A method for preparing a high frequency antenna board

Abstract

The present invention discloses a method for preparing a high-frequency antenna board. The present invention simultaneously generates the pattern and PAD of the high-frequency core layer, so that the two sides of the high-frequency core layer are completely consistent. The PAD of the high-frequency core layer is used alone to position the via holes that only penetrate the high-frequency core layer, and the positioning holes are used to position the other via holes, thereby ensuring the overall alignment and the alignment of the high-frequency core layer pattern and the related holes, thereby greatly improving the yield.

Description

Technical Field

[0001] The invention relates to a method for preparing a high-frequency antenna board, and belongs to the field of PCB board preparation. Background Art

[0002] With the development of 5G, many high-frequency antenna boards use high-frequency core layers and other conductive layers to mix and process the antenna layers into an integral PCB board. The alignment of the antenna core layer graphics and the connected holes has a greater impact on the signal. However, in conventional PCB operations, the alignment of each layer is a mixed compromise operation, which makes it impossible to guarantee the alignment of the high-frequency core layer graphics and related holes. Summary of the invention

[0003] The present invention provides a method for preparing a high-frequency antenna plate, which solves the problem disclosed in the background technology.

[0004] According to one aspect of the present disclosure, there is provided a method for preparing a high-frequency antenna board, comprising:

[0005] Generate the graphics of the high-frequency core layer and the PAD at the preset position at the same time;

[0006] From top to bottom, the high-frequency core layer and other conductive layers are pressed together into a board body; wherein other conductive layers also have PADs generated; in adjacent layers, the regions where PADs are generated are opposite, and the distance between the center points of the PADs in the opposite regions in the horizontal direction is less than a threshold;

[0007] Look through the board and drill positioning holes in the board according to the PAD position;

[0008] Drilling via holes that only penetrate the high-frequency core layer and other via holes on the board; wherein the via holes that only penetrate the high-frequency core layer are positioned according to the PAD of the high-frequency core layer, and other via holes are positioned according to the positioning holes;

[0009] Metallize the via holes and generate the outer layer graphics of the board.

[0010] In some embodiments of the present disclosure, simultaneously generating a pattern of a high-frequency core layer and a PAD at a preset position includes:

[0011] Press photosensitive dry film on both sides of the high-frequency core layer;

[0012] The high-frequency core layer pattern and the PAD at the preset position are generated simultaneously by exposure;

[0013] The non-exposed photosensitive dry film is developed away, and the copper without the photosensitive dry film is etched away.

[0014] In some embodiments of the present disclosure, the pattern of the high-frequency core layer is located on the bottom surface of the high-frequency core layer, and the PAD is located on the top surface of the high-frequency core layer.

[0015] In some embodiments of the present disclosure, the PAD of the high-frequency core layer is located at the four corners of the top surface of the high-frequency core layer, and the PADs of other conductive layers are also located at the four corners of their own top surfaces.

[0016] In some embodiments of the present disclosure, generating a board outer layer pattern includes:

[0017] Press photosensitive dry film on both sides of the plate;

[0018] Expose the graphics and vias on the outer layer of the board;

[0019] The non-exposed photosensitive dry film is developed away, and the copper without the photosensitive dry film is etched away.

[0020] In some embodiments of the present disclosure, the graphics and via holes on the outer layer of the board body are exposed twice, once to expose the graphics on the top surface of the board body and the via holes that only penetrate the high-frequency core layer, and another time to expose the graphics on the bottom surface of the board body and the other via holes. When exposing the via holes that only penetrate the high-frequency core layer, the PAD of the high-frequency core layer is used for positioning, and when exposing other via holes, positioning holes are used for positioning.

[0021] The beneficial effects achieved by the present invention are as follows: the present invention simultaneously generates the graphics and PAD of the high-frequency core layer, so that the two sides of the high-frequency core layer are completely consistent, and the PAD of the high-frequency core layer is used alone to position the via holes that only penetrate the high-frequency core layer, and the positioning holes are used to position other via holes, thereby ensuring the overall alignment and the alignment of the high-frequency core layer graphics and related holes, thereby greatly improving the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A flow chart of a method for preparing a high-frequency antenna board;

[0023] Figure 2 It is a schematic diagram of the high-frequency core after lamination film;

[0024] Figure 3 This is a schematic diagram of the high-frequency core layer after exposure;

[0025] Figure 4 It is a schematic diagram of the high-frequency core layer PAD;

[0026] Figure 5 It is a schematic diagram after the high-frequency core layer is developed;

[0027] Figure 6 This is a schematic diagram after the high-frequency core layer is etched;

[0028] Figure 7 This is a schematic diagram of all layers after lamination;

[0029] Figure 8 This is a schematic diagram of the board after the first type of positioning holes are drilled;

[0030] Fig. 9 This is a schematic diagram of the board after the second type of positioning holes are drilled;

[0031] Fig.10 This is a schematic diagram of the board after the via holes are drilled;

[0032] Fig.11 It is a schematic diagram of the board after hole metallization;

[0033] Fig.12 It is a schematic diagram of the outer side of the plate after compression molding;

[0034] Fig.13 It is a schematic diagram after the outer side of the board is exposed;

[0035] Fig.14 It is a schematic diagram after the outer side of the plate is developed;

[0036] Fig.15 This is a schematic diagram of the outer side of the board after etching. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. It is obvious that the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present disclosure and its application or use. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0038] Unless otherwise specified, the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure.

[0039] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0040] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0041] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0042] It should be noted that similar symbols and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it does not require further discussion in subsequent figures.

[0043] In order to solve the problem of alignment between the high-frequency core layer 1 pattern 4 and related holes, the present disclosure proposes a method for preparing a high-frequency antenna board. Figure 1 A schematic diagram of an embodiment of the method disclosed herein.

[0044] like Figure 1 As shown, in step 1 of the embodiment, the pattern 4 of the high-frequency core layer 1 and the PAD 3 at the preset position are generated simultaneously.

[0045] It should be noted that the generation method here can adopt any existing method, and it is only necessary to ensure the consistency between the generation of Figure 4 and PAD3.

[0046] In some embodiments, the pattern 4 and the PAD 3 are generated by simultaneous exposure, which can ensure that the two sides of the high-frequency core layer 1 are completely consistent. The specific process can be as follows:

[0047] 11) Press the photosensitive dry film 2 onto both sides of the high-frequency core layer 1.

[0048] See Figure 2 The high-frequency core layer 1 includes a substrate and copper layers on the top and bottom surfaces of the substrate, and a photosensitive dry film 2 is pressed on the copper layer.

[0049] 12) The pattern 4 of the high-frequency core layer 1 and the PAD 3 at the preset position are simultaneously generated by exposure.

[0050] It should be noted that the pattern 4 of the high-frequency core layer 1 is located on the bottom surface of the high-frequency core layer 1, the PAD3 is located on the top surface of the high-frequency core layer 1, and the preset position of generating the PAD3 can be determined according to the actual situation. However, in order not to affect the subsequent punching, in some embodiments, the PAD3 of the high-frequency core layer 1 is located at the four corners of the top surface of the high-frequency core layer 1, see Figure 3 and 4 .

[0051] 13) The non-exposed photosensitive dry film 2 is developed and the copper without the photosensitive dry film 2 is etched away.

[0052] It should be noted that the developer is used for the photolithography. The non-exposed photosensitive dry film 2 can be developed away by the developer, while the photosensitive dry film 2 on the pattern 4 is retained. Figure 5 .

[0053] The purpose of etching is to retain the copper in the area protected by the photosensitive dry film 2 and etch away the copper in the unprotected area, thereby forming a pattern 4. Finally, the photosensitive dry film 2 is further removed using a film stripping solution to expose the copper surface and PAD3. Figure 6 .

[0054] return Figure 1 In step 2 of the embodiment, from top to bottom, the high-frequency core layer 1 and other conductive layers are pressed together into a board body, see Figure 7 ; Among them, PAD3 is also generated in other conductive layers; in adjacent layers, the areas where PAD3 is generated are relative, and the distance between the center points of the relative areas PAD3 in the horizontal direction is less than the threshold.

[0055] It should be noted that other conductive layers also generate images and PAD3 similar to the high-frequency core layer 1. Taking the PAD3 at the corner of the high-frequency core layer 1 as an example, the PAD3 of other conductive layers is also located at the four corners of their own top surfaces. In adjacent layers, the areas where PAD3 are generated are relative, but PAD3 is not necessarily relative, and there may be a certain degree of staggering, that is, the distance between the center points of PAD3 in the horizontal direction is less than the threshold.

[0056] return Figure 1 In step 3 of the embodiment, an XR perspective is performed on the board, and a positioning hole 5 is punched in the board according to the position of PAD 3.

[0057] It should be noted that the positioning hole 5 needs to be punched based on experience. Taking a PAD3 at a corner as an example, although all PAD3 are not aligned, a positioning hole 5 that passes through all PAD3 can be punched. Figure 8 Of course, you can also drill positioning hole 5 at a certain distance from PAD3, see Fig. 9 The specific method of drilling holes depends on the actual situation.

[0058] return Figure 1 In step 4 of the embodiment, a via hole 6 that only penetrates the high-frequency core layer 1 and other via holes 6 are drilled on the board; wherein the via hole 6 that only penetrates the high-frequency core layer 1 is positioned according to the PAD 3 of the high-frequency core layer 1, and the other via holes 6 are positioned according to the positioning hole 5.

[0059] See Fig.10 The via holes 6 that only penetrate the high-frequency core layer 1 are the holes on the left side of the figure, and the other via holes 6 are the holes on the right side of the figure. Of course, the other via holes 6 are not through holes, but can also be holes that pass through multiple layers.

[0060] return Figure 1 In step 5 of the embodiment, the via hole 6 is metallized to generate the outer layer pattern 4 of the board body.

[0061] See Fig.11 The via hole 6 is metallized by a common chemical + electroplating method. Since it is a prior art, it will not be described in detail here.

[0062] It should be noted that, as in step 1, the outer layer pattern 4 may also be generated by exposure. In some embodiments, the outer layer pattern 4 of the board may be generated by:

[0063] 51) Press photosensitive dry film 2 onto both sides of the plate.

[0064] See Fig.12 A photosensitive dry film 2 is pressed on the top and bottom surfaces of the board, specifically, a layer of photosensitive dry film 2 is pressed on the top copper layer of the high-frequency core layer 1 and the bottom copper layer of the other conductive layers at the bottom.

[0065] 52) Expose the pattern 4 and the via 6 on the outer layer of the board, see Fig.13 .

[0066] It should be noted that, since different positioning references of different via holes 6 are different, exposure should also be performed according to different positioning references. Therefore, in some embodiments, the pattern 4 and via holes 6 of the outer layer of the board body are exposed twice, one time to expose the pattern 4 on the top surface of the board body and the via holes 6 that only penetrate the high-frequency core layer 1, and the other time to expose the pattern 4 on the bottom surface of the board body and other via holes 6. When exposing the via holes 6 that only penetrate the high-frequency core layer 1, the PAD 3 of the high-frequency core layer 1 is used for positioning, and when exposing other via holes 6, the positioning holes 5 are used for positioning. Alignment is ensured by this exposure method.

[0067] 53) The non-exposed photosensitive dry film 2 is developed and the copper without the photosensitive dry film 2 is etched away.

[0068] Similar to step 1, see Fig.14 , using a developer to remove the non-exposed photosensitive dry film 2, while retaining the photosensitive dry film 2 on the pattern 4. Fig.15 , the copper in the area protected by the photosensitive dry film 2 is retained, and the copper in the unprotected area is etched away, thereby forming a pattern 4, and finally the photosensitive dry film 2 is further removed using a film stripping solution.

[0069] The above method simultaneously generates the pattern 4 and PAD3 of the high-frequency core layer 1, so that the two sides of the high-frequency core layer 1 are completely consistent. The PAD3 of the high-frequency core layer 1 is used alone to position the conductive hole 6 that only penetrates the high-frequency core layer 1, and the positioning hole 5 is used to position the other conductive holes 6, which ensures the overall alignment and the alignment of the high-frequency core layer 1 pattern 4 and related holes, thereby greatly improving the yield.

[0070] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for preparing a high-frequency antenna board, characterized in that: include: Generate the graphics of the high-frequency core layer and the PAD at the preset position at the same time; From top to bottom, the high-frequency core layer and other conductive layers are pressed together into a board body; wherein other conductive layers also have PADs generated; in adjacent layers, the regions where PADs are generated are opposite, and the distance between the center points of the PADs in the opposite regions in the horizontal direction is less than a threshold; Look through the board and drill positioning holes in the board according to the PAD position; Drilling via holes that only penetrate the high-frequency core layer and other via holes on the board; wherein the via holes that only penetrate the high-frequency core layer are positioned according to the PAD of the high-frequency core layer, and other via holes are positioned according to the positioning holes; Metallize the via holes and generate the outer layer graphics of the board.

2. The method for preparing a high-frequency antenna board according to claim 1, characterized in that: Generates graphics of high frequency core layer and PADs at preset positions simultaneously, including: Press photosensitive dry film on both sides of the high-frequency core layer; The high-frequency core layer pattern and the PAD at the preset position are generated simultaneously by exposure; The non-exposed photosensitive dry film is developed away, and the copper without the photosensitive dry film is etched away.

3. The method for preparing the high-frequency antenna board according to claim 2, characterized in that: The pattern of the high-frequency core layer is located on the bottom surface of the high-frequency core layer, and the PAD is located on the top surface of the high-frequency core layer.

4. The method for preparing the high-frequency antenna board according to claim 3, characterized in that: The PAD of the high-frequency core layer is located at the four corners of the top surface of the high-frequency core layer, and the PADs of other conductive layers are also located at the four corners of their own top surfaces.

5. The method for preparing a high-frequency antenna board according to claim 1, characterized in that: Generate board outer layer graphics, including: Press photosensitive dry film on both sides of the plate; Expose the graphics and vias on the outer layer of the board; The non-exposed photosensitive dry film is developed away, and the copper without the photosensitive dry film is etched away.

6. The method for preparing the high-frequency antenna board according to claim 5, characterized in that: The graphics and via holes on the outer layer of the board are exposed twice, once to expose the graphics on the top surface of the board and the via holes that only penetrate the high-frequency core layer, and another time to expose the graphics on the bottom surface of the board and other via holes. When exposing the via holes that only penetrate the high-frequency core layer, the PAD of the high-frequency core layer is used for positioning, and when exposing other via holes, positioning holes are used for positioning.

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