Extensible case based on VPX architecture

Abstract

The invention discloses an extensible case based on a VPX framework, and belongs to the technical field of electronic equipment cases. The partition plate assembly is arranged in the containing cavity, a fixing plate is arranged on the top end face of the partition plate assembly, and an upper fixing groove position is formed in the bottom end face of the partition plate assembly. A first air channel parallel to the top end face of the partition plate assembly is further formed in the partition plate assembly. The side frame body comprises a front panel assembly and a rear frame assembly which are oppositely arranged, and two side frame assemblies are arranged between the front panel assembly and the rear frame assembly. The top end face of the bottom plate assembly is provided with a lower fixing groove position. A second air duct is further arranged in the bottom plate assembly. According to the extensible case based on the VPX architecture, a sufficient mixed installation foundation can be provided for various forms of modules, and meanwhile it can be ensured that the whole case has excellent heat dissipation performance on the premise that sufficient installation space is provided for the various forms of modules; and therefore, the heat in the operation process of each module in the case can be fully dissipated.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic equipment chassis, and in particular relates to an expandable chassis based on a VPX architecture. Background Art

[0002] With the rapid development of social economy, various fields have higher and higher requirements for the performance and corresponding requirements of electronic equipment, and highly reliable electronic equipment has been widely used in various fields such as civil and scientific research. Generalization, serialization, and combination are important directions for the research and development of various electronic equipment in the world today. In electronic equipment, the chassis is usually one of the basic structures of electronic equipment, and the VPX architecture chassis is widely used in harsh environments such as humidity, salt spray, mold, etc. due to its own reinforced structure, excellent seismic and impact resistance mechanical properties.

[0003] At present, the existing 4U VPX chassis is a general platform product that complies with the VITA48.2 bus architecture. The platform adopts a 3U VPX open architecture and is a 4U standard height cabinet chassis. The whole machine adopts brazing reinforcement, and the upper and lower covers of the chassis are designed as air ducts, and the heat dissipation method adopts conduction cooling. However, the VPX module can only be cooled by contacting the air-cooled cold plate on one side of the locking strip. Not only is the heat dissipation performance relatively limited, but the power module slot and general business module of the device are all 3U VPX architectures, which do not have good expansion performance. Summary of the invention

[0004] In response to one or more of the above defects or improvement needs in the prior art, the present invention provides an expandable chassis based on the VPX architecture, which can provide a sufficient mixed installation basis for various forms of modules. At the same time, while providing sufficient installation space for various forms of modules, it can also ensure that the entire chassis has excellent heat dissipation performance, so that the heat generated by the operation of each module in the chassis can be fully dissipated, thereby providing reliable guarantee for the continuous operation of the chassis.

[0005] To achieve the above object, the present invention provides an expandable chassis based on VPX architecture, which includes a box body, wherein at least one accommodating cavity is provided in the box body, and the box body further includes: A partition assembly, the partition assembly is arranged in the accommodating cavity to form two chambers on both sides of the partition assembly, at least one pair of fixing plates is arranged on the top end surface of the partition assembly for fixing and installing the hardware module; at least one upper fixing slot is arranged on the bottom end surface of the partition assembly for positioning and installing the VPX module; at least one first air duct parallel to the top end surface of the partition assembly is opened in the partition assembly; A side frame body, the side frame body comprising a front panel assembly and a rear frame assembly which are arranged opposite to each other, and two side frame assemblies which are spaced apart are arranged between the front panel assembly and the rear frame assembly; A top plate assembly and a bottom plate assembly, wherein the top plate assembly is arranged on the top end surface of the side frame body, and the bottom plate assembly is arranged on the bottom end surface of the side frame body to form a sealed accommodating cavity; at least one lower fixing slot corresponding to the upper fixing slot is arranged on the top end surface of the bottom plate assembly; and at least one second air duct is also arranged in the bottom plate assembly.

[0006] As a further preferred embodiment of the present invention, the rear frame assembly includes a rear sealing plate and a rear isolation plate, an air blowing cavity is arranged between the rear isolation plate and the rear sealing plate, and the rear isolation plate is provided with an upper air outlet connected to the first air duct and a lower air outlet connected to the second air duct on the side facing the accommodating cavity.

[0007] As a further preferred embodiment of the present invention, the air blast cavity is an inverted T-shaped structure, and installation through holes are symmetrically opened on both sides of the air blast cavity of the rear isolation plate to make way for the installation of hardware modules.

[0008] As a further preferred embodiment of the present invention, a conductive rubber strip is provided between the mounting through hole and the rear sealing plate.

[0009] As a further preferred embodiment of the present invention, the first air duct is distributed in a Z-shape, and the first air outlet of the first air duct is arranged on the side frame assembly to communicate with the outside of the chassis.

[0010] As a further preferred embodiment of the present invention, at least one first heat dissipation tooth parallel to the side frame assembly is provided in the first air duct.

[0011] As a further preferred embodiment of the present invention, a plurality of upper mounting holes are arranged on the bottom end surface of the partition assembly, and correspondingly, a plurality of lower mounting holes are arranged on the top end surface of the bottom plate assembly for mounting the back plate.

[0012] As a further preferred embodiment of the present invention, the bottom plate assembly includes a bottom end plate and a bottom cover plate, a second air duct is arranged between the bottom end plate and the bottom cover plate, and at least one second heat dissipating tooth is arranged in the second air duct.

[0013] As a further preferred embodiment of the present invention, a second air outlet is provided on a side of the bottom cover plate away from the lower air outlet for heat dissipation of the bottom plate assembly.

[0014] As a further preferred embodiment of the present invention, at least one heat dissipation groove is provided on the outer wall surface of the side frame assembly.

[0015] In general, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects: (1) The expandable chassis based on the VPX architecture of the present invention has a housing cavity provided in the chassis. A partition assembly is provided in the housing cavity, and a fixing plate is provided on the top surface of the partition assembly. An upper fixing slot is provided on the bottom surface of the partition assembly. A first air duct parallel to the top surface of the partition assembly is provided in the partition assembly. The side frame body includes a front panel assembly and a rear frame assembly that are relatively arranged, and a side frame assembly is provided between the front panel assembly and the rear frame assembly. A lower fixing slot is provided on the top surface of the bottom plate assembly; a second air duct is also provided in the bottom plate assembly. The expandable chassis can provide a sufficient mixed installation basis for various forms of modules. At the same time, on the premise of providing sufficient installation space for various forms of modules, it can also ensure that the entire chassis has excellent heat dissipation performance, so that the heat generated by the operation of each module in the chassis can be fully dissipated.

[0016] (2) The expandable chassis based on the VPX architecture of the present invention significantly improves the heat dissipation performance of the partition assembly and the bottom plate assembly by means of the first heat dissipation teeth arranged in the first air duct and the second heat dissipation teeth arranged in the second air duct. At the same time, the first heat dissipation teeth and the second heat dissipation teeth are respectively connected to the top end surface and the bottom end surface of the first air duct and the second air duct, further improving the heat dissipation performance of the air duct to the chassis. In addition, the fan and the air blast cavity arranged on the rear frame assembly form an airflow flowing in the first air duct and the second air duct, further improving the heat dissipation performance of the entire chassis.

[0017] (3) The expandable chassis based on the VPX architecture of the present invention has a simple structure, is easy to use, and has good heat dissipation. The storage space is divided into upper and lower areas by arranging a partition assembly in the storage space. And by arranging a pair of fixed plates on the top surface of the partition assembly, non-standard modules and 6U-sized VPX boards can be installed in the upper space. At the same time, by arranging a number of upper fixed slots on the bottom surface of the partition assembly and correspondingly arranged a number of lower fixed slots on the bottom plate assembly, a VPX module installation space with a VPX frame can be formed in the lower space. Combined with the back plate arranged between the partition assembly and the bottom plate assembly, the VPX module can be stably installed while also realizing electrical connection between the electrical components on the rear frame assembly and the VPX module. In addition, the upper and lower layers of the partition assembly are interconnected, and the back plate extends to both the upper and lower layers, so that non-standard modules and 6U-sized VPX boards can also be horizontally inserted on the back plate, realizing the integration of modules of different forms. In addition, by providing a first air duct in the isolation assembly and a second air duct in the base plate assembly, continuous and stable heat dissipation of the chassis is achieved, ensuring that the chassis can operate continuously and stably, and has good promotion prospects and application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1is an overall exploded view of an expandable chassis based on the VPX architecture in an embodiment of the present invention; Figure 2 It is a partial diagram of a scalable chassis based on the VPX architecture in an embodiment of the present invention; Figure 3 is a three-dimensional diagram of a front panel assembly of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Figure 4 is a three-dimensional diagram of a rear frame assembly of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Figure 5 is a front view of a rear isolation plate of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Figure 6 is a three-dimensional diagram of a partition assembly of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Figure 7 is a three-dimensional diagram of an air duct plate of an expandable chassis based on the VPX architecture in an embodiment of the present invention; Figure 8 is a three-dimensional diagram from another perspective of an air duct plate of an expandable chassis based on the VPX architecture in an embodiment of the present invention; Fig. 9 is a three-dimensional diagram of a baseboard assembly of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Fig.10 is a three-dimensional diagram of a bottom end plate of an expandable chassis based on a VPX architecture in an embodiment of the present invention; Fig.11 is a stereoscopic view of the bottom surface of an expandable chassis based on the VPX architecture in an embodiment of the present invention from another perspective; Fig.12 It is a vertical cross-sectional view of an expandable chassis based on the VPX architecture in an embodiment of the present invention.

[0019] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. Top plate assembly; 2. Partition plate assembly; 3. Rear frame assembly; 4. Side frame assembly; 5. Bottom plate assembly; 6. Front panel assembly; 7. Bottom cover; 8. Handle; 9. First connector; 10. Power switch; 11. Heat sink; 12. Rear sealing plate; 13. Rear isolation plate; 14. Power filter; 15. Grounding column; 16. Fuse; 17. Sealing pad; 18. Second connector; 19. Wind hood; 20. Ventilation guide Wave plate; 21. Fan; 22. Conductive rubber strip; 23. Lower air outlet; 24. Upper air outlet; 25. Mounting through hole; 26. Duct cover; 27. Duct plate; 28. Fixing plate; 29. ​​Upper fixing slot; 30. Upper mounting hole; 31. Bottom end plate; 32. Wire tie rack; 33. Bottom cover; 34. Lower mounting hole; 35. Lower fixing slot; 36. Second heat dissipation tooth; 37. First heat dissipation tooth; 38. Back plate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0025] Embodiment: Please refer to Figures 1 to 12 , the scalable chassis based on the VPX architecture in the preferred embodiment of the present invention can provide a sufficient basis for mixed installation of various forms of modules. At the same time, on the premise of providing sufficient installation space for various forms of modules, it can also ensure that the entire chassis has excellent heat dissipation performance, so that the heat generated during the operation of each module in the chassis can be fully dissipated, providing a reliable guarantee for the continuous operation of the chassis.

[0026] Specifically, as shown in Figures 1 to 12 , in the preferred embodiment of the present application, the expandable chassis based on the VPX architecture includes a box body, and at least one accommodation cavity is provided in the box body. At the same time, the box body includes a partition assembly 2, a side frame body, a top plate assembly 1 and a bottom plate assembly 5. Among them, the partition assembly 2 is arranged in the accommodation space, and two chambers are formed on both sides of the partition assembly 2 to facilitate the accommodation of different types of hardware modules. At least a pair of fixing plates 28 are arranged on the top end surface of the partition assembly 2 for the fixed installation of hardware modules. Preferably, the fixing plates 28 arranged in pairs on the top end surface of the partition assembly 2 can be used for the fixed installation of non-standard modules and 6U-sized VPX boards, thereby improving the expansion performance of the chassis. At least one upper fixing slot 29 is arranged on the bottom end surface of the partition assembly 2 for the positioning installation of VPX modules. And, in order to ensure sufficient cooling of the accommodation space, at least one first air duct parallel to the top end surface of the partition assembly 2 is provided in the partition assembly 2, and the continuous cooling of the accommodation space and the inside of the partition assembly 2 is realized through the air flow flowing in the first air duct.

[0027] The side frame body includes a front panel assembly 6 and a rear frame assembly 3 arranged opposite to each other. At the same time, two side frame assemblies 4 are arranged at intervals between the front panel assembly 6 and the rear frame assembly 3, thereby forming a frame structure in the shape of a rectangle with a hole in the middle. And, the top plate assembly 1 is arranged on the top end surface of the side frame body, and correspondingly, the bottom plate assembly 5 is arranged on the bottom end surface of the side frame body to stably seal the top opening and the bottom opening of the side frame body to form a sealed accommodation cavity.

[0028] At the same time, at least one lower fixing slot 35 corresponding to the upper fixing slot 29 is arranged on the top surface of the bottom plate assembly 5, so as to realize the stable fixing of the VPX module through the upper fixing slot 29 and the lower fixing slot 35 arranged in pairs, and ensure the installation of the VPX module in the chassis. Preferably, a plurality of lower fixing slots 35 are evenly spaced along the first direction on the top surface of the bottom plate assembly 5, and correspondingly, a plurality of upper fixing slots 29 are also evenly spaced along the first direction on the bottom surface of the bulkhead assembly, so that a fixed structure capable of installing a plurality of VPX modules is formed between the bulkhead assembly and the bottom plate assembly 5, thereby significantly improving the expansion performance of the chassis.

[0029] It is worth noting that in the preferred embodiment of the present application, the length direction of the front panel assembly 6 is the first direction, that is, the width direction of the bottom plate assembly 5 also extends along the first direction, and accordingly, the length direction of the bottom plate assembly 5 is the second direction, that is, in the plane where the bottom plate assembly 5 is located, the first direction and the second direction are perpendicular. In addition, the third direction is perpendicular to the plane where the bottom plate assembly 5 is located, that is, the height direction of the front panel assembly 6 is the third direction.

[0030] Furthermore, if Figure 4 and Figure 5 As shown in , in the preferred embodiment of the present application, the rear frame assembly 3 includes a rear sealing plate 12 and a rear isolation plate 13. At the same time, a blast cavity is set between the rear isolation plate 13 and the rear sealing plate 12, and an upper air outlet 24 connected to the first air duct and a lower air outlet 23 connected to the second air duct are opened on the side of the rear isolation plate 13 facing the accommodating cavity. In actual use, the airflow in the blast cavity can flow into the first air duct and the second air duct through the upper air outlet 24 and the lower air outlet 23 respectively, so that the airflow in the partition assembly 2, the bottom plate assembly 5 and the accommodating space flows stably and continuously, thereby completing the continuous heat dissipation of the chassis.

[0031] Further preferably, in the preferred embodiment of the present application, the side of the rear isolation plate 13 away from the accommodating cavity is sunken along the second direction to form a blast cavity, and the blast cavity is blocked by the rear sealing plate 12, thereby forming a sealed accommodating cavity. Preferably, the blast cavity is an inverted T-shaped structure to reduce the space occupied by the blast cavity on the rear isolation plate 13, and further increase the available space inside the chassis. Further preferably, installation through holes 25 are opened on both sides of the blast cavity for making way for the installation of hardware modules.

[0032] In more detail, in a preferred embodiment of the present application, a conductive rubber strip 22 is provided between the mounting through hole 25 and the rear sealing plate 12 to form a seal between the mounting through hole 25 and the rear sealing plate 12 while ensuring the electromagnetic shielding performance of the entire chassis.

[0033] Furthermore, in a preferred embodiment of the present application, a wiring area is provided in the area of ​​the rear cover plate 12 corresponding to the two mounting through holes 25. Preferably, components such as a power filter 14, a grounding column 15, a fuse 16, and a second connector 18 are provided in the wiring area. Preferably, the power function area and the signal and data component function area are respectively arranged on both sides of the rear cover plate 12 along the first direction, so as to separate strong electricity from weak electricity and avoid mutual influence between components.

[0034] Further preferably, in the preferred embodiment of the present application, a through hole is opened on the rear cover plate 12, and a fan 21 connected to the through hole is arranged on the side of the rear cover plate 12 away from the air blast cavity, so that the fan 21 can drive the air flow outside the chassis to flow through the air blast cavity to enter the first air duct and the second air duct, so as to improve the heat dissipation performance of the chassis.

[0035] In more detail, in a preferred embodiment of the present application, an air hood 19 is further provided on the rear sealing plate 12. Preferably, the air hood 19 covers the through hole on the rear sealing plate 12, and a ventilation waveguide plate 20 is provided on the side wall surface of the air hood 19 away from the through hole, and the ventilation waveguide plate 20 is fixed to the air hood 19 by a bolt assembly. Preferably, a sealing gasket 17 is provided between the air hood 19 and the rear sealing plate 12.

[0036] Furthermore, if Figure 6~Figure 8 As shown in the preferred embodiment of the present application, the partition assembly 2 includes an air duct plate 27 and an air duct cover plate 26. A groove is provided on the air duct plate 27. Accordingly, the air duct cover plate 26 is fixed to the top surface of the air duct plate 27 by bolts, thereby forming a first air duct.

[0037] Further, in a preferred embodiment of the present application, a first air inlet and a first air outlet are respectively provided at both ends of the first air duct, wherein the first air inlet is connected to the upper air outlet 24 of the air blast cavity, so that the external air flow can continuously flow into the first air duct through the first inlet. Accordingly, the first air outlet is provided on the side frame assembly 4, preferably, the first air outlet is provided on the side of the side frame assembly 4 away from the rear frame assembly 3, thereby enabling the first air duct to communicate with the outside of the chassis.

[0038] Further preferably, in the preferred embodiment of the present application, the first air duct is distributed in a Z shape. Preferably, a plurality of first heat dissipation teeth 37 evenly spaced along the first direction are arranged in the first air duct, so that the hardware arranged on the top end surface and the bottom end surface of the partition assembly 2 can dissipate heat into the first air duct with the help of each first heat dissipation tooth 37, and complete the heat dissipation of the partition assembly 2 and the surrounding accommodating cavity with the help of the flowing airflow in the first air duct.

[0039] In more detail, in the preferred embodiment of the present application, the top and bottom ends of the first heat dissipation teeth 37 abut against the top and bottom surfaces of the first air duct to facilitate heat conduction.

[0040] Furthermore, in the preferred embodiment of the present application, there are a plurality of upper mounting holes 30 on the bottom end surface of the partition assembly 2 for mounting the back plate 38. Correspondingly, a plurality of lower mounting holes 34 corresponding to the upper mounting holes 30 are also provided on the top end surface of the bottom plate assembly 5 for mounting the back plate 38. Preferably, a plurality of fixing areas are provided on the back plate 38, which can provide stable fixing for the side wall of the VPX module and realize electrical connection between the VPX module and the components provided on the rear frame assembly 3.

[0041] Further preferably, in the preferred embodiment of the present application, the partition assembly 2 as a whole presents a convex structure, and a plurality of wire grooves extending along a third direction are provided on the partition assembly 2 to facilitate the convenient routing of hardware equipment arranged at the top and bottom ends of the partition assembly 2.

[0042] In more detail, in a specific preferred embodiment of the present application, a rectangular wire groove is provided on both sides of the first direction of the side of the partition assembly 2 facing the first air inlet. Preferably, a trapezoidal wire groove is provided on the side of the partition assembly 2 facing away from the first air inlet.

[0043] Furthermore, if Figure 9~Figure 11 As shown in , in a preferred embodiment of the present application, the bottom plate assembly 5 includes a bottom end plate 31 and a bottom cover plate 33, wherein a second air duct is provided between the bottom end plate 31 and the bottom cover plate 33, and preferably, the second air duct is parallel to the top end surface of the bottom end plate 31, so that the second air duct can take away the heat generated by the operation of the VPX module provided on the bottom end plate 31. Further, a plurality of second heat dissipation teeth 36 spaced apart along the second direction are provided in the second air duct, and preferably, the top end surface and the bottom end surface of the second heat dissipation teeth 36 respectively abut against the top end surface and the bottom end surface of the second air duct, thereby further improving the heat dissipation effect on the plurality of VPX modules provided on the bottom plate assembly 5.

[0044] Further preferably, in the preferred embodiment of the present application, a second air inlet is provided at one end of the second air duct, and a second air outlet is provided at the other end of the second air duct, wherein the second air inlet is connected to the lower air outlet 23 of the blast cavity, and the second air outlet is provided on the side of the bottom cover plate 33 away from the second air inlet, so that the airflow can flow in through the second air inlet, flow through the entire second air duct and take away the heat of the second heat dissipation teeth 36, and finally flow out from the second air outlet.

[0045] In more detail, in a preferred embodiment of the present application, at least one wire binding rack 32 is also provided on the top of the bottom end plate 31. Preferably, the wire binding rack 32 is provided in parallel with the lower fixed slot 35 to facilitate the bundling and storage of the connecting cables, thereby making the chassis simple and tidy, avoiding the mutual influence between the cables, causing the interface to be detached and other unexpected situations, and improving the reliability of the equipment. Further preferably, at least two hinge units are provided on the side of the bottom end plate 31 facing the front panel assembly 6, so that the front panel assembly 6 can be stably hinged on the bottom end plate 31 to realize convenient opening and closing of the chassis. Preferably, sealing rings are provided between the front panel assembly 6 and the bottom plate assembly 5, the side frame assembly 4, and the top plate assembly 1, respectively, to improve the sealing of the airtightness.

[0046] Furthermore, in a preferred embodiment of the present application, at least one heat dissipation groove 11 extending along a third direction is provided on the outer wall surface of the side frame assembly 4 facing away from the accommodating chamber, so as to improve the heat dissipation performance of the side frame assembly 4 .

[0047] Furthermore, in a preferred embodiment of the present application, guide rail mounting holes are also provided on the side frame assembly 4 to facilitate the installation of the guide rails and to facilitate the installation of the chassis into a standard cabinet.

[0048] Further preferably, in the preferred embodiment of the present application, two handles 8 spaced apart along the first direction are provided between the front panel assemblies 6 to facilitate opening of the front panel assemblies 6 .

[0049] In more detail, in a preferred embodiment of the present application, at least one first connector 9 is provided on the front panel assembly 6. Further preferably, at least one power switch 10 is provided on the front panel assembly 6.

[0050] The expandable chassis based on the VPX architecture in the present invention has a simple structure, is easy to use, and has good heat dissipation. The storage space is divided into two layers of upper and lower areas by arranging a partition assembly 2 in the storage space. And by arranging a pair of fixed plates 28 on the top surface of the partition assembly 2, non-standard modules and 6U-sized VPX boards can be installed in the upper space. At the same time, by arranging a number of upper fixed slots on the bottom surface of the partition assembly 2 and correspondingly arranged on the bottom plate assembly 5, a VPX module installation space with a VPX frame can be formed in the lower space, and combined with the back plate 38 arranged between the partition assembly 2 and the bottom plate assembly 5, the VPX module can be stably installed while also realizing the electrical connection between the electrical components on the rear frame assembly 3 and the VPX module. In addition, the upper and lower layers of the partition assembly 2 are interconnected, and the back plate 38 extends to the upper and lower layers at the same time, so that non-standard modules and 6U-sized VPX boards can also be horizontally inserted on the back plate 38, realizing the integration of modules of different forms. In addition, by providing the first air duct in the isolation assembly and the second air duct in the base plate assembly 5, continuous and stable heat dissipation of the chassis is achieved, ensuring that the chassis can operate continuously and stably, and has good promotion prospects and application value.

[0051] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An expandable chassis based on VPX architecture, comprising a chassis, wherein at least one accommodating cavity is provided in the chassis, characterized in that: The box also includes: A partition assembly, the partition assembly is arranged in the accommodating cavity to form two chambers on both sides of the partition assembly, at least one pair of fixing plates is arranged on the top end surface of the partition assembly for fixing and installing the hardware module; at least one upper fixing slot is arranged on the bottom end surface of the partition assembly for positioning and installing the VPX module; at least one first air duct parallel to the top end surface of the partition assembly is opened in the partition assembly; A side frame body, the side frame body comprising a front panel assembly and a rear frame assembly which are arranged opposite to each other, and two side frame assemblies which are spaced apart are arranged between the front panel assembly and the rear frame assembly; A top plate assembly and a bottom plate assembly, wherein the top plate assembly is arranged on the top end surface of the side frame body, and the bottom plate assembly is arranged on the bottom end surface of the side frame body to form a sealed accommodating cavity; at least one lower fixing slot corresponding to the upper fixing slot is arranged on the top end surface of the bottom plate assembly; and at least one second air duct is also arranged in the bottom plate assembly.

2. The scalable chassis based on VPX architecture according to claim 1, wherein: The rear frame assembly includes a rear sealing plate and a rear isolation plate, an air blast cavity is arranged between the rear isolation plate and the rear sealing plate, and an upper air outlet connected to the first air duct and a lower air outlet connected to the second air duct are opened on the side of the rear isolation plate facing the accommodating cavity.

3. The scalable chassis based on VPX architecture according to claim 2, wherein: The air blast cavity is an inverted T-shaped structure, and mounting through holes are symmetrically provided on both sides of the air blast cavity of the rear isolation plate to make way for the installation of hardware modules.

4. The scalable chassis based on VPX architecture according to claim 3, wherein: A conductive rubber strip is arranged between the mounting through hole and the rear sealing plate.

5. The scalable chassis based on VPX architecture according to any one of claims 1 to 4, wherein: The first air duct is distributed in a Z shape, and a first air outlet of the first air duct is arranged on the side frame assembly to communicate with the outside of the chassis.

6. The scalable chassis based on VPX architecture according to claim 5, wherein: At least one first heat dissipation tooth parallel to the side frame assembly is arranged in the first air duct.

7. The scalable chassis based on VPX architecture according to any one of claims 1 to 4, wherein: A plurality of upper mounting holes are arranged on the bottom end surface of the partition assembly, and correspondingly, a plurality of lower mounting holes are arranged on the top end surface of the bottom plate assembly for mounting the back plate.

8. The scalable chassis based on VPX architecture according to any one of claims 2 to 4, wherein: The bottom plate assembly includes a bottom end plate and a bottom cover plate, a second air duct is arranged between the bottom end plate and the bottom cover plate, and at least one second heat dissipation tooth is arranged in the second air duct.

9. The scalable chassis based on VPX architecture according to claim 8, wherein: A second air outlet is provided on a side of the bottom cover plate away from the lower air outlet for heat dissipation of the bottom plate assembly.

10. The scalable chassis based on VPX architecture according to any one of claims 1 to 4, wherein: At least one heat dissipation groove is provided on the outer wall surface of the side frame assembly.

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