A microwave component weight-reducing and sealing housing packaging structure and manufacturing method

Abstract

The present invention discloses a weight-reduced and sealed housing packaging structure for microwave components and a manufacturing method thereof, which relates to the field of the design and manufacturing of the packaging housing structure for microwave components. The packaging structure includes: a packaging structure main body, a transition region, and a sealing region; the packaging structure main body is made of magnesium alloy; the transition region is located between the packaging structure main body and the sealing region and is made of molybdenum-copper alloy; the sealing region is made of aluminum alloy; and a manufacturing method is proposed accordingly. The present invention solves the problem of the requirement that the density of the packaging housing for microwave components is less than 2.0 g / cm3, and at the same time solves the problem of reliable sealing of such packaging housings; due to the adoption of local high-energy beam heating for sealing, the process compatibility of the micro-assembly process of such microwave components is taken into account.

Description

Technical Field

[0001] The present invention relates to the field of the structural design and manufacturing of microwave component packaging housings, and particularly relates to a weight-reducing and sealed housing packaging structure for microwave components and a manufacturing method thereof, which are used for the lightweight and sealed packaging of microwave components. Background Art

[0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art.

[0003] Microwave components are widely used in electronic systems to perform various processes on signals received by antennas, thereby realizing system functions. In a high-density integrated electronic whole machine system, in order to improve the functional density of the system, it is required that the mechanical structure be as light as possible on the premise of meeting the strength requirements. Therefore, there is also a requirement for weight reduction of the packaging housings of microwave components.

[0004] In order to balance requirements such as weight and tightness, existing microwave components generally use aluminum alloy or silicon aluminum alloy as the packaging housing material. The density of the packaging housing is 2.5 - 2.7 g / cm3, and it can be directly laser welded and sealed. On some missile-borne and aerospace platforms, there is a requirement that the packaging density of microwave components be less than 2.0 g / cm3, and it is required to be a metal material. In the existing industrial system, the metal materials with a density lower than that of aluminum alloy are only magnesium alloy and lithium alloy. Since lithium alloy has poor environmental adaptability and cannot meet the usage requirements in some occasions, especially in the military environment. Therefore, only magnesium alloy with excellent comprehensive performance and a relatively small density can be selected to manufacture the packaging housings of microwave components with weight reduction requirements. In addition, the tightness requirements of microwave components also need to be considered. The mainstream technology for microwave component sealing is laser welding. None of the existing magnesium alloys with a relatively small density can be directly laser welded and sealed. Summary of the Invention

[0005] The purpose of the present invention is: In order to balance the low density of magnesium alloy and the tightness of microwave components, the present invention proposes a weight-reducing and sealed housing packaging structure for microwave components and a manufacturing method thereof, which solves the problem of reliable sealing of such packaging housings while meeting the requirement that the density of the packaging housing of microwave components is less than 2.0 g / cm3; because local high-energy beam heating sealing is adopted, the process compatibility in the micro-assembly process of such microwave components is taken into account.

[0006] The technical solution of the present invention is as follows:

[0007] A weight-reducing and sealed housing packaging structure for microwave components, comprising: a packaging structure main body, a transition region, and a sealing region; the packaging structure main body is made of magnesium alloy; the transition region is located between the packaging structure main body and the sealing region and is made of molybdenum copper alloy; the sealing region is made of aluminum alloy.

[0008] Further, the magnesium alloy, molybdenum copper alloy, and aluminum alloy are made into an integrated encapsulation material by powder metallurgy; the main body of the encapsulation structure, the transition region, and the sealing region are made of the encapsulation material.

[0009] Further, the magnesium alloy, molybdenum copper alloy, and aluminum alloy are made into an integrated encapsulation material by the method of hot isostatic pressing after laser radiation surface induced treatment; the main body of the encapsulation structure, the transition region, and the sealing region are made of the encapsulation material.

[0010] Further, the weight percentage of molybdenum in the molybdenum copper alloy used in the transition region is not more than 16.8%.

[0011] Further, the thickness of the molybdenum copper alloy in the transition region is not less than 0.2 mm, and after subsequent processing, the remaining width of the molybdenum copper alloy is not less than 1 mm.

[0012] Further, when designing the cavity groove structure of the outer shell, the characteristic plane that needs to be machined mechanically is outside the range of 0.2 mm from the molybdenum copper bonding surface.

[0013] Further, the main body of the encapsulation structure is made of ZK61 magnesium alloy; the sealing region is made of 3A21 aluminum alloy or 6063 aluminum alloy, and the thickness is not less than 1 mm.

[0014] A manufacturing method for a microwave component weight-reducing and sealing outer shell encapsulation structure, based on the above-mentioned microwave component weight-reducing and sealing outer shell encapsulation structure, includes:

[0015] Step S1: Drawing;

[0016] Step S2: Material manufacturing;

[0017] Step S3: Precision CNC machining;

[0018] Step S4: Surface plating.

[0019] Further, the step S1 includes:

[0020] Using a drawing tool to draw the mechanical manufacturing drawings of the encapsulation structure;

[0021] The step S2 includes:

[0022] Adopting the powder metallurgy method to make the magnesium alloy, molybdenum copper alloy, and aluminum alloy into an integrated encapsulation material; or adopting the method of hot isostatic pressing after laser radiation surface induced treatment to make the magnesium alloy, molybdenum copper alloy, and aluminum alloy into an integrated encapsulation material;

[0023] The encapsulation material is a layered structure, the main body of the encapsulation structure is made of magnesium alloy, the sealing region is made of aluminum alloy, and the transition region between the magnesium alloy and the aluminum alloy is made of molybdenum copper alloy;

[0024] Step S3 includes:

[0025] According to the design requirements of the encapsulation housing structure, the manufactured encapsulation material is processed into an encapsulation housing by using a machining process method.

[0026] Step S4 includes:

[0027] Nickel or nickel / gold is plated on the surface of the processed encapsulation housing by electroless plating or electroplating, so as to obtain a surface state suitable for microassembly.

[0028] Furthermore, the design requirements of the encapsulation housing structure include:

[0029] The weight percentage of molybdenum in the molybdenum-copper alloy used in the transition region is not more than 16.8%;

[0030] The thickness of the molybdenum-copper alloy is not less than 0.2 mm; after post-processing, the remaining width of the molybdenum-copper alloy is not less than 1 mm;

[0031] When designing the cavity structure of the housing, the characteristic plane that needs to be machined is outside the range of 0.2 mm from the molybdenum-copper bonding surface.

[0032] Compared with the existing technology, the beneficial effects of the present invention are:

[0033] The present invention adopts a process route of encapsulation material preparation, precision numerical control machining and surface treatment to manufacture a lightweight and sealed encapsulation housing for microwave components. In terms of weight reduction effect, the overall density of this composite encapsulation housing is less than 3 2.0 g / cm³, meeting the weight requirements of microwave components for platforms such as missile-borne and space-borne. In terms of the sealing performance of the encapsulation housing, the sealing part of this encapsulation housing uses 3A21 aluminum alloy or 6063 aluminum alloy that can be directly laser welded and sealed, which is compatible with the existing process system, ensuring the reliability of the microwave component housing and eliminating the need for additional capacity building and process development to reconstruct the sealing process capacity of a new type of housing.

[0034] In terms of weight reduction and sealing effects, the present invention realizes reliable lightweight encapsulation of microwave components. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the encapsulation structure of a lightweight and sealed housing for microwave components. DETAILED DESCRIPTION OF THE INVENTION

[0036] It should be noted that relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0037] The features and performance of the present invention will be further described in detail below in conjunction with the embodiments.

[0038] Embodiment 1

[0039] The core idea of this embodiment is to adopt the process route of powder diffusion welding, precision numerical control machining and surface treatment to realize the manufacturing of a weight-reduced packaging shell for microwave components.

[0040] Optionally, in this embodiment, the packaging structure uses the method of powder diffusion welding to manufacture an integrated packaging material from magnesium alloy, molybdenum copper alloy and aluminum alloy.

[0041] Based on the above method, please refer to Figure 1 , this embodiment proposes a weight-reduced sealed shell packaging structure for microwave components, including:

[0042] The main body of the packaging structure, the transition region, and the sealing region; the main body of the packaging structure is made of magnesium alloy; the transition region is located between the main body of the packaging structure and the sealing region and is made of molybdenum copper alloy; the sealing region is made of aluminum alloy.

[0043] In this embodiment, specifically, the magnesium alloy, molybdenum copper alloy and aluminum alloy are made into an integrated packaging material by powder metallurgy; the main body of the packaging structure, the transition region and the sealing region are made of the packaging material.

[0044] In this embodiment, preferably, the main body of the packaging structure is made of ZK61 magnesium alloy.

[0045] In this embodiment, preferably, the sealing region is made of 3A21 aluminum alloy and has a thickness of not less than 1 mm.

[0046] In this embodiment, specifically, the specific requirements for the transition region are as follows:

[0047] The weight percentage of molybdenum in the molybdenum-copper alloy used is not more than 16.8%;

[0048] The thickness of the molybdenum-copper alloy in the transition area is not less than 0.2 mm, and after post-processing, the remaining width of the molybdenum-copper alloy is not less than 1 mm;

[0049] When designing the shell cavity structure, the feature plane that needs to be machined is outside the 0.2mm range of the molybdenum-copper bonding surface; that is, when designing the shell cavity structure, the feature plane that needs to be machined cannot be within the 0.2mm range of the molybdenum-copper bonding surface.

[0050] This embodiment is directed to the above-mentioned microwave component weight-reducing sealed housing packaging structure, and further proposes a method for manufacturing the microwave component weight-reducing sealed housing packaging structure, specifically comprising the following steps:

[0051] Step S1: drawing drawings;

[0052] Step S2: material manufacturing;

[0053] Step S3: precision CNC machining;

[0054] Step S4: surface coating.

[0055] In this embodiment, specifically, step S1 includes:

[0056] Use drawing tools to draw mechanical manufacturing drawings of package structures; that is, use tools such as AutoCAD and CATIA to draw mechanical manufacturing drawings of package structures;

[0057] The step S2 includes:

[0058] Using powder metallurgy, magnesium alloy, molybdenum-copper alloy and aluminum alloy are manufactured into an integrated packaging material; the packaging material has a layered structure, wherein the main body of the packaging structure is made of magnesium alloy, the sealing area is made of aluminum alloy, and the transition area between the magnesium alloy and the aluminum alloy is made of molybdenum-copper alloy;

[0059] That is, when manufacturing the packaging material, first prepare a molybdenum-copper alloy plate, magnesium alloy powder molding blank and aluminum alloy molding blank with an overall size slightly larger than the outer size of the packaging shell, and the height of each part should meet the requirements. Figure 1 The dimensions of the various parts are determined based on the final machining drawings and the principles established in this patent. A molybdenum-copper alloy plate is clamped between magnesium alloy and aluminum alloy preformed powder blanks using a sheath fixture, and then hot isostatic pressing is performed to form the three materials into a whole.

[0060] After the packaging material is manufactured, it is processed into the final usable packaging shell state through mechanical processing and surface coating according to the design drawings;

[0061] The step S3 includes:

[0062] According to the structural design requirements of the packaging shell, the manufactured packaging material is processed into the packaging shell by a mechanical processing method, thereby obtaining a weight-reduced sealed shell for microwave components; it should be noted that the mechanical processing method includes: wire cutting, electric discharge machining and milling;

[0063] The step S4 comprises:

[0064] Nickel or nickel / gold is plated on the surface of the processed package shell by chemical plating or electroplating, thereby obtaining a surface state suitable for micro-assembly.

[0065] In this embodiment, specifically, the package shell structure design requirements include:

[0066] The weight percentage of molybdenum in the molybdenum-copper alloy used in the transition region is not greater than 16.8%;

[0067] The thickness of the molybdenum-copper alloy is not less than 0.2 mm; after post-processing, the remaining width of the molybdenum-copper alloy is not less than 1 mm;

[0068] When designing the shell cavity structure, the characteristic plane that needs to be machined is outside the 0.2mm range of the molybdenum-copper bonding surface.

[0069] In this embodiment, it should also be noted that the initial state requirements of each material in step S2 are as follows:

[0070] The magnesium alloy is preformed in powder form;

[0071] The aluminum alloy is preformed in powder form;

[0072] Molybdenum-copper alloy is in a bulk solid state;

[0073] The three materials are tightly pressed together using a sheathing fixture.

[0074] Example 2

[0075] The core idea of this embodiment is to use a process route of laser radiation induction, hot isostatic pressing, precision CNC machining and surface treatment to achieve the manufacture of a weight-reduced packaging shell for microwave components.

[0076] Optionally, the packaging structure described in this embodiment uses laser radiation induction and hot isostatic pressing methods to manufacture magnesium alloy, molybdenum-copper alloy and aluminum alloy into an integrated packaging material.

[0077] Based on the above method, please refer to Figure 1 This embodiment proposes a microwave component weight-reducing sealed housing packaging structure, including:

[0078] The main body of the encapsulation structure, the transition region, and the sealing region; the main body of the encapsulation structure is made of magnesium alloy; the transition region is located between the main body of the encapsulation structure and the sealing region and is made of molybdenum copper alloy; the sealing region is made of aluminum alloy.

[0079] In this embodiment, specifically, the magnesium alloy, molybdenum copper alloy, and aluminum alloy are made into an integrated encapsulation material by the method of hot isostatic pressing after laser radiation surface induced treatment; the main body of the encapsulation structure, the transition region, and the sealing region are made of the encapsulation material.

[0080] In this embodiment, preferably, the main body of the encapsulation structure is made of ZK61 magnesium alloy.

[0081] In this embodiment, preferably, the sealing region is made of 6063 aluminum alloy and has a thickness of not less than 1 mm.

[0082] In this embodiment, specifically, the specific requirements for the transition region are as follows:

[0083] The weight percentage of molybdenum in the molybdenum copper alloy used is not more than 16.8%;

[0084] The thickness of the molybdenum copper alloy in the transition region is not less than 0.2 mm, and after subsequent processing, the remaining width of the molybdenum copper alloy is not less than 1 mm;

[0085] When designing the cavity structure of the outer shell, the characteristic plane that needs to be machined mechanically is outside the 0.2 mm range of the molybdenum copper joint surface; that is, when designing the cavity structure of the outer shell, the characteristic plane that needs to be machined mechanically cannot be within the 0.2 mm range of the molybdenum copper joint surface.

[0086] This embodiment also proposes a manufacturing method for a microwave component weight-reducing sealed outer shell encapsulation structure for the above-mentioned microwave component weight-reducing sealed outer shell encapsulation structure, which specifically includes the following steps:

[0087] Step S1: Drawing;

[0088] Step S2: Material manufacturing;

[0089] Step S3: Precision CNC machining;

[0090] Step S4: Surface plating.

[0091] In this embodiment, specifically, the step S1 includes:

[0092] Using a drawing tool to draw the mechanical manufacturing drawings of the encapsulation structure; that is, using tools such as AutoCAD and CATIA to draw the mechanical manufacturing drawings of the encapsulation structure;

[0093] The step S2 includes:

[0094] A method of hot isostatic pressing after laser radiation surface induced treatment is used to manufacture an integrated encapsulation material from magnesium alloy, molybdenum copper alloy and aluminum alloy; the encapsulation material is a layered structure, the main body of its encapsulation structure is made of magnesium alloy, the sealing area is made of aluminum alloy, and the transition area between magnesium alloy and aluminum alloy is made of molybdenum copper alloy;

[0095] That is, when manufacturing the encapsulation material, first prepare three flat plates with overall dimensions slightly larger than the outer shape dimensions of the encapsulation housing. The height of each part is finally determined according to the mechanical processing drawings of the final formed parts and with reference to the principles formulated in this patent on the basis of meeting the material dimensions of each part shown. First, the two surfaces of the molybdenum copper alloy and the surfaces of the aluminum alloy and magnesium alloy in contact with it are induced and activated using ultraviolet laser. Then, these three materials are stacked and mechanically clamped. Finally, the clamped materials are subjected to hot isostatic pressing to form an integral body of the three materials. Figure 1 After the encapsulation material is manufactured, it is processed into the final usable encapsulation housing state by mechanical processing and surface plating according to the design drawings;

[0096] The step S3 includes:

[0097] According to the design requirements of the encapsulation housing structure, the manufactured encapsulation material is processed into an encapsulation housing by using mechanical processing technology methods, so as to obtain a weight-reduced sealed housing for microwave components; it should be noted that the mechanical processing technology methods include wire cutting, electrical discharge machining, milling, etc.;

[0098] The step S4 includes:

[0099] Nickel or nickel / gold is plated on the surface of the above-mentioned processed encapsulation housing by chemical plating or electroplating, so as to obtain a surface state suitable for microassembly.

[0100] In this embodiment, specifically, the design requirements of the encapsulation housing structure include:

[0101] The weight percentage of molybdenum in the molybdenum copper alloy used in the transition area is not more than 16.8%;

[0102] The thickness of the molybdenum copper alloy is not less than 0.2 mm; after post-processing, the remaining width of the molybdenum copper alloy is not less than 1 mm;

[0103] When designing the cavity structure of the housing, the characteristic plane that needs to be machined is outside the range of 0.2 mm from the molybdenum copper bonding surface.

[0104] In this embodiment, it should also be noted that the laser radiation surface induced treatment in step S2 refers to directly irradiating the surface to be joined with a laser, and the specific requirements are as follows:

[0105]

[0106] ​1. Conduct a full scan irradiation on the bonding surface once.

[0107] 2. The laser wavelength used is 355 nm.

[0108] 3. The laser scanning speed is 50 - 100 mm / s.

[0109] 4. The spot overlap rate is 10% - 20%.

[0110] Example 3

[0111] To make the content of the present invention clearer and easier to understand, taking the encapsulation structure of a microwave component weight - reducing and sealing housing as an example, a further description is made in conjunction with the accompanying drawings:

[0112] As Figure 1 shown, the main body of the encapsulation structure is made of ZK61 magnesium alloy, the sealing area is made of 6063 aluminum alloy, and there is a layer of molybdenum - copper alloy between the magnesium alloy and the aluminum alloy. On this encapsulation structure, the thickness of the ZK61 magnesium alloy is 8 mm, the thickness of the molybdenum - copper alloy (molybdenum content 10%) is 0.5 mm, the thickness of the 6063 aluminum alloy is 1.5 mm, and the wall thickness of the encapsulation housing is 1.2 mm.

[0113] Its manufacturing method is as follows: First, use drawing software to draw the engineering drawings of this structure. Second, use the method of powder diffusion welding to manufacture the encapsulation material, and consider the machining allowance and the setting of the machining positioning surface at this stage. Third, use precision machining to machine the microwave component weight - reducing encapsulation housing into shape. Fourth, use electroplating or chemical plating to coat the metal layer on the required parts of the surface layer of the millimeter - wave solid - state power amplifier encapsulation structure. Thus, a microwave component weight - reducing encapsulation housing with complete functions is formed.

[0114] The above - described embodiments only represent the specific implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the protection scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the technical solution of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application.

[0115] This background technology section is provided to generally present the context of the present invention. The work of the currently named inventors, to the extent described in this background technology section, and aspects that are not prior art at the time of filing this application, are neither expressly nor impliedly admitted to be prior art of the present invention.

Claims

1. A weight-reduced and sealed housing packaging structure for microwave components, characterized in that, Including: The main body of the encapsulation structure, the transition region, and the sealing region; The main body of the encapsulation structure is made of magnesium alloy; The transition region is located between the main body of the encapsulation structure and the sealing region and is made of molybdenum copper alloy; the sealing region is made of aluminum alloy; The magnesium alloy, molybdenum copper alloy, and aluminum alloy are made into an integrated encapsulation material by the method of hot isostatic pressing after laser radiation surface induced treatment; the main body of the encapsulation structure, the transition region, and the sealing region are made of the encapsulation material.

2. The encapsulation structure of a microwave component weight-reducing and sealing housing according to claim 1, wherein The weight percentage of molybdenum in the molybdenum copper alloy used in the transition region is not more than 16.8%.

3. A weight-reduced sealed housing packaging structure for a microwave component according to claim 2, characterized in that The thickness of the molybdenum copper alloy in the transition region is not less than 0.2 mm, and after subsequent processing, the remaining width of the molybdenum copper alloy is not less than 1 mm.

4. A weight-reduced and sealed housing encapsulation structure for a microwave component according to claim 1, characterized in that, When designing the cavity groove structure of the sealing housing, the characteristic plane that needs to be machined is outside the range of 0.2 mm from the molybdenum copper joint surface.

5. A weight-reduced and sealed housing encapsulation structure for a microwave component according to claim 1, characterized in that, The main body of the encapsulation structure is made of ZK61 magnesium alloy; the sealing region is made of 3A21 aluminum alloy or 6063 aluminum alloy, and the thickness is not less than 1 mm.

6. A manufacturing method of a weight-reduced and sealed outer shell packaging structure for a microwave component, characterized in that, Based on the microwave component weight-reducing and sealing housing encapsulation structure according to any one of claims 1-5, including: Step S1: Drawing; Step S2: Material manufacturing; Step S3: Precision CNC machining; Step S4: Surface plating; The said step S1 includes: Using a drawing tool to draw the mechanical manufacturing drawings of the encapsulation structure; The said step S2 includes: By the method of hot isostatic pressing after laser radiation surface induced treatment, the magnesium alloy, molybdenum copper alloy, and aluminum alloy are made into an integrated encapsulation material; The encapsulation material is a layered structure, its main body of the encapsulation structure is made of magnesium alloy, the sealing region is made of aluminum alloy, and the transition region between the magnesium alloy and the aluminum alloy is made of molybdenum copper alloy; The said step S3 includes: According to the design requirements of the encapsulation housing structure, using a mechanical processing technology method, the manufactured encapsulation material is processed into an encapsulation housing; The said step S4 includes: By chemical plating or electroplating, nickel or nickel / gold is plated on the surface of the above-mentioned processed encapsulation housing, so as to obtain a surface state that can be micro-assembled.

7. A manufacturing method of a weight-reduced and sealed housing packaging structure for a microwave component, characterized in that, The design requirements of the encapsulation housing structure include: The weight percentage of molybdenum in the molybdenum copper alloy used in the transition region is not more than 16.8%; The thickness of the molybdenum copper alloy is not less than 0.2 mm; after subsequent processing, the remaining width of the molybdenum copper alloy is not less than 1 mm; When designing the cavity groove structure of the housing, the characteristic plane that needs to be machined is outside the range of 0.2 mm from the molybdenum copper joint surface.

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