Semiconductor chip packaging device and method

Abstract

A semiconductor chip packaging device and method, belonging to the field of chip processing technology, is intended to solve the problem that it is not convenient to automatically isolate the packaging process during traditional chip processing, resulting in the chip being easily affected by external factors during packaging, thereby causing accidents in the packaging process or reduced chip quality. The present invention uses the cooperation of a first extrusion component and a conveyor belt to change the position of a lead frame, and a lifting arm descends so that a group of grains are attached to corresponding positions on the lead frame through an adhesive. The adhesion of the grains and the lead frame is inside the isolation frame, avoiding the adhesion work from being affected by external factors. The present invention realizes the effect of facilitating automatic isolation of the packaging process during chip processing and not being easily affected by external factors.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a semiconductor chip packaging device and method. Background Art

[0002] Chip is a general term for semiconductor component products, also known as integrated circuits, microcircuits, microchips, wafers / chips. In electronics, it is a way of miniaturizing circuits, mainly including semiconductor devices, but also passive components, and is often manufactured on the surface of semiconductor wafers. Chip packaging is usually required in the chip manufacturing process. Chip packaging refers to the process of laying out, pasting, fixing and connecting chips on a frame or substrate, and fixing them with plastic after passing through wiring terminals to form a three-dimensional structure.

[0003] In the packaging process of traditional chip processing, it is not convenient to automatically isolate the packaging process, which makes the chip easily affected by external factors during packaging, resulting in accidents in the packaging process or reduced chip quality. Traditional chip packaging devices are not convenient for coordinating and moving the lead frame during transportation, resulting in low chip packaging efficiency. In addition, traditional chip packaging devices are not convenient for setting up an automatic lifting structure to ensure the chip packaging environment and chip adhesion.

[0004] In view of the above problems, a semiconductor chip packaging device and method are proposed. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor chip packaging device and method, which solves the problem that in the packaging process of traditional chip processing in the background technology, it is not convenient to automatically isolate the packaging process, resulting in the chip being easily affected by external factors during packaging, thereby causing accidents in the packaging process or reduced chip quality. The traditional chip packaging device is not convenient for the coordinated movement of the lead frame during transportation, resulting in low chip packaging efficiency, and the traditional chip packaging device is not convenient for setting an automatic lifting structure to ensure the chip packaging environment and chip adhesion.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a semiconductor chip packaging device, comprising a first conveying mechanism and a second conveying mechanism arranged on one side of the first conveying mechanism, a multi-axis robot arm is arranged at a spacing position between the first conveying mechanism and the second conveying mechanism, an isolation mechanism is arranged at the upper end of the second conveying mechanism, the second conveying mechanism comprises a conveying frame and a conveying belt arranged inside the conveying frame, a lead frame is arranged on the upper side of the conveying belt, a fixing plate is arranged on one side of the conveying frame, a first extrusion assembly and a second extrusion assembly are arranged inside the conveying frame, the first extrusion assembly and the second extrusion assembly are located at the same horizontal position, the first extrusion assembly and the second extrusion assembly are components made of the same structure, and the first extrusion assembly and the second extrusion assembly are located above the conveying belt;

[0007] The first extrusion assembly includes a servo motor arranged inside the conveyor frame, one side of the servo motor is connected to a first rolling wheel through a shaft, and a first belt is arranged on the outside of the first rolling wheel. The first extrusion assembly also includes a first fixed disk and a second fixed disk fixedly arranged inside the conveyor frame, the second fixed disk is penetrated by the shaft arranged on one side of the servo motor, and a first connecting shaft is arranged on one side of the second fixed disk. The servo motor is movably connected to the first connecting shaft through the shaft, a first penetration bar is movably arranged on one side of the first connecting shaft, a third fixed connecting block is fixedly connected to one side of the first penetration bar, a fixing bar is arranged on the outside of the third fixed connecting block, the fixing bar is fixedly connected to the inside of the conveyor frame, the third fixed connecting block is embedded in the fixing bar, a clamping bar is connected to one side of the fixing bar, an electric telescopic block is embedded in the clamping bar, and the first extrusion assembly is rotatably connected to the second extrusion assembly through the first belt.

[0008] Furthermore, a connecting hollow ring is provided on one side of the first rolling wheel, a component groove is opened through the inside of the first fixed disk, the connecting hollow ring is located inside the component groove, a sensing element is provided inside the component groove, and the sensing element is provided in multiple groups. An indicator block is provided on the outside of the connecting hollow ring, and the multiple groups of sensing elements are evenly arranged in a semicircular state inside the component groove.

[0009] Furthermore, the first conveying mechanism includes a conveying plate arranged inside the first conveying mechanism and a placement groove opened inside the conveying plate, and a wafer is arranged inside the placement groove, and the multi-axis robotic arm is provided with a lifting arm.

[0010] Furthermore, a pier is arranged inside the conveyor frame, and a lifting column is arranged inside the pier, and multiple groups of lifting columns are arranged, one end of the multiple groups of lifting columns is connected to the conveyor belt, and the fixed plate includes a through groove arranged inside it and a conveyor feed belt arranged inside the through groove.

[0011] Furthermore, the isolation mechanism includes an isolation frame arranged at the upper end of the conveyor frame and a lifting assembly arranged on one side of the isolation frame. A component groove is arranged through the upper end of the isolation frame, and the component groove matches the lifting hand. A first transmission assembly is arranged on one side of the lifting assembly. A downward pressure assembly is also arranged inside the isolation mechanism. A second transmission assembly is arranged on the upper end of the downward pressure assembly. An exhaust groove is opened on one side of the isolation mechanism, and an exhaust fan is arranged inside the exhaust groove.

[0012] Furthermore, the lifting assembly includes a lifting door movably arranged on one side of the isolation frame and a tooth groove opened on one side of the lifting door, a first meshing wheel is meshed with one side of the tooth groove, the first meshing wheel is connected to the double-headed motor through an axis, a second rolling wheel is connected to one side of the double-headed motor through an axis, and a second belt is arranged on the outer side of the second rolling wheel.

[0013] Furthermore, the second transmission assembly includes a third rolling wheel arranged inside the isolation frame and a second meshing wheel connected to the third rolling wheel through an axis, the third rolling wheel is connected to the second rolling wheel through a second belt, a third meshing wheel is meshingly arranged on one side of the second meshing wheel, a first fixed connecting block is arranged on one side of the third meshing wheel, the first fixed connecting block is fixedly connected to the inside of the isolation frame, a second connecting shaft is arranged on one side of the first fixed connecting block, the third meshing wheel is movably connected to the second connecting shaft through the axis passing through the first fixed connecting block, a second penetration strip is arranged on one side of the second connecting shaft, and one end of the second connecting shaft is movably embedded in the second penetration strip.

[0014] Furthermore, a connecting bar is fixedly connected to one side of the second penetration bar, a rack is provided on one side of the connecting bar, a clamping lifting bar is provided on the side of the connecting bar, and the connecting bar is clamped on one side of the clamping lifting bar, the clamping lifting bar is fixedly connected to the inside of the isolation frame, a fourth meshing wheel is meshed with one side of the rack, a central axis and a second fixed connecting block are provided on one side of the fourth meshing wheel, and the central axis penetrates the second fixed connecting block to be connected to the discharge fan, and the second fixed connecting block is fixedly connected to the inside of the isolation frame.

[0015] Furthermore, the downward pressure assembly includes a downward pressure plate arranged inside the isolation frame and a limiting hollow column and a connecting column arranged on the upper end of the lower pressure plate. The connecting column is embedded inside the limiting hollow column. The limiting hollow column is fixedly connected to the interior of the isolation frame. One end of the connecting column is connected to the downward pressure plate, and the other end is connected to the connecting strip.

[0016] Another technical solution proposed by the present invention is to provide an implementation method of a semiconductor chip packaging device, comprising the following steps:

[0017] S1: placing the cut wafers in a group of placement grooves, using a multi-axis robotic arm to make the position of the cut die in the wafer be at the lower end of the lifting arm, the multi-axis robotic arm descends through the lifting arm to make the die stick to the corresponding position on the lead frame through the adhesive, and then make the position of the die of another group be at the lower end of the lifting arm, and the lead frame is changed through the cooperation of the first extrusion component and the conveyor belt, and the lifting arm descends again to make the die of this group stick to the corresponding position on the lead frame through the adhesive;

[0018] S2: After the corresponding positions on the lead frame are pasted, the conveyor belt moves the lead frame, and the double-headed motor drives the first meshing wheel and the second rolling wheel to rotate. The rotation of the first meshing wheel can make the lifting door rise. At this time, the lower pressure plate rises and falls back and forth. The lowering of the lower pressure plate can press down the lead frame directly below it, so that the die is pasted more closely, and the rotation of the exhaust fan will discharge the air inside the isolation mechanism;

[0019] S3: After the lower pressure plate is lifted and lowered, the conveyor belt transmits the lead frame out of the conveyor frame through the lifting assembly to the next transmission device. At this time, the double-headed motor drives the first meshing wheel to rotate, causing the lifting door to descend. At this point, all implementation steps are completed.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. A semiconductor chip packaging device and method provided by the present invention places the cut wafer inside a group of placement grooves, uses a multi-axis mechanical arm to make the position of the cut grains in the wafer be at the lower end of the lifting hand, places a lead frame inside the through groove, that is, on the upper side of the conveying feed belt, and the lead frame is conveyed to the upper side of the conveying feed belt by the conveying feed belt, and then conveyed by the conveying belt so that the lead frame is in a position between a first extrusion component and a second extrusion component, at this time, the multi-axis mechanical arm descends through the lifting hand so that the grains are attached to the corresponding positions on the lead frame through an adhesive, at this time, the lifting hand passes through the component groove, and then the lifting hand is retracted so that the multi-axis mechanical arm can rotate so that the position of the grains of another group is at the lower end of the lifting hand, and the lead frame is changed by the cooperation of the first extrusion component and the conveying belt, and the lifting hand descends again so that the grains of this group are attached to the corresponding positions on the lead frame through the adhesive, and the bonding effect of the grains and the lead frame is both inside the isolation frame to prevent the bonding work from being affected by external factors.

[0022] 2. A semiconductor chip packaging device and method provided by the present invention, when the lead frame is moved to a position between the first extrusion assembly and the second extrusion assembly, the conveyor belt is raised by extending the lifting column. At this time, the lead frame, the first extrusion assembly and the second extrusion assembly are at the same horizontal position, and the electric telescopic block is electrically driven to move to the outside of the clamping strip. Since the first extrusion assembly and the second extrusion assembly are components made of the same structure, that is, the two groups of electric telescopic blocks will clamp the lead frame, and the first rolling wheel is driven to rotate by the servo motor, that is, the first connecting shaft is rotated, so that the first penetration strip and the third fixed connecting block are moved to one side of the lead frame, and the third fixed connecting block provided in the second extrusion assembly is also moved, so that the two groups of electric telescopic blocks always clamp the lead frame. The lead frame, when the servo motor is driven, the indicator block will rotate. When the indicator block points to a group of sensing elements, an electrical signal will be sent to stop the servo motor from driving. That is, at this time, the lead frame is changed to wait for the pasting of the next group of grains. When the indicator block rotates and points to another group of sensing elements, the servo motor stops driving again to paste the next group of grains. Through the cooperation of the first extrusion assembly, the second extrusion assembly and the conveyor belt, the lifting hand can complete the pasting work only through the component groove, so that the isolation frame can isolate the working process. After the indicator block rotates half a circle, the other half circle will not point to any group of sensing elements, and the indicator block will rotate half a circle quickly. At this time, the first extrusion assembly and the second extrusion assembly will not clamp the lead frame.

[0023] 3. The present invention provides a semiconductor chip packaging device and method. When the corresponding positions on the lead frame are pasted, the conveyor belt transports the lead frame to move. When this group of lead frames moves to the position directly below the lower pressure plate, the double-headed motor drives the first meshing wheel and the second rolling wheel to rotate. The rotation of the first meshing wheel can make the lifting door rise, and the rotation of the second rolling wheel will cause the third rolling wheel to rotate, that is, the rotation of the second meshing wheel and the third meshing wheel will drive the second connecting shaft to rotate, so that the second through bar and the connecting bar make reciprocating motion. The reciprocating lifting of the connecting bar will cause the lower pressure plate to lift and reciprocate. The descent of the lower pressure plate can press down the lead frame directly below it, so that the grains are more closely attached. The reciprocating lifting of the connecting bar will also cause the fourth meshing wheel to rotate. The rotation of the fourth meshing wheel causes the central axis and the exhaust fan to rotate. The rotation of the exhaust fan will discharge the air inside the isolation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the first conveying mechanism, the multi-axis robot arm and the second conveying mechanism of the present invention;

[0026] Figure 3 It is a schematic structural diagram of the second conveying mechanism of the present invention;

[0027] Figure 4 It is a schematic structural diagram of the first extrusion assembly of the present invention;

[0028] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0029] Figure 6 It is a schematic diagram of the planar structure of the first fixed disk of the present invention;

[0030] Figure 7 It is a schematic diagram of the isolation mechanism structure of the present invention;

[0031] Figure 8 It is a schematic diagram of the planar structure of the isolation mechanism of the present invention;

[0032] Fig. 9 It is a schematic diagram of the structure of the lifting assembly of the present invention;

[0033] Fig.10 It is a schematic diagram of the structure of the pressing assembly of the present invention;

[0034] Fig.11 It is a schematic structural diagram of the second transmission assembly of the present invention.

[0035] In the figure: 1. first conveying mechanism; 11. conveying plate; 12. placement groove; 13. wafer; 2. multi-axis robot arm; 21. lifting hand; 3. second conveying mechanism; 31. conveying frame; 311. pier; 312. lifting column; 32. fixing plate; 321. through groove; 322. feeding belt; 33. conveyor belt; 34. first extrusion assembly; 341. servo motor; 342. first rolling wheel; 3422. indicator block; 3421. connecting hollow ring; 343. first belt; 344. first fixed disk; 3441. component slot; 3442. induction element; 345. second fixed disk; 346. first connecting shaft; 347. first through strip; 348. third fixed connection block; 3481. fixing strip; 349. locking strip; 3491. electric telescopic block; 35. second extrusion assembly ;36, lead frame;4, isolation mechanism;41, isolation frame;42, component groove;43, lifting assembly;431, lifting door;432, tooth groove;433, first meshing wheel;434, double-headed motor;435, second rolling wheel;436, second belt;44, first transmission assembly;45, pressing assembly;451, pressing plate;452, limiting hollow column;453, connecting column;46, second transmission assembly;461, third rolling wheel;462, second meshing wheel;463, third meshing wheel;464, first fixed connecting block;465, second connecting shaft;466, second penetration strip;467, connecting strip;468, engaging lifting strip;4681, rack;469, fourth meshing wheel;4691, second fixed connecting block;4692, center shaft;47, discharge fan;48, exhaust slot. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In order to solve the technical problem that it is not convenient to automatically isolate the chip during the packaging process, the chip is easily affected by external factors during packaging, resulting in unexpected packaging processes or reduced chip quality, such as Figure 1-Figure 3 and Figure 7 As shown, the following preferred technical solutions are provided:

[0038] A semiconductor chip packaging device includes a first conveying mechanism 1 and a second conveying mechanism 3 arranged on one side of the first conveying mechanism 1, a multi-axis robot arm 2 is arranged at a spacing position between the first conveying mechanism 1 and the second conveying mechanism 3, an isolation mechanism 4 is arranged at the upper end of the second conveying mechanism 3, the second conveying mechanism 3 includes a conveying frame 31 and a conveying belt 33 arranged inside the conveying frame 31, a lead frame 36 is arranged on the upper side of the conveying belt 33, a fixing plate 32 is arranged on one side of the conveying frame 31, a first extrusion assembly 34 and a second extrusion assembly 35 are arranged inside the conveying frame 31, the first extrusion assembly 34 and the second extrusion assembly 35 are located at the same horizontal position, and the first extrusion assembly 34 and the second extrusion assembly 35 are arranged at the same horizontal position. The extrusion assembly 35 is a component made of the same structure. The first extrusion assembly 34 and the second extrusion assembly 35 are located above the conveyor belt 33. The first conveying mechanism 1 includes a conveying plate 11 arranged therein and a placement groove 12 opened inside the conveying plate 11, and a wafer 13 is arranged inside the placement groove 12. The multi-axis robot arm 2 is provided with a lifting hand 21. A pier 311 is arranged inside the conveying frame 31, and a lifting column 312 is arranged inside the pier 311. The lifting column 312 is provided in multiple groups, and one end of the multiple groups of lifting columns 312 is connected to the conveyor belt 33. The fixed plate 32 includes a through groove 321 arranged therein and a conveying feed belt 322 arranged inside the through groove 321.

[0039] Specifically, the cut wafer 13 is placed inside a group of placement grooves 12, and the multi-axis robot arm 2 is used to make the position of the cut grain in the wafer 13 at the lower end of the lifting hand 21, and the lead frame 36 is placed inside the through groove 321, that is, on the upper side of the conveying feed belt 322. The lead frame 36 is conveyed to the upper side of the conveyor belt 33 through the conveying feed belt 322, and then the lead frame 36 is conveyed by the conveyor belt 33 so that the first extrusion assembly 34 and the second extrusion assembly 35 are located between them. At this time, the multi-axis robot arm 2 is lowered through the lifting hand 21 to make the grain The corresponding positions on the lead frame 36 are attached by adhesive. At this time, the lifting arm 21 passes through the component slot 42, and then the lifting arm 21 is retracted, so that the multi-axis robot arm 2 can rotate, so that the position of another group of grains is at the lower end of the lifting arm 21, and the lead frame 36 changes position through the cooperation of the first extrusion component 34 and the conveyor belt 33. The lifting arm 21 descends again so that this group of grains is attached to the corresponding positions on the lead frame 36 by adhesive. The bonding effect of the grains and the lead frame 36 is both inside the isolation frame 41 to prevent the bonding work from being affected by external factors.

[0040] In order to solve the technical problem that the conventional chip packaging device is not convenient for the lead frame to move during the transportation process, resulting in low chip packaging efficiency, such as Figure 4-Figure 6 As shown, the following preferred technical solutions are provided:

[0041] The first extrusion assembly 34 includes a servo motor 341 disposed inside the conveyor frame 31, one side of the servo motor 341 is connected to a first rolling wheel 342 through an axis, and a first belt 343 is disposed outside the first rolling wheel 342. The first extrusion assembly 34 also includes a first fixed plate 344 and a second fixed plate 345 fixedly disposed inside the conveyor frame 31, the second fixed plate 345 is penetrated by an axis disposed on one side of the servo motor 341, and a first connecting shaft 346 is disposed on one side of the second fixed plate 345. The servo motor 341 is movably connected to the first connecting shaft 346 through an axis, and a first penetration bar 347 is movably disposed on one side of the first connecting shaft 346, and a third fixed connecting block 348 is fixedly connected to one side of the first penetration bar 347, and a fixed bar 3481 is disposed on the outside of the third fixed connecting block 348, and the fixed bar 34 81 is fixedly connected to the inside of the conveyor frame 31, the third fixed connection block 348 is embedded in the fixed bar 3481, a locking bar 349 is connected to one side of the fixed bar 3481, and an electric telescopic block 3491 is embedded in the locking bar 349, the first extrusion component 34 is rotatably connected to the second extrusion component 35 through the first belt 343, a connecting hollow ring 3421 is provided on one side of the first rolling wheel 342, an element groove 3441 is opened through the inside of the first fixed disk 344, the connecting hollow ring 3421 is located inside the element groove 3441, a sensing element 3442 is provided inside the element groove 3441, and a plurality of groups of sensing elements 3442 are provided, an indicating block 3422 is provided on the outside of the connecting hollow ring 3421, and the plurality of groups of sensing elements 3442 are evenly arranged in a semicircular state inside the element groove 3441.

[0042] Specifically, when the lead frame 36 moves to a position between the first extrusion assembly 34 and the second extrusion assembly 35, the conveyor belt 33 rises by extending the lifting column 312. At this time, the lead frame 36, the first extrusion assembly 34 and the second extrusion assembly 35 are in the same horizontal position. The electric telescopic block 3491 is electrically driven to move to the outside of the locking strip 349. Since the first extrusion assembly 34 and the second extrusion assembly 35 are components made of the same structure, that is, the two groups of electric telescopic blocks 3491 will clamp the lead frame 36, and the first rolling wheel 342 is driven to rotate by the servo motor 341, that is, the first connecting shaft 346 is rotated, so that the first penetration strip 347 and the third fixed connection block 348 move to one side of the lead frame 36, and the third fixed connection block 348 provided in the second extrusion assembly 35 will also move, so that the two groups of electric telescopic blocks 3491 always clamp the lead frame 36. When 341 is driven, the indicating block 3422 will rotate. When the indicating block 3422 points to a group of sensing elements 3442, an electrical signal will be sent to stop the servo motor 341. That is, at this time, the lead frame 36 is changed to wait for the pasting of the next group of grains. When the indicating block 3422 rotates and points to another group of sensing elements 3442, the servo motor 341 stops driving again to paste the next group of grains. Through the cooperation of the first extrusion component 34, the second extrusion component 35 and the conveyor belt 33, the lifting hand 21 can complete the pasting work only through the component groove 42, so that the isolation frame 41 can isolate the working process. After the indicating block 3422 rotates half a circle, the other half circle will not point to any group of sensing elements 3442, and the indicating block 3422 will rotate half a circle quickly. At this time, the first extrusion component 34 and the second extrusion component 35 will not clamp the lead frame 36.

[0043] In order to solve the technical problem that the traditional chip packaging device is not convenient to set up an automatic lifting structure to ensure the chip packaging environment and chip pasting conditions, such as Figure 8-Figure 11 As shown, the following preferred technical solutions are provided:

[0044] The isolation mechanism 4 includes an isolation frame 41 arranged at the upper end of the conveyor frame 31 and a lifting assembly 43 arranged on one side of the isolation frame 41. A component groove 42 is provided through the upper end of the isolation frame 41, and the component groove 42 matches the lifting hand 21. A first transmission assembly 44 is provided on one side of the lifting assembly 43. A pressing assembly 45 is also provided inside the isolation mechanism 4, and a second transmission assembly 46 is provided on the upper end of the pressing assembly 45. An exhaust groove 48 is provided on one side of the isolation mechanism 4, and an exhaust fan 47 is provided inside the exhaust groove 48. The lifting assembly 43 includes a lifting door 431 movably provided on one side of the isolation frame 41 and a tooth groove 432 provided on one side of the lifting door 431. A first meshing wheel 433 is meshed on one side of the tooth groove 432. The first meshing wheel 433 is connected to a double-headed motor 434 through an axis, and a second rolling wheel 43 is connected to one side of the double-headed motor 434 through an axis. 5. A second belt 436 is arranged on the outer side of the second rolling wheel 435. The second transmission assembly 46 includes a third rolling wheel 461 arranged inside the isolation frame 41 and a second meshing wheel 462 connected to the third rolling wheel 461 through an axis. The third rolling wheel 461 is connected to the second rolling wheel 435 through the second belt 436. A third meshing wheel 463 is meshingly arranged on one side of the second meshing wheel 462. A first fixed connection block 464 is arranged on one side of the third meshing wheel 463. The first fixed connection block 464 is fixedly connected to the inside of the isolation frame 41. A second connecting shaft 465 is arranged on one side of the first fixed connection block 464. The third meshing wheel 463 is movably connected to the second connecting shaft 465 through the first fixed connection block 464 passing through the axis. A second penetration strip 466 is arranged on one side of the second connecting shaft 465. One end of the second connecting shaft 465 is movably engaged in the second penetration strip 466.

[0045] A connecting strip 467 is fixedly connected to one side of the second penetration strip 466, a rack 4681 is provided on one side of the connecting strip 467, a clamping lifting strip 468 is provided on the side of the connecting strip 467, and the connecting strip 467 is clamped on one side of the clamping lifting strip 468, and the clamping lifting strip 468 is fixedly connected to the inside of the isolation frame 41, and a fourth meshing wheel 469 is meshed on one side of the rack 4681, and a central shaft 4692 and a second fixed connecting block 4691 are provided on one side of the fourth meshing wheel 469, and the central shaft 4692 penetrates the second fixed connecting wheel 467. The connecting block 4691 is connected to the exhaust fan 47, the second fixed connecting block 4691 is fixedly connected to the inside of the isolation frame 41, the lower pressure assembly 45 includes a lower pressure plate 451 arranged inside the isolation frame 41 and a limiting hollow column 452 and a connecting column 453 arranged at the upper end of the lower pressure plate 451, the connecting column 453 is embedded in the limiting hollow column 452, the limiting hollow column 452 is fixedly connected to the inside of the isolation frame 41, one end of the connecting column 453 is connected to the lower pressure plate 451, and the other end is connected to the connecting strip 467.

[0046] Specifically, after the corresponding positions on the lead frame 36 are pasted, the conveyor belt 33 conveys the lead frame 36 to move. When the lead frame 36 of this group moves to the position directly below the lower pressing plate 451, the lower side of the lower pressing plate 451 matches the upper side of the lead frame 36, and the double-headed motor 434 drives the first meshing wheel 433 and the second rolling wheel 435 to rotate. The rotation of the first meshing wheel 433 can make the lifting door 431 rise, and the rotation of the second rolling wheel 435 will make the third rolling wheel 461 rotate, that is, the second meshing wheel 462 and the third meshing wheel 463 rotate. It will drive the second connecting shaft 465 to rotate, so that the second through-bar 466 and the connecting bar 467 will make reciprocating motion. The reciprocating lifting of the connecting bar 467 will cause the lower pressure plate 451 to reciprocate. The descent of the lower pressure plate 451 can press down the lead frame 36 located directly below it, so that the grains are adhered more closely. The reciprocating lifting of the connecting bar 467 will also cause the fourth meshing wheel 469 to rotate. The rotation of the fourth meshing wheel 469 causes the central axis 4692 and the exhaust fan 47 to rotate. The rotation of the exhaust fan 47 will discharge the air inside the isolation mechanism 4.

[0047] In order to further better explain the above embodiment, the present invention also provides an implementation scheme, a method for implementing a semiconductor chip packaging device, comprising the following steps:

[0048] Step 1: Place the cut wafers 13 inside a group of placement grooves 12, use the multi-axis robot arm 2 to make the position of the cut die in the wafer 13 at the lower end of the lifting hand 21, and the multi-axis robot arm 2 descends through the lifting hand 21 to make the die stick to the corresponding position on the lead frame 36 through the adhesive, and then make the position of the die of another group at the lower end of the lifting hand 21, and change the position of the lead frame 36 through the cooperation of the first extrusion component 34 and the conveyor belt 33, and the lifting hand 21 descends again to make the die of this group stick to the corresponding position on the lead frame 36 through the adhesive;

[0049] Step 2: After the corresponding positions on the lead frame 36 are pasted, the conveyor belt 33 moves the lead frame 36, and the double-headed motor 434 drives the first meshing wheel 433 and the second rolling wheel 435 to rotate. The rotation of the first meshing wheel 433 can make the lifting door 431 rise. At this time, the lower pressing plate 451 is lifted and lowered reciprocally. The lowering of the lower pressing plate 451 can press down the lead frame 36 located directly below it, so that the die is pasted more tightly, and the rotation of the exhaust fan 47 will discharge the air inside the isolation mechanism 4;

[0050] Step 3: After the lower pressure plate 451 is lifted and lowered back and forth, the conveyor belt 33 transmits the lead frame 36 through the lifting assembly 43 and out of the conveyor rack 31 to the next transmission device. At this time, the double-headed motor 434 drives the first meshing wheel 433 to rotate, causing the lifting door 431 to descend. At this point, all implementation steps are completed.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging device, comprising a first conveying mechanism (1) and a second conveying mechanism (3) arranged on one side of the first conveying mechanism (1), wherein a multi-axis robot arm (2) is arranged at a distance between the first conveying mechanism (1) and the second conveying mechanism (3), Features: An isolation mechanism (4) is provided at the upper end of the second conveying mechanism (3). The second conveying mechanism (3) comprises a conveying frame (31) and a conveying belt (33) arranged inside the conveying frame (31). A lead frame (36) is provided on the upper side of the conveying belt (33). A fixing plate (32) is provided on one side of the conveying frame (31). A first extrusion assembly (34) and a second extrusion assembly (35) are provided inside the conveying frame (31). The first extrusion assembly (34) and the second extrusion assembly (35) are located at the same horizontal position. The first extrusion assembly (34) and the second extrusion assembly (35) are components made of the same structure. The first extrusion assembly (34) and the second extrusion assembly (35) are located above the conveying belt (33). The first extrusion assembly (34) includes a servo motor (341) disposed inside the conveyor frame (31), one side of the servo motor (341) is connected to a first rolling wheel (342) via a shaft, and a first belt (343) is disposed outside the first rolling wheel (342). The first extrusion assembly (34) also includes a first fixed disk (344) and a second fixed disk (345) fixedly disposed inside the conveyor frame (31), the second fixed disk (345) is penetrated by a shaft disposed on one side of the servo motor (341), one side of the second fixed disk (345) is provided with a first connecting shaft (346), the servo motor (341) is movably connected to the first connecting shaft (346) via a shaft, one side of the first connecting shaft (346) is movably provided with a first penetration strip (347), one side of the first penetration strip (347) is fixedly connected to a third fixed connection block (348), and the third fixed connection block (348) A fixing bar (3481) is arranged on the outside, the fixing bar (3481) is fixedly connected to the inside of the conveyor frame (31), a third fixed connection block (348) is embedded in the fixing bar (3481), a clamping bar (349) is connected to one side of the fixing bar (3481), an electric telescopic block (3491) is embedded in the clamping bar (349), and the first extrusion assembly (34) is rotationally connected to the second extrusion assembly (35) via a first belt (343); The isolation mechanism (4) comprises an isolation frame (41) arranged at the upper end of the conveying frame (31) and a lifting assembly (43) arranged at one side of the isolation frame (41); a component groove (42) is arranged through the upper end of the isolation frame (41), and the component groove (42) matches the lifting hand (21); a first transmission assembly (44) is arranged at one side of the lifting assembly (43); a pressing assembly (45) is also arranged inside the isolation mechanism (4); a second transmission assembly (46) is arranged at the upper end of the pressing assembly (45); an exhaust groove (48) is opened at one side of the isolation mechanism (4), and an exhaust fan (47) is arranged inside the exhaust groove (48); The lifting assembly (43) comprises a lifting door (431) movably arranged on one side of the isolation frame (41) and a tooth groove (432) opened on one side of the lifting door (431); a first meshing wheel (433) is meshedly arranged on one side of the tooth groove (432); the first meshing wheel (433) is connected to a double-headed motor (434) via a shaft; a second rolling wheel (435) is connected to one side of the double-headed motor (434) via a shaft; and a second belt (436) is arranged on the outer side of the second rolling wheel (435).

2. The semiconductor chip packaging device according to claim 1, Features: A connecting hollow ring (3421) is provided on one side of the first rolling wheel (342); an element groove (3441) is provided inside the first fixed disk (344); the connecting hollow ring (3421) is located inside the element groove (3441); a sensing element (3442) is provided inside the element groove (3441); a plurality of groups of sensing elements (3442) are provided; an indicating block (3422) is provided outside the connecting hollow ring (3421); and the plurality of groups of sensing elements (3442) are evenly arranged inside the element groove (3441) in a semicircular state.

3. The semiconductor chip packaging device according to claim 1, Features: The first conveying mechanism (1) comprises a conveying plate (11) arranged inside the conveying plate (11) and a placement groove (12) opened inside the conveying plate (11), and a wafer (13) is arranged inside the placement groove (12). The multi-axis robot arm (2) is provided with a lifting arm (21).

4. The semiconductor chip packaging device according to claim 1, Features: A pier (311) is arranged inside the conveyor frame (31), and a lifting column (312) is arranged inside the pier (311), and a plurality of groups of lifting columns (312) are arranged, and one end of the plurality of groups of lifting columns (312) is connected to the conveyor belt (33), and the fixed plate (32) includes a through groove (321) arranged inside the fixed plate (32) and a conveyor feed belt (322) arranged inside the through groove (321).

5. The semiconductor chip packaging device according to claim 1, Features: The second transmission assembly (46) includes a third rolling wheel (461) arranged inside the isolation frame (41) and a second meshing wheel (462) connected to the third rolling wheel (461) through an axis. The third rolling wheel (461) is connected to the second rolling wheel (435) through a second belt (436). A third meshing wheel (463) is meshed with one side of the second meshing wheel (462). A first fixed connection block (464) is arranged on one side of the third meshing wheel (463). The first fixed connection block (464) is fixedly connected to the inside of the isolation frame (41). A second connecting shaft (465) is arranged on one side of the first fixed connection block (464). The third meshing wheel (463) is movably connected to the second connecting shaft (465) through the axis passing through the first fixed connection block (464). A second penetration strip (466) is arranged on one side of the second connecting shaft (465). One end of the second connecting shaft (465) is movably engaged in the second penetration strip (466).

6. The semiconductor chip packaging device according to claim 5, Features: A connecting bar (467) is fixedly connected to one side of the second penetration bar (466), a rack (4681) is provided on one side of the connecting bar (467), a locking lifting bar (468) is provided on the side of the connecting bar (467), and the connecting bar (467) is locked on one side of the locking lifting bar (468), the locking lifting bar (468) is fixedly connected to the inside of the isolation frame (41), a fourth meshing wheel (469) is meshed on one side of the rack (4681), a central axis (4692) and a second fixed connecting block (4691) are provided on one side of the fourth meshing wheel (469), and the central axis (4692) passes through the second fixed connecting block (4691) and is connected to the exhaust fan (47), and the second fixed connecting block (4691) is fixedly connected to the inside of the isolation frame (41).

7. The semiconductor chip packaging device according to claim 6, Features: The pressing assembly (45) comprises a pressing plate (451) arranged inside the isolation frame (41), a limiting hollow column (452) and a connecting column (453) arranged at the upper end of the pressing plate (451), the connecting column (453) being embedded inside the limiting hollow column (452), the limiting hollow column (452) being fixedly connected to the inside of the isolation frame (41), one end of the connecting column (453) being connected to the pressing plate (451), and the other end being connected to the connecting strip (467).

8. A method for implementing a semiconductor chip packaging device according to any one of claims 1 to 7, Features: The following steps are involved: S1: Place the cut wafer (13) inside a group of placement grooves (12), use a multi-axis robot arm (2) to make the position of the cut grains in the wafer (13) at the lower end of the lifting arm (21), the multi-axis robot arm (2) descends through the lifting arm (21) so that the grains are attached to the corresponding positions on the lead frame (36) through the adhesive, and then make the position of the grains of another group at the lower end of the lifting arm (21), and change the position of the lead frame (36) through the cooperation of the first extrusion component (34) and the conveyor belt (33), and the lifting arm (21) descends again so that the grains of this group are attached to the corresponding positions on the lead frame (36) through the adhesive; S2: After the corresponding positions on the lead frame (36) are pasted, the conveyor belt (33) moves the lead frame (36), and the double-headed motor (434) drives the first meshing wheel (433) and the second rolling wheel (435) to rotate. The rotation of the first meshing wheel (433) can cause the lifting door (431) to rise. At this time, the lower pressure plate (451) is lifted and lowered reciprocatingly. The descent of the lower pressure plate (451) can press down the lead frame (36) located directly below it, so that the grains are pasted more tightly, and the rotation of the exhaust fan (47) will discharge the air inside the isolation mechanism (4); S3: After the lower pressure plate (451) has been lifted and lowered back and forth, the conveyor belt (33) causes the lead frame (36) to be transferred out of the conveyor frame (31) through the lifting assembly (43) to the next transmission device. At this time, the double-headed motor (434) drives the first meshing wheel (433) to rotate, causing the lifting door (431) to descend. At this point, all implementation steps are completed.

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