Composite copper foil integrated production device and production method

Abstract

The application relates to the technical field of composite copper foil, in particular to a composite copper foil integrated production device and a production method.The composite copper foil integrated production device comprises a vacuum container, a first rotary winding assembly, a second rotary winding assembly, a first sputtering film coating assembly and a second sputtering film coating assembly which are arranged in the vacuum container respectively; through the above mode, the first sputtering source mechanism is made to be close to / distant from the film coating winding mechanism and the second sputtering source mechanism is made to be distant from / close to the film coating winding mechanism through the telescopic adjusting part, the magnetron sputtering of the activation layer and the copper layer is sequentially carried out in the same vacuum container, meanwhile, the third sputtering source mechanism and the fourth sputtering source mechanism are staggered and spaced, an anti-oxidation layer is formed on the surface of the composite copper foil after the copper layer is sputtered, the plating of the activation layer, the copper layer and the anti-oxidation layer is carried out in the same vacuum container, the organic thin film does not need to be switched back and forth among three different magnetron sputtering devices, and the production efficiency and the copper plating quality are improved.

Description

Technical Field

[0001] This application relates to the field of composite copper foil technology, and in particular to an integrated production apparatus and method for composite copper foil. Background Technology

[0002] Currently, to improve battery safety, composite copper foil is used to prepare the negative electrode current collector. This composite copper foil consists of an organic thin film layer with heat-shrinkable properties and copper layers formed on both surfaces of the organic thin film layer. The organic thin film layer and the two copper layers form a sandwich structure. When the battery is subjected to impact deformation, a high temperature is instantly generated at the short-circuit point between the electrodes. The organic thin film layer instantly contracts, pulling the electrode sheet back to achieve electrode separation. Composite copper foil typically uses vacuum sputtering to deposit copper layers on both sides of the organic thin film layer. To improve the coating effect, the organic thin film layer needs pretreatment, and an activation layer is deposited on both surfaces of the organic thin film layer using magnetron sputtering. Furthermore, after the copper layer is deposited, an anti-oxidation layer needs to be formed on the copper layer surface to prevent changes in thickness and resistance caused by oxidation. During the production process of composite copper foil, because different sputtering sources are used for multiple magnetron sputtering processes, it is necessary to switch back and forth between multiple magnetron sputtering coating devices. This requires reinstalling the organic thin film layer, and the above installation process cannot be carried out in a vacuum environment, which is detrimental to improving production efficiency and copper plating quality. Summary of the Invention

[0003] In view of the above problems, this application provides an integrated production apparatus and method for composite copper foil to solve the above technical problems.

[0004] In a first aspect, embodiments of this application provide an integrated production apparatus for composite copper foil, including a vacuum container, a first rotary winding assembly and a second rotary winding assembly respectively disposed within the vacuum container, and a first sputtering coating assembly and a second sputtering coating assembly respectively disposed within the vacuum container.

[0005] The first rotary winding assembly includes a first take-up and unwinding mechanism, a first coating winding mechanism, and a second take-up and unwinding mechanism, wherein the first coating winding mechanism includes at least one coating roller.

[0006] The second rotary winding assembly includes a guiding mechanism, a second coating winding mechanism, and a winding mechanism, wherein the second coating winding mechanism includes at least one coating roller;

[0007] The first sputtering coating assembly includes multiple support mechanisms and multiple sputtering source mechanisms respectively disposed on the multiple support mechanisms; each support mechanism includes an arc-shaped fixing part for mounting the sputtering source mechanism and a telescopic adjustment part for supporting the arc-shaped fixing part, the telescopic adjustment part being used to adjust the distance between the sputtering source mechanism and the coating roller; the multiple sputtering source mechanisms include a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the first coating winding mechanism;

[0008] The second sputtering coating assembly includes a plurality of third sputtering source mechanisms and a plurality of fourth sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the second coating winding mechanism.

[0009] Optionally, the first winding and unwinding mechanism and the second winding and unwinding mechanism are arranged symmetrically at the center. The first coating winding mechanism includes a first coating roller and a second coating roller arranged symmetrically at the center. The second coating winding mechanism includes a third coating roller and a fourth coating roller disposed between the guiding mechanism and the winding mechanism.

[0010] Optionally, the telescopic adjustment part includes an adjustment cylinder disposed in the vacuum container and a fixing rod connected to the arc-shaped fixing part, the fixing rod being connected to the piston rod of the adjustment cylinder.

[0011] Optionally, the integrated composite copper foil production apparatus further includes a first pulse sputtering power supply electrically connected to the first sputtering source mechanism and a second pulse sputtering power supply electrically connected to the second sputtering source mechanism; the integrated composite copper foil production apparatus further includes a first gas flow controller and a second gas flow controller.

[0012] Optionally, the integrated composite copper foil production apparatus further includes a third pulse sputtering power supply electrically connected to the third sputtering source mechanism and a fourth pulse sputtering power supply electrically connected to the fourth sputtering source mechanism.

[0013] Optionally, the vacuum container includes a shell and a fixing plate covering the shell, the shell and the fixing plate forming a vacuum cavity, the rotary winding assembly further includes a fixing frame disposed on the fixing plate, the first winding and unwinding mechanism, the coating winding mechanism and the second winding and unwinding mechanism are respectively disposed on the fixing frame; the cylinder body of the adjusting cylinder is disposed at the bottom of the vacuum cavity.

[0014] Optionally, the vacuum container further includes a first slider mechanism disposed at the bottom of the fixed plate and a second slider mechanism disposed at the bottom of the housing;

[0015] The integrated production device for composite copper foil also includes a guide rail assembly, wherein the first slider mechanism and the second slider mechanism are respectively slidably engaged with the guide rail assembly.

[0016] Optionally, the vacuum container further includes a sealing mechanism, which includes a first magnetic attraction portion disposed on the fixed plate, a first sealing portion disposed on the first magnetic attraction portion, a second magnetic attraction portion disposed on the housing, and a second sealing portion disposed on the second magnetic attraction portion.

[0017] Secondly, embodiments of this application provide a method for producing composite copper foil, applied to the aforementioned integrated composite copper foil production apparatus, the method comprising:

[0018] The first sputtering source mechanism is brought closer to the coating roller by the corresponding telescopic adjustment part, and the second sputtering source mechanism is moved away from the coating roller.

[0019] The first pulse sputtering power supply is turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. Oxygen is introduced into the vacuum container at a second flow rate through the second gas flow controller. The organic film is output from the first take-up and unwinding mechanism. The first sputtering source mechanism performs magnetron sputtering coating on the organic film when it passes through the coating winding mechanism to form an activation layer on the organic film. The organic film is then wound up to the second take-up and unwinding mechanism.

[0020] The corresponding telescopic adjustment part brings each of the second sputtering source mechanisms closer to the coating roller, and moves each of the first sputtering source mechanisms away from the coating roller;

[0021] The second, third, and fourth pulse sputtering power supplies are turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. The organic thin film is output from the second take-up and unwinding mechanism. The second sputtering source mechanism performs magnetron sputtering coating on the organic thin film as it passes through the coating winding mechanism to form a copper layer on the activated layer of the organic thin film, thus obtaining a composite copper foil. The composite copper foil passes through the first take-up and unwinding mechanism and the guiding mechanism in sequence and enters the second coating winding mechanism. The third and fourth sputtering source mechanisms perform magnetron sputtering coating on the composite copper foil as it passes through the second coating winding mechanism to form an anti-oxidation layer on the surface of the composite copper foil. The composite copper foil is then wound up by the take-up mechanism.

[0022] Optionally, the inert gas is argon, the first flow rate is 100-200 sccm, the second flow rate is 5.0-7.0 sccm, and the pulse frequency of the first pulse sputtering power supply is 200-320 kHz.

[0023] The integrated composite copper foil production apparatus provided in this application includes a vacuum container, a first rotary winding assembly and a second rotary winding assembly respectively disposed within the vacuum container, and a first sputtering coating assembly and a second sputtering coating assembly respectively disposed within the vacuum container. The first rotary winding assembly includes a first unwinding mechanism, a first coating winding mechanism, and a second unwinding mechanism, wherein the first coating winding mechanism includes at least one coating roller. The second rotary winding assembly includes a guiding mechanism, a second coating winding mechanism, and a winding mechanism, wherein the second coating winding mechanism includes at least one coating roller. The first sputtering coating assembly includes multiple support mechanisms and multiple sputtering source mechanisms respectively disposed on the multiple support mechanisms. The support mechanism includes an arc-shaped fixing part for mounting the sputtering source mechanism and a telescopic adjustment part for supporting the arc-shaped fixing part. The telescopic adjustment part is used to adjust the sputtering source mechanism and the coating. The distance between the rollers; the plurality of sputtering source mechanisms include a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the first coating winding mechanism; the second sputtering coating assembly includes a plurality of third sputtering source mechanisms and a plurality of fourth sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the second coating winding mechanism; in the above manner, the first sputtering source mechanism can be moved closer to / away from the coating winding mechanism and the second sputtering source mechanism can be moved away from / closer to the coating winding mechanism by the telescopic adjustment part, so as to realize the magnetron sputtering of the activation layer and the copper layer in the same vacuum container. At the same time, through the staggered arrangement of the third sputtering source mechanism and the fourth sputtering source mechanism, an anti-oxidation layer is formed on the surface of the composite copper foil after the copper layer is sputtered. The activation layer, the copper layer and the anti-oxidation layer are deposited in the same vacuum container without the need to switch the organic thin film back and forth between three different magnetron sputtering devices, which is beneficial to improving production efficiency and copper plating quality.

[0024] These or other aspects of this application will become more apparent from the description of the following embodiments. Attached Figure Description

[0025] Figure 1 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown.

[0026] Figure 2 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown.

[0027] Figure 3 A schematic diagram of the sputtering coating component in the integrated composite copper foil production apparatus provided in this application embodiment is shown.

[0028] Figure 4 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown.

[0029] Figure 5 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown.

[0030] Figure 6 A schematic diagram of the sputtering coating component in the integrated composite copper foil production apparatus provided in this application embodiment is shown.

[0031] Figure 7 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown.

[0032] Figure 8 A schematic diagram of the integrated production apparatus for composite copper foil provided in an embodiment of this application is shown. Detailed Implementation

[0033] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0034] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0036] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0038] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0039] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0040] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0041] One embodiment of this application provides an integrated production apparatus for composite copper foil. Please refer to [link / reference]. Figure 1 , Figure 2 and Figure 3 As shown, the integrated composite copper foil production device 100 includes a vacuum container 10, a first rotary winding assembly, a second rotary winding assembly, a first sputtering coating assembly, and a second sputtering coating assembly, which are respectively disposed inside the vacuum container 10.

[0042] The first rotary winding assembly includes a first take-up and unwinding mechanism 21, a second take-up and unwinding mechanism 22, and a first coating winding mechanism 23, wherein the first coating winding mechanism 23 includes at least one coating roller.

[0043] The first sputtering coating assembly includes multiple support mechanisms 31 and multiple sputtering source mechanisms 32 respectively disposed on the support mechanisms 31. Each support mechanism 31 includes an arc-shaped fixing part 311 for mounting the sputtering source mechanism 32 and a telescopic adjustment part 312 for supporting the arc-shaped fixing part 311. The telescopic adjustment part 312 is used to adjust the distance between the sputtering source mechanism 32 and the coating roller 23. When the telescopic adjustment part 312 extends, the corresponding sputtering source mechanism 32 moves closer to the coating roller 23; when the telescopic adjustment part 312 shortens, the corresponding sputtering source mechanism 32 moves away from the coating roller 23.

[0044] The second rotary winding assembly includes a guiding mechanism 33, a second coating winding mechanism 34, and a winding mechanism 35. The second coating winding mechanism 34 includes at least one coating roller. The second sputtering coating assembly includes a plurality of third sputtering source mechanisms 36 and a plurality of fourth sputtering source mechanisms 37 arranged alternately along the outer periphery of the coating roller of the second coating winding mechanism 34.

[0045] The plurality of sputtering source mechanisms 32 include a plurality of first sputtering source mechanisms 321 and a plurality of second sputtering source mechanisms 322 arranged alternately along the outer periphery of the coating roller 23. The first sputtering source mechanisms 321 are used to deposit an activation layer on the surface of the organic thin film 200, and the second sputtering source mechanisms 322 are used to deposit a copper layer on the surface of the activation layer. (See also...) Figure 2 As shown, the first sputtering source mechanism 321 includes a first back tube 3211, a first fixed magnetic rod 3212 disposed inside the first back tube 3211, and an activated metal target 3213 sleeved outside the first back tube 3211. The second sputtering source mechanism 322 includes a second back tube 3221, a second fixed magnetic rod 3222 disposed inside the second back tube 3221, and a copper target 3223 sleeved outside the second back tube 3221.

[0046] The third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 have structures similar to the first sputtering source mechanism 321. The third sputtering source mechanism 36 includes a third back tube, a third fixed magnetic rod disposed within the third back tube, and a first anti-oxidation alloy target material sleeved outside the third back tube. The first anti-oxidation alloy includes an anti-oxidation metal and copper. The fourth sputtering source mechanism 37 includes a fourth back tube, a fourth fixed magnetic rod disposed within the fourth back tube, and a second anti-oxidation alloy target material sleeved outside the fourth back tube. The second anti-oxidation alloy includes an anti-oxidation metal and copper. The molar ratio of the anti-oxidation metal to copper in the first anti-oxidation alloy is a first molar ratio, and the molar ratio of the anti-oxidation metal to copper in the second anti-oxidation alloy is a second molar ratio. The first molar ratio and the second molar ratio can be the same or different.

[0047] During magnetron sputtering to form the activation layer, each first sputtering source mechanism 321 is brought close to the coating roller 23 and each second sputtering source mechanism 322 is moved away from the coating roller 23. A mixture of inert gas and oxygen is introduced into the vacuum container, and a pulsed direct current is applied to each first sputtering source mechanism 321. The organic thin film 200 is output from the first take-up and unwinding mechanism 21. The first sputtering source mechanism 321 performs magnetron sputtering coating on the organic thin film 200 as it passes through the first coating winding mechanism 23 to form an activation layer on the organic thin film, and then winds the organic thin film 200 into the second take-up and unwinding mechanism 22. The activation layer includes an activated metal oxide, or an activated metal and an activated metal oxide. During the magnetron sputtering process, the activated metal target is sputtered in a mixed atmosphere of oxygen and inert gas, and at least part of the activated metal is oxidized. Exemplarily, the activated metal can be at least one of titanium, niobium, nickel, molybdenum, chromium, zirconium, aluminum, and silver. Exemplarily, the inert gas can be argon.

[0048] When forming a copper layer by magnetron sputtering, each second sputtering source mechanism 322 is brought close to the coating roller 23 and each first sputtering source mechanism 321 is moved away from the coating roller 23. Inert gas is introduced into the vacuum container 10 and pulsed DC current is applied to each second sputtering source mechanism 322. The organic thin film 200 is output from the second take-up and unwinding mechanism 22. The second sputtering source mechanism 322 performs magnetron sputtering coating on the organic thin film 200 as it passes through the first coating winding mechanism 23 to form a copper layer on the activated layer of the organic thin film, thus obtaining a composite copper foil. The composite copper foil is then passed sequentially through the first take-up and unwinding mechanism 21 and the guiding mechanism 33. Pulsed DC current is applied to the third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 respectively. The third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 perform magnetron sputtering on the composite copper foil as it passes through the coating roller of the second coating winding mechanism 34 to form an anti-oxidation layer on the surface of the composite copper foil. The composite copper foil is then wound up in the take-up mechanism 35. During the formation of the anti-oxidation layer by magnetron sputtering, the first anti-oxidation alloy target on the third sputtering source mechanism 36 is bombarded, and the second anti-oxidation alloy target on the fourth sputtering source mechanism 37 is bombarded. The anti-oxidation metal atoms and copper atoms, carrying sufficient kinetic energy, simultaneously fly towards the coating roller of the second coating winding mechanism 34, forming an alloy layer of anti-oxidation metal and copper on the surface of the composite copper foil. This alloy layer is the anti-oxidation layer. Exemplarily, the anti-oxidation metal can be at least one of nickel, zinc, titanium, or chromium.

[0049] In this embodiment, the telescopic adjustment unit allows the first sputtering source mechanism to move closer to / away from the coating winding mechanism and the second sputtering source mechanism to move away from / closer to the coating winding mechanism, enabling the magnetron sputtering of the activation layer and the copper layer sequentially within the same vacuum container. Simultaneously, by staggering the third and fourth sputtering source mechanisms, an anti-oxidation layer is formed on the surface of the composite copper foil after the copper layer is sputtered. This achieves the deposition of the activation layer, copper layer, and anti-oxidation layer within the same vacuum container, eliminating the need to switch the organic thin film back and forth between three different magnetron sputtering devices, which is beneficial for improving production efficiency and copper plating quality.

[0050] As one implementation method, please refer to Figure 4 and Figure 5 As shown, the first winding and unwinding mechanism 21 and the second winding and unwinding mechanism 22 are arranged symmetrically at the center. The first coating winding mechanism 23 includes a first coating roller 231 and a second coating roller 232 arranged symmetrically at the center. The second coating winding mechanism 34 includes a third coating roller 341 and a fourth coating roller 342.

[0051] In this embodiment, when the activation layer is formed by magnetron sputtering, the organic thin film 200 is output from the first take-up and unwinding mechanism 21; the first sputtering source mechanism 321 performs magnetron sputtering deposition on the first surface of the organic thin film 200 when the organic thin film 200 passes through the first coating roller 231 to form an activation layer on the first surface of the organic thin film; the first sputtering source mechanism 321 performs magnetron sputtering deposition on the second surface of the organic thin film 200 when the organic thin film 200 passes through the second coating roller 232 to form an activation layer on the second surface of the organic thin film; and the organic thin film 200 is wound up by the second take-up and unwinding mechanism 22. When forming a copper layer by magnetron sputtering, the organic thin film 200 is output from the second take-up and unwinding mechanism 22; the second sputtering source mechanism 322 performs magnetron sputtering deposition on the second side of the organic thin film 200 as it passes through the second coating roller 232 to form a copper layer on the activation layer of the second side of the organic thin film; the second sputtering source mechanism 322 performs magnetron sputtering deposition on the first side of the organic thin film 200 as it passes through the first coating roller 231 to form a copper layer on the activation layer of the first side of the organic thin film, thus obtaining a composite copper foil; the composite copper foil is then sequentially passed through the first take-up and unwinding mechanism 22. The unwinding mechanism 21 and the guiding mechanism 33 are input to the second coating winding mechanism 34, and pulsed DC current is applied to the third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 respectively. When the composite copper foil passes through the third coating roller 341, the third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 perform magnetron sputtering treatment on the first side of the composite copper foil. When the composite copper foil passes through the fourth coating roller 342, the third sputtering source mechanism 36 and the fourth sputtering source mechanism 37 perform magnetron sputtering treatment on the second side of the composite copper foil to form an anti-oxidation layer on the surface of the composite copper foil, and then the composite copper foil is wound up to the winding mechanism 35.

[0052] As one implementation method, please refer to Figure 3 and Figure 6 As shown, the telescopic adjustment unit 312 includes an adjustment cylinder 3121 disposed in the vacuum container 10 and a fixing rod 3122 connected to the arc-shaped fixing unit 311. The cylinder body 3121a of the adjustment cylinder 3121 is fixed to the bottom wall of the vacuum chamber of the vacuum container 10, and the fixing rod 3122 is connected to the piston rod 3121b of the adjustment cylinder 3121. When the piston rod 3121b is pushed out of the cylinder body 3121a, it drives the fixing rod 3122 to move closer to the coating roller 23, so that the corresponding sputtering source mechanism 32 is closer to the coating roller 23; when the piston rod 3121b retracts into the cylinder body 3121a, it drives the fixing rod 3122 to move away from the coating roller 23, so that the corresponding sputtering source mechanism 32 is away from the coating roller 23.

[0053] In one embodiment, the integrated composite copper foil production apparatus 100 further includes a first pulse sputtering power supply electrically connected to the first sputtering source mechanism 321 and a second pulse sputtering power supply electrically connected to the second sputtering source mechanism 322. The first pulse sputtering power supply and the second pulse sputtering power supply can each be a pulsed DC power supply.

[0054] In one embodiment, the composite copper foil production apparatus 100 further includes a first gas flow controller and a second gas flow controller. The first gas flow controller is used to control the flow rate of inert gas introduced into the vacuum container 10, and the second gas flow controller is used to control the flow rate of oxygen introduced into the vacuum container 10.

[0055] In some embodiments, the integrated composite copper foil production apparatus 100 further includes a third pulse sputtering power supply electrically connected to the third sputtering source mechanism 341 and a fourth pulse sputtering power supply electrically connected to the fourth sputtering source mechanism 342. The third pulse sputtering power supply and the fourth pulse sputtering power supply can each be a pulsed DC power supply.

[0056] In some embodiments, the duration of the oxidation process of the active metal target and the duration of the sputtering process can be adjusted by regulating the duty cycle of the first pulse sputtering power supply, thereby adjusting the molar ratio of the activated metal oxide to the activated metal in the activated layer. For example, the duty cycle of the first pulse sputtering power supply can be 40% to 100%.

[0057] In some embodiments, the third pulse sputtering power supply has a first duty cycle, and the fourth pulse sputtering power supply has a second duty cycle. The sputtering time of the first anti-oxidation alloy target is adjusted by regulating the first duty cycle; the sputtering time of the second anti-oxidation alloy target is adjusted by regulating the second duty cycle; and the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer can be adjusted by regulating the ratio of the first duty cycle to the second duty cycle. For example, the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer may be a third molar ratio, which differs from both the first and second molar ratios. Anti-oxidation alloys with a first / second molar ratio are more common, while those with a third molar ratio require custom-made materials. By adjusting the ratio of the first and second duty cycles, the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer can be controlled to the third molar ratio, eliminating the need for custom-made anti-oxidation alloy targets with a third molar ratio.

[0058] As one implementation method, please refer to Figure 7 and Figure 8 As shown, the vacuum container 10 includes a shell 11 and a fixing plate 12 covering the shell 11. The shell 11 and the fixing plate 12 surround to form a vacuum chamber 10a. The vacuum container 10 also includes a fixing frame 13 disposed on the fixing plate 12. A first winding and unwinding mechanism 21, a coating winding mechanism 23 and a second winding and unwinding mechanism 22 are respectively disposed on the fixing frame 13. The cylinder body 3121a of the adjusting cylinder 3121 is fixed to the bottom wall of the vacuum chamber 10a of the vacuum container 10.

[0059] In some embodiments, the vacuum container 10 further includes a first slider mechanism 14 disposed at the bottom of the fixed plate 12 and a second slider mechanism 15 disposed at the bottom of the housing 11; the composite copper foil production apparatus 100 further includes a guide rail assembly 60, with the first slider mechanism 14 and the second slider mechanism 15 respectively slidingly engaged with the guide rail assembly 60.

[0060] In some embodiments, the composite copper foil production apparatus 100 further includes a sealing mechanism, which includes a first magnetic attraction part 411 disposed on the fixed plate 12, a first sealing part 412 disposed on the first magnetic attraction part 411, a second magnetic attraction part 421 disposed on the housing 11, and a second sealing part 422 disposed on the second magnetic attraction part 421.

[0061] Specifically, when the fixing plate 12 is closed onto the housing 11, the first sealing part 412 and the second sealing part 422 are attached together, and the first magnetic part 411 and the second magnetic part 421 are opposite each other. When the power is applied, the first magnetic part 411 and the second magnetic part 421 generate an attraction force to press the first sealing part 412 and the second sealing part 422 together, so as to seal the vacuum chamber 10a.

[0062] In some embodiments, the first magnetic attraction part 411 and the second magnetic attraction part 421 may be magnets, and the first sealing part 412 and the second sealing part 422 may be sealant layers.

[0063] In some embodiments, the guiding mechanism 33 includes at least one guide roller.

[0064] An embodiment of this application also provides a method for producing composite copper foil, applied to the aforementioned integrated composite copper foil production apparatus, the method comprising:

[0065] S11, by means of the corresponding telescopic adjustment part, each of the first sputtering source mechanisms is brought closer to the coating roller, and each of the second sputtering source mechanisms is moved away from the coating roller;

[0066] S12, turn on the first pulse sputtering power supply, introduce inert gas into the vacuum container at a first flow rate through the first gas flow controller, introduce oxygen into the vacuum container at a second flow rate through the second gas flow controller, output the organic film from the first take-up and unwinding mechanism, the first sputtering source mechanism performs magnetron sputtering coating treatment on the organic film when the organic film passes through the coating winding mechanism to form an activation layer on the organic film, and wind the organic film into the second take-up and unwinding mechanism;

[0067] S13, by means of the corresponding telescopic adjustment part, each of the second sputtering source mechanisms is brought closer to the coating roller, and each of the first sputtering source mechanisms is moved away from the coating roller;

[0068] S14, the second pulse sputtering power supply, the third pulse sputtering power supply, and the fourth pulse sputtering power supply are turned on. Inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. The organic thin film is output from the second take-up and unwinding mechanism. The second sputtering source mechanism performs magnetron sputtering coating on the organic thin film as it passes through the coating winding mechanism to form a copper layer on the activated layer of the organic thin film, thus obtaining a composite copper foil. The composite copper foil passes through the first take-up and unwinding mechanism and the guiding mechanism in sequence and enters the second coating winding mechanism. The third sputtering source mechanism and the fourth sputtering source mechanism perform magnetron sputtering coating on the composite copper foil as it passes through the second coating winding mechanism to form an anti-oxidation layer on the surface of the composite copper foil. The composite copper foil is then wound up by the take-up mechanism.

[0069] In this embodiment, the telescopic adjustment unit allows the first sputtering source mechanism to move closer to / away from the coating winding mechanism and the second sputtering source mechanism to move away from / closer to the coating winding mechanism, enabling the magnetron sputtering of the activation layer and the copper layer sequentially within the same vacuum container. Simultaneously, by staggering the third and fourth sputtering source mechanisms, an anti-oxidation layer is formed on the surface of the composite copper foil after the copper layer is sputtered. This achieves the deposition of the activation layer, copper layer, and anti-oxidation layer within the same vacuum container, eliminating the need to switch the organic thin film back and forth between three different magnetron sputtering devices, which is beneficial for improving production efficiency and copper plating quality.

[0070] In one embodiment, the inert gas is argon, the first flow rate is 100-200 sccm, the second flow rate is 5.0-7.0 sccm, and the pulse frequency of the first pulse sputtering power supply is 200-320 kHz.

[0071] In some embodiments, the duration of the oxidation process of the active metal target and the duration of the sputtering process can be adjusted by regulating the duty cycle of the first pulse sputtering power supply, thereby adjusting the molar ratio of the activated metal oxide to the activated metal in the activated layer. For example, the duty cycle of the first pulse sputtering power supply can be 40% to 100%.

[0072] In some embodiments, the third pulse sputtering power supply has a first duty cycle, and the fourth pulse sputtering power supply has a second duty cycle. The sputtering time of the first anti-oxidation alloy target is adjusted by regulating the first duty cycle; the sputtering time of the second anti-oxidation alloy target is adjusted by regulating the second duty cycle; and the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer can be adjusted by regulating the ratio of the first duty cycle to the second duty cycle. For example, the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer may be a third molar ratio, which differs from both the first and second molar ratios. Anti-oxidation alloys with a first / second molar ratio are more common, while those with a third molar ratio require custom-made materials. By adjusting the ratio of the first and second duty cycles, the molar ratio of the anti-oxidation metal to copper metal in the anti-oxidation layer can be controlled to the third molar ratio, eliminating the need for custom-made anti-oxidation alloy targets with a third molar ratio.

[0073] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. An integrated production device for composite copper foil, characterized in that, It includes a vacuum container, a first rotary winding assembly and a second rotary winding assembly respectively disposed within the vacuum container, and a first sputtering coating assembly and a second sputtering coating assembly respectively disposed within the vacuum container; The first rotary winding assembly includes a first take-up and unwinding mechanism, a first coating winding mechanism, and a second take-up and unwinding mechanism, wherein the first coating winding mechanism includes at least one coating roller. The second rotary winding assembly includes a guiding mechanism, a second coating winding mechanism, and a winding mechanism, wherein the second coating winding mechanism includes at least one coating roller; The first sputtering coating assembly includes multiple support mechanisms and multiple sputtering source mechanisms respectively disposed on the multiple support mechanisms; each support mechanism includes an arc-shaped fixing part for mounting the sputtering source mechanism and a telescopic adjustment part for supporting the arc-shaped fixing part, the telescopic adjustment part being used to adjust the distance between the sputtering source mechanism and the coating roller; the multiple sputtering source mechanisms include a plurality of first sputtering source mechanisms and a plurality of second sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the first coating winding mechanism; The second sputtering coating assembly includes a plurality of third sputtering source mechanisms and a plurality of fourth sputtering source mechanisms arranged alternately along the outer periphery of the coating roller of the second coating winding mechanism.

2. The integrated production device for composite copper foil according to claim 1, characterized in that, The first winding and unwinding mechanism and the second winding and unwinding mechanism are arranged symmetrically at the center. The first coating winding mechanism includes a first coating roller and a second coating roller arranged symmetrically at the center. The second coating winding mechanism includes a third coating roller and a fourth coating roller disposed between the guiding mechanism and the winding mechanism.

3. The integrated production device for composite copper foil according to claim 1, characterized in that, The telescopic adjustment part includes an adjustment cylinder disposed in the vacuum container and a fixing rod connected to the arc-shaped fixing part, the fixing rod being connected to the piston rod of the adjustment cylinder.

4. The integrated production device for composite copper foil according to claim 3, characterized in that, The integrated production apparatus for composite copper foil also includes a first pulse sputtering power supply electrically connected to the first sputtering source mechanism and a second pulse sputtering power supply electrically connected to the second sputtering source mechanism; the integrated production apparatus for composite copper foil also includes a first gas flow controller and a second gas flow controller.

5. The integrated production apparatus for composite copper foil according to claim 4, characterized in that, The integrated composite copper foil production device also includes a third pulse sputtering power supply electrically connected to the third sputtering source mechanism and a fourth pulse sputtering power supply electrically connected to the fourth sputtering source mechanism.

6. The integrated production apparatus for composite copper foil according to claim 5, characterized in that, The vacuum container includes a shell and a fixed plate covering the shell. The shell and the fixed plate form a vacuum cavity. The rotary winding assembly also includes a fixed frame on the fixed plate. The first winding and unwinding mechanism, the coating winding mechanism, and the second winding and unwinding mechanism are respectively located on the fixed frame. The cylinder body of the adjusting cylinder is located at the bottom of the vacuum cavity.

7. The integrated production apparatus for composite copper foil according to claim 6, characterized in that, The vacuum container also includes a first slider mechanism disposed at the bottom of the fixed plate and a second slider mechanism disposed at the bottom of the housing; The integrated production device for composite copper foil also includes a guide rail assembly, wherein the first slider mechanism and the second slider mechanism are respectively slidably engaged with the guide rail assembly.

8. The integrated production apparatus for composite copper foil according to claim 6, characterized in that, The vacuum container further includes a sealing mechanism, which includes a first magnetic attraction part disposed on the fixed plate, a first sealing part disposed on the first magnetic attraction part, a second magnetic attraction part disposed on the housing, and a second sealing part disposed on the second magnetic attraction part.

9. A method for producing composite copper foil, characterized in that, The composite copper foil production method, applied to the integrated production apparatus for composite copper foil according to any one of claims 1 to 8, comprises: The first sputtering source mechanism is brought closer to the coating roller by the corresponding telescopic adjustment part, and the second sputtering source mechanism is moved away from the coating roller. The first pulse sputtering power supply is turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. Oxygen is introduced into the vacuum container at a second flow rate through the second gas flow controller. The organic film is output from the first take-up and unwinding mechanism. The first sputtering source mechanism performs magnetron sputtering coating on the organic film when it passes through the coating winding mechanism to form an activation layer on the organic film. The organic film is then wound up to the second take-up and unwinding mechanism. The corresponding telescopic adjustment part brings each of the second sputtering source mechanisms closer to the coating roller, and moves each of the first sputtering source mechanisms away from the coating roller; The second, third, and fourth pulse sputtering power supplies are turned on, and inert gas is introduced into the vacuum container at a first flow rate through the first gas flow controller. The organic thin film is output from the second take-up and unwinding mechanism. The second sputtering source mechanism performs magnetron sputtering coating on the organic thin film as it passes through the coating winding mechanism to form a copper layer on the activated layer of the organic thin film, thus obtaining a composite copper foil. The composite copper foil passes through the first take-up and unwinding mechanism and the guiding mechanism in sequence and enters the second coating winding mechanism. The third and fourth sputtering source mechanisms perform magnetron sputtering coating on the composite copper foil as it passes through the second coating winding mechanism to form an anti-oxidation layer on the surface of the composite copper foil. The composite copper foil is then wound up by the take-up mechanism.

10. The method for producing composite copper foil according to claim 9, characterized in that, The inert gas is argon, with a first flow rate of 100-200 sccm and a second flow rate of 5.0-7.0 sccm. The pulse frequency of the first pulse sputtering power supply is 200-320 kHz.

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