A preparation method of plant fiber card, a plant fiber board and a plant fiber card

Abstract

The present invention provides a preparation method of a plant fiber card, a plant fiber board and a plant fiber card. The method comprises the following steps S1: crushing plant fiber raw materials to obtain wood chips; S2: adding a wood softener to the crushed wood chips, stirring them evenly, then adding an emulsifier and a wood hydrophobic agent, stirring them evenly again and letting them stand to obtain mixed slag; S3: drying the mixed slag obtained in step S2, grinding them again after drying, sieving them to obtain wood powder; S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder; S5: evenly paving the mixed powder, pressing them to obtain a plant fiber board; S6: hot pressing the plant fiber board and the chip layer to obtain a full-page card, and cutting the full-page card to obtain a plant fiber card. The plant fiber content in the plant fiber card prepared by the method exceeds 80%, and there is almost no harmful organic volatile matter.

Description

Technical Field

[0001] The invention relates to the field of smart card preparation, and in particular to a method for preparing a plant fiber card, a plant fiber board and a plant fiber card. Background Art

[0002] IC card (Integrated Circuit Card) is an integrated circuit card, which is widely used in hotel door locks, identity recognition, transportation payment, electronic wallets, etc. However, traditional IC cards are usually made of plastic materials, which contain a certain proportion of petrochemical products, causing certain impacts on the environment, and the production process has certain costs and energy consumption.

[0003] In recent years, people have become increasingly aware of the importance of sustainable development and environmental protection, and it has become an urgent need to seek feasible solutions to replace traditional materials. Plant fiber, as a renewable and biodegradable material, has broad application prospects.

[0004] However, a large amount of urea-formaldehyde glue is used in the preparation process of traditional plant fiber boards, and the finished products contain a large amount of formaldehyde and other harmful substances to humans. At the same time, the finished products of traditional plant fiber pressed boards have a poor feel.

[0005] As an item that comes into close contact with people, IC cards need to avoid using such harmful substances while having a comfortable feel. Summary of the invention

[0006] The first purpose of the present invention is to provide a method for preparing a plant fiber card, which is used to solve the problem that harmful substances are generated during the production process of existing plant fiber boards, which is not environmentally friendly and harmful to the body, and the finished product has a poor feel and is not suitable for the preparation of IC cards.

[0007] The second object of the present invention is to provide a plant fiber board, which is prepared by the above-mentioned method for preparing a plant fiber card.

[0008] The third object of the present invention is to provide a plant fiber card, which is prepared by the above-mentioned method for preparing a plant fiber card.

[0009] In order to achieve the above-mentioned first purpose, the present invention provides a method for preparing a plant fiber card, comprising the following steps: S1: crushing plant fiber raw materials to obtain wood chips; S2: adding a wood softener to the crushed wood chips, stirring them thoroughly, and then continuing to add an emulsifier and a wood hydrophobic agent, stirring them again and letting them stand to obtain mixed slag; S3: drying the mixed slag obtained in step S2, grinding them again after drying, and sieving them to obtain wood powder; S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder; S5: evenly flattening the mixed powder and pressing them to obtain a plant fiber board; S6: hot pressing the plant fiber board and the chip layer to obtain a full-page card, and cutting the full-page card to obtain a plant fiber card.

[0010] As can be seen from the above scheme, the plant fiber raw material in the present invention can be selected from at least one of tree trunks, resins, straws, and stalks, which are widely available, low in cost, and pollution-free to the environment. After the plant fiber raw material is crushed, adding a softener can optimize the feel of the final plant fiber card, while killing mold and insect eggs in the natural plant fiber material, making the plant fiber card safer; adding a wood hydrophobic agent makes the surface of the formed plant fiber card waterproof, and the user feels better; adding an emulsifier can make the wood hydrophobic agent, wood softener and plant fiber raw material fully mixed to improve the mixing effect; drying after mixing evenly to completely volatilize the organic volatiles in the mixed slag, and further kill mold and insect eggs, to ensure that the prepared plant fiber card does not contain harmful substances, and using hot melt adhesive powder to shape wood powder further avoids the presence of organic volatile substances in the prepared plant fiber card. The plant fiber content in the plant fiber card prepared by this method exceeds 80%, and there is almost no harmful organic volatile substance.

[0011] A further solution is that the method for preparing the chip layer in step S6 is: attaching hot melt adhesive on one side of cotton paper, and performing ultrasonic copper coil winding and fully automatic chip welding on the other side of the cotton paper opposite to the hot melt adhesive to obtain the chip layer; wherein the weight of the cotton paper is 40g to 60g, the hot melt adhesive is TPU hot melt adhesive, the weight of the TPU hot melt adhesive is 60g to 100g, and the melt index of the TPU hot melt adhesive is 10ml / 10min to 20ml / 10min.

[0012] As can be seen from the above scheme, cotton paper is a common material with a wide range of sources, environmental protection and relatively low price, which effectively controls the preparation cost of the chip layer. At the same time, the adhesive-backed cotton paper is airtight, and the cotton paper can be vacuumed on a traditional winding machine to achieve the same winding effect as traditional PVC winding.

[0013] A further solution is that step S6 is specifically as follows: arrange the plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board from top to bottom, use a pressure of 10MPa to 15MPa and hot press at 110℃ to 130℃ for 10s to 30s to obtain a full-page card, and cut the full-page card to obtain a plant fiber card.

[0014] It can be seen from the above scheme that the use of TPU hot melt adhesive film prevents the appearance of chip and coil marks on the card surface after hot pressing, making the plant fiber card more beautiful. At the same time, the plant fiber card obtained by hot pressing under this process condition has stable performance and long service life.

[0015] A further solution is that the wood softener in step S2 includes 10% to 20% acetic acid aqueous solution and sodium carbonate, wherein the mass ratio of the acetic acid aqueous solution to the sodium carbonate is (5 to 10):1; the wood hydrophobic agent includes butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane, and the mass ratio of butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane is 90:(1 to 3):(7 to 9); the emulsifier is selected from at least one of fatty acid soap, alkyl sulfate, phosphate, polyvinyl alcohol, and quaternary ammonium salt; the mass ratio of sawdust, wood softener, emulsifier, and wood hydrophobic agent is: 100:(10 to 20):(1 to 5):(5 to 15).

[0016] As can be seen from the above scheme, the sodium carbonate in the wood softener is alkaline and acetic acid is a weak acid. When the two substances come into contact with sawdust, they will react chemically with various chemical components in the wood. Alkaline sodium carbonate can neutralize acidic substances in sawdust, such as resin or tannin, thereby reducing the hardness and rigidity of sawdust and making it easier to process. Weakly acidic acetic acid can react with alkaline components in sawdust, affecting the structure of lignin and cellulose, making sawdust easier to soften and process. Using 10% to 20% acetic acid aqueous solution, the added water promotes the reaction of acetic acid, sodium carbonate and chemicals in sawdust, making it easier to process. Using perfluoroalkyl acrylate polymers and perfluoromethyl cyclopentane as wood hydrophobic agents has high hydrophobicity and very low surface tension. It is difficult for water molecules to pass through this hydrophobic layer to enter the interior of the plant fiber board, and at the same time, its molecular structure contains perfluorocarbon chains. These perfluorocarbon chains have extremely strong hydrophobicity, allowing these compounds to form a very dense and impermeable hydrophobic layer on the surface of the plant fiber board. This hydrophobic layer can effectively prevent water molecules from entering the interior of the plant fiberboard, thereby reducing the water absorption and humidity changes of the plant fiberboard, extending the service life of the plant fiberboard, and reducing the damage caused by the expansion of the plant fiberboard due to water absorption. At the same time, perfluoropolymers and perfluoro compounds have excellent weather resistance and chemical corrosion resistance, and can maintain their hydrophobic properties for a long time without being affected by the external environment. This enables them to protect the surface of the plant fiberboard from moisture and other harmful substances under various environmental conditions. Using butyl acetate as a solvent has better solubility. Sawdust, wood softener, emulsifier and wood hydrophobic agent can achieve better effects within this ratio range.

[0017] A further solution is that the particle size of the wood chips in step S1 is less than 3 mm; and the standing time in step S2 is 1 h to 3 h.

[0018] It can be seen from the above scheme that crushing the plant fiber raw material to a particle size below this size is conducive to the subsequent step reaction. Standing for a certain period of time ensures the effect of the wood softener and wood hydrophobic agent.

[0019] A further solution is that the drying time in step S3 is 2 h to 5 h, the drying temperature is 80° C. to 120° C., and the sieving mesh size is 20 mesh to 40 mesh.

[0020] A further solution is that in step S4, the hot melt adhesive powder is TPU powder, the mass ratio of wood powder to TPU powder is (4-9):1, the melting point of TPU powder is 150°C-170°C, and the melt index of TPU powder is 1ml / 10min-10ml / 10min.

[0021] A further solution is that in step S5, the mixed powder has a flattened density of 0.10 g / m 2 ~0.15g / m 2The pressing temperature is 150℃~170℃, the pressing pressure is 5MPa~10Mpa, and the pressing time is 10min~60min; the thickness of the plant fiber board is 0.7mm~1mm.

[0022] It can be seen from the above scheme that the TPU hot melt adhesive powder allows the wood powder to be formed, and the obtained plant fiber board has no organic volatile substances. The plant fiber card produced under the above process conditions has no harmful substances, good hand feel and long service life.

[0023] In order to achieve the third objective mentioned above, the present invention provides a plant fiber board, which is prepared by steps S1 to S5 of the method for preparing a plant fiber card described in any of the above schemes.

[0024] It can be seen from the above scheme that the plant fiber board has good antibacterial effect, no harmful substances volatilize, is environmentally friendly and safe, and can be applied to many fields such as smart card preparation.

[0025] In order to achieve the third purpose mentioned above, the present invention provides a plant fiber card, which is prepared by a preparation method of a plant fiber card described in any of the above schemes; the plant fiber card includes a plant fiber board layer, a TPU hot melt adhesive film, a chip layer and a plant fiber board layer arranged in sequence from top to bottom; the chip layer is cotton paper with a chip and a coil on one side and TPU hot melt adhesive attached to the other side, wherein the side with the chip and the coil is close to the TPU hot melt adhesive film.

[0026] It can be seen from the above scheme that the plant fiber content in the plant fiber card exceeds 80%, and there is almost no harmful organic volatiles. At the same time, it feels good and is more environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of a plant fiber card according to Example 1 of the present invention.

[0028] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0029] The present invention provides a method for preparing a plant fiber card, which comprises the following steps:

[0030] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm;

[0031] S2: Add wood softener to the crushed sawdust, stir thoroughly, then add emulsifier and wood hydrophobic agent, stir again and let stand for 1 to 3 hours to obtain mixed slag;

[0032] The wood softener comprises 10% to 20% acetic acid aqueous solution and sodium carbonate, wherein the mass ratio of the acetic acid aqueous solution to the sodium carbonate is (5 to 10):1; the wood hydrophobic agent comprises butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane, wherein the mass ratio of butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane is 90:(1 to 3):(7 to 9); the emulsifier is selected from at least one of fatty acid soap, alkyl sulfate, phosphate, polyvinyl alcohol, and quaternary ammonium salt; the mass ratio of sawdust, wood softener, emulsifier, and wood hydrophobic agent is: 100:(10 to 20):(1 to 5):(5 to 15);

[0033] S3: drying the mixed residue obtained in step S2, grinding it again after drying, and sieving it to obtain wood powder, the drying time is 2h to 5h, the drying temperature is 80°C to 120°C, and the sieving mesh number is 20 mesh to 40 mesh;

[0034] S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder, the hot melt adhesive powder may be TPU powder, the mass ratio of wood powder to TPU powder is (4-9):1, the melting point of TPU powder is 150° C.-170° C., and the melt index of TPU powder is 1 ml / 10 min-10 ml / 10 min;

[0035] S5: The mixed powder is evenly spread and pressed to obtain a plant fiber board, wherein the mixed powder has a spread density of 0.10 g / m 2 ~0.15g / m 2 , the pressing temperature is 150℃~170℃, the pressing pressure is 5MPa~10Mpa, and the pressing time is 10min~60min; the thickness of the plant fiber board is 0.7mm~1mm;

[0036] S6: applying a pressure of 10MPa to 15MPa and hot pressing at 110°C to 130°C for 10s to 30s to the plant fiber board and the chip layer to obtain a full-page card, and cutting the full-page card to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board;

[0037] The preparation method of the chip layer is as follows: hot melt adhesive is attached to one side of cotton paper, and ultrasonically winding a copper coil and fully automatically welding a chip on the other side of the cotton paper opposite to the hot melt adhesive to obtain the chip layer; wherein the weight of the cotton paper is 40g to 60g, the hot melt adhesive is TPU hot melt adhesive, the weight of the TPU hot melt adhesive is 60g to 100g, and the melt index of the TPU hot melt adhesive is 10ml / 10min to 20ml / 10min.

[0038] The 10% to 20% acetic acid aqueous solution, sodium carbonate, butyl acetate, perfluoroalkyl acrylate polymer, perfluoromethyl cyclopentane, emulsifier, TPU powder and TPU hot melt adhesive used in the method can all be purchased on the market.

[0039] Through steps S1 to S5 of the present invention, a plant fiber board with good antibacterial effect and environmental protection can be obtained.

[0040] The present invention will be further described below with reference to the embodiments.

[0041] Example 1

[0042] The preparation method of the plant fiber card provided in this embodiment comprises the following steps:

[0043] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm;

[0044] S2: Add wood softener to the crushed sawdust, stir thoroughly, then add emulsifier and wood hydrophobic agent, stir again and let stand for 1 to 3 hours to obtain mixed slag;

[0045] The wood softener comprises 10% to 20% acetic acid aqueous solution and sodium carbonate, wherein the mass ratio of the acetic acid aqueous solution to the sodium carbonate is (5 to 10):1; the wood hydrophobic agent comprises butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane, wherein the mass ratio of butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane is 90:(1 to 3):(7 to 9); the emulsifier is selected from at least one of fatty acid soap, alkyl sulfate, phosphate, polyvinyl alcohol, and quaternary ammonium salt; the mass ratio of sawdust, wood softener, emulsifier, and wood hydrophobic agent is 100:10:1:10;

[0046] S3: drying the mixed residue obtained in step S2, grinding it again after drying, and sieving it to obtain wood powder, the drying time is 3 hours, the drying temperature is 100° C., and the sieving mesh number is 40 mesh;

[0047] S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder, wherein the hot melt adhesive powder is TPU powder, the mass ratio of the wood powder to the TPU powder is 9:1, the melting point of the TPU powder is 160° C., and the melt index of the TPU powder is 2 ml / 10 min;

[0048] S5: The mixed powder is evenly spread and pressed to obtain a plant fiber board, wherein the mixed powder has a spread density of 0.10 g / m 2 ~0.15g / m 2, the pressing temperature is 150℃~170℃, the pressing pressure is 5MPa~10Mpa, and the pressing time is 10min~60min; the thickness of the plant fiber board is 0.7mm~1mm;

[0049] S6: applying a pressure of 10MPa to 15MPa and hot pressing at 110°C to 130°C for 10s to 30s to the plant fiber board and the chip layer to obtain a full-page card, and cutting the full-page card to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board;

[0050] The preparation method of the chip layer is as follows: attaching hot melt adhesive on one side of cotton paper, ultrasonically winding a copper coil and fully automatically welding a chip on the other side of the cotton paper opposite to the hot melt adhesive, so as to obtain the chip layer; wherein the weight of the cotton paper is 40g to 60g, the hot melt adhesive is TPU hot melt adhesive, the weight of the TPU hot melt adhesive is 60g to 100g, and the melting index of the TPU hot melt adhesive is 13ml / 10min.

[0051] See also Figure 1 The plant fiber card prepared in this embodiment includes a plant fiber board layer 1, a TPU hot melt adhesive film 2, a chip layer 3 and a plant fiber board layer 1 arranged in sequence from top to bottom; the chip layer 3 is a cotton paper with a chip and a coil on one side and a TPU hot melt adhesive on the other side, wherein the side with the chip and the coil is close to the TPU hot melt adhesive film 2.

[0052] Comparative Example 1

[0053] The preparation method of the plant fiber card provided in this comparative example comprises the following steps:

[0054] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm, wherein the plant fiber raw materials are the same as those used in Example 1;

[0055] S2: Continue grinding the sawdust until it passes through a 40-mesh sieve;

[0056] S3: mixing the wood powder obtained in step S2 with hot melt adhesive powder, wherein the hot melt adhesive powder is the same TPU powder as in Example 1, the mass ratio of the wood powder to the TPU powder is 9:1, the melting point of the TPU powder is 160° C., and the melt index of the TPU powder is 2 ml / 10 min;

[0057] S4: evenly paving the mixed powder and pressing it to obtain a plant fiber board, wherein the paving density of the mixed powder, the pressing temperature, the pressing pressure, the pressing time, and the thickness of the plant fiber board are the same as those in Example 1;

[0058] S5: The plant fiber board and the chip layer are hot pressed using the same pressure, temperature and time as in Example 1 to obtain a full-page card, and the full-page card is cut to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board, wherein the TPU hot melt adhesive film and the chip layer are the same as in Example 1.

[0059] Comparative Example 2

[0060] The preparation method of the plant fiber card provided in this comparative example comprises the following steps:

[0061] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm, wherein the plant fiber raw materials are the same as those used in Example 1;

[0062] S2: adding a wood softener to the crushed sawdust, stirring well, then adding an emulsifier and a wood hydrophobic agent, stirring well again and standing for 1 to 3 hours to obtain mixed slag, wherein the wood softener, the emulsifier and the wood hydrophobic agent are the same as those in Example 1, the mass ratio of the sawdust, the wood softener, the emulsifier and the wood hydrophobic agent is 100:10:1:10, and the standing time is the same as that in Example 1;

[0063] S3: After the mixed slag obtained in step S2 is naturally air-dried at room temperature of 20°C to 30°C for 24 hours, the sawdust is further ground until it passes through a 40-mesh sieve;

[0064] S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder, wherein the hot melt adhesive powder is the same TPU powder as in Example 1, the mass ratio of the wood powder to the TPU powder is 9:1, the melting point of the TPU powder is 160° C., and the melt index of the TPU powder is 2 ml / 10 min;

[0065] S5: evenly spreading the mixed powder and pressing to obtain a plant fiber board, wherein the mixed powder spreading density, pressing temperature, pressing pressure, pressing time, and thickness of the plant fiber board are the same as those in Example 1;

[0066] S6: The plant fiber board and the chip layer are hot pressed using the same pressure, temperature and time as in Example 1 to obtain a full-page card, and the full-page card is cut to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board, wherein the TPU hot melt adhesive film and the chip layer are the same as in Example 1.

[0067] Comparative Example 3

[0068] The preparation method of the plant fiber card provided in this comparative example comprises the following steps:

[0069] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm, wherein the plant fiber raw materials are the same as those used in Example 1;

[0070] S2: drying the crushed sawdust at 100°C for 3h;

[0071] S3: Mixing the wood chips dried in step S2 with hot melt adhesive powder, wherein the hot melt adhesive powder is the same TPU powder as in Example 1, the mass ratio of wood powder to TPU powder is 9:1, the melting point of TPU powder is 160° C., and the melt index of TPU powder is 2 ml / 10 min;

[0072] S4: evenly paving the mixed powder and pressing it to obtain a plant fiber board, wherein the paving density of the mixed powder, the pressing temperature, the pressing pressure, the pressing time, and the thickness of the plant fiber board are the same as those in Example 1;

[0073] S5: The plant fiber board and the chip layer are hot pressed using the same pressure, temperature and time as in Example 1 to obtain a full-page card, and the full-page card is cut to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board, wherein the TPU hot melt adhesive film and the chip layer are the same as in Example 1.

[0074] Comparative Example 4

[0075] S1: crushing plant fiber raw materials to obtain wood chips, the plant fiber raw materials can be selected from at least one of tree trunks, resins, straw, and stalks, and the particle size of the wood chips is less than 3 mm, wherein the plant fiber raw materials are the same as those used in Example 1;

[0076] S2: Continue grinding the sawdust until it passes through a 40-mesh sieve;

[0077] S3: mixing the wood powder obtained in step S2 with commercially available urea-formaldehyde glue;

[0078] S4: evenly spread the mixed powder, and press at 5 MPa for 1 h at room temperature to obtain a plant fiber board, wherein the mixed powder spread density and the thickness of the plant fiber board are the same as those in Example 1;

[0079] S5: The plant fiber board and the chip layer are hot pressed using the same pressure, temperature and time as in Example 1 to obtain a full-page card, and the full-page card is cut to obtain a plant fiber card, wherein the plant fiber board and the chip layer can be arranged from top to bottom in the order of plant fiber board, TPU hot melt adhesive film, chip layer, and plant fiber board, wherein the TPU hot melt adhesive film and the chip layer are the same as in Example 1.

[0080] The average range of the number of bacteria in the plant fiber boards prepared in Example 1 and Comparative Examples 1 to 4 was tested using [ISO 22196:2011 Measurement of antimicrobial activity of plastics and other non-porous surfaces], and the test results are shown in Table 1 below.

[0081] Under humid conditions of humidity>99% and temperature of 15°C to 25°C, 1000 copies of the plant fiber boards prepared in Example 1 and Comparative Examples 1 to 4 were prepared, each with an area of ​​1 m 2 , the proportion of the number of plant fiberboards with mildew spots to the total number was counted, and the test results are shown in Table 1 below.

[0082] The surfaces of the plant fiber cards prepared in Example 1 and Comparative Examples 1 to 4 were gently touched with fingers to feel their smoothness or roughness. The test results are shown in Table 1 below.

[0083] Table 1

[0084]

[0085] It can be seen from Table 1 that the plant fiber board prepared by the method of Example 1 has good antibacterial effect, and the plant fiber board has almost no harmful organic volatiles, and has a good hand feel and is more environmentally friendly. In Comparative Example 1, wood softener, wood hydrophobic agent and emulsifier were not added to the sawdust, and the sawdust was not dried. Although it was sterilized after a period of high-temperature treatment, the wood powder slowly heated up during the high-temperature pressing of the wood powder, and the local temperature could last for several minutes at the rapid growth temperature of fungi between 20°C and 40°C, resulting in local mildew spots. At the same time, the prepared plant fiber card had a bad feel. In Comparative Example 2, the fungi multiplied rapidly without drying, and local mildew spots appeared. In Comparative Example 3, the sawdust was not further refined, and wood softener, wood hydrophobic agent and emulsifier were not used. The fungi multiplied rapidly, and local mildew spots appeared. At the same time, the prepared plant fiber card had a bad feel. In Comparative Example 4, no high-temperature treatment was performed, no wood softener, wood hydrophobic agent and emulsifier were used, and adhesives and urea-formaldehyde glue were used. The obtained plant fiber board had many colonies and mildew spots, could not be used, had a poor feel, and had harmful substances volatilized.

[0086] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A method for preparing a plant fiber card, characterized in that: The following steps are involved: S1: crushing plant fiber raw materials to obtain wood chips; S2: adding a wood softener to the crushed sawdust, stirring evenly, and then adding an emulsifier and a wood hydrophobic agent, stirring evenly again and letting the mixture stand to obtain mixed slag, wherein the wood softener comprises 10% to 20% acetic acid aqueous solution and sodium carbonate, wherein the mass ratio of the acetic acid aqueous solution to the sodium carbonate is (5 to 10):1; S3: drying the mixed residue obtained in step S2, grinding it again after drying, and sieving it to obtain wood powder; S4: mixing the wood powder obtained in step S3 with hot melt adhesive powder; S5: evenly spread the mixed powder and press it to obtain a plant fiber board; S6: hot-pressing the plant fiber board and the chip layer to obtain a full-page card, and cutting the full-page card to obtain a plant fiber card.

2. The method for preparing a plant fiber card according to claim 1, characterized in that: The method for preparing the chip layer in step S6 is: Hot melt adhesive is attached to one side of the tissue paper, and ultrasonic copper coil winding and fully automatic chip welding are performed on the other side of the tissue paper opposite to the hot melt adhesive to obtain a chip layer; The weight of the tissue paper is 40g to 60g, the hot melt adhesive is TPU hot melt adhesive, the weight of the TPU hot melt adhesive is 60g to 100g, and the melt index of the TPU hot melt adhesive is 10ml / 10min to 20ml / 10min.

3. The method for preparing a plant fiber card according to claim 2, characterized in that: Step S6 is specifically as follows: The plant fiber board, the TPU hot melt adhesive film, the chip layer, and the plant fiber board are arranged from top to bottom, a pressure of 10MPa to 15MPa and hot pressing at 110°C to 130°C for 10s to 30s are used to obtain a full-page card, and the full-page card is cut to obtain a plant fiber card.

4. A method for preparing a plant fiber card according to claim 1 or 2, characterized in that: The wood hydrophobic agent in step S2 comprises butyl acetate, perfluoroalkyl acrylate polymer, and perfluoromethyl cyclopentane, and the mass ratio of the butyl acetate, the perfluoroalkyl acrylate polymer, and the perfluoromethyl cyclopentane is 90:(1-3):(7-9); The emulsifier is selected from at least one of fatty acid soap, alkyl sulfate, phosphate, polyvinyl alcohol, and quaternary ammonium salt; The mass ratio of the sawdust, the wood softener, the emulsifier and the wood hydrophobic agent is: 100: (10-20): (1-5): (5-15).

5. The method for preparing a plant fiber card according to claim 1 or 2, characterized in that: The particle size of the wood chips in step S1 is less than 3 mm; The standing time in step S2 is 1 h to 3 h.

6. A method for preparing a plant fiber card according to claim 1 or 2, characterized in that: The drying time of step S3 is 2h-5h, the drying temperature is 80°C-120°C, and the sieving mesh number is 20-40 mesh.

7. A method for preparing a plant fiber card according to claim 1 or 2, characterized in that: In step S4, the hot melt adhesive powder is TPU powder, the mass ratio of the wood powder to the TPU powder is (4-9):1, the melting point of the TPU powder is 150°C-170°C, and the melt index of the TPU powder is 1ml / 10min-10ml / 10min.

8. A method for preparing a plant fiber card according to claim 1 or 2, characterized in that: In step S5, the paving density of the mixed powder is 0.10g / m2~0.15g / m2, the pressing temperature is 150℃~170℃, the pressing pressure is 5MPa~10Mpa, and the pressing time is 10min~60min; the thickness of the plant fiber board is 0.7mm~1mm.

9. A plant fiber card, characterized in that: The plant fiber card is prepared by the method for preparing a plant fiber card according to any one of claims 1 to 8; The plant fiber card comprises a plant fiber board layer, a TPU hot melt adhesive film, a chip layer and a plant fiber board layer arranged in sequence from top to bottom; The chip layer is a cotton paper with a chip and a coil on one side and a TPU hot melt adhesive film attached to the other side, wherein the side with the chip and the coil is close to the TPU hot melt adhesive film.

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