Semiconductor packaging equipment with shielding and heat dissipation structure

Abstract

The invention relates to the field of semiconductor packaging, and discloses a semiconductor packaging device with a shielding and heat dissipation structure. In this scheme, shielding pads are laid on the inner surfaces of a shell body and a shell cover to reduce external interference and improve the working stability of a chip. A control mechanism is then used to connect a heat-conducting sleeve and a heat-conducting sheet. The heat-conducting sleeve can transfer the heat generated by the chip to the control mechanism, and finally the heat-conducting column is used to conduct the heat. This facilitates the heat conduction in a protective shell and reduces the interference caused by the heat of the chip itself. At the same time, the heat-conducting sleeve and the heat-conducting column are connected by using a control mechanism. When the temperature in the protective shell is normal and stable, the heat-conducting area is small and the heat conduction is slow. This can provide a reasonable working temperature for the chip, and avoid the external temperature being too low, which causes the operation of the chip to be affected by the low temperature. When the temperature in the protective shell is too high, the heat-conducting area becomes larger, and the heat-conducting speed is accelerated, which can avoid the chip being affected by the high temperature.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a semiconductor packaging device with a shielding and heat dissipation structure. Background Art

[0002] Semiconductor packaging is a layer of resin shell wrapped around the outside of the semiconductor chip. The semiconductor chip and external components are connected through the pins outside the shell. This can play a good role in protecting the semiconductor chip, preventing the semiconductor chip from being damaged, and making it easier to store, assemble and use;

[0003] Semiconductor chips are mostly soldered or plugged into circuit boards for use. When the circuit board is powered on, the heat generated by the semiconductor chip itself and the electromagnetic waves generated by other components on the circuit board will affect the performance of the semiconductor chip. In order to keep the performance of the semiconductor chip stable, we proposed a semiconductor packaging device with a shielding and heat dissipation structure to solve the problem. Summary of the invention

[0004] 1. Technical problems to be solved

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a semiconductor packaging device with a shielding and heat dissipation structure. In this scheme, shielding pads are laid on the inner surfaces of the shell body and the shell cover, so that the shell body and the shell cover can form a barrier to isolate the entry of external electromagnetic waves, reduce external interference, and improve the stability of chip operation. The inside and outside of the protective shell are connected by a thermally conductive column, and the thermally conductive sleeve and the thermally conductive sheet are connected by a control mechanism. In this way, the thermally conductive sleeve can transfer the heat generated by the chip to the control mechanism, and the control mechanism then transfers the heat to the thermally conductive column for output. This makes it convenient to output the heat in the protective shell and reduces the interference caused by the chip's own heat. By using the control mechanism The control mechanism is used to connect the heat-conducting sleeve and the heat-conducting column. When the temperature inside the protective shell is normal and stable, the heat-conducting sleeve transfers the heat emitted by the chip to the transfer plate. The heat is quickly transferred to the entire transfer plate, as well as the epitaxial wafer and the mounting sleeve. At this time, the first energy output surface and the second energy output surface of the transfer plate are only in contact with the heat-conducting plate in a small area, and the heat conduction is slow. This can provide a reasonable operating temperature for the chip to avoid the external temperature being too low, which causes the chip to be affected by the low temperature. When the temperature inside the protective shell is too high, the thermal control mechanism drives the epitaxial wafer and the transfer plate to deflect, so that the contact area between the first energy output surface and the second energy output surface of the transfer plate and the heat-conducting plate is increased, so that the heat conduction speed is accelerated, and the chip can be prevented from being affected by high temperature.

[0006] 2. Technical solution

[0007] To solve the above problems, the present invention adopts the following technical solutions.

[0008] A semiconductor packaging device with a shielding and heat dissipation structure comprises a shell body, a shell cover is buckled on the top of the shell body, pins penetrating the shell body are embedded on the outer side of the shell body, a chip is installed inside the shell body, the chip is connected to the pins by electrical signals, the shell body and the shell cover form a protective shell, the inner wall of the shell body and the bottom wall of the shell cover are paved with a layer of shielding pad, the shielding pad is made of soft magnetic material, a heat conduction mechanism is arranged in the protective shell formed by the shell body and the shell cover, the heat conduction mechanism comprises heat conduction columns penetrating the shell body, the shell cover and the shielding pad respectively, the heat conduction columns are evenly distributed in an array on the surface of the shell body and the shell cover, a heat conduction sheet is fixedly connected to one side of the heat conduction column located in the shell body, the heat conduction mechanism also comprises a heat conduction sleeve buckled above the chip, the heat conduction sleeve can make the heat of the chip dissipate more evenly through good thermal conductivity, a control mechanism is arranged between the heat conduction column and the heat conduction sleeve, and the heat conduction sleeve and two heat conduction The surfaces of the sheets are all arc-shaped, and the extended surfaces of the arc surfaces of the two heat-conducting sheets overlap, the control mechanism completely overlaps with the heat-conducting sleeve, and the control mechanism overlaps with the heat-conducting sheet in a staggered manner. The control mechanism includes a thermal control mechanism, and the heat-conducting sleeve, the heat-conducting sheet, the heat-conducting column and the control mechanism are all made of heat-conducting materials, and the heat-conducting material can be copper or aluminum; by laying a shielding pad on the inner surface of the shell body and the shell cover, the shell body and the shell cover can form a barrier to isolate the entry of external electromagnetic waves, reduce external interference, and improve the stability of chip operation, and the inside and outside of the protective shell are connected by the heat-conducting column, and then the control mechanism is used to connect the heat-conducting sleeve and the heat-conducting sheet, so that the heat-conducting sleeve can transfer the heat generated by the chip to the control mechanism, and the control mechanism then transfers the heat to the heat-conducting column for output, which facilitates the output of heat in the protective shell and reduces the interference caused by the chip's own heat.

[0009] Furthermore, a card slot is provided on the top of the shell body, and a key that engages with the card slot is fixedly connected to the bottom of the shell cover. In this way, when a fault occurs, the shell body and the shell cover can be separated first to observe whether the chip and the pins are in poor contact, and a response plan can be quickly made (if the chip and the pins are in poor contact, just re-soldering is sufficient; if there is no problem with the chip and the pins, then it is a problem with the chip itself and the component needs to be replaced).

[0010] Furthermore, the heat-conducting column is composed of a column body and a column cap. The diameter of the column cap is larger than the column body, and the column cap protrudes from the outer surfaces of the shell body and the shell cover, thereby increasing the heat dissipation area and accelerating the heat dissipation speed.

[0011] Furthermore, a collecting groove is provided at the protruding end of the column cap on the shell cover surface, and a ventilation hole extending to the side of the column cap is provided on the inner wall of the collecting groove. The opening of the ventilation hole is exposed to the outside of the shell cover, so that the air in the ventilation hole absorbs the heat of the column cap, floats upward and flows out of the collecting groove, while the air on the outside of the column cap will flow in from the bottom of the ventilation hole for replenishment, thus forming a circulation, further increasing the heat dissipation area and improving the heat dissipation speed.

[0012] Furthermore, the space enclosed by the shell body and the shell cover is a vacuum environment, which can prevent the chip from being rapidly oxidized in a high temperature environment and extend its service life.

[0013] Furthermore, the control mechanism also includes a support column fixedly connected to the inner bottom wall surface of the shell body, the support columns are distributed at the four corners of the shell body, and mounting rods are fixedly connected between adjacent support columns. The outer side of the mounting rod is rotatably connected to an array-distributed mounting sleeve, the outer side of the mounting sleeve is fixedly connected to an epitaxial wafer, the compression spring is set to be hollow, and the inside is filled with pressurized gas, and the other end of the epitaxial wafer is fixedly connected to a transfer sheet, the transfer sheet is arc-shaped, and three convex surfaces and two concave surfaces are staggered on the arc surface, the three convex surfaces are divided into an energy input surface, a first energy output surface and a second energy output surface, the energy input surface is completely fitted with the heat conductive sleeve, and the first energy output surface and the second energy output surface are respectively staggered and fitted with their corresponding heat conductive sheets, by using The control mechanism is used to connect the heat-conducting sleeve and the heat-conducting column. When the temperature inside the protective shell is normal and stable, the heat-conducting sleeve transfers the heat emitted by the chip to the transfer plate. The heat is quickly transferred to the entire transfer plate, as well as the epitaxial wafer and the mounting sleeve. At this time, the first energy output surface and the second energy output surface of the transfer plate are in contact with the heat-conducting plate in a small area, and the heat conduction is slow. This can provide a reasonable operating temperature for the chip to avoid the external temperature being too low, which causes the chip to be affected by the low temperature. When the temperature inside the protective shell is too high, the thermal control mechanism drives the epitaxial wafer and the transfer plate to deflect, so that the contact area between the first energy output surface and the second energy output surface of the transfer plate and the heat-conducting plate is increased, thereby accelerating the heat conduction speed and preventing the chip from being affected by high temperature.

[0014] Furthermore, the thermal control mechanism specifically includes a shrinkage groove opened on the surface of the mounting rod, and a compression spring is arranged between the shrinkage groove and the mounting sleeve. The compression spring is arranged to be hollow and filled with pressurized gas. When the temperature rises, the compression spring expands and becomes longer due to the heat, pushing the transfer plate to rotate with the mounting rod as the center. In this state, the thermal control mechanism responds sensitively and quickly, and the compression spring has a long continuous working time.

[0015] Furthermore, the energy input surface length of the transfer plate is smaller than the arc surface length of the thermal sleeve, and the first energy output surface and the second energy output surface length of the transfer plate are the same as the arc surface length of the thermal sleeve. In this way, the energy input surface of the transfer plate can always maintain maximum contact with the thermal sleeve, making the heat dissipation effect more stable.

[0016] Furthermore, the number of epitaxial wafers is not less than three, and they are evenly spaced apart from each other. The arc surfaces of the heat-conducting sleeve and the heat-conducting sheet are centered on the mounting rod, so that heat can be directly and evenly distributed on the energy input surface, the first energy output surface, the second energy output surface and the mounting sleeve.

[0017] Furthermore, the number of epitaxial wafers is one, and the thermal control mechanism specifically includes metal sheets fixedly embedded in the surfaces of both sides of the epitaxial wafer, and the two metal sheets have different thermal expansion coefficients, the arc surfaces of the heat-conducting sleeve and the heat-conducting sheet are centered on the connection point of the epitaxial wafer and the mounting sleeve, the epitaxial wafer and the transfer sheet are elastically connected, and the first energy output surface and the second energy output surface are elastically squeezed into contact with the thermally conductive sheet, so that when the temperature rises, the two metal sheets deform due to the different thermal expansion coefficients of the two metal sheets, the two metal sheets bend the epitaxial wafer and the transfer sheet deflects. In this state, the thermal control mechanism is more stable.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] 1. This solution lays shielding pads on the inner surfaces of the shell body and the shell cover, so that the shell body and the shell cover can form a barrier to isolate the entry of external electromagnetic waves, reduce external interference, and improve the stability of chip operation. The inside and outside of the protective shell are connected by thermal conductive columns, and the control mechanism is used to connect the thermal conductive sleeve and the thermal conductive sheet. In this way, the thermal conductive sleeve can transfer the heat generated by the chip to the control mechanism, and the control mechanism transfers the heat to the thermal conductive column for output. This facilitates the output of heat from the protective shell and reduces the interference caused by the chip's own heat.

[0021] 2. There is a card slot on the top of the shell body, and a key that engages with the card slot is fixedly connected to the bottom of the shell cover. In this way, when a fault occurs, you can first separate the shell body and the shell cover to observe whether the chip and pins have poor contact, and quickly make a response plan (if the chip and pins have poor contact, you only need to re-solder them. If there is no problem with the chip and pins, it is a problem with the chip itself and the component needs to be replaced).

[0022] 3. A collecting groove is provided at the protruding end of the column cap on the shell cover surface, and a ventilation hole extending to the side of the column cap is provided on the inner wall of the collecting groove. The opening of the ventilation hole is exposed to the outside of the shell cover, so that the air in the ventilation hole absorbs the heat of the column cap, floats upward and flows out of the collecting groove, while the air on the outside of the column cap will flow in from the bottom of the ventilation hole for replenishment, thus forming a circulation, further increasing the heat dissipation area and improving the heat dissipation speed.

[0023] 4. By using a control mechanism to connect the thermal sleeve and the thermal column, when the temperature inside the protective shell is normal and stable, the thermal sleeve transfers the heat emitted by the chip to the transfer plate, and the heat is quickly transferred to the entire transfer plate, as well as the epitaxial wafer and the mounting sleeve. At this time, the first energy output surface and the second energy output surface of the transfer plate are only in contact with the thermal conductive plate in a small area, and the heat conduction is slow. This can provide a reasonable operating temperature for the chip to avoid the external temperature being too low, causing the chip to be affected by the low temperature. When the temperature inside the protective shell is too high, the thermal control mechanism drives the epitaxial wafer and the transfer plate to deflect, so that the contact area between the first energy output surface and the second energy output surface of the transfer plate and the thermal conductive plate is increased, so that the heat conduction speed is accelerated, and the chip can be prevented from being affected by high temperature.

[0024] 5. The thermal control mechanism specifically includes a shrinkage groove opened on the surface of the mounting rod. A compression spring is arranged between the shrinkage groove and the mounting sleeve. The compression spring is arranged to be hollow and filled with pressurized gas. When the temperature rises, the compression spring expands and becomes longer due to the heat, pushing the transfer plate to rotate with the mounting rod as the center. In this state, the thermal control mechanism responds sensitively and quickly, and the compression spring has a long continuous working time.

[0025] 6. There is one epitaxial wafer, and the thermal control mechanism specifically includes metal sheets fixedly embedded in the surfaces of both sides of the epitaxial wafer, and the two metal sheets have different thermal expansion coefficients. The arc surfaces of the heat-conducting sleeve and the heat-conducting sheet take the connecting point of the epitaxial wafer and the mounting sleeve as the center of the circle. The epitaxial wafer and the transfer sheet are elastically connected, and the first energy output surface and the second energy output surface are elastically squeezed into contact with the thermally conductive sheet. In this way, when the temperature rises, the two metal sheets deform due to the different thermal expansion coefficients of the two metal sheets, the epitaxial wafer is bent by the two metal sheets, and the transfer sheet is deflected. In this state, the thermal control mechanism is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an overall display diagram of the present invention;

[0027] Figure 2 This is a top view of the present invention after disassembly;

[0028] Figure 3 This is a bottom observation diagram after the present invention is disassembled;

[0029] Figure 4 It is a diagram showing the heat-conducting column of the present invention;

[0030] Figure 5 This is a diagram showing the interior of the shell of the present invention;

[0031] Figure 6 A half-section view of the shell cover of the present invention;

[0032] Figure 7 This is a state diagram of the control mechanism of the present invention at low temperature;

[0033] Figure 8 This is a state diagram of the control mechanism of the present invention at high temperature;

[0034] Fig. 9 A diagram showing the control mechanism of the multi-epitaxial wafer of the present invention;

[0035] Fig.10 This is a diagram showing the control mechanism of a single epitaxial wafer of the present invention.

[0036] Description of the numbers in the figure:

[0037] 1. Shell body; 11. Card slot; 2. Shell cover; 21. Card key; 3. Pin; 4. Chip; 5. Shielding pad; 6. Heat conduction mechanism; 61. Heat conduction column; 611. Column body; 612. Column cap; 613. Ventilation hole; 614. Collecting groove; 62. Heat conduction sheet; 63. Heat conduction sleeve; 7. Control mechanism; 71. Support column; 72. Mounting rod; 73. Mounting sleeve; 74. Epitaxial wafer; 75. Transfer sheet; 76. Shrinkage groove; 77. Compression spring. DETAILED DESCRIPTION

[0038] This embodiment will be combined with the disclosed drawings to clearly and completely describe the technical solution, so that the purpose, technical solution and beneficial effects of the embodiment of the present disclosure are clearer. Obviously, the described embodiment is a part of the embodiment of the present disclosure, not all of the embodiments. Based on the described embodiment of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0039] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be the conventional meanings understood by the technical personnel to whom the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Up", "down", "inside", "outside" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] Embodiment 1:

[0041] See also Figures 1 to 6A semiconductor packaging device with a shielding and heat dissipation structure includes a shell body 1, a shell cover 2 is buckled on the top of the shell body 1, a pin 3 penetrating the shell body 1 is embedded on the outer side of the shell body 1, a chip 4 is installed inside the shell body 1, the chip 4 is connected to the pin 3 by electrical signals, the shell body 1 and the shell cover 2 are grouped into a protective shell, a card slot 11 is opened on the top of the shell body 1, and a card key 21 engaged with the card slot 11 is fixedly connected to the bottom of the shell cover 2. In this way, when a fault occurs, the shell body 1 and the shell cover 2 can be separated first to observe whether the chip 4 and the pin 3 are in poor contact, and a response plan can be quickly made (if the chip 4 and the pin 3 are in poor contact, it only needs to be re-welded. If there is no problem with the chip 4 and the pin 3, it is a problem with the chip 4 itself and the component needs to be replaced).

[0042] The inner wall of the shell body 1 and the bottom wall of the shell cover 2 are both paved with a layer of shielding pad 5, and the shielding pad 5 is made of soft magnetic material. A heat-conducting mechanism 6 is arranged in the protective shell surrounded by the shell body 1 and the shell cover 2, and the heat-conducting mechanism 6 includes heat-conducting columns 61 respectively penetrating the shell body 1, the shell cover 2 and the shielding pad 5, and the heat-conducting columns 61 are evenly distributed in an array on the surface of the shell body 1 and the shell cover 2. A heat-conducting sheet 62 is fixedly connected to one side of the heat-conducting column 61 located in the shell body 1. The heat-conducting mechanism 6 also includes a heat-conducting sleeve 63 that is buckled on top of the chip 4. The heat-conducting sleeve 63 can make the heat dissipation of the chip 4 more uniform through good thermal conductivity. A control mechanism 7 is arranged between the heat-conducting column 61 and the heat-conducting sleeve 63. The surfaces of the heat-conducting sleeve 63 and the two heat-conducting sheets 62 are both arc-shaped, and the extended surfaces of the arc-shaped surfaces of the two heat-conducting sheets 62 overlap, and the control mechanism 7 completely overlaps the heat-conducting sleeve 63. The control mechanism 7 and the heat conducting sheet 62 are offset and overlapped. The control mechanism 7 includes a thermal control mechanism, and the heat conducting sleeve 63, the heat conducting sheet 62, the heat conducting column 61 and the control mechanism 7 are all made of heat conducting materials, and the heat conducting material can be copper or aluminum. By laying a shielding pad 5 on the inner surface of the shell body 1 and the shell cover 2, the shell body 1 and the shell cover 2 can form a barrier to isolate the entry of external electromagnetic waves, reduce external interference, and improve the working stability of the chip 4. The heat conducting column 61 is used to connect the inside and outside of the protective shell, and then the control mechanism 7 is used to connect the heat conducting sleeve 63 and the heat conducting sheet 62. In this way, the heat conducting sleeve 63 can transfer the heat generated by the chip 4 to the control mechanism 7, and the control mechanism 7 then transfers the heat to the heat conducting column 61 for output, which facilitates the output of the heat in the protective shell and reduces the interference caused by the heat of the chip 4 itself.

[0043] The heat-conducting column 61 is composed of a column body 611 and a column cap 612. The diameter of the column cap 612 is larger than that of the column body 611. The column cap 612 protrudes from the outer surface of the shell body 1 and the shell cover 2, thereby increasing the heat dissipation area and accelerating the heat dissipation speed. A collecting groove 614 is provided at the protruding end of the column cap 612 on the surface of the shell cover 2. A ventilation hole 613 extending to the side of the column cap 612 is provided on the inner wall of the collecting groove 614. The opening of the ventilation hole 613 is exposed to the outside of the shell cover 2. In this way, after the air in the ventilation hole 613 absorbs the heat of the column cap 612, it floats upward and flows out of the collecting groove 614, and the air outside the column cap 612 will flow in from the bottom of the ventilation hole 613 for replenishment, thus forming a cycle, further increasing the heat dissipation area and improving the heat dissipation speed.

[0044] See also Figures 1 to 10 The space surrounded by the shell body 1 and the shell cover 2 is a vacuum environment, which can prevent the chip 4 from oxidizing rapidly in a high temperature environment and extend its service life. The control mechanism 7 also includes a support column 71 fixedly connected to the inner bottom wall surface of the shell body 1, and the support columns 71 are distributed at the four corners of the shell body 1. A mounting rod 72 is fixedly connected between adjacent support columns 71, and an array-distributed mounting sleeve 73 is rotatably connected to the outer side of the mounting rod 72. An epitaxial wafer 74 is fixedly connected to the outer side of the mounting sleeve 73. The compression spring 77 is set to be hollow and filled with pressurized gas. A transfer sheet 75 is fixedly connected to the other end of the epitaxial wafer 74. The transfer sheet 75 is arc-shaped, and three convex surfaces and two concave surfaces are arranged on the arc surface in an alternating manner. The three convex surfaces are divided into an energy entry surface, a first energy exit surface, and a second energy exit surface. The energy entry surface is completely fitted with the heat conductive sleeve 63, and the first energy exit surface and the second energy exit surface are completely fitted with the heat conductive sleeve 63. They are respectively staggered and fitted with their corresponding heat conducting sheets 62, and the heat conducting sleeve 63 and the heat conducting column 61 are connected by using the control mechanism 7. When the temperature inside the protective shell is normal and stable, the heat conducting sleeve 63 transfers the heat emitted by the chip 4 to the transfer sheet 75, and the heat is quickly transferred to the entire transfer sheet 75, as well as the epitaxial wafer 74 and the mounting sleeve 73. At this time, the first energy output surface and the second energy output surface of the transfer sheet 75 are only in contact with the heat conducting sheet 62 in a small area, and the heat conduction is slow. This can provide a reasonable operating temperature for the chip 4 to avoid the external temperature being too low, which causes the operation of the chip 4 to be affected by the low temperature. When the temperature inside the protective shell is too high, the thermal control mechanism drives the epitaxial wafer 74 and the transfer sheet 75 to deflect, so that the contact area between the first energy output surface and the second energy output surface of the transfer sheet 75 and the heat conducting sheet 62 is increased, so that the heat conduction speed is accelerated, and the chip 4 can be prevented from being affected by high temperature.

[0045] Example 2

[0046] The thermal control mechanism specifically includes a contraction groove 76 opened on the surface of the mounting rod 72. A compression spring 77 is arranged between the contraction groove 76 and the mounting sleeve 73. The compression spring 77 is arranged to be hollow and filled with pressurized gas. When the temperature rises, the compression spring 77 expands and becomes longer due to the heat, pushing the transfer plate 75 to rotate with the mounting rod 72 as the center. In this state, the thermal control mechanism responds sensitively and quickly, and the compression spring 77 has a long continuous working time.

[0047] The length of the energy input surface of the transfer sheet 75 is smaller than the length of the arc surface of the heat conductive sleeve 63. The length of the first energy output surface and the second energy output surface of the transfer sheet 75 are the same as the length of the arc surface of the heat conductive sheet 62. In this way, the energy input surface of the transfer sheet 75 can always maintain maximum contact with the heat conductive sleeve 63, making the heat dissipation effect more stable. The number of epitaxial sheets 74 is not less than three, and they are evenly spaced from each other. The arc surfaces of the heat conductive sleeve 63 and the heat conductive sheet 62 are both centered on the mounting rod 72. In this way, heat can be directly and evenly distributed on the energy input surface, the first energy output surface, the second energy output surface and the mounting sleeve 73.

[0048] Example 3

[0049] There is one epitaxial wafer 74, and the thermal control mechanism specifically includes metal sheets fixedly embedded in the surfaces of both sides of the epitaxial wafer 74, and the two metal sheets have different thermal expansion coefficients. The arc surfaces of the heat-conducting sleeve 63 and the heat-conducting sheet 62 take the connection point between the epitaxial wafer 74 and the mounting sleeve 73 as the center of the circle. The epitaxial wafer 74 and the transfer sheet 75 are elastically connected, and the first energy output surface and the second energy output surface are elastically squeezed into contact with the heat-conducting sheet 62. In this way, when the temperature rises, the two metal sheets deform due to the different thermal expansion coefficients of the two metal sheets, causing the two metal sheets to bend the epitaxial wafer 74 and the transfer sheet 75 to deflect.

[0050] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor packaging device with a shielding and heat dissipation structure, comprising a shell body (1), a shell cover (2) being buckled on the top of the shell body (1), pins (3) penetrating the shell body (1) being embedded on the outer side of the shell body (1), a chip (4) being installed inside the shell body (1), the chip (4) being electrically connected to the pins (3), characterized in that: The inner wall of the shell body (1) and the bottom wall of the shell cover (2) are both paved with a layer of shielding pad (5); a heat conducting mechanism (6) is arranged in the space enclosed by the shell body (1) and the shell cover (2); the heat conducting mechanism (6) comprises heat conducting columns (61) respectively penetrating the shell body (1), the shell cover (2) and the shielding pad (5); the heat conducting columns (61) are evenly distributed in an array on the surface of the shell body (1) and the shell cover (2); one side of the heat conducting columns (61) located in the shell body (1) is fixedly connected to a heat conducting sheet (62) ), the heat-conducting mechanism (6) further comprises a heat-conducting sleeve (63) buckled on the top of the chip (4), a control mechanism (7) is arranged between the heat-conducting column (61) and the heat-conducting sleeve (63), the surfaces of the heat-conducting sleeve (63) and the two heat-conducting sheets (62) are both arc-shaped, and the extended surfaces of the arc-shaped surfaces of the two heat-conducting sheets (62) overlap, the control mechanism (7) completely overlaps with the heat-conducting sleeve (63), the control mechanism (7) overlaps with the heat-conducting sheets (62) in a staggered manner, and the control mechanism (7) comprises a thermal control mechanism; The space enclosed by the shell body (1) and the shell cover (2) is a vacuum environment. The control mechanism (7) further comprises a support column (71) fixedly connected to the inner bottom wall surface of the shell body (1). The support columns (71) are distributed at four corners of the shell body (1). Adjacent support columns (71) are fixedly connected with mounting rods (72). The outer sides of the mounting rods (72) are rotatably connected with mounting sleeves (73) distributed in an array. The outer sides of the mounting sleeves (73) are fixedly connected with epitaxial wafers (74). The other end of the extension sheet (74) is fixedly connected with a transfer sheet (75), the transfer sheet (75) is arc-shaped, and three convex surfaces and two concave surfaces are arranged on the arc surface, the three convex surfaces are divided into an energy entry surface, a first energy exit surface and a second energy exit surface, the energy entry surface is completely fitted with the heat conduction sleeve (63), the first energy exit surface and the second energy exit surface are respectively fitted with the corresponding heat conduction sheet (62) in a staggered manner, and the thermal control mechanism specifically includes a shrinkage groove (76) provided on the surface of the mounting rod (72), the shrinkage groove (76) A compression spring (77) is arranged between the mounting sleeve (73), the compression spring (77) is arranged to be hollow and filled with pressurized gas, the energy input surface length of the transfer sheet (75) is less than the arc surface length of the heat-conducting sleeve (63), the first energy output surface and the second energy output surface length of the transfer sheet (75) are the same as the arc surface length of the heat-conducting sheet (62), the number of the epitaxial sheets (74) is not less than three, and they are evenly spaced from each other, and the arc surfaces of the heat-conducting sleeve (63) and the heat-conducting sheet (62) are both The mounting rod (72) is the center of the circle. The number of the epitaxial wafer (74) is one. The thermal control mechanism specifically includes metal sheets fixedly embedded in the surfaces of both sides of the epitaxial wafer (74), and the two metal sheets have different thermal expansion coefficients. The arc surfaces of the heat-conducting sleeve (63) and the heat-conducting sheet (62) are the connection points of the epitaxial wafer (74) and the mounting sleeve (73) as the center of the circle. The epitaxial wafer (74) and the transfer sheet (75) are elastically connected, and the first energy output surface and the second energy output surface are in elastic extrusion contact with the heat-conducting sheet (62).

2. The semiconductor packaging device with a shielding and heat dissipation structure according to claim 1, characterized in that: The top of the shell body (1) is provided with a slot (11), and the bottom of the shell cover (2) is fixedly connected with a key (21) engaged with the slot (11).

3. The semiconductor packaging device with shielding and heat dissipation structure according to claim 1, characterized in that: The heat-conducting column (61) is composed of a column body (611) and a column cap (612); the diameter of the column cap (612) is larger than that of the column body (611); and the column cap (612) protrudes from the outer surfaces of the shell body (1) and the shell cover (2).

4. The semiconductor packaging device with shielding and heat dissipation structure according to claim 3, characterized in that: A collecting groove (614) is provided at a protruding end of the column cap (612) on the surface of the shell cover (2), and a ventilation hole (613) extending to the side of the column cap (612) is provided on the inner wall of the collecting groove (614), and the opening of the ventilation hole (613) is exposed to the outside of the shell cover (2).

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