A data center cabinet-level server evaporative cooling system and flow control method

Abstract

The present invention discloses an evaporative cooling system and flow control method for a data center cabinet-level server, which relates to the field of data center cooling technology. A liquid storage tank is connected to a coolant delivery pipe via a variable frequency refrigerant pump, and the coolant delivery pipe is connected to a data center server cabinet. The data center server cabinet is equipped with multiple server liquid cooling plates. By installing an electromagnetic flow valve in front of the inlet of the server liquid cooling plate on each layer of the cabinet, the flow at the inlet of the server liquid cooling plates on different layers is controlled by controlling the opening of the electromagnetic flow valve. Without the need to customize the coolant branch pipe, the assembly efficiency of the data center server cabinet and the versatility of the components can be effectively improved. The opening of the electromagnetic flow valve of each layer of the liquid cooling plate is dynamically adjusted according to the change in the heat generation power of each layer of the server cabinet in the data center server cabinet to change the flow of the coolant of each layer of the server, thereby realizing refined dynamic allocation and management of the inlet flow of each layer of the liquid cooling plate, and reducing the total flow demand of the coolant and the total power consumption of the cooling system.

Description

Technical Field

[0001] The present invention relates to the technical field of data center cooling, and in particular to an evaporative cooling system for a cabinet-level server in a data center and a flow control method. Background Art

[0002] Data centers are key infrastructure for promoting the development of the digital economy. As the power density of data centers has continued to increase in recent years, their cooling method has gradually shifted from air cooling to liquid cooling. Data centers with higher power density will adopt two-phase evaporative cooling.

[0003] In existing data center server cabinets, IT equipment on different server floors generates varying heat due to varying loads. This results in varying coolant flow rates within the liquid cooling plates on each server floor, and these differences can change over time. Furthermore, because servers on different floors are located at varying heights within the cabinet, the gravitational pressure drop caused by the coolant flowing from the manifold to the different cold plates results in varying inlet flows between server cold plates. These two factors combine to create a mismatch between coolant demand and supply on different server floors during data center operation, complicating the distribution of coolant flow across the cabinet floors.

[0004] However, neither the single-phase liquid cooling method nor the two-phase evaporative cooling method of the cabinet-level data center can solve the above-mentioned mismatch between the supply and demand of the coolant. This problem will make the inlet pressure of the liquid cooling plate of the server with higher height relatively small, and the inlet pressure of the liquid cooling plate of the server with lower height relatively large, resulting in different cooling effects of the coolant in the liquid cooling plates at different heights.

[0005] For this problem, the more common practice at present is to change the cross-sectional area of ​​the diversion manifold at different heights. The diversion manifold with a higher height (i.e., the liquid cooling plate inlet pipe) adopts a larger cross-sectional area, and the diversion manifold with a lower height adopts a smaller cross-sectional area to balance the different coolant pressures at the inlet of the liquid cooling plates at different heights, so that the flow in the inlet pipes of the liquid cooling plates at different layers is the same. For example, in the paper "Numerical Study on Flow Uniformity and Resistance Characteristics of Diversion Pipes for Data Centers" by Tang Yongle et al., the diversion pipe of the cooling distribution unit in the data room was used as the research object. Through numerical simulation, the influence of the cross-sectional side length of the cabinet main pipe and the diameter of the branch pipe on the performance of the diversion pipe was explored, and the purpose of uniform distribution of flow between cabinet layers was achieved by adjusting the appropriate cross-sectional area of ​​the main pipe and branch pipe diameter. For another example, patent 202180004788.1 discloses an intelligent integrated liquid cooling rack for data centers. When faced with the problem of cooling liquid diversion for servers at different layers, the patent uses diversion manifolds with different cross-sectional diameters to make the flow distribution entering different layers of liquid cooling plates more uniform. However, this method requires customizing the diameters of the manifolds and branch pipes according to the cooling requirements of servers at different heights in the cabinet. By using pipes of different sizes in the vertical direction to balance the different coolant flow rates at the inlets of liquid cold plates at different heights, the flexibility and versatility of the cabinet components are reduced.

[0006] In addition, the workload of the data center will continue to change over time as the servers on different layers inside the cabinet change, resulting in constant fluctuations in the heat load of the liquid cooling plates of servers on different layers at different times. When the heat load of the server liquid cooling plate fluctuates, in order to fully cool the servers on each layer, the coolant flow rate on each layer needs to change accordingly with the fluctuation of the server heat load to ensure the cooling effect of the server. When the heat load fluctuates greatly and the coolant flow rate increases sharply, the total flow rate of the coolant delivery pipe will be greater than the heat dissipation flow rate required by the cabinet, resulting in an operational redundancy problem, and also accompanied by a large energy waste problem. To solve this problem, Patent 202210562125.8 discloses a two-phase flow dual-circulation multi-mode data center server cabinet cooling system. The invention has two freely switchable refrigeration cycle modes: compressor cycle and coolant pump cycle, and can be flexibly controlled according to the cabinet heat dissipation requirements and heat load size, and can choose whether to turn on the cold plate heat dissipation and evaporator fan heat dissipation, which greatly improves the utilization efficiency of the coolant and avoids the waste of resources caused by data center load fluctuations. However, although the invention installs an electromagnetic flow valve in front of the liquid cooling plate of each layer of servers, the electromagnetic flow valve only performs on-off control of the flow rate and does not perform fine-tuning of its opening and temperature regulation, and there is room for further optimization. Patent CN 107295779B discloses a liquid cooling heat dissipation system, a flow control method and a device, wherein the coolant exists in a gas-liquid two-phase state, including a power unit, multiple server liquid cooling plates and a heat dissipation unit, wherein a control unit and a flow regulating unit are installed at the coolant inlet of each server liquid cooling plate. The control unit can control the flow cross-section of the flow regulating unit or the length of the liquid flow path by detecting the load information of the server liquid cooling plate, thereby changing the resistance and flow of the coolant. However, the invention's method of adjusting the resistance by adjusting the length of the coolant flow path through a controller will increase the pressure loss along the cooling system, resulting in increased system energy consumption. Moreover, both of the above solutions use two-phase cooling, and when entering the liquid cooling plate, it is often a single-phase supercooled liquid, which will cause the phase change process to occur within the liquid cooling plate. This will not only easily destroy the microchannel structure, but also cause uneven heat exchange between the electronic chip and the coolant, and easily cause local hot spots in the electronic chip.

[0007] In summary, existing data center server cabinets typically address the challenges of varying server heat loads over time and the mismatch between coolant flow and server cooling requirements by customizing the cross-sectional area of ​​the cabinet manifolds, switching between multiple cooling modes, or adjusting the flow resistance of each layer of fluid. While these measures can alleviate the coolant flow supply and demand difficulties to a certain extent, they still cannot effectively address the flow matching issues and increased cooling system energy consumption when server power density is high and server heat loads fluctuate significantly.

[0008] In view of this, there is an urgent need for a device or method that can adjust the coolant flow rate and fluid state at the inlet of the liquid cooling plate of servers on different layers of the cabinet in real time, so as to improve the versatility of the cabinet cooling pipe components, improve the heat exchange uniformity and cooling efficiency between the heat source and the coolant, and avoid energy waste caused by the constant changes in the load of servers on different layers. Summary of the Invention

[0009] The purpose of the present invention is to provide a new data center cabinet-level server evaporative cooling system and flow control method to solve the problems existing in the prior art. By controlling the opening of the electromagnetic flow valve, the inlet flow of the liquid cooling plate of different layers of servers is controlled. The opening of the electromagnetic flow valve of each layer of liquid cooling plate can be dynamically adjusted according to the changes in the heat load of the data center servers to change the flow of the coolant of each layer of servers. The proportion of the heat recovery fluid is controlled according to the needs of coolant preheating, so as to control the coolant to be in or near a saturated state when entering the liquid cooling plate, improve the uniformity of heat exchange of the fluid in the cold plate, and reduce the total flow of coolant in the system and the power consumption of the equipment.

[0010] To achieve the above objectives, the present invention provides the following solution: The present invention provides an evaporative cooling system for a data center cabinet-level server, comprising:

[0011] A liquid storage tank filled with coolant, wherein the liquid outlet of the liquid storage tank is connected to the inlet of the variable frequency refrigerant pump, the outlet of the variable frequency refrigerant pump is connected to one end of the coolant delivery pipe, and the coolant delivery pipe is provided with a server cabinet total electromagnetic flow valve;

[0012] A data center server cabinet, wherein the data center server cabinet is equipped with multiple server liquid cooling plates, a shunt manifold, and a converging manifold. The inlet of the server liquid cooling plate is connected to the shunt manifold through a liquid cooling plate branch pipe. The liquid cooling plate branch pipe is provided with a liquid cooling plate electromagnetic flow valve. The outlet of the server liquid cooling plate is connected to the converging manifold. The shunt manifold is connected to the other end of the coolant delivery pipe. The converging manifold is connected to the condenser through a coolant return pipe. The condenser is connected to the liquid storage tank.

[0013] A CPU temperature sensor, wherein the server liquid cooling plate is capable of exchanging heat with the CPU, and the CPU temperature sensor is disposed on the CPU;

[0014] A controller, wherein the CPU temperature sensor is communicatively connected to the controller, and the controller is capable of controlling the opening of the server cabinet total electromagnetic flow valve, the regenerator electromagnetic flow valve, the regenerator bypass electromagnetic flow valve, and the liquid cooling plate electromagnetic flow valve.

[0015] Furthermore, it also includes a preheater, which is arranged on the coolant delivery pipe and located between the server cabinet total electromagnetic flow valve and the data center server cabinet.

[0016] Furthermore, a cabinet inlet temperature sensor and a cabinet inlet pressure sensor are provided on the cooling liquid delivery pipe between the preheater and the data center server cabinet, and a cabinet outlet temperature sensor and a cabinet outlet pressure sensor are provided on the cooling liquid return pipe near the data center server cabinet.

[0017] Furthermore, it also includes:

[0018] A regenerator is provided on the coolant delivery pipe between the variable frequency refrigerant pump and the server cabinet total electromagnetic flow valve. The inlet of the regenerator is connected to the coolant return pipe through a first pipe, and the connection point is a first node. A regenerator electromagnetic flow valve is provided on the first pipe; the outlet of the regenerator is connected to the coolant return pipe through a second pipe, and the connection point is a second node. The first node is close to the data center server cabinet, and a regenerator bypass electromagnetic flow valve is provided on the coolant return pipe between the first node and the second node.

[0019] Furthermore, it also includes:

[0020] A water storage tank, wherein the water outlet of the water storage tank is connected to the inlet of the cooling water pump, and the outlet of the cooling water pump is connected to the water inlet of the condenser through a water pipe;

[0021] A tube-fin radiator, one end of which is connected to the outlet of the condenser and the other end of which is connected to the water inlet of the water storage tank, and the tube-fin radiator dissipates heat through a cooling fan.

[0022] The present invention also provides a flow control method for a data center cabinet-level server evaporative cooling system, which uses the data center server cabinet-level server evaporative cooling system, including the following steps:

[0023] S1: During startup, the opening of the solenoid flow valve of the liquid cooling plate is controlled to be 50%, the main solenoid flow valve of the server cabinet and the solenoid flow valve of the regenerator are fully open, and the solenoid flow valve of the regenerator bypass is closed. The cooling fan and cooling water pump are turned on in sequence, and the liquid storage tank delivers supercooled coolant to the coolant delivery pipe through the variable frequency refrigerant pump.

[0024] S2: The supercooled coolant passes through the regenerator and enters the preheater, where it is heated to a saturated state. The saturated coolant is then diverted to each server cold plate through a diversion manifold. The opening of the electromagnetic flow valve corresponding to each server cold plate is adjusted to decrease in sequence as the height decreases according to the prefabrication strategy, ensuring that the flow rate within each server cold plate is the same. When the saturated coolant passes through the server cold plates, it absorbs heat and evaporates, becoming a two-phase state. It then flows into the coolant return pipe through the converging manifold.

[0025] S3: The two-phase coolant is directly cooled by the condenser and then flows back to the liquid storage tank, or enters the regenerator to exchange heat with the supercooled coolant and then flows back to the liquid storage tank after cooling by the condenser.

[0026] Furthermore, by adjusting the opening of the regenerator electromagnetic flow valve and the regenerator bypass electromagnetic flow valve, the proportion of the two-phase coolant entering the regenerator is adjusted. The regenerator and the preheater can jointly heat the supercooled coolant to a saturated state, and the temperature and pressure of the coolant are monitored by the cabinet inlet temperature sensor and the cabinet inlet pressure sensor.

[0027] Furthermore, by controlling the frequency of the variable frequency refrigerant pump, the coolant pressure monitored by the cabinet inlet pressure sensor is at a preset value, and by controlling the total electromagnetic flow valve of the server cabinet, the total flow of the coolant is at a preset value.

[0028] Furthermore, the CPU temperature is monitored by a CPU temperature sensor. When the CPU temperature is higher than a set temperature value, the opening of the electromagnetic flow valve of the liquid cooling plate corresponding to the CPU is increased until the temperature of the CPU drops to the set temperature value; when the CPU temperature is lower than the set temperature value, the opening of the electromagnetic flow valve of the liquid cooling plate corresponding to the CPU is reduced until the temperature of the CPU rises to the set temperature value.

[0029] Furthermore, when the cooling liquid flow required by the data center server cabinet is lower than a preset value, the frequency of the variable frequency refrigerant pump is reduced, and the frequencies of the cooling water pump and the cooling fan are reduced; when the cooling liquid flow required by the data center server cabinet is higher than a preset value, the frequency of the variable frequency refrigerant pump is increased, and the frequencies of the cooling water pump and the cooling fan are increased.

[0030] The present invention discloses the following technical effects:

[0031] 1. The present invention installs an electromagnetic flow valve in front of the inlet of the liquid cooling plate of each layer of the cabinet. By controlling the opening of the electromagnetic flow valve, the flow at the inlet of the liquid cooling plate of different layers of servers is balanced. There is no need to customize the coolant diversion branch pipe, which can effectively improve the assembly efficiency of the server cabinet in the data center and the versatility of the components.

[0032] 2. The present invention can dynamically adjust the opening of the electromagnetic flow valve of each layer of liquid cooling plate according to the changes in the heat generation power of each layer of servers in the data center server cabinet to change the flow rate of the coolant of each layer of servers, realize the refined dynamic allocation and management of the inlet flow of each layer of liquid cooling plate, and reduce the total flow demand of the cooling circuit coolant.

[0033] 3. The addition of a preheater and regenerator to the coolant delivery pipes controls the ratio of the two-phase coolant flowing back and forth based on the coolant preheating requirements. This ensures that the coolant is at or near saturation when entering the data center cabinet, improving the uniformity of heat transfer within the liquid cold plate and the efficiency of the coolant within the plate. These two measures work together to reduce power consumption in equipment such as pumps and fans within the system. Furthermore, the improved heat transfer uniformity during the saturated coolant phase transition within the plate absorbs heat, preventing damage to the microchannel structure and uneven heat transfer between the electronic chip and the coolant, thus preventing the generation of localized hot spots within the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 This is the overall structural layout diagram of the present invention;

[0036] Figure 2 This is a schematic diagram of the structure of a single-layer server liquid cooling plate;

[0037] Figure 3 This is a schematic diagram of a single-layer server CPU and CPU temperature sensor;

[0038] Figure 4 This is a schematic diagram of the connection between the server liquid cooling plate, the distribution manifold, and the converging manifold;

[0039] Figure 5 It is the flow control flow chart;

[0040] Among them, 1. Variable frequency refrigerant pump; 2. Regenerator; 3. Server cabinet total electromagnetic flow valve; 4. Preheater; 5. Cabinet inlet temperature sensor; 6. Cabinet inlet pressure sensor; 7. Data center server cabinet; 8. Liquid cooling plate electromagnetic flow valve; 9. Server liquid cooling plate; 10. Regenerator electromagnetic flow valve; 11. Regenerator bypass electromagnetic flow valve; 12. Condenser; 13. Liquid storage tank; 14. Coolant delivery pipe; 15. Diversion manifold; 16. Liquid cooling plate branch pipe; 17. Cooling water pump; 18. Tube-fin radiator; 19. Cooling fan; 20. Water storage tank; 21. Water pipe; 22. Cabinet outlet temperature sensor; 23. Cabinet outlet pressure sensor; 24. Condenser outlet temperature sensor; 25. Microchannel heat exchanger; 26. Coolant diversion pipe; 27. CPU temperature sensor; 28. Converging manifold; 29. ​​Coolant return pipe. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Reference Figure 1-Figure 5 As shown, the present invention provides a data center cabinet-level server evaporative cooling system, comprising:

[0044] A liquid storage tank 13 is filled with coolant, and its liquid outlet is connected to the inlet of the variable frequency refrigerant pump 1. The outlet of the variable frequency refrigerant pump 1 is connected to one end of the coolant delivery pipe 14. The coolant delivery pipe 14 is provided with a server cabinet total electromagnetic flow valve 3;

[0045] The data center server cabinet 7 has multiple server liquid cooling plates 9, a diverter manifold 15, and a confluence manifold 28 built in. The diverter manifold 15 and the confluence manifold 28 have the same structure, except that the diverter manifold 15 is used to input coolant to the server liquid cooling plate 9, and the confluence manifold 28 is used to collect the coolant after heat exchange in the server liquid cooling plate 9. The inlet of the server liquid cooling plate 9 is connected to the diverter manifold 15 through the liquid cooling plate branch pipe 16. The liquid cooling plate branch pipe 16 is provided with a liquid cooling plate electromagnetic flow valve 8. The outlet of the server liquid cooling plate 9 is connected to the confluence manifold 28 through another liquid cooling plate branch pipe 16 (this liquid cooling plate branch pipe 16 does not have a liquid cooling plate electromagnetic flow valve 8); the diverter manifold 15 is connected to the other end of the coolant delivery pipe 14, and the confluence manifold 28 is connected to the condenser 12 through the coolant return pipe 29. The condenser 12 is connected to the liquid storage tank 13.

[0046] CPU temperature sensor 27. Multiple coolant shunt pipes 26 are provided in the server liquid cooling plate 9. One end of the coolant shunt pipe 26 is connected to the shunt manifold 15 and the other end is connected to the microchannel heat exchanger 25. The coolant flows through the coolant shunt pipe 26 into the microchannel heat exchanger 25 to exchange heat with the CPU. The CPU temperature sensor 27 is provided on the CPU.

[0047] The CPU temperature sensor 27 is in communication with the controller, and the controller can control the opening of the server cabinet total electromagnetic flow valve 3, the regenerator electromagnetic flow valve 10, the regenerator bypass electromagnetic flow valve 11 and the electromagnetic flow valve 8 of each layer of liquid cooling plate.

[0048] like Figure 1 As shown, in this embodiment, a preheater 4 is further included. The preheater 4 is disposed on the coolant delivery pipe 14 and is located between the server cabinet main electromagnetic flow valve 3 and the data center server cabinet 7. The coolant delivery pipe 14 between the preheater 4 and the data center server cabinet 7 is provided with a cabinet inlet temperature sensor 5 and a cabinet inlet pressure sensor 6. The coolant return pipe 29 is provided near the data center server cabinet 7 with a cabinet outlet temperature sensor 22 and a cabinet outlet pressure sensor 23.

[0049] like Figure 1 As shown, in this embodiment, it also includes: a regenerator 2, which is arranged on the coolant delivery pipe 14 between the variable frequency refrigerant pump 1 and the server cabinet total electromagnetic flow valve 3, and the inlet of the regenerator 2 is connected to the coolant return pipe 29 through a first pipe, and the connection point is a first node. The regenerator electromagnetic flow valve 10 is provided on the first pipe; the outlet of the regenerator 2 is connected to the coolant return pipe 29 through a second pipe, and the connection point is a second node (the first and second pipe types are the same as the coolant return pipe 29); the first node is close to the data center server cabinet 7, and the coolant return pipe 29 is provided with a regenerator bypass electromagnetic flow valve 11 between the first node and the second node.

[0050] like Figure 1 As shown, in this embodiment, it also includes: a water tank 20, the water outlet of the water tank 20 is connected to the inlet of the cooling water pump 17, and the outlet of the cooling water pump 17 is connected to the water inlet of the condenser 12 through a water pipe 21; a tube-fin radiator 18, one end of the tube-fin radiator 18 is connected to the outlet of the condenser 12, and the other end is connected to the water inlet of the water tank 20, and the tube-fin radiator 18 dissipates heat through a cooling fan 19.

[0051] The flow control method is described in detail below in conjunction with the above-mentioned data center cabinet-level server evaporative cooling system, including the following steps:

[0052] S1: Control the opening of the liquid cooling plate electromagnetic flow valve 8 to about 50%, the server cabinet main electromagnetic flow valve 3 and the regenerator electromagnetic flow valve 10 to be fully open, and the regenerator bypass electromagnetic flow valve 11 to be closed; sequentially start the cooling fan 19 and the cooling water pump 17, and the liquid storage tank 13 delivers supercooled coolant to the coolant delivery pipe 14 via the variable frequency refrigerant pump 1;

[0053] S2: The supercooled coolant passes through the regenerator 2 and enters the preheater 4, where it is heated to a saturated state by the regenerator 2 and the preheater 4. The saturated coolant is diverted to each layer of the server liquid cooling plate 9 through the diversion manifold 15. The opening of the liquid cooling plate electromagnetic flow valve 8 corresponding to each layer of the server liquid cooling plate 9 is adjusted so that it decreases in sequence along the direction of descending height according to the prefabrication strategy, so that the flow rate in each layer of the server liquid cooling plate 9 is roughly the same, thereby balancing the uneven flow distribution problem caused by gravity on each layer of the server liquid cooling plate 9. When the saturated coolant passes through the server liquid cooling plate 9, it absorbs heat and evaporates into a two-phase state, and flows into the coolant return pipe through the converging manifold 28.

[0054] S3: When the entire system tends to be stable, the server IT equipment is turned on and made to work normally. The two-phase coolant is directly cooled through the condenser 12 and then flows back to the liquid storage tank 13, or enters the regenerator 2 to exchange heat with the supercooled coolant and then flows back to the liquid storage tank 13 to complete the coolant circulation.

[0055] During the above process, the ratio of two-phase coolant entering the regenerator 2 can be adjusted by adjusting the openings of the regenerator electromagnetic flow valve 10 and the regenerator bypass electromagnetic flow valve 11. The regenerator 2 and preheater 4 can jointly heat the subcooled coolant to saturation. The cabinet inlet temperature sensor 5 and cabinet inlet pressure sensor 6 monitor the coolant temperature and pressure. The frequency of the variable frequency refrigerant pump 1 is controlled to ensure that the coolant pressure monitored by the cabinet inlet pressure sensor 6 is at a preset value. The total coolant flow rate is maintained at a preset value by controlling the server cabinet total electromagnetic flow valve 3. On the condensing side, the cooling water flow and temperature of the condenser 12 can be controlled by controlling the frequency of the cooling water pump 17 and cooling fan 19 to ensure that the cooling water can remove heat from the coolant in the condenser 12 and reduce its temperature to an appropriate range. A condenser outlet temperature sensor 24 is provided at the outlet of the condenser 12 to monitor the condensation effect of the condenser 12.

[0056] During the above process, the CPU temperature is monitored by CPU temperature sensor 27. When the CPU temperature is higher than the set temperature, the opening of the corresponding liquid cooling plate electromagnetic flow valve 8 is increased until the CPU temperature drops to the set temperature. When the CPU temperature is lower than the set temperature, the opening of the corresponding liquid cooling plate electromagnetic flow valve 8 is decreased until the CPU temperature rises to the set temperature. When the required coolant flow rate of the data center server cabinet 7 is lower than the preset value, the frequency of the variable frequency refrigerant pump 1 is reduced, and the frequencies of the cooling water pump 17 and cooling fan 19 are reduced. When the required coolant flow rate of the data center server cabinet 7 is higher than the preset value, the frequency of the variable frequency refrigerant pump 1 is increased, and the frequencies of the cooling water pump 17 and cooling fan 19 are increased.

[0057] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0058] The embodiments described above are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A flow control method for a data center cabinet-level server evaporative cooling system, using a data center server cabinet-level server evaporative cooling system, characterized in that: Data center cabinet-level server evaporative cooling system, including: A liquid storage tank (13), wherein the liquid storage tank (13) is filled with coolant, and a liquid outlet end thereof is connected to the inlet of the variable frequency refrigerant pump (1), and the outlet of the variable frequency refrigerant pump (1) is connected to one end of a coolant delivery pipe (14), and a server cabinet total electromagnetic flow valve (3) is provided on the coolant delivery pipe (14); A data center server cabinet (7), wherein the data center server cabinet (7) is equipped with a plurality of server liquid cooling plates (9), a shunt manifold (15) and a confluence manifold (28), wherein the inlet of the server liquid cooling plate (9) is connected to the shunt manifold (15) via a liquid cooling plate branch pipe (16), a liquid cooling plate electromagnetic flow valve (8) is provided on the liquid cooling plate branch pipe (16), and the outlet of the server liquid cooling plate (9) is connected to the confluence manifold (28); the shunt manifold (15) is connected to the other end of the coolant delivery pipe (14), the confluence manifold (28) is connected to the condenser (12) via a coolant return pipe (29), and the condenser (12) is connected to the liquid storage tank (13); A CPU temperature sensor (27), the server liquid cooling plate (9) is capable of exchanging heat with the CPU, and the CPU temperature sensor (27) is arranged on the CPU; A controller, the CPU temperature sensor (27) is in communication with the controller, and the controller is capable of controlling the opening of the server cabinet total electromagnetic flow valve (3) and the electromagnetic flow valve; A preheater (4), the preheater (4) being arranged on the coolant delivery pipe (14) and located between the server cabinet total electromagnetic flow valve (3) and the data center server cabinet (7); A regenerator (2), the regenerator (2) being arranged on a coolant delivery pipe (14) between the variable frequency refrigerant pump (1) and the server cabinet total electromagnetic flow valve (3); the inlet of the regenerator (2) being connected to the coolant return pipe (29) through a first pipe, the connection point being a first node, and a regenerator electromagnetic flow valve (10) being arranged on the first pipe; the outlet of the regenerator (2) being connected to the coolant return pipe (29) through a second pipe, the connection point being a second node; the first node being close to the data center server cabinet (7), and the coolant return pipe (29) being provided with a regenerator bypass electromagnetic flow valve (11) between the first node and the second node; The following steps are involved: S1: Control the opening of the liquid cooling plate electromagnetic flow valve (8) to 50%, the server cabinet total electromagnetic flow valve (3) and the regenerator electromagnetic flow valve (10) to be fully open, and the regenerator bypass electromagnetic flow valve (11) to be closed; turn on the cooling fan (19) and the cooling water pump (17) in sequence, and the liquid storage tank (13) delivers the supercooled coolant to the coolant delivery pipe (14) through the variable frequency refrigerant pump (1); S2: The supercooled coolant passes through the regenerator (2) and enters the preheater (4), and is heated to a saturated state by the regenerator (2) and the preheater (4); the saturated coolant passes through the diversion manifold (15) and is diverted to each layer of the server liquid cooling plate (9), and the opening of the liquid cooling plate electromagnetic flow valve (8) door corresponding to each layer of the server liquid cooling plate (9) is adjusted so that the flow rate in each layer of the server liquid cooling plate (9) is the same. When the saturated coolant passes through the server liquid cooling plate (9), it absorbs heat and evaporates to become a two-phase state, and flows into the coolant return pipe (29) through the converging manifold (28); S3: The two-phase coolant is directly cooled by the condenser (12) and then flows back to the liquid storage tank (13), or enters the regenerator (2) to exchange heat with the supercooled coolant and then flows back to the liquid storage tank (13) after cooling by the condenser (12); By adjusting the opening of the regenerator electromagnetic flow valve (10) and the regenerator bypass electromagnetic flow valve (11), the ratio of the two-phase coolant entering the regenerator (2) is adjusted. The regenerator (2) and the preheater (4) can jointly heat the coolant in the supercooled state to a saturated state. The temperature and pressure of the coolant are monitored by the cabinet inlet temperature sensor (5) and the cabinet inlet pressure sensor (6).

2. The flow control method of the data center cabinet-level server evaporative cooling system according to claim 1 is characterized in that: When the cooling liquid flow rate required by the data center server cabinet (7) is lower than a preset value, the frequency of the variable frequency refrigerant pump (1) is reduced, and the frequencies of the cooling water pump (17) and the cooling fan (19) are reduced; when the cooling liquid flow rate required by the data center server cabinet (7) is higher than a preset value, the frequency of the variable frequency refrigerant pump (1) is increased, and the frequencies of the cooling water pump (17) and the cooling fan (19) are increased.

3. The flow control method for a data center cabinet-level server evaporative cooling system according to claim 1, characterized in that: A cabinet inlet temperature sensor (5) and a cabinet inlet pressure sensor (6) are provided on the cooling liquid delivery pipe (14) between the preheater (4) and the data center server cabinet (7), and a cabinet outlet temperature sensor (22) and a cabinet outlet pressure sensor (23) are provided on the cooling liquid return pipe (29) near the data center server cabinet (7).

4. The flow control method for a data center cabinet-level server evaporative cooling system according to claim 1, characterized in that: Also includes: A water storage tank (20), wherein the water outlet of the water storage tank (20) is connected to the inlet of the cooling water pump (17), and the outlet of the cooling water pump (17) is connected to the water inlet of the condenser (12) through a water pipe (21); A tube-fin radiator (18), one end of the tube-fin radiator (18) is connected to the outlet of the condenser (12), and the other end is connected to the water inlet of the water storage tank (20), and the tube-fin radiator (18) dissipates heat through a cooling fan (19).

5. The flow control method for a data center cabinet-level server evaporative cooling system according to claim 1, characterized in that: By controlling the frequency of the variable frequency refrigerant pump (1), the coolant pressure monitored by the cabinet inlet pressure sensor (6) is kept at a preset value, and by controlling the server cabinet total electromagnetic flow valve (3), the total flow of the coolant is kept at a preset value.

6. The flow control method for a data center cabinet-level server evaporative cooling system according to claim 1, characterized in that: The CPU temperature is monitored by a CPU temperature sensor (27). When the CPU temperature is higher than a set temperature value, the opening of the liquid cooling plate electromagnetic flow valve (8) corresponding to the CPU is increased until the CPU temperature drops to the set temperature value; when the CPU temperature is lower than the set temperature value, the opening of the liquid cooling plate electromagnetic flow valve (8) corresponding to the CPU is reduced until the CPU temperature rises to the set temperature value.

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