A thin semiconductor package

Abstract

The application discloses a kind of light thin semiconductor packaging devices, including pedestal assembly, pressure regulating assembly, pressure mounting structure, pressure transmission mechanism, lift box and crossbeam, the crossbeam is fixedly connected on pedestal assembly, the pressure mounting structure is located on crossbeam, the pressure mounting structure is connected with pressure regulating assembly, the pressure regulating assembly includes power transmission structure and transmission control structure, the pressure transmission mechanism is located on crossbeam and power transmission structure.The application belongs to the technical field of semiconductor packaging, specifically refers to a kind of light thin semiconductor packaging device;The application is packaged by setting pressure regulating assembly and pressure mounting structure to the pressure of semiconductor, and the locking of power transmission structure is controlled by transmission control structure, the pressure of individual pressure mounting structure can be regulated, effectively solve the problem of pressure control when light thin semiconductor packaging of semiconductor packaging device and the problem of low yield of light thin semiconductor packaging.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor packaging, and particularly relates to a light and thin semiconductor packaging device. BACKGROUND

[0002] In the packaging process, the chip needs to be bonded to the substrate, and sufficient pressure needs to be applied to ensure that there is sufficient contact area and good bonding effect between the chip and the substrate, and the adhesive (such as silver paste, epoxy resin, etc.) is uniformly distributed and fully fills the gap between the chip and the substrate. However, due to the characteristics of the light and thin semiconductor, if a large pressing force is applied during the pressing process, the surface of the semiconductor may be easily arched to form a curved surface, thereby affecting the accuracy of the bonding of the semiconductor and the support and resulting in poor mounting effect. Therefore, the packaging pressure of the light and thin semiconductor needs to be controlled.

[0003] However, compared with the traditional semiconductor packaging device, the use of sensors and control systems for pressure control during packaging requires a complex control system and expensive equipment, which is high in cost. In addition, when batch packaging is performed, the use of the overall packaging structure for packaging cannot well guarantee the packaging pressing force of each semiconductor, and it is inconvenient to adjust the pressing force of the individual pressing structure, resulting in a low yield of semiconductor packaging. Therefore, in order to reduce the cost of the light and thin semiconductor packaging equipment and facilitate the adjustment of the pressing force of the individual pressing structure, and improve the packaging yield of the light and thin semiconductor, the application provides a light and thin semiconductor packaging device. SUMMARY

[0004] In view of the above problems, the application provides a light and thin semiconductor packaging device to overcome the defects of the prior art. The packaging pressing of the semiconductor is realized by setting a pressure adjusting assembly and a pressing structure, and the locking of the power transmission structure is controlled by a transmission control structure. The pressure of the individual pressing structure can be adjusted, and the problems of expensive semiconductor packaging device and low packaging yield of the light and thin semiconductor are effectively solved.

[0005] The technical scheme adopted by the application is as follows: the application provides a light and thin semiconductor packaging device, which comprises a base assembly, a pressure adjusting assembly, a pressing structure, a pressure transmission mechanism, a lifting box and a cross beam. The cross beam is fixedly connected to the base assembly. The pressing structure is arranged on the cross beam. The pressing structure is connected to the pressure adjusting assembly. The pressure adjusting assembly comprises a power transmission structure and a transmission control structure. The pressure transmission mechanism is arranged on the cross beam and the power transmission structure. The pressure transmission mechanism is connected to the power transmission structure. The lifting box is arranged on the base assembly. The base assembly drives the transmission control structure to move up and down through the lifting box.

[0006] Furthermore, the power transmission structure includes a transmission plate, a rotating shaft, a locking gear, a balancing gear, a pressing rack, and a transmission rack. The transmission plate is slidably connected to the base assembly, the rotating shaft is rotatably connected to the transmission plate, the locking gear is fixedly connected to the rotating shaft, and a locking key is provided in the middle of the rotating shaft. The balancing gear is rotatably connected to the transmission plate, the pressing rack is slidably connected to the transmission plate, and the pressing rack meshes with the balancing gear. The transmission rack is slidably connected to the transmission plate, and the transmission rack meshes with the balancing gear. The transmission rack and the pressing rack are symmetrically arranged. The power transmission mechanism can transmit the power from the lifting box to the pressing structure, thereby pressing thin semiconductors.

[0007] Furthermore, the transmission control structure includes a follower block, a first synchronous rack, a transmission block, a transmission roller, a second synchronous rack, and a return spring. The first synchronous rack is fixedly connected to the follower block, and the second synchronous rack is fixedly connected to the transmission block. Guide rollers are rotatably connected to both the follower block and the transmission block. A sliding groove is provided on the transmission plate, and the guide rollers are disposed in the sliding groove. Locking plates are fixedly connected to both the follower block and the transmission block, and locking rings are fixedly connected to the locking plates. The locking rings can be engaged with locking keys. The transmission control structure can control the transmission and stopping of the power transmission mechanism.

[0008] Furthermore, a reversing gear is rotatably connected to the transmission plate, and both the first and second synchronous racks are meshed with the reversing gear.

[0009] Furthermore, the pressure transmission mechanism includes a pressure box, a pressure piston block, a pressure dividing rod, an adjusting piston block, a threaded rod, a driven box, a driven piston, and an adjusting spring. The pressure box is fixedly connected to the crossbeam, the pressure piston block is slidably connected inside the pressure box, the pressure dividing rod is fixedly connected to the pressure piston block, the adjusting piston block is slidably connected inside the pressure box, and both ends of the adjusting spring are fixedly connected to the pressure piston block and the adjusting piston block, respectively. A threaded sleeve is fixedly connected to the bottom of the pressure box, the threaded rod is threadedly connected to the threaded sleeve, the threaded rod is rotatably connected to the adjusting piston block, and an adjusting ring is fixedly connected to the threaded rod. The adjusting ring is located outside the pressure box. The driven box is fixedly connected to the transmission plate, the driven piston is slidably connected inside the driven box, the pressure box has a first connector, the driven box has a second connector, and a connecting pipe is provided between the first connector and the second connector.

[0010] Furthermore, a connecting block is fixedly connected to the pressure dividing rod, the connecting block is fixedly connected to the transmission rack, and a push rod is fixedly connected to the driven piston, the push rod is fixedly connected to the transmission block.

[0011] Further, the pressing structure comprises a pressing column, a pressing block, a guide column, a pressing spring and a pressing head, a connecting plate, the pressing column is slidably connected to the cross beam, the pressing column is fixedly connected with a limiting plate, the two ends of the pressing spring are fixedly connected to the pressing block and the limiting plate respectively, the guide column is fixedly connected to the pressing block, the guide column is slidably connected to the cross beam, the pressing block is fixedly connected with the guide column, and the pressing head is fixedly connected

[0012] On the pressing block, the connecting plate is fixedly connected with the pressing column, the guide column is slidably connected to the connecting plate, and the connecting plate is fixedly connected with the pressing rack.

[0013] Further, the base assembly comprises a rack, a fixing frame, a driving motor, a lead screw, a synchronous pulley, a lifting plate and a fixed plate, the fixing frame is fixedly connected to the rack, the driving motor is fixedly installed on the fixing frame, the lead screw is rotatably connected to the fixing frame, the synchronous pulley is fixedly connected to the lead screw, the lead screw and the synchronous pulley are both provided with two groups, and the synchronous pulley is provided with a synchronous belt, one group of the lead screw is fixedly connected to the output end of the driving motor, the lifting plate is slidably connected to the fixing frame, the lifting plate is threadedly connected with the lead screw, the fixed plate is fixedly connected to the fixing frame, the fixed plate is fixedly connected with a guide frame, the fixed plate is fixedly connected with a locking rack, and the rack is provided with an encapsulation base.

[0014] Further, the transmission plate is slidably connected to the guide frame, and the locking gear is meshingly connected with the locking rack.

[0015] Further, the lifting box is provided with an upper driving surface and a lower driving surface, the transmission roller is arranged between the upper driving surface and the lower driving surface, the lifting box is fixedly connected with an outer supporting block, and the top of the lifting box is provided with a through hole.

[0016] The beneficial effects achieved by the above structure are as follows:

[0017] (1) In order to solve the problem that the whole encapsulation structure is used for encapsulation when the semiconductor encapsulation device encapsulates in batches, the encapsulation pressure of a single semiconductor cannot be well guaranteed, the pressure of the independent pressing structure cannot be adjusted, and the yield of the semiconductor encapsulation is low, the power transmission structure is arranged to realize transmission of the pressing structure, the pressing structures are independent of each other, the encapsulation pressure of each semiconductor can be guaranteed, and the yield of the thin semiconductor encapsulation is effectively improved.

[0018] (2) Wherein, the transmission control structure controls the power transmission structure according to the pressure of the pressing structure, when the pressure of the pressure head on the thin semiconductor reaches the set value, the driven piston pushes the transmission block through the push rod, so that the locking ring tightly locks the locking key, at the same time, the transmission roller and the upper driving surface are out of contact, so that the locking gear cannot rotate, and under the meshing action of the locking gear and the locking rack, the power transmission structure is fixed and locked, so that the pressure head is fixed at the pressing position, realizing the precise pressing of the thin semiconductor, avoiding the problem that the thin semiconductor packaging equipment needs complex control system and expensive equipment and instruments for pressure control;

[0019] (3) Wherein, by setting the power transmission structure and the transmission control structure, when the power transmission structure is fixed and locked, the transmission roller and the upper driving surface are out of contact, so that the lifting box no longer transmits power to the power transmission structure and the transmission control structure, the driving motor can continue to drive other lifting plates to move downward, so that the device can press each group of pressing structure respectively, thereby facilitating the regulation of the pressing force of each group of thin semiconductor packaging, solving the problem of inconvenient adjustment of the pressing force of single pressing structure;

[0020] (4) In addition, the pressure tank is provided with a threaded rod and an adjusting ring, when the worker rotates the adjusting ring, the threaded rod drives the adjusting piston block to move in the pressure tank, so as to change the spring force of the adjusting spring, and then change the driving force of the balance gear to the pressing rack and the transmission rack, realizing the adjustment of the pressing force of the thin semiconductor, and improving the flexibility of the semiconductor packaging pressing force. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a perspective view of a thin semiconductor packaging device proposed by the present application;

[0022] Figure 2 It is a partial structure perspective view of a thin semiconductor packaging device proposed by the present application;

[0023] Figure 3 It is a partial structure side view of a thin semiconductor packaging device proposed by the present application;

[0024] Figure 4 It is Figure 3 the explosion structure schematic diagram;

[0025] Figure 5 It is a structure schematic diagram of a pressure adjusting assembly of a thin semiconductor packaging device proposed by the present application;

[0026] Figure 6 It is a side view of the pressure adjusting assembly;

[0027] Figure 7 It is an explosion schematic diagram of the pressure adjusting assembly;

[0028] Figure 8 A schematic diagram of a transmission control structure;

[0029] Figure 9 A partial exploded schematic of a thin semiconductor packaging device according to the present invention Figure 1 ;

[0030] Figure 10 A partial exploded schematic of a thin semiconductor packaging device according to the present invention Figure 2 ;

[0031] Figure 11 A schematic diagram of a pressure transmission mechanism of a thin semiconductor packaging device according to the present invention;

[0032] Figure 12 A schematic diagram of a press-fit structure of a thin semiconductor packaging device according to the present invention;

[0033] Figure 13 A Figure X partial enlarged view of II in FIG. 1;

[0034] Figure 14 A schematic diagram of a base assembly in perspective view;

[0035] Figure 15 A side view of the base assembly in perspective view.

[0036] Wherein, 1, base assembly; 2, pressure regulating assembly; 3, pressure mounting structure; 4, pressure transmission mechanism; 5, power transmission structure; 6, transmission control structure; 7, lifting box; 8, outer support block; 9, through hole; 10, packaging base; 11, crossbeam; 101, rack; 102, fixed frame; 103, drive motor; 104, lead screw; 105, synchronous pulley; 106, synchronous belt; 107, lifting plate; 108, fixed plate; 109, guide frame; 110, locking rack; 301, lower pressing column; 302, limit plate; 303, pressing block; 304, guide column; 305, pressure mounting spring; 306, pressure head; 307, connecting plate; 401, pressure box; 402, pressure piston block; 403, pressure dividing rod; 404, connecting block; 405, adjusting piston block; 406, threaded sleeve; 407, threaded rod; 408, adjusting ring; 409, joint one; 410, driven box; 411, driven piston; 412, push rod; 413, joint two; 414, adjusting spring; 415, connecting pipe; 501, transmission plate; 502, rotating shaft; 503, locking key; 504, locking gear; 505, reversing gear; 506, sliding groove; 507, balancing gear; 508, pressure mounting rack; 509, transmission rack; 601, follower block; 602, guide roller; 603, first synchronous rack; 604, transmission block; 605, transmission roller; 606, second synchronous rack; 607, locking plate; 608, locking ring; 609, return spring; 701, upper driving surface; 702, lower driving surface.

[0037] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation on the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0040] As Figures 1-15As shown, the present application provides a light and thin semiconductor packaging device, which comprises a base assembly 1, a pressure adjusting assembly 2, a pressing structure 3, a pressure conducting mechanism 4, a lifting box 7 and a crossbeam 11, the crossbeam 11 is fixedly connected to the base assembly 1, the pressing structure 3 is arranged on the crossbeam 11, the pressing structure 3 is connected to the pressure adjusting assembly 2, the pressure adjusting assembly 2 comprises a power conducting structure 5 and a transmission control structure 6, the pressure conducting mechanism 4 is arranged on the crossbeam 11 and the power conducting structure 5, the pressure conducting mechanism 4 is connected to the power conducting structure 5, the lifting box 7 is arranged on the base assembly 1, and the base assembly 1 drives the transmission control structure 6 to move up and down through the lifting box 7.

[0041] The power conducting structure 5 comprises a transmission plate 501, a rotating shaft 502, a locking gear 504, a balance gear 507, a pressing rack 508 and a conducting rack 509, the transmission plate 501 is slidingly connected to the base assembly 1, the rotating shaft 502 is rotatably connected to the transmission plate 501, the locking gear 504 is fixedly connected to the rotating shaft 502, the middle part of the rotating shaft 502 is provided with a locking key 503, the balance gear 507 is rotatably connected to the transmission plate 501, the pressing rack 508 is slidingly connected to the transmission plate 501, the pressing rack 508 is in meshing connection with the balance gear 507, the conducting rack 509 is slidingly connected to the transmission plate 501, the conducting rack 509 is in meshing connection with the balance gear 507, the conducting rack 509 is symmetrically arranged with the pressing rack 508, the transmission control structure 6 comprises a follow-up block 601, a first synchronous rack 603, a transmission block 604, a transmission roller 605, a second synchronous rack 606 and a return spring 609, the first synchronous rack 603 is fixedly connected to the follow-up block 601, the second synchronous rack 606 is fixedly connected to the transmission block 604, the follow-up block 601 and the transmission block 604 are rotatably connected with a guide roller 602, a sliding groove 506 is arranged on the transmission plate 501, the guide roller 602 is arranged in the sliding groove 506, the follow-up block 601 and the transmission block 604 are fixedly connected with a locking plate 607, the locking plate 607 is fixedly connected with a locking ring 608, the locking ring 608 is in meshing connection with the locking key 503, the transmission plate 501 is rotatably connected with a reversing gear 505, the first synchronous rack 603 and the second synchronous rack 606 are in meshing connection with the reversing gear 505, when the reversing gear 505 rotates, it can drive the first synchronous rack 603 and the second synchronous rack 606 to move synchronously, so as to drive the locking ring 608 to tightly lock the locking key 503 from both sides of the locking key 503.

[0042] Furthermore, the pressure conducting mechanism 4 comprises a pressure box 401, a pressure piston block 402, a pressure distribution rod 403, an adjusting piston block 405, a threaded rod 407, a driven box 410, a driven piston 411 and an adjusting spring 414, the pressure box 401 is fixedly connected to the cross beam 11, the pressure piston block 402 is slidingly connected in the pressure box 401, the pressure distribution rod 403 is fixedly connected to the pressure piston block 402, the adjusting piston block 405 is slidingly connected in the pressure box 401, the two ends of the adjusting spring 414 are fixedly connected to the pressure piston block 402 and the adjusting piston block 405 respectively, the bottom of the pressure box 401 is fixedly connected with a threaded sleeve 406, the threaded rod 407 is threadedly connected to the threaded sleeve 406, the threaded rod 407 is rotationally connected to the adjusting piston block 405, the threaded rod 407 is fixedly connected with an adjusting ring 408, the adjusting ring 408 is arranged outside the pressure box 401, when the adjusting ring 408 is rotated, the adjusting ring 408 drives the threaded rod 407 to rotate, so as to change the position of the adjusting piston block 405 in the pressure box 401, and then change the driving force of the balance gear 507 to the pressure gear rack 508 and the conducting gear rack 509, so as to adjust the pressing force of the thin semiconductor, the driven box 410 is fixedly connected to the transmission plate 501, the driven piston 411 is slidingly connected in the driven box 410, the pressure box 401 is provided with a joint one 409, the driven box 410 is provided with a joint two 413, a connecting pipe 415 is arranged between the joint one 409 and the joint two 413, the pressure distribution rod 403 is fixedly connected with a connecting block 404, the connecting block 404 is fixedly connected to the conducting gear rack 509, the driven piston 411 is fixedly connected with a push rod 412, the push rod 412 is fixedly connected to the transmission block 604.

[0043] Furthermore, the pressure installation structure 3 comprises a pressing column 301, a pressing block 303, a guide column 304, a pressing spring 305 and a pressing head 306, a connecting plate 307, the pressing column 301 is slidingly connected to the cross beam 11, the pressing column 301 is fixedly connected with a limiting plate 302, the two ends of the pressing spring 305 are fixedly connected to the pressing block 303 and the limiting plate 302 respectively, the guide column 304 is fixedly connected to the pressing block 303, the guide column 304 is slidingly connected to the cross beam 11, the pressing block 303 is fixedly connected to the guide column 304, the pressing head 306 is fixedly connected to the pressing block 303, the connecting plate 307 is fixedly connected to the pressing column 301, the guide column 304 is slidingly connected to the connecting plate 307, the guide column 304 can provide guidance for the lifting movement of the pressing head 306, so that the pressing head 306 can be accurately pressed on the semiconductor, and the connecting plate 307 is fixedly connected to the pressure gear rack 508.

[0044] Furthermore, the base assembly 1 comprises a rack 101, a fixing frame 102, a driving motor 103, lead screws 104, synchronous pulleys 105, a lifting plate 107 and a fixing plate 108, the fixing frame 102 is fixedly connected to the rack 101, the driving motor 103 is fixedly installed on the fixing frame 102, the lead screws 104 are rotatably connected to the fixing frame 102, the synchronous pulleys 105 are fixedly connected to the lead screws 104, the lead screws 104 and the synchronous pulleys 105 are both provided with two groups, the synchronous pulleys 105 are provided with synchronous belts 106, one group of the lead screws 104 is fixedly connected to the output end of the driving motor 103, the lead screw 104 drives the synchronous pulley 105 to rotate, and the two groups of lead screws 104 can synchronously rotate under the action of the synchronous belt 106, the lifting plate 107 is slidably connected to the fixing frame 102, the lifting plate 107 is threadedly connected to the lead screw 104, the fixing plate 108 is fixedly connected to the fixing frame 102, the fixing plate 108 is fixedly connected with a guide frame 109, the fixing plate 108 is fixedly connected with a locking rack 110, and the rack 101 is provided with the packaging substrate 10.

[0045] Furthermore, the transmission plate 501 is slidably connected to the guide frame 109, the locking gear 504 is meshedly connected to the locking rack 110, the lifting box 7 is provided with an upper driving surface 701 and a lower driving surface 702, the transmission roller 605 is arranged between the upper driving surface 701 and the lower driving surface 702, the lifting box 7 is fixedly connected with an outer supporting block 8, and the top of the lifting box 7 is provided with a through hole 9.

[0046] In specific use, when the packaging process of the thin semiconductor is performed, the driving motor 103 is started, the output end of the driving motor 103 drives the lead screw 104 to rotate, drives the lifting plate 107 to move downwards, drives the lifting box 7 to move downwards, the upper driving surface 701 in the lifting box 7 presses the transmission roller 605 downwards, so that the transmission control structure 6 moves downwards, at the same time, the guide roller 602 presses the transmission plate 501 downwards, so that the balance gear 507 moves downwards, the balance gear 507 drives the press-fitting rack 508 and the transmission rack 509 to move, the press-fitting rack 508 drives the lower pressing column 301 to move downwards through the connecting plate 307, so that the pressing head 306 presses and compresses the semiconductor, and then the semiconductor can be welded and packaged;

[0047] When the pressing rack 508 moves downward, the pressure difference between the pressing rack 508 and the transmission rack 509 is balanced under the action of the balancing gear 507, so that the pressure of the pressing rack 508 on the connecting plate 307 and the pressure of the transmission rack 509 on the connecting block 404 can be balanced. The pressure of the connecting plate 307 causes the pressing head 306 to press the thin and light semiconductor in the packaging substrate 10, and the pressure of the connecting block 404 compresses the adjusting spring 414 through the pressure distribution rod 403, and at the same time drives the hydraulic oil in the pressure tank 401 to flow into the driven tank 410, thereby pushing the driven piston 411 to move. The driven piston 411 pushes the transmission block 604 to move through the push rod 412. When the transmission block 604 moves, it drives the second synchronous rack 606 to move and drives the first synchronous rack 603 to move under the meshing action of the reversing gear 505, so that the driven block 601 and the transmission block 604 can move relatively close to each other, so that the locking ring 608 can move relatively close to each other, and the guide roller 602 moves in the sliding groove 506, the transmission roller 605 rolls on the upper driving surface 701, the locking gear 504 meshes with the locking rack 110 to make the rotating shaft 502 rotate. When the pressure of the pressing rack 508 on the connecting plate 307 compresses the adjusting spring 414 to a predetermined degree, the transmission roller 605 rolls to the through hole 9, so that the upper driving surface 701 cannot press the transmission roller 605 any more. At this time, the locking ring 608 holds the locking key 503 from both sides of the locking key 503, so that the rotating shaft 502 stops rotating, the locking gear 504 cannot rotate, and under the meshing action of the locking gear 504 and the locking rack 110, the power transmission structure 5 is locked and fixed, so that the movement of the lifting plate 107 no longer increases the pressure of the pressing rack 508 on the connecting plate 307, so that the pressure of the pressing head 306 on the semiconductor remains fixed.

[0048] When a group of pressing structures 3 reaches stability, because the transmission roller 605 is located in the through hole 9, the transmission roller 605 is separated from the upper driving surface 701, so that when the lifting plate 107 continues to move downward, each group of pressing structures 3 can be pressurized respectively, so as to facilitate the control of the pressing force during the packaging of each group of thin and light semiconductors.

[0049] When it is necessary to adjust the pressing force of the pressing head 306 on the thin and light semiconductor, the worker rotates the adjusting ring 408, which drives the adjusting piston block 405 to move in the pressure tank 401, thereby adjusting the compression degree of the adjusting spring 414, changing the spring force of the adjusting spring 414, and further changing the pressure of the balancing gear 507 on the pressing rack 508 and the transmission rack 509, so as to realize the adjustment of the pressing force of the thin and light semiconductor.

[0050] After the semiconductor is welded, the driving motor 103 drives the screw rod 104 reversely to rotate, so that the lifting plate 107 and the lifting box 7 are lifted upward, when the outer supporting block 8 contacts the transmission roller 605, the outer supporting block 8 pushes the transmission roller 605 to the two sides, and under the elastic force of the reset spring 609, the locking ring 608 is separated from the two sides of the locking key 503, the locking of the rotating shaft 502 is released, so that the power transmission structure 5 can be lifted upward with the lifting box 7, and the pressing of the semiconductor is released.

[0051] The above is the overall working process of the present application.

[0052] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a series of elements includes not only those elements, but also other elements not explicitly listed, or inherent to such a process, method, article or apparatus.

[0053] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

[0054] The above describes the present application and its embodiments, which are not limited, and the embodiments shown in the drawings are only one of the embodiments of the present application, and the actual structure is not limited thereto. In general, if a person skilled in the art is inspired by it, without departing from the purpose of the present application, without creative design, similar structure and embodiments of the technical solution can be designed, which should belong to the protection scope of the present application.

Claims

1. A thin and light semiconductor packaging device, characterized in that: The system includes a base assembly (1), a pressure regulating assembly (2), a press-fitting structure (3), a pressure transmission mechanism (4), a lifting box (7), and a crossbeam (11). The crossbeam (11) is fixedly connected to the base assembly (1). The press-fitting structure (3) is located on the crossbeam (11) and is connected to the pressure regulating assembly (2). The pressure regulating assembly (2) includes a power transmission structure (5) and a transmission control structure (6). The pressure transmission mechanism (4) is located on the crossbeam (11) and the power transmission structure (5) and is connected to the power transmission structure (5). The lifting box (7) is located on the base assembly (1). The base assembly (1) drives the transmission control structure (6) to move up and down through the lifting box (7). The power transmission structure (5) includes a transmission plate (501), a rotating shaft (502), a locking gear (504), a balance gear (507), a press-fit rack (508), and a transmission rack (509). The transmission plate (501) is slidably connected to the base assembly (1), the rotating shaft (502) is rotatably connected to the transmission plate (501), and the locking gear (504) is fixedly connected to the rotating shaft (502). A locking mechanism is provided in the middle of the rotating shaft (502). The key (503), the balance gear (507) is rotatably connected to the transmission plate (501), the press-fit rack (508) is slidably connected to the transmission plate (501), the press-fit rack (508) is meshed with the balance gear (507), the transmission rack (509) is slidably connected to the transmission plate (501), the transmission rack (509) is meshed with the balance gear (507), and the transmission rack (509) and the press-fit rack (508) are symmetrically arranged; The transmission control structure (6) includes a follower block (601), a first synchronous rack (603), a transmission block (604), a transmission roller (605), a second synchronous rack (606), and a return spring (609). The first synchronous rack (603) is fixedly connected to the follower block (601), and the second synchronous rack (606) is fixedly connected to the transmission block (604). Guide rollers (602) are rotatably connected to both the follower block (601) and the transmission block (604). A groove (506) is provided on the transmission plate (501), and the guide rollers (602) are located in the groove (506). Locking plates (607) are fixedly connected to both the follower block (601) and the transmission block (604). A locking ring (608) is fixedly connected to the locking plate (607), and the locking ring (608) can be engaged with the locking key (503).

2. The thin and light semiconductor packaging device according to claim 1, characterized in that: A reversing gear (505) is rotatably connected to the transmission plate (501), and the first synchronous rack (603) and the second synchronous rack (606) are both meshed with the reversing gear (505).

3. The thin and light semiconductor packaging device according to claim 2, characterized in that: The pressure transmission mechanism (4) includes a pressure box (401), a pressure piston block (402), a pressure dividing rod (403), an adjusting piston block (405), a threaded rod (407), a driven box (410), a driven piston (411), and an adjusting spring (414). The pressure box (401) is fixedly connected to the crossbeam (11). The pressure piston block (402) is slidably connected inside the pressure box (401). The pressure dividing rod (403) is fixedly connected to the pressure piston block (402). The adjusting piston block (405) is slidably connected inside the pressure box (401). The two ends of the adjusting spring (414) are respectively fixedly connected to the pressure piston block (402) and the adjusting piston block (405). 01) has a threaded sleeve (406) fixedly connected to its bottom. The threaded rod (407) is threadedly connected to the threaded sleeve (406). The threaded rod (407) is rotatably connected to the adjusting piston block (405). An adjusting ring (408) is fixedly connected to the threaded rod (407). The adjusting ring (408) is located outside the pressure box (401). The driven box (410) is fixedly connected to the transmission plate (501). The driven piston (411) is slidably connected inside the driven box (410). The pressure box (401) is provided with a connector one (409). The driven box (410) is provided with a connector two (413). A connecting pipe (415) is provided between the connector one (409) and the connector two (413).

4. The thin and light semiconductor packaging device according to claim 3, characterized in that: A connecting block (404) is fixedly connected to the pressure dividing rod (403), and the connecting block (404) is fixedly connected to the transmission rack (509). A push rod (412) is fixedly connected to the driven piston (411), and the push rod (412) is fixedly connected to the transmission block (604).

5. A thin and light semiconductor packaging device according to claim 4, characterized in that: The press-fit structure (3) includes a lower press column (301), a press block (303), a guide column (304), a press spring (305), a press head (306), and a connecting plate (307). The lower press column (301) is slidably connected to the crossbeam (11), and a limit plate (302) is fixedly connected to the lower press column (301). The two ends of the press spring (305) are fixedly connected to the press block (303) and the limit plate (302) respectively. The guide column (304) is connected to the crossbeam (11). 04) Fixedly connected to the pressure block (303), the guide column (304) is slidably connected to the crossbeam (11), the pressure block (303) is fixedly connected to the guide column (304), the pressure head (306) is fixedly connected to the pressure block (303), the connecting plate (307) is fixedly connected to the lower pressure column (301), the guide column (304) is slidably connected to the connecting plate (307), and the connecting plate (307) is fixedly connected to the press-fit rack (508).

6. The thin and light semiconductor packaging device according to claim 5, characterized in that: The base assembly (1) includes a frame (101), a fixed frame (102), a drive motor (103), a lead screw (104), a synchronous pulley (105), a lifting plate (107), and a fixed plate (108). The fixed frame (102) is fixedly connected to the frame (101), the drive motor (103) is fixedly mounted on the fixed frame (102), the lead screw (104) is rotatably connected to the fixed frame (102), and the synchronous pulley (105) is fixedly connected to the lead screw (104). Both the lead screw (104) and the synchronous pulley (105) are provided in two sets. A timing belt (106) is installed on a timing pulley (105), a set of lead screws (104) is fixedly connected to the output end of a drive motor (103), a lifting plate (107) is slidably connected to a fixed frame (102), the lifting plate (107) is threadedly connected to the lead screw (104), the fixed plate (108) is fixedly connected to the fixed frame (102), a guide frame (109) is fixedly connected to the fixed plate (108), a locking rack (110) is fixedly connected to the fixed plate (108), and an encapsulation base (10) is provided on the frame (101).

7. A thin and light semiconductor packaging device according to claim 6, characterized in that: The transmission plate (501) is slidably connected to the guide frame (109), and the locking gear (504) is meshed with the locking rack (110).

8. A thin and light semiconductor packaging device according to claim 7, characterized in that: The lifting box (7) is provided with an upper driving surface (701) and a lower driving surface (702). The transmission roller (605) is located between the upper driving surface (701) and the lower driving surface (702). An external support block (8) is fixedly connected inside the lifting box (7). A through hole (9) is opened on the top of the lifting box (7).

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