Heat dissipation assembly and electronic device

Abstract

The application discloses a heat dissipation assembly and an electronic device. The heat dissipation assembly comprises a plurality of cold plates and a heat conduction module. A channel is formed between two adjacent cold plates for inserting a plug-in module. The cold plate comprises two contact surfaces for contacting the plug-in module. The heat conduction module is arranged on at least one contact surface. The heat conduction module comprises a thermal interface material layer, a heat conduction member and a reset member. The thermal interface material layer is attached to the contact surface. The heat conduction member is located on the side of the thermal interface material layer away from the cold plate. The heat conduction member is used for elastically abutting the thermal interface material layer and the plug-in module. The reset member is arranged around the thermal interface material layer. The thermal interface material layer is used for driving the reset member to deform after being pressed. The reset member is used for driving the thermal interface material layer to recover the deformation after the thermal interface material layer is released, so as to enhance the heat dissipation effect of the plug-in module and meet the plug-in requirement of the plug-in module.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and in particular to a heat dissipation component and an electronic device. Background Art

[0002] As computer applications continue to expand, users are demanding greater capacity, higher reliability, higher availability, and faster speeds for storage systems. Existing hard drives primarily use contact cooling for heat dissipation, such as heat dissipation through a thermal interface material layer between the hard drive and the cold plate. However, the thermal interface material layer deforms when pressed by the hard drive. If the hard drive is removed, it will be difficult for the thermal interface material layer to recover its deformation, thereby increasing the contact thermal resistance of subsequently inserted hard drives. Therefore, it is difficult for the thermal interface material layer to simultaneously achieve high thermal conductivity and support the insertion and removal of pluggable modules such as hard drives. Summary of the Invention

[0003] In view of this, the present application provides a heat dissipation component and an electronic device to solve the problem that it is difficult for the thermal interface material layer to simultaneously have high thermal conductivity and support the plugging and unplugging of pluggable modules such as hard drives.

[0004] In a first aspect, the present application provides a heat dissipation assembly, comprising:

[0005] A plurality of cold plates, wherein a channel for inserting a plug-in module is formed between two adjacent cold plates, and the cold plate includes two contact surfaces for contacting the plug-in module;

[0006] a heat conduction module, disposed on at least one of the contact surfaces;

[0007] Among them, the thermal conductive module includes a thermal interface material layer, a thermal conductive part and a reset part, the thermal interface material layer is attached to the contact surface; the thermal conductive part is located on the side of the thermal interface material layer away from the cold plate, and the thermal conductive part is used to elastically abut the thermal interface material layer and the plug-in module; the reset part is arranged around the thermal interface material layer and abuts the thermal interface material layer, and the thermal interface material layer is used to deform after being compressed.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the heat conductor includes a substrate fixed on the cold plate, the substrate and the cold plate together form a accommodating space for accommodating the thermal interface material layer, the substrate is provided with a window, and the substrate is provided with an elastic pressing portion at one end of the window, and the pressing portion is used to conduct the heat generated by the plug-in module to the cold plate through the thermal interface material layer, thereby meeting the needs of multiple plug-in and plug-out of the plug-in module, improving heat dissipation efficiency, and reducing cost.

[0009] In some implementations of the first aspect, the pressing portion includes a root end and a free end opposite to each other, the root end is connected to the base plate, the free end of the pressing portion is located at a rear side of the window in a length direction of the heat dissipation assembly, and the root end of the pressing portion is located at a front side of the window in the length direction of the heat dissipation assembly, the length direction of the heat dissipation assembly is parallel to a plug-in direction of the plug-in module, so that the problem of the free end being warped when the root end of the pressing portion is stressed first is avoided, and the phenomenon of the contact area between the pressing portion and the thermal interface material layer being reduced due to uneven stress on the root end and the free end of the pressing portion is solved.

[0010] In some implementations of the first aspect, the pressing portion includes a main body segment connected to the base plate, and the main body segment is inclined to a side of the base plate away from the thermal interface material layer. In this way, on the one hand, the tolerance can be absorbed by the pressing portion, the contact area between the heat conduction member and the plug-in module and the thermal interface material layer is increased, and the heat dissipation efficiency is improved; on the other hand, when the plug-in module is inserted into the channel, the free end of the pressing portion is stressed first and moves close to the thermal interface material layer, and the root end of the pressing portion is tightly attached to the heat dissipation surface of the plug-in module, so that the contact surface of the plug-in module is better in interference fit with the pressing portion, and the stability and reliability of heat transmission are ensured.

[0011] In some implementations of the first aspect, the pressing portion further includes a guide segment connected to an end of the main body segment away from the base plate, the guide segment is inclined to the thermal interface material layer relative to the main body segment, and the inclination direction of the guide segment is opposite to the inclination direction of the main body segment. In this way, on the one hand, the guide segment plays a guiding role on the plug-in module, reduces the scratching of the plug-in module by the pressing portion, and reduces the plug-in friction, thereby improving the plug-in smoothness; on the other hand, the guide segment can limit the spread of the thermal interface material layer along the length direction of the heat dissipation assembly to a certain extent, and guide the spread of the thermal interface material layer along the width direction of the heat dissipation assembly, so that the thermal interface material layer drives the reset member to deform after being stressed.

[0012] In some implementations of the first aspect, the pressing portion is configured as a heat conduction sheet or a heat conduction film, so as to elastically abut against the plug-in module, reduce the plug-in friction, and increase the contact area between the pressing portion and the plug-in module and the thermal interface material layer, thereby improving the heat dissipation efficiency.

[0013] In some implementations of the first aspect, the reset member includes an elastic portion and a fixed portion, the elastic portion is fixed to the base plate through the fixed portion, a space-variable limiting space is formed between the elastic portion and the cold plate, and the thermal interface material layer is located in the limiting space. In this way, the reset member can provide an elastic force for restoring the deformation of the thermal interface material layer in the width direction of the heat dissipation assembly, so that the heat conduction member can be in close contact with the plug-in module and the thermal interface material layer to form a stable interference fit, thereby ensuring that the plug-in module can have good contact with the heat conduction module after being inserted into the channel each time, improving the heat conduction efficiency and enhancing the heat dissipation effect.

[0014] In some implementations of the first aspect, the elastic portion includes a deformation segment and a connecting segment connected to the deformation segment, the connecting segment is connected to the fixed portion and is arranged in a bent manner relative to the deformation segment, and the deformation segment abuts against the thermal interface material layer. In this way, when the thermal interface material layer is deformed, the deformation segment is also deformed, and after the thermal interface material layer releases the pressure, the deformation segment can drive the thermal interface material layer to produce a restoring deformation in the width direction of the heat dissipation assembly, thereby ensuring that the plug-in module can have good contact with the heat conduction module after being inserted into the channel each time, improving the heat conduction efficiency and enhancing the heat dissipation effect.

[0015] In some implementations of the first aspect, the connecting segment is arranged in a spaced manner relative to the thermal interface material layer. In this way, when the thermal interface material layer is subjected to an external force, the gap between the connecting segment and the thermal interface material layer provides a space for the thermal interface material layer to spread due to the external force, thereby avoiding the problem that the thermal interface material layer is pressed out of the limiting space and the problem that the fixed connection between the fixed portion of the reset member and the base plate is abnormal due to stress abnormality of the connecting segment, and ensuring that the deformation segment can provide an elastic force for restoring the deformation of the thermal interface material layer in the width direction of the heat dissipation assembly.

[0016] In some implementations of the first aspect, the deformation segment is configured as an arc-shaped structure formed by the elastic portion being concave in the length direction of the reset member, or the deformation segment is configured as a planar structure extending in the length direction of the reset member, or the deformation segment is a wave-shaped structure extending in the length direction of the heat dissipation assembly.

[0017] In some implementations of the first aspect, the elastic portion is configured as a metal spring or a rubber spring.

[0018] In some implementations of the first aspect, the thermal interface material layer includes a plurality of heat conduction blocks arranged in a spaced manner, and the plurality of heat conduction blocks are arranged in an array on the cold plate.

[0019] In some implementations of the first aspect, the thermal interface material layer includes a plurality of heat-conductive strips arranged at intervals, and the plurality of heat-conductive strips are arranged along a length direction or a width direction of the cold plate.

[0020] In some implementations of the first aspect, the thermal interface material layer includes at least one of a heat-conductive silicone grease, a heat-conductive silicone gel, and a thermal interface material sheet.

[0021] In some implementations of the first aspect, the heat dissipation assembly further includes a heat dissipation pipe, the heat dissipation pipe includes an inlet pipe, an outlet pipe, a plurality of main pipes arranged on the cold plate, and a plurality of node pipes connecting adjacent two of the main pipes, the plurality of main pipes are connected in series or in parallel through the node pipes, and the plurality of main pipes are connected in communication with the inlet pipe, the outlet pipe, and the node pipes, so as to improve the heat dissipation efficiency of the heat dissipation assembly and optimize the pipe design of the heat dissipation pipe.

[0022] In some implementations of the first aspect, the heat dissipation assembly further includes a fixing frame, the inlet pipe, the outlet pipe, and the node pipes are fixed on the fixing frame respectively, and the node pipes and the connector for electrically connecting with the plug-in module are arranged at intervals in a width direction of the heat dissipation assembly, so as to realize the compactness and miniaturization of the heat dissipation assembly.

[0023] In the second aspect, the present application provides an electronic device including at least one plug-in module and the heat dissipation assembly as described above, the heat dissipation assembly is used for dissipating heat of the plug-in module, and the plug-in module includes at least one of a hard disk, a battery module, and a power module.

[0024] In some implementations of the second aspect, the electronic device includes a server.

[0025] The heat dissipation assembly and the electronic device provided by the present application can effectively transfer the heat generated by the plug-in module to the cold plate by reducing the contact thermal resistance, thereby enhancing the heat dissipation effect of the heat dissipation assembly. On the other hand, the heat-conductive member can elastically abut against the thermal interface material layer and the plug-in module, so that the heat-conductive member can absorb the gap tolerance between the plug-in module and the heat dissipation module, thereby improving the heat conduction efficiency. In addition, the thermal interface material layer deforms after being pressed, so that the plug-in module realizes the interference fit between the thermal interface material layer and the heat-conductive member after being inserted into the channel, thereby ensuring the contact area between the thermal interface material layer and the heat-conductive member, and ensuring that the plug-in module can have good contact with the heat dissipation module after being plugged in and out for multiple times, thereby improving the heat conduction efficiency and enhancing the heat dissipation effect. Therefore, the heat dissipation assembly provided by the present application solves the problem that the thermal interface material layer is difficult to simultaneously have high thermal conductivity and support the plugging of the plug-in module such as the hard disk. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative labor.

[0027] Figure 1 is a schematic diagram of a functional module of a server provided by the present application.

[0028] Figure 2 is Figure 1 is a structural schematic diagram of a hard disk module of the server in

[0029] Figure 3 is Figure 2 is an exploded view of the hard disk module in

[0030] Figure 4 is Figure 3 is a structural schematic diagram of a heat dissipation assembly of the hard disk module in

[0031] Figure 5 is Figure 4 is an exploded view of a cold plate module of the heat dissipation assembly in

[0032] Figure 6 is Figure 5 is an enlarged view of part A of the cold plate module of the heat dissipation assembly in

[0033] Figure 7 is Figure 4 is an assembly view of the cold plate module of the heat dissipation assembly in

[0034] Figure 8 is Figure 7 is a sectional view of the cold plate module of the heat dissipation assembly in along VII-VII line.

[0035] Figure 9 is Figure 8 is an enlarged view of part B of the cold plate module of the heat dissipation assembly in

[0036] Figure 10 is Figure 5 is an enlarged view of a reset member of the cold plate module of the heat dissipation assembly in

[0037] Figure 11 is Figure 4 is a partial exploded view of the cold plate module of the heat dissipation assembly in

[0038] Figure 12 is Figure 11 is an enlarged view of part C of the cold plate module of the heat dissipation assembly in

[0039] Main component symbol description

[0040]

[0041]

[0042]

[0043] The following detailed description will further describe the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0044] In order for those skilled in the art to better understand the present application, the technical solutions in the present application will be described clearly and completely in conjunction with the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present application.

[0045] The terms "first", "second", and the like (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily limit to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0046] The following first briefly introduces the basic concepts involved in the embodiments of the present application.

[0047] The term "battery module" refers to a device that converts the chemical energy stored by itself into electrical energy, i.e. a device that converts the energy stored in advance into electrical energy for external use.

[0048] The term "power module" refers to a device that converts other forms of energy into electrical energy and provides electrical energy to a circuit (electronic device).

[0049] The electronic device of the embodiments of the present application includes but is not limited to servers, battery packs and the like. The plug-in module includes but is not limited to at least one of a hard disk, a battery module, a power module and the like. It should be noted that in order for those skilled in the art to better understand the electronic device, the following will be described in conjunction withFigure 1 For detailed introduction, please refer to Figure 1 , Figure 1 is a schematic view of functional modules of the server 1000 in the embodiment of the present application. The server 1000 comprises a case 1 and a hard disk module 2, a server mainboard 3, a central processing unit 4, a memory 5, a fan module 6 and a power supply 7 arranged in the case 1. The hard disk module 2, the central processing unit 4 and the memory 5 are connected to the server mainboard 3 through corresponding interfaces on the server mainboard 3, so as to realize transmission of data signals, power signals or other signals. The fan module 6 is used for cooling at least one of the hard disk module 2, the central processing unit 4, the memory 5 and the power supply 7. The power supply 7 supplies power for the hard disk module 2, the server mainboard 3, the central processing unit 4, the memory 5 and the fan module 6.

[0050] It should be noted that Figure 1 the purpose is only to schematically describe the connection mode between the case 1, the hard disk module 2, the server mainboard 3, the central processing unit 4, the memory 5, the fan module 6 and the power supply 7, and not to make specific limitation on the connection position, the connection relationship and the specific structure of each element. Figure 1 The structure of the server 1000 in the embodiment of the present application is only schematically described, and does not constitute specific limitation on the server 1000. In other embodiments of the present application, the server 1000 can comprise more or less components than those shown in the figure, or combine certain components, or different components, for example, the server 1000 can further comprise but not limited to an input / output interface, a connection cable and the like. Figure 1 For detailed introduction, please refer to

[0051] , Figures 2 to 4 , Figure 2 is Figure 1 a structure schematic view of the hard disk module 2 of the server 1000 in the embodiment of the present application, Figure 3 is Figure 2 an exploded view of the hard disk module 2 in the embodiment of the present application, Figure 4 is Figure 2 an enlarged view of a heat dissipation assembly 100 of the hard disk module 2 in the embodiment of the present application. The hard disk module 2 comprises the heat dissipation assembly 100 and at least one plug-in module 200. Each plug-in module 200 is plug-inly inserted into the heat dissipation assembly 100, so as to facilitate plug-in maintenance of the plug-in module 200.

[0052] For a clearer description, the X-axis direction is defined as the length direction of the hard disk module 2, i.e., the plug-in direction of the hard disk module 2, the Y-axis direction is defined as the width direction of the hard disk module 2, and the Z-axis direction is defined as the height direction of the hard disk module 2. The length direction of the heat dissipation assembly 100 is a direction parallel to the X-axis direction; the width direction of the heat dissipation assembly 100 is a direction parallel to the Y-axis direction; and the height direction of the heat dissipation assembly 100 is a direction parallel to the Z-axis direction. Exemplarily, the front is in the direction opposite to the arrow direction of the X-axis direction, and the rear is in the arrow direction of the X-axis direction.

[0053] The heat dissipation assembly 100 includes one or more cold plate modules 110. Each plug-in module 200 is in abutment with a corresponding cold plate module 110. Exemplarily, in the embodiment, the heat dissipation assembly 100 includes a plurality of cold plate modules 110. The plurality of cold plate modules 110 are arranged side by side and spaced apart. Two adjacent cold plate modules 110 form a channel 11 for the plug-in module 200 to be inserted. The number of plug-in modules 200 can include one or more. In the embodiment, different plug-in modules 200 can be inserted into different channels 11, so that each plug-in module 200 is inserted into a corresponding channel 11, thereby ensuring the heat dissipation effect of each plug-in module 200 and achieving precise plug-in of the plug-in module 200. In some embodiments, different plug-in modules 200 can also be inserted into the same channel 11, for example, two plug-in modules 200 are inserted into the same channel 11, at which time each plug-in module 200 is in contact with one of the cold plate modules 110. It can be understood that the corresponding plug-in module 200 can be inserted into all the channels 11; or only some of the channels 11 can be inserted into the corresponding plug-in module 200, for example, only one channel 11 is inserted into the corresponding plug-in module 200. It should be noted that the user inserts one or more plug-in modules 200 into the channel 11 according to the actual situation, and the present application does not make specific limitations. Exemplarily, in the embodiment, the number of cold plate modules 110 includes eight, and the number of plug-in modules 200 is seven, and the eight cold plate modules 110 form seven channels 11 corresponding to the seven plug-in modules 200, i.e., the seven plug-in modules 200 are respectively inserted into the seven channels 11. It should be noted that the number of cold plate modules 110 and plug-in modules 200 is only used for illustration, and the present application does not make specific limitations, for example, the number of cold plate modules 110 and plug-in modules 200 can be one, two, three, four, ten, fifteen, etc.

[0054] In the embodiment, the plug-in module 200 is a hard disk. Exemplarily, the hard disk is a solid state drive (SSD), such as but not limited to an E1.S hard disk, an E3.L hard disk, an E3.S hard disk, or the like. The plug-in module 200 includes a heat dissipation surface 210 configured to be attached to the heat conduction module 30. The heat dissipation surface 210 is configured as a flat surface, i.e., the heat dissipation surface 210 of the plug-in module 200 is not provided with a circuit board and other functional components, thereby improving the smoothness of the plug-in module 200 inserted into the heat dissipation assembly 100, and reducing the wear between the plug-in module 200 and the heat conduction module 30, thereby realizing the plug-in module 200 being plug-in mounted in the heat dissipation assembly 100. The heat dissipation surface 210 of the plug-in module 200 is parallel to the plane where the heat conduction module 30 is located, thereby increasing the contact area and improving the heat dissipation efficiency.

[0055] In the embodiment, the hard disk module 2 further includes a housing 101 and a support plate 102. The housing 101 and the support plate 102 form an installation space 1001 for accommodating the heat dissipation assembly 100 and all plug-in modules 200. The hard disk module 2 can further include a plug-in circuit board 103 disposed on the support plate 102. In some embodiments, the plug-in circuit board 103 is connected to the server mainboard 3, i.e., the plug-in circuit board 103 and the server mainboard 3 are independently disposed. The plug-in module 200 is connected to the server mainboard 3 through the plug-in circuit board 103. In other embodiments, the plug-in circuit board 103 is the server mainboard 3, i.e., the plug-in module 200 is directly connected to the server mainboard 3.

[0056] In some embodiments, the plug-in module 200 can be a hard disk, and is used for storing, but not limited to, file data, user data, software data, and the like on the server 1000. In other embodiments, the plug-in module 200 can also be a battery module or a power module, and is used for transmitting a power signal to the server mainboard 3. In this way, when the connecting head 230 of the plug-in module 200 is inserted into the connector 104 of the plug-in circuit board 103, the plug-in module 200 and the server mainboard 3 can transmit a data signal or a power signal through the plug-in circuit board 103, thereby realizing the server mainboard 3 reading the data signal of the plug-in module 200; or, realizing the plug-in module 200 storing data of the server 1000; or, realizing the server mainboard 3 being powered.

[0057] The plug-in circuit board 103 is connected with the plug-in module 200 in a pluggable manner, so as to realize transmission of data signals or power signals between the plug-in module 200 and the plug-in circuit board 103. Specifically, the plug-in circuit board 103 is provided with a connector 104 electrically connected with the plug-in module 200, and one end of the plug-in module 200 is provided with a connecting head 230 which is plugged with the connector 104, so as to realize pluggable connection between the plug-in circuit board 103 and the plug-in module 200. Optionally, in the embodiment, the plane of the plug-in circuit board 103 is parallel to the plane of the support plate 102, so as to simplify assembly and improve the space utilization above the plug-in circuit board 103. In some other embodiments, the plug-in circuit board 103 is arranged at an angle with the plane of the support plate 102, which is not limited in the present application. Optionally, in some embodiments, the other end of the plug-in module 200 is provided with an operation part 220, so as to facilitate a user to take out or install the plug-in module 200.

[0058] The heat dissipation assembly 100 is used for dissipating heat of the plug-in module 200. The heat conduction path of the heat dissipation assembly 100 is that heat generated by the plug-in module 200 during operation is conducted to the heat dissipation assembly 100, so as to dissipate the heat generated by the plug-in module 200. In order to make the skilled in the art better understand the heat dissipation principle of the heat dissipation assembly 100, the following will be described in detail in combination with Figure 4 and Figure 5 . Please refer to Figure 4 and Figure 5 , Figure 4 is a structural schematic view of the heat dissipation assembly 100 of the hard disk module 2 in Figure 3 , Figure 5 is a structural schematic view of the heat dissipation assembly 100 of the hard disk module 2 in Figure 4An exploded view of the cold plate module 110 of the heat dissipation assembly 100. The heat dissipation assembly 100 includes the cold plate module 110 and the fixing frame 120 for fixing the cold plate module 110. The fixing frame 120 is located at one end of the cold plate module 110, thereby avoiding the problem of assembly interference between the fixing frame 120 and the plug-in module 200. The cold plate module 110 includes a plurality of cold plates 10 and a heat conduction module 30. A channel 11 for inserting the plug-in module 200 is formed between two adjacent cold plates 10. The cold plate 10 includes two contact surfaces 12 for contacting the plug-in module 200. The heat conduction module 30 is arranged on at least one contact surface 12. The heat conduction module 30 includes a thermal interface material layer 40, a heat conduction piece 50, and a reset piece 60. The thermal interface material layer 40 is attached to the contact surface 12. The heat conduction piece 50 is located on the side of the thermal interface material layer 40 away from the cold plate 10. The heat conduction piece 50 is used to elastically abut the thermal interface material layer 40 and the plug-in module 200. The reset piece 60 surrounds the thermal interface material layer 40 and abuts the thermal interface material layer 40. The thermal interface material layer 40 is used to deform after being pressed. The reset piece 60 is used to drive the thermal interface material layer 40 to recover the deformation after the thermal interface material layer 40 is released. It should be noted that, since the heat conduction piece 50 is elastic, when the plug-in module 200 is inserted into the channel 11, the heat conduction piece 50 is deformed by the cold plate 10 and moves towards the side close to the thermal interface material layer 40, at this time the thermal interface material layer 40 is in a pressed state; after the plug-in module 200 is pulled out of the channel 11, the heat conduction piece 50 is released from the pressing of the cold plate 10 and recovers the deformation away from the thermal interface material layer 40, at this time the thermal interface material layer 40 is in a released state.

[0059] The heat dissipation assembly 100 provided by the present application, on the one hand, based on the thermal interface material layer 40 arranged on the contact surface 12 of the cold plate 10, thereby effectively transferring the heat generated by the plug-in module 200 to the cold plate 10 by reducing the contact thermal resistance, thereby enhancing the heat dissipation effect of the heat dissipation assembly 100. On the other hand, the heat conduction piece 50 can elastically abut between the thermal interface material layer 40 and the plug-in module 200, so the heat conduction piece 50 can absorb the gap tolerance between the plug-in module 200 and the heat conduction module 30, thereby improving the heat conduction efficiency. On the other hand, based on the thermal interface material layer 40 driving the reset piece 60 to deform after being pressed, and the reset piece 60 driving the thermal interface material layer 40 to recover the deformation after the thermal interface material layer 40 is released, so that the thermal interface material layer 40 and the heat conduction piece 50 are interference fit after the plug-in module 200 is inserted into the channel 11, thereby ensuring the contact area between the thermal interface material layer 40 and the heat conduction piece 50, and thereby ensuring that the plug-in module 200 can still have good contact with the heat conduction module 30 after being plugged in and out multiple times, thereby improving the heat conduction efficiency and enhancing the heat dissipation effect. Therefore, by using the heat dissipation assembly 100 of the present application, the problem that the thermal interface material layer 40 is difficult to simultaneously have high thermal conductivity and support the plug-in module 200 such as hard disk plug-in and out is solved.

[0060] In the embodiment, two heat-conducting modules 30 are respectively arranged on the two contact surfaces 12 of the cold plate 10. On the one hand, the two heat dissipation surfaces 210 of the plug-in module 200 are respectively in contact with the corresponding heat-conducting modules 30, thereby enhancing the heat dissipation effect of the plug-in module 200. On the other hand, when the plug-in module 200 is inserted into the channel 11, the plug-in module 200 is balanced in the width direction of the hard disk module 2, thereby achieving accurate alignment of the plug-in module 200 and the connector 104. In other embodiments, one of the contact surfaces 12 of the cold plate 10 is provided with a heat-conducting module 30, thereby making the overall structure of the heat dissipation assembly 100 more compact and saving production costs. The heat dissipation assembly 100 can be understood as a connecting body of the cold plate 10 and the heat-conducting module 30, which can provide heat dissipation, heat conduction, assembly, support, and the like for the plug-in module 200. Specifically, the two heat-conducting modules 30 are combined with the cold plate 10 into an integrated cold plate module 110, thereby simplifying the assembly efficiency of the cold plate module 110 and facilitating replacement and maintenance of the plug-in module 200.

[0061] The thermal interface material layer 40 has elasticity, so that the contact between the thermal interface material layer 40 and the cold plate 10 and the heat-conducting member 50 is flexible contact, so as to better realize the fitting degree of the thermal interface material layer 40 and the cold plate 10 and the heat-conducting member 50, thereby accelerating the heat transfer between the plug-in module 200 and the heat dissipation assembly 100 and enhancing the heat conduction performance of the heat dissipation assembly 100. In the embodiment, the thermal interface material layer 40 includes a plurality of heat-conducting blocks 41 arranged at intervals, thereby better helping the restoring member 60 to drive the thermal interface material layer 40 to generate recovery deformation and ensuring the reliability of the contact between the cold plate 10 and the plug-in module 200. The plurality of heat-conducting blocks 41 are arranged in an array on the cold plate 10, thereby being conducive to uniform heat dissipation, preventing heat dissipation concentration, and improving the heat dissipation effect. In the embodiment, the plurality of heat-conducting blocks 41 are arranged in multiple rows and multiple columns at intervals. In some embodiments, the thermal interface material layer 40 includes a plurality of heat-conducting strips arranged at intervals, and the plurality of heat-conducting strips are arranged in the length direction or the width direction of the cold plate 10, thereby simplifying the assembly efficiency of the heat-conducting member 50. In other embodiments, the plurality of heat-conducting strips can also be arranged at other included angles with the length direction or the width direction of the heat dissipation assembly 100. It should be noted that the number and arrangement of the heat-conducting blocks 41 or the heat-conducting strips of the thermal interface material layer 40 can be set according to the size of the cold plate 10 and / or the distribution of the heat generation area of the hard disk, for example, the thermal interface material layer 40 can be regularly or randomly arranged on the cold plate 10, and the embodiments of the present application do not make specific limitations thereto.

[0062] The thermal interface material layer 40 is arranged on the cold plate 10 to conduct heat in a direction perpendicular to the plane on which the heat conduction module 30 is arranged, which can effectively reduce the interface contact thermal resistance, has good heat conduction efficiency, and increases the heat dissipation speed. The thermal interface material layer 40 includes but is not limited to at least one of a heat-conducting silicone grease, a heat-conducting silica gel, and a thermal interface material layer 40 sheet. The heat-conducting silicone grease is a paste-like heat-conducting medium, which is a heat-conducting organic silicone compound. The heat-conducting material includes but is not limited to at least one of aluminum oxide, aluminum powder, and silver powder. It should be noted that the heat-conducting silicone grease can also be described as a non-Newtonian, thixotropic, or pseudoplastic liquid or semi-solid matrix or cream or paste. In addition, a single paste composition can be used or a combination of two or more paste compositions with different release curves and / or containing different active substances can be used. The heat-conducting silica gel is a gel-like heat-conducting medium, which is a gel-like heat-conducting material prepared by stirring, mixing, and packaging silica gel composite heat-conducting filler. The heat-conducting pad is prepared by using an organic silicon system or a non-organic silicon system as a base, auxiliary heat-conducting fillers, and various functional additives such as flame retardants, so as to have good heat conductivity and compression resilience, and is mainly applied to the interface heat dissipation, shock absorption, and buffering of heat-generating components.

[0063] Please refer to Figure 2 、 Figure 5 and Figure 6 , Figure 6 are Figure 5 are enlarged views of the A part of the cold plate module 110 of the heat dissipation assembly 100 in

[0064] In some embodiments, the flange 511 can be omitted, i.e., the base plate 51 is provided with a mounting structure for mounting the cold plate 10, for example, the base plate 51 is provided with a clamping portion, and the cold plate 10 is provided with a clamping groove for fixing the clamping portion. The fixed connection mode of the heat conduction member 50 and the cold plate 10 can be designed according to the actual situation, and the present application does not make specific limitation.

[0065] The base plate 51 and the cold plate 10 jointly form a containing space 510. The containing space 510 at least includes a mounting groove to increase the space of the containing space 510. Exemplarily, in the present embodiment, the thermal interface material layer 40 and the reset member 60 are both accommodated in the containing space 510. The base plate 51 is provided with a window 520, and the base plate 51 is provided with an elastic pressing portion 52 at one end of the window 520. The pressing portion 52 is located on the side of the thermal interface material layer 40 away from the cold plate 10. The pressing portion 52 is used for conducting the heat generated by the plug-in module 200 to the cold plate 10 through the thermal interface material layer 40, thereby meeting the requirement of multiple insertion and extraction of the plug-in module 200, improving the heat dissipation efficiency, and being low in cost. In the present embodiment, the base plate 51 and the pressing portion 52 are integrally formed, thereby improving the connection strength of the pressing portion 52 and the base plate 51 and improving the assembly efficiency. In some embodiments, the pressing portion 52 and the base plate 51 are independently provided, and the pressing portion 52 and the base plate 51 are connected together by a locking structure, adhesion, welding, clamping or the like. In some embodiments, the thermal interface material layer 40 is accommodated in the containing space 510, and the reset member 60 is located outside the containing space 510, for example, the reset member 60 can be arranged in the window 520 to realize the extrusion of the thermal interface material layer 40.

[0066] Please refer again to Figure 5 and Figure 6In the embodiment, the pressing part 52 protrudes outward relative to the base plate 51 away from the thermal interface material layer 40, thereby reducing the friction between the base plate 51 and the plug-in module, facilitating the plug-in. The pressing part 52 includes oppositely arranged root end 521 and free end 522, the root end 521 of the pressing part 52 is connected with the base plate 51, and the free end 522 of the pressing part 52 is movable in and out of the window 520, thereby better realizing the pressing of the thermal interface material layer 40 by the pressing part 52. In the embodiment, the free end 522 of the pressing part 52 is located at the rear side of the window 520 in the length direction of the heat dissipation assembly 100, and the root end 521 of the pressing part 52 is located at the front side of the window 520 in the length direction of the heat dissipation assembly 100. Wherein, the length direction of the heat dissipation assembly 100 is the direction parallel to the plug-in direction of the plug-in module, thereby avoiding the problem that the free end 522 is warped when the root end 521 of the pressing part 52 is stressed first in the plug-in process of the plug-in module, and further solving the phenomenon that the contact area between the pressing part 52 and the thermal interface material layer 40 is reduced due to the uneven stress on the root end 521 and the free end 522 of the pressing part 52. In some embodiments, the free end 522 of the pressing part 52 can also be located at the rear side of the window 520 in the length direction of the heat dissipation assembly 100, and the root end 521 of the pressing part 52 can also be located at the front side of the window 520 in the length direction of the heat dissipation assembly 100, in which embodiment, the root end 521 of the pressing part 52 can be provided with a stressed part, which is deformed when the root end 521 of the pressing part 52 is stressed first, thereby avoiding the problem that the free end 522 is warped.

[0067] Please refer to Figures 7 to 9 , Figure 7 is Figure 4 the assembly view of the cold plate module 110 of the heat dissipation assembly 100 in Figure 8 is Figure 7 the sectional view of the cold plate module 110 of the heat dissipation assembly 100 in Figure 9 is Figure 8Figure 6 is an enlarged view of the B part of the cold plate module 110 of the heat dissipation assembly 100 in Figure 5. In the embodiment, the pressing part 52 comprises a main section 523 and a guide section 524. An end of the main section 523 away from the guide section 524 is a root end 521 of the pressing part 52, and an end of the guide section 524 away from the main section 523 is a free end 522 of the pressing part 52. One end of the main section 523 is connected to the base plate 51, and the other end of the main section 523 is connected to the guide section 524. The main section 523 is arranged to be inclined to the side away from the thermal interface material layer 40 relative to the base plate 51. On one hand, the pressing part 52 can absorb the tolerance and increase the contact area between the heat conduction member 50, the plug-in module 200 and the thermal interface material layer 40, thereby improving the heat dissipation efficiency. On the other hand, when the plug-in module 200 is inserted into the channel 11, the free end 522 of the pressing part 52 is first stressed to approach the thermal interface material layer 40, and the root end 521 of the pressing part 52 is driven to tightly adhere to the heat dissipation surface 210 of the plug-in module 200, thereby better realizing the interference fit between the contact surface 12 of the plug-in module 200 and the pressing part 52, and ensuring the stability and reliability of heat transmission. The distance between the end of the main section 523 close to the base plate 51 and the base plate 51 is greater than the distance between the end of the main section 523 away from the base plate 51 and the base plate 51, so that the plug-in module 200 can gradually press the heat conduction member 50 during the insertion process, thereby reserving space for the thermal interface material layer 40 to spread due to external force, avoiding the phenomenon of the thermal interface material layer 40 overflowing out of the window 520 or abnormal stress.

[0068] In some embodiments, the pressing part 52 can only comprise the main section 523, i.e., the guide section 524 can be omitted. Alternatively, in this embodiment, the root end 521 of the pressing part 52 is located on the front side of the window 520 in the length direction of the heat dissipation assembly 100, and the free end 522 of the pressing part 52 is located on the rear side of the window 520 in the length direction of the heat dissipation assembly 100, thereby avoiding interference between the plug-in module 200 and the pressing part 52 during the insertion process, and thereby improving the assembly efficiency of the plug-in module 200. In other embodiments, when the root end 521 of the pressing part 52 is located on the front side of the window 520 in the length direction of the heat dissipation assembly 100, a stressed part is arranged close to the root end 521 of the pressing part 52, thereby avoiding the problem of the free end 522 being warped during the insertion process of the plug-in module 200.

[0069] Optionally, the guide section 524 is arranged to be inclined towards the TIM layer 40 relative to the main body section 523, and the inclination direction of the guide section 524 is opposite to that of the main body section 523. In this way, on the one hand, the guide section 524 plays a guiding role on the plug-in module 200, reduces the scratching of the pressing part 52 on the plug-in module 200, and reduces the plug-in friction, thereby improving the plug-in smoothness; on the other hand, the guide section 524 can limit the diffusion of the TIM layer 40 along the length direction of the heat dissipation assembly 100 to some extent, and guide the diffusion of the TIM layer 40 along the height direction of the heat dissipation assembly 100, so as to realize that the TIM layer 40 drives the reset member 60 to deform after being pressed, thereby ensuring that the reset member 60 can drive the TIM layer 40 to recover the deformation after the pressure of the TIM layer 40 is released. In some embodiments, the guide section 524 can also be arranged to be a curled structure bent towards the side of the main body section 523 close to the TIM layer 40.

[0070] Optionally, the pressing part 52 covers the TIM layer 40, thereby increasing the contact area between the pressing part 52 and the TIM layer 40, and improving the heat conduction efficiency. In the embodiment, the pressing part 52 can be configured as a heat conduction sheet, so as to realize that the heat conduction sheet elastically abuts against the plug-in module 200, reduces the plug-in friction, and increases the contact area between the pressing part 52 and the plug-in module 200 and the TIM layer 40, thereby improving the heat dissipation efficiency. In other embodiments, the pressing part 52 can also be configured as a heat conduction film. The heat conduction member 50 includes but is not limited to at least one of a metal sheet, a graphite film and a graphene film. In the embodiment, the heat conduction member 50 is a metal sheet. The metal sheet includes but is not limited to an indium sheet, a copper sheet, an aluminum sheet, an aluminum alloy sheet, a magnesium alloy sheet or a stainless steel sheet, etc. It should be noted that the material of the heat conduction member 50 can be selected according to actual needs, and the embodiments of the present application do not make specific limitation thereon.

[0071] Please refer to Figure 5 and Figure 10 , Figure 10 is Figure 5An enlarged view of the reset member 60 of the cold plate module 110 of the heat dissipation assembly 100 in FIG. 1. In the embodiment, the reset member 60 is fixed on the base plate 51, thereby improving the assembly efficiency of the reset member 60. The reset member 60 is detachably fixed on the base plate 51, thereby facilitating the replacement and maintenance of the base plate 51 and the reset member 60. In some embodiments, the base plate 51 is provided with a through hole 501 for a locking member to pass through, and the reset member 60 is provided with an alignment hole 601 corresponding to the through hole 501. The locking member is sequentially threaded through the through hole 501 of the base plate 51 and the alignment hole 601 of the reset member 60 and is screwed with a nut, thereby achieving the fixed connection of the reset member 60 and the base plate 51. In some embodiments, the through hole 501 and / or the alignment hole 601 are configured as locking holes matched with the locking member. In other embodiments, the reset member 60 can also be fixed on the base plate 51 and / or the cold plate 10 by welding, bonding or external mounting structure, etc. The fixing mode of the reset member 60 can be designed according to actual needs, and the embodiments of the present application do not make specific limitations thereto.

[0072] The reset member 60 includes an elastic part 61 and a fixed part 62. The elastic part 61 is fixed on the base plate 51 through the fixed part 62. The elastic part 61 and the cold plate 10 form a space-variable limiting space 603 therebetween, and the thermal interface material layer 40 is located in the limiting space 603, so as to realize that the thermal interface material layer 40 drives the reset member 60 to deform after being pressed, and the reset member 60 can drive the thermal interface material layer 40 to recover the deformation after the thermal interface material layer 40 releases the pressure, i.e. the reset member 60 can provide the elastic force of recovering the deformation for the thermal interface material layer 40 in the height direction of the heat dissipation assembly 100 (i.e. the width direction of the cold plate 10), so that the heat conducting member 50 can tightly abut against the plug-in module 200 and the thermal interface material layer 40 to form a stable interference fit, thereby ensuring that the plug-in module 200 can have good contact with the heat conducting module 30 after being inserted into the channel 11 each time, improving the heat conduction efficiency and enhancing the heat dissipation effect. The fixed part 62 extends outward from the side of the elastic part 61 away from the limiting space 603, i.e. the fixed part 62 is located outside the limiting space 603, thereby avoiding that the fixed part 62 interferes with the deformation of the thermal interface material layer 40 or damages the structure of the thermal interface material layer 40 during the deformation process of the thermal interface material layer 40.

[0073] Please refer to Figures 11 to 12 , Figure 11 is Figure 4 a partial exploded view of the cold plate module 110 of the heat dissipation assembly 100 in FIG. 1. Figure 12 is Figure 11An enlarged view of the C part of the cold plate module 110 of the heat dissipation assembly 100 in FIG. 6. In the embodiment, a gap 604 is formed between at least part of the circumferential side of the reset member 60 and the circumferential side 410 of the thermal interface material layer 40, i.e., the thermal interface material layer 40 does not fill the entire limiting space 603. Specifically, the elastic part 61 includes a deformation segment 611 and a connecting segment 612 connected to the deformation segment 611. The connecting segment 612 is connected to the fixed part 62 and is bent relative to the deformation segment 611. The deformation segment 611 abuts against the thermal interface material layer 40, so that the thermal interface material layer 40 deforms to cause the deformation segment 611 to deform. After the thermal interface material layer 40 releases the pressure, the deformation segment 611 can drive the thermal interface material layer 40 to produce a recovery deformation in the height direction of the heat dissipation assembly 100, thereby ensuring that the plug-in module 200 can have good contact with the heat conduction module 30 after being inserted into the channel 11 each time, improving the heat conduction efficiency and enhancing the heat dissipation effect. The connecting segment 612 is spaced apart from the thermal interface material layer 40, so that when the thermal interface material layer 40 is subjected to external force, the gap 604 between the connecting segment 612 and the thermal interface material layer 40 provides space for the thermal interface material layer 40 to spread due to external force, avoiding the thermal interface material layer 40 from overflowing the limiting space 603 under pressure, and avoiding the abnormal stress of the connecting segment 612 from causing abnormal problems in the fixed connection between the fixed part 62 of the reset member 60 and the base plate 51, thereby ensuring that the deformation segment 611 can provide elastic force for the thermal interface material layer 40 to recover the deformation in the height direction of the heat dissipation assembly 100.

[0074] In some other embodiments, the circumferential side of the reset member 60 is attached to the circumferential side 410 of the thermal interface material layer 40, i.e., the thermal interface material layer 40 can also fill the entire limiting space 603, thereby simplifying the assembly efficiency of the thermal interface material layer 40 and the reset member 60. Alternatively, the anti-deformation ability of the connecting segment 612 is greater than that of the deformation segment 611, thereby avoiding the abnormal stress of the connecting segment 612 from causing abnormal problems in the fixed connection between the fixed part 62 of the reset member 60 and the base plate 51, and ensuring that the deformation segment 611 can provide elastic force for the thermal interface material layer 40 to recover the deformation in the height direction of the heat dissipation assembly 100. The anti-deformation ability of the connecting segment 612 and the deformation segment 611 can be adjusted according to factors such as thickness and material, for example, the thickness of the connecting segment 612 is greater than that of the deformation segment 611.

[0075] In the embodiment, the reset member 60 is configured as a substantially rectangular frame. In some embodiments, the reset member 60 can also be configured as, but not limited to, other shaped frames, such as a six-variant frame, an octagonal frame, etc. The shape of the reset member 60 can be designed according to the shape, size or actual needs of the thermal interface material layer 40, and the embodiments of the present application do not make specific limitations thereon. The length of the connecting segment 612 is less than the length of the deformation segment 611, so as to ensure that the deformation capacity of the deformation segment 611 can drive the thermal interface material layer 40 to provide recovery deformation in the height direction of the heat dissipation assembly 100. Optionally, the reset member 60 is configured as a semi-open frame, so as to avoid the phenomenon that the reset member 60 extrudes or damages the thermal interface material layer 40 during assembly, and improve the assembly efficiency of the reset member 60 and the thermal interface material layer 40. Specifically, the reset member 60 is provided with an opening 605 at the connecting segment 612, so that the two end portions of the reset member 60 can be opened to each other under external force, facilitate the reset member 60 to be sleeved outside the thermal interface material layer 40, and be in a tension state after the external force is removed, facilitating assembly.

[0076] Optionally, the height of the thermal interface material layer 40 is greater than the height of the reset member 60, so as to ensure that the thermal interface material can reach a height greater than or equal to the height of the reset member 60 after recovery deformation in the height direction of the heat dissipation assembly 100, and then realize that the plug-in module 200 can have good contact with the heat conduction module 30 after being inserted into the channel 11 each time, improve the heat conduction efficiency, and enhance the heat dissipation effect. In some embodiments, the height of the thermal interface material layer 40 can also be equal to the height of the reset member 60.

[0077] In the embodiment, the deformation segment 611 is configured as an arc-shaped structure formed by the elastic portion 61 being concave in the length direction of the heat dissipation assembly 100. The reset member 60 is concave in the middle portion in the length direction of the heat dissipation assembly 100. In other embodiments, the deformation segment 611 is configured as a planar structure extending along the length direction of the heat dissipation assembly 100; or the deformation segment 611 is a wave-shaped structure extending in the length direction of the heat dissipation assembly 100. In the embodiment, the elastic portion 61 can be configured as a metal elastic piece, such as, but not limited to, a stainless steel elastic piece, a copper piece, an aluminum piece, etc. In other embodiments, the elastic portion 61 can also be configured as a non-metal elastic piece, such as, but not limited to, a rubber elastic piece.

[0078] Please refer again to Figure 3 and Figure 4The heat dissipation assembly 100 further comprises a heat dissipation pipe 13. The heat dissipation pipe 13 is at least partially embedded in the cold plate 10, thereby increasing the contact area between the heat dissipation pipe 13 and the cold plate 10, improving the heat dissipation effect, and making the overall structure of the heat dissipation assembly 100 more compact. In the embodiment, the cold plate 10 is provided with a receiving groove 14 for accommodating the heat dissipation pipe 13. The heat dissipation pipe 13 is tightly attached to the groove wall of the receiving groove 14 and exposed to the outside of the receiving groove 14, thereby improving the assembly efficiency of the heat dissipation assembly 100. Alternatively, the heat dissipation pipe 13 is a flat pipe, so that the contact surface 12 of the cold plate 10 and the exposed surface of the heat dissipation pipe 13 are coplanar, facilitating the assembly of the heat conduction module 30. It can be understood that, in the embodiment, the exposed surface of the heat dissipation pipe 13 can serve as part of the contact surface 12 of the cold plate 10. In some embodiments, the heat dissipation pipe 13 can also be embedded in the interior of the cold plate 10, thereby ensuring that the cold plate 10 has two contact surfaces 12, further facilitating the assembly of the heat conduction module 30.

[0079] In the embodiment, the heat dissipation pipe 13 can be a liquid cooling pipe, so that the cooling medium loaded in the liquid cooling pipe can absorb the heat of the liquid cooling pipe and flow back to the cooling liquid tank, thereby improving the heat dissipation effect of the heat dissipation assembly 100. In other embodiments, the heat dissipation pipe 13 can also be a heat pipe, so that part of the heat generated by the plug-in module 200 can be conducted to the heat pipe through the heat conduction module 30 and dissipated to the outside air, and another part of the heat generated by the plug-in module 200 can also be conducted to the cold plate 10 through the heat conduction module 30 and dissipated to the outside air. The heat dissipation pipe 13 can be but is not limited to a metal pipe such as a copper pipe or an aluminum pipe or a ceramic pipe.

[0080] The heat dissipation pipe 13 comprises an inlet pipe 131, an outlet pipe 132, a main pipe 133 arranged on the cold plate 10, and a node pipe 134 connecting two adjacent main pipes 133. The plurality of main pipes 133 are connected in series or in parallel through the inlet pipe 131, the outlet pipe 132, and the node pipe 134, thereby improving the heat dissipation efficiency of the heat dissipation assembly 100 and optimizing the pipe design of the liquid cooling pipe. In the embodiment, the inlet pipe 131 and the outlet pipe 132 are arranged at two sides in the width direction of the heat dissipation assembly 100. The structure of the inlet pipe 131 is the same as that of the outlet pipe 132. The node pipe 134 and the main pipe 133 can also be integrally formed, thereby simplifying the assembly efficiency. The main pipe 133 is arranged in a meandering manner in the height direction of the hard disk module 2, thereby increasing the heat dissipation area, facilitating the layout of the pipe, and simplifying the structure. In the embodiment, the main pipe 133 has a serpentine shape. In other embodiments, the main pipe 133 can also have a C shape, an S shape, a Z shape, etc., and the embodiments of the present application do not make specific limitations in this regard.

[0081] The node pipe 134 and the main pipe 133, the main pipe 133 and the liquid inlet pipe 131, and the main pipe 133 and the liquid outlet pipe 132 can be fixedly connected together by screwing, so as to facilitate assembly and maintenance. In other embodiments, the node pipe 134 and the main pipe 133, the main pipe 133 and the liquid inlet pipe 131, and the main pipe 133 and the liquid outlet pipe 132 can also be fixedly connected together by clamping, bonding, welding or the like. It should be noted that the connection mode between the liquid inlet pipe 131, the liquid outlet pipe 132, the main pipe 133 and the node pipe 134 can be selected according to actual needs, and the embodiments of the present application do not make specific limitations thereon.

[0082] The fixing frame 120 extends along the width direction of the hard disk module 2. The liquid inlet pipe 131, the liquid outlet pipe 132 and the node pipe 134 are fixed to the fixing frame 120. The node pipe 134 and the connector 104 for electrically connecting with the plug-in module 200 are staggered and spaced apart in the width direction of the hard disk module 2, so as to realize the compactness and miniaturization of the heat dissipation assembly 100. In the present embodiment, the node pipe 134 and the connector 104 for electrically connecting with the plug-in module 200 are one-to-one corresponding in the length direction of the hard disk module 2. Specifically, the fixing frame 120 is provided with a clearance hole 121 for the connector 104 to pass through and an opening 122 for the node pipe 134 to pass through. The clearance hole 121 and the opening 122 are spaced apart. The two ends of each node pipe 134 span the clearance hole 121 on both sides of the width direction of the hard disk module 2. The node pipe 134 includes a first pipe body 1341 and a second pipe body 1342. The first pipe body 1341 and the second pipe body 1342 are alternately and spaced apart in the height direction of the hard disk module 2. Optionally, in the present embodiment, the length of the first pipe body 1341 is greater than the length of the second pipe body 1342, so as to realize the clearance of the first pipe body 1341 and the connector 104, save the production cost of the first pipe body 1341, and realize the compactness and miniaturization of the heat dissipation assembly 100. In other embodiments, the lengths of the first pipe body 1341 and the second pipe body 1342 are the same, so as to improve the assembly efficiency and simplify the production process.

[0083] In the present embodiment, one end of the main pipe 133 is connected with the first pipe body 1341, and the other end is connected with the second pipe body 1342, so as to realize the series connection of the main pipe 133 and the node pipe 134. Optionally, the liquid inlet end and the liquid outlet end of the main pipe 133 are located on both sides of the height direction of the cold plate 10 in the hard disk module 2, so as to avoid interference between the connector 104 and the node pipe 134 in the assembly process, improve the assembly efficiency, and realize the compact structure.

[0084] Those skilled in the art can clearly understand the specific working process of the system, the device and the unit described above for the convenience and brevity of description, which can refer to the corresponding process in the foregoing method embodiments, and will not be repeated here. In the foregoing embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be seen in the related description of other embodiments.

[0085] It should be noted that, for the foregoing method embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the action sequence described, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0086] In several embodiments provided in the present application, it should be understood that the disclosed system and device can be implemented in other ways. For example, the device embodiments described above are only schematic.

[0087] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation assembly and a plug-in module. The heat dissipation assembly comprises a plurality of cold plates, a channel is formed between two adjacent cold plates for inserting a plug-in module, the cold plates comprise two contact surfaces for contacting the plug-in module; A heat conduction module is arranged on at least one of the contact surfaces, and the heat conduction module is used for transferring heat generated by the plug-in module to the cold plate; The heat conduction module comprises a thermal interface material layer, a heat conduction piece and a reset piece, the thermal interface material layer is attached to the contact surface; the heat conduction piece is located on the side of the thermal interface material layer away from the cold plate, and the heat conduction piece is used for elastically abutting the thermal interface material layer and the plug-in module; the reset piece surrounds the periphery of the thermal interface material layer and abuts the thermal interface material layer, the thermal interface material layer is used for deforming after being pressed, the heat conduction piece comprises a base plate fixed to the cold plate, the base plate and the cold plate jointly form a containing space for containing the thermal interface material layer, the base plate is provided with a window, and the base plate is provided with an elastic pressing part at one end of the window, the pressing part is used for conducting heat generated by the plug-in module to the cold plate through the thermal interface material layer, the reset piece comprises an elastic part and a fixed part, the elastic part is fixed to the base plate through the fixed part, a space-variable limiting space is formed between the elastic part and the cold plate, and the thermal interface material layer is located in the limiting space.

2. The heat dissipating assembly of claim 1, wherein, The pressing part comprises a main body segment connected with the base plate, and the main body segment is obliquely arranged on the side of the base plate away from the thermal interface material layer.

3. The heat dissipating assembly of claim 2, wherein, The pressing part further comprises a guide segment connected to the end of the main body segment away from the base plate, the guide segment is obliquely arranged on the side of the main body segment towards the thermal interface material layer, and the oblique direction of the guide segment is opposite to that of the main body segment.

4. The heat dissipating assembly of claim 1, wherein, The pressing part is configured as a heat conduction sheet or a heat conduction film.

5. The heat dissipating assembly of claim 1, wherein, The elastic part comprises a deformation segment and a connecting segment connected with the deformation segment, the connecting segment is connected with the fixed part and is arranged to be bent relative to the deformation segment, and the deformation segment abuts the thermal interface material layer.

6. The heat dissipating assembly of claim 5, wherein, The connecting segment is arranged to be spaced apart from the thermal interface material layer.

7. The heat dissipating assembly of any of claims 1-6, wherein, The elastic part is configured as a metal elastic sheet or a rubber elastic sheet.

8. The heat dissipating assembly of any one of claims 1-6, wherein, The thermal interface material layer comprises a plurality of heat conduction blocks arranged at intervals, and the plurality of heat conduction blocks are arranged in an array on the cold plate.

9. The heat dissipating assembly of any one of claims 1-6, wherein, The thermal interface material layer comprises a plurality of heat conduction strips arranged at intervals, and the plurality of heat conduction strips are arranged along the length direction or the width direction of the cold plate.

10. The heat dissipating assembly of any one of claims 1-6, wherein, The heat dissipation assembly further comprises a heat dissipation pipe, the heat dissipation pipe comprises an inlet pipe, an outlet pipe, a main pipe arranged on the cold plate and a node pipe connecting two adjacent main pipes, a plurality of main pipes are connected in communication with the inlet pipe, the outlet pipe and the node pipe, and are connected in series or in parallel through the node pipe.

11. An electronic device, comprising: The heat dissipation assembly is used for dissipating heat of the plug-in module; and the plug-in module comprises at least one of a hard disk, a battery module or a power module.

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