Circuit board fusion method and fusion production line

Abstract

The application discloses a circuit board fusion method and a fusion production line. The circuit board fusion method disclosed by the embodiment comprises the following steps: core plate feeding and layer number identification; inner layer PP sheet feeding and thickness detection; pre-lamination of the core plate and the inner layer PP sheet at a pre-lamination station; position detection of the core plate and the inner layer PP sheet at the pre-lamination station in sequence into an initial positioning station and a fine positioning station; fine lamination of the core plate and the inner layer PP sheet after fine positioning; hot fusion of the core plate and the inner layer PP sheet after fine lamination at a hot fusion station; and core plate and inner layer PP sheet feeding. The initial positioning station and the fine positioning station are respectively provided with positioning cameras, the positioning cameras detect edges of the inner layer PP sheet to determine the position of the inner layer PP sheet, and the positioning cameras detect positioning Mark points on the core plate to determine the position of the core plate. The fusion method does not need to punch positioning holes on the core plate and the inner layer PP sheet, can realize full-automatic production, improves production efficiency and a good product rate, and reduces production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board; more particularly, it relates to a circuit board fusion method and fusion production line. BACKGROUND

[0002] In the production of multi-layer circuit board, core board lamination is an indispensable production process, through which the PP sheet (prepreg) is used to press (hot press) the multi-layer core board together. Before the whole board of the core board and the PP sheet is pressed, the core board and the adhesive sheet of each layer need to be pre-connected to maintain their relative positions.

[0003] In the prior art, the core board and the PP sheet are positioned and pre-connected by pins. Specifically, pins are arranged on the carrier plate, positioning holes are punched on the core board and the PP sheet, and the core board and the PP sheet are manually placed on the carrier plate by the operator during production to stack the boards, and the positioning and pre-connection of the core board and the PP sheet are achieved by the cooperation of the pins and the positioning holes. This production method has long operation process and high cost, and is a manual operation during production, which has low comprehensive operation efficiency of personnel and is prone to human errors such as putting too many PP sheets, putting wrong PP sheets, and putting wrong core boards, resulting in low yield. SUMMARY

[0004] In view of the deficiencies of the prior art, the main purpose of the present application is to provide an improved circuit board fusion method and fusion production line to improve the production efficiency and yield of circuit board core board fusion.

[0005] To achieve the above main purpose, the first aspect of the present application discloses a circuit board fusion method, comprising the following steps:

[0006] S1, core board feeding and layer number identification; wherein the core board is provided with two initial positioning Mark points and four precise positioning Mark points;

[0007] S2, inner layer PP sheet feeding and thickness detection;

[0008] S3, pre-stacking of the core board and the inner layer PP sheet at the pre-stacking station;

[0009] S4, feeding the core board and the inner layer PP sheet at the pre-stacking station into the initial positioning station and the precise positioning station in sequence for position detection;

[0010] S5, precisely stacking the core board and the inner layer PP sheet after precise positioning;

[0011] S6, feeding the core board and the inner layer PP sheet after precise stacking into the hot fusion station for hot fusion;

[0012] S7, feeding and weighing of the hot fusion board material;

[0013] The two initial positioning cameras determine the position of the inner PP sheet by detecting the edges of the inner PP sheet, and determine the position of the core plate by detecting two initial positioning Mark points.

[0014] Further, the circuit board fusion method further comprises the following steps:

[0015] S8, outer layer PP sheet feeding and layer thickness detection;

[0016] S9, stacking the outer layer PP sheet on the upper surface and / or lower surface of the hot fusion plate material.

[0017] According to an embodiment of the present application, the core plate is provided with a label, and the layer number of the core plate is determined by recognizing / reading the label information when the core plate is fed, and the core plate is managed by tracing.

[0018] According to an embodiment of the present application, the two initial positioning Mark points have different sizes and / or shapes.

[0019] According to an embodiment of the present application, the four precise positioning Mark points are respectively arranged at four side edges or four corners of the core plate.

[0020] According to an embodiment of the present application, the distance between the four Mark points is detected by the four precise positioning cameras in step S4, so as to detect the expansion / contraction value of the core plate in the length and width directions.

[0021] The second aspect of the present application discloses a circuit board fusion production line for executing the circuit board fusion method described above; wherein the circuit board fusion production line comprises: a core plate feeding station for executing step S1, a PP sheet feeding station for executing step S2, a pre-stacking station for executing step S3, a pre-positioning station and a precise positioning station for executing step S4, a hot fusion station for executing steps S5 and S6, a hot fusion plate material discharging station for executing step S7, and a control system.

[0022] According to an embodiment of the present application, the number of the pre-stacking station, the pre-positioning station, the precise positioning station and the hot fusion plate material discharging station is two, so as to form two groups of parallel plate stacking-positioning-fusion lines.

[0023] Further, the circuit board fusion production line further comprises a hot fusion plate converging station, which is located between the two hot fusion plate feeding stations in a first horizontal direction to receive the hot fusion plates from the two hot fusion plate feeding stations.

[0024] Further, the hot fusion plate converging station is provided with an outer layer PP sheet stacking station on the side in a second horizontal direction, and the outer layer PP sheet stacking station is provided with outer layer PP sheet feeding stations on opposite sides in the first horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.

[0025] The technical scheme of the present application has the following beneficial effects:

[0026] The number of work stations in the production process is reduced, and the fusion process is improved from the original four independent work stations to one continuous production line, and the number of operators is reduced from four to one, which significantly reduces the personnel cost.

[0027] The cost of purchasing a PP punching machine and an inner layer plate PE punching machine is saved, the production efficiency is improved, and the production time is shortened from about 12-24 hours to about 30 minutes.

[0028] Full automation of the circuit board fusion process can be realized, and automatic fusion realizes error-proofing of PP and inner layer core plates, and the quality is guaranteed.

[0029] In order to more clearly illustrate the purpose, technical scheme and advantages of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a flowchart of the circuit board fusion method in the embodiment;

[0031] Figure 2 is a station layout schematic diagram of the circuit board fusion production line in the embodiment. DETAILED DESCRIPTION

[0032] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0033] As shown in Figure 1 , the circuit board fusion method of the embodiment comprises the following steps:

[0034] S1, core plate feeding and its layer number identification. Two initial positioning Mark points and four precise positioning Mark points are arranged on the core plate; preferably, a label can be arranged on the core plate, and the label information is identified / read by a detection camera when the core plate is fed, so as to identify the layer number of the core plate and perform traceability management.

[0035] S2, inner layer PP sheet feeding and its thickness detection, to automatically determine whether the thickness of the inner layer PP sheet is within a specified range, to prevent the situation of putting too many inner layer PP sheets or putting wrong inner layer PP sheets.

[0036] S3, pre-lamination of the core plate and the inner layer PP sheet at a pre-lamination station.

[0037] S4, sequentially feeding the core plate and the inner layer PP sheet at the pre-lamination station into an initial positioning station and a precise positioning station for position detection.

[0038] The initial positioning station is provided with two initial positioning cameras, which determine the position of the inner layer PP sheet by detecting the edge of the inner layer PP sheet, and determine the position of the core plate by detecting the two initial positioning Mark points; the precise positioning station is provided with four precise positioning cameras, which determine the position of the inner layer PP sheet by detecting the edge of the inner layer PP sheet, and determine the position of the core plate by detecting the four precise positioning Mark points.

[0039] Preferably, the two initial positioning Mark points on the core plate have different sizes and / or shapes to achieve a foolproof function, such as preventing the core plate from being placed in the front, back, left and right directions. The Mark points on the core plate can be obtained by etching the copper foil on the surface of the core plate, but are not limited thereto. The initial positioning Mark points can be arranged at the approximate middle position of the core plate, which is not limited by the present application.

[0040] Preferably, the four precise positioning Mark points are arranged at the four side edges or four corners of the core plate, so that the distance between the four Mark points can be detected by the four precise positioning cameras in step S4 to detect whether the expansion value of the core plate in the length and width directions meets the requirements.

[0041] S5, precisely laminating the core plate and the inner layer PP sheet after precise positioning.

[0042] S6, feeding the core plate and the inner layer PP sheet after precise lamination into a hot fusion station for hot fusion. At least the local area of the opposite two sides of the laminated plate is heated during hot fusion, so that the local area of the inner layer PP sheet and the core plate form a bonding area, realizing the pre-connection of the core plate and the inner layer PP sheet, to facilitate the subsequent whole plate hot pressing. Preferably, the local area of the four sides of the laminated plate is heated during hot fusion, to make the pre-connection of the core plate and the inner layer PP sheet more reliable.

[0043] S7, feeding out the hot-melted board. The step S7 can further include weighing the hot-melted board and determining whether the weight is within a specified range.

[0044] Further, the circuit board melting method of the embodiment further includes the following steps:

[0045] S8, feeding in outer layer PP sheets and detecting the thickness of the layers;

[0046] S9, stacking the outer layer PP sheets on the upper surface and / or lower surface of the hot-melted board.

[0047] The aforementioned circuit board melting method can be executed by a circuit board melting production line as shown in Figure 2 which includes a core board feeding station 1 for executing step S1, a PP sheet feeding station 2 for executing step S2, a pre-stacking station 3 for executing step S3, a pre-positioning station 4 and a fine positioning station 5 for executing step S4, a hot-melting station 6 for executing steps S5 and S6, a hot-melted board feeding station 7 for executing step S7, and a control system. Each station device / mechanism automatically operates under the control of the control system to realize full automation of the melting line.

[0048] The core board feeding station 1 can be supplied with core boards by an AGV trolley 1a, and is provided with a detection camera to read the core board label information, and the control system can identify the core board layer number according to the read label information. The PP sheet feeding station 2 can be supplied with PP sheets by an AGV trolley 2a, and is provided with a thickness detector to measure the thickness of the inner layer PP sheets, and the system automatically determines whether the thickness is within the range.

[0049] It is easy to understand that the positions of the core board feeding station 1 and the PP sheet feeding station 2 can be replaced with each other without affecting the implementation of the present application. In addition, the core board feeding station 1 and the PP sheet feeding station 2 can adopt other feeding devices / structures, which are not limited by the present application.

[0050] The pre-stacking operation of the core board and the inner layer PP sheet can be completed by a corresponding suction cup manipulator. The pre-positioning station 4 and the fine positioning station 5 preferably adopt a UVW automatic positioning platform structure. In the embodiment of the present application, the number of the pre-stacking station 3, the pre-positioning station 4, the fine positioning station 5 and the hot-melted board feeding station 6 is two, so as to form two groups of parallel stacking-positioning-melting lines to improve the production efficiency. As a variation, the number of the pre-stacking station 3, the pre-positioning station 4, the fine positioning station 5 and the hot-melted board feeding station 6 can also be one.

[0051] Further, the circuit board fusion production line of the embodiment further comprises a hot fusion board converging station 8, which is located between the two hot fusion board unloading stations 7 in the first horizontal direction Y to receive the hot fusion boards on the two hot fusion board unloading stations 7. Preferably, the hot fusion board unloading station 7 and / or the hot fusion board converging station 8 is provided with a weighing device to weigh the hot fusion boards and automatically determine whether the weight is within the range.

[0052] Further, the hot fusion board converging station 8 is provided with a side layer PP sheet laminating station 9 on the side thereof in the second horizontal direction X (the second horizontal direction X is perpendicular to the first horizontal direction Y) to perform step S9, and the side layer PP sheet laminating station 9 is provided with a side layer PP sheet loading station 10 on the side thereof in the first horizontal direction Y to perform step S8. The side layer PP sheet loading station 10 is provided with a thickness detector to detect the thickness of the side layer PP sheet and automatically determine whether the thickness is within the range.

[0053] Preferably, to improve production efficiency, the number of the side layer PP sheet loading station 10 is two, which are respectively arranged on the opposite sides of the side layer PP sheet laminating station 9 in the first horizontal direction Y. Two AGV trolleys 10a respectively supply the side layer PP sheet to the two side layer PP sheet loading stations 10, and the hot fusion board laminated with the side layer PP sheet can be transported to the subsequent station by the AGV trolley 9a.

[0054] In the embodiment of the present application, the positioning camera is used to automatically capture the core board Mark point and the inner layer PP sheet edge to realize automatic alignment operation, and the positioning holes of the core board and the PP sheet are cancelled. The automatic operation ensures that the PP and the core board surface are free of scratches or artificial scratches. The operation has a visual recognition function to realize foolproofing. The operation has a full-automatic thickness measuring function to achieve 100% error prevention. The fusion has an automatic weighing function to achieve finished product re-inspection confirmation.

[0055] The contents not described in detail in the present application can be referred to the prior art. For example, the material can be moved / transferred between different stations by using a suction cup manipulator, a conveyor belt, a conveyor roller, and a conveyor rail.

[0056] Although the present application is described above by the embodiments, it should be understood that any equivalent changes made according to the present application without departing from the scope of the present application should be covered by the protection scope of the present application.

Claims

1. A method of fusing a circuit board, characterized by The method comprises the following steps: S1, core plate feeding and layer number identification; wherein, the core plate is provided with two initial positioning Mark points and four precise positioning Mark points; S2, inner layer PP sheet feeding and thickness detection; S3, pre-laminating the core plate and the inner layer PP sheet at a pre-laminating station; S4, feeding the core plate and the inner layer PP sheet at the pre-laminating station into an initial positioning station and a precise positioning station in sequence for position detection; S5, precisely laminating the core plate and the inner layer PP sheet after precise positioning; S6, feeding the precisely laminated core plate and the inner layer PP sheet into a hot melting station for hot melting; S7, feeding and weighing the hot-melted plate material; wherein, the core plate feeding in step S1 is performed by an AGV material vehicle, and the inner layer PP sheet feeding in step S2 is performed by an AGV material vehicle; the initial positioning station is provided with two initial positioning cameras, which determine the position of the inner layer PP sheet by detecting the edge of the inner layer PP sheet, and determine the position of the core plate by detecting the two initial positioning Mark points; the precise positioning station is provided with four precise positioning cameras, which determine the position of the inner layer PP sheet by detecting the edge of the inner layer PP sheet, and determine the position of the core plate by detecting the four precise positioning Mark points; wherein, the four precise positioning Mark points are respectively arranged at the four side edges or four corner portions of the core plate; in step S4, the four precise positioning cameras are used to detect the distance between the four Mark points to detect the expansion and contraction values of the core plate in the length and width directions.

2. The circuit board fusion method according to claim 1, characterized by The method further comprises the following steps: S8, outer layer PP sheet feeding and layer thickness detection; S9, laminating the outer layer PP sheet on the upper surface and / or the lower surface of the hot-melted plate material.

3. The circuit board fusion method according to claim 1, characterized by: The core plate is provided with a label, and the layer number of the core plate is determined by recognizing / reading the label information during the feeding of the core plate, and the core plate is subjected to traceability management.

4. The circuit board fusion method according to claim 1, characterized by: The two initial positioning Mark points have different sizes and / or shapes.

5. A circuit board fusing production line for carrying out the circuit board fusing method as claimed in any one of claims 1 to 4, characterized by The circuit board melting production line comprises: a core plate feeding station for performing step S1, a PP sheet feeding station for performing step S2, a pre-laminating station for performing step S3, an initial positioning station and a precise positioning station for performing step S4, a hot melting station for performing steps S5 and S6, a hot-melted plate material feeding station for performing step S7, and a control system.

6. The circuit board fusion line of claim 5, wherein: The number of the pre-laminating station, the initial positioning station, the precise positioning station and the hot-melted plate material feeding station is two, so as to form two parallel laminating-positioning-melting lines.

7. The circuit board fusion line of claim 6, wherein: The circuit board melting production line further comprises a hot-melted plate material converging station, which is located between the two hot-melted plate material feeding stations in a first horizontal direction to receive the hot-melted plate materials from the two hot-melted plate material feeding stations.

8. The circuit board fusion line of claim 7, wherein: The hot-melted plate material converging station is provided with an outer layer PP sheet laminating station on the side in a second horizontal direction, and outer layer PP sheet feeding stations are arranged on the opposite sides of the outer layer PP sheet laminating station in the first horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.

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