A method for substrate forming and processing

Abstract

The present invention discloses a substrate forming and processing method, which is used for processing a finished board, and includes the following steps: obtaining a substrate to be formed, where at least three positioning holes are provided on the substrate to be formed, and fixing the substrate to be formed on a processing device; obtaining the boundary information of the finished board on the substrate to be formed, and the area outside the boundary of the finished board is the area to be cut; obtaining the position information of the connection part between the finished board and the area to be cut; based on the boundary information of the finished board and the position information of the connection part, setting a first forming path, and cutting the substrate to be formed according to the first forming path; after the cutting is completed, the finished board is connected and fixed to the area to be cut through the connection part; a pressing device presses against the substrate to be formed and applies a preset pressure to fix the finished board; based on the position information of the connection part, setting a second forming path, and cutting the connection part according to the second forming path to obtain the formed finished board. This application can reduce the processing process and lower the processing cost.

Description

Technical Field

[0001] The present invention relates to the field of FCBGA packaging substrates, and particularly to a method for substrate forming and processing. Background Art

[0002] With the development needs of technology, the FCBGA packaging substrate has high precision, and C4 pads need to be soldered with solder balls. In order to facilitate soldering the solder balls and meet the requirements of alignment accuracy, the FCBGA substrate needs to be divided during production, and the substrate is divided into multiple equal parts. In the traditional substrate dividing and forming method, in order to fix the substrate, positioning pin holes need to be set both at the board edge and inside the board. During the forming process, pins need to be implanted into the positioning pin holes and connected to the pin holes on the forming machine tool to fix the substrate on the forming machine and prevent the substrate from shifting during forming, resulting in damage to the finished board. When setting the pin holes inside the board, since the board is divided inside, in order to position each divided finished board, the number of pin holes to be set also increases, and an independent process station needs to be added to process the pin holes inside the board, which will increase the personnel time and production cost. Summary of the Invention

[0003] In order to overcome the defects in the prior art, an embodiment of the present invention provides a method for substrate forming and processing, which can reduce the positioning hole processing process and reduce the personnel time and processing cost.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] The first aspect of the present application discloses a method for substrate forming and processing, which is used for processing a finished board and includes the following steps:

[0006] Obtain a substrate to be formed, on which at least three positioning holes are provided, and fix the substrate to be formed on a processing device;

[0007] Obtain the boundary information of the finished board on the substrate to be formed, and the outside of the finished board boundary is the area to be removed;

[0008] Obtain the position information of the connection part between the finished board and the area to be removed;

[0009] Based on the finished board boundary information and the connection part position information, set a first forming path, and cut the substrate to be formed according to the first forming path. After cutting, the finished board is connected and fixed to the area to be removed through the connection part;

[0010] The pressing device presses against the substrate to be formed and applies a preset pressure to fix the finished board;

[0011] Based on the connection part position information, set a second forming path, and cut the connection part according to the second forming path to obtain the formed finished board.

[0012] In the above technical solution, a connecting part is provided between the boundary of the finished board and the area to be cut off. When cutting the substrate to be formed according to the first preset path, the finished board is connected to the area to be cut off through the connecting part, and when cutting the connecting part, the finished board and the area to be cut off are fixed by a pressing device, so that the substrate will not shift during the forming process. The substrate forming method provided by this technical solution is simple to operate, can reduce the positioning pin holes set on the substrate to be formed in the traditional method, can reduce the processing process, reduce the process production cost, save personnel time, and reduce the personnel production cost.

[0013] Preferably, the at least three positioning holes are arranged in the area to be cut off, and the at least three positioning holes are not on a straight line.

[0014] Preferably, a pin hole is provided on the processing device, and a pin is inserted through the positioning hole and the pin hole to fix the substrate to be formed.

[0015] A pin hole is provided on the processing device at a position corresponding to the positioning hole on the substrate to be formed. When fixing the substrate to be formed, the pin passes through the positioning hole and is implanted into the pin hole. When cutting the substrate to be formed according to the first preset path, the substrate to be formed can be prevented from shifting.

[0016] Preferably, a plurality of finished boards are provided on the substrate to be formed, and the plurality of finished boards are spaced apart on the substrate to be formed. According to the design requirements of the substrate to be formed, the substrate to be formed can be divided into a plurality of finished boards.

[0017] Preferably, one connecting part is provided for one finished board, the length of the connecting part is 4 - 6 mm, and the width of the connecting part is 1 - 3 mm.

[0018] The area to be cut off is connected to the finished board through a preset connecting part. When cutting, the finished board is kept fixed, and when the cutting is completed according to the first preset forming path, the finished board will not shift.

[0019] Preferably, the step of "setting a first forming path based on the boundary information of the finished board and the position information of the connecting part, and cutting the substrate to be formed according to the first forming path" further includes the following steps

[0020] Set the first forming path circumferentially along the boundary of the finished board;

[0021] Perform longitudinal and transverse cutting along the first forming path, and keep the connecting part during cutting.

[0022] Preset the first forming path according to the size and shape of the finished board, cut out the finished board, and keep the connecting part during cutting to avoid the finished board shifting when the cutting according to the first preset path is completed.

[0023] Preferably, when the pressing device contacts the substrate to be formed, at least a part of the pressing device covers the finished board and the area to be cut off.

[0024] When cutting to the connecting part, the pressing device presses down. By covering the finished board and the area to be cut off, the pressing device applies pressure to the finished board and the area to be cut off, and forms a resistance to the finished board and the area to be cut off to fix the substrate.

[0025] Preferably, after obtaining the formed finished board, the pins on the area to be cut off are retained.

[0026] The cutting area on the substrate to be formed is mainly used for positioning. After the substrate is formed, the pins are still fixed on the cutting area, and the pins can be reused to fix the substrate to be formed.

[0027] The second aspect of the present application discloses a packaging substrate, which includes a finished board and an area to be cut off, and the finished board is obtained by dividing according to any one of the methods disclosed in the first aspect.

[0028] Preferably, a plurality of finished boards can be cut out from the packaging substrate, and the plurality of finished boards are preset at intervals on the packaging substrate.

[0029] Due to the application of the above technical solutions, the present invention has the following advantages compared with the prior art:

[0030] 1. By providing a connecting part between the boundary of the finished board and the area to be cut off, when cutting the connecting part, a pressing device is provided to press down, and pressure is applied to the finished board and the area to be cut off to fix the finished board and the area to be cut off, so as to avoid the offset of the finished board during the forming process. The substrate forming method provided by the present application is simple, easy to operate, can reduce the processing process, and reduce the production cost of the process.

[0031] 2. When forming the substrate, the present application can reduce the setting of pin positioning holes, reduce the personnel for processing positioning holes during substrate forming, can reduce the personnel efficiency, and reduce the processing cost.

[0032] To make the above and other objects, features and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given, and in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0034] Figure 1It is a flow chart of the substrate forming and processing method of the present invention;

[0035] Figure 2 It is a schematic diagram of a substrate to be formed and processed provided by an embodiment of the present invention;

[0036] Figure 3 It is a partial enlarged cross-sectional view when cutting the connecting part of the present invention.

[0037] Reference numerals of the above drawings: 1. Substrate to be formed; 2. Finished board; 3. Area to be removed; 4. Positioning hole; 5. Connecting part; 6. Cutting path; 7. Milling cutter; 8. Pressure angle. Specific embodiments

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0039] According to the design requirements, the substrate to be formed can be provided with divided patterns such as two-divided, four-divided, eight-divided, etc., and the substrate is divided into multiple finished boards. Refer to Figure 2 As shown, the present application shows a schematic diagram of a substrate to be formed and processed with four divisions. The substrate to be formed 1 includes a finished board 2 and an area to be removed 3. The area to be removed 3 is all the areas on the substrate to be formed 1 except the finished board 2. A plurality of positioning holes 4 are provided in the area to be removed 3. The plurality of positioning holes 4 are used for implanting pins and connecting with the pin holes on the processing device to fix the substrate to be formed 1. A connecting part 5 is provided at the boundary of the finished board 2. The connecting part 5 is used to connect the finished board 2 and the area to be removed 3 to each other.

[0040] It should be noted that the substrate to be formed 1 shown in the embodiments of the present application and the accompanying drawings is only illustrated by taking the substrate to be formed 1 divided into four finished boards 2 as an example. The number of the finished boards 2 in the substrate to be formed 1 in the embodiments of the present invention is not specifically limited, and those skilled in the art can set it according to the actual situation, and the present application will not describe it in detail here.

[0041] Refer to Figure 1 As shown, the present application provides a substrate forming and processing method, and the method is used for processing the finished board 2, including the following steps:

[0042] Step 101, obtain the substrate to be formed 1, at least three positioning holes 4 are provided on the substrate to be formed 1, and the substrate to be formed 1 is fixed on the processing device.

[0043] Among them, the substrate 1 to be formed refers to the substrate obtained after the completion of preliminary production such as circuit pattern production and insulating layer production. Substrate forming refers to fixing the substrate 1 to be formed on a processing device and performing operations such as cutting on the substrate 1 to be formed, so as to obtain the formed finished board 2. According to the substrate design requirements, a finished product area and a to-be-removed area are preset on the substrate 1 to be formed. The finished product area can be formed by a processing device to divide out the required finished products.

[0044] The substrate 1 to be formed is provided with positioning holes 4. The positioning holes 4 are used to fix the substrate 1 to be formed on the processing device. The positioning holes 4 are arranged on the to-be-removed area 3 to avoid affecting the patterns arranged on the substrate. When fixing the substrate 1 to be formed, a pin passes through the positioning hole 4 to fix the substrate 1 to be formed on the processing device, preventing the position of the substrate 1 to be formed from shifting during the forming process, resulting in damage to the finished board 2.

[0045] In order to make the substrate 1 to be formed have good stability, at least three positioning holes 4 are arranged on the to-be-removed area 3, and the three arranged positioning holes 4 are not on the same straight line. According to the size of the pins, various pore diameters of the positioning holes 4 can be set. Generally, the diameter of the process pin holes is set between 3 and 4 mm. In some possible embodiments, multiple positioning holes 4 can also be arranged, and the positions of the positioning holes 4 can also be set according to the actual situation. This application will not describe it in detail here.

[0046] According to the substrate design requirements, a plurality of finished boards 2 are preset on the substrate 1 to be formed. The plurality of finished boards 2 are spaced apart on the substrate 1 to be formed. As Figure 2 shown, according to the design requirements and cutting dimensions of the preset finished boards 2 on the substrate 1 to be formed, the processing device is controlled to form the substrate 1 to be formed to form four finished boards 2.

[0047] In a feasible embodiment, the processing device for processing the substrate 1 to be formed is a forming machine. In this embodiment of the application, the forming machine is taken as an example of the processing device for processing the substrate to illustrate the substrate processing method.

[0048] Among them, the forming machine processing machine tool is provided with pin holes, and the pin holes correspond to the positions of the positioning holes 4. Specifically, a pin passes through the positioning hole 4 and is implanted into the pin holes on the forming machine processing machine tool, and the substrate 1 to be formed is fixed on the forming machine processing machine tool through the pins.

[0049] Step 102, obtain the boundary information of the finished board 2 on the substrate 1 to be formed. The outside of the boundary of the finished board 2 is the to-be-removed area 3.

[0050] The finished board 2 is the area on the substrate 1 to be formed where the circuit pattern manufacturing, insulation layer manufacturing and other preliminary manufacturing have been completed. During the forming process, the finished board 2 needs to be cut from the substrate 1 to be formed according to the boundary area of the finished board 2. The cut area outside the finished board 2 is the area on the substrate 1 to be formed where no circuit pattern is designed, which is used to assist in fixing the substrate 1 to be formed, etc.

[0051] Step 103: Obtain the position information of the connection part 5 between the finished board 2 and the area to be cut 3.

[0052] During the forming process of the finished board 2, especially when the forming of the finished board 2 is about to end, the finished board 2 will shift without external force fixation, resulting in errors in the size and shape of the finished board 2, causing damage to the finished product and affecting its use.

[0053] The connection part 5 is a connection part that is preset according to the stability of the substrate 1 to be formed and connects the boundary of the finished board 2 and the area to be cut 3. The connection part 5 is used to maintain the stability of the finished board 2 when cutting the substrate 1 to be formed according to the first forming path and prevent the finished board 2 from shifting.

[0054] Step 104: Based on the boundary information of the finished board 2 and the position information of the connection part 5, set the first forming path, and cut the substrate 1 to be formed according to the first forming path. After cutting, the finished board 2 is connected and fixed to the area to be cut 3 through the connection part 5.

[0055] The first forming path should be set according to the shape of the finished board 2. When setting the forming path, a connection part 5 should be set at the connection between the finished board 2 and the area to be cut 3, which can fix the finished board 2 when cutting is completed according to the first preset forming path and avoid the finished board 2 from shifting.

[0056] The width of the preset connection part 5 is usually set between 1 and 3 mm, and the length is usually set between 4 and 6 mm. In a feasible embodiment, when the length of the connection part 5 is set to 5 mm and the width is set to 2 mm, the stability of the substrate can be better maintained. The connection part 5 can be set at any position on the boundary of the finished board 2 according to the stability of the substrate 1 to be formed. Usually, setting one connection part 5 can maintain the stability of the substrate 1 to be formed during the cutting process.

[0057] As Figure 2 shown, this application shows a schematic diagram of a preset connection part 5. Among the four finished boards 2, the board edge boundary of each finished board 2 is connected to the area to be cut 3 through a preset connection part 5, which is used to connect the finished board 2 and the area to be cut 3 during the forming process.

[0058] After the substrate 1 to be formed is fixed on the forming machine, the forming machine is started, and the forming machine forms according to the first forming path, specifically, it also includes the following steps:

[0059] A first forming path is arranged along the circumferential direction of the boundary of the finished plate 2;

[0060] Longitudinal and transverse cutting is performed along the first forming path, and the connecting portion 5 is retained during cutting.

[0061] The first forming path is set according to the boundary of the finished board 2. A milling cutter 7 is arranged in the cutting spindle of the forming machine. Usually, the diameter of the milling cutter 7 is 2-3 mm. The milling cutter 7 cuts along the middle of the substrate 1 to be formed according to the first forming path, and then cuts the outer side of the finished board 2. When cutting, the long side of the finished board 2 is first cut, and then the short side of the finished board 2 is cut to form a cutting path 6. Figure 2 As shown, when the cutting spindle moves to the preset connection portion 5, the milling cutter 7 is retracted.

[0062] After the cutting is completed according to the first forming path, the connecting portion 5 is retained. The connecting portion 5 can prevent the finished plate 2 from being deviated due to lack of external force when the forming of the finished plate 2 is about to be completed.

[0063] Step 105 , the pressing device presses down to contact the substrate 1 to be formed, and applies a preset pressure to fix the finished plate 2 .

[0064] Among them, the pressing device presets the pressing position parameters. In a feasible embodiment, the pressing device is a cutting spindle on a forming machine, and a milling cutter 7 is provided in the cutting spindle. After the substrate 1 to be formed is formed to the connecting part 5, the milling cutter 7 is retracted, and according to the preset spindle pressing position parameters, the cutting spindle on the forming machine is pressed down to fix the finished plate 2.

[0065] Specifically, the cutting spindle of the molding machine contains a brush and a pressure angle 8. During the molding process of the molding machine, when the milling cutter 7 moves to the connecting portion 5, the cutting spindle jumps, and the milling cutter 7 is retracted. When the milling cutter 7 is retracted, the brush in the spindle is automatically replaced by the pressure angle 8. The cutting spindle is pressed down, and the pressure angle 8 contacts the substrate 1 to be molded. The pressure angle 8 at least covers a part of the finished plate 2 and the area to be cut 3, and applies pressure to the finished plate 2 and the area to be cut 3, so as to fix the finished plate 2 and the area to be cut 3. Figure 3 shown.

[0066] Step 106 , based on the position information of the connection part 5 , a second forming path is set, and the connection part 5 is cut according to the second forming path to obtain a formed finished plate 2 .

[0067] like Figure 3As shown, the cross-section of the pressure angle 8 is annular. The cutting main shaft on the forming machine presses downwards, and the pressure angle 8 presses on a part of the finished board 2 and the area to be cut off 3. At this time, the connecting part 5 is located within the pressure angle 8. The pressure angle 8 applies pressure to fix the finished board 2 during cutting. The milling cutter 7 within the cutting main shaft cuts the connecting part 5 along the second preset path. The finished board 2 is cut from the substrate to be formed 1. During cutting, the air-floating principle is used, and relative movement occurs between the pressure angle 8 and the cutting main shaft. When cutting the connecting part 5, the size deformation of the finished board 2 is relatively small, which can avoid damaging the finished board 2.

[0068] Among them, after the finished board 2 is cut from the substrate to be formed 1, the pin remains on the area to be cut off 3. The pin can be reused. It is necessary to remove the pin on the area to be cut off 3 and retain the pin. The pin is used to continue to fix the substrate to be formed on the processing device.

[0069] The second aspect of the present application provides a packaging substrate, which includes a finished board 2 and an area to be cut off 3. The finished board 2 is obtained by dividing using the method described in the above-mentioned embodiment.

[0070] Among them, multiple finished boards 2 can be cut out from the packaging substrate, and the multiple finished boards 2 are spaced apart on the packaging substrate by a preset distance.

[0071] Furthermore, during the forming process of the substrate to be formed 1 in the present application, there are various forming methods. For example, laser stamping can also be used for forming. The present application does not describe it in detail here.

[0072] The present application sets a connecting part at the boundary of the finished board and the area to be cut off, and sets a pressing device to press down when cutting the connecting part. The pressing device applies pressure to the area to be cut off and the finished board to fix the finished board when cutting the connecting part, avoiding the offset of the finished board during the forming process. The substrate forming method set in the present application is simple and easy to operate, can reduce the processing process, reduce the process production cost, reduce the personnel for processing positioning holes during substrate forming, and can reduce the processing cost and personnel efficiency.

[0073] In the present invention, specific embodiments are used to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A substrate forming method, the method is used to process a finished plate, characterized in that: The steps include: Obtaining a substrate to be formed, wherein at least three positioning holes are provided on the substrate to be formed, and fixing the substrate to be formed on a processing device; Acquire boundary information of the finished plate on the substrate to be formed, the outer side of the boundary of the finished plate is the area to be cut off, and the at least three positioning holes are arranged in the area to be cut off; Acquire the position information of the connection between the finished plate and the area to be cut off; Based on the boundary information of the finished board and the position information of the connection part, a first forming path is set, and the substrate to be formed is cut according to the first forming path, including setting the first forming path along the boundary circumference of the finished board, performing longitudinal and transverse cutting along the first forming path, retaining the connection part during cutting, and after the cutting is completed, the finished board is connected and fixed to the area to be cut through the connection part; The pressing device presses down to contact the substrate to be formed and applies a preset pressure to fix the finished plate, wherein when the pressing device contacts the substrate to be formed, at least part of the pressing device covers the finished plate and the area to be cut off; Based on the position information of the connection part, a second forming path is set, and the connection part is cut according to the second forming path to obtain a finished plate after forming.

2. A substrate forming method according to claim 1, characterized in that: The at least three positioning holes are not in a straight line.

3. A substrate forming method according to claim 1, characterized in that: The processing device is provided with a pin hole, and the pin is inserted into the positioning hole and the pin hole to fix the substrate to be formed.

4. A substrate forming method according to claim 1, characterized in that: A plurality of finished boards are arranged on the substrate to be formed, and the plurality of finished boards are distributed at intervals on the substrate to be formed.

5. A substrate forming method according to claim 4, characterized in that: A finished plate is provided with a connection portion, the length of the connection portion is 4-6 mm, and the width of the connection portion is 1-3 mm.

6. A substrate forming method according to claim 1, characterized in that: Once you have the finished shaped plate, keep the pins on the areas to be cut out.

7. A packaging substrate, comprising a finished plate and an area to be cut off, characterized in that: The finished plate is obtained by dividing by the method according to any one of claims 1 to 6.

8. The packaging substrate according to claim 7, characterized in that: The packaging substrate can be cut into a plurality of finished boards, and the plurality of finished boards are preset at intervals on the packaging substrate.

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