An automated collection device and method for grinding dust

Abstract

The application discloses a kind of automatic collection device and method of grinding dust, device includes: dust collection assembly, the dust collection assembly includes dust collection cover installed to the outer protective cover of grinding wheel and dust collection plate arranged above upper workbench;Control assembly, the control assembly includes limit switch arranged on the side of bed and controller;Transmission assembly, the transmission assembly includes cylinder arranged on the side of dust collection cover, transmission plate arranged on the output end of cylinder, motor connecting plate arranged on the side of transmission plate, motor fixed plate arranged on the front end of motor connecting plate, motor arranged between the motor fixed plate, slide rail fixed plate arranged on the side of transmission plate, slide rail arranged between the slide rail fixed plate, slider arranged on the slide rail, gear arranged on the output shaft of motor and rack installed on the slider.Dust collection is guaranteed while ensuring that dust collection assembly and workpiece do not interfere, improve the quality and precision of dust collection, realize the automation of debris collection.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of grinding machines, and more particularly relates to a grinding dust automatic collection device and method. BACKGROUND

[0002] Grinding is an effective means to improve the machining quality and dimensional accuracy of the material surface, and is often applied to finishing and secondary processing of composite material components. A large amount of grinding dust is often generated during grinding, which forms dust and easily enters the interior of the equipment, affecting the service life of the equipment and the health of the operators and the working environment. At the same time, in the process of studying the material removal mechanism of grinding, the grinding dust generated during grinding often needs to be observed. Therefore, the grinding dust generated during grinding needs to be effectively collected.

[0003] The conventional grinding dust collection method is to collect the grinding dust generated during grinding by installing a collection bag or a collection groove on the side where the dust is generated. This collection method collects less grinding dust, and the installation process of the collection bag or the collection groove is relatively complicated, the degree of automation is extremely low, and the experimental efficiency cannot be guaranteed. Moreover, the grinding dust collection process is relatively dangerous, and it is easy to cause damage to the human body and the grinding machine. The Chinese patent with publication number CN114523381A discloses a grinding machine with a waste dust recycling function, which includes a base, a workbench, a grinding table, a grinding mechanism, and a first waste dust recycling mechanism. The first waste dust recycling mechanism includes a lifting mechanism, a moving mechanism, a motor, and a dust sweeping mechanism. The lifting mechanism is installed on the workbench, and the dust sweeping mechanism includes a connecting rod and a dust sweeping head. The connecting rod is installed on the rotating shaft of the motor, and the dust sweeping head is installed at the bottom of the connecting rod. The dust sweeping head is located above the grinding table. The periphery of the base is provided with a dust collecting table, and the cross-sectional area of the dust collecting table is greater than that of the workbench. The dust collecting table can achieve the purpose of cleaning the collected dust.

[0004] However, the Chinese patent with publication number CN114523381A only cleans the collected dust to a certain extent, and cannot meet the requirement of observing the collected grinding dust generated during grinding in the study of the material removal mechanism of grinding. Therefore, there is an urgent need for a grinding dust automatic collection device and method that can collect the dust generated during grinding and meet the requirement of observing the collected dust. SUMMARY

[0005] To address the aforementioned deficiencies or improvement needs of existing technologies, this invention provides an automated grinding chip collection device and method. A transmission component drives a chip collection component in linear motion, ensuring that the chip collection component does not interfere with the grinding machine or workpiece during the grinding feed process. This guarantees sufficient safety during chip collection and prevents dust generation during grinding. The device monitors chip generation in real time and adjusts the operation of the transmission component as needed to collect chips promptly, ensuring that the workpiece grinding process is not disturbed by chips. This improves the quality and accuracy of chip collection, automatically and efficiently collecting chips, reducing the need for manual cleaning and intervention, thereby lowering maintenance costs, reducing the impact on the processing environment, and minimizing the health hazards of grinding to operators.

[0006] To achieve the above objectives, according to a first aspect of the present invention, an automated grinding debris collection device is provided, comprising:

[0007] A chip collection assembly, comprising a chip collection cover installed outside the grinding wheel guard and a chip collection plate disposed above the upper worktable;

[0008] The control component includes a limit switch and a controller located on the side of the bed.

[0009] The transmission assembly includes a cylinder disposed on the side of the chip collection hood, a transmission plate disposed at the output end of the cylinder, a motor connecting plate disposed on the side of the transmission plate, a motor fixing plate disposed at the front end of the motor connecting plate, a motor disposed between the motor fixing plates, a slide rail fixing plate disposed on the side of the transmission plate, a slide rail disposed between the slide rail fixing plates, a slider disposed on the slide rail, a gear disposed on the output shaft of the motor, and a rack mounted on the slider, providing the chip collection plate with two degrees of freedom in two directions, improving the quality and accuracy of chip collection, and realizing automated chip collection.

[0010] Furthermore, the chip collection cover is a protective cover that is closed on all four sides, with openings at the bottom and one end;

[0011] A square tube is installed at one end of the opening. The square tube is located between the front and rear sides of the chip collection cover. The tube wall is in contact with the front and rear sides of the chip collection cover, and the inner side is cut at an angle.

[0012] A round tube is connected to the square tube as a ventilation duct.

[0013] Furthermore, the chip collecting plate includes a chip collecting baffle;

[0014] The chip collecting baffle has a three-fold plate structure, with a flat plate at the bottom, an inclined plate in the middle, and a vertical plate at the top. The flat plate, the inclined plate, and the vertical plate are fixedly connected to each other.

[0015] The flat plate of the chip collecting baffle is further provided with a plurality of grooves, and the direction of the grooves is perpendicular to the plane of the vertical plate.

[0016] Further, the chip collecting plate further comprises a chip collecting bottom plate.

[0017] The chip collecting bottom plate is provided with a lower recess on the side which is the same as the shape of the recess on the flat plate of the chip collecting baffle, and cooperates with the recess on the flat plate of the chip collecting baffle.

[0018] No fixing structure is arranged between the chip collecting bottom plate and the chip collecting baffle, and the dismounting and mounting are completed by pulling along the grooves.

[0019] Further, the chip collecting bottom plate is fixed with a conductive adhesive tape.

[0020] The conductive adhesive tape is a conductive adhesive tape special for scanning electron microscopes.

[0021] Further, a plurality of copper columns are arranged between the sliding block and the horizontal plate of the chip collecting baffle.

[0022] The upper end of the copper column is fixed to the four corners of the sliding block by screwing, and the lower end is fixed to the horizontal plate of the chip collecting baffle by screwing.

[0023] Further, the transmission plate is installed in parallel with the side surface of the chip collecting cover and is driven to move up and down by a gas cylinder.

[0024] The motor connecting plate and the sliding rail are located on the same side of the transmission plate and are on the opposite side of the gas cylinder.

[0025] Further, the monitoring device is further provided.

[0026] The monitoring device is an infrared camera arranged on the side surface of the bed.

[0027] Further, the monitoring area of the infrared camera is the area where the debris generated when the upper surface of the grinding wheel rubs against the workpiece and the flying debris are generated.

[0028] According to another aspect of the present application, an automatic grinding debris collection method is provided, comprising the following steps:

[0029] S100, the chip collecting plate enters an initial state, the chip collecting bottom plate is tightly attached to the side edge of the bottom of the chip collecting cover, the limit switch is connected to the controller to start detection, and the infrared camera is connected to the controller to start detection.

[0030] S200, the grinding machine starts grinding the workpiece, the debris generated is concentrated in the square tube under the guidance of the chip collecting cover and falls into the groove of the chip collecting bottom plate, is reserved in the groove through the conductive adhesive tape, the infrared camera monitors the grinding process and outputs real-time thermal imaging until the grinding is completed.

[0031] S300, grinding is completed, continue to move out of the grinding area, the limit switch detects the workpiece and transmits the signal to the controller, and the controller issues an instruction to control the transmission assembly to drive the scrap collecting plate out of the scrap collecting area, manually replace the scrap collecting bottom plate and clean it up;

[0032] S400, the workpiece returns, and passes through the limit switch again, the limit switch detects the workpiece and transmits the signal to the controller, and the controller issues an instruction to control the transmission assembly to drive the scrap collecting plate back to the initial scrap collecting area.

[0033] Overall, compared with the prior art, the above technical solutions conceived by the present application can achieve the following beneficial effects:

[0034] 1. The transmission assembly drives the scrap collecting assembly to move linearly, so that the scrap collecting assembly can ensure that there is no interference between the grinding feed process and the grinding machine and the workpiece 6, ensuring sufficient safety during the scrap collecting process, preventing dust from being generated during the grinding process, monitoring the generation of debris in real time, adjusting the operation of the transmission assembly as needed, collecting debris in a timely manner, ensuring that the grinding process of the workpiece is not disturbed by debris, improving the quality and precision of the scrap collecting, automatically and efficiently collecting debris, reducing the need for manual cleaning and intervention, thereby reducing maintenance costs, reducing the impact on the processing environment, and reducing the harm of grinding to the operator's body.

[0035] 2. The scrap collecting cover collects the waste generated by grinding, prevents the waste from flying in multiple directions during the grinding process, causes cleaning difficulties, and affects the safety hazards, and at the same time, the waste generated by grinding is guided by the side wall of the scrap collecting cover to the inclined angle of the square tube, and after being blocked, it falls on the scrap collecting bottom plate, and the scrap collecting bottom plate can be directly removed to clean the debris. At the same time, when studying the material removal mechanism of grinding, it is convenient to place the entire scrap collecting bottom plate with debris under the scanning electron microscope for observation.

[0036] 3. The transmission assembly provides two directions of freedom for the scrap collecting plate, allowing the scrap collecting plate to move flexibly during use, tightly fitting the side edge of the bottom of the scrap collecting cover during scrap collecting, preventing large gaps from being generated to cause the waste to fly out and affect the scrap collecting effect, and allowing the scrap collecting plate to quickly and flexibly exit outward after scrap collecting is completed, facilitating the disassembly and replacement of the scrap collecting bottom plate, enhancing the scrap collecting effect of the device, and facilitating the processing of the collected waste, including cleaning and observation.

[0037] 4. The infrared camera monitors the grinding process in real time, outputs real-time thermal imaging on the display screen of the controller, and the operator can intuitively observe the characteristics including the temperature and distribution of the debris, analyze the grinding process according to the provided information, prevent abnormal situations from occurring during the grinding process, and adjust the grinding parameters in a timely manner to prevent damage to the workpiece or the grinding machine. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 It is a schematic diagram of installation of the embodiment of the application for the automatic collection device of grinding dust;

[0039] Figure 2 It is a front view of installation of the embodiment of the application for the automatic collection device of grinding dust;

[0040] Figure 3 It is a schematic diagram of structure of the embodiment of the application for the automatic collection device of grinding dust;

[0041] Figure 4 It is a schematic diagram of structure of the embodiment of the application for the automatic collection device of grinding dust from another direction;

[0042] Figure 5 It is a schematic diagram of structure of the embodiment of the application for the automatic collection device of grinding dust from another direction;

[0043] Figure 6 It is a schematic diagram of steps of the embodiment of the application for the automatic collection method of grinding dust.

[0044] In all the drawings, the same reference signs represent the same technical features, specifically: 1-stand, 2-bed, 3-grinding wheel, 4-lower worktable, 5-upper worktable, 6-workpiece, 7-dust collecting cover, 8-ventilation pipe, 9-dust collecting plate, 901-dust collecting baffle, 902-dust collecting bottom plate, 10-transmission plate, 11-motor connecting plate, 12-motor fixing plate, 13-motor, 14-gear, 15-sliding rail, 16-sliding rail fixing plate, 17-sliding block, 18-rack, 19-air cylinder, 20-copper column, 21-limit switch, 22-infrared camera. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the application more clear, the application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application. In addition, the technical features involved in each embodiment of the application described below can be combined with each other as long as they do not conflict with each other.

[0046] Embodiment 1

[0047] The embodiment of the present application provides a kind of automatic collection device of grinding dust, including: for collecting the debris generated when grinding machine is carried out grinding to workpiece 5, the transmission assembly for providing power to the debris collection component, for controlling the operation of the control assembly of the transmission assembly and for monitoring the monitoring device of the debris generated by grinding machine.The transmission assembly drives the linear motion of debris collection component, so that debris collection component is guaranteed not to interfere with grinding machine and workpiece 6 in the process of grinding feed while collecting debris, ensure the safety of debris collection process, and block the generation of dust in the process of grinding, real-time monitoring the generation of debris, adjust the operation of transmission assembly according to the need, collect debris in time, ensure that the grinding process of workpiece is not disturbed by debris, improve the quality and precision of debris collection, automatically and efficiently collect debris, reduce the need for manual cleaning and intervention, thereby reducing maintenance cost, reduce the impact on processing environment, reduce the harm of grinding to the operator's body.

[0048] The chip collecting assembly comprises a chip collecting cover 7 mounted outside the grinding wheel 3 cover and a chip collecting plate 9 arranged above the upper workbench 5. The chip collecting cover 7 is a four-face closed cover, which is sleeved outside the grinding wheel 3 cover. The chip collecting cover 7 is open at the bottom and one end face, and a square tube is mounted at the open end. The square tube is located between the front and rear faces of the chip collecting cover 7, and the tube wall is attached to the front and rear faces of the chip collecting cover 7. The inner side of the square tube is beveled. A round tube is connected to the square tube as a ventilation pipe 8. The chip collecting plate 9 is arranged between the upper workbench 5 and the chip collecting cover 7, and comprises a chip collecting baffle 901 and a chip collecting bottom plate 902 mounted on the chip collecting baffle 901. The chip collecting baffle 901 is a three-fold baffle structure, which comprises a flat plate at the bottom, an inclined plate in the middle and a vertical plate at the top. The flat plate, the inclined plate and the vertical plate are fixedly connected. A plurality of grooves are arranged on one side of the flat plate, and the direction of the grooves is perpendicular to the plane of the vertical plate. The chip collecting bottom plate 902 has the same shape as the groove on one side of the flat plate of the chip collecting baffle 901, and also has a lower recess. The chip collecting bottom plate 902 and the chip collecting baffle 901 are not provided with any fixing structure, and can be pulled out along the groove for disassembly and installation. The chip collecting bottom plate 902 is fixedly connected with a conductive adhesive tape. The conductive adhesive tape is a scanning electron microscope special conductive adhesive tape, which can effectively collect and retain the debris in the groove when the debris falls into the groove. The chip collecting bottom plate 902 with debris can be easily removed and replaced, and the scanning electron microscope can be used for observation. The chip collecting cover 7 collects the grinding debris to prevent the debris from flying in multiple directions during grinding, causing cleaning difficulties and safety hazards. When the debris is generated by grinding, it is guided by the side wall of the chip collecting cover 7 to the beveled corner of the square tube, and then falls on the chip collecting bottom plate 902. The debris can be cleaned by removing the chip collecting bottom plate 902. When studying the material removal mechanism of grinding, the chip collecting bottom plate 902 with debris can be easily placed under the scanning electron microscope for observation.

[0049] The transmission assembly comprises a cylinder 19 fixedly installed on the side of the chip collecting cover 7, a transmission plate 10 fixedly installed on the output end of the cylinder 19, a motor connecting plate 11 fixedly installed on the side of the transmission plate 10, a motor fixing plate 12 installed on the front end of the motor connecting plate 11, a motor 13 installed between the motor fixing plates 12, a slide rail fixing plate 16 fixedly installed on the side of the transmission plate 10, a slide rail 15 fixedly installed between the slide rail fixing plates 16, a sliding block 17 installed on the slide rail 15, a gear 14 installed on the output shaft of the motor 13, and a rack 18 installed on the sliding block 17. The cylinder 19 is fixedly installed on the front side of the chip collecting cover 7. The transmission plate 10 is parallelly installed on the side of the chip collecting cover 7, is fixedly installed on the output end of the cylinder 19, is pushed up and down by the cylinder 19, and is provided with a plurality of mounting holes. The motor connecting plate 11 is an L-shaped plate, the vertical plate is fixedly installed on one side of the transmission plate 10, and a reinforcing rib is welded between the vertical plate and the horizontal plate. The motor fixing plate 12 is a pair of small L-shaped plates, is fixedly installed on the distal end of the horizontal plate of the motor connecting plate 11, and the vertical plate is arranged in the middle. The motor 13 is installed between the pair of motor fixing plates 12, and is fixedly connected with the motor fixing plates 12 and the motor connecting plate 11. The slide rail fixing plate 16 is also a pair of plates, is fixedly installed on the side of the transmission plate 10, and is located below the side of the motor connecting plate 11. The slide rail fixing plate 16 is a three-fold plate structure, the vertical plate is fixedly installed on the transmission plate 10, the two horizontal plates are parallelly arranged, the middle part is a parallel plane, and a side plate is arranged on the side of the three-fold plate structure to increase the strength. One end of the slide rail 15 is fixedly installed between the pair of slide rail fixing plates 16, and the end surface is attached to the transmission plate 10, and the other end extends to the motor connecting plate 11. The motor connecting plate 11 and the slide rail 15 are located on the same side of the transmission plate 10, and are located on the opposite side of the cylinder 19. The sliding block 17 is installed on the slide rail 15 and cooperates with the slide rail 15, and the sliding block 17 can slide forward and backward along the slide rail 15.

[0050] The gear 14 is connected with the motor 13 output shaft by key, one end of the rack 18 is fixed above the slider 17, the other end extends away from the transmission plate 10, the gear 14 cooperates with the rack 18, the gear 14 drives the rack 18 to slide when rotating. The slider 17 and the horizontal plate of the chip collecting baffle 901 are connected by multiple copper columns 20, the upper end of the copper column 20 is fixed on the four corners of the slider 17 by threads, and the lower end is fixed on the horizontal plate of the chip collecting baffle 901 by threads. The copper column 20 connects the transmission assembly and the chip collecting plate 9 together, so that they move in the vertical direction under the driving of the air cylinder 19. The copper column 20 connects the slider 17 and the chip collecting plate 9 together, so that they move in the horizontal direction along the slide rail 15 under the driving of the motor 13. The transmission assembly provides two degrees of freedom for the chip collecting plate 9, so that the chip collecting plate 9 moves flexibly during use, tightly fits the side edge of the bottom of the chip collecting cover 7 during chip collecting, prevents large gaps from being generated to cause the chips to fly out and affect the chip collecting effect, quickly and flexibly exits outward after the chip collecting is completed, facilitates the disassembly and replacement of the chip collecting bottom plate 902, enhances the chip collecting effect of the device, and facilitates the processing including cleaning and observation of the collected chips.

[0051] Preferably, the transmission assembly drives the chip collecting plate 9 to move downward by a certain distance, then moves towards the transmission plate 10, and stops until the chip collecting bottom plate 902 completely enters below the chip collecting cover 7, and then moves upward to make the chip collecting bottom plate 902 fit the edge of the bottom of the chip collecting cover 7, so that the device enters the initial state of chip collecting.

[0052] The control assembly includes a limit switch 21 installed on the side surface of the bed 2 and a controller. The limit switch 21 is fixed on the side surface of the bed 2 and located outside the vertical plate of the chip collecting baffle 901, and is used to detect the position of the workpiece 6. The workpiece 6 moves from right to left on the upper workbench 5, and the grinding wheel 3 grinds the surface of the workpiece 6 during the movement. When the limit switch 21 detects the workpiece 6, a signal is transmitted to the controller, and the controller sends an instruction to control the air cylinder 19 to drive the chip collecting plate 9 to move downward, so that the chip collecting plate 9 is away from the side edge of the bottom of the chip collecting cover 7, and then the motor 13 drives the chip collecting plate 9 to pull out from the bottom of the chip collecting cover 7. At this time, the chip collecting bottom plate 902 is directly replaced. After the grinding is completed, the chip collecting plate 9 automatically exits from the chip collecting position, and the operator only needs to simply replace the chip collecting bottom plate 902 to complete the chip collecting and cleaning work of the grinding machine, so that the chip collecting effect is better and the efficiency is higher, and a good working position is provided for the operator.

[0053] Preferably, after the workpiece 6 is ground, the worktable 5 moves to the right to return to the initial position, and the limit switch 21 detects the workpiece 6 again, and the limit switch 21 detects the workpiece 6 and transmits information to the controller, and the controller sends instructions to control the motor 13 to drive the chip collecting plate 9 to move below the chip collecting cover 7, and then sends instructions to control the cylinder 19 to drive the chip collecting plate 9 to move upward to tightly fit the chip collecting bottom plate 902. After the manual replacement of the chip collecting bottom plate 902 is completed, the chip collecting plate 9 is automatically returned to the initial chip collecting position again to prepare for the grinding and chip collecting of the next workpiece, forming a continuous operation cycle of the grinding machine.

[0054] Preferably, after the chip collecting bottom plate 902 is replaced, the chip collecting bottom plate 902 with debris is transported to a scanning electron microscope for direct observation of the debris when the grinding material removal mechanism is studied. Or without special treatment, the chip collecting bottom plate 902 with debris is directly transported to the debris collection area for centralized cleaning.

[0055] The monitoring device includes an infrared camera 22 arranged on the side of the bed 2. The monitoring area of the infrared camera 22 is the entire grinding processing area, that is, the area where the debris generated when the grinding wheel 3 rubs against the upper surface of the workpiece 6 and the debris flies out. The infrared camera 22 monitors the grinding process in real time and outputs real-time thermal images on the display screen of the controller. The operator can directly observe the characteristics including the temperature and distribution of the debris, analyze the grinding processing condition according to the provided information, prevent abnormal conditions from occurring during the grinding process, and timely adjust the grinding parameters to avoid damage to the workpiece or the grinding machine.

[0056] Embodiment 2

[0057] The embodiment provides an automatic chip collecting method, which comprises the following steps:

[0058] S100, the chip collecting plate 9 enters the initial state, the chip collecting bottom plate 902 tightly fits the bottom side of the chip collecting cover 7, and the limit switch 21 is connected to the controller to start detection, and the infrared camera 22 is connected to the controller to start detection;

[0059] S200, the grinding machine starts grinding the workpiece 6, and the debris generated is collected in the groove of the chip collecting bottom plate 902 under the guidance of the chip collecting cover 7 and is retained in the groove through the conductive adhesive tape. The infrared camera 22 monitors the grinding process and outputs real-time thermal images until the grinding is completed.

[0060] S300, after the grinding is completed, the workpiece 6 continues to move out of the grinding area, and the limit switch 21 detects the workpiece 6 and transmits a signal to the controller. The controller sends instructions to control the transmission assembly to drive the chip collecting plate 9 to exit the chip collecting area, and the chip collecting bottom plate 902 is manually replaced and cleaned.

[0061] S400, the workpiece 6 returns, passes the limit switch 21 again, the limit switch 21 detects the workpiece 6 and transmits a signal to the controller, and the controller issues an instruction to control the transmission assembly to drive the chip collecting plate 9 to return to the initial chip collecting area.

[0062] The step S200 of "the controller issues an instruction to control the transmission assembly to drive the chip collecting plate 9 to exit the chip collecting area" specifically includes:

[0063] S201, when the limit switch 21 detects the workpiece 6, a signal is transmitted to the controller, and the controller sends an instruction to control the cylinder 19 to drive the chip collecting plate 9 to move downward, so that the chip collecting plate 9 is pulled away from the side edge of the bottom of the chip collecting cover 7.

[0064] S202, the motor 13 is controlled to drive the chip collecting plate 9 to pull out from the bottom of the chip collecting cover 7, and at this time, the chip collecting bottom plate 902 is directly replaced.

[0065] The step S300 further includes:

[0066] S301, when it is necessary to observe the chip of the ground material, the removed chip collecting bottom plate 902 is directly transported to the scanning electron microscope for scanning observation, and then transported to the chip collecting position for cleaning.

[0067] S302, when it is not necessary to perform any operation on the chip, the removed chip collecting bottom plate 902 is directly transported to the chip collecting position for cleaning.

[0068] Those skilled in the art can easily understand that the above description is only a preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An automated grinder debris collection device, comprising: It comprises: A chip collecting assembly, which comprises a chip collecting cover (7) installed outside the grinding wheel (3) protective cover and a chip collecting plate (9) arranged above the upper workbench (5); A control assembly, which comprises a limit switch (21) arranged on the side of the bed (2) and a controller; A transmission assembly, which comprises a cylinder (19) arranged on the side of the chip collecting cover (7), a transmission plate (10) arranged at the output end of the cylinder (19), a motor connecting plate (11) arranged on the side of the transmission plate (10), a motor fixing plate (12) arranged at the front end of the motor connecting plate (11), a motor (13) arranged between the motor fixing plates (12), a slide rail fixing plate (16) arranged on the side of the transmission plate (10), a slide rail (15) arranged between the slide rail fixing plates (16), a sliding block (17) arranged on the slide rail (15), a gear (14) arranged on the output shaft of the motor (13), and a rack (18) installed on the sliding block (17), which provides the chip collecting plate (9) with freedom in two directions; The chip collecting cover (7) is a four-sided closed protective cover with an open end at the bottom and one side; A square tube is installed at the open end, which is located between the front and rear sides of the chip collecting cover (7), the tube wall is attached to the front and rear sides of the chip collecting cover (7), and the inner side is cut at an angle; A round tube is connected in the square tube as a ventilation pipe (8); The chip collecting plate (9) comprises a chip collecting baffle (901); The chip collecting baffle (901) is a three-fold baffle structure, the bottom is a flat plate, the middle is an inclined plate, and the top is a vertical plate, which are fixedly connected respectively; The flat plate side of the chip collecting baffle (901) is also provided with multiple grooves, and the groove direction is perpendicular to the vertical plate plane; The chip collecting plate (9) further comprises a chip collecting bottom plate (902); The chip collecting bottom plate (902) is the same shape as the groove side of the flat plate of the chip collecting baffle (901), also has a lower recess, and cooperates with the groove of the flat plate of the chip collecting baffle (901); There is no fixed structure between the chip collecting bottom plate (902) and the chip collecting baffle (901), and the disassembly and installation are completed by pulling along the groove; The chip collecting bottom plate (902) is fixed with a conductive adhesive tape; The conductive adhesive tape is a scanning electron microscope special conductive adhesive tape.

2. An automated grinder debris collection device according to claim 1, wherein, The sliding block (17) and the horizontal plate of the chip collecting baffle (901) are connected through multiple copper columns (20); The upper end of the copper column (20) is fixed on the four corners of the sliding block (17) by threads, and the lower end is fixed on the horizontal plate of the chip collecting baffle (901) by threads.

3. An automated grinder debris collection device according to claim 1, wherein, The transmission plate (10) is installed parallel to the side of the chip collecting cover (7) and is pushed up and down by the cylinder (19); The motor connecting plate (11) and the slide rail (15) are located on the same side of the transmission plate (10) and are on the opposite side of the cylinder (19).

4. An automated grinder debris collection device according to claim 1, wherein, It also comprises a monitoring device; The monitoring device is an infrared camera (22) arranged on the side of the bed (2).

5. An automated grinder debris collection device according to claim 4, wherein, The monitoring area of the infrared camera (22) is the area where the chips generated when the grinding wheel (3) and the upper surface of the workpiece (6) rub and the chips fly out.

6. An automated grinder debris collection method implemented using an automated grinder debris collection device as claimed in any one of claims 1-5, characterized by, It comprises the following steps: S100, the chip collecting plate (9) enters the initial state, the chip collecting bottom plate (902) is closely attached to the bottom side edge of the chip collecting cover (7), the limit switch (21) is connected to the controller to start detection, and the infrared camera (22) is connected to the controller to start detection; S200, the grinding machine starts grinding the workpiece (6), and the generated chips are concentrated in the square tube under the guidance of the chip collecting cover (7) and fall into the groove of the chip collecting bottom plate (902), are retained in the groove through the conductive adhesive tape, the infrared camera (22) monitors the grinding process and outputs real-time thermal imaging until the grinding is completed; S300, after the grinding is completed, the workpiece (6) is continuously moved out of the grinding area, the limit switch (21) detects the workpiece (6) and transmits a signal to the controller, the controller issues an instruction to control the transmission assembly to drive the chip collecting plate (9) to exit the chip collecting area, the chip collecting bottom plate (902) is manually replaced and cleaned; S400, the workpiece (6) returns, passes through the limit switch (21) again, the limit switch (21) detects the workpiece (6) and transmits a signal to the controller, and the controller issues an instruction to control the transmission assembly to drive the chip collecting plate (9) to return to the initial chip collecting area.

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