Inverter power system and manufacturing method thereof

Abstract

The present invention belongs to the field related to power systems, and specifically relates to an inverter power system and a manufacturing method thereof, including: an inverter power system; an inverter structure, the inverter structure including an inverter housing, an inverter body, a heat dissipation component a, a heat dissipation component b, a heat dissipation component c and a drying structure; the inverter power system includes an analysis unit, a processing unit and a control unit, the analysis unit is used to analyze the image heat source of the scanning mechanism, the processing unit is used to find the heat source with the highest temperature according to the analysis data of the analysis unit, and the control unit is used to control the heat dissipation component a to dissipate heat from the heat source according to the processing data of the processing unit. The heat source with the highest temperature on the image of the scanning mechanism is found by the analysis unit and the processing unit, and then the heat dissipation component a is moved to the top of the heat source for heat dissipation by the control unit, and the heat dissipation component b and the heat dissipation component c cool down the inverter body at the same time, achieving a better heat dissipation effect.

Description

Technical Field

[0001] The present invention belongs to the field of power systems, and in particular relates to an inverter power system and a manufacturing method thereof. Background Art

[0002] An inverter is a converter that converts DC power into constant-frequency and constant-voltage AC power. It is suitable for electrical appliances such as televisions, computers, washing machines, and fans.

[0003] At present, the inverter system of the inverter only controls the power of the cooling fan for heat dissipation, which cannot achieve a good heat dissipation effect. In addition, most inverters use cooling fans and heat sinks for heat dissipation, and the cooling fans cannot be adjusted according to the location of the heat source. In some areas in the south, it is relatively humid, and desiccant is needed to prevent the inside of the inverter from becoming humid, but most of the inverters currently do not have a good moisture-proof function. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the present invention provides an inverter power system and a manufacturing method thereof, wherein the heat source with the highest temperature on the scanning mechanism image is found out through an analysis unit and a processing unit, and then the heat dissipation component a is moved to above the heat source for heat dissipation through the control unit, and the heat dissipation component b and the heat dissipation component c cool the inverter body at the same time, thereby achieving a better heat dissipation effect, and the drying structure can prevent the inside of the inverter from becoming humid.

[0005] An inverter power system according to an embodiment of the present invention includes:

[0006] Inverter power system;

[0007] An inverter structure, comprising an inverter housing, an inverter body, a heat dissipation component a, a heat dissipation component b, a heat dissipation component c and a drying structure;

[0008] The inverter body is mounted on the inverter housing, the heat dissipation component a is mounted on the inverter housing, the heat dissipation component b is symmetrically mounted on the inverter body, the heat dissipation component c is mounted in the inverter housing and located at the bottom of the inverter body, and the drying structure is mounted on the inverter housing;

[0009] The heat dissipation assembly a comprises an X-axis moving mechanism, a Y-axis moving mechanism, a heat dissipation element and a scanning mechanism, wherein the X-axis moving mechanism is mounted on the inverter housing, the Y-axis moving mechanism is mounted on the X-axis moving mechanism, the heat dissipation element is mounted on the Y-axis moving mechanism, and the scanning mechanism is mounted on the heat dissipation element;

[0010] The inverter power system includes an analysis unit, a processing unit and a control unit. The analysis unit is used to analyze the image heat source of the scanning mechanism. The processing unit is used to find the heat source with the highest temperature according to the analysis data of the analysis unit. The control unit is used to control the heat dissipation component a to dissipate heat from the heat source according to the processing data of the processing unit.

[0011] An inverter power system of the present invention can drive a heat sink and a scanning mechanism to move along the X-axis and the Y-axis through an X-axis moving mechanism and a Y-axis moving mechanism, and can scan a heat source through the scanning mechanism. The scanned image is analyzed by an analysis unit, and a position with high heat generation is found through a processing unit. After receiving a signal from the processing unit, the control unit starts the X-axis moving mechanism and the Y-axis moving mechanism, and drives the heat sink to move to a specified position through the X-axis moving mechanism and the Y-axis moving mechanism, so that the position with more serious heat generation can be cooled. The heat dissipation components b and the heat dissipation components c can cool the inverter body at the same time, and better reduce the temperature inside the inverter housing. The drying structure is used to ensure the dryness of the inside of the inverter housing and prevent the inverter from getting damp.

[0012] According to some embodiments of the present invention, the X-axis moving structure includes a driving member a and a movable bearing plate;

[0013] The driving member a is mounted on the inner wall of the inverter housing;

[0014] The movable bearing plate is mounted on the output end of the driving member a;

[0015] The inverter housing is provided with a bearing groove, and the movable bearing plate is slidably connected in the bearing groove.

[0016] According to some embodiments of the present invention, the Y-axis moving mechanism includes a driving member b and a fixed platform;

[0017] The driving member b is fixedly arranged on the moving end of the X-axis moving structure;

[0018] The fixing platform is fixedly arranged on the output end of the driving member b.

[0019] According to some embodiments of the present invention, the heat sink is fixedly disposed on the bottom of the fixing platform, and a dustproof net is disposed on the heat sink.

[0020] According to some embodiments of the present invention, the heat dissipation assembly b includes an L-shaped heat conducting block and a plurality of conducting sheets;

[0021] One end of the vertical section of the L-shaped heat conductive block is fixedly disposed on the inverter body;

[0022] One end of the horizontal section of the L-shaped heat conductive block is integrally formed with one end of the vertical section of the L-shaped heat conductive block away from the inverter body;

[0023] One end of the horizontal section of the L-shaped heat conductive block away from the vertical section of the L-shaped heat conductive block is in close contact with the inner wall of the inverter housing;

[0024] The L-shaped heat conducting block is provided with a plurality of heat dissipation holes.

[0025] According to some embodiments of the present invention, the heat dissipation component c includes a plurality of heat dissipation columns;

[0026] A plurality of heat dissipation columns are installed in a rectangular array on the inner bottom of the inverter housing;

[0027] The inverter body is mounted on a plurality of the heat dissipation columns.

[0028] According to some embodiments of the present invention, the drying structure includes a plurality of movable carrying boxes, a clamping block, an anti-sliding block and a mesh plate.

[0029] According to some embodiments of the present invention, the movable carrying box is installed in the inverter housing;

[0030] The card block is symmetrically mounted on the movable carrying box;

[0031] The bottom of each of the blocks is provided with an anti-sliding block;

[0032] The mesh cover is arranged on the carrying box;

[0033] The inverter housing is provided with a sliding groove adapted to the clamping block.

[0034] According to some embodiments of the present invention, the carrier box includes an active state and a fixed state;

[0035] When the carrying box is in an active state, the carrying box is moved upward by an external force, at which time the anti-sliding block is separated from the bottom wall of the sliding groove, and the carrying box is movably installed in the inverter housing;

[0036] When the carrying box is in a fixed state, the anti-sliding block is tightly attached to the bottom wall of the sliding groove, and at this time the carrying box is fixed in the inverter housing.

[0037] One embodiment of the present invention provides a method for manufacturing an inverter, comprising:

[0038] The inverter power system as described in any one of the above embodiments, and

[0039] Inverter manufacturing steps:

[0040] (1) Design corresponding functional modules according to the functions of the inverter;

[0041] (2) Manufacturing PCB circuit board according to inverter function module;

[0042] (3) Installing a number of corresponding electronic components on a PCB circuit board to form a functional module;

[0043] (4) Design the heat dissipation structure according to the functional modules of the inverter;

[0044] (5) The heat dissipation structure is die-cast;

[0045] (6) Place the functional module into the mounting housing and connect it to the heat dissipation structure;

[0046] (7) After assembly is complete, install the housing seal.

[0047] The inverter power system provided by the above technical solution has the following beneficial effects:

[0048] 1. The driving member a can drive the movable carrier plate to move back and forth along the X-axis direction, thereby driving the driving member b to move. The driving member b drives the fixed platform and the heat sink to move. The moving direction of the heat sink is perpendicular to the moving direction of the movable carrier plate. The combination of the driving member a and the driving member b can drive the heat sink to move accordingly according to the position where the PCB circuit board is heated.

[0049] 2. The heat source can be scanned by the scanning mechanism, and the location with high heat generation can be found through the analysis unit. The heat sink can then be moved to the specified location through the X-axis moving mechanism and the Y-axis moving mechanism, so that the location with more serious heat generation can be cooled. The heat dissipation components b and c can cool the inverter body at the same time, so as to better reduce the temperature inside the inverter housing.

[0050] 3. Most of the heat generated on the PCB circuit board can be transferred to the inverter housing through the L-shaped heat conductive block, and the air flow in the inverter housing can be accelerated through the heat dissipation component to better dissipate heat. Part of the heat can also be exported through the heat dissipation holes on the L-shaped heat conductive block.

[0051] 4. The bagged desiccant can be placed through the movable carrying box, and the position of the movable carrying box can be moved by pushing the movable carrying box upward. After the movable carrying box is lowered again, the anti-sliding block contacts the bottom wall of the slide slot, so that the movable carrying box can be fixed on the slide slot without the need for locking parts to fix it, saving materials and facilitating operation.

[0052] 5. The analysis unit and the processing unit are used to find the heat source with the highest temperature on the scanning mechanism image, and then the control unit is used to move the heat dissipation component a to the top of the heat source for heat dissipation. The heat dissipation components b and c cool down the inverter body at the same time, achieving a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0054] Figure 1 It is a structural schematic diagram of the present invention;

[0055] Figure 2 This is a schematic diagram of the installation of the inverter body of the present invention;

[0056] Figure 3 It is a structural schematic diagram of the inverter housing of the present invention;

[0057] Figure 4 for Figure 3 A magnified image of point A;

[0058] Figure 5 It is a schematic cross-sectional structure diagram of the inverter housing of the present invention;

[0059] Figure 6 for Figure 5 The enlarged view of point B;

[0060] Figure 7 It is a schematic diagram of the structure of the heat dissipation hole of the present invention;

[0061] Figure 8 It is a structural schematic diagram of the present invention;

[0062] Fig. 9 It is a structural schematic diagram of the inverter power system of the present invention.

[0063] The markings in the figure are as follows:

[0064] 100, inverter housing; 110, bearing slot; 120, slide slot;

[0065] 200, inverter body;

[0066] 300, heat dissipation component a;

[0067] 310, X-axis moving mechanism;

[0068] 311, driving member a; 312, movable bearing plate;

[0069] 320, Y-axis moving mechanism;

[0070] 321, driving member b; 322, fixing platform;

[0071] 330, heat sink;

[0072] 340, scanning mechanism;

[0073] 400, heat dissipation component b; 410, L-shaped heat conduction block; 420, conduction sheet; 430, heat dissipation hole;

[0074] 500, heat dissipation component c; 510, heat dissipation column;

[0075] 600, dry structure;

[0076] 610, movable carrying box; 620, clamping block; 630, anti-sliding block; 640, mesh plate. DETAILED DESCRIPTION

[0077] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0078] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0079] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0080] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0081] Combination Figures 1 to 9As shown, one of the inverter power systems of the present invention includes:

[0082] Inverter power system;

[0083] An inverter structure, the inverter structure comprising an inverter housing 100, an inverter body 200, a heat dissipation component a300, a heat dissipation component b400, a heat dissipation component c500 and a drying structure 600;

[0084] The inverter body 200 is mounted on the inverter housing 100, the heat dissipation assembly a 300 is mounted on the inverter housing 100, the heat dissipation assembly b 400 is symmetrically mounted on the inverter body 200, the heat dissipation assembly c 500 is mounted in the inverter housing 100 and located at the bottom of the inverter body 200, and the drying structure 600 is mounted on the inverter housing 100;

[0085] The heat dissipation assembly a 300 includes an X-axis moving mechanism 310, a Y-axis moving mechanism 320, a heat dissipation member 330 and a scanning mechanism 340, wherein the X-axis moving mechanism 310 is mounted on the inverter housing 100, the Y-axis moving mechanism 320 is mounted on the X-axis moving mechanism 310, the heat dissipation member 330 is mounted on the Y-axis moving mechanism 320, and the scanning mechanism 340 is mounted on the heat dissipation member 330;

[0086] The inverter power system includes an analysis unit, a processing unit and a control unit. The analysis unit is used to analyze the image heat source of the scanning mechanism 340, the processing unit is used to find the heat source with the highest temperature according to the analysis data of the analysis unit, and the control unit is used to control the heat dissipation component a 300 to dissipate heat from the heat source according to the processing data of the processing unit.

[0087] An inverter power system of the present invention can drive a heat sink 330 and a scanning mechanism 340 to move along the X-axis and the Y-axis through an X-axis moving mechanism 310 and a Y-axis moving mechanism 320. The heat source can be scanned by the scanning mechanism 340. The scanned image is analyzed by an analysis unit, and a position with high heat generation is found by a processing unit. After receiving a signal from the processing unit, the control unit starts the X-axis moving mechanism 310 and the Y-axis moving mechanism 320, and drives the heat sink 330 to move to a specified position through the X-axis moving mechanism 310 and the Y-axis moving mechanism 320, so that the position with more serious heat generation can be cooled. The heat dissipation component b400 and the heat dissipation component c500 can cool the inverter body 200 at the same time, so as to better reduce the temperature inside the inverter housing 100. The drying structure 600 is used to ensure the dryness of the inside of the inverter housing 100 and prevent the inverter from getting damp.

[0088] In this embodiment, the heat sink 330 may be a fan, a hair dryer, or other components that can drive air circulation, which is not limited here;

[0089] The scanning mechanism 340 can be a thermal imager or other device that can detect the position of the heat source. It is not limited here. The temperature of the PCB circuit board can be detected by the thermal imager. The area with the highest temperature is detected by the target detection and recognition algorithm. After the detection is completed, the X-axis moving mechanism 310 and the Y-axis moving mechanism 320 are started to move the heat sink 330 to the top of the PCB circuit board where the temperature is the highest, and the area where the heat source is generated is fixed-point heat dissipation, which effectively improves the heat dissipation effect.

[0090] It should be noted that the scanning mechanism 340 is installed on the heat sink 330, which can refer to being installed on any side of the heat sink 330, but the scanning end of the scanning mechanism 340 is limited to face the PCB circuit board, so as to ensure the detection of temperature.

[0091] Further, in this extension, the scanning mechanism 340 can be rotatably installed on the heat sink 330, so that the heat source can be detected more accurately. The solution of fixing it on the heat sink 330 can also be implemented without affecting the detection of the heat source by the scanning mechanism 340.

[0092] Furthermore, after scanning the heat source through the scanning mechanism 340 , the area where the heat source is most concentrated is addressed, and then the heat sink 330 is moved above the heat source concentration, thereby cooling the inverter body 200 .

[0093] Specifically, the steps of scanning the heat source include:

[0094] According to the thermal imager, the temperature information of the PCB circuit board is obtained;

[0095] According to the temperature information of the PCB circuit board, the coordinates of the heat source concentration area are obtained.

[0096] In one embodiment, the X-axis moving structure includes a driving member a 311 and a movable carrying plate 312;

[0097] The driving member a 311 is mounted on the inner wall of the inverter housing 100;

[0098] The movable bearing plate 312 is mounted on the output end of the driving member a 311;

[0099] A bearing slot 110 is defined on the inverter housing 100 , and the movable bearing plate 312 is slidably connected in the bearing slot 110 .

[0100] In this embodiment, the driving member a 311 may be a cylinder, a screw structure or other mechanism that can drive the movable bearing plate 312 to move, and is not limited to this.

[0101] like Figure 3 As shown, the movable supporting plate 312 is used to support the Y-axis moving mechanism 320 , thereby driving the Y-axis moving mechanism 320 to move while moving.

[0102] It should be noted that the screw rod structure requires more parts than the cylinder, so it is preferred that the cylinder drives the movable bearing plate 312 to move.

[0103] In one embodiment, the Y-axis moving mechanism 320 includes a driving member b 321 and a fixing platform 322;

[0104] The driving member b 321 is fixedly arranged on the moving end of the X-axis moving structure;

[0105] The fixing platform 322 is fixedly disposed on the output end of the driving member b 321 .

[0106] In this embodiment, the driving member b 321 may be a cylinder, a screw structure or other mechanism that can drive the movable bearing plate 312 to move, and is not limited to this.

[0107] like Figure 4 As shown, the output end of the driver b 321 can drive the fixed platform 322 to move, thereby driving the heat sink 330 to move. Through the driver a 311 and the driver b 321, the movement range of the heat sink 330 can be consistent with the area of ​​the PCB circuit board of the inverter body 200, so that the position where the heat source is concentrated on the PCB board can be moved, thereby achieving a better heat dissipation effect.

[0108] It should be noted that the moving steps of the driving member a 311 and the driving member b 321 include:

[0109] According to the sensor, the coordinates of the heat source are obtained;

[0110] According to the coordinates where the heat source is concentrated, the driving element a 311 and the driving element b 321 are activated to move the heat sink 330 to a designated position.

[0111] Furthermore, installing a sensor on the scanning mechanism 340 is a common configuration at present, so the sensor is not mentioned in the claims, but is explained here.

[0112] In one embodiment, the heat sink 330 is fixedly disposed on the bottom of the fixing platform 322 , and a dustproof net is disposed on the heat sink 330 .

[0113] In this embodiment, if Figure 5-6 The dustproof net is used to prevent a large amount of dust from entering the heat sink 330, thereby affecting the life of the heat sink 330;

[0114] It should be noted that the dust screen can be removed from the heat sink 330, so that the staff can clean the heat sink 330 and the dust screen conveniently.

[0115] In one embodiment, the heat dissipation assembly b 400 includes an L-shaped heat conducting block 410 and a plurality of conducting sheets 420;

[0116] One end of the vertical section of the L-shaped heat conductive block 410 is fixedly disposed on the inverter body 200;

[0117] One end of the horizontal section of the L-shaped heat conductive block 410 is integrally formed with one end of the vertical section of the L-shaped heat conductive block 410 away from the inverter body 200;

[0118] One end of the horizontal section of the L-shaped heat conductive block 410 away from the vertical section of the L-shaped heat conductive block 410 is in close contact with the inner wall of the inverter housing 100;

[0119] The L-shaped heat conducting block 410 is provided with a plurality of heat dissipation holes 430 .

[0120] In this embodiment, the L-shaped heat conductive block 410 is used to connect the inverter body 200 and the inverter housing 100 respectively, and conduct heat to the inverter housing 100 and outside the inverter housing 100 .

[0121] It should be noted that the conductive sheet 420 is used to disperse the heat on the L-shaped heat conductive block 410, so as to achieve a better heat dissipation effect.

[0122] Furthermore, when the heat dissipation holes 430 accelerate the air flow inside the inverter housing 100 when the heat dissipation element 330 is used, a part of the airflow will conduct a part of the heat to the outside of the inverter housing 100 through the heat dissipation holes 430, thereby achieving a better heat dissipation effect.

[0123] Furthermore, Figure 7 As shown, the heat dissipation hole 430 is opened in a Z-shape on the L-shaped heat conductive block 410 .

[0124] In one embodiment, the heat dissipation component c 500 includes a plurality of heat dissipation columns 510;

[0125] A plurality of heat dissipation columns 510 are installed in a rectangular array at the inner bottom of the inverter housing 100;

[0126] The inverter body 200 is mounted on a plurality of the heat dissipation columns 510 .

[0127] In this embodiment, a plurality of heat dissipation columns 510 conduct the heat generated by the inverter body 200 to the bottom of the inverter housing 100 , thereby dissipating the heat of the inverter body 200 again.

[0128] It should be noted that, in order to better disperse the heat at the bottom of the inverter housing 100 , a supporting device needs to be provided outside the inverter housing 100 so that the bottom of the inverter housing 100 becomes hollow, thereby better dissipating the heat.

[0129] Furthermore, the material of the heat dissipation column 510 can be copper, aluminum, graphene or other materials that can achieve heat dissipation effect, and is not limited to one material.

[0130] In one embodiment, the drying structure 600 includes a plurality of movable carrying boxes 610, a block 620, an anti-sliding block 630 and a mesh plate 640;

[0131] The movable carrying box 610 is installed in the inverter housing 100;

[0132] The card block 620 is symmetrically mounted on the movable carrying box 610;

[0133] An anti-sliding block 630 is installed at the bottom of each of the clamping blocks 620;

[0134] The mesh plate 640 is covered on the carrying box;

[0135] The inverter housing 100 is provided with a slide groove 120 adapted to the clamping block 620;

[0136] The carrying box includes an active state and a fixed state;

[0137] When the carrying box is in an active state, the carrying box is moved upward by an external force, and at this time, the anti-sliding block 630 is separated from the bottom wall of the sliding groove 120, and at this time, the carrying box is movably installed in the inverter housing 100;

[0138] When the carrying box is in a fixed state, the anti-sliding block 630 is tightly attached to the bottom wall of the sliding groove 120 , and at this time, the carrying box is fixed in the inverter housing 100 .

[0139] In this embodiment, the bagged desiccant can be placed through the movable carrying box 610, and the position of the movable carrying box 610 can be moved by pushing the movable carrying box 610 upward. After the movable carrying box 610 is lowered again, the anti-slid block 630 contacts the bottom wall of the slide groove 120, so that the movable carrying box 610 can be fixed on the slide groove 120 without the need for locking parts to fix it, which saves materials and facilitates operation.

[0140] It should be noted that ventilation holes need to be provided on the movable carrying box 610 to achieve a better drying effect and not to block the heat sink 330 from driving the air flow above the inverter body 200 .

[0141] Further, a plurality of movable carrying boxes 610 may be installed as required. Since the humidity conditions in different areas are different, the number of movable carrying boxes 610 to be installed may be determined as required, and this is expanded upon.

[0142] One embodiment of the present invention provides a method for manufacturing an inverter, comprising:

[0143] The inverter power system as described in any one of the above embodiments, and

[0144] Inverter manufacturing steps:

[0145] (1) Design corresponding functional modules according to the functions of the inverter;

[0146] (2) Manufacturing PCB circuit board according to inverter function module;

[0147] (3) Installing a number of corresponding electronic components on a PCB circuit board to form a functional module;

[0148] (4) Design the heat dissipation structure according to the functional modules of the inverter;

[0149] (5) The heat dissipation structure is die-cast;

[0150] (6) Place the functional module into the mounting housing and connect it to the heat dissipation structure;

[0151] (7) After assembly is complete, install the housing seal.

[0152] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An inverter power system, characterized in that: include: Inverter power system; An inverter structure, comprising an inverter housing, an inverter body, a heat dissipation component a, a heat dissipation component b, a heat dissipation component c and a drying structure; The inverter body is mounted on the inverter housing, the heat dissipation component a is mounted on the inverter housing, the heat dissipation component b is symmetrically mounted on the inverter body, the heat dissipation component c is mounted in the inverter housing and located at the bottom of the inverter body, and the drying structure is mounted on the inverter housing; The heat dissipation assembly a comprises an X-axis moving mechanism, a Y-axis moving mechanism, a heat dissipation element and a scanning mechanism, wherein the X-axis moving mechanism is mounted on the inverter housing, the Y-axis moving mechanism is mounted on the X-axis moving mechanism, the heat dissipation element is mounted on the Y-axis moving mechanism, and the scanning mechanism is mounted on the heat dissipation element; The scanning mechanism is a thermal imager or other device capable of detecting the location of a heat source. The thermal imager can detect the temperature of the PCB circuit board. After the target detection and recognition algorithm detects the area with the highest temperature, the X-axis moving mechanism and the Y-axis moving mechanism are activated after the detection is completed, so as to move the heat sink to the top of the PCB circuit board with the highest temperature. The inverter power system includes an analysis unit, a processing unit and a control unit, wherein the analysis unit is used to analyze the image heat source of the scanning mechanism, the processing unit is used to find the heat source with the highest temperature according to the analysis data of the analysis unit, and the control unit is used to control the heat dissipation component a to dissipate heat from the heat source according to the processing data of the processing unit; The heat dissipation component b includes an L-shaped heat conducting block and a plurality of conducting sheets; One end of the vertical section of the L-shaped heat conductive block is fixedly disposed on the inverter body; One end of the horizontal section of the L-shaped heat conductive block is integrally formed with one end of the vertical section of the L-shaped heat conductive block away from the inverter body; One end of the horizontal section of the L-shaped heat conductive block away from the vertical section of the L-shaped heat conductive block is in close contact with the inner wall of the inverter housing; The L-shaped heat-conducting block is provided with a plurality of heat-dissipating holes, each of which is in a Z-shape; The heat dissipation component c includes a plurality of heat dissipation columns; A plurality of heat dissipation columns are installed in a rectangular array on the inner bottom of the inverter housing; The inverter body is mounted on a plurality of the heat dissipation columns; The drying structure includes a plurality of movable carrying boxes, a card block, an anti-sliding block and a mesh plate; The movable carrying box is installed in the inverter housing; The card block is symmetrically mounted on the movable carrying box; The bottom of each of the blocks is provided with an anti-sliding block; The mesh cover is arranged on the carrying box; The inverter housing is provided with a slide groove adapted to the clamping block; The carrying box includes an active state and a fixed state; When the carrying box is in an active state, the carrying box is moved upward by an external force, at which time the anti-sliding block is separated from the bottom wall of the sliding groove, and the carrying box is movably installed in the inverter housing; When the carrying box is in a fixed state, the anti-sliding block is tightly attached to the bottom wall of the sliding groove, and at this time the carrying box is fixed in the inverter housing.

2. The inverter power system according to claim 1, characterized in that: The X-axis moving mechanism includes a driving member a and a movable bearing plate; The driving member a is mounted on the inner wall of the inverter housing; The movable bearing plate is mounted on the output end of the driving member a; The inverter housing is provided with a bearing groove, and the movable bearing plate is slidably connected in the bearing groove.

3. The inverter power system according to claim 1, characterized in that: The Y-axis moving mechanism includes a driving member b and a fixed platform; The driving member b is fixedly arranged on the moving end of the X-axis moving mechanism; The fixing platform is fixedly arranged on the output end of the driving member b.

4. The inverter power system according to claim 3, characterized in that: The heat sink is fixedly arranged at the bottom of the fixing platform, and a dustproof net is arranged on the heat sink.

5. A method for manufacturing an inverter, characterized in that: include: The inverter power system according to any one of claims 1 to 4, and Inverter manufacturing steps: (1) Design corresponding functional modules according to the functions of the inverter; (2) Manufacture PCB circuit boards based on inverter functional modules; (3) Installing a number of corresponding electronic components onto a PCB circuit board to form a functional module; (4) Design the heat dissipation structure according to the functional modules of the inverter; (5) The heat dissipation structure is die-cast; (6) Place the functional module into the mounting housing and connect it to the heat dissipation structure; (7) After assembly, install the housing seal.

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