Chip mounting structure of quantum computer and quantum computer

Abstract

The application provides a chip mounting structure of a quantum computer and the quantum computer, and particularly comprises: a chip mounting structure of a quantum computer, the mounting structure comprising a chip carrier plate and a connecting piece, wherein the chip carrier plate is used for mounting a quantum chip, and a first surface of the chip carrier plate is detachably electrically connected with a first end of the connecting piece, and a second end of the connecting piece is electrically connected with a circuit board. The first end of the connecting piece is detachably electrically connected with the first surface of the chip carrier plate, so that alignment and plugging operations can be easily achieved, which is very friendly to test scenes in which chips are frequently replaced.

Description

Technical Field

[0001] This invention belongs to the field of quantum chip testing technology, and specifically relates to a chip mounting structure for a quantum computer and a quantum computer. Background Technology

[0002] A quantum computer is a computer that uses the principles of quantum mechanics to perform calculations. It is considered one of the most promising methods for realizing scalable quantum computing and has the potential to surpass traditional computers. Chip-based systems, with their integration, precise control, and high scalability, provide a feasible approach to building large-scale quantum computers and realizing quantum information processing, and have broad prospects for experimental and commercial applications.

[0003] However, as the number of ion qubits controlled in the ion trap continues to increase, the number of chip electrodes also continues to increase, which poses a challenge to the chip mounting structure in the laboratory testing of chip physical properties.

[0004] In quantum computers, where quantum chips are the core component, a qualified quantum chip mounting structure must provide sufficient electrical pathways while facilitating the replacement of ion trap chips. Most existing mounting structures involve directly inserting PGA (Pin Grid Array) packaged chips into circuit board sockets, or adding a zero insertion force (ZIF) socket for inserting the PGA package. The former results in extremely difficult insertion, removal, and alignment due to the cumulative resistance of numerous pins, while the latter increases product development costs and timelines and is incompatible with most quantum chip types.

[0005] Therefore, it is necessary to design a chip mounting structure for a quantum computer and a quantum computer in order to solve the above-mentioned technical problems. Summary of the Invention

[0006] To address the above problems, this invention provides a chip mounting structure for a quantum computer, the mounting structure including a chip carrier and connectors, wherein...

[0007] The chip carrier is used to mount the quantum chip, and the first surface of the chip carrier is detachably electrically connected to the first end of the connector, wherein the second end of the connector is electrically connected to the circuit board.

[0008] Furthermore, the mounting structure also includes a cover plate and a base, wherein,

[0009] The cover plate is bolted to the base and covers the base, wherein...

[0010] The chip carrier is disposed between the cover plate and the base;

[0011] A through hole is made in the center of the base.

[0012] Furthermore, the base has a through-hole, wherein...

[0013] The connector is installed in the socket, and there are multiple connectors and sockets.

[0014] Furthermore, a window penetrating through the cover plate is provided at the center of the cover plate, wherein,

[0015] The quantum chip is located within a window and bonded to wiring on the second surface of the chip carrier.

[0016] Furthermore, the connector is a spring pin made of metal material, wherein,

[0017] The spring pin includes a main body shell and a step, wherein the step is disposed on the main body shell and surrounds the main body shell, and the step is installed in the step hole that is outwardly set at the first end of the insertion hole.

[0018] Furthermore, a first connection point is provided on the first surface of the chip carrier, and the first connection point is electrically connected to the first end of the connector, wherein...

[0019] The wiring on the second surface of the chip carrier is connected to the first connection point by vias, wherein there are multiple first connection points.

[0020] Furthermore, a second connection point is provided on the first surface of the circuit board, and the second connection point is in contact with the second end of the connector, wherein...

[0021] The wiring on the second surface of the circuit board is connected to the second connection point by vias, and there are multiple second connection points.

[0022] Furthermore, the spring pin also includes a first spring and a first ejector pin, wherein,

[0023] The main body shell has a first inner hole, and the first spring is installed in the first inner hole;

[0024] The first ejector pin is divided into two sections, including an integral first inner section and a first outer section. The first inner section is inserted into the first inner hole and contacts the first spring, and the end of the first inner hole is provided with a first limiting member to prevent the first inner section from disengaging from the first inner hole.

[0025] Furthermore, the step is positioned close to the first limiting component, and the first outer segment end is the first end of the connector, while the end of the main body shell away from the first limiting component is a closed structure.

[0026] Furthermore, the end of the main body shell away from the first limiting component is the second end of the connector, wherein the end of the main body shell away from the first limiting component passes through the insertion hole.

[0027] Furthermore, a needle bar is provided at one end of the main body shell away from the first limiting component. The end of the needle bar is the second end of the connector. The needle bar passes through a recessed perforation at the second end of the insertion hole. The diameter of the needle bar is smaller than the diameter of the main body shell.

[0028] Furthermore, the first connection point is made of a metallic material and is disc-shaped, tooth-shaped, or concave, wherein...

[0029] When the first connection point is disc-shaped or concave, the end of the first outer segment is arc-shaped or planar.

[0030] When the first connection point is a first tooth shape, the end of the first outer segment is a second tooth shape that meshes with the first tooth shape.

[0031] On the other hand, a quantum computer is also provided, which includes the chip mounting structure described above.

[0032] This invention provides a chip mounting structure for a quantum computer and a quantum computer in general. The first end of a connector is detachably electrically connected to a first connection point on a first surface corresponding to the chip carrier, enabling easy alignment and insertion / removal operations. This is highly suitable for testing scenarios where chips are frequently replaced. With slight modifications, this structure can adapt to the rapid iteration of ion trap chips, reducing product development costs and timelines, and is compatible with almost all ion trap chip types.

[0033] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 A schematic diagram of a chip mounting structure for a quantum computer according to an embodiment of the present invention is shown.

[0036] Figure 2 A cross-sectional view of the base corresponding to the connector of a single-head structure according to an embodiment of the present invention is shown.

[0037] Figure 3 A perspective view of a connector with a single-head structure according to an embodiment of the present invention is shown.

[0038] Figure 4 A cross-sectional view of a connector of a single-head structure according to an embodiment of the present invention is shown.

[0039] Figure 5 A cross-sectional view of a connector of a single-head structure according to an embodiment of the present invention is shown.

[0040] Figure 6 A perspective view of the base corresponding to the connector of the single-head structure according to an embodiment of the present invention is shown.

[0041] Figure 7 A cross-sectional view of the base corresponding to the connector of the single-head structure according to embodiment two of the present invention is shown.

[0042] Figure 8 A perspective view of a chip carrier board according to an embodiment of the present invention is shown.

[0043] Figure 9 A perspective view of a circuit board according to an embodiment of the present invention is shown.

[0044] Figure 10 A cross-sectional view of a connector with a double-headed structure according to an embodiment of the present invention is shown.

[0045] Figure 11 A cross-sectional view of the mounting positions of the connector with a double-headed structure according to an embodiment of the present invention corresponding to the two bases is shown.

[0046] Figure 12 A perspective view of a cover plate according to an embodiment of the present invention is shown.

[0047] Figure 13 An overall perspective view of the connector of the single-head structure according to embodiment two of the present invention after installation is shown. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] like Figure 1 As shown, the present invention provides a chip mounting structure for a quantum computer, the mounting structure including a chip carrier 1 and a connector 2, wherein:

[0050] The chip carrier 1 is used to mount the quantum chip 7, and the first surface 11 of the chip carrier 1 is detachably electrically connected to the first end of the connector 2. The second end of the connector 2 is electrically connected to the circuit board 3. In this invention, the quantum chip 7 includes an ion trap chip. Additionally, by way of example, in this invention, the circuit board can be any one of the following: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper plate, impedance board, etc.

[0051] The following is a detailed description of a chip mounting structure for a quantum computer provided by the present invention.

[0052] In some embodiments of the present invention, such as Figure 1 As shown, the mounting structure also includes a cover plate 4 and a base 5. The cover plate 4 is bolted to the base 5 and covers the base 5 (with a through hole 53 at its center). The chip carrier 1 is located between the cover plate 4 and the base 5 and is fixed by the base 5 and the cover plate 4. The method of fixing will be described below. In addition, since the entire mounting structure is in a vacuum chamber, the components in the mounting structure need to meet the high temperature environment caused by vacuum preparation and baking and the low outgassing rate under vacuum. Therefore, in this invention, the components in the mounting structure need to be made of special vacuum-compatible materials (for example, the base 5 is made of PEEK or ceramic materials).

[0053] In some embodiments of the present invention, such as Figure 2 As shown, the base 5 has a through-hole 51. The connector 2 can be installed in the through-hole 51. There are multiple connectors 2 and multiple through-holes 51.

[0054] In some embodiments of the present invention, the connector 2 can be divided into a single-head structure (exemplary, for example, a spring pin structure with one ejector pin, described in the following examples) and a double-head structure (exemplary, for example, a spring pin structure with two ejector pins, described in the following examples). For the single-head structure, the connector has various forms, thereby corresponding to various forms of the mounting structure of the present invention. The various forms of the connector 2 with the single-head structure are described below.

[0055] 1) Connector with a single-head structure

[0056] In this embodiment, the various forms of connector 2 with single-head structures have some common components, such as... Figure 3As shown, the same structure is as follows:

[0057] The connector 2 is a spring pin made of metal material. The spring pin includes a main body shell 21 and a step 22. The step 22 is provided on the main body shell 21 and surrounds the main body shell 21. The step 22 is installed in the step hole 511, which is extended outward at the first end of the insertion hole 51.

[0058] In addition, the spring pin also includes a first spring 23 and a first ejector pin 24, wherein, as Figure 4 As shown, the main body shell 21 has a first inner hole 211 inside, the first spring 23 is installed in the first inner hole 211, and the first ejector pin 24 is divided into two sections, including an integral first inner section 241 and a first outer section 242. The first inner section 241 is inserted into the first inner hole 211 and contacts the first spring 23, and the end of the first inner hole 211 is provided with a first limiting member 2111 to prevent the first inner section 241 from disengaging from the first inner hole 211. The first limiting member 2111 can be referred to as Figure 3 As shown, it is an inverted bowl shape, that is, the diameter of the inner surface of the limiting component 211 gradually decreases from the connection with the first inner hole 211, thereby playing a limiting role.

[0059] Specifically, the lower end of the first inner section 241 of the connector 2 is cylindrical, and the surface of its upper end is shaped to fit the inner surface of the first limiting member 2111, thereby preventing the first inner section 241 of the first ejector pin 24 from disengaging from the first inner hole 211. In this embodiment, the end of the first outer section 242 is the first end of the connector 2 and is connected to the first surface 11 of the chip carrier 1.

[0060] The end of the main body shell 21 away from the first limiting component 2111 is a closed structure, and the step 22 is set close to the first limiting component 2111.

[0061] In some embodiments of the present invention, for the single-headed connector 2, there are multiple forms of different structures. In the present invention, two forms are exemplarily described. However, it should be understood that the different structures are not limited to the two forms described in the present invention. Other structures applicable to the present invention can also be applied to different structural parts of the connector of the present invention.

[0062] Format 1:

[0063] In some embodiments of the present invention, such as Figure 3 and Figure 4 As shown, the end of the main body shell 21 away from the first limiting member 2111 is the second end of the connector 2, wherein the end of the main body shell 21 away from the first limiting member 2111 passes through the insertion hole 51, i.e. Figure 2 As shown, the second end of connector 2 can pass directly through as... Figure 2 The socket 51 shown (i.e., the base 5 selected at this time) Figure 2 (The pattern shown).

[0064] Form Two:

[0065] In some embodiments of the present invention, such as Figure 5 As shown, a needle bar 25 is provided at one end of the main body shell 21 away from the first limiting member 2111. The diameter of the needle bar 25 is smaller than the diameter of the main body shell 21. The end of the needle bar 25 is the second end of the connector 2. The needle bar 25 passes through the inwardly recessed through hole 512 at the second end of the insertion hole 51, i.e. Figure 6 and Figure 7 As shown, the second end of the connector 2 can pass through the inwardly recessed through hole 512 of the second end of the insertion hole 51 (i.e., the base 5 is selected at this time). Figure 6 and Figure 7 (The pattern shown).

[0066] Based on the structural description of the single-head connector 2, the following describes how the single-head connector 2 is connected to the chip carrier board 1 and the circuit board 3.

[0067] In some embodiments of the present invention, such as Figure 7 As shown, a first connection point 111 is provided on the first surface 11 of the chip carrier 1. The first connection point 111 is electrically connected to the first end of the single-headed connector 2. The wiring on the second surface of the chip carrier 1 (wherein, the wiring on the second surface of the chip carrier 4 can also be inside the chip carrier 1) is connected to the first connection point 111 by means of vias. Figure 8 (not shown in the image), wherein there are multiple first connection points 111.

[0068] In some embodiments of the present invention, such as Figure 9 As shown, the first surface 31 of the circuit board 3 is provided with a second connection point 311. The second connection point 311 is in contact with the second end of the single-headed connector 2. The wiring on the second surface of the circuit board 3 (the wiring on the second surface of the circuit board 3 can also be inside the circuit board 3) is connected to the second connection point by means of vias. There are multiple second connection points 311.

[0069] 2) Connector with double-headed structure

[0070] In some embodiments of the present invention, the double-headed connector 2 is also a spring needle made of metal material. The spring needle corresponding to the double-headed connector 2 includes a main body shell 21 and a step 22. The step 22 is disposed on the main body shell 21 and surrounds the main body shell 21. The step 22 is disposed in the middle part of the main body shell 21.

[0071] like Figure 10 As shown, the spring pin also includes a second spring 26 and two second ejector pins 27. The main body shell 21 has a second inner hole 212 inside, and the second spring 26 is installed in the second inner hole 212. Each second ejector pin 27 is divided into two sections, including an integral second inner section 271 and a second outer section 272. The two second inner sections 271 are inserted into the second inner hole 212 from both ends and respectively contact the two ends of the second spring 26. The two ends of the second inner hole 212 are respectively provided with second limiting components 2121 to prevent the two second inner sections 271 from disengaging from the second inner hole 212. Similar to the spring pin corresponding to the single-headed connector 2, the two limiting components 2121 can respectively prevent the two second inner sections 271 from disengaging from the second inner hole 212, thus providing a limiting effect.

[0072] In this embodiment, the lower end of the second inner section 271 of the connector 2 is cylindrical, and the surface of its upper end is shaped to fit against the inner surface of the second limiting member 2121, thereby preventing the second inner section 271 of the second ejector pin 27 from disengaging from the first inner hole 211 and the second inner hole 212. Furthermore, in this embodiment, one end of the second outer section 272 is the first end of the connector 2, and the other end of the second outer section 272 is the second end of the connector 2, thus forming the double-headed structure (i.e., a spring pin structure with two ejector pins) connector 2 in this embodiment.

[0073] In addition, in order to accommodate the double-headed connector 2, in some embodiments of the present invention, the base 5 is adapted to a different single-headed connector 2. That is, there are two bases 5 adapted to the double-headed structure, and the two bases 5 are arranged symmetrically to each other. The cover plate 4 is bolted to one of the bases 5 and covers the base 5, and the other base 5 is bolted to the first surface 11 of the circuit board 3.

[0074] Of the two second ejector pins 27, the end of the second outer segment 272 of one of the second ejector pins 27 passes through the insertion hole 51 of one of the bases 5 (at this time, the second end of the insertion hole 51 corresponding to the base 5 does not have the inwardly recessed through hole 512), and the end of the second outer segment 272 of the other second ejector pin 27 passes through the insertion hole 51 of the other base 5.

[0075] Among them, such as Figure 11As shown, one half of the step 22 is installed in the step hole 511 of the first end of the insertion hole 51 of one of the bases 5, which is set outward; the other half of the step 22 is installed in the step hole 511 of the first end of the insertion hole 51 of the other base 5. It should be noted that the longitudinal length of the step 22 of the double-headed spring needle can be twice the length of the step 22 of the single-headed spring needle, but it is not limited to twice, and can be adapted as needed.

[0076] Based on the structural description of the dual-head connector 2, the following describes how the dual-head connector 2 connects to the chip carrier 1 and the circuit board 3. The connection method between the dual-head connector 2 and the chip carrier 1 and the circuit board 3 is similar to that of the single-head connector 2.

[0077] In some embodiments of the present invention, a first connection point 111 provided on the first surface 11 of the chip carrier 1 is electrically connected to the first end of the double-headed connector 2, wherein the wiring on the second surface of the chip carrier 1 is connected to the first connection point 111 by means of vias. Figure 8 (not shown in the image), wherein there are multiple first connection points 111.

[0078] In some embodiments of the present invention, such as Figure 9 As shown, the second connection point 311 provided on the first surface 31 of the circuit board 3 is in contact with the second end of the double-headed connector 2. The wiring on the second surface of the circuit board 3 is connected to the second connection point by means of vias. There are multiple second connection points 311.

[0079] After describing the structure of the connector 2 with single-head and double-head structures, the following describes in detail each connection point of the connector with single-head and double-head structures in this invention.

[0080] In some embodiments of the present invention, among the connection points corresponding to the single-headed connector 2, the first connection point 111 is made of metal material and is a disc, a first tooth, or a concave shape, etc. The shape of the first connection point 111 is not limited to a disc, a first tooth, or a concave shape. As long as it can play a contact connection role, other shapes can be applied to the present invention. Specifically, 1) when the first connection point 111 is disc-shaped, the end of the first outer segment 242 is arc-shaped or planar; 2) when the first connection point 111 is a first tooth, the end of the first outer segment 242 is a second tooth that meshes with the first tooth.

[0081] In some embodiments of the present invention, the first connection point 111 and the second connection point 311 of the double-headed connector 2 are both made of metal and are disc-shaped, tooth-shaped, or concave. The shape of the first connection point 111 and the second connection point 311 is not limited to disc-shaped, tooth-shaped, or concave. As long as they can achieve the function of contact connection, other shapes are applicable to the present invention. Specifically, 1) when the first connection point 111 and the second connection point are both disc-shaped or concave, the ends of the two second outer segments 272 are both arc-shaped or planar; 2) when the first connection point 111 and the second connection point 311 are both arc-shaped or planar. When both are first tooth-shaped, the ends of the two second outer segments 272 are both second tooth-shaped and mesh with the first tooth-shaped; 3) When the first connection point 111 is disc-shaped and the second connection point is first tooth-shaped, the end of the second outer segment 272 that is electrically connected to the first connection point 111 is disc-shaped, and the end of the second outer segment 272 that is electrically connected to the second connection point is first tooth-shaped; 4) When the first connection point 111 is first tooth-shaped and the second connection point is disc-shaped, the end of the second outer segment 272 that is electrically connected to the first connection point 111 is first tooth-shaped, and the end of the second outer segment 272 that is electrically connected to the second connection point is disc-shaped.

[0082] Based on the detailed description of the connectors for single-head and double-head structures, the following describes how the chip carrier 1 is fixed between the base 5 and the cover plate 4.

[0083] like Figure 1 As shown, the cover plate 4 is square, and each of the four sides of the square cover plate 4 extends outward with a first connecting plate 42 (for example, the first connecting plate 42 is integrally formed with the cover plate 4, see reference). Figure 12 The first connecting plate 42 has a first connecting hole 421, and right-angle plates 43 extend downward from each of the four corners of the cover plate 4 (exemplarily, the right-angle plates 43 are integrally formed with the cover plate). The corresponding base 5 is square, and second connecting plates 52 extend outward from each of the four sides of the base (exemplarily, the second connecting plates 52 are integrally formed with the base, see reference). Figure 6 The second connecting plate 52 is provided with a second connecting hole 521 or a third connecting hole.

[0084] (1) In some embodiments of the present invention, the connector 2 with a single-head structure of form one is used with the corresponding Figure 2 The base 5 shown above fixes the chip carrier board 1 in the following way:

[0085] The second end of connector 2 is passed through the socket 51 (at this time, the main body shell 21 of connector 2 is located in the socket 51). The step of connector 2 is installed in the step hole 511 of base 5. Then, chip carrier 1 is placed into the four right-angle plates 43 of cover plate 1. The first connection hole 421 on each first connection plate 42 on cover plate 4 is connected to the second connection hole 521 on each second connection plate 52 on base 5 one by one with bolts. At this time, the first end of connector 2 will contact and connect with the first connection point 11 set on the first surface 11 of chip carrier 1. At this time, the four right-angle plates 43 of cover plate 4 also cover the four corners of base 5.

[0086] At this point, after the chip carrier 1 is fixed between the base 5 and the cover plate 4 to form a whole, it is necessary to connect this whole to the circuit board 3. Specifically, the second end of the connector 2 in the whole is connected to the second connection point on the circuit board 3. For example, welding, conductive adhesive bonding or other methods can be used to connect the whole to the circuit board 3.

[0087] (2) In some embodiments of the present invention, the connector 2 with the single-head structure of form two is used with the corresponding Figure 2 The base 5 shown above fixes the chip carrier board 1 in the following way:

[0088] The second end of connector 2 is passed through the through hole 512 (at this time, the main body shell 21 of connector 2 is located in the insertion hole 51). The step of connector 2 is installed in the step hole 511 of base 5. Then, chip carrier 1 is placed into the four right-angle plates 43 of cover plate 1. The first connection hole 421 on each first connection plate 42 on cover plate 4 is connected to the second connection hole 521 on each second connection plate 52 on base 5 one by one with bolts. At this time, the first end of connector 2 will contact and connect with the first connection point 11 set on the first surface 11 of chip carrier 1 one by one. At this time, the four right-angle plates 43 of cover plate 4 also cover the four corners of base 5.

[0089] At this time, the chip carrier 1 is fixed between the base 5 and the cover plate 4 to form a shape as shown. Figure 13 After the entire assembly shown is formed, it is necessary to connect this assembly to the circuit board 3. Specifically, the second end of the connector 2 in the assembly is connected to the second connection point on the circuit board 3. For example, welding, conductive adhesive bonding or other methods can be used to connect the assembly to the circuit board 3.

[0090] (3) In some embodiments of the present invention, a double-headed connector 2 is used with a corresponding Figure 2 The base 5 shown above fixes the chip carrier board 1 in the following way:

[0091] Pass the first end of the connector 2 through the insertion hole 51 of one of the bases 5, and pass the second end of the connector 2 through the insertion hole of the other base 5 (at this time, the main body shell 21 of the connector 2 is located in the insertion holes 51 of the two bases 5). Install half of the step 22 in the step hole 511 of the insertion hole 51 of one of the bases 5, which is set outwards. Install the other half of the step 22 in the step hole 511 of the insertion hole 51 of the other base 5, which is set outwards. Then connect the third connecting holes on the two bases one by one with bolts.

[0092] Next, the chip carrier 1 is placed into the four right-angled plates 43 of the cover plate 1. Then, the first connection hole 421 on each first connecting plate 42 on the cover plate 4 is connected one by one with the second connection hole 521 on each second connecting plate 52 on one of the bases 5 (the other base 5 may not have a second connection hole). At this time, the first end of the connector 2 will contact and connect one by one with the first connection point 11 set on the first surface 11 of the chip carrier 1. At this time, the four right-angled plates 43 of the cover plate 4 also cover the four corners of one of the bases 5.

[0093] At this point, the chip carrier 1 is fixed between one of the bases 5 and the cover plate 4. Then, after the other base is connected to one of the bases 5 to form a whole, this whole needs to be connected to the circuit board 3. Specifically, the second end of the connector 2 in this whole is connected to the second connection point on the circuit board 3. For example, in some embodiments of the present invention, the following connection method can be adopted:

[0094] Both bases 5 can have multiple threaded holes, and the circuit board 3 has corresponding multiple fixing holes. Through multiple bolts, threaded holes, and corresponding fixing holes, the entire assembly can be connected to the circuit board 3. After connection, the second end of the connector 2 in the assembly and the second connection point on the circuit board 3 are in a compression contact connection. Alternatively, multiple threaded holes can be provided on one base (i.e., the other base 5 mentioned above), and the circuit board 3 can also have corresponding multiple fixing holes. By rotating a bolt from the bottom of the circuit board 3, first inserting it into the fixing hole of the circuit board 3, and then into the threaded hole of the other base 5, the entire assembly can also be connected to the circuit board 3. After connection, the second end of the connector 2 in the assembly and the second connection point on the circuit board 3 are also in a compression contact connection.

[0095] It should be noted that some of the connection hole and bolt fit forms mentioned in (1), (2) and (3) above are just examples. For example, in this invention, the snap-fit ​​connection between the cover plate and the base or between two bases can also be applied to this invention.

[0096] Based on the aforementioned fixing of the chip carrier 1 between the base 5 and the cover plate 4, in some embodiments of the present invention, such as... Figure 12 As shown, a window 41 penetrating the cover plate 4 is provided at the center of the cover plate 4, wherein the quantum chip 7 is located inside the window 41 and is bonded to the wiring on the second surface of the chip carrier 1, and the quantum chip 7 has a loading slot.

[0097] In some embodiments of the present invention, the circuit board 3 of the mounting structure of the present invention can be connected to the vacuum feedthrough via some adapters, so that the entire mounting structure can be installed in the ion trap vacuum chamber via the vacuum feedthrough.

[0098] In addition, in some embodiments of the present invention, an ion trap quantum computer is also provided, the ion trap quantum computer including the above-described mounting structure.

[0099] In the above-described mounting structure, the quantum chip 7, encapsulated on the chip carrier, is electrically connected to the circuit board 3 via a spring-loaded pin structure, thus enabling connection to external control devices (details omitted here). Through the cooperation of the top cover and the base, when, for example, the second connection point of the circuit board 3 is recessed, after the chip carrier 1 is fixed between the cover plate 4 and the base 5, the second end of the connector 2 can easily insert into the corresponding recessed second connection point 311 of the circuit board 3, facilitating easy alignment and insertion / removal operations. This is particularly beneficial for testing scenarios involving frequent chip replacements. With slight modifications, this structure can adapt to the rapid iteration of the quantum chip 7, reducing product development costs and timelines, and is compatible with most quantum chip types.

[0100] In summary, the chip mounting structure and quantum computer provided by this invention also have the following characteristics:

[0101] 1. In this invention, since the second end of the connector 2 is electrically connected to the circuit board 3, if the connector is directly electrically connected to the circuit board 3, the circuit board 3 may deform under long-term pressure. In this invention, when the top cover 4 and the base 5 are combined, the step 22 of the connector and the step hole 512 in the base 5 can jointly bear the elastic force after the spring needle is compressed, avoiding all the spring needle force being applied to the electrical connection end of the spring needle with the circuit board 3.

[0102] 2. In this invention, the cover plate 4 is bolted to cover the base 5, and the connector 2 is installed in the insertion hole 51 of the base 5, so that the first end of the connector can be detachably electrically connected to the first connection point corresponding to the chip carrier.

[0103] 3. In this invention, the through hole 53 can be used in conjunction with the loading groove (the size of the loading groove can be set as needed) (at this time, a slot is opened on the circuit board 3 to pass through the circuit board 3), that is, ions can be loaded from the back of the quantum chip 7, that is, the atomic beam (i.e., atomic vapor, used for ionization) is injected into the through hole 53 from below, and then can be ejected upward from the loading groove). During this process, the atomic vapor will not sputter onto the surface of the ion trap chip, which can effectively avoid the problem of atomic vapor contaminating the surface of the ion trap chip.

[0104] 4. In this invention, the through hole 53 can be used in conjunction with the copper pillar connected to the refrigerator (used for heat exchange, i.e., it has the function of directly cooling the chip). That is, the copper pillar needs to pass through the through hole 53 so that the quantum chip 7 can directly contact the copper pillar, thereby achieving the effect of cooling the quantum chip 7.

[0105] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A chip mounting structure for a quantum computer, characterized in that, The mounting structure includes a chip carrier board (1) and a connector (2), wherein, The chip carrier (1) is used to mount the quantum chip (7), and the first surface (11) of the chip carrier (1) is detachably electrically connected to the first end of the connector (2), wherein the second end of the connector (2) is electrically connected to the circuit board (3). The mounting structure also includes a cover plate (4) and a base (5), wherein, The cover plate (4) is bolted to the base (5) and covers the base (5), wherein, The chip carrier (1) is disposed between the cover plate (4) and the base (5); A through hole (53) is provided at the center of the base (5), and an insertion hole (51) is provided on the base (5) to penetrate the base (5); The connector (2) is a spring pin made of metal material, wherein, The spring pin includes a main body shell (21) and a step (22), wherein the step (22) is provided on the main body shell (21) and surrounds the main body shell (21), and the step (22) is installed in the step hole (511) that is outwardly extended at the first end of the insertion hole (51).

2. The chip mounting structure for a quantum computer according to claim 1, characterized in that, There are multiple connectors (2) and sockets (51).

3. The chip mounting structure for a quantum computer according to claim 1, characterized in that, A window (41) penetrating through the cover plate (4) is provided at the center of the cover plate (4), wherein, The quantum chip (7) is located within the window (41) and is bonded to wiring on the second surface of the chip carrier (1).

4. The chip mounting structure for a quantum computer according to claim 1, characterized in that, The chip carrier (1) has a first connection point (111) on its first surface (11), and the first connection point (111) is electrically connected to the first end of the connector (2). The wiring on the second surface of the chip carrier (1) is connected to the first connection point (111) by means of vias, wherein there are multiple first connection points (111).

5. The chip mounting structure for a quantum computer according to claim 1, characterized in that, The circuit board (3) has a second connection point (311) on its first surface (31), and the second connection point (311) is in contact with the second end of the connector (2). The wiring on the second surface of the circuit board (3) is connected to the second connection point (311) by means of vias, wherein there are multiple second connection points (311).

6. The chip mounting structure for a quantum computer according to claim 4, characterized in that, The spring needle also includes a first spring (23) and a first pin (24), wherein, The main body shell (21) has a first inner hole (211) inside, and the first spring (23) is installed in the first inner hole (211); The first ejector pin (24) is divided into two sections, including an integral first inner section (241) and a first outer section (242). The first inner section (241) is inserted into the first inner hole (211) and contacts the first spring (23). The end of the first inner hole (211) is provided with a first limiting member (2111) to restrict the first inner section (241) from disengaging from the first inner hole (211).

7. The chip mounting structure for a quantum computer according to claim 6, characterized in that, The step (22) is located near the first limiting component (2111), and the end of the first outer section (242) is the first end of the connector (2). The end of the main body shell (21) away from the first limiting component (2111) is a closed structure.

8. The chip mounting structure for a quantum computer according to claim 7, characterized in that, The end of the main body shell (21) away from the first limiting member (2111) is the second end of the connector (2), wherein the end of the main body shell (21) away from the first limiting member (2111) passes through the socket (51).

9. The chip mounting structure for a quantum computer according to claim 7, characterized in that, The main body shell (21) has a needle bar (25) at one end away from the first limiting component (2111). The end of the needle bar (25) is the second end of the connector (2). The needle bar (25) passes through the inwardly recessed perforation (512) of the second end of the insertion hole (51). The diameter of the needle bar (25) is smaller than the diameter of the main body shell (21).

10. A chip mounting structure for a quantum computer according to any one of claims 5-9, characterized in that, The first connection point (111) is made of metal and is disc-shaped, tooth-shaped, or concave, wherein, When the first connection point (111) is disc-shaped or concave, the end of the first outer segment (242) is arc-shaped or planar. When the first connection point (111) is a first tooth, the end of the first outer segment (242) is a second tooth that meshes with the first tooth.

11. A quantum computer, characterized in that, The quantum computer includes the chip mounting structure as described in any one of claims 1-10.

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