Circuit board module assembly method, circuit board module and terminal device

Abstract

The present application provides a circuit board module assembly method, a circuit board module and a terminal device, the assembly method comprising: providing a circuit board assembly, a shielding cover and a plurality of solder balls, the circuit board assembly comprising a circuit board, a functional device and a plurality of solder pads, the functional device and the plurality of solder pads are all installed on the same side of the circuit board, the plurality of solder pads are all arranged around the functional device, and are all spaced apart from the functional device and spaced apart from each other, the shielding cover comprises a plurality of soldering parts, and the plurality of soldering parts are spaced apart from each other; placing the shielding cover on the circuit board, and covering the functional device, the plurality of soldering parts are respectively arranged opposite to the plurality of solder pads; placing each solder ball between at least one soldering part and at least one solder pad, melting and solidifying each solder ball, and at least part of each solder ball forms a soldering part connected between at least one soldering part and at least one solder pad. The assembly method can reduce the influence of temperature on the functional device during the welding process, and ensure the reliability of the functional device.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to an assembly method of a circuit board module, a circuit board module and a terminal equipment. Background Art

[0002] At present, the RF interference shielding scheme for high-power devices in terminal equipment mainly uses a shielding cover formed by metal stamping to cover the functional device, and then solders the shielding cover to the printed circuit board (PCB) through the SMT (Surface Mounted Technology) reflow soldering process. Among them, the SMT process usually includes: printing solder paste at the position where the shielding cover is required on the circuit board, bonding the shielding cover to the corresponding solder paste on the circuit board, and then putting the circuit board with the shielding cover pasted into the reflow furnace for reflow soldering, so as to achieve the installation of the shielding cover on the circuit board. However, when the functional device has a part that is not resistant to high temperature, or the performance changes after being subjected to high temperature, the method of installing the shielding cover by SMT will cause damage to the functional device, reducing the reliability of the functional device. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a circuit board module assembly method, a circuit board module and a terminal device. When assembling using the circuit board module assembly method, the influence of temperature on functional devices during the welding process can be reduced, thereby ensuring the reliability of the functional devices.

[0004] The present invention provides a method for assembling a circuit board module, comprising:

[0005] A circuit board assembly, a shielding cover and a plurality of solder balls are provided. The circuit board assembly includes a circuit board, a functional device and a plurality of solder pads. The functional device and the plurality of solder pads are mounted on the same side of the circuit board. The plurality of solder pads are arranged around the functional device and are spaced apart from the functional device and spaced apart from each other. The shielding cover includes a plurality of soldering portions, and the plurality of soldering portions are spaced apart from each other.

[0006] The shielding cover is placed on the circuit board and covers the functional components, and the plurality of welding parts are respectively arranged opposite to the plurality of welding pads;

[0007] Each solder ball is placed between at least one soldering portion and at least one solder pad, each solder ball is melted and solidified, and at least a portion of each solder ball forms a soldering member connected between the at least one soldering portion and the at least one solder pad.

[0008] The embodiment of the present application provides an assembly method of a circuit board module, by setting a welding portion on a shielding cover, and setting the welding portion relative to the pad, placing a solder ball in the gap between the solder portion and the pad, melting and solidifying the solder ball to form a soldering piece connected between the solder portion and the pad, so that the shielding cover forms a loop with the circuit board through the soldering piece, and then the shielding effect of the shielding cover on the functional device is achieved. Since the process of melting the solder ball is only performed between the solder portion and the pad, the influence of temperature on the functional device during the welding process is reduced, thereby ensuring the reliability of the functional device. In addition, compared with the existing SMT (Surface Mounted Technology) reflow soldering process, in the assembly method of the circuit board module of the embodiment of the present application, it is not necessary to place the circuit board module in a reflow oven, thereby avoiding the damage of the functional device to the existing SMT high temperature environment, and is suitable for parts that are not resistant to high temperatures, or functional devices that are prone to abnormal changes after being subjected to high temperatures, thereby improving the reliability of the functional device.

[0009] In a possible implementation manner, the solder balls are made of solder, and in the step of melting and solidifying each solder ball, the solder balls are melted by laser irradiation.

[0010] In a possible implementation, the shielding cover includes a cover body, a first side shell, a second side shell and a skirt, the cover body is located on a side of the functional device away from the circuit board, the first side shell and the second side shell are both fixedly connected to a side of the cover body facing the circuit board, the first side shell includes a plurality of welding portions, and the skirt is fixedly connected to an outer side of the second side shell and is arranged opposite to the circuit board;

[0011] After the step of placing the shielding cover on the circuit board, the circuit board module assembly method further includes:

[0012] A liquid conductive material is filled between the skirt and the circuit board, and the conductive material is solidified, so that the conductive material forms a conductive layer connected between the skirt and the circuit board. The gap between the skirt and the circuit board is filled with liquid conductive material, and the liquid conductive material is solidified to realize that the conductive layer electrically connects the skirt and the circuit board. While realizing that the second side shell and the circuit board form a loop through the conductive layer, the use of welding equipment is avoided, thereby avoiding the influence of welding on the functional device, and further ensuring the reliability of the functional device.

[0013] In one possible implementation, the conductive material is a low-temperature curing material, and the conductive material is cured by baking. The curing temperature is relatively low, and baking at a relatively low temperature can ensure that the functional device is not damaged. This is suitable for functional devices that have parts that are not resistant to high temperatures or that are prone to abnormal changes after being exposed to high temperatures, thereby improving the reliability of the functional devices.

[0014] In a possible implementation manner, the curing temperature of the low-temperature curing material is ≤80°C.

[0015] In a possible implementation, the low-temperature curing material is a low-temperature silver paste.

[0016] In a possible implementation, the circuit board module assembly method further includes:

[0017] An insulating package is provided, the insulating package is connected between the circuit board and the welding part, and at least partially covers the welding part, and / or the insulating package is connected between the circuit board and the second side shell, and at least partially covers the conductive layer. By providing the insulating package between the circuit board and the shielding cover, the electronic device can avoid the problem of the shielding cover detaching from the circuit board and causing the shielding performance of the shielding cover to be reduced in product use scenarios such as falling, collision, and extrusion. On the other hand, the insulating package can cover the conductive component to prevent the conductive layer, such as the cured silver paste, from being broken in product use scenarios such as falling, collision, and extrusion, and falling to other circuit areas of the electronic device to cause short circuits.

[0018] An embodiment of the present application also provides a circuit board module, which includes a circuit board, a functional device, a plurality of solder pads, a shielding cover and a plurality of welding parts. The functional device and the plurality of solder pads are all installed on the same side of the circuit board. The plurality of solder pads are all arranged around the functional device and are spaced apart from the functional device and spaced apart from each other. The shielding cover covers the functional device. The shielding cover includes a plurality of welding parts. The plurality of soldering parts are spaced apart from each other and are arranged opposite to the plurality of solder pads. Each welding part is arranged on at least one solder pad and is fixedly connected to at least one soldering part.

[0019] The embodiment of the present application provides a circuit board module, in which the first side shell of the shielding cover cancels the design of the pressing skirt, and by setting a welding part on the first side shell, and setting a pad at the position of the welding part of the circuit board corresponding to the shielding cover, a welding piece is set on at least one pad and fixedly connected with at least one welding part to realize the electrical connection between the welding part and the pad, so as to realize the shielding cover and the circuit board form a loop through the welding piece, and then realize the shielding effect of the shielding cover on the functional device. Compared with the existing SMT (Surface Mounted Technology, surface mounting technology) reflow soldering process, in the soldering process, the functional device needs to be subjected to the SMT high temperature reflow together with the shielding cover. In the circuit board module of the embodiment of the present application, by setting a welding part on the shielding cover, and setting the welding part and the pad on the circuit board opposite and spaced, the shielding cover and the circuit board can form a loop through the welding piece by only performing a soldering process at the welding part between the welding part and the pad, and the circuit board module does not need to be placed in a reflow oven, thereby avoiding the damage of the existing SMT high temperature environment to the functional device, and being suitable for parts that are not resistant to high temperatures, or functional devices that are prone to abnormal changes after being subjected to high temperatures, and improving the reliability of the functional device.

[0020] In a possible implementation, the shielding cover includes a cover body, a first side shell, a second side shell and a skirt, the cover body is located on a side of the functional device away from the circuit board, the first side shell and the second side shell are both fixedly connected to a side of the cover body facing the circuit board, the first side shell includes a plurality of welding portions, and the skirt is fixedly connected to an outer side of the second side shell and is arranged opposite to the circuit board;

[0021] The circuit board module also includes a conductive layer, which is connected between the skirt and the circuit board. By arranging the skirt on the second side shell and electrically connecting the skirt and the circuit board using the conductive layer, on the one hand, the conductive layer plays a role in bonding the skirt of the shielding cover and the circuit board, so as to realize the formation of a loop between the second side shell and the circuit board through the conductive layer, thereby avoiding the problem that the shielding cover cannot be completely connected to the circuit board when it is irregular, and on the other hand, avoiding the use of welding equipment, thereby further avoiding the impact on the functional device and ensuring the reliability of the functional device.

[0022] In a possible embodiment, the extension length of the second side shell along the circumferential extension of the cover body is less than the design threshold. When the shape of the shielding cover is irregular, due to the limitation of the size of welding equipment such as a laser head, the narrow part of the shielding cover cannot accommodate the welding equipment, so that it is impossible to completely weld the shielding cover to the circuit board only by setting the welding part. In the embodiment of the present application, the extension length of the second side shell is less than the design threshold, such as the size of the laser head, and the laser head cannot extend to weld the second side shell. By providing a skirt on the second side shell and electrically connecting the skirt and the circuit board with a conductive layer, on the one hand, the second side shell and the circuit board form a loop through the conductive layer, thereby avoiding the problem that the shielding cover cannot be completely connected to the circuit board when it is irregular, and on the other hand, avoiding the use of welding equipment, thereby further avoiding the impact on the functional device and ensuring the reliability of the functional device.

[0023] In a possible embodiment, the circuit board module further includes an insulating packaging layer, which is connected between the circuit board and the welding part and at least partially covers the welding part, and / or the insulating packaging part is connected between the circuit board and the second side shell and at least partially covers the conductive layer. By providing an insulating packaging part between the circuit board and the shielding cover, the electronic device can avoid the problem of the shielding cover detaching from the circuit board and causing the shielding performance of the shielding cover to be reduced in product use scenarios such as falling, collision, and extrusion. On the other hand, the insulating packaging part can cover the conductive component to avoid the conductive layer, such as the cured silver paste, from breaking in product use scenarios such as falling, collision, and extrusion, and falling to other circuit areas of the electronic device to cause short circuits.

[0024] In a possible implementation manner, a distance between each welding portion and each welding pad is H, and H is 0.1 mm to 0.3 mm.

[0025] In a possible implementation manner, the width of each welding portion is D, where D=0.4 mm to 0.6 mm.

[0026] In a possible implementation manner, the distance between two adjacent welding portions is W, where W=0.3 mm to 0.5 mm.

[0027] The present application also provides a terminal device, which includes a housing and a circuit board module as described above, wherein the circuit board module is installed in the housing.

[0028] In a possible implementation, the terminal device is a mobile phone, the mobile phone includes a camera assembly, and the camera assembly includes a functional device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a terminal device provided in the first embodiment of the present application;

[0031] Figure 2 for Figure 1 A schematic diagram of the structure of a circuit board module in the terminal device shown;

[0032] Figure 3 for Figure 2 The schematic diagram of the exploded structure of the circuit board module shown;

[0033] Figure 4 for Figure 3 A schematic diagram of the structure of the circuit board assembly in the circuit board module shown;

[0034] Figure 5 for Figure 3 A schematic diagram of the structure of the shielding cover in the circuit board module shown;

[0035] Figure 6 for Figure 2 A flow chart of a method for assembling a circuit board module;

[0036] Figure 7 A schematic diagram of the structure of a circuit board module in a terminal device provided in a second embodiment of the present application;

[0037] Figure 8 for Figure 7 A flow chart of a method for assembling a circuit board module is shown. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] See also Figure 1 , Figure 1 A schematic diagram of the structure of the terminal device 1 provided in the first embodiment of the present application.

[0040] The embodiment of the present application provides a terminal device 1, which includes but is not limited to mobile phones, tablet computers, wearable devices, etc. Among them, the wearable device can be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (VR) glasses, etc.

[0041] Specifically, the terminal device 1 includes a housing 1000 and a circuit board module 3000 , and the circuit board module 3000 is installed in the housing 1000 .

[0042] See also Figure 2 and Figure 3 , Figure 2 for Figure 1 The schematic diagram of the structure of the circuit board module 3000 in the terminal device 1 is shown. Figure 3 for Figure 2 A schematic diagram of the exploded structure of the circuit board module 3000 is shown.

[0043] The circuit board module 3000 includes a circuit board assembly 100, a shielding cover 300, a conductive assembly 500 and an insulating package ( Figure 2 and Figure 3 (not shown).

[0044] Specifically, the shielding cover 300 is installed on the circuit board assembly 100, the conductive component 500 is electrically connected between the circuit board assembly 100 and the shielding cover 300, and the insulating package is connected between the circuit board assembly 100 and the shielding cover 300, and at least partially covers the conductive component 500. The shielding cover 300 is used to shield the radio frequency interference of other high-power devices in the terminal device 1 to the functional device 120 in the circuit board assembly 100.

[0045] See also Figure 4 , Figure 4 for Figure 3 The schematic diagram of the structure of the circuit board assembly 100 in the circuit board module 3000 is shown.

[0046] The circuit board assembly 100 includes a circuit board 110, a functional device 120, and a pad 130. The functional device 120 and the pad 130 are both mounted on the same side of the circuit board 110.

[0047] Specifically, the circuit board 110 includes a first surface 111 and a second surface 113, and the first surface 111 and the second surface 113 are arranged opposite to each other along the thickness direction of the circuit board 110. The functional device 120 is mounted on the first surface 111 of the circuit board 110. Exemplarily, the functional device 120 can be an inductor, a resistor or a chip. It is understandable that in other embodiments, the functional device 120 can also be other devices that need to shield radio frequency interference, and the present application does not limit this. There can be multiple pads 130, and multiple pads 130 are all mounted on the first surface 111 of the circuit board 110 and are electrically connected to the circuit board 110 to achieve that multiple pads 130 and the functional device 120 are installed on the same side of the circuit board 110. Multiple pads 130 are all arranged around the functional device 120, and are all spaced apart from the functional device 120, and are spaced apart from each other.

[0048] See also Figure 5 , Figure 5 for Figure 3 The schematic diagram of the structure of the shielding cover 300 in the circuit board module 3000 is shown.

[0049] The shielding cover 300 includes a cover body 310, a first side shell 330, a second side shell 350 and a skirt 370. The first side shell 330 and the second side shell 350 are both fixedly connected to the same side of the cover body 310, and are both connected to the peripheral side of the cover body 310, and both extend along the peripheral side direction of the cover body 310. The skirt 370 is fixedly connected to the outer side of the second side shell 350, and is located at one end of the second side shell 350 away from the cover body 310, and extends along the extension direction of the second side shell 350.

[0050] The first side shell 330, the second side shell 350 and the cover body 310 are enclosed to form a shielding cavity. The shielding cavity is used to accommodate the functional device 120 to shield the functional device 120 so that the functional device 120 can avoid radio frequency interference from other high-power devices in the terminal device 1. In the embodiment of the present application, the outer side of the second side shell 350 refers to the side of the second side shell 350 facing away from the shielding cavity, and the inner side of the shielding cover 300 refers to the side of the shielding cover 300 facing the shielding cavity.

[0051] Among them, due to the limited space in the terminal device 1 and the arrangement of other devices in the terminal device 1, the shape of the functional device 120 may be irregular. Therefore, the shape of the shielding cover 300 may also be irregular. In this embodiment, the cover 310 includes a first part 311 and a second part 315. Among them, the first part 311 and the second part 315 are both roughly plate-shaped. In this embodiment, the plane where the first part 311 is located is not in the same plane as the plane where the second part 315 is located.

[0052] The extension length of the first side shell 330 along the circumferential direction of the cover body 310 is L1, and L1 ≥ the design threshold. There can be multiple first side shells 330, and the extension direction of each first side shell 330 along the circumferential direction of the cover body 310 does not overlap. The extension length of the second side shell 350 along the circumferential direction of the cover body 310 is L2, and L2 < the design threshold. There are multiple second side shells 350, and the extension direction of each second side shell 350 along the circumferential direction of the cover body 310 does not overlap. Exemplarily, the design threshold is the size of the laser head. At this time, the laser head is used to perform laser welding on the first side shell 330, but cannot be inserted to perform laser welding on the second side shell 350.

[0053] Specifically, the first side shell 330 includes a connecting portion 10 and a welding portion 30. The connecting portion 10 is connected to the surface of the cover body 310 facing the shielding cavity, and is connected to the peripheral side of the cover body 310. The welding portion 30 is arranged on the side of the connecting portion 10 away from the cover body 310. There can be multiple welding portions 30, and the multiple welding portions 30 are arranged at intervals from each other, and each welding portion 30 is used to electrically connect to a pad 130. In this embodiment, along the extension direction of the first side shell 330, the width of each welding portion 30 is D. Exemplarily, D=0.4mm~0.6mm. Along the extension direction of the first side shell 330, the spacing between two adjacent welding portions 30 is W, W=0.3~0.5mm, which can meet the requirements of interference shielding.

[0054] Continue reading Figure 2 and Figure 3 The conductive component 500 is used to electrically connect between the circuit board 110 and the shielding cover 300 of the circuit board assembly 100, and to electrically connect between the pad 130 and the shielding cover 300, so as to form a loop between the circuit board 110 and the shielding cover 300 through the conductive component 500, thereby achieving the shielding effect of the shielding cover 300.

[0055] Specifically, the conductive component 500 includes a welding piece 510 and a conductive layer 530. The welding piece 510 is used to electrically connect between the shielding cover 300 and the pad 130. The welding piece 510 can be composed of multiple pieces. Exemplarily, the material of the welding piece 510 is solder. The conductive layer 530 is used to electrically connect between the shielding cover 300 and the circuit board 110. Exemplarily, the thickness of the conductive layer 530 is 0.1 mm to 0.15 mm. Exemplarily, the material of the conductive layer 530 is a low-temperature curing material. The "low temperature" in the "low-temperature curing material" means that the curing temperature of the material is lower than the tolerance temperature of the functional device 120. The "tolerance temperature" of the functional device 120 means that when the temperature is exceeded, at least part of the functional device 120 is damaged or the performance is abnormal. Exemplarily, the curing temperature of the low-temperature curing material is ≤80°C to achieve curing under low temperature conditions. In this embodiment, the low-temperature curing material is a low-temperature silver paste.

[0056] The insulating package is used to connect the circuit board 110 of the circuit board assembly 100 with the shielding cover 300 and to cover the conductive component 500 to achieve the effect of insulating packaging. Exemplarily, the material of the insulating package is insulating glue.

[0057] Continue reading Figure 2 In the assembled circuit board module 3000, the shielding cover 300 is mounted on the first surface 111 of the circuit board 110 in the circuit board assembly 100, and covers the functional device 120 mounted on the first surface 111 of the circuit board 110 (see Figure 3 ), the functional device 120 is accommodated in the shielding cavity of the shielding case 300. The cover 310 of the shielding case 300 is arranged opposite to the circuit board 110, and the first side shell 330 and the second side shell 350 are both located on the side of the cover 310 facing the circuit board 110. Each welding portion 30 in the first side shell 330 is connected to a solder pad 130 (see Figure 4 ) are arranged opposite to and spaced apart from each other, the surface of the second side shell 350 facing away from the cover body 310 faces the first surface 111 of the circuit board 110, and the skirt 370 is arranged opposite to and spaced apart from the first surface 111 of the circuit board 110. Exemplarily, the spacing between each welding portion 30 and each welding pad 130 is H, and H is 0.1mm-0.3mm.

[0058] Each welding piece 510 in the conductive assembly 500 is disposed on at least one soldering pad 130 and fixedly connected to at least one welding portion 30 of the first side shell 330 in the shielding cover 300, so as to realize that the welding piece 510 is electrically connected between the shielding cover 300 and the circuit board 110. The conductive layer 530 is electrically connected between the skirt 370 and the circuit board 110, so as to realize that the conductive layer 530 is electrically connected between the shielding cover 300 and the circuit board 110.

[0059] The insulating package is connected between the welding portion 30 of the first side shell 330 and the circuit board 110, and at least partially covers the welding portion 30 and the welding piece 510, and is connected between the second side shell 350 and the circuit board 110, and at least partially covers the skirt 370 and the conductive layer 530, so as to realize that the insulating package is connected between the circuit board assembly 100 and the shielding cover 300, and covers the conductive assembly 500.

[0060] In this embodiment, it is shown that the functional device 120, the pad 130, the shielding cover 300 and the conductive component 500 are only arranged on the first surface 111 of the circuit board 110. It can be understood that the functional device 120, the pad 130, the shielding cover 300 and the conductive component 500 can also be arranged on the first surface 111 and the second surface 113 of the circuit board 110. In this case, the shielding cover 300 installed on the first surface 111 covers the functional device 120 arranged on the first surface 111, the welding part 30 of the shielding cover 300 is connected to the pad 130 arranged on the first surface 111 through the welding part 510, and the skirt 370 is connected to the first surface 111 of the circuit board 110 through the conductive layer 530. The shielding cover 300 installed on the second surface 113 covers the functional device 120 disposed on the second surface 113, the welding portion 30 of the shielding cover 300 is connected to the pad 130 disposed on the second surface 113 through the welding piece 510, and the skirt 370 is connected to the second surface 113 of the circuit board 110 through the conductive layer 530.

[0061] Exemplarily, the terminal device 1 can be a mobile phone, which includes a camera assembly, and the camera assembly includes a lens (Lens), a support frame (Holder) and a chip. The lens is mounted on the support frame and is electrically connected to the chip. In this case, the functional device 120 can be a chip in the camera assembly. The cover body 310 is provided with a window, and the window penetrates the cover body 310 along the thickness direction of the cover body 310 to connect the inside and outside of the shielding cover 300. The shielding cover 300 covers the chip in the camera assembly, and part of the support frame and the lens can be penetrated by the window and exposed relative to the cover body 310. The material of the support frame is usually resin. When the shielding cover 300 is welded by the SMT (Surface Mounted Technology) reflow soldering process, the lens, support frame and chip in the camera assembly cannot withstand high temperatures and are easily damaged during the SMT high-temperature reflow soldering process.

[0062] In the circuit board module 3000 provided in the embodiment of the present application, the functional device 120 is covered by the shielding cover 300, and the first side shell 330 in the shielding cover 300 cancels the pressing skirt design. By setting a welding portion 30 on the first side shell 330, and setting a soldering pad 130 at a position of the circuit board 110 corresponding to the soldering portion 30 of the shielding cover 300, a welding component 510 is set on at least one soldering pad 130 and fixedly connected to at least one soldering portion 30 to achieve electrical connection between the soldering portion 30 and the soldering pad 130, so that the shielding cover 300 and the circuit board 110 form a loop through the welding component 510, thereby achieving the shielding effect of the shielding cover 300 on the functional device 120.

[0063] Compared with the existing SMT (Surface Mounted Technology) reflow soldering process, during the soldering process, the functional device 120 needs to undergo SMT high-temperature reflow together with the shielding cover. In the circuit board module 3000 of the embodiment of the present application, a welding portion 30 is provided on the shielding cover 300, and the welding portion 30 and the pad 130 on the circuit board 110 are arranged opposite to and spaced apart, so that the shielding cover 300 and the circuit board 110 can form a loop through the welding part 510 only by performing welding processing at the welding part 510 between the welding portion 30 and the pad 130. There is no need to place the circuit board module 3000 in a reflow oven, thereby avoiding damage to the functional device 120 in the existing SMT high-temperature environment. It is suitable for functional devices 120 with parts that are not resistant to high temperatures or that are prone to abnormal changes after being subjected to high temperatures, thereby improving the reliability of the functional device 120.

[0064] In addition, when the shape of the shielding cover 300 is irregular, the narrow part of the shielding cover 300 cannot accommodate the welding equipment due to the size of the welding equipment such as the laser head, so that the shielding cover 300 cannot be completely welded to the circuit board 110 by only setting the welding part 30. In the embodiment of the present application, the extension length of the second side shell 350 is less than the design threshold, such as the size of the laser head, and the laser head cannot be inserted to weld the second side shell 350. By setting the skirt 370 on the second side shell 350, the skirt 370 and the circuit board 110 are electrically connected by the conductive layer 530. On the one hand, the conductive layer 530 plays the role of bonding the skirt 370 of the shielding cover 300 and the circuit board 110, so as to realize the formation of a loop between the second side shell 350 and the circuit board 110 through the conductive layer 530, thereby avoiding the problem that the shielding cover 300 cannot be completely connected to the circuit board 110 when it is irregular, and on the other hand, avoiding the use of welding equipment, thereby further avoiding the impact on the functional device 120, and ensuring the reliability of the functional device 120. In addition, since the material of the conductive layer 530 is a low-temperature curing material with a low curing temperature, the functional device 120 can be protected from damage. This is suitable for functional devices 120 that have parts that are not resistant to high temperatures or that are prone to abnormal changes after being exposed to high temperatures, thereby improving the reliability of the functional device 120.

[0065] In addition, by providing an insulating package between the circuit board 110 and the shielding cover 300, the terminal device 1 can, on the one hand, avoid the shielding cover 300 from detaching from the circuit board 110 and causing a reduction in the shielding performance of the shielding cover 300 in product usage scenarios such as falling, collision, and extrusion. On the other hand, the insulating package can cover the conductive component 500 to avoid the conductive layer 530 in the conductive component 500, such as the cured silver paste, from breaking in product usage scenarios such as falling, collision, and extrusion, and falling to other circuit areas of the terminal device 1 to cause a short circuit.

[0066] In addition, the various parts of the functional device 120 covered by the shielding cover 300 can be connected by glue, so that the functional device 120 itself is in a sealed state, thereby blocking fragments generated after the conductive component 500 is broken, such as silver flakes generated when the solidified silver paste is broken, from entering the interior of the functional device 120, thereby avoiding the short circuit problem of the functional device 120.

[0067] See also Figure 2 and Figure 6 , Figure 6 for Figure 2 A flow chart of an assembly method of a circuit board module 3000 is shown.

[0068] The embodiment of the present application further provides an assembly method of the circuit board module 3000. The assembly method of the circuit board module 3000 includes:

[0069] A circuit board assembly 100, a shield cover 300, and a plurality of solder balls are provided.

[0070] The shielding cover 300 is placed on the circuit board 110 and covers the functional device 120 . The plurality of soldering portions 30 are respectively arranged opposite to the plurality of solder pads 130 .

[0071] Each solder ball is placed between at least one soldering portion 30 and at least one soldering pad 130, and each solder ball is melted and solidified, and at least a portion of each solder ball forms a soldering member 510 connected between at least one soldering portion 30 and at least one soldering pad 130. In this embodiment, the solder ball is made of solder, and the solder ball is melted by laser irradiation. Figure 2 In this embodiment, the multiple welding parts 510 formed by the multiple solder balls are arranged at intervals from each other. It can be understood that in other embodiments, two adjacent solder balls can also be welded during the melting process so that the multiple welding parts 510 formed by the multiple solder balls are connected to each other.

[0072] The skirt 370 is arranged opposite to the circuit board 110, and a liquid conductive material is filled between the skirt 370 and the circuit board 110, and the conductive material is cured to form a conductive layer 530 connected between the skirt 370 and the circuit board 110. In this embodiment, liquid silver paste is filled between the skirt 370 and the circuit board 110, and is cured by low-temperature pressure baking, so that the low-temperature silver paste is cured to form the conductive layer 530.

[0073] An insulating package is provided, which is connected between the circuit board 110 and the welding portion 30 and at least partially covers the welding piece 510, and / or the insulating package is connected between the circuit board 110 and the second side shell and at least partially covers the conductive layer 530. In this embodiment, the material of the insulating package is insulating glue.

[0074] In the assembly method of the circuit board module 3000 provided in the embodiment of the present application, by setting the soldering portion 30 on the shielding cover 300, and setting the soldering portion 30 and the pad 130 opposite to each other, placing the solder ball in the gap between the soldering portion 30 and the pad 130, melting and solidifying the solder ball to form a soldering piece 510 connected between the soldering portion 30 and the pad 130, the shielding cover 300 forms a loop with the circuit board 110 through the soldering piece 510, and further achieves the shielding effect of the shielding cover 300 on the functional device 120. Since the process of melting the solder ball is only performed between the soldering portion 30 and the pad 130, the influence of temperature on the functional device 120 during the soldering process is reduced, thereby ensuring the reliability of the functional device 120. Compared with the existing SMT (Surface Mounted Technology) reflow soldering process, in the assembly method of the circuit board module 3000 in the embodiment of the present application, there is no need to place the circuit board module 3000 in a reflow oven, thereby avoiding damage to the functional device 120 caused by the existing SMT high temperature environment. It is suitable for functional devices 120 that have parts that are not resistant to high temperatures or are prone to abnormal changes after being exposed to high temperatures, thereby improving the reliability of the functional device 120.

[0075] In addition, the gap between the skirt 370 and the circuit board 110 is filled with a liquid conductive material, and the liquid conductive material is solidified to realize that the conductive layer 530 electrically connects the skirt 370 and the circuit board 110, and while realizing that the second side shell 350 and the circuit board 110 form a loop through the conductive layer 530, the use of welding equipment is avoided, thereby avoiding the impact of welding on the functional device 120, and further ensuring the reliability of the functional device 120. In addition, since the material of the conductive layer 530 is a low-temperature curing material with a low curing temperature, it can be baked at a low temperature to ensure that the functional device 120 is not damaged, which is suitable for functional devices 120 with parts that are not resistant to high temperatures or that are prone to abnormal changes after being subjected to high temperatures, thereby improving the reliability of the functional device 120.

[0076] See also Figure 7 , Figure 7 This is a schematic diagram of the structure of the circuit board module 3000 in the terminal device 1 provided in the second embodiment of the present application.

[0077] The circuit board module 3000 of the second embodiment differs from the circuit board module 3000 of the first embodiment in that the shielding cover 300 of the circuit board module 3000 of the second embodiment has a regular shape and does not include a second side shell 350 .

[0078] Specifically, the shielding cover 300 of the circuit board module 3000 of the second embodiment only includes a first side shell 330, and there are multiple first side shells 330. Each first side shell 330 includes a welding portion 30. The multiple welding portions 30 are arranged at intervals from each other and are connected to the multiple pads ( Figure 7 Each welding member 510 is disposed on at least one welding pad and is fixedly connected to at least one welding portion 30 .

[0079] See also Figure 8 , Figure 8 for Figure 7 A flow chart of an assembly method of a circuit board module 3000 is shown.

[0080] The assembly method of the circuit board module 3000 of the second embodiment includes:

[0081] A circuit board assembly 100, a shield cover 300, and a plurality of solder balls are provided.

[0082] The shielding cover 300 is placed on the circuit board 110 and covers the functional device 120 . The plurality of soldering portions 30 are respectively arranged opposite to the plurality of soldering pads.

[0083] Each solder ball is placed between at least one soldering portion 30 and at least one solder pad, and each solder ball is melted and solidified, so that at least a portion of each solder ball forms a soldering member 510 connected between at least one soldering portion 30 and at least one solder pad.

[0084] In the circuit board module 3000 provided in this embodiment, the shielding cover 300 uses the welding part 30 and the welding pad to realize the circuit through the welding part 510 to achieve the shielding effect of the shielding cover 300, eliminating the use of the conductive layer 530, and is suitable for application scenarios of the shielding cover 300 with regular shapes.

[0085] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A method for assembling a circuit board module, characterized in that: include: A circuit board assembly, a shielding cover and a plurality of solder balls are provided, wherein the circuit board assembly comprises a circuit board, a functional device and a plurality of solder pads, wherein the functional device and the plurality of solder pads are mounted on the same side of the circuit board, the plurality of solder pads are arranged around the functional device, and are spaced apart from the functional device and spaced apart from each other, and the shielding cover comprises a plurality of soldering portions, and the plurality of soldering portions are spaced apart from each other; The shielding cover is placed on the circuit board and covers the functional device, and the plurality of welding parts are respectively arranged opposite to the plurality of welding pads; Placing each of the solder balls between at least one of the soldering portions and at least one of the soldering pads, melting and solidifying each of the solder balls, so that at least a portion of each of the solder balls forms a soldering member connected between at least one of the soldering portions and at least one of the soldering pads; The shielding cover comprises a cover body, a first side shell, a second side shell and a skirt, the cover body is located on the side of the functional device away from the circuit board, the first side shell and the second side shell are both fixedly connected to the side of the cover body facing the circuit board, the first side shell comprises a plurality of welding portions, and the skirt is fixedly connected to the outer side of the second side shell and is arranged opposite to the circuit board; After the step of placing the shielding cover on the circuit board, the circuit board module assembly method further includes: A liquid conductive material is filled between the skirt and the circuit board, and the conductive material is solidified to form a conductive layer connected between the skirt and the circuit board.

2. The method for assembling a circuit board module according to claim 1, characterized in that: The solder balls are made of solder, and in the step of melting and solidifying each solder ball, the solder balls are melted by laser irradiation.

3. The method for assembling a circuit board module according to claim 1, characterized in that: The conductive material is a low temperature curing material, and the conductive material is cured by baking.

4. The method for assembling a circuit board module according to claim 3, characterized in that: The curing temperature of the low temperature curing material is ≤80°C.

5. The method for assembling a circuit board module according to claim 4, characterized in that: The low temperature curing material is low temperature silver paste.

6. The method for assembling a circuit board module according to any one of claims 1 to 5, characterized in that: The assembly method of the circuit board module also includes: An insulating package is provided, wherein the insulating package is connected between the circuit board and the welding portion and at least partially covers the welding piece, and / or the insulating package is connected between the circuit board and the second side shell and at least partially covers the conductive layer.

7. A circuit board module, characterized in that: The circuit board module is a circuit board module assembled according to the circuit board module assembly method according to any one of claims 1 to 6, the circuit board module comprises a circuit board, a functional device, a plurality of solder pads, a shielding cover and a plurality of welding parts, the functional device and the plurality of solder pads are all installed on the same side of the circuit board, the plurality of solder pads are all arranged around the functional device, and are spaced apart from the functional device and spaced apart from each other, the shielding cover covers the functional device, the shielding cover comprises a plurality of soldering parts, the plurality of soldering parts are spaced apart from each other and are arranged opposite to the plurality of soldering pads, each of the soldering parts is arranged on at least one of the soldering pads and is fixedly connected to at least one of the soldering parts; The shielding cover comprises a cover body, a first side shell, a second side shell and a skirt, the cover body is located on the side of the functional device away from the circuit board, the first side shell and the second side shell are both fixedly connected to the side of the cover body facing the circuit board, the first side shell comprises a plurality of welding portions, and the skirt is fixedly connected to the outer side of the second side shell and is arranged opposite to the circuit board; The circuit board module further comprises a conductive layer connected between the skirt and the circuit board.

8. The circuit board module according to claim 7, characterized in that: An extension length of the second side shell along the circumferential direction of the cover body is smaller than a design threshold.

9. The circuit board module according to claim 7, characterized in that: The circuit board module also includes an insulating package, which is connected between the circuit board and the welding part and at least partially covers the welding part, and / or the insulating package is connected between the circuit board and the second side shell and at least partially covers the conductive layer.

10. The circuit board module according to any one of claims 7 to 9, characterized in that: The distance between each welding portion and each welding pad is H, and H is 0.1 mm to 0.3 mm.

11. The circuit board module according to any one of claims 7 to 9, characterized in that: The width of each welding portion is D, D=0.4 mm ~0.6 mm.

12. The circuit board module according to any one of claims 7 to 9, characterized in that: The distance between two adjacent welding parts is W, W=0.3 mm ~0.5 mm.

13. A terminal device, characterized in that: The terminal device comprises a housing and a circuit board module as claimed in any one of claims 7 to 12, wherein the circuit board module is mounted on the housing.

14. The terminal device according to claim 13, characterized in that: The terminal device is a mobile phone, the mobile phone includes a camera assembly, and the camera assembly includes the functional device.

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