A hidden circuit board support separation processing mechanism

By designing a hidden circuit board support separation processing mechanism, components such as electronic control support transfer rollers to achieve automated glue operation operations, the problem of low manual operation efficiency in existing technologies and a large waste of materials have been improved, and the accuracy and efficiency of glue coating are improved.

CN118019227BActive Publication Date: 2025-01-28EAST ELECTRONIC TECH (DONGTAI) CO LTD
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Patent Information

Application Number
CN202410248743.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-03-05
Publication Date
2025-01-28
Estimated Expiration
2044-03-05

AI Technical Summary

Technical Problem

The existing circuit board glue coating method relies on manual operation, which is inefficient and complex, and can easily lead to waste of materials and difficult to maintain in the later stage.

Method used

Design a hidden circuit board supporting separation processing mechanism, using electronic control support conveying rollers, flipping support rods, top drive seats, horizontal guide wheels, and guide material return cover to achieve automated circuit board coating operations.

Benefits of technology

Through automated operations, the efficiency and accuracy of the circuit board coating is improved, artificial intervention is reduced, the waste of materials is reduced, and later maintenance is simplified.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of circuit board processing, and in particular to a hidden circuit board support and separation processing mechanism, comprising a main frame and an electrically controlled support conveying roller installed inside the main frame, wherein an electrically controlled flip strut is movably installed inside the main frame at the bottom side of the electrically controlled support conveying roller. The hidden circuit board support and separation processing mechanism of the present invention adopts a hidden structural design, which can be directly flipped and retracted when not in use, thus avoiding interference with the conveying equipment and facilitating storage and use; by being directly integrated on the electrically controlled conveying equipment, it can directly process the circuit board during the conveying process, greatly improving the functional integration; the electrically controlled flip strut at the bottom drives the external support frame to flip and retract, thereby squeezing and positioning the circuit board, separating the circuit board from the conveying equipment, and improving its processing accuracy.
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Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to a hidden circuit board support separation processing mechanism. Background Art

[0002] A rigid-flex board is a flexible circuit board and a rigid circuit board, which are combined together through lamination and other processes according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. During the production and processing, in order to facilitate the assembly and fixation of different components and improve the stability and firmness of the assembly and fixation, it is necessary to apply glue to the contact surface of the components and the circuit board.

[0003] The current glue coating method mainly involves manually placing the circuit board at the designated position, and then using manual operation to complete the operation on the circuit board surface. The entire operation is not only time-consuming and labor-intensive, but also has low work efficiency. It also requires a high level of operator skills. At the same time, it can only be operated on fixed workstation molds, which has great limitations. It will also increase the difficulty of subsequent cleaning and maintenance, and the waste of materials is also relatively serious. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the current gluing method mainly involves manually placing the circuit board at a specified position, and then manually operating the circuit board surface. The entire operation is not only time-consuming and labor-intensive, but also has low work efficiency. It also requires a relatively high level of operator skills. At the same time, it can only be operated on a fixed workstation mold, which has great limitations and will increase the difficulty of subsequent cleaning and maintenance, and the material waste is also relatively serious.

[0005] The technical solution adopted by the present invention to solve its technical problems is: a hidden circuit board support and separation processing mechanism, including a main frame and an electrically controlled support and conveying roller installed inside the main frame, an electrically controlled flip support rod is movably installed at the bottom side of the electrically controlled support and conveying roller inside the main frame, an overhead beam is installed above the electrically controlled support and conveying roller inside the main frame through a flip bracket, an electrically controlled top drive seat is installed at the lower end of the overhead beam, electrically controlled transverse guide wheels are installed on both sides of the electrically controlled top drive seat through the bottom side of an elastic extrusion rod, and a combined material guide reflux hood is installed on both sides of the electrically controlled transverse guide wheel on the elastic extrusion rod.

[0006] A bottom cross beam is fixed inside the main frame at the bottom side of the electrically controlled supporting conveying roller, and the electrically controlled flipping strut includes a lateral flipping cylinder movably installed on the outside of the bottom cross beam through a transverse axis, an internal telescopic strut axially fixed inside the lateral flipping cylinder, a lateral flipping strut movably assembled between the bottom cross beam and the lateral flipping cylinder, an overhead lifting bracket slidably sleeved on the outside of the lateral flipping cylinder, and a pressure sensor module installed on the side wall of the overhead lifting bracket.

[0007] A plurality of lateral limiting through holes are provided on the outer walls of both sides of the main frame on the contact surface of the flip bracket, and the flip bracket is fixedly connected to the side wall of the main frame through the inner locking bolts penetrating the inside of the lateral limiting through holes.

[0008] The lower surface of the top crossbeam is fixedly equipped with a top guide rail for installing an electrically controlled top drive seat, and the electrically controlled top drive seat includes an internal moving seat installed inside the top guide rail, bottom electric drive wheels installed on both sides of the lower end of the internal moving seat, bottom support wheels, top limiting wheels installed on both sides of the upper end of the internal moving seat, and a raw material diversion chamber opened inside the internal moving seat.

[0009] The upper end of the elastic extrusion rod is fixedly installed on the bottom of the internal movable seat and is connected to the inside of the raw material guide chamber. The two sides of the bottom of the elastic extrusion rod are fixedly equipped with L-shaped lateral mounting brackets by bolts, and the lateral mounting brackets are fixedly equipped with lateral electric control support rods for controlling the electric-controlled transverse guide wheels.

[0010] A bottom side frame for installing an electrically controlled transverse guide wheel is fixedly mounted on the bottom telescopic section of the lateral electrically controlled support rod.

[0011] The combined material guide return hood includes a first lateral guide hood fixed on one side of the bottom frame, a second lateral guide hood fixed on the other side of the bottom frame, an arc-shaped scraper plate fixed on the inner side of the first lateral guide hood, a lateral return pipe fixed on the outer side of the first lateral guide hood, an electrically controlled spiral conveying rod installed inside the lateral return pipe, and an electrically controlled heating module fixed inside the second lateral guide hood.

[0012] The upper end of the lateral reflux pipe is equipped with a top guide pipe which is connected with the interior of the raw material guide chamber.

[0013] An embedded pressure sensor for monitoring pressure changes is installed at the telescopic end of the elastic extrusion rod.

[0014] Infrared monitoring and positioning modules are fixedly mounted on the outer sides of the first lateral air guide cover and the second lateral air guide cover.

[0015] The beneficial effects of the present invention are:

[0016] (1) The hidden circuit board support separation processing mechanism of the present invention adopts a hidden structural design, which can be directly flipped and retracted when idle, avoiding interference with the conveying equipment, and is convenient for storage and use;

[0017] (2) By directly integrating it into the electronically controlled conveying equipment, it can directly process the circuit boards during the conveying process, greatly improving the functional integration;

[0018] (3) The electrically controlled flip support rod at the bottom drives the external support frame to flip and retract, thereby squeezing and positioning the circuit board and separating the circuit board from the conveying equipment, thereby improving its processing accuracy;

[0019] (4) By installing an electrically controlled top drive seat at the lower end of the top crossbeam and installing electrically controlled horizontal guide wheels using elastic extrusion rods on both sides of the electrically controlled top drive seat, the gluing device can be controlled to operate on the operating surface of the circuit board, thereby improving the uniformity of gluing. By using a reciprocating gluing method, repeated movement can be avoided, thereby improving efficiency.

[0020] (5) By installing a combined material guide return cover on both sides of the electric-controlled transverse guide wheel on the elastic extrusion rod, the material guide efficiency and recycling rate can be reduced by guiding and recycling the glue on the electric-controlled transverse guide wheel, thereby avoiding material waste;

[0021] (6) The raw material is guided to the electrically controlled transverse guide wheel through the raw material guide chamber and the elastic extrusion rod inside the internal moving seat, so that the stability of raw material transportation can be ensured;

[0022] (7) By adopting a multi-group design of electrically controlled transverse guide wheels, glue coating operations can be performed on multiple locations at the same time, and they can be separated from the surface by independent control, which is convenient for operation;

[0023] (8) The entire processing process does not require human intervention, avoiding the influence of human factors, saving time and effort, and greatly improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0025] Figure 1 It is a structural schematic diagram of the present invention.

[0026] Figure 2 It is a schematic diagram of the internal structure of the present invention.

[0027] Figure 3 It is a schematic diagram of the internal structure of the combined material guiding reflux hood in the present invention. DETAILED DESCRIPTION

[0028] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Figure 1 , Figure 2 and Figure 3 A hidden circuit board support separation processing mechanism shown in the figure includes a main frame 1 and an electrically controlled support conveying roller 2 installed inside the main frame 1, an electrically controlled flip support rod 3 is movably installed on the bottom side of the electrically controlled support conveying roller 2 inside the main frame 1, an overhead crossbeam 6 is installed above the electrically controlled support conveying roller 2 inside the main frame 1 through a flip bracket 5, an electrically controlled top drive seat 7 is installed at the lower end of the overhead crossbeam 6, electrically controlled transverse guide wheels 9 are installed on the bottom sides of both sides of the electrically controlled top drive seat 7 through elastic extrusion rods 8, and combined material guide reflux hoods 10 are installed on both sides of the electrically controlled transverse guide wheels 9 on the elastic extrusion rods 8.

[0031] The circuit board is conveyed in translation by the electrically-controlled supporting conveying rollers 2, and then after it moves to the specified position, the electrically-controlled flip support rods 3 lift and separate it, and then the electrically-controlled top driving seat 7 applies glue to the specified position on the circuit board through the electrically-controlled horizontal guide wheels 9 at the bottom of the two sides of the elastic squeezing rods 8.

[0032] In order to cooperate with the flipping and telescopic adjustment, a bottom cross beam 11 is fixed inside the main frame 1 at the bottom side of the electrically controlled supporting conveyor roller 2. The electrically controlled flip support rod 3 includes a lateral flip cylinder 31 movably installed on the outside of the bottom cross beam 11 through a transverse axis, an internal telescopic support rod 32 axially fixed inside the lateral flip cylinder 31, a lateral flip support rod 33 movably assembled between the bottom cross beam 11 and the lateral flip cylinder 31, an overhead lifting bracket 34 slidably sleeved on the outside of the lateral flip cylinder 31, and a pressure sensor module 35 installed on the side wall of the overhead lifting bracket 34.

[0033] The lateral flip strut 33 and the internal telescopic strut 32 are both existing technologies. The internal telescopic strut 32 controls the lifting and lowering of the overhead lifting bracket 34 by telescoping, while the lateral flip strut 33 controls the flipping of the lateral flip cylinder 31 by telescoping. In this way, the lateral limiting can be performed on all sides of the circuit board, and then clamped, lifted and separated, and finally the circuit board can be positioned and fixed at a specified height and position, which will not affect the subsequent transportation of the circuit board.

[0034] In order to lock and fix the angle of the flip bracket 5, 9 lateral limit through holes 12 are opened on the outer walls of both sides of the main frame 1 on the contact surface of the flip bracket 5. The flip bracket 5 is fixedly connected to the side wall of the main frame 1 through the inner locking bolts 13 that pass through the lateral limit through holes 12.

[0035] In order to cooperate with the top adjustment, the lower surface of the top crossbeam 6 is fixedly equipped with a top guide rail 61 for installing an electrically controlled top drive seat 7. The electrically controlled top drive seat 7 includes an internal movable seat 71 installed inside the top guide rail 61, bottom electric drive wheels 72 installed on both sides of the lower end of the internal movable seat 71, bottom support wheels 73, top limiting wheels 74 installed on both sides of the upper end of the internal movable seat 71, and a raw material diversion chamber 75 opened inside the internal movable seat 71.

[0036] The bottom electric drive wheel 72 is a prior art, and drives the internal moving seat 71 to translate and adjust inside the top guide rail 61 by rotating.

[0037] In order to facilitate installation and control, the upper end of the elastic extrusion rod 8 is fixedly installed on the bottom of the internal movable seat 71 and is connected to the inside of the raw material guide chamber 75. The two sides of the bottom of the elastic extrusion rod 8 are fixedly assembled with L-shaped lateral mounting brackets 76 by bolts, and the lateral mounting bracket 76 is fixedly assembled with a lateral electric control support rod 77 for controlling the electric-controlled transverse guide wheel 9.

[0038] The lateral electrically controlled support rod 77 is a prior art, which adjusts the distance between the electrically controlled transverse guide wheel 9 and the operating surface by telescoping.

[0039] In order to facilitate assembly, a bottom side frame 78 for installing the electrically controlled transverse guide wheel 9 is fixedly mounted on the bottom telescopic section of the lateral electrically controlled support rod 77 .

[0040] The electrically controlled transverse guide wheel 9 is installed on one side of the bottom side frame 78, and the lateral electrically controlled support rod 77 is adjusted for telescopic movement by driving the bottom side frame 78.

[0041] In order to cooperate with the heating material guide and scraping material return, the combined material guide return cover 10 includes a first lateral air guide cover 101 fixed on one side of the bottom side frame 78, a second lateral air guide cover 102 fixed on the other side of the bottom side frame 78, an arc-shaped scraper plate 103 fixed on the inner side of the first lateral air guide cover 101, a lateral return pipe 104 fixed on the outer side of the first lateral air guide cover 101, an electrically controlled screw conveying rod 105 installed inside the lateral return pipe 104 and an electrically controlled heating module 106 fixed inside the second lateral air guide cover 102.

[0042] An internal reflux port is provided inside the first lateral air guide cover 101 between the arc scraper plate 103 and the lateral reflux pipe 104. When the electrically controlled transverse guide wheel 9 rotates, the curved scraper plate 103 is used to scrape the raw materials after the glue coating to the inside of the internal reflux port, and then the raw materials are returned to the raw material guide chamber 75 through the electrically controlled spiral conveying pipe 105, and then the materials are circulated and guided to avoid hardening of the outer wall of the electrically controlled transverse guide wheel 9 over time. The direction of the electrically controlled transverse guide wheel 9 is fixed, and no matter how the electrically controlled transverse guide wheel 9 is translated, its rotation direction is always consistent, thereby ensuring the stability of material discharging and material returning.

[0043] In order to cooperate with the top diversion, the upper end of the lateral return pipe 104 is equipped with a top diversion pipe 107 which is connected to the inside of the raw material diversion chamber 75.

[0044] In order to monitor the telescopic pressure of the elastic extrusion rod 8 and thus facilitate control, an embedded pressure sensor 81 for monitoring pressure changes is installed at the telescopic end of the elastic extrusion rod 8 .

[0045] When the internal telescopic support rod 32 and the lateral flip support rod 33 are started, the top lifting bracket 34 is driven to squeeze, lift and separate the four sides of the circuit board, so that the circuit board is lifted to a preset position. At this time, the glue-coated surface on the circuit board will squeeze the bottom electric drive wheel 72, thereby squeezing and adjusting the elastic squeezing rod 8.

[0046] In order to monitor the gluing position and control the extension and retraction, infrared monitoring and positioning modules 108 are fixedly mounted on the outer sides of the first lateral air guide cover 101 and the second lateral air guide cover 102 .

[0047] The infrared monitoring and positioning module 108 monitors the bottom distance by emitting infrared rays downward through the infrared emitting port at the bottom. When the feeding end detects the circuit board entering, the internal telescopic support rod 32 and the lateral flip support rod 33 are automatically controlled to start, driving the top lifting bracket 34 to extrude, lift and separate the circuit board around, so that the circuit board is lifted to a preset position. After the lifting correction, the bottom electric drive wheels 72 on both sides of the lower end of the internal moving seat 71 are started, driving the internal moving seat 71 to translate along the top guide rail 61. The elastic extrusion rod 8 can not only drive the bottom electric drive wheel 72 to translate, but also guide the raw material inside the internal raw material diversion chamber 75 to the surface of the bottom electric drive wheel 72 for gluing operation. An extrusion mechanism with the same structural principle as the electric-controlled screw conveying rod 105 is also installed inside the elastic extrusion rod 8, and it also has an electric heating function to ensure the efficiency and stability of raw material extrusion.

[0048] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A hidden circuit board support separation processing mechanism, comprising a main frame (1) and an electrically controlled support conveying roller (2) installed inside the main frame (1), characterized in that: An electrically controlled flip support rod (3) is movably mounted inside the main frame (1) at the bottom side of the electrically controlled support conveying roller (2); an overhead beam (6) is mounted inside the main frame (1) above the electrically controlled support conveying roller (2) via a flip bracket (5); an electrically controlled top drive seat (7) is mounted at the lower end of the overhead beam (6); electrically controlled transverse guide wheels (9) are mounted on both sides of the electrically controlled top drive seat (7) via the bottom side of an elastic extrusion rod (8); and a combined material guide return hood (10) is mounted on both sides of the electrically controlled transverse guide wheel (9) on the elastic extrusion rod (8); A bottom crossbeam (11) is fixed inside the main frame (1) and located at the bottom side of the electrically controlled supporting conveying roller (2), and the electrically controlled flip support rod (3) comprises a lateral flip cylinder (31) movably mounted on the outside of the bottom crossbeam (11) via a transverse axis, an internal telescopic support rod (32) axially fixed inside the lateral flip cylinder (31), a lateral flip support rod (33) movably assembled between the bottom crossbeam (11) and the lateral flip cylinder (31), an overhead lifting bracket (34) slidably sleeved on the outside of the lateral flip cylinder (31), and a pressure sensor module (35) mounted on the side wall of the overhead lifting bracket (34); The lower surface of the top crossbeam (6) is fixedly equipped with a top guide rail (61) for mounting an electrically controlled top drive seat (7), the electrically controlled top drive seat (7) comprising an internal movable seat (71) mounted inside the top guide rail (61), bottom electric drive wheels (72) mounted on both sides of the lower end of the internal movable seat (71), bottom support wheels (73), top limit wheels (74) mounted on both sides of the upper end of the internal movable seat (71), and a raw material guide chamber (75) opened inside the internal movable seat (71); The upper end of the elastic extrusion rod (8) is fixedly mounted on the bottom of the internal moving seat (71) and communicates with the inside of the raw material guide chamber (75); L-shaped lateral mounting brackets (76) are fixedly mounted on both sides of the bottom of the elastic extrusion rod (8) by bolts; and a lateral electric control support rod (77) for controlling the electric control transverse guide wheel (9) is fixedly mounted on the lateral mounting bracket (76); The combined material guide return hood (10) comprises a first lateral guide hood (101) fixed on one side of a bottom frame (78), a second lateral guide hood (102) fixed on the other side of the bottom frame (78), an arc-shaped scraper plate (103) fixed on the inner side of the first lateral guide hood (101), a lateral return pipe (104) fixed on the outer side of the first lateral guide hood (101), an electrically controlled screw conveying rod (105) installed inside the lateral return pipe (104), and an electrically controlled heating module (106) fixed inside the second lateral guide hood (102).

2. The hidden circuit board support separation processing mechanism according to claim 1 is characterized in that: A plurality of lateral limiting through holes (12) are provided on the outer walls of both sides of the main frame (1) on the contact surface of the flip bracket (5), and the flip bracket (5) is fixedly connected to the side wall of the main frame (1) by means of inner locking bolts (13) penetrating the inside of the lateral limiting through holes (12).

3. The hidden circuit board support separation processing mechanism according to claim 1 is characterized in that: A bottom side frame (78) for mounting an electrically controlled transverse guide wheel (9) is fixedly mounted on the bottom telescopic section of the lateral electrically controlled support rod (77).

4. The hidden circuit board support separation processing mechanism according to claim 1 is characterized in that: The upper end of the lateral return pipe (104) is equipped with a top guide pipe (107) which is connected to the interior of the raw material guide chamber (75).

5. The hidden circuit board support separation processing mechanism according to claim 1 is characterized in that: An embedded pressure sensor (81) for monitoring pressure changes is installed at the telescopic end of the elastic extrusion rod (8).

6. The hidden circuit board support separation processing mechanism according to claim 1 is characterized in that: Infrared monitoring and positioning modules (108) are fixedly mounted on the outer sides of the first lateral air guide cover (101) and the second lateral air guide cover (102).

Citation Information

Patent Citations

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