A high-speed rotating vacuum mechanism connection and fixing device for wafer glue coating and development

By designing a high-speed rotating vacuum mechanism connection fixing device for wafer coating and development, the problems of suction cup height error and motor shaking are solved, and a more stable and clean coating and development process is achieved.

CN118448330BActive Publication Date: 2025-03-25迈睿捷(南京)半导体科技有限公司
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Patent Information

Application Number
CN202410653944.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-03-25
Estimated Expiration
2044-05-24

AI Technical Summary

Technical Problem

In the prior art, there is a gap and processing error between the shoulder screw and the suction cup, resulting in errors in the top height of the suction cup. At the same time, there may be adverse factors such as jitter during the high-speed rotation of the motor, which affects the stability and cleanliness of the glue-coating development process.

Method used

A high-speed rotating vacuum mechanism connection fixing device is designed. Through the threaded fit of the second locking bolt and the first thread groove, the radial pressure of the motor shaft is eliminated, ensuring that the radial jump of the suction cup during the high-speed rotation is reduced, and the deposition of contaminants is reduced through the reverse installation method.

Benefits of technology

It effectively reduces the radial jump of the suction cup during high-speed rotation, improves the stability and cleanliness of the glue coating development process, and improves the use effect and production quality of the device.

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Abstract

The present invention relates to the field of semiconductor chip manufacturing technology, and discloses a high-speed rotating vacuum mechanism connection and fixing device for wafer coating and development, including an operating table and a suction cup, wherein the top of the operating table is rotatably connected to a motor shaft, and each of the first locking bolts is threadedly connected to the inner wall of the adjacent second thread groove after passing through the first threaded hole. In the present invention, the first locking bolt is installed on the outer end face of the suction cup. Compared with the radial installation method on the motor shaft in the prior art, the installation method in this device is more convenient and quick, which is conducive to the reverse process of disassembly and maintenance, and is more convenient. In addition, the second locking bolt passes through the back of the suction cup to fix the locking pressure ring, so that the locking pressure ring and the sealing gasket are fastened to the suction cup. This reverse installation method reduces the screw holes of the pressure ring on the front of the suction cup, greatly reducing the deposition of pollutants, which is beneficial to the clean environment process requirements of the coating and development process.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development. Background Art

[0002] As an important step in the chip manufacturing process, the wafer requires an extremely high and stable rotation speed during the coating and development process. Through relevant mechanisms and devices, a stable negative pressure is generated to fix the wafer and rotate it at high speed. To this end, the traditional mechanical solution is as follows: a suction cup made of hard plastic with a radial hole at the shaft end is sleeved on the end of the motor shaft, and the shoulder screw is radially locked on the motor shaft to prevent the suction cup from moving axially. A sealing ring is placed between the motor spindle and the inner diameter of the suction cup.

[0003] At present, there is a gap and processing error between the existing shoulder screw and the suction cup, which leads to an error in the height of the top of the suction cup. At the same time, the motor may have adverse factors such as jitter during high-speed rotation, and the glue coating and development process needs to be avoided. In addition, the sealing effect is produced by squeezing the sealing ring, which leads to assembly difficulties and damage to the sealing ring, which has certain limitations.

[0004] Therefore, we propose a high-speed rotating vacuum mechanism connection fixing device for wafer coating and development to solve the above-mentioned problems. Summary of the invention

[0005] The purpose of the present invention is to provide a high-speed rotating vacuum mechanism connecting and fixing device for wafer coating and development, so as to solve the problem proposed in the above background technology that there is a gap and processing error between the shoulder screw and the suction cup, resulting in an error in the height of the top of the suction cup, and the motor may have adverse factors such as jitter during high-speed rotation.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical scheme: a high-speed rotating vacuum mechanism connecting and fixing device for wafer coating and developing, comprising an operating table and a suction cup, the top end of the operating table is rotatably connected with a motor shaft, the end of the motor shaft away from the operating table is provided with a first threaded groove, the bottom end of the suction cup is provided with a connecting groove, one end of the motor shaft is slid through the inside of the connecting groove, a circular groove is provided at the center of the top end of the suction cup, a second threaded hole is provided on the inner bottom wall of the circular groove, a second locking bolt is threadedly connected to the inner wall of the second threaded hole through the inner wall, one end of the second locking bolt is threadedly connected to the inner wall of the first threaded groove after passing through the second threaded hole, an annular groove is provided on the top end of the suction cup, a locking pressure ring is sealingly and slidably connected to the inner wall of the annular groove, a plurality of second threaded grooves are symmetrically provided at the bottom end of the locking pressure ring, a plurality of first threaded holes are symmetrically provided on the inner bottom wall of the annular groove, each of the inner walls of the first threaded holes is threadedly connected with a first locking bolt, and each of the first locking bolts is threadedly connected to the inner wall of the adjacent second threaded groove after passing through the first threaded hole.

[0007] Preferably, a motor is fixedly connected to the bottom end of the operating table, one end of the motor shaft passes through the side wall of the operating table and is fixedly connected to the output end of the motor, a plurality of fixed plates are symmetrically fixedly connected to the side wall of the locking ring, a sealing gasket is commonly fixedly connected to the plurality of fixed plates, the sealing gasket is sealingly and slidably connected to the circular groove, a plurality of suction ports are fixedly connected to the top end of the suction cup, and a wafer is commonly fixedly connected to the plurality of suction ports.

[0008] Preferably, the inner wall of the suction cup is symmetrically provided with cavities, each of which is a rectangular structure, and a rectangular hole is provided at the top of the cavity. The fixing assembly includes two screws, and one end of each screw passes through the side wall of the suction cup and is rotatably connected to the inner wall of the adjacent cavity.

[0009] Preferably, the side wall of the lead screw is threadedly connected with a slider, the slider is in contact with the inner wall of the cavity, the top of the slider is fixedly connected with a connecting rod, and one end of the connecting rod passes through the rectangular hole and is fixedly connected with a clamping plate.

[0010] Preferably, the side wall of the clamping plate is symmetrically fixedly connected with a plurality of springs, one end of the plurality of springs is commonly fixedly connected with a buffer plate, the buffer plate and the clamping plate are both arc-shaped structures, and are both slidably connected with the top of the suction cup.

[0011] Preferably, the cleaning assembly includes a first bevel gear, which is rotatably connected to the side wall of the motor shaft, a mounting plate is fixedly connected to the top of the operating table, the side wall of the mounting plate is rotatably connected to a rotating shaft, and a third bevel gear is fixedly connected to the side wall of one end of the rotating shaft.

[0012] Preferably, a second bevel gear is fixedly connected to the side wall of the motor shaft, the first bevel gear, the second bevel gear and the third bevel gear are meshed with each other, a sleeve is slidably connected to the outer wall of the motor shaft, one end of the sleeve is fixedly connected to the first bevel gear, and the other end of the sleeve extends into the inside of the connecting groove.

[0013] Preferably, a reciprocating thread groove is formed on the outer wall of the sleeve, a sliding sleeve is threadedly connected to the inner thread of the reciprocating thread groove, a limiting rod is fixedly connected to the top of the operating table, and the limiting rod is an inverted Z-shaped structure.

[0014] Preferably, one end of the limiting rod extends into the interior of the connecting groove, and one end of the limiting rod penetrates and is slidably connected to the side wall of the sliding sleeve.

[0015] Preferably, a plurality of cleaning brushes are fixedly connected to the outer wall of the sliding sleeve, and the cleaning brushes are in contact with the inner wall of the connecting groove.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Through the thread cooperation of the second locking bolt and the first thread groove, the radial pressure of the motor shaft is eliminated, and it is ensured that the radial runout of the suction cup is greatly reduced during the high-speed rotation process, which greatly improves the glue coating and development process; through the installation method of the first locking bolt on the outer end surface of the suction cup, compared with the radial installation method on the motor shaft in the prior art, the installation method in this device is more convenient and quick, which is conducive to the reverse process of disassembly and maintenance, and is more convenient. In addition, the second locking bolt passes through the back of the suction cup to fix the locking pressure ring, so that the locking pressure ring and the sealing gasket are fastened to the suction cup. This reverse installation method reduces the screw holes of the pressure ring on the front side of the suction cup and greatly reduces the deposition of pollutants. This is beneficial to the clean environment process requirements of the glue coating and development process, and solves the problem that the height error of the top of the suction cup is caused by the gap between the shoulder screw and the suction cup and the processing error, and the motor may have unfavorable factors such as jitter during high-speed rotation, which greatly improves the glue coating and development process.

[0018] 2. By rotating the two lead screws outward, the two sliders drive the clamping plate and the buffer plate to move away from each other, and adjustments can be made quickly according to the size of the wafer. Then, the two lead screws are rotated in the opposite direction, so that the two buffer plates compress the corresponding springs and stably clamp the edge of the wafer. Through the cooperation of the lead screw and the slider, the clamping plate and the buffer plate are driven to adjust their positions, so that they can be used to stably fix wafers of different sizes, improve the practicality of the device, avoid instability during the coating and development process, cause quality problems, and improve the production quality of wafers.

[0019] 3. During the operation of the motor shaft, the second bevel gear is driven to rotate, the third bevel gear is rotated, and the first bevel gear is driven to rotate, thereby driving the sleeve to rotate on the outer wall of the motor shaft, wherein a reciprocating thread groove is provided on the outer wall of the sleeve. Under the limiting action of the limiting rod, the sliding sleeve is reciprocated up and down along the sleeve, so that the cleaning brush on the outer wall of the sliding sleeve can reciprocate into the connecting groove between the motor shaft and the suction cup, and clean out the dust in the connecting groove, thereby ensuring the connection stability of the motor shaft and the suction cup, so as to improve the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a cross-sectional structural schematic diagram of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the suction cup in the present invention;

[0023] Figure 4 It is a schematic structural diagram of a cross-section of the suction cup of the present invention;

[0024] Figure 5 It is a structural schematic diagram of the locking pressure ring in the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of the cleaning component in the present invention.

[0026] In the figure: 1. operating table; 11. motor; 12. motor shaft; 13. first threaded groove; 14. mounting plate; 15. rotating shaft; 2. suction cup; 21. first threaded hole; 22. first locking bolt; 23. second threaded hole; 24. second locking bolt; 25. suction port; 26. circular groove; 27. cavity; 28. rectangular hole; 29. ​​annular groove; 210. connecting groove; 3. fixing assembly; 31. lead screw; 32. slider; 33. connecting rod; 34. clamping plate; 35. spring; 36. buffer plate; 37. locking pressure ring; 38. fixing plate; 39. sealing gasket; 310. second threaded groove; 4. cleaning assembly; 41. first bevel gear; 42. second bevel gear; 43. third bevel gear; 44. sleeve; 45. sliding sleeve; 46. cleaning brush; 47. limiting rod; 5. wafer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Example 1: Please refer to Figure 1-2 The present invention provides a technical solution: a high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development, comprising an operating table 1 and a suction cup 2, wherein a motor shaft 12 is rotatably connected to the top of the operating table 1, a first threaded groove 13 is provided at the end of the motor shaft 12 away from the operating table 1, a connecting groove 210 is provided at the bottom of the suction cup 2, one end of the motor shaft 12 penetrates and slides inside the connecting groove 210, a circular groove 26 is provided at the center of the top of the suction cup 2, a second threaded hole 23 is provided on the inner bottom wall of the circular groove 26, and a second locking bolt is threadedly connected to the inner wall of the second threaded hole 23 24, one end of the second locking bolt 24 passes through the second threaded hole 23 and is threadedly connected to the inner wall of the first threaded groove 13, an annular groove 29 is provided at the top of the suction cup 2, and a locking pressure ring 37 is sealingly and slidably connected to the inner wall of the annular groove 29, and a plurality of second threaded grooves 310 are symmetrically provided at the bottom end of the locking pressure ring 37, and a plurality of first threaded holes 21 are symmetrically provided on the inner bottom wall of the annular groove 29, and a first locking bolt 22 is threadedly connected to the inner wall of the adjacent second threaded groove 310 after passing through the first threaded hole 21.

[0029] A motor 11 is fixedly connected to the bottom end of the operating table 1, and one end of the motor shaft 12 passes through the side wall of the operating table 1 and is fixedly connected to the output end of the motor 11. A plurality of fixing plates 38 are symmetrically fixedly connected to the side wall of the locking ring 37, and a sealing gasket 39 is fixedly connected to the plurality of fixing plates 38. The sealing gasket 39 is sealingly and slidably connected to the circular groove 26. A plurality of adsorption ports 25 are fixedly connected to the top of the suction cup 2, and a wafer 5 is fixedly connected to the plurality of adsorption ports 25. Compared with the radial installation method on the motor shaft 12 in the prior art, the installation method in the present device is more convenient and quick, which is conducive to the reverse process of disassembly and maintenance and is more convenient. In addition, the first locking bolt 22 is passed through the back side of the suction cup 2 to fix the locking ring 37, so that the locking ring 37 and the sealing gasket 39 are fastened to the suction cup 2. This reverse installation method reduces the screw holes of the pressure ring on the front side of the suction cup 2, greatly reducing the deposition of pollutants.

[0030] In this embodiment: when in use, first insert the connecting groove 210 of the suction cup 2 into one end of the motor shaft 12, then pass the second locking bolt 24 through the circular groove 26 and screw it into the second threaded hole 23, until the second locking bolt 24 is screwed into the first threaded groove 13, thereby achieving the fixed installation of the suction cup 2 and the motor shaft 12. Through the threaded cooperation between the second locking bolt 24 and the first threaded groove 13, the radial pressure of the motor shaft 12 is eliminated, and it is ensured that the radial runout of the suction cup 2 is greatly reduced during the high-speed rotation process, which greatly improves the glue coating and development process; in addition, by moving the locking pressure ring 37 to the inside of the annular groove 29, and then by screwing the four first locking bolts 22 into the adjacent first threaded holes 21 respectively, until the first locking bolts The bolt 22 is screwed into the second threaded groove 310 opened at the bottom of the locking ring 37, so as to fix the locking ring 37. At this time, the sealing gasket 39 seals the circular groove 26. The first locking bolt 22 is installed on the outer end surface of the suction cup 2. Compared with the radial installation method on the motor shaft 12 in the prior art, the installation method in this device is more convenient and quick, which is conducive to the reverse process of disassembly and maintenance, and is more convenient. In addition, the first locking bolt 22 passes through the back of the suction cup 2 to fix the locking ring 37, so that the locking ring 37 and the sealing gasket 39 are fastened to the suction cup 2. This reverse installation method reduces the screw holes of the pressure ring on the front side of the suction cup 2, greatly reduces the deposition of pollutants, which is beneficial to the clean environment process requirements of the glue coating and development process.

[0031] Example 2: Please refer to Figure 3-4 The inner wall of the suction cup 2 is symmetrically provided with cavities 27, each of which is a rectangular structure, and a rectangular hole 28 is provided at the top of the cavity 27. The fixing assembly 3 includes two lead screws 31, and one end of each lead screw 31 penetrates the side wall of the suction cup 2 and is rotated to be connected to the inner wall of the adjacent cavity 27. By rotating the two lead screws 31 outward, the two sliders 32 drive the clamping plate 34 and the buffer plate 36 to move away from each other, and can be quickly adjusted according to the size of the wafer 5, and then the two lead screws 31 are rotated in the opposite direction to compress the corresponding springs 35 of the two buffer plates 36 to stably clamp the edge of the wafer 5.

[0032] The side wall of the lead screw 31 is threadedly connected to a slider 32, which contacts the inner wall of the cavity 27 to prevent the slider 32 from rotating. A connecting rod 33 is fixedly connected to the top of the slider 32. One end of the connecting rod 33 passes through the rectangular hole 28 and is fixedly connected to a clamping plate 34. Under the elastic action of the spring 35, it plays a buffering clamping role to avoid excessive clamping force and damage to the wafer 5.

[0033] The side wall of the clamping plate 34 is symmetrically fixedly connected with multiple springs 35, and one end of the multiple springs 35 is commonly fixedly connected with a buffer plate 36. The buffer plate 36 and the clamping plate 34 are both arc-shaped structures, and are both slidably connected to the top of the suction cup 2. Through the cooperation of the lead screw 31 and the slider 32, the clamping plate 34 and the buffer plate 36 are driven to adjust their positions, so that they can be suitable for stably fixing wafers 5 of different sizes, thereby improving the practicality of the device.

[0034] In this embodiment: when in use, the wafer 5 is placed on the suction port 25, and then negative pressure adsorption is performed through the suction cup 2 to tightly adsorb the wafer 5 on the suction cup 2. However, considering that some larger wafers 5 lack adsorption and fixation at the edges, they are not stable enough during the process of coating and developing, which will affect the quality. By rotating the two lead screws 31 outward, the two sliders 32 drive the clamping plate 34 and the buffer plate 36 to move away from each other, and adjustments can be made quickly according to the size of the wafer 5. Then, the two lead screws 31 are rotated in the opposite direction, so that the two buffer plates 36 compress the corresponding springs 35 and then stably clamp the edges of the wafer 5. Under the elastic action of the springs 35, a buffer clamping effect is played to avoid excessive clamping force and damage to the wafer 5. Through the cooperation of the lead screw 31 and the slider 32, the clamping plate 34 and the buffer plate 36 are driven to adjust their positions, so that they can be suitable for stably fixing wafers 5 of different sizes, thereby improving the practicality of the device, avoiding instability during the process of coating and developing, causing quality problems, and improving the production quality of the wafer 5.

[0035] Example 3: Please refer to Figure 5-6 The cleaning assembly 4 includes a first bevel gear 41, which is rotatably connected to the side wall of the motor shaft 12. The top of the operating table 1 is fixedly connected to a mounting plate 14, the side wall of the mounting plate 14 is rotatably connected to a rotating shaft 15, and one end side wall of the rotating shaft 15 is fixedly connected to a third bevel gear 43.

[0036] A second bevel gear 42 is fixedly connected to the side wall of the motor shaft 12, and the first bevel gear 41, the second bevel gear 42 and the third bevel gear 43 are meshed and connected to each other. A sleeve 44 is slidably connected to the outer wall of the motor shaft 12, and one end of the sleeve 44 is fixedly connected to the first bevel gear 41, and the other end of the sleeve 44 extends to the inside of the connecting groove 210.

[0037] A reciprocating thread groove is provided on the outer wall of the sleeve 44, and a sleeve 45 is connected to the inner thread of the reciprocating thread groove. A limit rod 47 is fixedly connected to the top of the operating table 1, and the limit rod 47 is an inverted Z-shaped structure; one end of the limit rod 47 extends to the inside of the connecting groove 210, and one end of the limit rod 47 penetrates and slides with the side wall of the sleeve 45; a plurality of cleaning brushes 46 are fixedly connected to the outer wall of the sleeve 45, and the cleaning brushes 46 are in contact with the inner wall of the connecting groove 210. A reciprocating thread groove is provided on the outer wall of the sleeve 44. Under the limiting action of the limit rod 47, the sleeve 45 reciprocates up and down along the sleeve 44, so that the cleaning brush 46 on the outer wall of the sleeve 45 can reciprocate into the connecting groove 210 between the motor shaft 12 and the suction cup 2 to clean out the dust in the connecting groove 210.

[0038] In this embodiment: a large amount of dust will be adsorbed at the connection between the motor shaft 12 and the suction cup 2. If it is not cleaned for a long time, the connection effect of the motor shaft 12 and the suction cup 2 will be affected. During the operation of the motor shaft 12, the second bevel gear 42 is driven to rotate, and the meshing action between the bevel gears is utilized to rotate the third bevel gear 43, thereby driving the first bevel gear 41 to rotate, wherein the first bevel gear 41 rotates on the outer wall of the motor shaft 12, thereby driving the sleeve 44 to rotate on the outer wall of the motor shaft 12, wherein a reciprocating thread groove is provided on the outer wall of the sleeve 44, and under the limiting action of the limiting rod 47, the sliding sleeve 45 is made to reciprocate up and down along the sleeve 44, so that the cleaning brush 46 on the outer wall of the sliding sleeve 45 can reciprocately enter the connection groove 210 between the motor shaft 12 and the suction cup 2, and clean out the dust in the connection groove 210, thereby ensuring the connection stability of the motor shaft 12 and the suction cup 2, so as to improve the use effect of the device.

[0039] Working principle: first, insert the connecting groove 210 of the suction cup 2 into one end of the motor shaft 12, then pass the second locking bolt 24 through the circular groove 26 and screw it into the second threaded hole 23 until the second locking bolt 24 is screwed into the first threaded groove 13, then screw the four first locking bolts 22 into the adjacent first threaded holes 21 respectively until the first locking bolt 22 is screwed into the second threaded groove 310 opened at the bottom of the locking pressure ring 37, thereby fixing the locking pressure ring 37;

[0040] By rotating the two lead screws 31 outward, the two sliders 32 drive the clamping plate 34 and the buffer plate 36 to move away from each other, and the adjustment can be made quickly according to the size of the wafer 5. Then, the two lead screws 31 are rotated in the opposite direction, so that the two buffer plates 36 compress the corresponding springs 35 to stably clamp the edge of the wafer 5. Then, the suction cup 2 is used for negative pressure adsorption to tightly adsorb the wafer 5 on the suction cup 2, and then the motor 11 is turned on to work.

[0041] When the motor 11 drives the motor shaft 12, the second bevel gear 42 is driven to rotate, the third bevel gear 43 is rotated, and the first bevel gear 41 is driven to rotate, thereby driving the sleeve 44 to rotate on the outer wall of the motor shaft 12, wherein a reciprocating thread groove is provided on the outer wall of the sleeve 44, and under the limiting action of the limiting rod 47, the sliding sleeve 45 reciprocates up and down along the sleeve 44, so that the cleaning brush 46 on the outer wall of the sliding sleeve 45 can reciprocate into the connecting groove 210 between the motor shaft 12 and the suction cup 2 to clean out the dust in the connecting groove 210.

[0042] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0043] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development, comprising an operating table (1), a suction cup (2), a fixing component (3) and a cleaning component (4), characterized in that: A motor shaft (12) is rotatably connected to the top of the operating table (1), a first threaded groove (13) is provided at one end of the motor shaft (12) away from the operating table (1), a connecting groove (210) is provided at the bottom end of the suction cup (2), one end of the motor shaft (12) slides through the connecting groove (210), a circular groove (26) is provided at the center of the top of the suction cup (2), a second threaded hole (23) is provided on the inner bottom wall of the circular groove (26), a second locking bolt (24) is threadedly connected to the inner wall of the second threaded hole (23), one end of the second locking bolt (24) passes through the second threaded hole ( 23) is threadedly connected with the inner wall of the first thread groove (13), the top of the suction cup (2) is provided with an annular groove (29), the inner wall of the annular groove (29) is sealingly and slidably connected with a locking ring (37), the bottom of the locking ring (37) is symmetrically provided with a plurality of second thread grooves (310), the inner bottom wall of the annular groove (29) is symmetrically provided with a plurality of first thread holes (21), the inner wall of each of the first thread holes (21) is threadedly connected with a first locking bolt (22), and each of the first locking bolts (22) is threadedly connected with the inner wall of the adjacent second thread groove (310) after passing through the first thread hole (21); The bottom end of the operating table (1) is fixedly connected to a motor (11); one end of the motor shaft (12) passes through the side wall of the operating table (1) and is fixedly connected to the output end of the motor (11); a plurality of fixing plates (38) are symmetrically fixedly connected to the side wall of the locking ring (37); a sealing gasket (39) is fixedly connected to the plurality of fixing plates (38); the sealing gasket (39) is sealingly and slidably connected to the circular groove (26); a plurality of suction ports (25) are fixedly connected to the top end of the suction cup (2); a wafer (5) is fixedly connected to the plurality of suction ports (25).

2. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 1, characterized in that: The inner wall of the suction cup (2) is symmetrically provided with cavities (27), each of the cavities (27) is of a rectangular structure, a rectangular hole (28) is provided at the top of the cavity (27), and the fixing assembly (3) comprises two lead screws (31), one end of each lead screw (31) passes through the side wall of the suction cup (2) and is rotatably connected to the inner wall of an adjacent cavity (27).

3. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 2, characterized in that: The side wall of the lead screw (31) is threadedly connected to a slider (32), the slider (32) is in contact with the inner wall of the cavity (27), the top of the slider (32) is fixedly connected to a connecting rod (33), and one end of the connecting rod (33) passes through the rectangular hole (28) and is fixedly connected to a clamping plate (34).

4. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 3, characterized in that: A plurality of springs (35) are symmetrically fixedly connected to the side wall of the clamping plate (34); one end of the plurality of springs (35) is commonly fixedly connected to a buffer plate (36); the buffer plate (36) and the clamping plate (34) are both arc-shaped structures and are both slidably connected to the top of the suction cup (2).

5. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 1, characterized in that: The cleaning assembly (4) comprises a first bevel gear (41), the first bevel gear (41) being rotatably connected to the side wall of the motor shaft (12), a mounting plate (14) being fixedly connected to the top of the operating table (1), a rotating shaft (15) being rotatably connected to the side wall of the mounting plate (14), and a third bevel gear (43) being fixedly connected to the side wall of one end of the rotating shaft (15).

6. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 5, characterized in that: A second bevel gear (42) is fixedly connected to the side wall of the motor shaft (12); the first bevel gear (41), the second bevel gear (42) and the third bevel gear (43) are meshed and connected to each other; a sleeve (44) is slidably connected to the outer wall of the motor shaft (12); one end of the sleeve (44) is fixedly connected to the first bevel gear (41), and the other end of the sleeve (44) extends to the interior of the connecting groove (210).

7. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 6, characterized in that: The outer wall of the sleeve (44) is provided with a reciprocating thread groove, the inner thread of the reciprocating thread groove is threadedly connected to a sliding sleeve (45), and the top end of the operating table (1) is fixedly connected to a limiting rod (47), and the limiting rod (47) is an inverted Z-shaped structure.

8. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 7, characterized in that: One end of the limiting rod (47) extends into the interior of the connection groove (210), and one end of the limiting rod (47) penetrates and is slidably connected to the side wall of the sliding sleeve (45).

9. The high-speed rotating vacuum mechanism connecting and fixing device for wafer glue coating and development according to claim 8, characterized in that: A plurality of cleaning brushes (46) are fixedly connected to the outer wall of the sliding sleeve (45), and the cleaning brushes (46) are in contact with the inner wall of the connecting groove (210).

Citation Information

Patent Citations

  • Adsorption rotating device and monolithic wafer cleaning machine

    CN114558839A

  • Wafer mechanical auxiliary clamp

    CN216528824U