A pressure output control method and device for chip placement machine

Abstract

The present invention discloses a pressure output control method and device for a patch machine, which belongs to the field of intelligent device technology, and includes the following steps: setting a plurality of uniformly distributed pressure sensors, monitoring the real-time pressure data of the patch machine during patch extrusion, and feeding back the plurality of pressure data after processing; dynamically regulating the vacuum pump, providing vacuum suction to the electronic components during patching, so as to maintain the pressure data fluctuating within a constant range; controlling the current size of the annular array electromagnet, the magnetic force change size of the annular array electromagnet accurately controls the pressure data during patching, and cutting off the vacuum suction of the vacuum pump after the patching is completed; when the patch position is misplaced, instantaneous patch recovery is performed by starting a power electromagnet, and the vacuum pump is synchronously connected. The present invention uses a power electromagnet to perform instantaneous patch recovery, and synchronously connects the vacuum pump, which can fill the defect that the vacuum pump response cycle has an interval, so that the operation frequency of the patch is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of intelligent equipment, and in particular, relates to a pressure output control method and device for a chip placement machine. Background Art

[0002] The placement machine is a complex of mechanical, electrical, optical and computer control technologies. It is a precision working robot that gives full play to the high-tech achievements of modern precision machinery, mechatronics, optoelectronics, and computer control technology to achieve high-speed, high-precision, intelligent electronic assembly and manufacturing equipment. It can quickly and accurately place various electronic components on the designated pad positions on the circuit board through the mobile placement head picking, displacement, alignment, placement and other functions. Generally, the placement machine is configured after the dispensing machine or screen printing machine.

[0003] During the SMT operation of electronic components, negative pressure is used for picking. During the picking process, the gripping and placement are controlled by the on-off control of the negative pressure airflow, and the SMT operation is realized by coordinating the height of the main arm. However, during the negative pressure airflow interruption process, it takes a certain amount of time to form a negative pressure adsorption state to pick up electronic components, that is, the response window period, which is generally based on the need for electronic component adsorption pressure. The gas flow rate generated by the vacuum pump is limited, and it is impossible to increase the gas flow rate by increasing the negative pressure to accelerate the formation of the negative pressure state and reduce the response time of the negative pressure adsorption state. Therefore, this type of picking form of the current SMT machine has limited the working efficiency of the SMT machine to a certain extent when adapting to high-speed automated SMT work.

[0004] In view of this, the present invention is proposed. Summary of the invention

[0005] In order to solve the above technical problems, the present invention proposes the following technical solutions, the basic concept of which is:

[0006] In a first aspect of an embodiment of the present invention, a pressure output control method for a chip mounter is provided, characterized in that it comprises the following steps:

[0007] Multiple pressure sensors are evenly distributed to monitor the real-time pressure data of the SMT machine during SMT extrusion, and multiple pressure data are processed and fed back;

[0008] Dynamically regulating the vacuum pump to provide vacuum suction to the electronic components during patching, so as to maintain the pressure data fluctuating within a constant range;

[0009] Controlling the current of the annular array electromagnet, the magnetic force change of the annular array electromagnet accurately controls the pressure data during patching, and cutting off the vacuum suction of the vacuum pump after the patching is completed;

[0010] When the patch is misplaced, the power electromagnet is started to instantly recover the patch and the vacuum pump is connected synchronously;

[0011] Repeat the control process of the annular array electromagnet and re-mount the chip.

[0012] As a further solution of an embodiment of the present invention, the pressure sensors are evenly distributed in a ring and / or polygonal shape, and an established data transfer node continuously monitors the pressure data monitored by the multiple pressure sensors, dynamically analyzes the force states of the pressure data in different directions, and dynamically alerts the adsorption state of electronic components during the patch process.

[0013] As a further solution of an embodiment of the present invention, the annular array electromagnet and the power electromagnet are controlled by a current controller and / or multiple current controllers to control the magnitude of the electromagnetic force.

[0014] As a further solution of the embodiment of the present invention, the data transfer node, the current controller and the vacuum pump are all logically controlled by a unified scheduling terminal, and the dynamic warning feedback of the data transfer node is fed back to the unified scheduling terminal.

[0015] As a further solution of an embodiment of the present invention, the fluctuation range of the pressure data maintained by the vacuum suction of the vacuum pump includes 0.001-0.003kgf / cm2, and the vacuum suction of the vacuum pump is cut off by controlling the solenoid valve controlled by the unified dispatching terminal through the pipeline.

[0016] In a second aspect of an embodiment of the present invention, a pressure output control device for a placement machine is provided, comprising:

[0017] shell;

[0018] Micro-motion end;

[0019] The micro-movement end is located at the bottom of the housing and is fixedly connected to the housing, and is used to connect the housing with the outside air and monitor the fitting pressure and / or pressing pressure of the patch, and to accurately control the fitting pressure and / or pressing pressure;

[0020] Instantaneous pressure control components;

[0021] The instantaneous pressure regulating component is located on the inner wall of the housing and is installed in close contact with the inner wall of the housing. The instantaneous pressure regulating component is used to quickly generate vacuum suction to adsorb electronic components to fill the response cycle of the vacuum suction of the vacuum pump;

[0022] Power components;

[0023] The power assembly is respectively located on the surface of the housing and the surface of the transient pressure regulating assembly, and is used to control the movement of the transient pressure regulating assembly through electromagnetic force.

[0024] As a further solution of the embodiment of the present invention, it also includes:

[0025] Constant voltage components;

[0026] The constant pressure component is located on the inner wall of the shell and is arranged in close contact with the shell, and the constant pressure component slides axially on the inner wall of the instantaneous pressure regulating component to balance the upper limit value of the vacuum pressure of the inner wall of the shell;

[0027] The constant pressure component includes a plurality of constant pressure holes opened on the inner wall of the shell, and the constant pressure holes are fitted with a pressure ring that slides on the inner wall of the instantaneous pressure regulating component, and a balance ring for counterweight is fixed on the top of the pressure ring.

[0028] As a further solution of the embodiment of the present invention, the lower surface of the housing is provided with a mounting port for connecting the micro-motion end, and the surface of the housing is provided with a connector for connecting the vacuum pump;

[0029] The micro-motion end portion comprises a connection portion threadedly fixed to the mounting port, and a pressure head is slidably provided on the surface of the connection portion;

[0030] The inner wall of the pressure head is fixed with a beam cover that fits and slides on the inner wall of the connecting part, and the bottom of the connecting part is fixed with a sealing ring for matching with the limiting beam cover;

[0031] A plurality of pressure sensors are fixed on the lower surface of the sealing ring, and a spring is fixed between the pressure sensor and the inner wall of the pressure head;

[0032] The surface of the pressure head is supported by an end shield fixed to the shell, and the inner wall of the end shield is installed with a ring array electromagnet for adsorbing the pressure head;

[0033] The surface of the connecting portion is sleeved with a slide cylinder for cooperating with the pressing head to slide;

[0034] The bottom of the pressure head is provided with a rubber ring for tightly fitting with the patch.

[0035] As a further solution of an embodiment of the present invention, the instantaneous pressure regulating component includes a support ring fixed on the inner wall of the outer shell, the upper surface of the support ring supports a valve plate that slides in contact with the inner wall of the outer shell, the surface of the valve plate is provided with a plurality of air holes for gas circulation, and the surface of the valve plate is provided with a one-way valve sheet at the position of the air holes for controlling the direction of airflow.

[0036] As a further solution of an embodiment of the present invention, the power component includes a metal sheet fixed on the surface of the valve plate, and the power component also includes a power electromagnet located on the inner wall of the outer shell and fixed to the metal sheet for adsorbing, and a ring sleeve for supporting the valve plate is arranged around the surface of the power electromagnet.

[0037] By adopting the above technical solution, the present invention mainly has the following technical effects:

[0038] The present invention dynamically monitors the adsorption state of electronic components by adopting multiple pressure sensors, and provides a constant vacuum pump suction force at the same time. When the patch position is misplaced, the vacuum pump is connected, and the power electromagnet is started at the same time, so that the valve plate is driven to move in cooperation with the metal sheet, so that when the valve plate moves, a negative pressure space is formed below. When the vacuum pump is connected after the window period, the gas inside the shell is extracted, so that it is seamlessly connected with the negative pressure formed by the valve plate, thereby making up for the defect of intervals in the response cycle and improving its operating frequency.

[0039] It is possible to monitor the adsorption status of the power element. Any deviation or irregularity on one side will cause abnormal records due to the differentiated data of multiple pressure sensors, which is convenient for calibration operations.

[0040] By using a circular array of electromagnets to adsorb the pressure head, it is possible to more accurately control the pressing force of the pressure head on the electrical component. At the same time, the spring pulls the pressure sensor to obtain the pressing force data. At this time, the vacuum pump and the shell are disconnected through the solenoid valve to realize the patch operation. This method is simple and convenient to press, and the pressing force can be accurately adjusted and controlled, which is beneficial to the quality assurance of the electrical components.

[0041] During the patch operation, the unified dispatching terminal adjusts the current controller to set the current flowing through the annular array electromagnet, so that the electromagnetic force of the annular array electromagnet can be accurately adjusted, and then the pressure head is adsorbed under the action of the electromagnetic force, so that the pressure head offsets the pressure data under the action of the electromagnetic force, and further pulls the spring to change the pressure value of the pressure sensor to zero. At this time, the pressure head is reset. When the spring is further stretched, its pressure change data is proportional to the tension applied to it by the spring tension length, so that it can directly understand the distance of small-amplitude pressure application, and can simultaneously grasp the applied pressure in combination with the current size of the annular array electromagnet, and can accurately judge the small-amplitude pressing distance and pressure, and can achieve precise patch pressure control. The structure is relatively simple, which meets the use needs of various situations and improves accuracy and reliability.

[0042] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0044] Figure 1 It is a flow chart of a pressure output control method of a chip placement machine in an embodiment of the present invention;

[0045] Figure 2 A control process display diagram of a pressure output control method for a chip placement machine according to an embodiment of the present invention;

[0046] Figure 3 It is a schematic diagram of the three-dimensional structure of a pressure output control device for a chip placement machine according to an embodiment of the present invention;

[0047] Figure 4 It is a schematic cross-sectional structure diagram of a pressure output control device for a chip placement machine according to an embodiment of the present invention;

[0048] Figure 5 A schematic cross-sectional structure diagram of a pressure output control device for a chip placement machine according to an embodiment of the present invention from another perspective;

[0049] Figure 6 A schematic diagram of a cross-sectional structural column of a micro-movement end portion of a pressure output control device for a chip placement machine according to an embodiment of the present invention;

[0050] Figure 7 The present invention is a schematic diagram of the principle of detecting the weight of an electric component and adjusting pressure data by a micro-movement end of a pressure output control device for a chip placement machine in an embodiment of the present invention.

[0051] The meanings of the reference numerals are as follows:

[0052] 1. Shell; 2. Mounting port; 3. Micro-motion end; 31. Connecting part; 32. Sealing ring; 33. Pressure head; 34. Ring array electromagnet; 35. Spring; 36. Pressure sensor; 37. Beam cover; 38. Slide; 39. End shield; 4. Instantaneous pressure control assembly; 41. Valve plate; 42. Support ring; 43. Air hole; 44. One-way valve plate; 5. Power assembly; 51. Power electromagnet; 52. Metal sheet; 53. Ring sleeve; 6. Constant pressure assembly; 61. Constant pressure hole; 62. Pressure ring; 63. Balance ring; 7. Connector; 8. Vacuum pump; 9. Data transfer node; 10. Current controller; 11. Unified dispatching terminal; 12. Rubber ring. DETAILED DESCRIPTION

[0053] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the specification of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0055] During the SMT operation of electronic components, negative pressure is used for picking. During the picking process, the gripping and placement are controlled by the on-off control of the negative pressure airflow, and the height of the main arm is coordinated to achieve the SMT operation. However, during the negative pressure airflow interruption process, it takes a certain amount of time to form a negative pressure adsorption state to pick up electronic components, that is, the response window period. Therefore, this type of picking form of the current SMT machine has limited the working efficiency of the SMT machine to a certain extent when adapting to high-speed automated SMT work.

[0056] In order to solve the above technical problems, embodiments of the present invention are described in detail with reference to the accompanying drawings.

[0057] Embodiment 1

[0058] See also Figure 1 and Figure 2 , Figure 1 and Figure 2 They are respectively a flow chart of a pressure output control method for a chip placement machine in an embodiment of the present invention and a control process display diagram, combined with Figure 1 and Figure 2 , this embodiment provides a pressure output control method for a placement machine, comprising the following steps:

[0059] S101, setting a plurality of uniformly distributed pressure sensors 36 to monitor the real-time pressure data of the patch extrusion of the patch machine, and feeding back the plurality of pressure data after processing;

[0060] Specifically, a pressure sensor is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to certain rules. Pressure sensors are usually composed of pressure sensitive elements and signal processing units, and are widely used in various industrial automatic control environments.

[0061] Specifically, the uniform distribution of the plurality of pressure sensors 36 can maintain a relatively stable and balanced supporting effect on the pressure head 33 .

[0062] S102, dynamically regulating the vacuum pump 8 to provide vacuum suction to the electronic components during patching, so as to maintain the pressure data fluctuating within a constant range.

[0063] Specifically, the vacuum pump 8 refers to a device or equipment that uses mechanical, physical, chemical or physicochemical methods to evacuate the container to obtain a vacuum. It is a device that uses various methods to improve, generate and maintain vacuum in a closed space. Its function is to remove gas molecules from the vacuum chamber and reduce the gas pressure in the vacuum chamber to achieve the required vacuum degree. In order to achieve the process indicators, work efficiency and equipment service life requirements of different products, different vacuum sections need to select different vacuum system configurations.

[0064] It can be understood that the vacuum suction force of the vacuum pump 8 can be dynamically adjusted, and the values ​​of shutdown, working vacuum pressure maintenance and working vacuum pressure halved are used to control it in the dormant state, running state and standby state respectively. In actual use, engineers should still independently adjust the state of the vacuum pump 8 according to the actual production needs and factory specifications.

[0065] Specifically, the pressure data is maintained to fluctuate within a constant range, and the pressure data to be maintained always needs to be greater than the maximum vacuum suction value captured by the electric element.

[0066] S103, controlling the current of the annular array electromagnet 34, the magnetic force change of the annular array electromagnet 34 accurately controls the pressure data during patching, and cuts off the vacuum suction of the vacuum pump 8 after the patching is completed.

[0067] Specifically, an electromagnet is a device that generates electromagnetism when powered on. A conductive winding that matches its power is wound around the outside of the iron core. The coil with current flowing through it has magnetism like a magnet. The electromagnet is magnetic when powered on, and the magnetism disappears when the power is off. It is usually made into a bar or hoof shape to make the iron core easier to magnetize.

[0068] Specifically, in the electromagnetic force control room of the annular array electromagnet 34, at the moment of pressure control of the patch, the vacuum suction force is coordinated and closed, so that the coordination is achieved in an instant.

[0069] S104, when the patch position is misaligned, the power electromagnet 51 is started to perform instantaneous patch recovery, and the vacuum pump 8 is connected synchronously.

[0070] Specifically, the power component 5 using the power electromagnet 51 can drive the instantaneous pressure regulating component 4 to realize vacuum adsorption and grasping of the power element, i.e., the patch, and then connect with the negative pressure suction response of the vacuum pump 8 to complete the connection and realize a rapid grasping response.

[0071] S105, repeat the control process of the annular array electromagnet 34 and perform the patch operation again.

[0072] The present invention dynamically monitors the adsorption state of electronic components by adopting multiple pressure sensors, and provides a constant vacuum pump suction force at the same time. When the patch position is misplaced, the vacuum pump is connected, and the power electromagnet is started at the same time, so that the valve plate is driven to move in cooperation with the metal sheet, so that when the valve plate moves, a negative pressure space is formed below. When the vacuum pump is connected after the window period, the gas inside the shell is extracted, so that it is seamlessly connected with the negative pressure formed by the valve plate, thereby making up for the defect of intervals in the response cycle and improving its operating frequency.

[0073] As a further solution of an embodiment of the present invention, the pressure sensors 36 are evenly distributed in a ring and / or polygonal shape, and an established data transfer node 9 continuously monitors the pressure data monitored by the multiple pressure sensors 36, dynamically analyzes the force states of the pressure data in different directions, and dynamically alerts the adsorption state of electronic components during the patch process.

[0074] Specifically, the data transfer node 9 is used to forward the pressure data of the pressure sensor 36 to the host computer, and the host computer can monitor the pressure data. Furthermore, by setting the pressure sensor 36, and multiple pressure sensors 36 are evenly distributed, it is possible to more evenly control the adsorption state of the power element when it is adsorbed. One side of it is more tightly adsorbed, and the other side is more floatingly adsorbed, which can provide a more accurate adsorption state.

[0075] As a further solution of the embodiment of the present invention, the annular array electromagnet 34 and the power electromagnet 51 are controlled by a current controller 10 and / or multiple current controllers 10 to control the magnitude of the electromagnetic force.

[0076] Specifically, the current controller 10 can change the wiring of the main circuit or the control circuit and change the resistance value in the circuit in a predetermined order to control the starting, speed regulation, braking and reversing of the motor, thereby controlling the starting, speed regulation, braking and reversing of the annular array electromagnet 34 and the power electromagnet 51.

[0077] Specifically, by providing a current controller 10 , the current controller 10 is controlled by a unified dispatching center so that the electromagnetic force of the power electromagnet 51 and the annular array electromagnet 34 can be adjusted more accurately.

[0078] As a further solution of the embodiment of the present invention, the data transfer node 9 , the current controller 10 and the vacuum pump 8 are all logically controlled by a unified dispatching terminal 11 , and the data transfer node 9 dynamically sends warning feedback to the unified dispatching terminal 11 .

[0079] Specifically, the unified dispatch terminal 11 may be the above-mentioned host computer, or may be other control devices that can achieve the same control, and no specific limitation is made here.

[0080] Specifically, by setting up a unified dispatching terminal 11, as an intelligent terminal for electronic control, providing logic control and human-computer interaction feedback, it exists as a logic control node for pressure output control of the placement machine.

[0081] As a further solution of an embodiment of the present invention, the fluctuation range of the pressure data maintained by the vacuum suction of the vacuum pump 8 includes 0.001-0.003kgf / cm2, and the vacuum suction of the vacuum pump 8 is cut off by controlling the solenoid valve controlled by the unified dispatching terminal 11 through the pipeline.

[0082] Specifically, the suction action of the vacuum pump 8 is in a continuous state, so that it maintains a continuous suction state, and its on-off control is operated by a solenoid valve to maintain a constant suction force to reduce the fluctuation range of the fitting pressure, thereby keeping its overall state in a relatively stable state.

[0083] Based on the above-mentioned method, in order to solve the technical problems and related optimizations raised in the background, the following specific devices are adopted for cooperation.

[0084] See also Figure 3-Figure 7 This embodiment also provides a pressure output control device for a placement machine, comprising:

[0085] Shell 1;

[0086] Specifically, the shell 1 adopts a bucket-shaped structure, which can achieve the effect of increasing suction to a certain extent, while keeping the internal space of the shell 1 in a relatively closed state, thereby creating a stable negative pressure environment.

[0087] Micro-motion end 3;

[0088] Among them, the micro-motion end 3 is located at the bottom of the shell 1 and is fixedly connected to the shell 1, and is used to connect the shell 1 with the external gas and monitor the fitting pressure and / or pressing pressure of the patch, as well as to accurately control the fitting pressure and / or the pressing pressure.

[0089] It can be understood that the functions of the micro-movement end 3 include weight detection of the power element, i.e., the patch, precise regulation of pressure and downward pressing distance, and stable fitting effect on the power element.

[0090] Instantaneous pressure regulating component 4;

[0091] Among them, the instantaneous pressure regulating component 4 is located on the inner wall of the shell 1 and is installed in close contact with the inner wall of the shell 1. The instantaneous pressure regulating component 4 is used to quickly generate vacuum suction to adsorb electronic components to fill the response cycle of the vacuum suction of the vacuum pump 8.

[0092] Power assembly 5;

[0093] The power assembly 5 is respectively located on the surface of the housing 1 and the surface of the transient pressure regulating assembly 4 , and is used to control the movement of the transient pressure regulating assembly 4 through electromagnetic force.

[0094] As a further solution of the embodiment of the present invention, the pressure output control device of the placement machine further includes:

[0095] Constant pressure component 6;

[0096] The constant pressure component 6 is located on the inner wall of the housing 1 and is arranged in close contact with the housing 1, and the constant pressure component 6 slides axially on the inner wall of the instantaneous pressure regulating component 4 to balance the upper limit value of the vacuum pressure on the inner wall of the housing 1;

[0097] The constant pressure component 6 includes a plurality of constant pressure holes 61 opened on the inner wall of the housing 1 , and a pressure ring 62 sliding on the inner wall of the instantaneous pressure regulating component 4 is arranged in close proximity to the constant pressure holes 61 , and a balance ring 63 for counterweight is fixed on the top of the pressure ring 62 .

[0098] Furthermore, the constant pressure hole 61 of the constant pressure assembly 6 is blocked by the pressure ring 62, and the blocking force of the pressure ring 62 is provided by the balance ring 63, so that the balance rings 63 of different weights can limit the maximum negative pressure suction force of the electric device.

[0099] As a further solution of the embodiment of the present invention, the lower surface of the housing 1 is provided with a mounting port 2 for connecting the micro-motion end 3, and the surface of the housing 1 is provided with a connector 7 for connecting the vacuum pump 8;.

[0100] Among them, by setting the installation opening 2, a reserved space for disassembly and installation of the micro-motion end portion 3 can be conveniently provided, thereby facilitating disassembly, maintenance and overhaul.

[0101] The micro-motion end portion 3 includes a connection portion 31 threadedly fixed to the mounting opening 2 , and a pressure head 33 is slidably provided on the surface of the connection portion 31 .

[0102] A beam cover 37 that fits and slides on the inner wall of the connecting portion 31 is fixed to the inner wall of the pressing head 33 , and a sealing ring 32 for cooperating with the limiting beam cover 37 is fixed to the bottom of the connecting portion 31 .

[0103] Specifically, a plurality of pressure sensors 36 are fixed on the lower surface of the sealing ring 32 , and a spring 35 is fixed between the pressure sensor 36 and the inner wall of the pressure head 33 .

[0104] It can be understood that the force applied to the pressure sensor 36 by the spring 35 enables it to achieve displacement while maintaining the change of the pressure value, and the change in the length of the spring 35 can more accurately control the increase or decrease of the pressure of the pressure sensor 36.

[0105] Furthermore, the surface of the pressing head 33 is supported by an end shield 39 fixed to the housing 1 , and the inner wall of the end shield 39 is installed with a ring array electromagnet 34 for adsorbing the pressing head 33 .

[0106] Furthermore, the end shield 39 serves to install the annular array electromagnet 34 and has the function of limiting and guiding the pressure head 33 .

[0107] In addition, a slide cylinder 38 for cooperating with the pressing head 33 to slide is sleeved on the surface of the connecting portion 31 , wherein the slide cylinder 38 serves as a matching set inside the end shield 39 to maintain the limited sliding characteristics of the pressing head 33 .

[0108] Furthermore, a rubber ring 12 for sealingly fitting with the patch is installed at the bottom of the pressing head 33. The rubber ring 12 is located at the bottom of the pressing head 33 and can enhance the fit between the pressing head 33 and the power element.

[0109] As a further solution of the embodiment of the present invention, the instantaneous pressure regulating component 4 includes a support ring 42 fixed to the inner wall of the housing 1, and the upper surface of the support ring 42 supports a valve plate 41 that slides in contact with the inner wall of the housing 1. The surface of the valve plate 41 is provided with a plurality of air holes 43 for gas circulation, and the surface of the valve plate 41 is provided with a one-way valve plate 44 that controls the flow direction of the airflow at the air holes 43. The support ring 42 guides the inner wall of the pressure ring 62 and supports the valve plate 41 at the same time. When the valve plate 41 moves downward, the air holes 43 of the one-way valve plate 44 are in the air flow state. When the valve plate 41 moves upward, the one-way valve plate 44 keeps the air holes 43 in a closed state, and the vacuum pump 8 draws the airflow, and the airflow pushes the one-way valve plate 44 on the surface of the air holes 43 to be in a connected state.

[0110] As a further solution of an embodiment of the present invention, the power component 5 includes a metal sheet 52 fixed on the surface of the valve plate 41, and the power component 5 also includes a power electromagnet 51 located on the inner wall of the outer shell 1 and fixed to the metal sheet 52 for adsorbing, and a ring sleeve 53 for supporting the valve plate 41 is arranged around the surface of the power electromagnet 51.

[0111] Furthermore, the metal sheet 52, as a cooperating member for adsorption of the power electromagnet 51, has the advantages of low weight, high degree of adsorption and easy use. By adopting the ring sleeve 53, the ring sleeve 53 is used to support the valve plate 41 during the process of the power electromagnet 51 adsorbing the metal sheet 52, thereby effectively preventing collision and maintaining stability in use.

[0112] The above method theory combined with the support of the relevant SMT pressure output control device can be understood as follows:

[0113] In actual use, when the vacuum pump 8 is started, the vacuum pump 8 is connected to the joint 7 through a pipeline whose on / off state is controlled by a solenoid valve operated by the unified dispatching terminal 11. At this time, the vacuum pump 8 draws the external airflow into the shell 1 through the beam cover 37, and at the same time, the airflow is drawn out through the joint 7 after the one-way valve plate 44 is opened and passes through the air hole 43. As the mechanical arm installed in the shell 1 moves to the top of the corresponding power element, and the rubber ring 12 contacts it, due to the effect of negative pressure, the rubber ring 12 and the power element are in a tightly fitted state, and the pressure head 33 is The pressure is squeezed through the spring 35 to squeeze the pressure sensor 36. At this time, several pressure sensors 36 at different positions obtain the pressure data of the position, and the data are uniformly summarized to the data transfer node 9. The data transfer node 9 corresponds to the layout position of the pressure sensor 36 to grasp the grasping state of the power component. When the pressure data at a certain position is low, an offset may occur, causing the center of gravity to shift, resulting in uneven force, so that it can assist the visual system of the placement machine for auxiliary judgment. When an abnormality occurs, the visual system is called up for judgment. In the normal operation state, the visual system is turned off to maintain the overall efficient operation.

[0114] Embodiment 2

[0115] The same as the first embodiment, furthermore:

[0116] The above description is directed to the coordination relationship between the pressure sensor 36 and the vacuum pump 8 .

[0117] In further use, due to the negative pressure adsorption of the electric element, the pressure head 33 compresses the spring 35 to contract. At this time, we start the annular array electromagnet 34 to adsorb the pressure head 33, thereby offsetting the pressure on the spring 35, so that the pressure head 33 can move and squeeze the electric element downward. Based on the change in the distance moved downward by the pressure head 33, the value of the pressure sensor 36 of the spring 35 changes synchronously, so that the downward pressure operation on the electric element can be achieved without attenuation of the adsorption effect of the vacuum pump 8. At the same time, the current of the annular array electromagnet 34 is regulated by the current controller 10, so that the pressure of the pressure head 33 can be controlled. At the same time, the extrusion force is controlled in real time by the pressure sensor 36, so as to achieve precise control and adjustment of the pressure.

[0118] Embodiment 3

[0119] The same as the first embodiment, furthermore:

[0120] The above description is about the precise control of the pressure of the pressure head 33 based on the pressure sensor 36 and the annular array electromagnet 34 .

[0121] Based on the further extension of the above two points, after the power element is placed, the solenoid valve controlled by the unified dispatching terminal 11 cuts off the connection between the vacuum pump 8 and the connector 7. At this time, the annular array electromagnet 34 is closed to complete the patch operation of the power element. When the patch needs to be grabbed, the power electromagnet 51 is started. At this time, the power electromagnet 51 is started to adsorb the metal sheet 52, and the metal sheet 52 moves with the valve plate 41. At this time, the air hole 43 is blocked by the one-way valve plate 44, so that negative pressure is formed at the position of the beam cover 37, and the rubber ring 12 is used to adsorb the power element. In this less than one second, the negative pressure suction force of the vacuum pump 8 takes over the continuous adsorption of the power element, so that the response time is greatly improved, and the overall equipment patch speed is improved.

[0122] Based on the use of the above three embodiments, due to the adsorption of power components under the action of negative pressure, when the internal pressure of the shell 1 reaches the maximum allowable negative pressure value, the external airflow enters the shell 1 through the constant pressure hole 61. At this time, the pressure ring 62 moves upward under the push of the airflow, and the external airflow enters through the constant pressure hole 61. When the negative pressure is less than the gravity of the balance ring 63, the constant pressure hole 61 is blocked by the pressure ring 62 again. This method can limit the maximum suction force of the use range through the gravity model of the balance ring 63 to avoid damage to the power components.

[0123] Working principle:

[0124] When the present solution is in use, the unified dispatching terminal 11 starts the current controller 10 and supplies power to the power electromagnet 51, so that the power electromagnet 51 absorbs the metal sheet 52 until the valve plate 41 moves rapidly and hits the ring sleeve 53, thereby realizing the driving of the instantaneous pressure regulating component 4 by the power component 5. When the valve plate 41 moves rapidly upward, the one-way valve plate 44 blocks the air hole 43, so that the valve plate 41 allows the external airflow to enter the interior of the housing 1 through the connecting portion 31 and the beam cover 37 of the micro-motion end 3, and then absorbs the power element. When the valve plate 41 contacts the ring sleeve 53, the power electromagnet 51 is de-energized, so that the valve plate 41 is reset downward under the action of gravity. This process is the instantaneous start and stop control of the power electromagnet 51.

[0125] It should be particularly noted that the pipeline connecting the vacuum pump 8 and the connector 7 preferably adopts a corrugated tube, and a solenoid valve directly controlled by the unified dispatching terminal 11 is provided in the middle section of the pipe wall of the pipeline. The corrugated tube on the side of the solenoid valve close to the connector 7 should be connected with the connector 7 by a tee. A one-way valve that only allows outflow but not inflow is installed at the external end of the tee. When the valve plate 41 moves upward, based on the closed state of the solenoid valve, the closed airflow above the valve plate 41 is discharged through the tee and the one-way valve.

[0126] In this embodiment, the vacuum pump 8 is driven by the unified dispatching terminal 11, and at the same time, the solenoid valve connected to the vacuum pump 8 and the connector 7 is opened to maintain a negative pressure state inside the housing 1. Synchronous external airflow passes through the connection portion 31 and the beam cover 37 of the micro-motion end 3 into the housing 1, and then passes through the air hole 43 to lift the one-way valve plate 44, so that the airflow is drawn out through the connector 7. At the same time, the valve plate 41 moves downward and resets under the action of gravity until it contacts the support ring 42.

[0127] In addition, in the process of the valve plate 41 forming negative pressure upward and the vacuum pump 8 forming negative pressure attraction, when the vacuum suction force is greater than GH*15 times the weight of the power element, the power element cooperates with the rubber ring 12 to seal the pressure head 33, and the negative pressure state formed by the vacuum pump 8 or the valve plate 41 inside the housing 1 is in a closed state, and then the external airflow passes through the constant pressure hole 61 to lift the pressure ring 62, and maintains the synchronous lifting of the balance ring 63, and the external airflow enters to maintain the internal vacuum suction force at the maximum value to stably grasp the power element. When the vacuum suction force is lower than G*15 times, the balance ring 63 acts on the pressure ring 62 to slide on the inner wall of the support ring 42 and cover the constant pressure hole 61 to maintain sealing;

[0128] Please read further Figure 6When the electric element is fitted with the rubber ring 12 and the negative pressure applies a pressure to the pressure head 33, the pressure head 33 slides on the surface of the slide 38 and the inner wall of the end shield 39, and synchronously provides an applied pressure to multiple pressure sensors 36 through a plurality of springs 35, so as to monitor the grasping state of the electric element. It can be seen here that the relationship between the pressure data Q obtained by the pressure sensor 36 and the weight GH of the electric element and the negative pressure suction G1 is Q=G1-GH, and the vacuum suction is limited by the constant pressure component 6 to be in a constant adsorption state of the maximum value. The different electric elements, therefore, have different weights of the electric elements within a range of values, so that the negative pressure suction offsets the weight of the electric element, which is the gravity data adsorbed by the pressure sensor 36. Therefore, the weight data of the electric element can be directly judged. In this way, the weight data of the electric element can be mastered after the grasping is completed, and the specifications of the electric element can be directly checked, thereby reducing the error rate and improving the fault tolerance rate.

[0129] At the same time, when the patch operation is required, a smaller pressure needs to be applied to the patch. Here, the current controller 10 is started by the unified dispatching terminal 11 to control the current flowing through the annular array electromagnet 34, so that the size of its electromagnetic force can be changed, and then the pressure head 33 is adsorbed, so that the pressure head 33 offsets the pressure data Q under the action of the electromagnetic force, and further pulls the spring 35, so that the pressure value of the pressure sensor 36 changes to zero, and the pressure head 33 is reset at this time. When the spring 35 is further stretched, its pressure change data is proportional to the tension applied to it by the tension length of the spring 35, so that it can directly understand the distance of small-amplitude pressure application, and combined with the current size of the annular array electromagnet 34, the applied pressure can be grasped at the same time, and the small-amplitude pressing distance and pressure can be accurately judged, and precise patch pressure control can be achieved.

[0130] In summary, this solution realizes the significant advantages of high-frequency operation of the patch and high-precision control combined with the three-stage control of the vacuum pump 8, the data transfer node 9 and the current controller 10, and the cooperation of the three stages.

[0131] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0132] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0133] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0134] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A pressure output control method for a chip placement machine, characterized in that: The following steps are involved: A plurality of pressure sensors (36) are evenly distributed on the lower surface of the sealing ring 32 to monitor the real-time pressure data of the patch extrusion of the patch machine and to feed back the multiple pressure data after processing. The pressure sensors (36) are evenly distributed in a ring and / or polygonal shape. An established data transfer node (9) continuously monitors the pressure data monitored by the multiple pressure sensors (36), and dynamically analyzes the stress state of the pressure data in different directions, and performs dynamic alerts on the adsorption state of electronic components during the patch process. A vacuum pump (8) is dynamically regulated to provide vacuum suction to the electronic components during patching, so as to maintain the pressure data fluctuating within a constant range. A connector (7) for connecting to the vacuum pump (8) is provided on the surface of the housing (1); Controlling the current of the annular array electromagnet (34), the magnetic force change of the annular array electromagnet (34) accurately controls the pressure data during patching, and cutting off the vacuum suction of the vacuum pump (8) after the patching is completed, wherein the annular array electromagnet 34 is used to adsorb the pressure head (33) and is arranged on the inner wall of the end shield (39); When the patch is misplaced, the patch is instantly recovered by starting the power electromagnet (51) and the vacuum pump (8) is connected synchronously, wherein the power electromagnet (51) is located on the inner wall of the housing 1; Repeat the control process of the annular array electromagnet (34) and re-patch the operation.

2. A chip placement machine pressure output control method according to claim 1, characterized in that: The annular array electromagnet (34) and the power electromagnet (51) are controlled in terms of electromagnetic force by a current controller (10) and / or a plurality of current controllers (10).

3. A chip placement machine pressure output control method according to claim 1 or 2, characterized in that: The data transfer node (9), the current controller (10) and the vacuum pump (8) are all logically controlled by a unified dispatching terminal (11), and the dynamic warning of the data transfer node (9) is fed back to the unified dispatching terminal (11).

4. A chip placement machine pressure output control method according to claim 3, characterized in that: The fluctuation range of the pressure data maintained by the vacuum suction of the vacuum pump (8) includes 0.001-0.003 kgf / cm2, and the vacuum suction of the vacuum pump (8) is cut off by controlling the solenoid valve controlled by the unified dispatching terminal (11) through the pipeline.

5. A pressure output control device for a chip placement machine, characterized in that: A pressure output control method for a chip placement machine according to any one of claims 1 to 4, comprising: housing (1); Micro-movement end (3); The micro-movement end portion (3) is located at the bottom of the housing (1) and is fixedly connected to the housing (1), and is used to connect the housing (1) with the outside air and monitor the fitting pressure and / or pressing pressure of the patch, and to precisely control the fitting pressure and / or pressing pressure; Transient pressure control component (4); The instantaneous pressure regulating component (4) is located on the inner wall of the housing (1) and is mounted in close contact with the inner wall of the housing (1). The instantaneous pressure regulating component (4) is used to quickly generate vacuum suction to adsorb electronic components, thereby filling the response cycle of the vacuum suction of the vacuum pump (8); The instantaneous pressure regulating assembly (4) comprises a support ring (42) fixed to the inner wall of the housing (1); the upper surface of the support ring (42) supports a valve plate (41) that slides in contact with the inner wall of the housing (1); a surface of the valve plate (41) is provided with a plurality of air holes (43) for gas circulation, and a one-way valve plate (44) for controlling the flow direction of the air is provided on the surface of the valve plate (41) at the position of the air holes (43); Power assembly (5); The power assembly (5) is located on the surface of the housing (1) and the surface of the transient pressure regulating assembly (4), respectively, and is used to control the movement of the transient pressure regulating assembly (4) through electromagnetic force; The power assembly (5) includes a metal sheet (52) fixed to the surface of the valve plate (41), and the power assembly (5) also includes a power electromagnet (51) located on the inner wall of the housing (1) and fixedly adapted to be adsorbed by the metal sheet (52), and a ring sleeve (53) for supporting the valve plate (41) is provided around the surface of the power electromagnet (51); The lower surface of the housing (1) is provided with a mounting port (2) for connecting to the micro-motion end portion (3), and the surface of the housing (1) is provided with a connector (7) for connecting to the vacuum pump (8); The micro-motion end portion (3) comprises a connecting portion (31) threadedly fixed to the mounting opening (2), and a pressure head (33) is slidably provided on the surface of the connecting portion (31); A beam cover (37) is fixed to the inner wall of the pressure head (33) and is slidably fitted on the inner wall of the connecting portion (31). A sealing ring (32) for matching the beam cover (37) is fixed to the bottom of the connecting portion (31). A plurality of pressure sensors (36) are fixed on the lower surface of the sealing ring (32), and a spring (35) is fixed between the pressure sensors (36) and the inner wall of the pressure head (33); The surface of the pressure head (33) is supported by an end shield (39) fixed to the housing (1), and the inner wall of the end shield (39) is equipped with an annular array of electromagnets (34) for adsorbing the pressure head (33); The surface of the connecting portion (31) is sleeved with a sliding cylinder (38) for sliding with the pressing head (33); The bottom of the pressure head (33) is provided with a rubber ring (12) for sealingly fitting with the patch; Constant pressure component (6); The constant pressure component (6) is located on the inner wall of the housing (1) and is arranged in close contact with the housing (1), and the constant pressure component (6) slides axially on the inner wall of the instantaneous pressure regulating component (4) to balance the upper limit value of the vacuum pressure on the inner wall of the housing (1); The constant pressure assembly (6) includes a plurality of constant pressure holes (61) provided on the inner wall of the housing (1), wherein the constant pressure holes (61) are provided with a pressure ring (62) sliding on the inner wall of the instantaneous pressure regulating assembly (4), and a balance ring (63) for counterweight is fixed on the top of the pressure ring (62).

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