Manufacturing method of LED lamp bead, LED lamp bead and electronic equipment

Abstract

The present application provides a method for manufacturing an LED lamp bead, an LED lamp bead and an electronic device. The LED lamp bead includes an insulating seat, a plurality of pins, a first light-emitting chip group, a second light-emitting chip group, a third light-emitting chip group, a fourth light-emitting chip group, at least one driving chip and packaging glue. The pins are arranged on the insulating seat, the first light-emitting chip group is arranged on the pins, the second light-emitting chip group is arranged on the pins adjacent to the first light-emitting chip group, the third light-emitting chip group is arranged on the pins opposite to the first light-emitting chip group, the fourth light-emitting chip group is arranged on the pins opposite to the second light-emitting chip group, the driving chip is arranged on the pins, and the packaging glue is encapsulated on the outside of the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group. The packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface relative to the four chip groups, so as to realize flexible light emission on four sides of the LED lamp bead.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to a method for manufacturing an LED lamp bead, an LED lamp bead and an electronic device. Background Art

[0002] RGB LED lamp beads are widely used in various consumer electronics and display industries due to their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0003] Traditional RGB LED computer fans achieve lighting effects through the three primary colors of RGB (red, green, and blue). Traditional RGB LED fans send signals to the corresponding pins to make a specific "combination" of the three colors of RGB LED to present the desired color. The ARGB (IC+RGB chip integrated package) fan controls each lamp bead through the control chip, which is equivalent to a "brain" that can send real-time signals. In theory, in an ARGB fan, as many light colors as there are lamp beads can be emitted at the same time, so the color transition of the ARGB fan is more natural, and there will be no problem of discontinuity in the lighting effect, and the lighting effect of the ARGB lamp is richer.

[0004] However, with the increasing demand for color effects of LED lamp beads, if rich colors need to be presented in the product, multiple LED lamp beads need to be arranged in the product, resulting in limitations on the miniaturization of product size. Summary of the invention

[0005] The present application provides a method for manufacturing an LED lamp bead, an LED lamp bead, and an electronic device, aiming to solve the problem that as the current demand for the color effect of LED lamp beads increases, if a product needs to present rich colors, multiple LED lamp beads need to be arranged in the product, resulting in the miniaturization of the product size being limited. The provided LED lamp bead can be provided with a first light-emitting surface, a second light-emitting surface, a third light-emitting surface, and a fourth light-emitting surface on both sides, respectively, to achieve flexible light emission on the four sides of the LED lamp bead, so that the electronic device designed based on the provided LED lamp bead can achieve product miniaturization.

[0006] According to the first aspect of the present application, the present application provides a method for manufacturing an LED lamp bead, which is used to manufacture an LED lamp bead, wherein the LED lamp bead includes an insulating seat, a plurality of pins, a first light-emitting chip group, a second light-emitting chip group, a third light-emitting chip group, a fourth light-emitting chip group, at least one driving chip and a packaging glue, wherein the pins are arranged on the insulating seat, the first light-emitting chip group is arranged on the pins and is electrically connected to the pins, the second light-emitting chip group is arranged on the pins adjacent to the first light-emitting chip group and is electrically connected to the pins, the third light-emitting chip group is arranged on the pins opposite to the first light-emitting chip group and is electrically connected to the pins, and the fourth light-emitting chip group is arranged on the pins opposite to the second light-emitting chip group. and electrically connected to the pins, the driving chip is arranged on the pins, the driving chip is electrically connected to the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group respectively, the packaging glue is packaged outside the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, the packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group, the second light-emitting surface is arranged relative to the second light-emitting chip group, the third light-emitting surface is arranged relative to the third light-emitting chip group and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group; the manufacturing method includes:

[0007] A first glue injection device is used for molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, respectively; wherein the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffusion glue layers, and the driving chip is encapsulated in any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer;

[0008] A second glue injection device is used for molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer; wherein the fifth glue layer is an opaque glue, the fifth glue layer and the first glue layer form a first light-emitting surface, the fifth glue layer and the second glue layer form a second light-emitting surface, the fifth glue layer and the third glue layer form a third light-emitting surface, and the fifth glue layer and the fourth glue layer form a fourth light-emitting surface.

[0009] In a manufacturing method of one embodiment of the present application, the first glue injection device is used for molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, respectively, including: according to the shape of the first glue layer corresponding to the first light-emitting chip group, the first glue injection device is used to mold the outside of the first light-emitting chip group to form the first glue layer; according to the shape of the second glue layer corresponding to the second light-emitting chip group, the first glue injection device is used to mold the outside of the second light-emitting chip group to form the second glue layer; according to the shape of the third glue layer corresponding to the third light-emitting chip group, the first glue injection device is used to mold the outside of the third light-emitting chip group to form the third glue layer; according to the shape of the fourth glue layer corresponding to the fourth light-emitting chip group, the first glue injection device is used to mold the outside of the fourth light-emitting chip group to form the fourth glue layer.

[0010] In a manufacturing method of one embodiment of the present application, the first light-emitting surface is located on the side of the first adhesive layer, and the contact surface shape of the first adhesive layer and the first light-emitting chip group is a trapezoid; the second light-emitting surface is located on the side of the second adhesive layer, and the contact surface shape of the second adhesive layer and the second light-emitting chip group is a trapezoid; the third light-emitting surface is located on the side of the third adhesive layer, and the contact surface shape of the third adhesive layer and the third light-emitting chip group is a trapezoid; the fourth light-emitting surface is located on the side of the fourth adhesive layer, and the contact surface shape of the fourth adhesive layer and the fourth light-emitting chip group is a trapezoid.

[0011] In a manufacturing method of one embodiment of the present application, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first glue layer; and / or, the height of the second light-emitting surface is higher than the height of the surface opposite to the second light-emitting surface in the second glue layer; and / or, the height of the third light-emitting surface is higher than the height of the surface opposite to the third light-emitting surface in the third glue layer; and / or, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth glue layer.

[0012] In a manufacturing method of one embodiment of the present application, the second glue injection device is used for molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer, including: using the second glue injection device to perform molding on the opposite surface of any glue layer relative to the first glue layer, the second glue layer, the third glue layer or the fourth glue layer, to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer.

[0013] According to the second aspect of the present application, the present application provides an LED lamp bead, comprising:

[0014] Insulation seat;

[0015] A plurality of pins, wherein the pins are arranged on the insulating seat;

[0016] a first light-emitting chip group, the first light-emitting chip group being disposed on the pin and electrically connected to the pin;

[0017] a second light-emitting chip group, the second light-emitting chip group being disposed adjacent to the first light-emitting chip group on the pin and being electrically connected to the pin;

[0018] a third light-emitting chip group, the third light-emitting chip group being arranged on the pin opposite to the first light-emitting chip group and being electrically connected to the pin;

[0019] a fourth light-emitting chip group, the fourth light-emitting chip group being arranged on the pin opposite to the second light-emitting chip group and being electrically connected to the pin;

[0020] at least one driving chip, the driving chip being disposed on the pins and being electrically connected to the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group, and the fourth light-emitting chip group respectively;

[0021] Packaging glue, the packaging glue is packaged outside the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, the packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group, the second light-emitting surface is arranged relative to the second light-emitting chip group, the third light-emitting surface is arranged relative to the third light-emitting chip group and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group; the driving chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, the second light-emitting chip group to emit light through the second light-emitting surface, the third light-emitting chip group to emit light through the third light-emitting surface and the fourth light-emitting chip group to emit light through the fourth light-emitting surface;

[0022] Wherein, the packaging glue includes a first glue layer, a second glue layer, a third glue layer, a fourth glue layer and a fifth glue layer; the first glue layer is encapsulated outside the first light-emitting chip group, and the first glue layer includes the first light-emitting surface; the second glue layer is encapsulated outside the second light-emitting chip group, and the second glue layer includes the second light-emitting surface; the third glue layer is encapsulated outside the third light-emitting chip group, and the third glue layer includes the third light-emitting surface; the fourth glue layer is encapsulated outside the fourth light-emitting chip group, and the fourth glue layer includes the fourth light-emitting surface; the fifth glue layer is encapsulated outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer except the first light-emitting surface, the second light-emitting surface, the third light-emitting surface and the fourth light-emitting surface; the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffusion glue layers; the fifth glue layer is an opaque glue layer; the driving chip is encapsulated in any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer. In an LED lamp bead of one embodiment of the present application, the packaging glue includes: a first glue layer, the first glue layer is encapsulated on the outside of the first light-emitting chip group; the first glue layer includes the first light-emitting surface; a second glue layer, the second glue layer is encapsulated on the outside of the second light-emitting chip group; the second glue layer includes the second light-emitting surface; a third glue layer, the third glue layer is encapsulated on the outside of the first glue layer and the second glue layer except the first light-emitting surface and the second light-emitting surface; wherein, the first glue layer and the second glue layer are light-transmitting glue layers, and the third glue layer is an opaque glue layer.

[0023] In an LED lamp bead of one embodiment of the present application, the first light-emitting surface is located on the side of the first adhesive layer, and the contact surface shape of the first adhesive layer and the first light-emitting chip group is a trapezoid; the second light-emitting surface is located on the side of the second adhesive layer, and the contact surface shape of the second adhesive layer and the second light-emitting chip group is a trapezoid; the third light-emitting surface is located on the side of the third adhesive layer, and the contact surface shape of the third adhesive layer and the third light-emitting chip group is a trapezoid; the fourth light-emitting surface is located on the side of the fourth adhesive layer, and the contact surface shape of the fourth adhesive layer and the fourth light-emitting chip group is a trapezoid.

[0024] In an LED lamp bead of one embodiment of the present application, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first adhesive layer; and / or, the height of the second light-emitting surface is higher than the height of the surface opposite to the second light-emitting surface in the second adhesive layer; and / or, the height of the third light-emitting surface is higher than the height of the surface opposite to the third light-emitting surface in the third adhesive layer; and / or, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth adhesive layer.

[0025] In an LED lamp bead of one embodiment of the present application, the pins set in the first light-emitting chip group are connected to the pins set in the second light-emitting chip group; and / or, the pins set in the third light-emitting chip group are connected to the pins set in the fourth light-emitting chip group.

[0026] In an LED lamp bead of one embodiment of the present application, the driver chip includes a first driver chip, a second driver chip, a third driver chip and a fourth driver chip; the multiple pins include four groups of pin pairs, the four groups of pin pairs are respectively a first pin pair, a second pin pair, a third pin pair and a fourth pin pair, and the pins in each group of the pin pairs are relatively distributed on the insulating seat; wherein, the first pin pair includes two first power pins and one first ground pin, the first light-emitting chip group and the first driver chip are electrically connected to the first power pin, the second light-emitting chip group and the second driver chip are electrically connected to another first power pin, and the first driver chip and the second driver chip are respectively electrically connected to the first ground pin; the second pin pair includes two first signal input pins and two first signal output pins, the first driver chip is electrically connected to the first ground pin, and the second signal output pins are electrically connected to the first signal input pins. The first signal input pin is electrically connected to the first signal output pin, and the second driver chip is electrically connected to another first signal input pin and another first signal output pin; the third pin pair includes two second signal input pins and two second signal output pins, the third driver chip is electrically connected to the second signal input pin and the second signal output pin, and the fourth driver chip is electrically connected to another second signal input pin and another second signal output pin; the fourth pin pair includes two second power pins and one second ground pin, the third light-emitting chip group and the third driver chip are electrically connected to the first power pin, the fourth light-emitting chip group and the fourth driver chip are electrically connected to another first power pin, and the third driver chip and the fourth driver chip are electrically connected to the second ground pin respectively.

[0027] In an LED lamp bead of one embodiment of the present application, the insulating seat includes a first end face, and the first ground pin, the first power pin, the first signal input pin, the first signal output pin, the second ground pin, the second power pin, the second signal input pin, and the second signal output pin have a solid crystal portion formed on the first end face and a welding portion formed on the other end faces of the insulating seat; the first light-emitting chip group, the second light-emitting chip group, the first driver chip and the second driver chip are arranged on the solid crystal portion of any one of the first ground pin, the first power pin, the first signal input pin and the first signal output pin; the third light-emitting chip group, the fourth light-emitting chip group, the third driver chip and the fourth driver chip are arranged on the solid crystal portion of any one of the second ground pin, the second power pin, the second signal input pin and the second signal output pin; at least part of the structure of the welding portion is formed with a via structure.

[0028] In an LED lamp bead of one embodiment of the present application, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group each include a plurality of light-emitting chips; wherein the light-emitting chips of the first light-emitting chip group and the light-emitting chips of the second light-emitting chip group are equidistantly spaced on the same said crystal-fixing portion, and the light-emitting chips of the third light-emitting chip group and the light-emitting chips of the fourth light-emitting chip group are equidistantly spaced on the same said crystal-fixing portion.

[0029] In an LED lamp bead of one embodiment of the present application, the crystal-fixing portion provided for the first light-emitting chip group and the second light-emitting chip group includes a first extension portion and a second extension portion perpendicular to the first extension portion between the first light-emitting chip group and the second light-emitting chip group, the first extension portion extends toward the direction of the first light-emitting chip group, and forms a third extension portion and a fourth extension portion spaced apart from the first extension portion, the second extension portion extends toward the direction of the second light-emitting chip group, and forms a fifth extension portion and a sixth extension portion spaced apart from the second extension portion; the crystal-fixing portion provided for the third light-emitting chip group and the fourth light-emitting chip group includes a seventh extension portion and an eighth extension portion perpendicular to the seventh extension portion between the third light-emitting chip group and the fourth light-emitting chip group, the seventh extension portion extends toward the direction of the third light-emitting chip group, and forms a ninth extension portion spaced apart from the seventh extension portion An extension portion and a tenth extension portion, the eighth extension portion extends toward the direction of the fourth light-emitting chip group, and forms an eleventh extension portion and a twelfth extension portion spaced apart from the fourth extension portion; wherein the first light-emitting chip group is arranged in the third extension portion, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the first extension portion and the fourth extension portion, respectively; the second light-emitting chip group is arranged in the fifth extension portion, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the second extension portion and the sixth extension portion, respectively; the third light-emitting chip group is arranged in the ninth extension portion, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the seventh extension portion and the tenth extension portion, respectively; the fourth light-emitting chip group is arranged in the eleventh extension portion, and a plurality of light-emitting chips in the fourth light-emitting chip group are electrically connected to the eighth extension portion and the twelfth extension portion, respectively.

[0030] In an LED lamp bead of one embodiment of the present application, the crystal-fixing portion provided in the first light-emitting chip group also includes a thirteenth extension portion provided relative to the third extension portion, and the first driver chip is electrically connected to the thirteenth extension portion; the crystal-fixing portion provided in the second light-emitting chip group also includes a fourteenth extension portion provided relative to the fifth extension portion, and the second driver chip is electrically connected to the fourteenth extension portion; the crystal-fixing portion provided in the third light-emitting chip group also includes a fifteenth extension portion provided relative to the ninth extension portion, and the third driver chip is electrically connected to the fifteenth extension portion; the crystal-fixing portion provided in the fourth light-emitting chip group also includes a sixteenth extension portion provided relative to the eleventh extension portion, and the fourth driver chip is electrically connected to the sixteenth extension portion.

[0031] In an LED lamp bead of one embodiment of the present application, the first light-emitting chip group is adjacent to the first light-emitting surface; and / or, the second light-emitting chip group is adjacent to the second light-emitting surface; and / or, the third light-emitting chip group is adjacent to the third light-emitting surface; and / or, the fourth light-emitting chip group is adjacent to the fourth light-emitting surface.

[0032] According to the third aspect of the present application, the present application provides an electronic device, including the LED lamp beads provided by any embodiment of the present application.

[0033] The technical solution provided by the embodiments of the present application may include the following beneficial effects: the present application designs a manufacturing method of an LED lamp bead, an LED lamp bead and an electronic device, the LED lamp bead includes an insulating seat, a plurality of pins, a first light-emitting chip group, a second light-emitting chip group, a third light-emitting chip group, a fourth light-emitting chip group, at least one driver chip and a packaging glue, the pins are arranged on the insulating seat, the first light-emitting chip group is arranged on the pins and is electrically connected to the pins, the second light-emitting chip group is arranged on the pins adjacent to the first light-emitting chip group and is electrically connected to the pins, the third light-emitting chip group is arranged on the pins opposite to the first light-emitting chip group and is electrically connected to the pins, and the fourth light-emitting chip group is arranged on the The second light-emitting chip group is relatively arranged on the pin and electrically connected to the pin, the driving chip is arranged on the pin, the driving chip is electrically connected to the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group respectively, the packaging glue is encapsulated on the outside of the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, the packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group, the second light-emitting surface is arranged relative to the second light-emitting chip group, the third light-emitting surface is arranged relative to the third light-emitting chip group and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group. Among them, the packaging glue includes a first glue layer, a second glue layer, a third glue layer, a fourth glue layer and a fifth glue layer; the first glue layer is packaged on the outside of the first light-emitting chip group, and the first glue layer includes a first light-emitting surface; the second glue layer is packaged on the outside of the second light-emitting chip group, and the second glue layer includes a second light-emitting surface; the third glue layer is packaged on the outside of the third light-emitting chip group, and the third glue layer includes a third light-emitting surface; the fourth glue layer is packaged on the outside of the fourth light-emitting chip group, and the fourth glue layer includes a fourth light-emitting surface; the fifth glue layer is packaged on the outside of the first glue layer, the second glue layer, the third glue layer and the fourth glue layer except the first light-emitting surface, the second light-emitting surface, the third light-emitting surface and the fourth light-emitting surface; the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffusion glue layers; the fifth glue layer is an opaque glue layer; the driving chip is packaged in any glue layer of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer.

[0034] Furthermore, the LED lamp bead provided in the present application forms corresponding first light-emitting surfaces, second light-emitting surfaces, third light-emitting surfaces and fourth light-emitting surfaces through packaging glue on the first light-emitting chip group, second light-emitting chip group, third light-emitting chip group and fourth light-emitting chip group on the four sides of the LED lamp bead, and can then control the four light-emitting surfaces to emit light separately, thereby achieving flexible light emission on the four sides of the LED lamp bead, so that the electronic equipment designed based on the provided LED lamp bead can be miniaturized.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 This is one of the structural schematic diagrams of an LED lamp bead provided in one embodiment of the present application;

[0038] Figure 2 This is the second structural schematic diagram of the LED lamp bead provided in one embodiment of the present application;

[0039] Figure 3 is a schematic structural diagram of a fifth adhesive layer provided in one embodiment of the present application;

[0040] Figure 4 This is the third structural schematic diagram of the LED lamp bead provided in one embodiment of the present application;

[0041] Figure 5 This is the fourth structural diagram of the LED lamp bead provided in one embodiment of the present application;

[0042] Figure 6 This is a schematic diagram of the back structure of an LED lamp bead provided in one embodiment of the present application;

[0043] Figure 7 This is an exploded schematic diagram of an LED lamp bead provided in one embodiment of the present application;

[0044] Figure 8 This is a schematic flow chart of the steps of a method for manufacturing an LED lamp bead provided in one embodiment of the present application;

[0045] Fig. 9 It is a schematic diagram of the structure of an electronic device provided in one embodiment of the present application.

[0046] Description of reference numerals:

[0047] 100. Electronic equipment;

[0048] 10. LED lamp beads;

[0049] 11. Insulation seat;

[0050] 12, pin; 121, first power pin; 122, first ground pin; 123, first signal output pin; 124, first signal input pin; 125, second power pin; 126, second ground pin; 127, second signal output pin; 128, second signal input pin;

[0051] 13. A first light-emitting chip group;

[0052] 14. A second light-emitting chip group;

[0053] 15. a third light-emitting chip group;

[0054] 16. a fourth light-emitting chip group;

[0055] 17, driver chip; 171, first driver chip; 172, second driver chip; 173, third driver chip; 174, fourth driver chip;

[0056] 18, packaging glue; 181, first glue layer; 182, second glue layer; 183, third glue layer; 184, fourth glue layer; 185, fifth glue layer;

[0057] 19. Conductive column.

[0058] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0060] It should also be understood that the terms used in this specification of the present application are only for describing specific realities. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0061] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0062] RGB LED lamp beads are widely used in various consumer electronics and display industries due to their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0063] Traditional RGB LED computer fans achieve lighting effects through the three primary colors of RGB (red, green, and blue). Traditional RGB LED fans send signals to the corresponding pins to make a specific "combination" of the three colors of RGB LED to present the desired color. The ARGB (IC+RGB chip integrated package) fan controls each lamp bead through the control chip, which is equivalent to a "brain" that can send real-time signals. In theory, in an ARGB fan, as many light colors as there are lamp beads can be emitted at the same time, so the color transition of the ARGB fan is more natural, and there will be no problem of discontinuity in the lighting effect, and the lighting effect of the ARGB lamp is richer.

[0064] However, with the increasing demand for color effects of LED lamp beads, if rich colors need to be presented in the product, multiple LED lamp beads need to be arranged in the product, resulting in limitations on the miniaturization of product size.

[0065] To solve the above problems, please refer to Figures 1 to 7 ,like Figures 1 to 7As shown, the present application provides an LED lamp bead 10 including an insulating seat 11, a plurality of pins 12, a first light-emitting chip group 13, a second light-emitting chip group 14, a third light-emitting chip group 15, a fourth light-emitting chip group 16, at least one driving chip 17 and a packaging glue 18, the pin 12 is arranged on the insulating seat 11, the first light-emitting chip group 13 is arranged on the pin 12 and is electrically connected to the pin 12, the second light-emitting chip group 14 is arranged adjacent to the first light-emitting chip group 13 on the pin 12 and is electrically connected to the pin 12, the third light-emitting chip group 15 is arranged on the pin 12 opposite to the first light-emitting chip group 13 and is electrically connected to the pin 12, the fourth light-emitting chip group 16 is arranged on the pin 12 opposite to the second light-emitting chip group 14 and is electrically connected to the pin 12 is electrically connected, a driving chip 17 is arranged on the pin 12, and the driving chip 17 is electrically connected to the first light-emitting chip group 13, the second light-emitting chip group 14, the third light-emitting chip group 15 and the fourth light-emitting chip group 16 respectively, and the packaging glue 18 is packaged on the outside of the driving chip 17, the first light-emitting chip group 13, the second light-emitting chip group 14, the third light-emitting chip group 15 and the fourth light-emitting chip group 16, and the packaging glue 18 includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group 13, the second light-emitting surface is arranged relative to the second light-emitting chip group 14, the third light-emitting surface is arranged relative to the third light-emitting chip group 15 and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group 16.

[0066] The encapsulation glue 18 includes a first glue layer 181, a second glue layer 182, a third glue layer 183, a fourth glue layer 184 and a fifth glue layer 185; the first glue layer 181 is encapsulated outside the first light-emitting chip group 13, and the first glue layer 181 includes a first light-emitting surface; the second glue layer 182 is encapsulated outside the second light-emitting chip group 14, and the second glue layer 182 includes a second light-emitting surface; the third glue layer 183 is encapsulated outside the third light-emitting chip group 15, and the third glue layer 183 includes a third light-emitting surface; the fourth glue layer 184 is encapsulated outside the fourth light-emitting chip group 16, The fourth adhesive layer 184 includes a fourth light-emitting surface; the fifth adhesive layer 185 is encapsulated on the outer sides of the first adhesive layer 181, the second adhesive layer 182, the third adhesive layer 183 and the fourth adhesive layer 184 except the first light-emitting surface, the second light-emitting surface, the third light-emitting surface and the fourth light-emitting surface; the first adhesive layer 181, the second adhesive layer 182, the third adhesive layer 183 and the fourth adhesive layer 184 are transparent adhesive layers or diffusion adhesive layers; the fifth adhesive layer 185 is an opaque adhesive layer; the driving chip 17 is encapsulated in any adhesive layer of the first adhesive layer 181, the second adhesive layer 182, the third adhesive layer 183 or the fourth adhesive layer 184.

[0067] Specifically, the LED lamp bead 10 provided in the present application forms corresponding first, second, third and fourth light-emitting surfaces through the first light-emitting chip group 13, second light-emitting chip group 14, third light-emitting chip group 15 and fourth light-emitting chip group 16 on the four sides of the LED lamp bead 10 through the packaging glue 18, and can then emit light through the four light-emitting surfaces respectively, thereby achieving flexible light emission on the four sides of the LED lamp bead 10, so that the electronic device 100 designed based on the provided LED lamp bead 10 can be miniaturized.

[0068] In some embodiments, Figure 1 to Figure 2 As shown, the first light-emitting surface is located on the side of the first adhesive layer 181, and the contact surface of the first adhesive layer 181 and the first light-emitting chip group 13 is in a trapezoidal shape; the second light-emitting surface is located on the side of the second adhesive layer 182, and the contact surface of the second adhesive layer 182 and the second light-emitting chip group 14 is in a trapezoidal shape; the third light-emitting surface is located on the side of the third adhesive layer 183, and the contact surface of the third adhesive layer 183 and the third light-emitting chip group 15 is in a trapezoidal shape; the fourth light-emitting surface is located on the side of the fourth adhesive layer 184, and the contact surface of the fourth adhesive layer 184 and the fourth light-emitting chip group 16 is in a trapezoidal shape. By designing the contact surface of the adhesive layer and the chip group in a trapezoidal shape, when the chip group and the adhesive layer form a reflective cup, the effect of any light-emitting chip group emitting light through the corresponding light-emitting surface can be better.

[0069] Exemplarily, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first adhesive layer 181, such as Figure 7 As shown, the first adhesive layer 181 is a trapezoid cut downward, which can increase the intensity of light emitted from the first light-emitting surface of the first light-emitting chip group 13. At the same time, the height of the surface opposite to the first light-emitting surface needs to be at least higher than the height of the first light-emitting chip group 13. When the driving chip 17 is also encapsulated in the first adhesive layer 181, the height of the surface opposite to the first light-emitting surface needs to be higher than the height of the first light-emitting chip group 13 and the driving chip 17.

[0070] Exemplarily, the height of the second light emitting surface is higher than the height of the surface opposite to the second light emitting surface in the second adhesive layer 182, such as Figure 7 As shown, the second adhesive layer 182 is a downwardly cut trapezoid, which can increase the light intensity emitted from the second light-emitting surface of the second light-emitting chip group 14. At the same time, the height of the surface opposite to the second light-emitting surface needs to be at least higher than the height of the second light-emitting chip group 14. When the driving chip 17 is also encapsulated in the second adhesive layer 182, the height of the surface opposite to the second light-emitting surface needs to be higher than the height of the second light-emitting chip group 14 and the driving chip 17.

[0071] Exemplarily, the height of the third light emitting surface is higher than the height of the surface opposite to the third light emitting surface in the third adhesive layer 183, such as Figure 7As shown, the third adhesive layer 183 is a trapezoid cut downward, which can increase the intensity of light emitted from the third light-emitting surface of the third light-emitting chip group 15. At the same time, the height of the surface opposite to the third light-emitting surface needs to be at least higher than the height of the third light-emitting chip group 15. When the driving chip 17 is also encapsulated in the third adhesive layer 183, the height of the surface opposite to the third light-emitting surface needs to be higher than the height of the third light-emitting chip group 15 and the driving chip 17.

[0072] Exemplarily, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth adhesive layer 184, such as Figure 7 As shown, the fourth adhesive layer 184 is a trapezoid cut downward, which can increase the intensity of light emitted from the fourth light-emitting surface of the fourth light-emitting chip group 16. At the same time, the height of the surface opposite to the fourth light-emitting surface needs to be at least higher than the height of the fourth light-emitting chip group 16. When the driving chip 17 is also encapsulated in the fourth adhesive layer 184, the height of the surface opposite to the fourth light-emitting surface needs to be higher than the height of the fourth light-emitting chip group 16 and the driving chip 17.

[0073] In some embodiments, Figure 7 As shown, the pin 12 provided on the first light-emitting chip group 13 is connected to the pin 12 provided on the second light-emitting chip group 14, thereby simplifying the wiring structure of the LED lamp bead 10 and preventing the problem of cold soldering caused by unilateral solder leakage.

[0074] In some embodiments, Figure 7 As shown, the pin 12 provided on the third light-emitting chip group 15 is connected to the pin 12 provided on the fourth light-emitting chip group 16, thereby simplifying the wiring structure of the LED lamp bead 10 and preventing the problem of cold soldering caused by unilateral solder leakage.

[0075] In some embodiments, Figure 7As shown, the driver chip 17 includes a first driver chip 171, a second driver chip 172, a third driver chip 173 and a fourth driver chip 174; the plurality of pins 12 include four groups of pin 12 pairs, the four groups of pin 12 pairs are respectively a first pin 12 pair, a second pin 12 pair, a third pin 12 pair and a fourth pin 12 pair, and the pins 12 in each group of pin 12 pairs are relatively distributed on the insulating seat 11; wherein the first pin 12 pair includes two first power pins 121 and a first ground pin 122, the first light-emitting chip group 13 and the first driver chip 171 are electrically connected to the first power pin 121, the second light-emitting chip group 14 and the second driver chip 172 are electrically connected to another first power pin 121, and the first driver chip 171 and the second driver chip 172 are respectively electrically connected to the first ground pin 122; the second pin 12 pair includes two first signal input pins 124 and two first signal output pins 123, the first driver chip 171 is electrically connected to the first ground pin 122, and the second signal output pins 124 are electrically connected to the second signal output pins 123. A signal input pin 124 is electrically connected to a first signal output pin 123, and a second driver chip 172 is electrically connected to another first signal input pin 124 and another first signal output pin 123; a third pin 12 pair includes two second signal input pins 128 and two second signal output pins 127, a third driver chip 173 is electrically connected to the second signal input pin 128 and the second signal output pin 127, and a fourth driver chip 174 is electrically connected to another second signal input pin 128 and another second signal output pin 127; a fourth pin 12 pair includes two second power pins 125 and a second ground pin 126, a third light-emitting chip group 15 and a third driver chip 173 are electrically connected to a first power pin 121, a fourth light-emitting chip group 16 and a fourth driver chip 174 are electrically connected to another first power pin 121, and the third driver chip 173 and the fourth driver chip 174 are electrically connected to the second ground pin 126, respectively.

[0076] Thus, the first driving chip 171 and the second driving chip 172, the third driving chip 173 and the third driving chip 174 can be simultaneously Figure 5-7 As shown, the conductive pillars 19 are connected to the corresponding pins on the back to realize power supply and signal control for the two groups of driver chips. At the same time, if the specifications of the four groups of driver chips are different, separate power pins can be set for each of the four driver chips.

[0077] For example, Figures 5 to 7As shown, the insulating seat 11 includes a first end face, and the first grounding pin 122, the first power pin 121, the first signal input pin 124, the first signal output pin 123, the second grounding pin 126, the second power pin 125, the second signal input pin 128, and the second signal output pin 127 have a solid crystal portion formed on the first end face and a welding portion formed on the other end faces of the insulating seat 11; the first light-emitting chip group 13, the second light-emitting chip group 14, the first driving chip 171 and the second driving chip 172 are arranged on the solid crystal portion of any pin 12 among the first grounding pin 122, the first power pin 121, the first signal input pin 124, and the first signal output pin 123; the third light-emitting chip group 15, the fourth light-emitting chip group 16, the third driving chip 173 and the fourth driving chip 174 are arranged on the solid crystal portion of any pin 12 among the second grounding pin 126, the second power pin 125, the second signal input pin 128, and the second signal output pin 127; at least part of the structure of the welding portion is formed with a via structure.

[0078] Furthermore, the light-emitting chips and the driving chips on the four sides of the provided LED lamp bead 10 can be successfully connected, which simplifies the control logic of the provided LED lamp bead 10.

[0079] It should be noted that, in some embodiments, Figure 5 As shown, the first light-emitting chip group 13, the second light-emitting chip group 14, the third light-emitting chip group 15 and the fourth light-emitting chip group 16 each include a plurality of light-emitting chips; wherein the light-emitting chips of the first light-emitting chip group 13 and the light-emitting chips of the second light-emitting chip group 14 are equidistantly spaced on the same solid crystal portion, and the light-emitting chips of the third light-emitting chip group 15 and the light-emitting chips of the fourth light-emitting chip group 16 are equidistantly spaced on the same solid crystal portion.

[0080] It should be noted that, in some embodiments, Figure 5As shown, the crystal-fixing portion provided for the first light-emitting chip group 13 and the second light-emitting chip group 14 includes a first extension portion and a second extension portion perpendicular to the first extension portion between the first light-emitting chip group 13 and the second light-emitting chip group 14, the first extension portion extends toward the direction of the first light-emitting chip group 13, and forms a third extension portion and a fourth extension portion spaced apart from the first extension portion, the second extension portion extends toward the direction of the second light-emitting chip group 14, and forms a fifth extension portion and a sixth extension portion spaced apart from the second extension portion; the crystal-fixing portion provided for the third light-emitting chip group 15 and the fourth light-emitting chip group 16 includes a seventh extension portion and an eighth extension portion perpendicular to the seventh extension portion between the third light-emitting chip group 15 and the fourth light-emitting chip group 16, the seventh extension portion extends toward the direction of the third light-emitting chip group 15, and forms a ninth extension portion spaced apart from the seventh extension portion The eighth extension portion extends toward the fourth light-emitting chip group 16, and an eleventh extension portion and a twelfth extension portion are formed which are spaced apart from the fourth extension portion; wherein the first light-emitting chip group 13 is arranged in the third extension portion, and a plurality of light-emitting chips in the first light-emitting chip group 13 are electrically connected to the first extension portion and the fourth extension portion, respectively; the second light-emitting chip group 14 is arranged in the fifth extension portion, and a plurality of light-emitting chips in the first light-emitting chip group 13 are electrically connected to the second extension portion and the sixth extension portion, respectively; the third light-emitting chip group 15 is arranged in the ninth extension portion, and a plurality of light-emitting chips in the first light-emitting chip group 13 are electrically connected to the seventh extension portion and the tenth extension portion, respectively; the fourth light-emitting chip group 16 is arranged in the eleventh extension portion, and a plurality of light-emitting chips in the fourth light-emitting chip group 16 are electrically connected to the eighth extension portion and the twelfth extension portion, respectively.

[0081] Furthermore, by using multiple extension parts, each solid crystal part of the LED lamp bead 10 forms an "island", which can reduce the stress of the device on the bottom pad of the LED lamp bead 10, avoid the delamination phenomenon at the bottom, increase the peeling path when the stress is released, and improve the reliability of the solder joint.

[0082] It should be noted that, in some embodiments, the crystal-fixing portion provided in the first light-emitting chip group 13 also includes a thirteenth extension portion provided relative to the third extension portion, and the first driver chip 171 is electrically connected to the thirteenth extension portion; the crystal-fixing portion provided in the second light-emitting chip group 14 also includes a fourteenth extension portion provided relative to the fifth extension portion, and the second driver chip 172 is electrically connected to the fourteenth extension portion; the crystal-fixing portion provided in the third light-emitting chip group 15 also includes a fifteenth extension portion provided relative to the ninth extension portion, and the third driver chip 173 is electrically connected to the fifteenth extension portion; the crystal-fixing portion provided in the fourth light-emitting chip group 16 also includes a sixteenth extension portion provided relative to the eleventh extension portion, and the fourth driver chip 174 is electrically connected to the sixteenth extension portion.

[0083] In some embodiments, the first light-emitting chip group 13 is adjacent to the first light-emitting surface; and / or, the second light-emitting chip group 14 is adjacent to the second light-emitting surface; and / or, the third light-emitting chip group 15 is adjacent to the third light-emitting surface; and / or, the fourth light-emitting chip group 16 is adjacent to the fourth light-emitting surface. Figure 5 As shown, by placing the light-emitting chip close to the light-emitting surface, the light-emitting effect of the four sides of the provided LED lamp bead 10 can be improved.

[0084] Please refer to Figure 8 , Figure 8 A method for manufacturing an LED lamp bead provided in an embodiment of the present application is used to manufacture Figures 1 to 7 The LED lamp bead shown, the LED lamp bead 10 includes an insulating seat 11, a plurality of pins 12, a first light-emitting chip group 13, a second light-emitting chip group 14, a third light-emitting chip group 15, a fourth light-emitting chip group 16, at least one driving chip 17 and a packaging glue 18, the pin 12 is arranged on the insulating seat 11, the first light-emitting chip group 13 is arranged on the pin 12 and is electrically connected to the pin 12, the second light-emitting chip group 14 is arranged adjacent to the first light-emitting chip group 13 and is electrically connected to the pin 12, the third light-emitting chip group 15 is arranged on the pin 12 opposite to the first light-emitting chip group 13 and is electrically connected to the pin 12, the fourth light-emitting chip group 16 is arranged opposite to the second light-emitting chip group 14 and is electrically connected to the pin 1 2, the driving chip 17 is arranged on the pin 12, and the driving chip 17 is electrically connected to the first light-emitting chip group 13, the second light-emitting chip group 14, the third light-emitting chip group 15 and the fourth light-emitting chip group 16 respectively. The packaging glue 18 is packaged outside the driving chip 17, the first light-emitting chip group 13, the second light-emitting chip group 14, the third light-emitting chip group 15 and the fourth light-emitting chip group 16, and the packaging glue 18 includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface. The first light-emitting surface is arranged relative to the first light-emitting chip group 13, the second light-emitting surface is arranged relative to the second light-emitting chip group 14, the third light-emitting surface is arranged relative to the third light-emitting chip group 15, and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group 16.

[0085] like Figure 7 As shown, the provided manufacturing method includes steps S201 to S202.

[0086] S201. Use a first glue injection device to perform molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, respectively; wherein the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffused glue layers, and the driving chip is encapsulated in any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer.

[0087] Through the first molding, the provided method can form corresponding light-transmitting adhesive layers on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group, and the fourth light-emitting chip group. Of course, according to actual needs, a diffusion adhesive layer can also be formed, so that the light of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group, and the fourth light-emitting chip group can be emitted to the side.

[0088] S202. Use a second glue injection device to perform molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer; wherein the fifth glue layer is an opaque glue, the fifth glue layer and the first glue layer form a first light-emitting surface, the fifth glue layer and the second glue layer form a second light-emitting surface, the fifth glue layer and the third glue layer form a third light-emitting surface, and the fifth glue layer and the fourth glue layer form a fourth light-emitting surface.

[0089] Since not every surface requires a corresponding light-emitting chip group to emit light, the present application forms an opaque fifth adhesive layer on the outside of each light-transmitting or diffusion adhesive layer through the corresponding positions of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, such as the side, to ensure that each chip group has only one corresponding light-emitting surface, thereby improving the light-emitting effect of the LED lamp beads.

[0090] In some embodiments, the first glue injection device is used for molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, respectively, including: according to the shape of the first glue layer corresponding to the first light-emitting chip group, the first glue injection device is used to mold the outside of the first light-emitting chip group to form the first glue layer; according to the shape of the second glue layer corresponding to the second light-emitting chip group, the first glue injection device is used to mold the outside of the second light-emitting chip group to form the second glue layer; according to the shape of the third glue layer corresponding to the third light-emitting chip group, the first glue injection device is used to mold the outside of the third light-emitting chip group to form the third glue layer; according to the shape of the fourth glue layer corresponding to the fourth light-emitting chip group, the first glue injection device is used to mold the outside of the fourth light-emitting chip group to form the fourth glue layer.

[0091] Furthermore, the provided method can determine the corresponding shape of each glue layer and then quickly mold the corresponding glue layer at the position of the corresponding chip group. At the same time, the corresponding glue layer can also be formed by dispensing. Compared with the method of cutting each glue layer, it can save materials and improve the efficiency of LED lamp bead manufacturing.

[0092] In some embodiments, the first light-emitting surface is located on the side of the first adhesive layer, and the contact surface of the first adhesive layer and the first light-emitting chip group is in a trapezoidal shape; the second light-emitting surface is located on the side of the second adhesive layer, and the contact surface of the second adhesive layer and the second light-emitting chip group is in a trapezoidal shape; the third light-emitting surface is located on the side of the third adhesive layer, and the contact surface of the third adhesive layer and the third light-emitting chip group is in a trapezoidal shape; the fourth light-emitting surface is located on the side of the fourth adhesive layer, and the contact surface of the fourth adhesive layer and the fourth light-emitting chip group is in a trapezoidal shape. By designing the contact surface of the adhesive layer and the chip group in a trapezoidal shape, when the chip group and the adhesive layer form a reflective cup, the effect of any light-emitting chip group emitting light through the corresponding light-emitting surface can be better.

[0093] Exemplarily, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first adhesive layer; and / or, the height of the second light-emitting surface is higher than the height of the surface opposite to the second light-emitting surface in the second adhesive layer; and / or, the height of the third light-emitting surface is higher than the height of the surface opposite to the third light-emitting surface in the third adhesive layer; and / or, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth adhesive layer.

[0094] In some embodiments, the use of a second glue injection device for molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer includes: using the second glue injection device to perform molding on the opposite surface of any glue layer relative to the first glue layer, the second glue layer, the third glue layer or the fourth glue layer to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer.

[0095] The opposite surface means that no matter whether the LED lamp beads are placed horizontally, vertically, forwardly or reversely, glue is squeezed at the cavity on the upper side of any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer, so that an opaque fifth glue layer can be formed without cutting. The fifth glue layer can also be formed by dispensing glue.

[0096] Please refer to Fig. 9 , Fig. 9 is a schematic diagram of the structure of the electronic device 100 provided in the embodiment of the present application, such as Fig. 9 As shown, the electronic device 100 includes the LED lamp bead 10 provided in any embodiment of the present application, thereby enabling the electronic device 100 to be miniaturized.

[0097] In some embodiments, the electronic device 100 is any device such as a fan, a screen, etc., and the embodiment of the present application does not limit the type of the electronic device 100.

[0098] In some embodiments, the electronic device 100 includes a plurality of LED lamp beads 10 , and the plurality of LED lamp beads can be connected in the electronic device 100 at intervals, or a corresponding connection method can be set according to requirements.

[0099] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0100] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0101] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0102] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A method for manufacturing an LED lamp bead, characterized in that: Used to manufacture LED lamp beads, the LED lamp beads include an insulating seat, a plurality of pins, a first light-emitting chip group, a second light-emitting chip group, a third light-emitting chip group, a fourth light-emitting chip group, at least one driver chip and packaging glue, the pins are arranged on the insulating seat, the first light-emitting chip group is arranged on the pins and is electrically connected to the pins, the second light-emitting chip group is arranged on the pins adjacent to the first light-emitting chip group and is electrically connected to the pins, the third light-emitting chip group is arranged on the pins opposite to the first light-emitting chip group and is electrically connected to the pins, the fourth light-emitting chip group is arranged on the pins opposite to the second light-emitting chip group and is electrically connected to the pins, the driver The chip is arranged on the pin, the driving chip is electrically connected to the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group respectively, the packaging glue is encapsulated outside the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, the packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group, the second light-emitting surface is arranged relative to the second light-emitting chip group, the third light-emitting surface is arranged relative to the third light-emitting chip group and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group; the manufacturing method includes: A first glue injection device is used for molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, respectively; wherein the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffusion glue layers, and the driving chip is encapsulated in any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer; A second glue injection device is used for molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer; wherein the fifth glue layer is an opaque glue, the fifth glue layer and the first glue layer form a first light-emitting surface, the fifth glue layer and the second glue layer form a second light-emitting surface, the fifth glue layer and the third glue layer form a third light-emitting surface, and the fifth glue layer and the fourth glue layer form a fourth light-emitting surface; the first light-emitting surface is located on the side of the first glue layer, and the contact surface of the first glue layer and the first light-emitting chip group is in a trapezoidal shape; the second light-emitting surface is located on the side of the second glue layer, and the contact surface of the second glue layer and the second light-emitting chip group is in a trapezoidal shape; the third light-emitting surface is located on the side of the second glue layer, and the contact surface of the second glue layer and the second light-emitting chip group is in a trapezoidal shape; The light surface is located at the side of the third adhesive layer, and the contact surface of the third adhesive layer and the third light-emitting chip group is in a trapezoidal shape; the fourth light-emitting surface is located at the side of the fourth adhesive layer, and the contact surface of the fourth adhesive layer and the fourth light-emitting chip group is in a trapezoidal shape; wherein, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first adhesive layer; and / or, the height of the second light-emitting surface is higher than the height of the surface opposite to the second light-emitting surface in the second adhesive layer; and / or, the height of the third light-emitting surface is higher than the height of the surface opposite to the third light-emitting surface in the third adhesive layer; and / or, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth adhesive layer.

2. The method according to claim 1, characterized in that The method of using the first glue injection device for molding to form a first glue layer, a second glue layer, a third glue layer and a fourth glue layer on the outside of the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group respectively includes: According to the shape of the first adhesive layer corresponding to the first light-emitting chip group, the first adhesive layer is molded on the outer side of the first light-emitting chip group by the first adhesive injection device to form the first adhesive layer; According to the shape of the second adhesive layer corresponding to the second light-emitting chip group, the first adhesive injection device is used to perform molding on the outer side of the second light-emitting chip group to form the second adhesive layer; According to the shape of the third adhesive layer corresponding to the third light-emitting chip group, molding is performed on the outer side of the third light-emitting chip group by the first adhesive injection device to form the third adhesive layer; According to the shape of the fourth adhesive layer corresponding to the fourth light-emitting chip group, the first adhesive injection device is used to perform molding on the outer side of the fourth light-emitting chip group to form the fourth adhesive layer.

3. The method according to claim 1, characterized in that The method of using the second glue injection device for molding to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer includes: The second glue injection device is used to perform molding on the opposite surface of any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer to form a fifth glue layer outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer.

4. An LED lamp bead, characterized in that: include: Insulation seat; A plurality of pins, wherein the pins are arranged on the insulating seat; a first light-emitting chip group, the first light-emitting chip group being disposed on the pin and electrically connected to the pin; a second light-emitting chip group, the second light-emitting chip group being disposed adjacent to the first light-emitting chip group on the pin and being electrically connected to the pin; a third light-emitting chip group, the third light-emitting chip group being arranged on the pin opposite to the first light-emitting chip group and being electrically connected to the pin; a fourth light-emitting chip group, the fourth light-emitting chip group being arranged on the pin opposite to the second light-emitting chip group and being electrically connected to the pin; at least one driving chip, the driving chip being disposed on the pins and being electrically connected to the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group, and the fourth light-emitting chip group respectively; Packaging glue, the packaging glue is packaged outside the driving chip, the first light-emitting chip group, the second light-emitting chip group, the third light-emitting chip group and the fourth light-emitting chip group, the packaging glue includes a first light-emitting surface, a second light-emitting surface, a third light-emitting surface and a fourth light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting chip group, the second light-emitting surface is arranged relative to the second light-emitting chip group, the third light-emitting surface is arranged relative to the third light-emitting chip group and the fourth light-emitting surface is arranged relative to the fourth light-emitting chip group; the driving chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, the second light-emitting chip group to emit light through the second light-emitting surface, the third light-emitting chip group to emit light through the third light-emitting surface and the fourth light-emitting chip group to emit light through the fourth light-emitting surface; Wherein, the packaging glue includes a first glue layer, a second glue layer, a third glue layer, a fourth glue layer and a fifth glue layer; the first glue layer is encapsulated outside the first light-emitting chip group, and the first glue layer includes the first light-emitting surface; the second glue layer is encapsulated outside the second light-emitting chip group, and the second glue layer includes the second light-emitting surface; the third glue layer is encapsulated outside the third light-emitting chip group, and the third glue layer includes the third light-emitting surface; the fourth glue layer is encapsulated outside the fourth light-emitting chip group, and the fourth glue layer includes the fourth light-emitting surface; the fifth glue layer is encapsulated outside the first glue layer, the second glue layer, the third glue layer and the fourth glue layer except the first light-emitting surface, the second light-emitting surface, the third light-emitting surface and the fourth light-emitting surface; the first glue layer, the second glue layer, the third glue layer and the fourth glue layer are transparent glue layers or diffusion glue layers; the fifth glue layer is an opaque glue layer; the driving chip is encapsulated in any one of the first glue layer, the second glue layer, the third glue layer or the fourth glue layer; the first light-emitting surface is located on the side of the first glue layer, and the contact surface of the first glue layer and the first light-emitting chip group is a trapezoid; The second light-emitting surface is located at the side of the second adhesive layer, and the contact surface of the second adhesive layer and the second light-emitting chip group is in a trapezoidal shape; the third light-emitting surface is located at the side of the third adhesive layer, and the contact surface of the third adhesive layer and the third light-emitting chip group is in a trapezoidal shape; the fourth light-emitting surface is located at the side of the fourth adhesive layer, and the contact surface of the fourth adhesive layer and the fourth light-emitting chip group is in a trapezoidal shape; wherein, the height of the first light-emitting surface is higher than the height of the surface opposite to the first light-emitting surface in the first adhesive layer; and / or, the height of the second light-emitting surface is higher than the height of the surface opposite to the second light-emitting surface in the second adhesive layer; and / or, the height of the third light-emitting surface is higher than the height of the surface opposite to the third light-emitting surface in the third adhesive layer; and / or, the height of the fourth light-emitting surface is higher than the height of the surface opposite to the fourth light-emitting surface in the fourth adhesive layer.

5. The LED lamp bead according to claim 4, characterized in that: The pins provided by the first light-emitting chip group are connected to the pins provided by the second light-emitting chip group; and / or, The pins provided on the third light-emitting chip group are connected to the pins provided on the fourth light-emitting chip group.

6. The LED lamp bead according to claim 4, characterized in that: The driving chip includes a first driving chip, a second driving chip, a third driving chip and a fourth driving chip; the plurality of pins include four groups of pin pairs, the four groups of pin pairs are respectively a first pin pair, a second pin pair, a third pin pair and a fourth pin pair, and the pins in each group of the pin pairs are relatively distributed on the insulating seat; The first pin pair includes two first power pins and one first ground pin, the first light-emitting chip group and the first driver chip are electrically connected to the first power pin, the second light-emitting chip group and the second driver chip are electrically connected to another first power pin, and the first driver chip and the second driver chip are electrically connected to the first ground pin respectively; The second pin pair includes two first signal input pins and two first signal output pins, the first driver chip is electrically connected to the first signal input pins and the first signal output pins, and the second driver chip is electrically connected to another first signal input pin and another first signal output pin; The third pin pair includes two second signal input pins and two second signal output pins, the third driver chip is electrically connected to the second signal input pin and the second signal output pin, and the fourth driver chip is electrically connected to another second signal input pin and another second signal output pin; The fourth pin pair includes two second power pins and one second ground pin, the third light-emitting chip group and the third driver chip are electrically connected to the first power pin, the fourth light-emitting chip group and the fourth driver chip are electrically connected to another first power pin, and the third driver chip and the fourth driver chip are electrically connected to the second ground pin respectively.

7. The LED lamp bead according to claim 6, characterized in that: The insulating seat comprises a first end surface, and the first ground pin, the first power pin, the first signal input pin, the first signal output pin, the second ground pin, the second power pin, the second signal input pin, and the second signal output pin have a crystal bonding portion formed on the first end surface and a welding portion formed on other end surfaces of the insulating seat; The first light-emitting chip group, the second light-emitting chip group, the first driving chip and the second driving chip are arranged on the die-bonding portion of any one of the first ground pin, the first power pin, the first signal input pin and the first signal output pin; The third light-emitting chip group, the fourth light-emitting chip group, the third driving chip and the fourth driving chip are arranged on the solid crystal part of any one of the second ground pin, the second power pin, the second signal input pin and the second signal output pin; at least part of the structure of the welding part is formed with a via structure.

8. The LED lamp bead according to claim 7, characterized in that: The first light emitting chip group, the second light emitting chip group, the third light emitting chip group and the fourth light emitting chip group each include a plurality of light emitting chips; The light-emitting chips of the first light-emitting chip group and the light-emitting chips of the second light-emitting chip group are equidistantly arranged on the same solid crystal portion, and the light-emitting chips of the third light-emitting chip group and the light-emitting chips of the fourth light-emitting chip group are equidistantly arranged on the same solid crystal portion.

9. The LED lamp bead according to claim 8, characterized in that: The die-bonding portion provided for the first light-emitting chip group and the second light-emitting chip group includes a first extension portion and a second extension portion perpendicular to the first extension portion between the first light-emitting chip group and the second light-emitting chip group, the first extension portion extends toward the first light-emitting chip group and is provided with a third extension portion and a fourth extension portion spaced apart from the first extension portion, the second extension portion extends toward the second light-emitting chip group and is provided with a fifth extension portion and a sixth extension portion spaced apart from the second extension portion; The die-bonding portion provided for the third light-emitting chip group and the fourth light-emitting chip group includes a seventh extension portion and an eighth extension portion perpendicular to the seventh extension portion between the third light-emitting chip group and the fourth light-emitting chip group, the seventh extension portion extends toward the direction of the third light-emitting chip group and is formed with a ninth extension portion and a tenth extension portion spaced apart from the seventh extension portion, the eighth extension portion extends toward the direction of the fourth light-emitting chip group and is formed with an eleventh extension portion and a twelfth extension portion spaced apart from the fourth extension portion; Wherein, the first light-emitting chip group is arranged in the third extension part, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the first extension part and the fourth extension part respectively; The second light-emitting chip group is arranged in the fifth extension part, and the plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the second extension part and the sixth extension part respectively; The third light-emitting chip group is disposed in the ninth extension portion, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the seventh extension portion and the tenth extension portion respectively; The fourth light-emitting chip group is disposed in the eleventh extending portion, and a plurality of light-emitting chips in the fourth light-emitting chip group are electrically connected to the eighth extending portion and the twelfth extending portion, respectively.

10. The LED lamp bead according to claim 9, characterized in that: The die-bonding portion provided in the first light-emitting chip group further includes a thirteenth extending portion provided opposite to the third extending portion, and the first driving chip is electrically connected to the thirteenth extending portion; The crystal-fixing portion provided in the second light-emitting chip group further includes a fourteenth extending portion provided opposite to the fifth extending portion, and the second driving chip is electrically connected to the fourteenth extending portion; The die-bonding portion provided in the third light-emitting chip group further includes a fifteenth extension portion provided opposite to the ninth extension portion, and the third driving chip is electrically connected to the fifteenth extension portion; The die-bonding portion of the fourth light-emitting chip group further includes a sixteenth extending portion disposed opposite to the eleventh extending portion, and the fourth driving chip is electrically connected to the sixteenth extending portion.

11. The LED lamp bead according to claim 4, characterized in that: The first light-emitting chip group is adjacent to the first light-emitting surface; and / or, The second light-emitting chip group is adjacent to the second light-emitting surface; and / or, The third light-emitting chip group is adjacent to the third light-emitting surface; and / or, The fourth light-emitting chip group is adjacent to the fourth light-emitting surface.

12. An electronic device, characterized in that: The invention comprises at least one LED lamp bead as claimed in any one of claims 4 to 11.

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