A plasma-based printing screen processing technology

Abstract

This invention relates to the field of printing screen processing, and more particularly to a plasma-based printing screen processing technology. Existing printing screens suffer from problems such as film detachment due to insufficient bonding between the PI film and the screen mesh caused by reduced base adhesive during processing. The technical solution includes the following steps: Step 1: Using an inspection machine, residual adhesive dots on the screen are removed with a needle tip to prevent obstruction of subsequent plasma spraying onto the screen mesh surface; Step 2: A release film is placed on the screen surface to prevent damage to areas other than the screen mesh from the sprayed plasma active arc; the plasma spraying process begins using a plasma machine; Step 3: The screen is manually flipped, and Step 2 is repeated to complete the plasma spraying of the screen mesh on the other side. This invention uses a high-frequency plasma active arc to process the screen mesh, which facilitates a thorough bonding between the PI film base adhesive and the screen mesh wire diameter, thereby strengthening the bond and preventing detachment during printing.

Description

Technical Field

[0001] This invention relates to the field of printing screen processing, and more particularly to a plasma-based printing screen processing technology. Background Technology

[0002] With the maturation of PI screen printing technology and its future development, the performance and lifespan of screen printing plates are improving. To reduce the two major problems of printing grid breakage and poor shaping, current technology is making the screen printing yarn thinner and the wire diameter finer. Therefore, the surface of the mesh wire is first roughened to make it rougher and improve its ink permeability, thereby reducing the problem of grid breakage. However, using a PI film with a conventional base adhesive thickness at this time will cause the screen to overflow with adhesive. Therefore, the amount of base adhesive used needs to be reduced simultaneously during the plate making process. Due to the reduction in the amount of base adhesive, the bond between the PI film and the mesh may not be strong enough, leading to the problem of film detachment. Summary of the Invention

[0003] In order to overcome the problems and disadvantages mentioned in the background art, the present invention provides a plasma-based printing screen processing technology.

[0004] The technical solution adopted by this invention to solve its technical problem is: a plasma-based printing screen processing technology, specifically including the following steps:

[0005] Step 1: Use a needle tip to remove any remaining adhesive dots on the screen using an inspection machine to prevent them from obstructing the subsequent plasma spraying onto the screen surface.

[0006] Step 2: Place the isolation film on the screen surface to prevent the active arc of the ejected plasma from damaging areas other than the screen. Then, start the plasma spraying operation through the plasma machine.

[0007] Step 3: Manually flip the screen and repeat Step 2 above to complete the plasma spraying of the other side of the screen.

[0008] Step 4: Press the plasma-processed screen using a heat press machine according to the SOP;

[0009] Step 5: Use a laser engraving machine to create a PI laser pattern on the heat-pressed PI film;

[0010] Step Six: Use 3M tape to perform a tensile test on the stencil completed in Step Five above.

[0011] Furthermore, the plasma energy of the plasma machine in step two is adjusted to be controlled at 740-760 watts.

[0012] Furthermore, the gas pressure of the plasma machine in step two is adjusted to be controlled between 0.24 and 0.26 MPa.

[0013] Furthermore, before the plasma machine in step two begins operation, it is necessary to pre-set one or more of the following paths for plasma processing: single point, multi-segment, curve, and arc.

[0014] Furthermore, the separator in step two is a Teflon film.

[0015] Furthermore, before the plasma spraying operation in step two is carried out, the working area is sealed off, and protective gas is introduced into the sealed space.

[0016] Furthermore, the protective gas is nitrogen or argon.

[0017] Furthermore, the method for conducting a tensile test on the screen in step six is ​​as follows: clean the screen after PI laser drawing, cut a piece of 3M tape and attach it to the screen, connect the unbonded end of the tape to the clamping device, adjust the tensile speed, test the tensile value in the reverse direction at 180°, and record the data.

[0018] Furthermore, the tensile test speed range in step six is ​​set to 20-70 N / cm.

[0019] Furthermore, the clamping device selects one of flat jaws, V-jaws, or wedge jaws for clamping based on the shape, size, and material of the screen sample to be tested.

[0020] Compared with the prior art, the present invention has the following advantages: The present invention uses a high-frequency plasma active arc to spray ions, excited-state molecules, atoms and other high-energy electrons and molecules generated by collisions in low-pressure plasma onto the surface of the screen, thereby improving the surface roughness and wettability of the screen, increasing the roughness of the mesh yarn diameter, which is more conducive to the ink penetration of subsequent ink paste, thereby reducing the problem of screen breakage.

[0021] This invention uses negative pressure to draw in and discharge dust and oil molecules from the air within the working area, and introduces protective gas into the enclosed space, thereby reducing the impact of air, dust, and oil molecules on plasma jetting and preventing oxygen and moisture in the air from oxidizing the surface materials.

[0022] This invention removes grease and dirt from the surface of the mesh by spraying a plasma active arc. At the same time, appropriate plasma energy can efficiently remove contaminants from the mesh surface, making the subsequent PI film bond more firmly to the mesh and less likely to fall off. In addition, the high-frequency plasma active arc increases the roughness of the mesh wire diameter, which is conducive to the full bonding of the PI film base adhesive with the steel wire, further strengthening the firmness and making it less likely to fall off during printing. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0024] Figure 1 This is a partial structural diagram of a finished printing screen mesh in the prior art;

[0025] Figure 2 This is a partial structural schematic diagram of the finished printing screen mesh product according to the present invention;

[0026] Figure 3 This is a magnified view of a finished printing screen mesh from the prior art.

[0027] Figure 4 This is a partial enlarged view of the finished printing screen mesh of the present invention;

[0028] Figure 5 This is a partial structural diagram of the finished printing screen mesh of the present invention after a tensile test;

[0029] Figure 6 This is a partial structural diagram of a printed screen printing mesh after a tensile test. Detailed Implementation

[0030] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0031] Example 1

[0032] A plasma-based printing screen processing technology, such as Figures 1-2 As shown, the screen to be processed is first inspected by an inspection machine to check whether there is a large amount of adhesive residue on its surface. At this time, it needs to be removed manually with the help of a needle tip and the inspection machine to avoid obstructing the subsequent plasma spraying work on the screen surface. Then, a release film is placed manually on the area of ​​the screen surface other than the mesh to prevent the active arc of the sprayed plasma from damaging the area other than the mesh. After the manual ensures that the release film is correct, the plasma spraying work begins through the plasma machine.

[0033] It is important to note that before operating the plasma machine, the plasma energy needs to be adjusted to be controlled at 740-760 watts. Precise control of the plasma energy can adjust its temperature and activity, so that appropriate plasma energy can efficiently perform microstructure processing, while avoiding excessive energy that could damage the substrate or create unnecessary heat-affected zones.

[0034] It is important to note that before operating the plasma machine, the air pressure needs to be adjusted to be controlled between 0.24 and 0.26 MPa. Precise control of the air pressure is beneficial for controlling the density, flow rate, and force of the plasma on the material, which can directly affect the speed and uniformity of surface treatment. At the same time, adjusting the appropriate plasma gas pressure can improve the oleophilicity or hydrophilicity of the mesh surface, so as to better adapt to different types of inks and improve printing quality.

[0035] Furthermore, before the plasma machine is put into operation, it is necessary to pre-set one or more of the following paths for plasma processing: single point, multi-segment, curve, arc, etc. This can improve production efficiency, make the entire process flow smoother and more continuous, and help ensure full coverage of the screen being processed, avoid unnecessary waste of resources caused by repeated processing. At the same time, the pre-set working path can ensure product processing consistency, thereby ensuring the stability of screen quality.

[0036] After all parameters of the plasma machine are adjusted, click the start button and wait for the high-energy electrons and molecules in the low-pressure plasma to collide and generate ions, excited molecules, atoms and other high-frequency plasma active arcs to spray onto the screen surface, thereby improving the surface roughness and wettability of the screen, increasing the roughness of the mesh yarn diameter, which is more conducive to the ink penetration of the subsequent paste, thereby reducing the problem of screen breakage.

[0037] After the plasma machine finishes running, the screen is manually removed and flipped over. Then the above steps are repeated to complete the plasma spraying of the other side of the screen, resulting in a plasma-processed semi-finished mesh.

[0038] The semi-finished product is heat-pressed according to the standard operating procedure (SOP) using a heat press machine to obtain a heat-pressed PI film. Subsequently, the film is laser-etched using a laser engraving machine. After completion, the laser pattern is subjected to a tensile test using 3M tape to obtain the finished plasma-processed printed screen mesh.

[0039] Example 2

[0040] A plasma-based printing screen processing technology, such as Figures 3-4 As shown, the screen to be processed is first inspected by an inspection machine to check whether there is a large amount of adhesive residue on its surface. At this time, it needs to be removed manually with the help of a needle tip and the inspection machine to avoid obstructing the subsequent plasma spraying work on the screen surface. Then, a release film is placed manually on the area of ​​the screen surface other than the mesh to prevent the active arc of the sprayed plasma from damaging the area other than the mesh. After the manual ensures that the release film is correct, the plasma spraying work begins through the plasma machine.

[0041] It should be noted that the above-mentioned separator is made of Teflon, which ensures the connection between the separator and the area on the screen other than the mesh. At the same time, it is ensured manually that no air bubbles are generated between the separator and the screen to avoid incomplete separation due to air bubbles and damage caused by plasma active arc.

[0042] Furthermore, before the plasma jetting operation is carried out, the work area needs to be sealed off. The ventilation equipment is used to draw out the dust and oil molecules in the air under negative pressure and discharge them in a concentrated manner. A protective gas is introduced into the sealed space through a gas supply device. At the same time, this protective gas is either nitrogen or argon, thereby reducing the impact of air, dust and oil molecules on the plasma jetting operation and preventing oxygen and moisture in the air from oxidizing the surface materials.

[0043] After all parameters of the plasma machine are adjusted, click the start button and wait for the high-energy electrons and molecules in the low-pressure plasma to collide and generate ions, excited molecules, atoms and other high-frequency plasma active arcs to spray onto the screen surface, thereby improving the surface roughness and wettability of the screen, increasing the roughness of the mesh yarn diameter, which is more conducive to the ink penetration of the subsequent paste, thereby reducing the problem of screen breakage.

[0044] It is important to note that after the mesh is subjected to the jet plasma active arc, the grease and dirt on the surface of the mesh will be removed. The appropriate plasma energy can efficiently remove contaminants from the surface of the mesh, making the subsequent PI film bond with the mesh more firmly and less likely to fall off. At the same time, the high-frequency plasma active arc increases the roughness of the mesh wire diameter, which is conducive to the full bonding of the PI film base adhesive with the steel wire, further strengthening the firmness and making it less likely to fall off during printing.

[0045] After the plasma machine finishes running, the screen is manually removed and flipped over. Then the above steps are repeated to complete the plasma spraying of the other side of the screen, resulting in a plasma-processed semi-finished mesh.

[0046] The semi-finished product is heat-pressed according to the standard operating procedure (SOP) using a heat press machine to obtain a heat-pressed PI film. Subsequently, the film is laser-etched using a laser engraving machine. After completion, the laser pattern is subjected to a tensile test using 3M tape to obtain the finished plasma-processed printed screen mesh.

[0047] Example 3

[0048] A plasma-based printing screen processing technology, such as Figures 5-6As shown, the screen to be processed is first inspected by an inspection machine to check whether there is a large amount of adhesive residue on its surface. At this time, it needs to be removed manually with the help of a needle tip and the inspection machine to avoid obstructing the subsequent plasma spraying work on the screen surface. Then, a release film is placed manually on the area of ​​the screen surface other than the mesh to prevent the active arc of the sprayed plasma from damaging the area other than the mesh. After the manual ensures that the release film is correct, the plasma spraying work begins through the plasma machine.

[0049] After all parameters of the plasma machine are adjusted, click the start button and wait for the high-energy electrons and molecules in the low-pressure plasma to collide and generate ions, excited molecules, atoms and other high-frequency plasma active arcs to spray onto the screen surface, thereby improving the surface roughness and wettability of the screen, increasing the roughness of the mesh yarn diameter, which is more conducive to the ink penetration of the subsequent paste, thereby reducing the problem of screen breakage.

[0050] After the plasma machine finishes running, the screen is manually removed and flipped over. Then the above steps are repeated to complete the plasma spraying of the other side of the screen, resulting in a plasma-processed semi-finished mesh.

[0051] The semi-finished product is heat-pressed according to the SOP using a heat press machine to obtain a heat-pressed PI film. Then, it is laser-etched using a laser engraving machine. After completion, the laser pattern is subjected to a tensile test using 3M tape to obtain the finished plasma-processed printed screen mesh.

[0052] It is important to note that the above tensile testing method is as follows: First, clean the screen printing plate after PI drawing to ensure that its surface is free of grease and impurities. Then, cut a piece of 3M tape and attach it to the screen printing plate. Connect the unbonded end of the tape to the clamping device. At this time, pressure needs to be applied to ensure that the 3M tape makes full contact with the screen printing plate surface to eliminate air bubbles. Further, adjust the tensile test speed range to 20-70 N / cm and test the tensile value in reverse at 180°. Record detailed test data and generate a test result report. Compare the test results with those of screen printing plates made with existing technologies. The printing screen printing plate treated by plasma jetting process can withstand greater loads, has higher overall structural strength, is not easily deformed, and has a significantly longer service life.

[0053] It should be noted that the clamping device described above selects one of the following clamping jaws—flat jaw, V-jaw, or wedge jaw—to clamp the screen sample according to its shape, size, and material. This ensures uniform force distribution during tensile testing and avoids errors in test results caused by localized deformation or uneven force. At the same time, the design and use of a reasonable clamping device can facilitate and expedite tensile testing, improve equipment utilization, and achieve high-precision tensile testing.

[0054] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0055] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A plasma-based printing screen processing technology, characterized in specific ways. It comprises the following steps: Step one: through the inspection machine, the glue point residue on the screen is removed by needle point to avoid shielding the subsequent plasma on the screen surface; Step two: place the isolation film on the screen surface to prevent the plasma active arc sprayed from damaging the area other than the screen yarn, and start the plasma spraying work through the plasma machine; Step three: manually turn over the screen and repeat the above step two to complete the plasma spraying work on the other side of the screen yarn; Step four: press the screen according to the SOP through the pressing machine; Step five: PI laser drawing is made on the PI film after pressing through the laser machine; Step six: use 3M tape to test the tension of the screen completed in the above step five.

2. A platen-based, platen-printing process according to claim 1, wherein: The plasma machine in step two adjusts the plasma energy to control it at 740-760 watts.

3. A platen-based, platen-printing process according to claim 1, wherein: The plasma machine in step two adjusts the air pressure to control it at 0.24-0.26 megapascals.

4. A platen-based, plasmonic printing process according to any one of claims 1 to 3, wherein: Before the plasma machine in step two works, it needs to set the processing range in advance to perform plasma processing work on one or more of single point, multiple line segments, curves, arcs and other lines.

5. A platen-based, platen-printing process according to claim 4, wherein: The isolation film in step two is a Teflon film.

6. A platen-based, platen-printing process according to claim 5, wherein: Before the plasma spraying work in step two, the working area is closed and protective gas is input into the closed space.

7. A platen-based, platen-printing process according to claim 6, wherein; The protective gas is nitrogen or argon.

8. A platen-based, platen-printing process according to claim 1, wherein: The method of tension test of the screen in step six is: clean the screen after PI laser drawing, cut a piece of 3M tape and attach it to the screen, connect the unattached end of the tape with the clamping device, adjust the tension speed, test the tension value in 180° reverse direction, and record the data.

9. A platen-based, platen-printing process according to claim 8, wherein: The tension test speed range in step six is set at 20-70 N / cm.

10. A platen-based, platen-printing process according to claim 8, wherein: The clamping device selects one of flat jaw, V-shaped jaw and wedge-shaped jaw according to the shape, size and material of the sample to be tested.

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