High-precision detection device for overlay accuracy measurement and detection method thereof

Abstract

The application belongs to the technical field of semiconductor detection, and discloses a high-precision detection device for overlay accuracy measurement and a detection method thereof, which comprises a detection seat and an optical microscope, the top surface of the detection seat is respectively provided with an adaptive cavity, a discharge port and a liquid discharge port, and the top surface of the detection seat is provided with an air suction hole. After positioning and detection, the dislodging frame removed by resetting is used to dislodge the automatically released wafer on the other side of the discharge port along the top surface of the detection seat to complete automatic discharge. The detection device is used for the overlay accuracy measurement of wafer samples. Through rapid positioning, synchronous adsorption and fixing, and resetting and dislodging, the detection operation of wafer samples is continuously and quickly completed. Wafer sample loading, positioning, detection, fixing and automatic discharge are completed in one go, the operation is simple, especially for the sequential detection of multiple wafer samples, the efficiency in the continuous detection process is greatly improved, rapid detection is realized, repeated operation and adjustment are not needed, and the use effect is good.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor detection, and particularly relates to a high-precision detection device for overlay accuracy measurement and a detection method thereof. BACKGROUND

[0002] Semiconductor detection is the key to improving yield and competitiveness. Semiconductor detection is throughout the entire product manufacturing process. The product team analyzes the detection data to ensure that the product process parameters meet the design requirements, and uses the detection data to determine the source of the problem and take corrective measures in a timely manner, so as to reduce defects and improve yield. For the overlay accuracy detection on the wafer in the semiconductor processing and manufacturing process, multiple wafer samples are usually required to cooperate with an optical microscope for detection.

[0003] The high-precision detection device for overlay accuracy measurement in the prior art needs positioning and fixing operations in the actual detection process in order to cooperate with the precise detection of the optical microscope, so as to ensure the accuracy of the detection position and avoid deviation. However, for continuous detection of multiple wafer samples, the current positioning and fixing and replacement of the wafer samples to be detected are relatively troublesome, and repeated positioning adjustment and switching of the material are required. The comprehensive detection efficiency is low, and positioning errors and damage to the wafer samples are likely to occur during frequent positioning, fixing and switching of the material. The comprehensive detection efficiency is low, the effect is poor, and the use effect is not good.

[0004] In addition, the high-precision detection device for overlay accuracy measurement in the prior art usually needs surface cleaning treatment before detection, and uses chemical liquid to wash and remove surface dirt to ensure the subsequent detection accuracy. However, the current cleaning treatment needs to be completed independently before wafer detection, and needs to cooperate with an independent process and cleaning equipment. The processing operation before wafer detection is relatively complex, which further reduces the detection efficiency, and the continuous detection effect of multiple samples is not good. SUMMARY

[0005] The application aims to provide a high-precision detection device for overlay accuracy measurement and a detection method thereof to solve the problems in the background.

[0006] In order to achieve the above object, the application provides the following technical scheme: a high-precision detection device for overlay accuracy measurement and a detection method thereof, comprising a detection seat and an optical microscope, the top surface of the detection seat is respectively provided with an adaptive cavity, a discharge port and a liquid discharge port, the top surface of the detection seat is provided with an air suction hole, the inside of the detection seat is provided with a negative pressure cavity in communication with the air suction hole, the inside of the adaptive cavity is movably sleeved with a material stirring assembly, the bottom of the material stirring assembly is fixedly provided with a steering power assembly, the bottom of the detection seat is provided with a lifting power assembly, the inside of the detection seat is movably sleeved with a linkage assembly, the linkage assembly is fixedly connected with the steering power assembly, the top surface of the detection seat is fixedly connected with a limiting baffle, and the top surface of the limiting baffle is fixedly connected with a quick washing assembly.

[0007] The material stirring assembly comprises a positioning frame, a material stirring frame, a rotating shaft, a torsional spring and a gear one, the material stirring frame is swingingly assembled on the top of the positioning frame, the air suction hole, the liquid discharge port and the discharge port are all located on the swing path of the material stirring frame, and the gear one is meshingly connected with the steering power assembly.

[0008] Preferably, the top surface of the positioning frame is in contact with the bottom surface of the material stirring frame, the peripheral sizes of the positioning frame and the material stirring frame are the same, the positioning frame is movably sleeved in the inside of the adaptive cavity, the adaptive cavity is located on the outside of the air suction hole, the rotating shaft is fixedly connected with the bottom surface of one end of the material stirring frame, the lower end of the rotating shaft penetrates through the bottom surface of the positioning frame and is movably sleeved with the positioning frame, the torsional spring is sleeved on the outside of the rotating shaft and is fixedly connected between the positioning frame and the material stirring frame, and the gear one is fixedly sleeved on the outer surface of the rotating shaft and is located below the positioning frame.

[0009] Preferably, the top surface of the material stirring frame of the positioning frame is provided with a circular arc sleeve hole, one side of the circular arc sleeve hole is provided with a notch, and the positioning frame and the material stirring frame are both semi-enclosed structures.

[0010] Preferably, the steering power assembly comprises a bottom sleeve, a motor one, a gear two and a reserved cavity, the bottom sleeve is fixedly connected with the bottom of the positioning frame, the motor one is fixedly installed in the inside of the bottom sleeve, the gear two is fixedly sleeved on the output shaft of the motor one, the reserved cavity is formed in the bottom of the bottom sleeve, and the gear two is meshingly connected with the gear one.

[0011] Preferably, the lifting power assembly comprises a motor two, a threaded rod and a threaded sleeve, the motor two is fixedly arranged on the bottom of the detection seat through a bottom frame, the threaded rod is fixedly connected with the output shaft of the motor two, the threaded rod extends into the reserved cavity along the upper end of the detection seat, the threaded sleeve is fixedly sleeved in the inside of the reserved cavity, and the threaded sleeve is threadedly sleeved with the threaded rod.

[0012] Preferably, the inner part of the detection seat is respectively provided with a movable cavity and a communication groove, two ends of the communication groove are respectively connected with the movable cavity and the matching cavity, the upper end of the movable cavity is connected with the negative pressure cavity, the linkage assembly is movably sleeved in the communication groove, the linkage assembly comprises a connecting folding rod and a movable column, the movable column is movably sleeved in the movable cavity, the connecting folding rod is slidably sleeved in the communication groove, one end of the connecting folding rod is fixedly connected with the movable column, and the other end of the connecting folding rod is fixedly connected with the bottom sleeve.

[0013] Preferably, the top of the material stirring frame is provided with a first through hole, the inside of the material stirring frame is provided with a communication arc cavity, and the inner side arc surface of the material stirring frame is provided with an inclined port.

[0014] Preferably, the quick washing assembly comprises a mounting ring, a second through hole, a ring cavity, a fan and an air inlet plate, the mounting ring is fixedly connected to the top surface of the limiting baffle, the second through hole and the ring cavity are respectively formed in the bottom surface and the inside of the mounting ring, the second through hole and the ring cavity are connected, the fan is arranged in the inside of the mounting ring, the air inlet plate is fixedly sleeved on the top of the mounting ring and located above the fan, the top surface of the air inlet plate is provided with an air inlet hole, and the top surface of the mounting ring is fixedly connected with a liquid supply curved pipe connected with the ring cavity.

[0015] Preferably, the number of the second through holes is the same as that of the first through holes, the second through holes are located above the oscillation path of the first through holes, the mounting ring is located above the oscillation path of the material stirring frame, and the top surface of the limiting baffle is provided with a sealing baffle fixedly connected to the outer surface of the mounting ring.

[0016] A detection method of a high-precision detection device for overlay accuracy measurement comprises the following detection steps:

[0017] First step: keep the material stirring assembly in the initial position, the material stirring frame is located above the matching cavity and outside the air inlet hole, and the wafer sample to be detected is put on the top of the material stirring assembly, the wafer sample falls on the top surface of the detection seat, the turning power assembly is started to drive the material stirring frame to oscillate, the material stirring frame rotates and slides on the top surface of the detection seat, and the wafer sample in the inner positioning sleeve is driven to oscillate to be located directly below the quick washing assembly;

[0018] Second step: start the external cleaning liquid supply equipment, the liquid enters the inside of the mounting ring through the liquid supply curved pipe, and is sprayed out through the second through hole, the first through hole, the communication arc cavity and the inclined port, the liquid is sprayed to the wafer sample in the material stirring frame along the middle space of the mounting ring, the surface cleaning is completed, then the top fan is started, the liquid flows out along the liquid discharge port, and the air volume blows the wafer sample to complete the quick drying after cleaning.

[0019] Third step: the turning power assembly is reset, the cleaned wafer sample is reset to the upper side of the air suction hole, the lifting power assembly is started, the material pushing assembly is moved downward along the matching cavity, and the linkage assembly is moved downward at the same time, with the downward movement of the assembly, the material pushing assembly is completely hidden in the matching cavity, and the linkage assembly is moved downward and the gas in the negative pressure cavity is sucked, the wafer sample on the top surface of the air suction hole forms a pressure difference and is adsorbed and fixed, and positioning and fixing are completed;

[0020] Fourth step: the optical microscope is adjusted to detect the overlay precision measurement of the positioned and fixed wafer sample, the optical microscope is reset after detection, the lifting power assembly is started again, and is reset to the initial state, the wafer sample is released from adsorption and fixation, the turning power assembly is started again, the material pushing assembly is swung, the wafer sample positioned and sleeved in the material pushing assembly is swung to the other side and is located above the discharge port, the wafer sample is automatically dropped out after detection, and then the material pushing assembly is reset for the next group of detection.

[0021] The beneficial effects of the present application are as follows:

[0022] 1、The present application utilizes the effect that the material pushing assembly moves up and down along the matching cavity, positions the wafer to be detected at the detection position above the air suction hole, and completes rapid positioning, hides the structure after positioning by moving the material pushing assembly downward, avoids interference with the approach detection of the optical microscope, changes the air pressure in the negative pressure cavity by moving the material pushing assembly downward and the linkage assembly downward, realizes rapid adsorption and fixation of the wafer sample after positioning, avoids the influence of vibration on the detection position, and cooperates with the swingable material pushing assembly in the material pushing assembly to push the wafer out of the material pushing assembly to the discharge port on the other side after positioning and detection, which realizes automatic discharge, realizes continuous and rapid detection of the wafer sample, and realizes wafer sample positioning, detection, and automatic discharge in one operation, which is simple to operate, especially for the detection of multiple wafer samples in sequence, greatly improves the efficiency in the continuous detection process, realizes rapid detection, and does not need to be repeatedly operated and adjusted.

[0023] 2、The present application utilizes the swing stirring effect of the stirring assembly again, cooperates with the inclined opening of the inner arc surface of the stirring frame, and utilizes the added quick washing assembly, through the utilization of the stirring assembly, the wafer sample positioned before detection is swung and transferred to the lower side of the quick washing assembly, cooperates with the communication of the quick washing assembly and the stirring frame after the transfer, guides the cleaning liquid to carry out the quick liquid flushing in the limited space of the assembly ring and the stirring frame to remove the surface dirt and impurities, improves the subsequent overlay detection precision, cooperates with the notch design of the front end of the stirring frame, cooperates with the limiting of the limiting baffle, guides the flushing liquid to be directly and quickly discharged from the liquid discharge port, and the fan in the enclosed space rotates quickly to complete the drying treatment after the automatic flushing and liquid discharge, quickly completes the cleaning treatment before detection, the subsequent detection precision, the comprehensive cleaning speed, the high efficiency and the good use effect. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structural schematic view of the present application;

[0025] Figure 2 It is a sectional view schematic view of the present application;

[0026] Figure 3 It is a schematic view of the detection seat of the present application;

[0027] Figure 4 It is a sectional view schematic view of the detection seat of the present application;

[0028] Figure 5 It is an installation schematic view of the stirring assembly and the steering power assembly of the present application;

[0029] Figure 6 It is a sectional view schematic view of the stirring assembly of the present application;

[0030] Figure 7 It is a sectional view schematic view of the stirring frame of the present application;

[0031] Figure 8 It is a schematic view of the lifting power assembly of the present application;

[0032] Figure 9 It is a schematic view of the quick washing assembly of the present application;

[0033] Figure 10 It is a sectional view schematic view of the quick washing assembly of the present application.

[0034] As shown in the figure: 1, detection seat; 2, adaptive cavity; 3, discharge port; 4, liquid discharge port; 5, suction hole; 6, negative pressure cavity; 7, movable cavity; 8, communication groove; 9, stirring assembly; 91, positioning frame; 92, stirring frame; 93, rotating shaft; 94, torsional spring; 95, gear one; 10, steering power assembly; 101, bottom sleeve; 102, motor one; 103, gear two; 104, reserved cavity; 11, lifting power assembly; 111, motor two; 112, threaded rod; 113, threaded sleeve; 12, linkage assembly; 121, connecting folding rod; 122, movable column; 13, limit stop; 14, quick washing assembly; 141, assembly ring; 142, No. 2 through hole; 143, ring cavity; 144, fan; 145, air inlet plate; 15, inclined port; 16, communication arc cavity; 17, No. 1 through hole; 18, sealing stop. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0036] As Figures 1 to 10 shown, the embodiment of the present application provides a high-precision detection device for overlay accuracy measurement and a detection method thereof, which comprises a detection seat 1 and an optical microscope, the top surface of the detection seat 1 is provided with an adaptive cavity 2, a discharge port 3 and a liquid discharge port 4, the top surface of the detection seat 1 is provided with a suction hole 5, the inside of the detection seat 1 is provided with a negative pressure cavity 6 connected with the suction hole 5, the inside of the adaptive cavity 2 is movably sleeved with a stirring assembly 9, the bottom of the stirring assembly 9 is fixedly provided with a steering power assembly 10, the bottom of the detection seat 1 is provided with a lifting power assembly 11, the inside of the detection seat 1 is movably sleeved with a linkage assembly 12, the linkage assembly 12 is fixedly connected with the steering power assembly 10, the top surface of the detection seat 1 is fixedly connected with a limit stop 13, and the top surface of the limit stop 13 is fixedly connected with a quick washing assembly 14.

[0037] The stirring assembly 9 comprises a positioning frame 91, a stirring frame 92, a rotating shaft 93, a torsional spring 94 and a gear one 95, the stirring frame 92 is swingably assembled on the top of the positioning frame 91, the suction hole 5, the liquid discharge port 4 and the discharge port 3 are all located on the swing path of the stirring frame 92, and the gear one 95 is engagedly connected with the steering power assembly 10.

[0038] Embodiment 1: Keep the poking assembly 9 in the initial position, the poking frame 92 is above the adaptive cavity 2 and outside the suction hole 5, the bottom of the poking frame 92 is slightly higher than the top of the detection seat 1, the wafer sample to be detected is thrown along the top of the poking assembly 9, the wafer sample falls on the top of the detection seat 1, the wafer sample is automatically positioned above the suction hole 5, start the lifting power assembly 11, the motor two 111 drives the threaded rod 112 to rotate, so that the poking assembly 9 threaded with the threaded sleeve 113 is lowered along the adaptive cavity 2, the poking frame 92 assembly is lowered into the adaptive cavity 2, and at the same time the linkage assembly 12 is lowered synchronously, as the assembly is lowered, the poking assembly 9 is completely hidden in the adaptive cavity 2, and when the linkage assembly 12 is lowered, the movable column 122 is lowered along the inside of the movable cavity 7 and increases the space volume of the upper part of the movable cavity 7, and the gas in the suction cavity 6 is sucked, the gas pressure difference is formed on the upper and lower surfaces of the wafer sample sealed on the top surface of the suction hole 5 and is adsorbed and fixed, the positioning and fixing are quickly completed, the optical microscope is adjusted to approach the wafer sample positioned and fixed, and after approaching, the detection of overlay precision measurement is carried out, after detection, the optical microscope is reset, the lifting power assembly 11 is started again, and the initial state is reset, the poking frame 92 moves out of the adaptive cavity 2 and is again sleeved outside the wafer sample, at the same time the linkage assembly 12 is reset to release the adsorption and fixation of the wafer sample, the steering power assembly 10 is started, the motor one 102 drives the gear two 103 to rotate, so that the meshing gear one 95 rotates, the rotating shaft 93 rotates, and the poking frame 92 swings along the top surface of the detection seat 1, the torsional spring 94 is deformed, the poking frame 92 swings the wafer sample positioned inside to the other side and above the discharge port 3, at this time the detected wafer sample automatically falls out of the discharge port 3, and then the poking frame 92 is reset for the detection of the next group of wafer samples.

[0039] Firstly, by using the effect of moving up and down along the adaptive cavity 2 of the poking assembly 9, the wafer to be detected is conveniently positioned at the detection position and covers the air suction hole 5 above, completes the rapid positioning, and hides the structure after positioning by using the downward movement of the poking assembly 9, avoids the interference of the optical microscope during the detection, and changes the air pressure in the negative pressure cavity 6 by using the downward movement of the poking assembly 9 and the downward movement of the linkage assembly 12, realizes the rapid adsorption and fixation of the wafer sample after positioning, avoids the influence of vibration on the detection position, and cooperates with the swingable poking rack 92 in the poking assembly 9, which is automatically removed from the detection seat 1 top after positioning and detection, and is automatically removed from the discharge port 3 on the other side to complete the automatic discharge. The actual overlay accuracy measurement of the wafer sample is detected by rapid positioning, synchronous adsorption and fixation, and reset to move out of the material, and the wafer sample is continuously and quickly detected. The wafer sample is loaded, positioned, fixed and detected, and the operation is simple. Especially for the detection of multiple wafer samples in turn, the efficiency of the continuous detection process is greatly improved, the rapid detection process is realized, and repeated operation and adjustment are not required. The use effect is good.

[0040] In example 2, when cleaning is needed before detection, the poking assembly 9 is kept in the initial position, the poking rack 92 is located above the adaptive cavity 2 and outside the air suction hole 5, the wafer sample to be detected is put along the top of the poking assembly 9, the wafer sample falls on the top surface of the detection seat 1, the turning power assembly 10 is started to drive the poking rack 92 to swing, the poking rack 92 rotates and slides along the top surface of the detection seat 1, and the wafer sample in the internal positioning sleeve is pushed to swing to the front of the quick washing assembly 14. At this time, the first through hole 17 and the second through hole 142 are one-to-one corresponding and communicating, and the arc-shaped limiting baffle 13 is located in front of the swinging poking rack 92. The external cleaning liquid supply device is started, the liquid enters the inside of the assembly ring 141 through the liquid supply elbow, and is sprayed out through the second through hole 142, the first through hole 17, the communicating arc cavity 16 and the inclined port 15. The liquid is sprayed along the middle space of the assembly ring 141 to the wafer sample in the poking rack 92, and the surface cleaning is completed. Then the top fan 144 is started, and the liquid flow is blown away to make the liquid flow out of the gap in the front segment of the poking rack 92 and out of the liquid discharge port 4. The air volume blows the wafer sample to complete the quick drying after cleaning, completes the quick washing and quick drying, and then the turning power assembly 10 is reset to reset the cleaned wafer sample to the upper side of the air suction hole 5 for detection after positioning.

[0041] First, by reusing the swinging and shifting effect of the material shifting assembly 9, in conjunction with the inclined opening 15 opened on the inner arc surface of the material shifting rack, and by utilizing the added quick-washing assembly 14, the wafer sample positioned before detection is swung and transferred to the bottom of the quick-washing assembly 14 by utilizing the material shifting assembly 9, and in conjunction with the connection between the quick-washing assembly 14 and the material shifting rack 92 after the transfer, the cleaning liquid is guided to be quickly rinsed in the limited space of the assembly ring 141 and the material shifting rack 92 to remove surface dirt and impurities, thereby improving the subsequent overlay detection accuracy. At the same time, in conjunction with the notch design at the front end of the material shifting rack 92 and the limit of the limit block 13, the rinsing liquid is guided to be quickly discharged directly from the drain port 4, and the fan 144 in the enclosed space rotates quickly to complete the drying process after automatic rinsing and draining, thereby quickly completing the cleaning process before detection, and while positioning the subsequent detection accuracy, the comprehensive cleaning speed is fast, the efficiency is high, and the use effect is good.

[0042] like Figure 2 、 Figure 3 、 Figure 5 、 Figure 6 and Figure 7 As shown, the top surface of the positioning frame 91 contacts the bottom surface of the material selection frame 92, the outer dimensions of the positioning frame 91 and the material selection frame 92 are the same, the positioning frame 91 is movably sleeved inside the adaptation chamber 2, the adaptation chamber 2 is located on the outside of the suction hole 5, the rotating shaft 93 is fixedly connected to the bottom surface of one end of the material selection frame 92, the lower end of the rotating shaft 93 passes through the bottom surface of the positioning frame 91 and is rotatably sleeved with the positioning frame 91, the torsion spring 94 is sleeved on the outside of the rotating shaft 93 and fixedly connected between the positioning frame 91 and the material selection frame 92, and the gear 95 is fixedly sleeved on the outer surface of the rotating shaft 93 and is located below the positioning frame 91 The top surfaces of the positioning frame 91 and the material shifting frame 92 are both provided with arc holes, and a notch is provided on one side of the arc holes. The positioning frame 91 and the material shifting frame 92 are both semi-enclosed structures. The steering power assembly 10 includes a bottom sleeve 101, a motor 102, a gear 2 103 and a reserved cavity 104. The bottom sleeve 101 is fixedly connected to the bottom of the positioning frame 91, and the motor 102 is fixedly installed inside the bottom sleeve 101. The gear 2 103 is fixedly sleeved on the output shaft of the motor 102. The reserved cavity 104 is opened at the bottom of the bottom sleeve 101, and the gear 2 103 is meshed with the gear 1 95.

[0043] The elasticity of the torsion spring 94 facilitates reset after swinging. The initial position of the material rack 92 is slightly higher than the top of the detection seat 1, ensuring that it can swing smoothly along the top surface of the detection seat 1 and drive the internally sleeved wafer sample. The arc sleeve hole adapts to the size of the target wafer sample and is convenient for positioning. The opening of the notch facilitates the insertion of the wafer sample and increases the operating space. On the other hand, it guides the outflow of the cleaning liquid during cleaning. The steering power component 10 drives the rotating shaft 93 to rotate through the meshing effect to complete the swing control of the material rack 92.

[0044] likeFigure 1 、 Figure 2 、 Figure 4 、 Figure 5 and Figure 8 As shown in

[0045] By using the lifting power assembly 11 to realize the up and down movement of the steering power assembly 10 and the stirring assembly 9, the position of the stirring frame 92 is controlled and hidden during detection.

[0046] As shown in Figure 2 、 Figure 4 and Figure 5 The inner part of the detection seat 1 is respectively provided with a movable cavity 7 and a communication groove 8, the two ends of the communication groove 8 are respectively communicated with the movable cavity 7 and the adaptive cavity 2, the upper end of the movable cavity 7 is communicated with the negative pressure cavity 6, the linkage assembly 12 is movably sleeved in the communication groove 8, the linkage assembly 12 includes a connecting folding rod 121 and a movable column 122, the movable column 122 is movably sleeved in the movable cavity 7, the connecting folding rod 121 is slidably sleeved in the communication groove 8, one end of the connecting folding rod 121 is fixedly connected with the movable column 122, and the other end of the connecting folding rod 121 is fixedly connected with the bottom sleeve 101.

[0047] By using the synchronous up and down movement of the linkage assembly 12, using a set of lifting power assembly 11 to realize the hiding of the stirring assembly 9 after positioning, at the same time, the linkage assembly 12 is driven to realize the decrease of the air pressure in the negative pressure cavity 6, realize the fixed adsorption after positioning, and maintain the stability of the wafer sample.

[0048] As shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 、 Figure 9 and Figure 10As shown, the top of the material stirring frame 92 is provided with a first through hole 17, the inside of the material stirring frame 92 is provided with a communication arc cavity 16, the inner side arc surface of the material stirring frame 92 is provided with an inclined port 15, the upper and lower sides of the communication arc cavity 16 are communicated with the first through hole 17 and the inclined port 15 respectively, the quick washing assembly 14 includes an assembly ring 141, a second through hole 142, a ring cavity 143, a fan 144 and an air inlet plate 145, the assembly ring 141 is fixedly connected to the top surface of the limiting baffle 13, the second through hole 142 and the ring cavity 143 are respectively provided in the bottom surface and the inside of the assembly ring 141, the second through hole 142 and the ring cavity 143 are communicated, the fan 144 is arranged in the inside of the assembly ring 141, the air inlet plate 145 is fixedly sleeved on the top of the assembly ring 141 and located above the fan 144, the top surface of the air inlet plate 145 is provided with an air inlet hole, the top surface of the assembly ring 141 is fixedly connected with a liquid supply curved pipe, the liquid supply curved pipe is communicated with the ring cavity 143, the number of the second through hole 142 is the same as that of the first through hole 17, the second through hole 142 is located above the oscillation path of the first through hole 17, the assembly ring 141 is located above the oscillation path of the material stirring frame 92, the top surface of the limiting baffle 13 is provided with a sealing baffle 18, the sealing baffle 18 is fixedly connected to the outer side surface of the assembly ring 141.

[0049] By using the position control of the first through hole 17 and the second through hole 142 and the position control of the material stirring frame 92 and the assembly ring 141, after the material stirring frame 92 oscillates and aligns with the assembly ring 141, it is ensured that the first through hole 17 and the second through hole 142 are correspondingly communicated, the cleaning liquid is guided to enter the inclined port 15 and flush the top of the wafer sample in the limited space, the sealing baffle 18 adapts to the oscillation radius and position of the material stirring frame 92, ensures that the sealing baffle 18 is matched when aligned to realize the relative sealing of the limited flushing space, controls the flow of the flushing liquid, and directly discharges from the liquid discharge port 4, the inner side surface of the sealing baffle 18 is an arc surface, and the material stirring frame 92 just contacts when oscillating and aligning to maintain a certain sealing, the fan 144 realizes subsequent air blowing and drying to blow and dry the residual liquid.

[0050] A detection method of a high-precision detection device for overlay accuracy measurement, comprising the following detection steps:

[0051] First step: keep the material stirring assembly 9 in the initial position, the material stirring frame 92 is located above the adaptive cavity 2 and outside the air suction hole 5, the wafer sample to be detected is thrown along the top of the material stirring assembly 9, the wafer sample falls to the top surface of the detection seat 1, the turning power assembly 10 is started to drive the material stirring frame 92 to oscillate, the material stirring frame 92 rotates and slides along the top surface of the detection seat 1 to push the wafer sample in the inside positioning sleeve to oscillate to the lower side of the quick washing assembly 14;

[0052] Second step: start the external cleaning liquid supply device, the liquid through the supply tube into the assembly ring 141 inside, and through the second hole 142, the first hole 17, the communication arc cavity 16 and the inclined port 15, the liquid is sprayed along the assembly ring 141 middle space to the wafer sample in the material rack 92, complete the surface cleaning, then start the top fan 144, the liquid along the drain port 4 outflow, the air volume along the wafer sample top blowing complete the cleaning of fast drying;

[0053] Third step: turn to the power assembly 10 reset, drive the cleaned wafer sample reset to the air suction hole 5 above, start the lifting power assembly 11, drive the material assembly 9 along the adaptive cavity 2 down, and at the same time drive the linkage assembly 12 down, with the assembly down, the material assembly 9 is completely hidden in the adaptive cavity 2, and the linkage assembly 12 down and suction the gas in the negative pressure cavity 6, the wafer sample on the top surface of the air suction hole 5 forms a pressure difference and adsorbs and fixes, completes positioning and fixing;

[0054] Fourth step: adjust the optical microscope to measure the detection of the positioning and fixed wafer sample, after detecting the optical microscope, start the lifting power assembly 11 again, reset to the initial state, the wafer sample is released from the adsorption and fixation, start the turning power assembly 10 again, make the material rack 92 in the material assembly 9 swing, drive the wafer sample inside the positioning sleeve to swing to the other side and above the discharge port 3, the wafer sample is automatically dropped out after detecting, then reset the material rack 92 for the next group of detection.

[0055] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision detection device for overlay measurement, comprising a detection seat (1) and an optical microscope, characterized in that: The top surface of the detection seat (1) is respectively provided with an adaptive cavity (2), a discharge port (3) and a liquid discharge port (4), the top surface of the detection seat (1) is provided with an air suction hole (5), the inside of the detection seat (1) is provided with a negative pressure cavity (6) in communication with the air suction hole (5), the inside of the adaptive cavity (2) movably sleeved with a stirring component (9), the bottom of the stirring component (9) is fixedly provided with a steering power component (10), the bottom of the detection seat (1) is provided with a lifting power component (11), the inside of the detection seat (1) movably sleeved with a linkage component (12), the linkage component (12) is fixedly connected with the steering power component (10), the top surface of the detection seat (1) is fixedly connected with a quick washing component (14), the top surface of the limiting baffle (13) is fixedly connected with the quick washing component (14). The stirring component (9) comprises a positioning frame (91), a stirring frame (92), a rotating shaft (93), a torsional spring (94) and a gear one (95), the stirring frame (92) is swingingly assembled on the top of the positioning frame (91), the air suction hole (5), the liquid discharge port (4) and the discharge port (3) are all located on the swing path of the stirring frame (92), the gear one (95) is meshingly connected with the steering power component (10).

2. The high-precision measurement device for overlay accuracy measurement according to claim 1, characterized in that: The top surface of the positioning frame (91) is in contact with the bottom surface of the stirring frame (92), the positioning frame (91) and the stirring frame (92) have the same peripheral dimension, the positioning frame (91) is movably sleeved in the inside of the adaptive cavity (2), the adaptive cavity (2) is located on the outside of the air suction hole (5), the rotating shaft (93) is fixedly connected on the bottom surface of one end of the stirring frame (92), the lower end of the rotating shaft (93) penetrates through the bottom surface of the positioning frame (91) and is movably sleeved with the positioning frame (91), the torsional spring (94) is sleeved on the outside of the rotating shaft (93) and is fixedly connected between the positioning frame (91) and the stirring frame (92), the gear one (95) is fixedly sleeved on the outer surface of the rotating shaft (93) and is located below the positioning frame (91).

3. The high-precision measurement device for overlay accuracy measurement according to claim 1, characterized in that: The top surface of the stirring frame (92) of the positioning frame (91) is provided with an arc sleeve hole, one side of the arc sleeve hole is provided with a notch, the positioning frame (91) and the stirring frame (92) are both half-enclosing structures.

4. The highly accurate measurement device for overlay accuracy measurement according to claim 1, characterized in that: The steering power component (10) comprises a bottom sleeve (101), a motor one (102), a gear two (103) and a reserved cavity (104), the bottom sleeve (101) is fixedly connected on the bottom of the positioning frame (91), the motor one (102) is fixedly installed in the inside of the bottom sleeve (101), the gear two (103) is fixedly sleeved on the output shaft of the motor one (102), the reserved cavity (104) is formed on the bottom of the bottom sleeve (101), the gear two (103) is meshingly connected with the gear one (95).

5. The highly accurate measurement device for overlay accuracy measurement according to claim 1, characterized in that: The lifting power assembly (11) comprises a second motor (111), a threaded rod (112) and a threaded sleeve (113), the second motor (111) is fixed at the bottom of the detection seat (1) through the bottom frame, the threaded rod (112) is fixedly connected on the output shaft of the second motor (111), the threaded rod (112) extends into the reserved cavity (104) along the upper end of the detection seat (1), and the threaded sleeve (113) is fixedly sleeved in the inside of the reserved cavity (104), and the threaded sleeve (113) is threadedly sleeved with the threaded rod (112).

6. The highly accurate measurement device for overlay accuracy measurement according to claim 1, characterized in that: The inside of the detection seat (1) is respectively provided with a movable cavity (7) and a communication groove (8), two ends of the communication groove (8) are respectively communicated with the movable cavity (7) and the adaptive cavity (2), the upper end of the movable cavity (7) is communicated with the negative pressure cavity (6), the linkage assembly (12) is movably sleeved in the communication groove (8), the linkage assembly (12) comprises a connecting folding rod (121) and a movable column (122), the movable column (122) is movably sleeved in the movable cavity (7), the connecting folding rod (121) is slidably sleeved in the communication groove (8), one end of the connecting folding rod (121) is fixedly connected with the movable column (122), and the other end of the connecting folding rod (121) is fixedly connected with the bottom sleeve (101).

7. The highly accurate measurement device for overlay accuracy measurement according to claim 1, characterized in that: The top of the material stirring frame (92) is provided with a first through hole (17), the inside of the material stirring frame (92) is provided with a communication arc cavity (16), and the inner arc surface of the material stirring frame (92) is provided with an inclined port (15).

8. The highly accurate measurement device for overlay accuracy measurement according to claim 1, characterized in that: The quick washing assembly (14) comprises an assembly ring (141), a second through hole (142), a ring cavity (143), a fan (144) and an air inlet plate (145), the assembly ring (141) is fixedly connected to the top surface of the limiting baffle (13), the second through hole (142) and the ring cavity (143) are arranged on the bottom surface and the inside of the assembly ring (141) respectively, the second through hole (142) and the ring cavity (143) are communicated, the fan (144) is arranged in the inside of the assembly ring (141), the air inlet plate (145) is fixedly sleeved on the top of the assembly ring (141) and located above the fan (144), the top surface of the air inlet plate (145) is provided with an air inlet hole, and the top surface of the assembly ring (141) is fixedly connected with a liquid supply curved pipe, the liquid supply curved pipe is communicated with the ring cavity (143).

9. The high-precision measurement device for overlay accuracy measurement according to claim 8, characterized in that: The number of the second through hole (142) is the same as that of the first through hole (17), the second through hole (142) is located above the oscillation path of the first through hole (17), the assembly ring (141) is located above the oscillation path of the material stirring frame (92), and the top surface of the limiting baffle (13) is provided with a sealing baffle (18).

10. The detection method of the high-precision detection device for overlay measurement according to claim 1, characterized in that: The detection steps comprise: The first step: keep the poking assembly (9) in the initial position, the poking frame (92) is above the adaptive cavity (2) and outside the air suction hole (5), put the wafer sample to be detected along the top of the poking assembly (9), the wafer sample falls to the top surface of the detection seat (1), start the steering power assembly (10) to drive the poking frame (92) to swing, the poking frame (92) rotates and slides along the top surface of the detection seat (1), and pushes the wafer sample in the inner positioning sleeve to swing to the lower side of the quick washing assembly (14); The second step: start the external cleaning liquid supply device, the liquid enters the inner part of the assembly ring (141) through the liquid supply curved pipe, and is sprayed through the second through hole (142), the first through hole (17), the communication arc cavity (16) and the inclined port (15), the liquid is sprayed to the wafer sample in the poking frame (92) along the middle space of the assembly ring (141), the surface cleaning is completed, then the top fan (144) is started, the liquid flows out along the liquid discharge port (4), and the air volume blows the cleaned wafer sample to complete the quick drying; The third step: the steering power assembly (10) is reset to drive the cleaned wafer sample to reset to the upper side of the air suction hole (5), the lifting power assembly (11) is started to drive the poking assembly (9) to move downward along the adaptive cavity (2), and the linkage assembly (12) is also moved downward, with the movement of the assembly, the poking assembly (9) is completely hidden in the adaptive cavity (2), and the linkage assembly (12) is moved downward and sucks the gas in the negative pressure cavity (6), the wafer sample on the top surface of the air suction hole (5) forms a pressure difference between the upper and lower surfaces and is adsorbed and fixed, the positioning and fixing are completed; The fourth step: adjust the optical microscope to detect the positioning and fixed wafer sample to measure the overlay precision, reset the optical microscope after detection, start the lifting power assembly (11) again, reset to the initial state, the wafer sample is released from the adsorption and fixing, start the steering power assembly (10) again, make the poking frame (92) in the poking assembly (9) swing, drive the wafer sample in the inner positioning sleeve to swing to the other side and above the discharge port (3), the wafer sample is automatically dropped out after detection, then reset the poking frame (92) for the next group of detection.

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