Tin wire flux for 5G communication harness welding, preparation method thereof, and tin wire

Abstract

The present application relates to a tin wire flux for 5G communication harness welding, a preparation method thereof, and tin wire, comprising the following components in weight percentage: 2-5% amine salt active agent, 5-10% organic active agent, 10-15% film-forming agent, and the remainder being a flux carrier. All components of the flux in the present application abandon conventional organic acid active agents and rosin resin carrier components. A flux is prepared using amine salt active agents, organic active agents, film-forming agents, and flux carriers to meet welding requirements while ensuring that the residual carbonization phenomenon does not occur after welding. This flux can meet 5G communication harness welding temperatures of 450-500°C. While ensuring welding reliability, the residual flux after welding does not carbonize, which does not affect the appearance and quality of the product.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic welding technology, and in particular to a tin wire flux for 5G communication wiring harness welding, a preparation method thereof, and a tin wire. Background Art

[0002] As a new type of mobile communication network, 5G not only solves the communication problem between people and provides users with immersive and ultimate service experience such as augmented reality, virtual reality, and ultra-high-definition (3D) video, but also solves the communication problem between people and things, and things and things, and meets the needs of Internet of Things applications such as mobile medical care, Internet of Vehicles, smart home, industrial control, and environmental monitoring.

[0003] With the rapid development of 5G communications, the welding requirements for communication wiring harnesses and terminals are becoming increasingly stringent. When producing wiring harnesses with terminal blocks, soldering is often required to secure the terminals to the conductors of the wires and cables to ensure proper electrical connectivity. The wiring harnesses and terminals require high temperatures to rapidly melt the tin wire under the action of flux to complete the welding process, enabling the transmission of electronic information. Soldering temperatures, typically above 450°C, pose a significant challenge to the soldering materials used in soft soldering. This is because the flux components of standard tin wire undergo extensive carbonization after soldering. These carbonized particles are not only unsightly, but once they form internal encapsulation or form in hard-to-find areas such as the ends of the wiring harness and inside the terminals, they can create the risk of cold solder joints and voids, impacting product quality and service life.

[0004] Chinese invention patent application CN107498208A discloses a "lead-free solder wire suitable for drag soldering technology", which includes 96.0%-98.5% lead-free solder, 4.0%-

[0005] 1.5%; the flux is composed of the following components by weight: 1-4% low-boiling-point organic solvent, 4-10% activator, 0-0.5% corrosion inhibitor, and the balance modified rosin. While the activators, such as glutaric acid, citric acid, and salicylamide, provide sufficient activity, they produce relatively severe carbonized particles during welding at 450°C, failing to address the high-temperature welding issues of wire harnesses.

[0006] Chinese invention patent application CN101244492B discloses a "lead-free solder wire containing flux and method for preparing the flux." This method proposes using two or more different organic acids to ensure a wide temperature range of activator activity, preventing high-temperature deactivation or carbonization, thereby maintaining soldering activity. Among these organic acids, glutaric acid, malonic acid, adipic acid, sebacic acid, malic acid, salicylic acid, lauric acid, and tartaric acid all exhibited relatively severe carbonization particles when tested at 450°C, making them unsuitable for high-temperature soldering processes.

[0007] Therefore, the soldering flux in the prior art has the following technical defects:

[0008] 1. Welding at 450-500℃ will leave a large area of ​​carbonized slag, which will affect the appearance of the product and the reliability of its electrical performance.

[0009] 2. General activator drugs will carbonize and become inactivated at temperatures of 450°C or above, causing the flux activity to weaken and insufficient tinning.

[0010] 3. Welding at relatively high temperatures cannot meet the requirements of both manual welding and machine automatic welding.

[0011] 4. Traditional flux carrier rosin resin products turn yellow and dark at high temperatures of 450-500℃, and have poor heat resistance and stability. Summary of the Invention

[0012] The main purpose of this application is to provide a tin wire flux for 5G communication wire harness welding, a preparation method thereof, and tin wire to solve current problems.

[0013] In order to achieve the above objectives, this application provides the following technologies:

[0014] In one aspect, the present application provides a tin wire flux for 5G communication harness welding, comprising the following components in weight percentage:

[0015] Amine salt active agent 2-5%, organic active agent 5-10%, film-forming agent 10-15%, and the balance is flux carrier.

[0016] As an optional embodiment of the present application, optionally, the amine salt active agent is composed of diethylamine hydrobromide and cyclohexylamine hydrobromide in a mass ratio of 1:1.5.

[0017] As an optional embodiment of the present application, optionally, the organic active agent is at least one of isoadipic acid and isosubic acid.

[0018] As an optional embodiment of the present application, optionally, the film-forming agent is terephthalate tackifying resin P-105.

[0019] As an optional embodiment of the present application, optionally, the flux carrier is hydrogenated dimer acid.

[0020] On the other hand, the present application provides a method for preparing the tin wire flux for 5G communication wire harness welding as described in any one of the above items, comprising the following preparation steps:

[0021] Putting the flux carrier and the film-forming agent into a reaction kettle, melting them at an initial preset temperature, and stirring them at an initial preset speed to obtain a first mixture;

[0022] Adding an amine salt active agent into a grinder and grinding it to obtain active agent powder;

[0023] After increasing the initial preset speed to a target speed value, adding the active agent powder to the first mixture, and after dissolution, lowering the initial preset temperature to a target temperature value to obtain a second mixture;

[0024] After the rotation speed target value is reduced to the initial preset rotation speed, an organic active agent is added to the second mixture and stirred evenly to obtain a soldering flux.

[0025] As an optional embodiment of the present application, optionally, the initial preset temperature is 180° C., and the initial preset rotation speed is 200 r / min.

[0026] As an optional implementation scheme of the present application, optionally, the speed target value is 400r / min, and the temperature target value is 140°C.

[0027] In another aspect of the present application, a tin wire is provided, comprising the following components in percentage by weight:

[0028] 97-97.4% of tin-based lead-free antimony-containing alloy and 2.6-3.0% of any of the above-mentioned tin wire flux for 5G communication wire harness welding.

[0029] As an optional embodiment of the present application, optionally, the tin-based lead-free antimony-containing alloy is any one of SnAg1.5Cu0.8Sb1.0, SnSb5, and SnSb10.

[0030] Technical effects of the present invention:

[0031] All the components of the tin wire flux for 5G communication harness welding in this application have abandoned conventional organic acid activators and rosin resin carrier components, and an amine salt activator, an organic activator, a film-forming agent and a flux carrier are used to prepare a flux that can meet the welding requirements and can meet the requirement that the residual carbonization phenomenon does not appear after welding. That is, it can meet the 450-500°C 5G communication harness welding. Under the premise of ensuring welding reliability, the solder wire will not carbonize the residual flux after welding, and will not affect the appearance and quality of the product. At the same time, it can also be applied to high-temperature welding processes of various high-temperature resistant electronic products. The solder joints have high reliability and can be applied to automatic welding processes. The welding activity is good, the welding residues are clean, and there is no carbonized slag, which ensures the reliability of the product. According to the detailed description of the exemplary embodiments with reference to the accompanying drawings below, other features and aspects of the present disclosure will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0033] Figure 1 Shown is a schematic flow chart of a method for preparing tin wire flux for 5G communication harness welding according to the present invention. DETAILED DESCRIPTION

[0034] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0035] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0036] In addition, numerous specific details are provided in the following detailed description to better illustrate the present disclosure. Those skilled in the art will appreciate that the present disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0037] As shown in Table 1, in one aspect, the present application proposes a tin wire flux for 5G communication harness welding, comprising the following components in weight percentage:

[0038] Amine salt active agent 2-5%, organic active agent 5-10%, film-forming agent 10-15%, and the balance is flux carrier.

[0039]

[0040]

[0041] Table 1 Composition of tin wire flux for 5G communication harness welding

[0042] It should be noted that all the components of the tin wire flux for 5G communication harness welding of this application have abandoned the conventional organic acid activator and rosin resin carrier components, and an amine salt activator, an organic activator, a film-forming agent and a flux carrier are used to prepare a flux that can meet the welding requirements and can meet the requirement that the residual carbonization phenomenon does not appear after welding. That is, it can meet the 450-500°C 5G communication harness welding. Under the premise of ensuring the welding reliability, the solder wire will not carbonize the residual flux after welding, which will not affect the appearance and quality of the product. At the same time, it can also be used in high-temperature welding processes of various high-temperature resistant electronic products. The solder joints have high reliability and can be applied to automatic welding processes. It has good welding activity, clean welding residues and no carbonized slag, which ensures the reliability of the product.

[0043] As an optional embodiment of the present application, optionally, the amine salt active agent is composed of diethylamine hydrobromide and cyclohexylamine hydrobromide in a mass ratio of 1:1.5.

[0044] Among them, the amine salt active agent of the present application is diethylamine hydrobromide and cyclohexylamine hydrobromide added in a mass ratio of 1:1.5. Both belong to the hydrohalide salt class of organic hydrazine amine salts, are highly active, can quickly remove oxides during the welding process, can reduce surface tension, change the surface physical and chemical equilibrium conditions, make the solder and the metal to be welded mutually wet, and can enhance the fluxing ability. In addition, it has low hygroscopicity, and the residual corrosion after welding is relatively small. The present application has concluded from a variety of compounding ratio tests that adding in a ratio of 1:1.5 can better exert the active effect at different melting point temperatures, and the activity performance is better. Both have been tested at high temperatures and there is no risk of carbonization.

[0045] As an optional embodiment of the present application, optionally, the organic active agent is at least one of isoadipic acid and isosubic acid.

[0046] The organic active agent of this application is at least one of isoadipic acid and isooctanedioic acid. Both are dibasic acids with two carboxyl groups, have high acid values, and possess good deoxidation capabilities, thus improving welding activity. Since both are liquid dibasic acids, the liquid component can evaporate as much as possible after the fluxing process is completed during the welding process, reducing solid residue. Most importantly, the organic active agent of this application does not pose a risk of carbonization at high temperatures of 450-500°C.

[0047] As an optional embodiment of the present application, optionally, the film-forming agent is terephthalate tackifying resin P-105.

[0048] The film-forming agent of this application is terpene tackifying resin P-105, model CLEARON P-105, which has the characteristics of transparency, non-toxicity, neutrality, electrical insulation, hydrophobicity, non-crystallization, resistance to dilute acids and alkalis, heat resistance, light resistance, and aging resistance, and has good compatibility with various synthetic substances. After welding, the thin film formed on the solder joint plays the role of isolating the air. Under high temperature testing, its color does not show signs of yellowing or deepening, completely eliminating the risk of carbonization in welding.

[0049] As an optional embodiment of the present application, optionally, the flux carrier is hydrogenated dimer acid.

[0050] The flux of this application is hydrogenated dimer acid. It should be noted that hydrogenated dimer acid generally refers to hydrogenated dimer fatty acid hydrogenated dimer acid, which is a complex mixture of hydrogenated dimer acid. It should be emphasized that this application uses hydrogenated dimer acid to replace the conventional flux carrier rosin resin components because hydrogenated dimer acid exhibits extremely strong stability at high temperatures of 450-500°C, without discoloration or carbonization. Other rosin resin products only show yellowing, darkening, or even carbonization at 450°C. At the same time, the flux carrier generally accounts for more than 60% of the system. Hydrogenated dimer acid is stable at high temperatures and has a certain acid value, which can provide sufficient deoxidation ability. Therefore, hydrogenated dimer acid is the best choice for the flux carrier of this application.

[0051] On the other hand, this application Figure 1 As shown, a method for preparing the tin wire flux for 5G communication wire harness welding as described in any one of the above items is provided, comprising the following preparation steps:

[0052] S100, adding a flux carrier and a film-forming agent into a reaction kettle, melting them at an initial preset temperature, and stirring them at an initial preset speed to obtain a first mixture;

[0053] The preparation method of the present application prepares a tin wire flux for 5G communication wiring harness welding according to the weight percentage of 2-5% amine salt active agent, 5-10% organic active agent, 10-15% film-forming agent, and the remainder being the flux carrier. In this step, the flux carrier and film-forming agent are weighed together and added to a stainless steel reactor. The temperature of the reactor is set to an initial preset temperature. After the flux carrier and film-forming agent are completely dissolved at the initial preset temperature, stirring is started and carried out at an initial preset speed to obtain a first mixture.

[0054] S200, adding an amine salt active agent to a grinder and crushing it to obtain active agent powder;

[0055] In this step, 2-5% of an amine salt active agent is added to a grinder and pulverized at high speed to obtain active agent powder. The active agent powder obtained after high-speed pulverization and refinement is easy to dissolve.

[0056] S300, after increasing the initial preset speed to a target speed value, adding the active agent powder to the first mixture, and after dissolution, lowering the initial preset temperature to a target temperature value to obtain a second mixture;

[0057] In this step, after the first mixture is stirred evenly, the rotation speed is increased to the target rotation speed value, and the active agent powder obtained in step S200 is added to the first mixture obtained in step S100. When the active agent powder is completely dissolved in the first mixture, the temperature is lowered to the temperature target value to obtain a second mixture.

[0058] S400 , after reducing the target speed value to the initial preset speed, adding an organic active agent to the second mixture and stirring the mixture evenly to obtain a soldering flux.

[0059] In this step, the speed is first reduced from the target speed to the initial preset speed. Then, 5-10% of the organic surfactant is slowly added to the second mixture and stirred thoroughly to obtain the finished flux. After stirring, the flux can be directly added to the rosin barrel for extrusion, or poured into a clean packaging barrel to cool for later use.

[0060] As an optional embodiment of the present application, the initial preset temperature is optionally 180°C, and the initial preset speed is 200 rpm. That is, in step S100, the initial preset temperature of the stainless steel reactor is set at 180°C, so that the flux carrier and film-forming agent are completely dissolved at this temperature. After the melting is complete, the initial preset speed is set to 200 rpm, at which the melted flux carrier and film-forming agent are thoroughly stirred to obtain a first mixture.

[0061] As an optional embodiment of the present application, the target speed is 400 r / min and the target temperature is 140° C. That is, in step S300 , after increasing the speed from 200 r / min to 400 r / min, the active agent powder is added to the first mixture so that the active agent powder can be fully dissolved in the first mixture at this speed, and then the temperature is reduced from 180° C. to 140° C. to obtain the second mixture.

[0062] In another aspect of the present application, a tin wire is provided, comprising the following components in percentage by weight:

[0063] 97-97.4% of tin-based lead-free antimony-containing alloy and 2.6-3.0% of any of the above-mentioned tin wire flux for 5G communication wire harness welding.

[0064] The tin wire of the present application is a tin wire for 5G communication harness welding, which is prepared using a tin-based lead-free antimony alloy and the above-mentioned flux, and the weight percentage of the tin-based lead-free antimony alloy is 97-97.4%, and the tin wire flux is 2.6-3.0%.

[0065] The preparation method of the tin wire comprises: adding a tin-based lead-free antimony-containing alloy and a flux into a rosin barrel, adjusting the required flux content through an extruder, and after the content is determined, extruding, rolling, and drawing the tin wire into a desired wire diameter, ultimately obtaining a tin wire product with a flux content of 2.6-3.0%.

[0066] As an optional embodiment of the present application, optionally, the tin-based lead-free antimony-containing alloy is any one of SnAg1.5Cu0.8Sb1.0, SnSb5, and SnSb10.

[0067] Example 1

[0068] A tin wire comprises the following components in weight percentage: alloy component SnAg1.5Cu0.8Sb1.0: 97.2%, flux 2.80%. The flux component includes:

[0069] Diethylamine hydrobromide 1.0%, cyclohexylamine hydrobromide 1.5%, isoadipic acid 6%, CLEARON P-105 10%, and hydrogenated dimer acid 81.5%;

[0070] The preparation method of the flux and the tin wire is as follows:

[0071] 1. Weigh all the hydrogenated dimer acid and CLEARON P-105 together and add them into a stainless steel reactor. Set the temperature to 180°C. After they are completely dissolved, start stirring at 200 rpm to obtain the first mixture.

[0072] 2. Add all the diethylamine hydrobromide and cyclohexylamine hydrobromide into a grinder and grind them at high speed to obtain an active agent powder that is easy to dissolve;

[0073] 3. After increasing the speed to 400 r / min, add the active agent powder to the first mixture. After confirming that it is completely dissolved, cool it to 140°C to obtain the second mixture;

[0074] 4. After reducing the speed to 200r / min, slowly add all the isoadipic acid into the second mixture. After stirring evenly, it can be directly added to the rosin barrel for extrusion or poured into a clean packaging barrel for cooling and standby use. The preparation of the flux is completed.

[0075] The above flux and SnAg1.5Cu0.8Sb1.0 are added to the rosin barrel, and the required flux content is adjusted by an extruder. After determination, the tin wire is extruded, rolled and drawn into the required wire diameter, and finally a tin wire product with a flux content of 2.8% is obtained.

[0076] Example 2

[0077] A tin wire comprises the following components in weight percentage: alloy component SnSb5: 97.15%, flux content: 2.85%; wherein the flux component comprises:

[0078] Diethylamine hydrobromide 2%, cyclohexylamine hydrobromide 3%, isoadipic acid 4%, isooctanoic acid 4%, CLEARON P-105 15% and hydrogenated dimer acid 72%;

[0079] The preparation method of the flux and the tin wire is as follows:

[0080] 1. Weigh all the hydrogenated dimer acid and CLEARON P-105 together and add them into a stainless steel reactor. Set the temperature to 180°C. After they are completely dissolved, start stirring at 200 rpm to obtain the first mixture.

[0081] 2. Add all the diethylamine hydrobromide and cyclohexylamine hydrobromide into a grinder and grind them at high speed to obtain an active agent powder that is easy to dissolve;

[0082] 3. Increase the speed to 400 r / min, add the active agent powder to the first mixture, and after confirming that it is completely dissolved, cool it to 140°C to obtain the second mixture;

[0083] 4. Reduce the speed to 200r / min, slowly add all the isoadipic acid and isooctanedioic acid into the second mixture in turn, stir evenly, then add it directly into the rosin barrel for extrusion or pour it into a clean packaging barrel for cooling and standby use. The preparation of the flux is completed.

[0084] The above-mentioned flux and alloy component SnSb5 are added to the rosin barrel, and the required flux content is adjusted by an extruder. After determination, it is extruded, rolled, and drawn into the required wire diameter tin wire, and finally a tin wire product with a flux content of 2.8% is obtained.

[0085] Example 3

[0086] A tin wire comprises the following components in weight percentage: alloy component SnAg1.5Cu0.8Sb1.0: 97.17%, flux content: 2.83%; wherein the flux component comprises:

[0087] Diethylamine hydrobromide 0.8%, cyclohexylamine hydrobromide 1.2%, isoadipic acid 8%, CLEARON P-105 12%, and hydrogenated dimer acid 78%;

[0088] The preparation method of the flux and the tin wire is as follows:

[0089] 1. Weigh all the hydrogenated dimer acid and CLEARON P-105 together and add them into a stainless steel reactor. Set the temperature to 180°C. After they are completely dissolved, start stirring at 200 rpm to obtain the first mixture.

[0090] 2. Add all the diethylamine hydrobromide and cyclohexylamine hydrobromide into a grinder and grind them at high speed to obtain an active agent powder that is easy to dissolve;

[0091] 3. Increase the speed to 400 r / min, add the active agent powder to the first mixture, and after confirming that it is completely dissolved, cool it to 140°C to obtain the second mixture;

[0092] 4. Reduce the speed to 200r / min, slowly add all the isoadipic acid to the second mixture, stir evenly, then add it directly into the rosin barrel for extrusion or pour it into a clean packaging barrel for cooling. The flux is now ready.

[0093] The above flux and SnAg1.5Cu0.8Sb1.0 are added to the rosin barrel, and the required flux content is adjusted by an extruder. After determination, the tin wire is extruded, rolled and drawn into the required wire diameter, and finally a tin wire product with a flux content of 2.8% is obtained.

[0094] Comparative Examples 1-8 are provided below for comparison with Example 1. The comparison items include residual rate, halogen content, copper plate corrosion test, and expansion rate. Detailed data are shown in Table 1.

[0095] Comparative Example 1

[0096] Compared with Example 1, the difference of Comparative Example 1 is that the amine salt activator (a mixture of diethylamine hydrobromide and cyclohexylamine hydrobromide) in the flux is completely replaced by an equal amount of cyclohexylamine adipate.

[0097] Comparative Example 2

[0098] Compared with Example 1, the difference in Comparative Example 2 is that the organic acid activator isoadipic acid in the flux is completely replaced by an equal amount of succinic acid.

[0099] Comparative Example 3

[0100] Compared with Example 1, the difference in Comparative Example 3 is that the organic acid activator isoadipic acid in the flux is completely replaced by an equal amount of adipic acid.

[0101] Comparative Example 4

[0102] Compared with Example 1, the difference of Comparative Example 4 is that the organic acid activator isoadipic acid in the flux is completely replaced by an equal amount of sebacic acid.

[0103] Comparative Example 5

[0104] Compared with Example 1, the difference in Comparative Example 5 is that the organic acid activator isoadipic acid in the flux is completely replaced by an equal amount of glutaric acid.

[0105] Comparative Example 6

[0106] Compared with Example 1, the difference of Comparative Example 6 is that the organic acid activator isoadipic acid in the flux is completely replaced by an equal amount of salicylic acid.

[0107] Comparative Example 7

[0108] Compared with Example 1, the difference of Comparative Example 7 is that the flux carrier hydrogenated dimer acid in the flux is completely replaced by an equal amount of water white rosin 101.

[0109] Comparative Example 8

[0110] Compared with Example 1, the difference in Comparative Example 8 is that the carrier hydrogenated dimer acid in the flux is completely replaced by an equal amount of hydrogenated rosin AX-E.

[0111] It should be noted that the residual color test conditions were 500°C for 5 minutes, and the residual carbonization test conditions were three soldering temperature gradients of 450°C, 475°C, and 500°C. For the copper plate corrosion test, the expansion rate was tested in accordance with SJ / T11389-2009 and SJ / T11390-2009. The flux content was tested in accordance with GBT20422-2018. The results of each item are shown in Table 2.

[0112]

[0113]

[0114] Table 2 Comparative data results of Example 1 and Comparative Examples 1-8

[0115] According to the results in Table 2, Comparative Examples 1-8 and Example 1 can meet the requirements in terms of copper plate corrosion and expansion rate, but the residual colors of Comparative Examples 6-8 are all yellowed to varying degrees. Considering the impact on the appearance of the product and the presence of varying degrees of carbonized particles that cannot meet the welding requirements, Comparative Examples 1-5 illustrate that most conventional organic acids cannot meet the high-temperature welding process. Although the welding expansion rate is good, relatively serious carbonized particles will appear at different high temperatures. From a comprehensive comparison, the residual color of Example 1 of the present application is clean and stable, the expansion rate can reach the H-level high activity standard, the welding reliability is better, and under different high-temperature welding conditions, no obvious signs of carbonization appear, maintaining high welding reliability, and meeting the process requirements of high-temperature manual welding and automatic welding of 5G communication harnesses and other high-temperature resistant electronic products.

[0116] While various embodiments of the present disclosure have been described above, the foregoing description is intended to be illustrative, non-exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technical improvements to existing technologies, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A tin wire flux for 5G communication harness welding, characterized in that: It is composed of the following ingredients in percentage by weight: Amine salt active agent 2-5%, organic active agent 5-10%, film-forming agent 10-15%, and the balance is flux carrier; The flux carrier is hydrogenated dimer acid; The amine salt active agent is composed of diethylamine hydrobromide and cyclohexylamine hydrobromide in a mass ratio of 1:1.5; The organic active agents are isooctanoic acid and isooctanoic acid.

2. The tin wire flux for 5G communication harness welding according to claim 1, characterized in that: The film-forming agent is terephthalate tackifying resin P-105.

3. A method for preparing the tin wire flux for 5G communication harness welding according to claim 1 or 2, characterized in that: The method comprises the following preparation steps: Putting the flux carrier and the film-forming agent into a reaction kettle, melting them at an initial preset temperature, and stirring them at an initial preset speed to obtain a first mixture; Adding an amine salt active agent into a grinder and grinding it to obtain active agent powder; After increasing the initial preset speed to a target speed value, adding the active agent powder to the first mixture, and after dissolution, lowering the initial preset temperature to a target temperature value to obtain a second mixture; After the rotation speed target value is reduced to the initial preset rotation speed, an organic active agent is added to the second mixture and stirred evenly to obtain a soldering flux.

4. The preparation method according to claim 3, characterized in that The initial preset temperature is 180° C., and the initial preset rotation speed is 200 r / min.

5. The preparation method according to claim 3, characterized in that The target speed value is 400 r / min, and the target temperature value is 140°C.

6. A tin wire, characterized in that: The composition includes the following weight percentages: 97-97.4% of tin-based lead-free antimony-containing alloy and 2.6-3.0% of the tin wire flux for 5G communication wire harness welding according to claim 1 or 2.

7. The tin wire according to claim 6, characterized in that The tin-based lead-free antimony-containing alloy is any one of SnAg1.5Cu0.8Sb1.0, SnSb5, and SnSb10.

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