Cleaning apparatus and process for reducing metal particle residue on a cassette

Abstract

The application provides a cleaning device and process for reducing metal particle residues of a film box, comprising a bearing platform for bearing the film box, a cleaning device being mounted on the upper end of the bearing platform, and a plurality of bearing openings being arranged on the surface of the bearing platform, a plurality of the film boxes being arranged in an array in the corresponding bearing openings, and the outer edge limit endpoints of the film boxes in the same column being located on the same virtual contact line; the device further comprises a conductive device, the conductive device comprising a movable conductive wire, the conductive wire being parallel to the contact line, and the conductive wire having a first position close to the film box and a second position away from the film box. The application can release static electricity for a plurality of film boxes at one time, improves the efficiency of static electricity release, and has a small contact area of the conductive wire, a simple control method, improved efficiency of static electricity release, and reduced difficulty and cost of static electricity release.

Description

Technical Field

[0001] This invention relates to the field of tablet cartridge cleaning technology, and in particular to a cleaning device and process for reducing residual metal particles in tablet cartridges. Background Technology

[0002] After the wafer cassettes are dried with nitrogen and rotated at high speed in the wafer cassette cleaner for a certain period of time, static electricity is generated on the surface of the wafer cassettes due to the high temperature inside the chamber and the friction of the gas. Some metal particles remain on the surface of the wafer cassettes and are difficult to completely clean and remove. At the same time, the static electricity on the surface of the wafer cassettes affects the storage of wafers.

[0003] By setting a conductive device, static electricity on the surface of the wafer cassette can be released, eliminating static electricity inside the wafer cassette and meeting the needs of wafer storage. At the same time, after the static electricity inside the wafer cassette is eliminated, the metal particles and impurities attracted by static electricity on the surface of the wafer cassette are easy to clean. The metal particles can be discharged by gas treatment, resulting in good cleaning effect and thorough cleaning of the wafer cassette surface.

[0004] Some conductive devices use a single-point contact method to sequentially release electrostatic discharge from multiple wafers, which affects the efficiency of electrostatic discharge. Some multi-point electrostatic discharge devices can solve the problem of synchronous electrostatic discharge from multiple wafers, but this type of electrostatic discharge equipment has a complex structure, large size, and high operational requirements. Furthermore, when the size of the wafers changes, the electrostatic discharge points of the equipment need to be adjusted, making the operation cumbersome, the switching process complicated, the failure rate high, and the maintenance cost high. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a cleaning device and process for reducing residual metal particles in film cartridges. This invention can electrostatically release multiple film cartridges at once, improving the efficiency of electrostatic release. Furthermore, the conductive wire has a small contact area, and the control method is simple, thus improving the efficiency of electrostatic release while reducing the difficulty and cost of electrostatic release.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0007] A cleaning device for reducing residual metal particles in tablet cartridges includes a support platform for holding the tablet cartridges. A cleaning device is installed on the upper end of the support platform. The surface of the support platform is provided with a plurality of support openings. Multiple tablet cartridges are arranged in an array within corresponding support openings. The outer edge limits of multiple tablet cartridges in the same column are located on the same virtual contact line. The device also includes a conductive device, which includes a movable conductive wire parallel to the contact line. The conductive wire has a first position close to the tablet cartridge and a second position far from the tablet cartridge. After the tablet cartridges are cleaned, the conductive wire is controlled to move towards the contact line to release static electricity from the tablet cartridges.

[0008] Preferably, conductive wires are provided on both the left and right sides of the sheet box in the same column, and a telescopic device is installed between two of the conductive wires.

[0009] The above structure is suitable for clamping some lightweight covers, avoiding excessive force applied to the cover by the conductive wires, which would affect the stability of the cover; and the two conductive wires can act as conductors and limiters, playing a preliminary limiting role during the placement of the film cassette, ensuring the accuracy of the film cassette placement position.

[0010] Preferably, the telescopic device includes two sets of telescopic components, which are located on the front and rear sides of the sheet box in the same column.

[0011] Preferably, flexible positioning pads are fixed on the surfaces of both conductive wires, and there is a predetermined distance between two adjacent positioning pads; by setting positioning pads, the wafer cassette is further flexibly positioned, ensuring accurate positioning of the wafer cassette while providing flexible protection for the surface of the conductive wires, thus preventing damage to the surface of the conductive wires during placement of the wafer cassette.

[0012] Preferably, the surface of the bearing platform further includes an electric guide rail, and the telescopic device is installed at the sliding end of the electric guide rail.

[0013] Preferably, the sidewall of the positioning pad has a bent installation gap, and the end of the installation gap extends away from the bearing platform.

[0014] Through the above structural design, during the positioning and placement of the wafer cassette, the wafer cassette applies a downward frictional force to the positioning pad, and the installation gap is bent and extended away from the bearing platform. This can prevent the positioning pad from shifting with the conductive wire under the action of external force, thus ensuring the accuracy of the positioning pad's installation position.

[0015] Preferably, the inner surface of the end of the installation gap is made of a hot-melt material.

[0016] Preferably, the cleaning device includes multiple sets of air jet openings and multiple sets of liquid spray openings, wherein the air jet openings and liquid spray openings correspond one-to-one and are located on both sides of the corresponding film cassette.

[0017] A cleaning process for reducing residual metal particles in wafer cassettes, using the aforementioned cleaning equipment for reducing residual metal particles in wafer cassettes, includes the following steps: S1, placing wafer cassettes in corresponding bearing openings according to a predetermined matrix distribution; S2, controlling the conductive wire to move towards the contact line until the conductive wire coincides with the contact line and comes into contact with the surfaces of multiple wafer cassettes, and controlling the conductive wire to conduct electricity to release static electricity from the wafer cassettes.

[0018] The beneficial effects of this invention are as follows:

[0019] The electrostatic discharge device described above requires placing the wafer cassette in a predetermined position on the surface of the support platform, ensuring that the outer edge limit endpoints of the wafer cassette are on the same virtual contact line. This guarantees that the conductive wire can contact multiple wafer cassettes, enabling rapid electrostatic discharge. For wafer cassettes of different sizes, it is only necessary to control the outer edge limit endpoints on one side to be on the same virtual contact line. This allows for synchronous electrostatic discharge of wafer cassettes of different sizes without adjusting the position of the conductive wire, thus satisfying the adaptability of electrostatic discharge. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the chip holder placement structure in the prior art.

[0021] Figure 2 This is a schematic diagram of Embodiment 1 of the present invention.

[0022] Figure 3 This is a schematic diagram of Embodiment 2 of the present invention.

[0023] Figure 4 This is a schematic diagram of Embodiment 3 of the present invention.

[0024] In the diagram: 100, bearing platform; 200, jet opening; 300, cassette; 310, box body; 320, cover; 400, liquid spray opening; 500, conductive device; 510, conductive wire one; 520, conductive wire two; 530, positioning pad; 600, telescopic device; 700, electric guide rail. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0026] See attached document Figure 1 -Appendix Figure 4 A cleaning device for reducing residual metal particles in wafer cassettes includes a support platform 100 for holding wafer cassettes 300. A cleaning device is installed on the upper end of the support platform 100. The surface of the support platform 100 is provided with several support openings. Multiple wafer cassettes 300 are arranged in an array within the corresponding support openings. The outer edge limits of multiple wafer cassettes 300 in the same column are located on the same virtual contact line. The cleaning device can clean and dry the wafer cassettes 300 placed in the support openings, ensuring the cleanliness of the surface of the wafer cassettes 300 and meeting the requirements for accommodating wafers. After the wafer cassette is dried with nitrogen and rotated at high speed for a certain period of time, static electricity is generated on the surface of the wafer cassette due to the high temperature in the cavity and the friction of the gas. Some metal particles remain on the surface of the wafer cassettes 300 and are difficult to completely clean and remove. At the same time, the static electricity on the surface of the wafer cassettes 300 affects the storage of wafers.

[0027] To address the aforementioned issues, the cleaning equipment also includes a conductive device 500. By setting the conductive device 500, static electricity on the surface of the wafer cassette 300 can be released, eliminating static electricity inside the wafer cassette 300 and meeting the needs of wafer storage. Simultaneously, after the static electricity inside the wafer cassette 300 is eliminated, the metal particle impurities attracted by static electricity on the surface of the wafer cassette 300 are easier to clean. The metal particles can be discharged through gas treatment, resulting in good cleaning effect and thorough cleaning of the surface of the wafer cassette 300.

[0028] The single-point contact method of some conductive devices sequentially discharges electrostatics from multiple cartridges 300, affecting the efficiency of electrostatic discharge. Some multi-point electrostatic discharge devices can solve the problem of synchronous electrostatic discharge from multiple cartridges 300, but this type of electrostatic discharge equipment has a complex structure, large size, and high operational requirements. Furthermore, when the size of the cartridges 300 changes, the electrostatic discharge points of the equipment need to be adjusted, making the operation cumbersome, the switching process complicated, the failure rate high, and the maintenance cost high.

[0029] To address the aforementioned issues, the conductive device 500 includes a movable conductive wire parallel to the contact line. The conductive wire has a first position close to the cartridge 300 and a second position away from the cartridge 300. After cleaning the cartridge 300, the conductive wire is controlled to move towards the contact line to release static electricity from the cartridge 300. The conductive wire is gradually moved towards the cartridge 300 until it contacts the surfaces of multiple cartridges 300. After contact with the surfaces of multiple cartridges 300, the conductive wire is grounded. Static electricity can be released from the surfaces of multiple cartridges 300 through a single conductive wire. This static electricity release method simplifies the control process; static electricity release can be completed simply by controlling the conductive wire to a predetermined position. Furthermore, the conductive wire has a simple structure, is easy to maintain and operate, and has low cost and a low failure rate.

[0030] The electrostatic discharge device described above requires placing the cartridge 300 in a predetermined position on the surface of the support platform 100 in a predetermined posture, ensuring that the outer edge limit endpoints of the cartridge 300 are located on the same virtual contact line. This ensures that the conductive wire can contact multiple cartridges 300, thereby completing the rapid release of static electricity. For cartridges 300 of different sizes, it is only necessary to control the outer edge limit endpoints on one side to be located on the same virtual contact line. This enables synchronous electrostatic discharge of cartridges 300 of different sizes without adjusting the position of the conductive wire, thus satisfying the adaptability of electrostatic discharge.

[0031] It should be noted that the cleaning device includes multiple sets of jet nozzles 200 and multiple sets of liquid spray nozzles 400. The jet nozzles 200 and liquid spray nozzles 400 correspond one-to-one and are located on both sides of the corresponding wafer cassette 300. The cleaning liquid can be sprayed out through the liquid spray nozzles 400 to complete the liquid cleaning process on the surface of the wafer cassette 300. After the wafer cassette 300 has been cleaned by liquid, the dry gas is sprayed out from both sides through the jet nozzles 200 to dry the surface of the cover 320 and meet the requirements of the wafer cassette 300 to accommodate wafers.

[0032] It should also be noted that during the process of spraying cleaning liquid from the spray nozzle 400, the conductive wire is kept away from the cartridge 300 to avoid dead corners in the liquid cleaning process and to prevent stains from remaining. In the initial stage of drying, the conductive wire and the cartridge 300 are kept away from each other, which allows for continuous drying of the surface of the cartridge 300. After the surface of the cartridge 300 is completely dry, the conductive wire is brought into full contact with the cartridge 300 to release static electricity. After the conductive wire and the cartridge 300 are in full contact, the air jet nozzle 200 is controlled to spray for a predetermined time. Under the action of the airflow, the metal particles and impurities remaining on the surface of the cartridge 300 are blown out, achieving complete cleaning of the surface of the cartridge 300.

[0033] It should also be noted that, compared with traditional conductive contacts, the conductive wire has the characteristics of long length span and small contact area, which can simultaneously contact multiple cartridges 300 while avoiding cleaning dead corners to the greatest extent and satisfying the process of deep cleaning and drying of cartridges 300. Example

[0034] The difference from Embodiment 1 is that conductive wires are provided on both sides of the sheet cassette 300 in the same column, and a telescopic device 600 is installed between the two conductive wires. By providing conductive wires on both sides, the sheet cassette can be pressed tightly from both sides, and the telescopic device 600 can control the size of the distance between the two conductive wires.

[0035] Through the above structural design, during the electrostatic discharge process, the two conductive wires can move from both sides towards the middle to achieve synchronous clamping of the cartridge 300, ensuring the stability of the cartridge 300 in the middle position; it is especially suitable for clamping some lightweight covers 320, avoiding excessive force applied to the cover 320 by the conductive wires, which would affect the stability of the cover 320; and the two conductive wires can also act as conductors and limiters, playing a preliminary limiting role during the placement of the cartridge 300, ensuring the accuracy of the placement position of the cartridge 300.

[0036] The preferred telescopic device 600 includes two sets of telescopic components, which are located on the front and rear sides of the sheet box 300 in the same column. The telescopic device 600 can control the extension and retraction of the conductive wire at the front and rear sides of the sheet box 300, so that each point of the two sets of conductive wires can move closer or further away according to the same change, thus meeting the requirements for efficient and stable control of the conductive wire. Example

[0037] Unlike Embodiments 1 and 2, flexible positioning pads 530 are fixed on the surfaces of both conductive wires. There is a predetermined distance between two adjacent positioning pads 530. By setting the positioning pads 530, the cassette 300 is further flexibly positioned, ensuring that the cassette 300 is accurately positioned, while also providing flexible protection for the surface of the conductive wires, preventing damage to the surface of the conductive wires during placement.

[0038] The surface of the support platform 100 also includes an electric guide rail 700. The telescopic device 600 is installed at the sliding end of the electric guide rail 700. By setting the electric guide rail 700, the longitudinal position of the conductive wire can be adjusted. During the electrostatic discharge process, the positioning pad 530 can be staggered from the film box 300. Through the above structural design, there is no need to disassemble or replace the positioning pad 530, realizing the automatic positioning of the film box 300 and the electrostatic discharge, thus meeting the control requirements.

[0039] A bent installation slot is provided on the side wall of the positioning pad 530, with the end of the installation slot extending away from the support platform 100. Through the above structural design, during the positioning and placement of the cassette 300, the cassette 300 applies a downward frictional force to the positioning pad 530. The bent installation slot design and extension away from the support platform 100 can prevent the positioning pad 530 from shifting with the conductive wire under the action of external force, ensuring the accurate installation position of the positioning pad 530. In addition, the inner surface of the positioning pad 530 can be designed to be inclined, forming a layout where the top is larger than the bottom between the two positioning pads 530, which facilitates the quick and accurate placement of the cassette 300.

[0040] The inner surface of the end of the installation gap is made of hot melt material. With the above-mentioned hot melt material design, after the positioning pad 530 is placed in the predetermined position, the positioning pad 530 can be hot melt processed to achieve fast and stable installation and positioning of the positioning pad 530.

[0041] The invention will be further described below in conjunction with the cleaning process.

[0042] A cleaning process for reducing residual metal particles in tablet cartridges, using the aforementioned cleaning equipment for reducing residual metal particles in tablet cartridges, includes the following steps:

[0043] S1. Place the film boxes in the corresponding bearing openings according to the predetermined matrix distribution; control the outer edge limit endpoints of multiple film boxes 300 in the same column to be located on the same virtual contact line.

[0044] S2. Control the conductive wire to move towards the contact line until the conductive wire coincides with the contact line and comes into contact with the surfaces of multiple cartridges 300. Control the conductive wire to conduct electricity and complete the release of static electricity from the cartridges 300.

[0045] The above method can perform electrostatic discharge on multiple wafer cassettes 300 at one time, which improves the efficiency of electrostatic discharge. In addition, the contact area of ​​the conductive wire is small and the control method is simple, which improves the efficiency of electrostatic discharge and reduces the difficulty and cost of electrostatic discharge.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cleaning device for reducing residual metal particles in tablet cartridges, comprising a support platform (100) for supporting tablet cartridges (300), wherein a cleaning device is installed on the upper end of the support platform (100), characterized in that: The surface of the carrier platform (100) is provided with a plurality of carrier openings, and a plurality of the sheet boxes (300) are arranged in an array within the corresponding carrier openings. The outer edge limit endpoints of the plurality of sheet boxes (300) in the same column are located on the same virtual contact line. The carrier platform (100) also includes a conductive device (500), which includes a movable conductive wire. The conductive wire is parallel to the contact line and has a first position close to the sheet box (300) and a second position away from the sheet box (300). After the sheet box (300) is cleaned, the conductive wire is controlled to move toward the contact line to release the static electricity of the sheet box (300). Conductive wires are provided on both the left and right sides of the sheet box (300) in the same column, and a telescopic device (600) is installed between two of the conductive wires. Flexible positioning pads (530) are fixed on the surfaces of both conductive wires, and there is a predetermined distance between two adjacent positioning pads (530); The surface of the support platform (100) also includes an electric guide rail (700), and the telescopic device (600) is installed at the sliding end of the electric guide rail (700).

2. The cleaning equipment for reducing residual metal particles in tablet cartridges according to claim 1, characterized in that, The telescopic device (600) includes two sets of telescopic components, which are located on the front and rear sides of the sheet box (300) in the same column.

3. The cleaning equipment for reducing residual metal particles in tablet cartridges according to claim 1, characterized in that, The positioning pad (530) has a bent installation gap on its side wall, and the end of the installation gap extends away from the bearing platform (100).

4. The cleaning equipment for reducing residual metal particles in tablet cartridges according to claim 3, characterized in that, The inner surface of the end of the installation gap is made of hot-melt material.

5. The cleaning equipment for reducing residual metal particles in tablet cartridges according to any one of claims 1-4, characterized in that, The cleaning device includes multiple sets of air jet openings (200) and multiple sets of liquid spray openings (400), the air jet openings (200) and the liquid spray openings (400) are one-to-one corresponding and located on both sides of the corresponding film cassette (300).

6. A cleaning process for reducing residual metal particles in tablet cartridges, characterized in that, The cleaning equipment for reducing residual metal particles in tablet cartridges according to any one of claims 1-5 includes the following steps: S1. Place the film boxes into the corresponding carrying openings according to the predetermined matrix distribution; S2. Control the conductive wire to move towards the contact line until the conductive wire coincides with the contact line and comes into contact with the surface of multiple cartridges (300). Control the conductive wire to conduct electricity and release the static electricity of the cartridges (300).

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