 and the second supporting film 50 are bonded together, the insertion passage 52 and the passage AP form a communicating gap.

[0124] After the first supporting film 30 and the second supporting film 50 are bonded together, a molten resin material is supplied from the insertion path 52. The resin material is supplied toward the sensor element 10. Fig.12 and Fig.13 As shown, the sensor element 10 is hardened after being surrounded. In this way, the sensor element 10 is surrounded by the protective body 7 made of resin material and protected from the gas environment for temperature measurement. The resin material constituting the protective body 7 is not limited, and epoxy resin, silicone resin, lacquer, etc. are preferably used.

[0125] In addition to the above, the configurations described in the above embodiments may be selected or modified as appropriate to other configurations without departing from the spirit of the present invention.

[0126] For example, prepare Fig.14 The temperature sensor 1 (first embodiment) shown in (a) is used as a standard product. However, when it is desired to lengthen the first support film 30, Fig.14 The extension support film 5 shown in (b) is connected to the temperature sensor 1 .

[0127] The extension support film 5 includes a base 71 and a pair of lead patterns 72 and 73 formed on the surface of the base 71. In addition, the extension support film 5 includes terminal pads 74 and 75 connected to one ends of the lead patterns 72 and 73, respectively, and terminal pads 76 and 77 connected to the other ends of the lead patterns 72 and 73, respectively. Furthermore, the extension support film 5 includes a cover 81 that covers from the vicinity of the connection portion of the terminal pads 74 and 75 with the lead patterns 72 and 73 to the vicinity of the connection portion of the terminal pads 76 and 77 with the lead patterns 72 and 73. The cover 81 has a filling port 83 for a resin material formed at one end thereof. In addition, the base 71, the lead patterns 72 and 73, the terminal pads 74, 75, 76, 77, and the cover 81 are made of the same material as the corresponding portions of the first support film 30 and the second support film 50. In addition, the base 71 and the cover 81 are bonded by means such as an adhesive and a double-sided tape.

[0128] The side of the extension support film 5 where the terminal pads 74 and 75 are provided is connected to the temperature sensor 1. Fig.14 The surface on the side shown in (b) is turned over, and the first terminal pad 13 of the temperature sensor 1 is connected to the terminal pad 74, and the second terminal pad 17 of the temperature sensor 1 is connected to the terminal pad 75. At this time, the base 71 and the base 31 of the temperature sensor 1 are joined by means such as an adhesive, a double-sided tape, etc.

[0129] The base 71 and the base 31 are joined, but between the connected terminal pads 13 and the terminal pads 17 and 75 in the width direction (W) are filled with an electrically insulating resin material. The filling port 83 is provided for supplying the resin material. Fig.15 As shown in (a), the cover 81 of the extension support film 5 is directed downward, and the first support film 30 and the extension support film 5 are opposed to each other.

[0130] Then, if Fig.15 As shown in (b), the first support film 30 and the extension support film 5 are aligned with each other in a state where the terminal pad 13 (17) and the terminal pad 74 (75) are in contact with each other. In the aligned state, a gap is formed between the first support film 30 and the extension support film 5. The gap is closed relative to the surrounding except for the filling port 83.

[0131] By injecting a resin material made of an electrically insulating material from the filling port 83 in the aligned state, Fig.15 As shown in (c), the gap between the base 31 and the base 71 is filled with a resin material to form a protective body 8. The protective body 8 protects the connection portion between the temperature sensor 1 and the extension support film 5.

[0132] The temperature sensors 1 and 2 described above show an example in which the heat-sensitive body 11 is sandwiched between the double-sided tapes 54 and 54 as a junction body and arranged on both sides separated by a gap in the width direction W. However, the present invention is not limited to this, and the passage AP can also be ensured if the heat-sensitive body 11 is sandwiched between the double-sided tapes 54 and 54 and arranged on both sides separated by a gap in the length direction L. In addition, the passage AP is not limited to a form that is connected in the length direction L or the width direction W. For example, in addition to providing the junction body on both sides of the width direction W, the present invention also includes a form in which the junction body is provided only on one side of the length direction L. Even in this form, since the other side of the length direction L is opened, the passage AP can be ensured. In addition, even in a form in which the junction body is provided on one side of the width direction W and one side of the length direction L, for example, the passage AP can be ensured. That is, the present invention can ensure the passage AP by providing the junction body in at least two regions separated by a predetermined gap in the plane direction of the first supporting film 30 and the second supporting film 50 with the heat-sensitive body sandwiched therebetween. The plane direction is a concept that has both the width direction W and the length direction L.

[0133] The temperature sensors 1 and 2 described above are provided with the pseudo conductor 9 to make the thickness uniform, but the present invention is not limited to this. Instead of providing the pseudo conductor 9, the thickness direction dimension of one or both of the bonded bodies 39 and 59 may be increased according to the thickness of the pseudo conductor 9.

[0134] In addition, for example, the shape and size of the temperature sensors 1 to 2 are merely examples of the present invention. Compared with the temperature sensors 1 to 3, the dimension in the length direction (L) can be made longer or shorter, and the dimension in the width direction (W) can be made longer or shorter. The same is true for the first conductive pad 14, the second conductive pad 15, etc. For example, the planar shape of these pads can be made into a shape other than a rectangle, such as a circle. In addition, the planar shape of the first supporting film 30 and the second supporting film 50 is not limited to a rectangle. For example, one end in the length direction (L) can be protruded or recessed in an arc shape. The planar shape of the first supporting film 30 and the second supporting film 50 is any trapezoidal, triangular, etc.

[0135] Furthermore, in the manufacturing procedure of the temperature sensor 1 , the heat sensitive body 11 may be provided on the second FPC 61 side of the second supporting film 50 and then laminated and bonded to the first FPC 41 of the first supporting film 30 .

[0136] In the above embodiment, the first lead pattern 12 and the second lead pattern 16 are provided on the first supporting film 30 having a larger dimension in the longitudinal direction (L), but the present invention is not limited thereto. The first lead pattern 12 and the second lead pattern 16 may be provided on the second supporting film 50 having a smaller dimension in the longitudinal direction (L).

[0137] Description of symbols

[0138] 1.2 Temperature sensor

[0139] 5 Extended support film

[0140] 7, 8 Protective body

[0141] 9 Pseudo-conductors

[0142] 10 Sensor element

[0143] 11. Heat-sensitive body

[0144] 11A Thermistor

[0145] 11B 1st electrode

[0146] 11C 2nd electrode

[0147] 121st lead pattern

[0148] 16 2nd lead pattern

[0149] 131st terminal pad

[0150] 17 2nd terminal pad

[0151] 14 1st conductive pad

[0152] 15 2nd conductive pad

[0153] 18 3A conduction pad

[0154] 19 3B conductive pad

[0155] 21 3C conductive pad

[0156] 30 1st supporting film

[0157] 31 Base

[0158] 33 Hood

[0159] 35 Conductive pattern

[0160] 37, 39 joint body

[0161] 43, 45 receiving holes

[0162] 50 Second support film

[0163] 51 Base

[0164] 52 Insertion channel

[0165] 53 Hood

[0166] 54 Double-sided tape

[0167] 55 Conductive pattern

[0168] 56 Insulation gap

[0169] 57, 59 joint

[0170] 63, 65 receiving hole

[0171] 71 Base

[0172] 72, 73 Lead pattern

[0173] 74, 75, 76, 77 terminal pads

[0174] 81 Hood

[0175] 83 Filling port

[0176] AP Path

[0177] H Horizontal direction

[0178] L Length direction

[0179] W Width direction

Claims

1. A temperature sensor, characterized in that: have: The first supporting film and the second supporting film are made of an electrically insulating material and are arranged to face each other; A sensor element, provided between the first supporting film and the second supporting film, including a heat-sensitive body whose electrical characteristics change with temperature; A bonding body, wherein the first supporting film and the second supporting film are bonded to each other around the heat-sensitive body; as well as The protective body is provided in a region sandwiched by two of the above-mentioned bonding bodies provided at a distance or in a region surrounded on three sides by three of the above-mentioned bonding bodies, and is made of an electrically insulating resin material, and covers the above-mentioned heat-sensitive body. The bonded body is provided in at least two regions sandwiching the heat-sensitive body and spaced apart by a predetermined interval in the planar direction of the first supporting film and the second supporting film. One or both of the first supporting film and the second supporting film are provided with an insertion passage penetrating in the thickness direction thereof and filled with the resin material constituting the protective body. The protection body is formed by filling the resin material into a passage between the first supporting film and the second supporting film, in which the heat sensitive body is sandwiched and in which the heat sensitive body communicates with the outside.

2. The temperature sensor according to claim 1, characterized in that The protective body is exposed to the periphery in a gap between the first supporting film and the second supporting film located between the two bonding bodies, except for a portion in contact with the bonding body. The protection body is in direct contact with both the first supporting film and the second supporting film.

3. The temperature sensor according to claim 2, characterized in that The first supporting film and the second supporting film have a rectangular shape in plan view having a width direction and a length direction that is orthogonal to the width direction and relatively larger than the width direction. The second supporting film has a smaller dimension in the longitudinal direction than the first supporting film. The bonded body is provided on both sides of the first supporting film and the second supporting film at a distance in the width direction.

4. The temperature sensor according to claim 1, characterized in that The insertion path is provided on one of the first supporting film and the second supporting film.

5. The temperature sensor according to any one of claims 1 to 4, characterized in that: The sensor element includes a first lead pattern and a second lead pattern attached to the first supporting film and on the same plane facing the second supporting film. The first supporting film comprises: a first conductive pad supporting the heat-sensitive body and electrically connected to the first lead pattern; and The second conductive pad is electrically connected to the second lead pattern. The second supporting film includes a third conductive pad on a surface facing the region where the heat-sensitive body is provided. A dummy conductor corresponding to the heat sensitive body is provided between the second conductive pad and the third conductive pad.

6. A method for manufacturing a temperature sensor, characterized in that: have: In a first step, a first support film made of an electrical insulating material and having a sensor element having a heat-sensitive body attached to one side thereof and a second support film made of an electrical insulating material are stacked in a state where the one side faces the second support film; A second step of bonding the first supporting film and the second supporting film using a bonding body; In the third step, a resin material composed of an electrical insulating material is supplied around the heat-sensitive body and between the first supporting film and the second supporting film to form a protective body. In the first step, one or both of the first supporting film and the second supporting film are provided with an insertion passage penetrating in the thickness direction thereof, and in the second step, the bonded body is provided so as to sandwich the heat-sensitive body and have a passage connecting the heat-sensitive body with the outside. In the third step, the resin material is supplied between the first supporting film and the second supporting film via the passage and the insertion passage.

7. The method for manufacturing a temperature sensor according to claim 6, wherein: The protection body is exposed to the periphery at the opening of the passage and at a gap between the first supporting film and the second supporting film located between the two bonded bodies.

8. The method for manufacturing a temperature sensor according to claim 6 or 7, characterized in that: In the first step, the first supporting film and the second supporting film have a width direction and a length direction that is orthogonal to the width direction and is relatively larger than the width direction, and the second supporting film has a smaller length direction than the first supporting film. In the second step, the bonded body is provided on both sides of the first supporting film and the second supporting film at a distance in the width direction.

9. The method for manufacturing a temperature sensor according to claim 6, wherein: In the first step, the insertion path is provided on one of the first supporting film and the second supporting film.

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