Method for processing a ceramic substrate and ceramic substrate

Abstract

A ceramic substrate (111) has a ceramic portion (112) containing Al2O3. A processing method of the ceramic substrate (111) includes a laser irradiation step of irradiating a portion of a main surface of the ceramic portion (112) with laser light (LB). In the processing method of the ceramic substrate (111), a colored portion is formed by the laser irradiation step.

Description

Technical Field

[0001] This invention relates to a method for processing a ceramic substrate and the ceramic substrate itself. Background Technology

[0002] In the past, for example, in applications such as ceramic wiring boards, a type of ceramic substrate containing glass is known, as disclosed in Patent Document 1. Furthermore, as disclosed in Patent Document 2, sometimes positioning calibration marks are provided on the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-092541

[0006] Patent Document 2: Japanese Patent Application Publication No. 2006-330192 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] This invention discloses a method for easily forming colored portions on a ceramic substrate. The object of this invention is to provide a method for processing a ceramic substrate and a ceramic substrate on which colored portions can be easily formed.

[0009] Methods for solving problems

[0010] In the ceramic substrate processing method for solving the above-mentioned problems, the ceramic substrate has a ceramic part containing Al2O3, and the ceramic substrate processing method includes an irradiation step: irradiating a portion of the main surface of the ceramic part with a laser; and forming a colored part through the irradiation step.

[0011] In the above-mentioned ceramic substrate processing method, it is also possible to: in the above-mentioned irradiation process, a portion of the above-mentioned main surface is colored according to Al, thereby forming the above-mentioned colored portion.

[0012] In the above-described ceramic substrate processing method, the ceramic portion may further have TiO2; the colored portion may contain Ti generated through the above-described irradiation process. 3＋ .

[0013] In the above-mentioned ceramic substrate processing method, the above-mentioned ceramic part may also be a glass ceramic containing glass; the composition of the above-mentioned glass ceramic is as follows: glass: 20-70%, Al2O3: 10-60%, and Zn2SiO4: 20-70% by mass%.

[0014] In the above-mentioned ceramic substrate processing method, the above-mentioned ceramic part may also be a glass ceramic containing glass; the composition of the above-mentioned glass ceramic is glass: 30-70% and Al2O3: 30-70% by mass%.

[0015] The above-mentioned ceramic substrate processing method may also be as follows: the glass composition contains, by mass %: SiO2: 50-80%, B2O3: 10-30%, Li2O+Na2O+K2O: 1-10%, MgO+CaO+SrO+BaO: 5-30%, and TiO2: 0-10%.

[0016] In the above-mentioned ceramic substrate processing method, the ceramic substrate may further include a calibration mark portion disposed on the ceramic portion; in the above-mentioned irradiation process, the above-mentioned colored portion adjacent to the calibration mark portion is formed by irradiating the ceramic portion adjacent to the calibration mark portion with the laser.

[0017] In the above-mentioned ceramic substrate processing method, the above-mentioned laser may also be a UV laser; and the above-mentioned colored part with concave and convex features may be formed in the above-mentioned irradiation process.

[0018] A ceramic substrate includes: a ceramic portion containing Al2O3, a calibration mark portion disposed on the ceramic portion, and a coloring portion having a different color from the ceramic portion; the coloring portion is formed in a region adjacent to the calibration mark portion.

[0019] In the above-mentioned ceramic substrate, the above-mentioned colored part may also have a color based on Al.

[0020] The ceramic substrate described above may also be a glass-ceramic containing glass; the composition of the glass-ceramic is as follows: glass: 20-70%, Al2O3: 10-60%, and Zn2SiO4: 20-70% by mass%.

[0021] The ceramic substrate described above may also be a glass ceramic containing glass; the composition of the glass ceramic is as follows: glass: 30-70% and Al2O3: 30-70% by mass%.

[0022] The ceramic substrate mentioned above may also be: the glass mentioned above, wherein the glass composition contains, by mass %, SiO2: 50-80%, B2O3: 10-30%, Li2O+Na2O+K2O: 1-10%, MgO+CaO+SrO+BaO: 5-30%, and TiO2: 0-10%.

[0023] In the above-mentioned ceramic substrate, the arithmetic mean roughness Ra of the colored portion may be in the range of 0.5 μm or more and 15 μm or less.

[0024] In the above-mentioned ceramic substrate, the maximum height Sz of the surface roughness of the colored part may be in the range of 5μm or more and 40μm or less.

[0025] In the above-mentioned ceramic substrate, the arithmetic mean roughness Ra of the ceramic portion without the above-mentioned coloring portion is in the range of 5 nm or more and 35 nm or less.

[0026] A ceramic substrate comprising: a ceramic portion containing Al2O3, and a colored portion having a different color from the ceramic portion; the colored portion being colored according to Al.

[0027] Invention Effects

[0028] According to the present invention, colored portions can be easily formed on ceramic substrates. Attached Figure Description

[0029] Figure 1 This is a top view of the ceramic substrate used in the embodiment.

[0030] Figure 2 It is along Figure 1 A cross-sectional view of line 2-2.

[0031] Figure 3 This is a cross-sectional view illustrating the processing method of ceramic substrates.

[0032] Figure 4 It is the ESR spectrum of the ceramic substrate before the irradiation process.

[0033] Figure 5 It is the ESR spectrum of the ceramic substrate after the irradiation process. Detailed Implementation

[0034] The following description, with reference to the accompanying drawings, outlines the processing method and embodiments of the ceramic substrate. For ease of explanation, some components may be exaggerated or simplified in the drawings. Furthermore, the dimensional ratios of the various parts may differ from the actual dimensions. First, the ceramic substrate processed by the ceramic substrate processing method will be described.

[0035] <Ceramic substrate>

[0036] like Figure 1 and Figure 2 As shown, the ceramic substrate 11 includes a ceramic portion 12 containing Al2O3, a calibration mark portion 13 disposed on the ceramic portion 12, and a coloring portion 14 that presents a different color from the ceramic portion 12. The coloring portion 14 is formed in the region adjacent to the calibration mark portion 13.

[0037] <Ceramics Department>

[0038] The ceramic portion 12 of the ceramic substrate 11 is preferably glass-ceramic or ceramic. Glass-ceramic contains both glass and ceramic. Examples of glass-ceramic include low-temperature co-fired ceramics (LTCC).

[0039] The glass preferably contains, by mass percent, SiO2: 50-80%, B2O3: 10-30%, Li2O + Na2O + K2O: 1-10%, MgO + CaO + SrO + BaO: 5-30%, and TiO2: 0-10%, more preferably, by mass percent, SiO2: 60-80%, B2O3: 10-30%, Li2O + Na2O + K2O: 1-5%, MgO + CaO + SrO + BaO: 5-20%, and TiO2: 0.1-3%. The glass composition may also contain, by mass percent, ZrO2 as other oxides: 0.1-3%.

[0040] Examples of ceramics include Zn₂SiO₄ (zirconia), Al₂O₃ (alumina), cordierite, AlN (aluminum nitride), zirconium phosphate compounds, ZrSiO₄ (zircon), ZrO₂ (zirconium oxide), TiO₂ (titanium oxide), SnO₂ (tin oxide), β-quartz solid solution, β-nepheline, and β-spodumene. One or more of these materials may be used in ceramics.

[0041] The glass-ceramic composition preferably contains, by mass %: 20-70% glass, 10-60% Al2O3, and 20-70% Zn2SiO4; more preferably, by mass %: 30-60% glass, 15-45% Al2O3, and 25-55% Zn2SiO4; and most preferably, by mass %: 35-50% glass, 20-35% Al2O3, and 30-45% Zn2SiO4.

[0042] The composition of glass-ceramics can also be a composition that does not contain Zn2SiO4. Preferably, the composition of glass-ceramics contains, by mass %: 30-70% glass and 30-70% Al2O3; more preferably, it contains, by mass %: 40-60% glass and 40-60% Al2O3; and most preferably, it contains, by mass %: 45-55% glass and 45-55% Al2O3.

[0043] The ceramic part 12 can be obtained by a known method, such as forming a circuit pattern using a ceramic green sheet. The main surface of the ceramic part 12 is preferably polished. More preferably, the main surface of the ceramic part 12 is polished to a mirror finish. In this case, when a multilayer film including a plating film and a polyimide film is applied to the ceramic part 12, it is possible to prevent scratches, irregularities, etc., on the ceramic part 12 from being transferred to the multilayer film. If scratches, irregularities, etc., on the ceramic part are transferred to the multilayer film, there is a concern that this could lead to poor appearance of the multilayer film.

[0044] The grinding method for the main surface of the ceramic part 12 can be exemplified by grinding using fixed or free grinding grains. The arithmetic mean roughness Ra of the ceramic part 12 without the formation of the coloring part 14 is preferably in the range of 5 nm or more and 35 nm or less.

[0045] <Calibration Marking Section>

[0046] The calibration mark portion 13 of the ceramic substrate 11 can be formed of, for example, metal. Examples of metal materials used to form the calibration mark portion 13 include Au, Ag, Ni, and Cr. The shape of the calibration mark portion 13 is not particularly limited. Examples of possible shapes include circular, quadrilateral, and cross-shaped. The shape of the calibration mark portion 13 can also be a circular or oval ring, a rectangular frame, etc. The calibration mark portion 13 can also be a combination of multiple shapes. The calibration mark portion 13 can be formed using methods such as plating or printing.

[0047] <Coloring Section>

[0048] The colored portion 14 of the ceramic substrate 11 preferably has an Al-based color. The colored portion 14 will exhibit, for example, an Al-based gray. The colored portion 14 may also contain Ti. 3＋ The arithmetic mean roughness Ra of the colored portion 14 is preferably in the range of 0.5 μm or more and 15 μm or less. The maximum height Sz of the surface roughness of the colored portion 14 is preferably in the range of 5 μm or more and 40 μm or less. The colored portion 14 is formed on the surface of the ceramic portion 12. The thickness of the colored portion 14 is preferably in the range of, for example, 1 μm or more and 15 μm or less.

[0049] <Processing methods for ceramic substrates>

[0050] Next, the processing method for ceramic substrates will be explained.

[0051] like Figure 3 As shown, the ceramic substrate 111 has a ceramic portion 112 containing Al2O3. The processing method of the ceramic substrate 111 includes an irradiation step: irradiating a portion of the main surface of the ceramic portion 112 of the ceramic substrate 111 with laser LB. In the processing method of the ceramic substrate 111, the irradiation step forms... Figure 1 and Figure 2The coloring part 14 is shown.

[0052] During the irradiation process, a portion of the main surface of the ceramic part 112 can also be colored according to Al, thereby forming the colored part 14. In other words, the colored part 14 is formed by modifying a portion of the main surface of the ceramic part 112 using laser LB. The ceramic part 112 may further contain TiO2, and the colored part 14 may also contain Ti generated during the irradiation process. 3＋ The TiO2 contained in the ceramic part 112 may also be present in the composition of ceramics or in the composition of glass.

[0053] In the irradiation process of this embodiment, a colored portion 14 adjacent to the calibration mark portion 13 is formed by irradiating the ceramic portion 112 adjacent to the calibration mark portion 13 with laser LB.

[0054] Laser beam irradiation (LB) processes can include, for example, UV lasers and green lasers. UV lasers are preferred. Examples of UV lasers include YAG lasers and excimer lasers.

[0055] The average output of the laser LB used in the irradiation process is preferably in the range of, for example, 0.5W or more and 15W or less. The frequency of the laser LB is preferably in the range of, for example, 40kHz or more and 300kHz or less. The focusing diameter of the laser LB is preferably in the range of, for example, 5μm or more and 30μm or less.

[0056] There is no particular limitation on the scanning method of the laser LB. Examples of laser LB scanning methods include: scanning the laser LB along a first predetermined scanning line in a straight line, and then scanning the laser LB along a second predetermined scanning line in a straight line extending parallel to the first predetermined scanning line. By repeatedly performing this laser LB scanning, the laser LB can be irradiated within a predetermined area on the surface of the ceramic part 112.

[0057] The spacing between adjacent scan lines, i.e., the pitch width, is preferably in the range of, for example, 10% to 150% of the beam diameter. The scanning speed of the laser LB is preferably in the range of, for example, 25 mm / s to 500 mm / s.

[0058] During the irradiation process, a UV laser, for example, can be used to form the uneven colored portion 14. The uneven colored portion 14 has, for example, the arithmetic mean roughness Ra or the maximum height Sz of the surface roughness, as described in the <Colored Portion> column above.

[0059] <Trial example>

[0060] Next, we will explain the trial example.

[0061] First, prepare ceramic substrate 111 (LTCC substrate: glass-ceramic substrate). The composition of the glass-ceramic substrate is as follows (by mass%): glass: 50%, Al2O3: 25%, and Zn2SiO4: 25%.

[0062] The glass composition is as follows (by mass%): SiO2: 60%, B2O3: 20%, Na2O: 2%, K2O: 2%, MgO: 3%, CaO: 10%, BaO: 1%, TiO2: 1%, ZrO2: 1%.

[0063] The main surface of the ceramic substrate 111 is polished to a mirror finish. The main surface of the ceramic substrate 111 is provided with a calibration mark portion 13 (approximately 500 μm in size). The calibration mark portion 13 is formed by Au plating.

[0064] Next, an irradiation process is performed, in which laser LB is irradiated onto the ceramic portion 112 of the ceramic substrate 111. In the irradiation process of this prototype example, laser LB is irradiated onto... Figure 3 The calibration mark portion 13 is shown to extend both inside and around its outer periphery. In this manner, a colored portion 14 is formed in the area adjacent to the calibration mark portion 13.

[0065] The irradiation conditions for laser LB are as follows.

[0066] Types of laser LB: UV laser, wavelength 355nm

[0067] Average output: 2W

[0068] Frequency: 90kHz

[0069] Light collection diameter: 20μm

[0070] In the irradiation process, the laser LB is scanned along a first predetermined linear scanning line, and then scanned again along a second predetermined linear scanning line that extends parallel to the first predetermined scanning line. This scanning of the laser LB is repeated until the laser LB is irradiated within a predetermined area on the surface of the ceramic part 112. The interval between adjacent predetermined scanning lines, i.e., the spacing width, is set to 10 μm. The scanning speed of the laser LB is set to 100 mm / s.

[0071] <Microscopic observation results of the sample>

[0072] The surfaces of the calibration mark portion 13, ceramic portion 12, and colored portion 14 of the sample obtained in the above-described prototype were observed using a microscope under white incident light. The calibration mark portion 13 is nearly white. The ceramic portion 12 is gray. In contrast, the colored portion 14 is black.

[0073] The results show that the calibration mark 13 is easier to identify when it is adjacent to the colored portion 14 than when it is adjacent to the ceramic portion 12. In other words, the recognizability of the calibration mark 13 can be improved by forming the colored portion 14 in the area adjacent to the calibration mark 13.

[0074] <Analysis of the Colored Part Based on Electron Spin Resonance (ESR)>

[0075] First, ESR measurements were performed on the main surface of the ceramic portion 112 of the ceramic substrate 111 before the irradiation process used in the above-described prototype at a measurement temperature of 50K, and the ESR spectrum was obtained. The results are shown below. Figure 4 .

[0076] Next, ESR measurements were performed on the main surface of the colored portion 14 of the ceramic substrate 11 after the irradiation process obtained in the above-described prototype at a measurement temperature of 50 K, and the ESR spectrum was obtained. The results are shown in... Figure 5 .

[0077] Figure 4 and Figure 5 The symbol "◆" indicates the presence of 6 lines centered at g = 2.002 (split interval: approximately 82G, Mn). 2＋ ( ) part. Figure 5 In the ESR spectrum shown, multiple signals based on holes appear in region A1 (denoted by the dashed line) (g = 2.050, 2.010, 2.002). Furthermore, Figure 5 In the ESR spectrum shown, within region A2 (represented by the dashed line), there are six lines centered at g = 2.018. Therefore, it can be concluded that... Figure 5 The ESR spectrum shown shows Figure 4 The signal centered at g = 2.018, which is absent in the ESR spectrum shown, is a signal. This signal centered at g = 2.018 is presumed to be a resonance signal generated based on Al, specifically... 27 The signal generated by the nuclear rotation possessed by Al.

[0078] This result shows that the coloring of the colored portion 14 in the ceramic substrate 11 after the irradiation process is generated based on the Al contained in the ceramic portion 112 of the ceramic substrate 111 before the irradiation process. The coloring of this colored portion 14 is generated based on a change in the structure containing Al. Furthermore, the signal observed in the colored portion 14 centered at g = 2.018 is a signal at a position larger than the g = 2.0023 possessed by free electrons. It can be deduced that the signal observed in the colored portion 14 centered at g = 2.018 is a signal caused by holes possessed by Al. Therefore, in order to form the colored portion 14 through the irradiation process, the ceramic substrate 111 before the irradiation process needs to contain an Al source, specifically Al₂O₃.

[0079] Figure 5 In the ESR spectrum shown, signal S is the resonance signal at g = 1.946, which is caused by Ti. The peak of the resonance signal at g = 1.946 is considered to be due to lattice defects caused by oxygen deficiency. From this result, it can be seen that Ti... 3＋ There is also coloring applied to the coloring part 14.

[0080] The observation results of the colored part 14 of the ESR spectrum are summarized in Table 1.

[0081] [Table 1]

[0082]

[0083] <Surface Condition Measurement>

[0084] The arithmetic mean roughness Ra and the maximum height Sz of the ceramic part 112 of the ceramic substrate 111 before the irradiation process were measured using a surface roughness measuring machine (manufactured by TOKYO SEIMITSU Corporation, trade name: SURFCOM 1400D) and a laser microscope (Olympus Corporation, trade name: OLS5000).

[0085] The arithmetic mean roughness Ra and the maximum height Sz of the surface roughness of the colored portion 14 of the ceramic substrate 11 after the irradiation process were also measured in the same manner as described above. The results are shown in Table 2.

[0086] [Table 2]

[0087]

[0088] Here, when the calibration mark portion 13 is formed by, for example, plating, the surface of the calibration mark portion 13 will have a relatively smooth surface. By making such a calibration mark portion 13 adjacent to the colored portion 14, whose Ra and Sz values ​​are greater than those of the ceramic portion 112, the recognizability of the calibration mark portion 13 can be improved.

[0089] Next, the function and effects of this embodiment will be explained.

[0090] (1) A method for processing a ceramic substrate 111 having an Al2O3-containing ceramic portion 112 includes an irradiation step: irradiating a portion of the main surface of the ceramic portion 112 with a laser LB. In the method for processing the ceramic substrate 111, a colored portion 14 is formed by the irradiation step. By this method, the colored portion 14 can be easily formed using the Al2O3-containing ceramic portion 112 by means of the irradiation step of the laser LB. In this way, for example, identification information using the colored portion 14 can be easily imparted to the ceramic substrate 111.

[0091] (2) In the processing method of ceramic substrate 111, the ceramic part 112 may further contain TiO2, and the coloring part 14 may also contain Ti generated in the irradiation process. 3＋ At this point, the hue of the shading part 14 can be changed.

[0092] (3) In the method for processing the ceramic substrate 111, the ceramic substrate 111 further includes a calibration mark portion 13 provided on the ceramic portion 112. In the above-described irradiation process, by irradiating the ceramic portion 112 adjacent to the calibration mark portion 13 with laser LB, a colored portion 14 adjacent to the calibration mark portion 13 is formed. At this time, even if, for example, the recognizability of the calibration mark portion 13 adjacent to the ceramic portion 112 is low, the recognizability of the calibration mark portion 13 can still be easily improved by forming the colored portion 14 adjacent to the calibration mark portion 13.

[0093] For example, when the main surface of the ceramic part 112 is a polished mirror finish and the calibration mark part 13 is formed by metal plating, both the main surfaces of the ceramic part 112 and the calibration mark part 13 are prone to reflection. As a result, the legibility of the calibration mark part 13 relative to the ceramic part 112 is particularly easily reduced. In this case, the coloring part 14 is particularly helpful from the viewpoint of improving the legibility of the calibration mark part 13.

[0094] (4) The laser LB used in the irradiation process is a UV laser, and a colored portion 14 with unevenness can also be formed in the irradiation process. At this time, the hue of the colored portion 14 can be changed by, for example, the scattering of light produced by the unevenness of the colored portion 14.

[0095] (5) The ceramic substrate 11 can be used, for example, as a ceramic wiring substrate, particularly as a substrate for semiconductor inspection devices such as probe cards. In addition, the ceramic substrate 11 can also be used as a mother substrate for packaging articles in which multiple packaged electronic components are manufactured at the same time, that is, a mother substrate for dividing into multiple pieces. Since these applications require high-precision positioning, improving the recognizability of the calibration mark section 13, for example as described above, is particularly effective.

[0096] <Example of Change>

[0097] The above-described embodiments can also be modified as follows. The above-described embodiments and the following modifications can be combined and implemented with each other within the scope of technical inconsistency.

[0098] The processing method of the ceramic substrate 111 described above can also be modified to a processing method in which the coloring portion 14 is formed at a position not adjacent to the calibration mark portion 13. Furthermore, the processing method of the ceramic substrate 111 described above can also be modified to a processing method in which the coloring portion 14 is formed on a ceramic substrate that does not have the calibration mark portion 13. In this case, the coloring portion 14 can be configured as a display portion for displaying identification information such as text, numbers, or symbols. In other words, the processing method of the ceramic substrate 111 allows for easy application of identification information formed by the coloring portion 14 to the ceramic substrate 111. The ceramic substrate 11 obtained in this manner has a ceramic portion 12 containing Al2O3 and a coloring portion 14 exhibiting a different color from the ceramic portion 12, the coloring portion 14 being colored according to Al.

[0099] The calibration mark portion 13 of the ceramic substrate 111 may be provided at one location of the ceramic portion 112 or at multiple locations of the ceramic portion 112. When the calibration mark portion 13 is provided at multiple locations of the ceramic portion 112, the color portion 14 of the ceramic substrate 11 may be formed in a region adjacent to at least one of the multiple calibration mark portions 13.

[0100] Explanation of reference numerals in the attached figures

[0101] 11. Ceramic substrate (after irradiation process)

[0102] 12. Ceramic section (after irradiation process)

[0103] 13 Calibration Marking Section

[0104] 14 Coloring Section

[0105] 111 Ceramic Substrate (Before Irradiation Process)

[0106] 112 Ceramic Section (Before Irradiation Process)

[0107] LB Laser

Claims

1. A method for processing a ceramic substrate, the ceramic substrate having a ceramic portion containing Al2O3, wherein, The processing method for the ceramic substrate includes an irradiation step: irradiating a portion of the main surface of the ceramic part with a laser, and grinding the main surface of the ceramic part to achieve a mirror finish. Through the irradiation process, a colored portion is formed based on the structural changes in the Al contained in the ceramic portion. The ceramic part is a glass-ceramic containing glass. The glass-ceramic composition is as follows (by mass%): glass: 20-70%, Al2O3: 10-60%, and Zn2SiO4: 20-70%.

2. A method for processing a ceramic substrate, the ceramic substrate having a ceramic portion containing Al2O3, wherein, The processing method for the ceramic substrate includes an irradiation step: irradiating a portion of the main surface of the ceramic part with a laser, and grinding the main surface of the ceramic part to achieve a mirror finish. Through the irradiation process, a colored portion is formed based on the structural changes in the Al contained in the ceramic portion. The ceramic part is a glass-ceramic containing glass. The glass-ceramic composition is as follows: glass: 30-70% and Al2O3: 30-70% by mass%.

3. The method for processing a ceramic substrate as described in claim 1 or claim 2, wherein, The ceramic part further contains TiO2. The colored portion contains Ti generated through the irradiation process. 3＋ .

4. The method for processing a ceramic substrate as described in claim 1 or claim 2, wherein, The glass composition comprises, by mass%, SiO2: 50-80%, B2O3: 10-30%, Li2O + Na2O + K2O: 1-10%, MgO + CaO + SrO + BaO: 5-30%, and TiO2: 0-10%.

5. The method for processing a ceramic substrate as described in claim 1 or claim 2, wherein, The ceramic substrate further includes a calibration mark portion disposed on the ceramic portion. In the irradiation process, the colored portion adjacent to the calibration mark portion is formed by irradiating the ceramic portion with the laser.

6. The method for processing a ceramic substrate as described in claim 1 or claim 2, wherein, The laser is a UV laser. The colored portion with an uneven surface is formed during the irradiation process.

7. A ceramic substrate comprising: The main surface is a mirror-finished ceramic part containing Al2O3. The calibration mark portion provided in the ceramic part, and A colored portion, exhibiting a different color from the ceramic portion, is formed based on variations in the structure of the Al contained in the ceramic portion. The colored portion is formed in the region adjacent to the calibration mark portion. The ceramic part is a glass-ceramic material containing glass. The glass-ceramic composition is as follows (by mass%): glass: 20-70%, Al2O3: 10-60%, and Zn2SiO4: 20-70%.

8. A ceramic substrate comprising: The main surface is a mirror-finished ceramic part containing Al2O3. The calibration mark portion provided in the ceramic part, and A colored portion, exhibiting a different color from the ceramic portion, is formed based on variations in the structure of the Al contained in the ceramic portion. The colored portion is formed in the region adjacent to the calibration mark portion. The ceramic part is a glass-ceramic material containing glass. The glass-ceramic composition is as follows: glass: 30-70% and Al2O3: 30-70% by mass%.

9. The ceramic substrate as claimed in claim 7 or claim 8, wherein, The glass composition comprises, by mass%, SiO2: 50-80%, B2O3: 10-30%, Li2O + Na2O + K2O: 1-10%, MgO + CaO + SrO + BaO: 5-30%, and TiO2: 0-10%.

10. The ceramic substrate as claimed in claim 7 or claim 8, wherein, The arithmetic mean roughness Ra of the colored portion is in the range of 0.5 μm or more and 15 μm or less.

11. The ceramic substrate as claimed in claim 7 or claim 8, wherein, The maximum height Sz of the surface roughness of the colored part is in the range of 5μm or more and 40μm or less.

12. The ceramic substrate as claimed in claim 7 or claim 8, wherein, The arithmetic mean roughness Ra of the ceramic part without the formed coloring portion is in the range of 5 nm or more and 35 nm or less.

13. A ceramic substrate comprising: The main surface is a mirror-finished ceramic part containing Al2O3, and A colored portion that presents a different color from the ceramic portion. The coloring portion is colored according to the structural changes of the Al contained in the ceramic portion. The ceramic part is a glass-ceramic material containing glass. The glass-ceramic composition is as follows (by mass%): glass: 20-70%, Al2O3: 10-60%, and Zn2SiO4: 20-70%.

14. A ceramic substrate comprising: The main surface is a mirror-finished ceramic part containing Al2O3, and A colored portion that presents a different color from the ceramic portion. The coloring portion is colored according to the structural changes of the Al contained in the ceramic portion. The ceramic part is a glass-ceramic material containing glass. The glass-ceramic composition is as follows: glass: 30-70% and Al2O3: 30-70% by mass%.

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