A lead frame and encapsulation component

Abstract

The present invention discloses a lead frame and a packaging component, wherein the lead frame includes: a frame body, a heat sink and a connecting block. The frame body includes a lead terminal, the heat sink is used to carry a chip, the lead terminal is arranged around the heat sink and is spaced from the heat sink, a connecting block is arranged between the lead terminal and the heat sink, the connecting block is used to fix the lead terminal to the heat sink, at least part of the surface of the lead terminal is exposed from the connecting block, so that the lead terminal and the chip are connected through the lead. The lead terminal is fixedly connected to the heat sink by the connecting block, which not only positions the lead terminal to avoid the lead terminal from being offset in the up-down direction or the front-back-left-right direction during the process of welding the lead or the process of packaging by injection molding the insulating seat, but also ensures the flatness of the lead terminal, improves the stability of the connection between the lead terminal and the chip, and thus improves the quality of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a lead frame and a packaging assembly. Background Art

[0002] The lead frame includes lead terminals and heat sinks. The heat sink is used to carry the chip. One end of the lead terminal is connected to the chip through a lead, and the other end of the lead terminal is connected to the external circuit. The lead frame provides mechanical support and electrical connection for the chip, and connects the chip to the external circuit. Lead frames are widely used in the packaging of integrated circuits (ICs), discrete components and other electronic components, that is, the lead frame and chip are packaged in an insulating seat, and the insulating seat is used to protect the chip.

[0003] In the prior art, the lead terminal and the heat sink are spaced apart, that is, the lead terminal is suspended. During the process of welding the lead or the process of injection molding the insulating base for packaging, the lead terminal is prone to shifting up and down or left and right, and it is difficult to achieve precise positioning of the lead terminal and the heat sink, which will also affect the connection stability of the chip and the quality of the product.

[0004] Therefore, the existing lead frames need to be improved. Summary of the invention

[0005] The purpose of the present invention is to provide a lead frame and packaging assembly, which can prevent the lead terminal from shifting during the process of welding the lead or the process of packaging by injection molding an insulating base, achieve precise positioning, improve the stability of the connection between the lead terminal and the chip, and thus improve the quality of the product.

[0006] The purpose of the present invention is achieved by the following technical solutions:

[0007] A lead frame, comprising:

[0008] A frame body, the frame body comprising lead terminals;

[0009] A heat sink, the heat sink is used to carry a chip, the lead terminals are arranged around the heat sink and spaced apart from the heat sink, a connecting block is arranged between the lead terminals and the heat sink, the connecting block is used to fix the lead terminals to the heat sink, at least part of the surface of the lead terminals is exposed from the connecting block, so that the lead terminals are connected to the chip through leads.

[0010] Preferably, a welding portion is provided on the lead terminal, and the connecting block is provided between the welding portion and the heat sink, and at least a part of the surface of the welding portion is exposed from the connecting block, so that the welding portion is connected to the chip through a lead.

[0011] Preferably, a first welding layer is provided on the surface of the welding portion; and / or,

[0012] A second welding layer is provided at a position corresponding to the heat sink and the chip to increase the bonding force between the heat sink and the chip; and / or,

[0013] The upper surface of the soldering portion exposed from the connecting block is flush with the upper surface of the chip to shorten the length of the lead; and / or,

[0014] The upper surface of the connecting block is flush with the upper surface of the welding portion.

[0015] Preferably, the number of the welding parts is one or more. When the number of the welding parts is multiple, the multiple welding parts are arranged at intervals, the number of the connecting blocks is equal to the number of the welding parts, and the multiple connecting blocks are arranged one by one with the multiple welding parts respectively; and / or,

[0016] The welding part is provided with a first groove penetrating therethrough, and part of the connecting block is filled in the first groove to increase the bonding force between the connecting block and the welding part; and / or,

[0017] The heat sink is provided with a second groove, and part of the connecting block is filled in the second groove to increase the bonding force between the connecting block and the heat sink.

[0018] Preferably, the connecting block is made of a thermoplastic material, which is a polyphenylene sulfide material. The connecting block is connected to the lead terminal and the heat sink as a whole by injection molding. The connecting block is simultaneously covered on the lower surface of the welding portion and the two outer side surfaces of the welding portion, and the upper surface of the welding portion and the front end surface of the welding portion are simultaneously exposed to the connecting block.

[0019] Preferably, the frame body also includes a riveted terminal, a fixing portion is provided on the riveted terminal, a through hole is provided on the fixing portion, a riveted column is provided on the heat sink, and an expansion groove is provided on the riveted column. When the riveted column passes through the through hole of the fixing portion, the expansion groove is expanded so that the riveted column abuts against the fixing portion.

[0020] Preferably, the expansion groove is recessed downward from the upper surface of the riveting column and has an inverted truncated cone structure that is wide at the top and narrow at the bottom; and / or,

[0021] A height difference is formed between the welding portion of the lead terminal and the fixing portion of the riveted terminal; and / or,

[0022] The number of the riveted columns is four, and the four riveted columns are respectively arranged close to the four corners of the heat sink, and the riveted terminals are arranged to be sunken corresponding to the four corners of the heat sink to form the fixing portion.

[0023] Preferably, the lead terminal and the riveted terminal are connected to the same material strip; or,

[0024] The lead terminal and the rivet terminal are cut from the same material strip.

[0025] Preferably, the heat sink has a first side and a second side opposite to each other, the connecting blocks are both provided on the first side of the heat sink and the second side of the heat sink, a receiving space is formed between the connecting block located on the first side of the heat sink and the connecting block located on the second side of the heat sink, and the chip is arranged in the receiving space.

[0026] A packaging component comprises a lead frame, a chip and an insulating base as described in any one of the above, wherein the chip is arranged on a heat sink of the lead frame, the insulating base covers at least part of the chip and at least part of the lead frame, and at least part of the lead terminals are exposed from the insulating base.

[0027] Preferably, the insulating seat body is formed by injection molding, and the material of the insulating seat body is a thermosetting material, and the thermosetting material is a thermosetting resin.

[0028] Compared with the prior art, the beneficial effects of the present invention include at least:

[0029] The lead frame and packaging assembly of the present invention fixedly connect the lead terminal to the heat sink via a connecting block, which not only accurately positions the lead terminal to avoid the lead terminal from being offset in the up-down direction or the front-back-left-right direction during the process of welding the lead or the process of packaging by injection molding the insulating base body, but also ensures the flatness of the lead terminal, improves the stability of the connection between the lead terminal and the chip, and thus improves the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of the frame body in an embodiment of the present invention.

[0031] Figure 2 yes Figure 1 A local enlarged schematic diagram of point A in the middle.

[0032] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat sink in the embodiment of the present invention.

[0033] Figure 4 It is a schematic diagram of the three-dimensional structure of the packaging component of an embodiment of the present invention.

[0034] Figure 5 It is a schematic diagram of the planar structure of the packaging component of an embodiment of the present invention.

[0035] Figure 6 yes Figure 5 Schematic diagram of the cross section along the AA direction.

[0036] Figure 7 It is a schematic diagram of the three-dimensional structure of the packaging component of the embodiment of the present invention when no insulating seat is provided.

[0037] Figure 8 It is a schematic diagram of the planar structure of the packaging component of the embodiment of the present invention when no insulating seat is provided.

[0038] Fig. 9 yes Figure 8 Schematic diagram of the cross section along direction BB.

[0039] In the figure: 100, packaging component; 1, lead frame; 11, frame body; 111, lead terminal; 1111, welding part; 1112, first welding layer; 1113, first groove; 112, riveted terminal; 1121, fixing part; 1122, through hole; 113, material strip; 12, heat sink; 121, first side; 122, second side; 123, first side; 124, second side; 125, second welding layer; 126, second groove; 127, riveted column; 128, expansion groove; 13, connecting block; 2, chip; 3, insulating seat. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0041] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present invention.

[0042] Reference Figures 1 to 9 The present invention provides a lead frame 1, which is used to install a chip 2. The lead frame 1 includes: a frame body 11 and a heat sink 12, and the chip 2 can be arranged on the heat sink 12.

[0043] Reference Figure 1 , Figure 2 , Figure 7The frame body 11 may include a lead terminal 111, one end of which may be electrically connected to the chip 2 via a lead wire (not shown), such as a gold wire, and the other end of the lead terminal 111 may be electrically connected to an external circuit, such as a circuit board. The chip 2 is electrically connected to the lead terminal 111 via a lead wire, and then electrically connected to the external circuit via the lead terminal 111, so that the chip 2 and the external circuit can communicate with each other. The number of lead terminals 111 may be one or more, and each lead terminal 111 may be connected to one or more leads. The lead terminal 111 is preferably made of a conductive material, and is further preferably made of a metal material or an alloy material.

[0044] Reference Figure 3 , Figure 7 , the heat sink 12 can be a rectangular parallelepiped as a whole, and of course it can also be set to other shapes as needed. In this embodiment, the heat sink 12 is a rectangular parallelepiped as a whole, and the heat sink 12 has a first surface 121 and a second surface 122 that are arranged opposite to each other. The first surface 121 and the second surface 122 are preferably two surfaces with larger areas on the heat sink 12. The chip 2 can be arranged on the first surface 121 of the heat sink 12. The heat sink 12 is used to carry the chip 2 and provide support for the chip 2. The chip 2 is preferably arranged near the center of the heat sink 12. The lead terminal 111 can be arranged around the heat sink 12 and spaced from the heat sink 12. A connecting block 13 can be arranged between the lead terminal 111 and the heat sink 12. The connecting block 13 is used to fix the lead terminal 111 to the heat sink 12, and at least part of the surface of the lead terminal 111 is exposed from the connecting block 13, so that the lead terminal 111 is electrically connected to the chip 2 through the lead wire, ensuring that the lead terminal 111 is electrically connected to the chip 2 through the lead wire.

[0045] In this embodiment, refer to Figure 7, the lead terminal 111 can be arranged around the chip 2, and the end of the lead terminal 111 connected to the lead is preferably arranged close to the chip 2, which can shorten the distance between the lead terminal 111 and the chip 2, thereby shortening the length of the lead. The end of the lead terminal 111 close to the chip 2 is preferably arranged above the first surface 121 of the heat sink 12 and spaced from the first surface 121 of the heat sink 12. A connecting block 13 can be formed between the lead terminal 111 and the heat sink 12 by injection molding. The connecting block 13 can fix the lead terminal 111 and the heat sink 12. At least part of the upper surface of the lead terminal 111 is exposed from the connecting block 13, and the upper surface of the lead terminal 111 exposed from the connecting block 13 can be electrically connected to the chip 2 through the lead. The heat sink 12 has a certain structural strength to ensure that the heat sink 12 can provide stable support for the chip 2 and ensure the stability of the position of the chip 2. The heat sink 12 is preferably made of a material with high thermal conductivity, thereby improving the heat dissipation effect of the heat sink 12, thereby dissipating the heat generated when the chip 2 is working, and ensuring that the chip 2 can operate normally. The heat sink 12 may be made of metal or non-metal.

[0046] Reference Figure 3 , Figure 7 The heat sink 12 has a first side 123 and a second side 124 opposite to each other. The first side 123 and the second side 124 of the heat sink 12 can be provided with a connection block 13. A receiving space (not shown) can be formed between the connection block 13 located at the first side 123 of the heat sink 12 and the connection block 13 located at the second side 124 of the heat sink 12. The chip 2 can be provided in the receiving space, that is, the chip 2 is provided between the first side 123 of the heat sink 12 and the second side 124 of the heat sink 12. The connection block 13 located at the first side 123 of the heat sink 12 and the connection block 13 located at the second side 124 of the heat sink 12 can position the chip 2, facilitate the installation of the chip 2, and improve the accuracy of the installation position of the chip 2. The number of connecting blocks 13 may be one or more, the number of connecting blocks 13 located on the first side 123 of the heat sink 12 may be one or more, the number of connecting blocks 13 located on the second side 124 of the heat sink 12 may also be one or more, and the connecting blocks 13 located on the first side 123 of the heat sink 12 and the connecting blocks 13 located on the second side 124 of the heat sink 12 may also be interconnected to form a whole.

[0047] The connection block 13 can be connected to the lead terminal 111 and the heat sink 12 as a whole by injection molding. The connection block 13 can be coated on the lower surface of the welding part 1111 and the two outer side surfaces of the welding part 1111 at the same time, and the upper surface of the welding part 1111 and the front end surface of the welding part 1111 are simultaneously exposed to the connection block 13. The lower surface of the welding part 1111 and the two outer side surfaces of the welding part 1111 are coated by the connection block 13, which can ensure the electrical insulation performance between the welding part 1111 and the heat sink 12 and the adjacent welding parts 1111. The upper surface of the welding part 1111 and the front end surface of the welding part 1111 are exposed to the connection block 13, which facilitates the welding of the lead wire on the one hand, and ensures the heat dissipation area of ​​the lead terminal 111 on the other hand, thereby improving the heat dissipation performance.

[0048] That is to say, the connecting block 13 can be formed by injection molding, and the material of the connecting block 13 is preferably a thermoplastic material. Thermoplastic material softens and melts when heated, and its molding process is simple, injection molding is good, and it has better plasticity, so it can better insulate the heat sink 12 and the lead terminal 111 from each other and fix them together.

[0049] The material of the connecting block 13 is further preferably polyphenylene sulfide (PPS). PPS not only has good fluidity and better formability, but also has excellent electrical insulation, so that the heat sink 12 and the lead terminal 111 are better insulated. PPS also has excellent mechanical properties, tensile strength and bending strength, so that it can resist the impact caused by the secondary injection molding of the insulating seat body 3. In addition, the high temperature resistance of the packaging component 100 is generally required to be higher than 175 degrees, and the thermal deformation temperature of PPS is 260°C, so it also has good high temperature resistance. Therefore, the connecting block 13 can better insulate and fix the heat sink 12 and the lead terminal 111 together, not only better positioning the welding part 1111 of the lead terminal 111, better ensuring the flatness of the welding part 1111, in the process of welding the chip 2 or the process of injection molding the insulating seat body 3 for packaging, it can prevent the lead terminal 111 from shifting up and down or front and back and left and right, further improving the connection stability of the chip 2 and the quality of the product. At the same time, the connecting block 13 cannot be made of thermosetting plastics, such as epoxy resin, because the epoxy resin material has a low construction temperature, poor leveling properties, and is prone to burrs. In addition, its surface is prone to surface depressions or bubbles due to insufficient tension, and is easily attached to the surface of the lead terminal 111, affecting the electrical performance, and also affecting the molding accuracy of the lead frame 1.

[0050] As a preferred method, refer to Figure 3 , Figure 6 , Figure 7, the heat sink 12 may be provided with a second groove 126, that is, the second groove 126 is provided on the first surface 121 of the heat sink 12, and part of the connecting block 13 may be filled in the second groove 126. The second groove 126 may increase the contact area between the connecting block 13 and the heat sink 12, so as to increase the bonding force between the connecting block 13 and the heat sink 12. The second groove 126 may be an undercut structure or a special-shaped structure, that is, the width of the second groove 126 does not gradually decrease from the opening of the second groove 126 to the bottom of the second groove 126, but the width of the second groove 126 gradually increases from the opening of the second groove 126 to the bottom of the second groove 126, or the width of the second groove 126 sometimes increases and sometimes decreases from the opening of the second groove 126 to the bottom of the second groove 126, that is, the side wall of the second groove 126 is uneven, so that the bonding force between the connecting block 13 and the heat sink 12 can be further increased to prevent the connecting block 13 from separating from the heat sink 12.

[0051] In the present application, the lead terminal 111 is fixedly connected to the heat sink 12 by the connecting block 13, which not only accurately positions the lead terminal 111 to avoid the lead terminal 111 from shifting up and down or forward and backward or left and right during the process of welding the lead or the process of encapsulating the injection molding insulating base 3, but also ensures the flatness of the lead terminal 111, improves the stability of the connection between the lead terminal 111 and the chip 2, and thus improves the quality of the product.

[0052] In a specific embodiment, referring to Figure 2 , Figure 7 , a welding part 1111 may be provided on the lead terminal 111, and a connecting block 13 may be provided between the welding part 1111 and the heat sink 12, at least part of the surface of the welding part 1111 is exposed from the connecting block 13, so that the welding part 1111 is connected to the chip 2 through the lead. The welding part 1111 is preferably provided at one end of the lead terminal 111 close to the chip 2, so that the distance between the welding part 1111 and the chip 2 can be shortened, thereby shortening the length of the lead. The welding part 1111 is preferably provided above the first surface 121 of the heat sink 12 and spaced from the heat sink 12, and a connecting block 13 is provided below the welding part 1111, and the connecting block 13 fixes the welding part 1111 and the heat sink 12, so as to avoid the welding part 1111 from being offset in the up-down direction or the front-back-left-right direction during the process of welding the lead or the process of encapsulating the injection molding insulating seat body 3, and also ensures the flatness of the welding part 1111, improves the stability of the connection between the welding part 1111 and the chip 2, and thus improves the quality of the product.

[0053] As a preferred embodiment, the number of welding parts 1111 may be one or more. In the present embodiment, the number of welding parts 1111 is multiple, and the multiple welding parts 1111 are arranged at intervals. The multiple welding parts 1111 can be divided into two columns, each column can include one or more welding parts 1111, and the two columns of welding parts 1111 are respectively arranged on the first side 123 of the heat sink 12 and the second side 124 of the heat sink 12. In the present embodiment, the number of welding parts 1111 is six, each column has three welding parts 1111, and the two columns of welding parts 1111 can be symmetrically arranged. The number of connecting blocks 13 can be equal to the number of welding parts 1111, and the multiple connecting blocks 13 and the multiple welding parts 1111 are respectively arranged in a one-to-one correspondence, that is, one connecting block 13 is connected to one welding part 1111, so that the welding parts 1111 can be better spaced, fixed and electrically insulated.

[0054] In some embodiments, one connection block 13 may be connected to multiple welding portions 1111 at the same time, and one welding portion 1111 may also be connected to multiple connection blocks 13 at the same time.

[0055] As a preferred method, refer to Figure 2 , Figure 7 The surface of the welding part 1111 may be provided with a first welding layer 1112. The first welding layer 1112 may be, for example, a silver layer. The silver layer may be formed by electroplating or chemical plating. The first welding layer 1112 may increase the welding performance of the welding part 1111, facilitate welding the lead to the welding part 1111, and enhance the stability and reliability of the connection between the lead and the welding part 1111.

[0056] Reference Figure 2 A penetrating first groove 1113 may also be provided on the welding portion 1111. One or more first grooves 1113 may be provided on each welding portion 1111. Part of the connecting block 13 is filled in the first groove 1113. The connecting block 13 and the first groove 1113 form a concave-convex matching connecting and retaining structure. The first groove 1113 may increase the contact area between the connecting block 13 and the welding portion 1111 to increase the bonding force between the connecting block 13 and the welding portion 1111.

[0057] Reference Figure 3 A second welding layer 125 may be provided at a position corresponding to the heat sink 12 and the chip 2, that is, the second welding layer 125 is provided on the first surface 121 of the heat sink 12. The second welding layer 125 is, for example, a silver layer, which may be formed by electroplating or chemical plating. The second welding layer 125 may also increase the welding performance of the heat sink 12 to increase the bonding force between the heat sink 12 and the chip 2, thereby enhancing the stability and reliability of the connection between the heat sink 12 and the chip 2.

[0058] In a specific embodiment, the position of the upper surface of the soldering portion 1111 can be adjusted according to the position of the upper surface of the chip 2 when the chip 2 is mounted on the heat sink 12, so that the upper surface of the soldering portion 1111 exposed from the connection block 13 can be flush with the upper surface of the chip 2 to shorten the length of the lead. In other words, the upper surface of the soldering portion 1111 and the upper surface of the chip 2 are on the same horizontal plane, which can further shorten the distance between the soldering portion 1111 and the chip 2, thereby further shortening the length of the lead, which can not only reduce the amount of lead used and reduce the manufacturing cost of the product, but also shorten the signal transmission path, reduce the loss of the transmission signal, reduce the current loss, etc., thereby improving the performance of the product.

[0059] Reference Figure 6 , Figure 7 , Fig. 9 The upper surface of the connecting block 13 and the upper surface of the welding part 1111 can be arranged flush, that is, the connecting block 13 is not only connected to the side of the welding part 1111 facing the heat sink 12, but also connected to the side of the welding part 1111, that is, the connecting block 13 covers multiple partial surfaces of the welding part 1111, which not only increases the contact area between the connecting block 13 and the welding part 1111, thereby increasing the bonding force between the connecting block 13 and the welding part 1111, but also facilitates welding the lead to the welding part 1111.

[0060] In some embodiments, the connection block 13 may also cover a portion of the upper surface of the welding portion 1111, further increasing the contact area between the connection block 13 and the welding portion 1111, thereby increasing the bonding force between the connection block 13 and the welding portion 1111. The connection block 13 may also be arranged protruding from the upper surface of the welding portion 1111, or the connection block 13 may also be arranged recessed in the upper surface of the welding portion 1111, or the connection block 13 may only be connected to the side of the welding portion 1111 facing the heat sink 12, that is, the connection block 13 is placed on the lower surface of the welding portion 1111 for connection.

[0061] In a specific embodiment, referring to Figure 2 , Figure 3 , Figure 7 The frame body 11 may further include a riveted terminal 112, a fixing portion 1121 may be provided on the riveted terminal 112, a through hole 1122 may be provided on the fixing portion 1121, and a riveted column 127 may be provided on the heat sink 12, that is, the riveted column 127 is provided on the first surface 121 of the heat sink 12, and an expansion groove 128 is provided on the riveted column 127. When the riveted column 127 passes through the through hole 1122 of the fixing portion 1121, the expansion groove 128 on the expanded riveted column 127 is expanded so that the riveted column 127 abuts against the fixing portion 1121.

[0062] As a preferred method, refer to Figure 2, Figure 3 , Figure 7 The number of the riveted posts 127 is preferably four, and the four riveted posts 127 are preferably respectively arranged near the four corners of the heat sink 12, and each riveted post 127 is provided with an expansion slot 128, and the riveted posts 127 and the expansion slot 128 can be formed by stamping. Correspondingly, the number of the riveted terminals 112 is also preferably four, and the riveted terminals 112 are arranged to be sunken corresponding to the four corners of the heat sink 12 to form a fixing portion 1121, and the fixing portion 1121 is provided with a through hole 1122 that matches the riveted post 127. After the rivet column 127 passes through the through hole 1122 of the fixing portion 1121, a jig can be used to enter the expansion groove 128 and push the rivet column 127 outward, that is, the rivet column 127 and the fixing portion 1121 are connected together by riveting, which is equivalent to increasing the outer diameter of the rivet column 127, so that the rivet column 127 contacts and abuts against the fixing portion 1121 outward, and the matching gap between the rivet column 127 and the through hole 1122 can be reduced or avoided. In this way, the fixation and positioning between the heat sink 12 and the riveted terminal 112 can be achieved more accurately, and the stability of the connection between the welding portion 1111 and the chip 2 is improved, thereby improving the quality of the product, and avoiding the heat sink 12 relative to the riveted terminal 112 during the process of fixing and matching the chip 2 with the heat sink 12, the process of lead welding, or the subsequent secondary injection molding of the insulating seat body 3 for packaging. Position displacement, thereby causing the chip 2 and the welding portion 1111 to occur.

[0063] The expansion slot 128 is recessed downward from the upper surface of the riveted column 127 and has an inverted truncated cone structure that is wide at the top and narrow at the bottom. The inverted truncated cone structure makes the bottom of the expansion slot 128 narrower and the top wider, which can provide greater expansion force. After the riveting is completed, the groove wall of the expansion slot 128 can better clamp and lock the fixing portion 1121, thereby increasing the tensile and shear strengths, and can effectively prevent the riveted column 127 from loosening or falling off during use. Under the action of the jig, the top of the riveted column 127 can be bent and extended toward the upper surface of the fixing portion 1121, so that the top of the riveted column 127 abuts against the side of the fixing portion 1121 facing away from the heat sink 12, that is, the top of the riveted column 127 abuts against the upper surface of the fixing portion 1121, so that not only can the riveted terminal 112 be prevented from being offset along the axial direction of the riveted column 127, but also the riveted terminal 112 can be prevented from falling off from the riveted column 127.

[0064] As a preferred method, refer to Figure 2 , Figure 7, a height difference of different heights can be formed between the welding portion 1111 of the lead terminal 111 and the fixing portion 1121 of the riveted terminal 112, that is, the welding portion 1111 and the fixing portion 1121 can be on different horizontal planes. In this embodiment, in the thickness direction of the heat sink 12, the welding portion 1111 can be located above the fixing portion 1121, that is, the fixing portion 1121 is closer to the heat sink 12. By adjusting the height of the welding portion 1111, the upper surface of the welding portion 1111 is kept consistent with the upper surface of the chip 2, so that the two ends of the lead can always be kept in the same horizontal plane, shortening the length of the lead.

[0065] Reference Figure 1 , Figure 2 The lead terminal 111 and the rivet terminal 112 can be connected to the same material strip 113, and the material strip 113 can connect the lead terminal 111 and the rivet terminal 112 together, which not only facilitates automated production and improves production efficiency, but also avoids the position of the lead terminal 111 and the rivet terminal 112 from being offset during the manufacturing process.

[0066] Reference Figure 1 , Figure 2 The lead terminal 111 and the rivet terminal 112 can also be cut from the same material strip 113, which can further improve the position accuracy of the lead terminal 111 and the rivet terminal 112. The cutting method includes one or more of laser cutting, stamping cutting, etc.

[0067] Reference Figures 4 to 9 The present invention further provides a packaging component 100, comprising the lead frame 1, the chip 2 and the insulating base 3, wherein the chip 2 is arranged on the heat sink 12 of the lead frame 1, and the insulating base 3 can be formed by injection molding, the insulating base 3 covers at least a portion of the chip 2 and at least a portion of the lead frame 1, and at least a portion of the lead terminal 111 is exposed from the insulating base 3. In this embodiment, the chip 2 is completely covered by the insulating base 3, so that the chip 2 is better protected, and a portion of the lead terminal 111 is exposed from the insulating base 3 to ensure that the lead terminal 111 can be electrically connected to an external circuit.

[0068] As a preferred embodiment, the material of the insulating base body 3 can be a thermosetting material. Thermosetting materials have good bonding properties and structural strength, and have good heat resistance and thermal conductivity, thereby achieving better packaging performance for the lead frame 1 and the chip 2.

[0069] The material of the insulating seat body 3 is further preferably a thermosetting resin, such as epoxy resin. Epoxy resin has good bonding, sealing and heat dissipation properties, and epoxy resin and PPS have better bonding strength, that is, the bonding strength between the insulating seat body 3 and the connecting block 13 is improved, thereby improving the firmness of the packaging component 100 after the secondary injection molding.

[0070] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A lead frame, characterized in that: include: A frame body, the frame body comprising lead terminals; A heat sink, the heat sink having a first surface and a second surface arranged opposite to each other, the heat sink being used to carry a chip, the lead terminals being arranged around the heat sink and spaced apart from the heat sink, a connecting block being arranged between the lead terminals and the heat sink, the connecting block being arranged on the first surface of the heat sink, the connecting block being used to fixedly connect the lead terminal to the heat sink, the connecting block being connected to the lead terminal and the heat sink as a whole by injection molding, at least a portion of the surface of the lead terminal being exposed from the connecting block, so that the lead terminal is connected to the chip through a lead.

2. The lead frame according to claim 1, characterized in that: The lead terminal is provided with a welding portion, and the connecting block is provided between the welding portion and the heat sink, and at least a part of the surface of the welding portion is exposed from the connecting block, so that the welding portion is connected to the chip through the lead.

3. The lead frame according to claim 2, characterized in that: The surface of the welding portion is provided with a first welding layer; and / or, A second welding layer is provided at a position corresponding to the heat sink and the chip to increase the bonding force between the heat sink and the chip; and / or, The upper surface of the soldering portion exposed from the connecting block is flush with the upper surface of the chip to shorten the length of the lead; and / or, The upper surface of the connecting block is flush with the upper surface of the welding portion.

4. The lead frame according to claim 2, characterized in that: The number of the welding parts is one or more. When the number of the welding parts is multiple, the multiple welding parts are arranged at intervals, the number of the connecting blocks is equal to the number of the welding parts, and the multiple connecting blocks are arranged one by one with the multiple welding parts respectively; and / or, The welding part is provided with a first groove penetrating therethrough, and part of the connecting block is filled in the first groove to increase the bonding force between the connecting block and the welding part; and / or, The heat sink is provided with a second groove, and part of the connecting block is filled in the second groove to increase the bonding force between the connecting block and the heat sink.

5. The lead frame according to claim 2, characterized in that: The connecting block is made of a thermoplastic material, which is a polyphenylene sulfide material. The connecting block simultaneously covers the lower surface of the welding portion and the two outer side surfaces of the welding portion, and the upper surface of the welding portion and the front end surface of the welding portion are simultaneously exposed to the connecting block.

6. The lead frame according to claim 1, wherein: The frame body also includes a riveted terminal, a fixing portion is provided on the riveted terminal, a through hole is provided on the fixing portion, a riveted column is provided on the heat sink, and an expansion groove is provided on the riveted column. When the riveted column passes through the through hole of the fixing portion, the expansion groove is expanded so that the riveted column abuts against the fixing portion.

7. The lead frame according to claim 6, characterized in that The expansion groove is recessed downward from the upper surface of the riveting column and has an inverted truncated cone structure that is wide at the top and narrow at the bottom; and / or, A height difference is formed between the welding portion of the lead terminal and the fixing portion of the riveted terminal; and / or, The number of the riveted columns is four, and the four riveted columns are respectively arranged close to the four corners of the heat sink, and the riveted terminals are arranged to be sunken corresponding to the four corners of the heat sink to form the fixing portion.

8. The lead frame according to claim 6, characterized in that: The lead terminal and the riveted terminal are connected to the same material strip; or, The lead terminal and the rivet terminal are cut from the same material strip.

9. The lead frame according to claim 1, wherein: The heat sink has a first side and a second side opposite to each other, the first side and the second side of the heat sink are both provided with the connecting blocks, a receiving space is formed between the connecting block located on the first side of the heat sink and the connecting block located on the second side of the heat sink, and the chip is arranged in the receiving space.

10. A packaging component, characterized in that: It comprises a lead frame, a chip and an insulating seat as described in any one of claims 1 to 9, wherein the chip is arranged on a heat sink of the lead frame, the insulating seat covers at least part of the chip and at least part of the lead frame, and at least part of the lead terminals are exposed from the insulating seat.

11. The packaging assembly according to claim 10, characterized in that: The insulating seat body is formed by injection molding, and the material of the insulating seat body is a thermosetting material, and the thermosetting material is a thermosetting resin.

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