A wafer airtight drying device

Abstract

The present invention relates to the field of wafer drying, and specifically relates to a wafer airtight drying device, which includes a mounting frame and a U-shaped square tube arranged on the mounting frame. A U-shaped accommodating groove for accommodating a synchronous belt is arranged inside the U-shaped square tube. An adjusting mechanism for driving the synchronous belt to rotate is arranged on a horizontal plate. A plurality of fixing mechanisms for fixing wafers are arranged on the synchronous belt. Each group of fixing mechanisms includes a fixing ring and a rotating ring coaxially arranged inside the fixing ring. A plurality of claw fingers are radially arranged along the axis direction inside the rotating ring. A plurality of sector blades are hinged along the axis direction at one end of the rotating ring; An air supply mechanism for conveying gas into the U-shaped square tube is arranged on the U-shaped square tube, and a plugging mechanism is also arranged at one end of the U-shaped square tube; This application can enable the wafer to contact the reciprocatingly shaking cleaning liquid in a relatively airtight environment, and dry the wafer through the air supply mechanism, thereby ensuring the wafer drying efficiency and avoiding secondary contamination of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of wafer drying, and particularly to a wafer closed drying device. Background Art

[0002] A wafer is a thin slice of semiconductor, such as crystalline silicon (c-Si), used to manufacture integrated circuits. Simply put, a wafer is a silicon wafer made of silicon. Because it is circular, it is called a wafer, and it is mainly used for silicon semiconductor integrated circuits. In order to be able to correspond to the severely uneven and complex microstructures of the surface, after the wafer is manufactured, it also needs to be cleaned and dried to significantly reduce the residual contamination amount. However, the existing drying equipment needs to transfer the wet wafer to the drying equipment again for drying after wet cleaning of the wafer. However, during the transfer process, the wet surface of the wafer is easily recontaminated, and it is difficult to ensure its reliability in use after drying.

[0003] Chinese Patent: CN110864536B discloses a rotary lifting type wafer dryer, including a base, a vertical plate, a sprocket assembly, a driving member, and a chain; the fixing mechanism includes a rotating arm, a turntable, and a fixing seat; the fixing seat is fixedly connected to the chain; the vertical plate is provided with a rotation stopping plate at the top of the chain; the vertical plate is provided with a rotating guide plate at the bottom of the chain; the base is provided with a water tank; and a jetting mechanism is arranged in the water tank.

[0004] In this application, the wafer is driven by the chain into the water tank for cleaning and dried by the jetting mechanism. However, in the whole process, only relying on the hanging mechanism to rotate in the water tank to clean the wafer, the cleaning effect is not good. And during the drying process, the jetting mechanism blows the cleaning liquid in the water tank, which may cause the cleaning liquid in the water tank to splash and at the same time affect the drying effect of the wafer. Summary of the Invention

[0005] Aiming at the problems existing in the prior art, a wafer closed drying device is provided. Through the cooperation of a U-shaped square tube, a gas supply mechanism, and a fixing mechanism, when the wafer enters the inside of the U-shaped square tube, it can rotate by itself, and cooperate with the reciprocally shaking cleaning liquid, so as to improve the cleaning effect on the wafer, and the drying process is in a relatively closed environment, thereby avoiding the secondary contamination of the wafer.

[0006] In order to solve the problems of the prior art, the technical solution adopted by the present invention is as follows:

[0007] A wafer airtight drying device, comprising a mounting frame and a U-shaped square tube arranged on the mounting frame. A horizontal plate is provided at the upper end of the mounting frame, and two rectangular grooves for accommodating the U-shaped square tube are arranged on the horizontal plate. Both ends of the U-shaped square tube are arranged in the corresponding rectangular grooves. The device further comprises a synchronous belt, an adjusting mechanism, a fixing mechanism, an air supply mechanism and a blocking mechanism. A U-shaped accommodating groove for accommodating the synchronous belt is arranged inside the U-shaped square tube. The adjusting mechanism is arranged on the horizontal plate and is used to drive the synchronous belt to rotate. There are multiple groups of fixing mechanisms, which are arranged on the synchronous belt and are used to fix the wafers. Each group of fixing mechanisms includes a fixing ring, a connecting piece and a rotating ring. The fixing ring is connected to the synchronous belt through the connecting piece. The rotating ring is coaxially and rotatably arranged inside the fixing ring. An adjusting ring is rotatably arranged between the rotating ring and the fixing ring. A plurality of abutting rods that can move synchronously with the rotation of the adjusting ring are radially arranged inside the rotating ring. A claw is arranged at one end of each abutting rod close to the axis of the rotating ring. A plurality of hinge grooves are radially arranged at one end of the rotating ring. A fan-shaped blade is hinged in each hinge groove. An axial ring is coaxially arranged on the outer wall of the rotating ring. A plurality of first hinge parts are radially arranged at one end of the axial ring. A second hinge part is arranged on each fan-shaped blade. The first hinge part and the corresponding second hinge part are connected by a hinge rod. A water inlet for adding cleaning liquid is arranged on one outer wall of the U-shaped square tube. The air supply mechanism is arranged on one side of the U-shaped square tube away from the water inlet and is used to convey gas into the U-shaped square tube. The blocking mechanism is arranged at one end of the U-shaped square tube close to the air supply mechanism and can intermittently block and open the open end of the U-shaped square tube as the synchronous belt rotates.

[0008] Preferably, the adjusting mechanism includes a synchronous pulley and a driving member. There are two synchronous pulleys, which are rotatably arranged on the top of the horizontal plate and are mirror-symmetric with respect to the center of the horizontal plate. The synchronous belt is sleeved on the two synchronous pulleys, and the synchronous belt between the two synchronous pulleys is in a horizontal state.

[0009] The driving member is arranged on the horizontal plate and is used to drive one of the synchronous pulleys to rotate.

[0010] Preferably, each set of fixing mechanisms further includes a sliding cylinder; two arc-shaped guiding grooves are mirror-symmetrically arranged on the inner wall of the fixing ring, two guiding columns cooperating with the arc-shaped guiding grooves are mirror-symmetrically arranged on the outer wall of the adjusting ring, the guiding columns are slidably arranged in the corresponding arc-shaped guiding grooves, and temporary storage grooves for accommodating the guiding columns are arranged at both ends of each arc-shaped guiding groove; a plurality of sliding holes are radially arranged on the inner wall of the rotating ring, there are a plurality of sliding cylinders, the sliding cylinders are slidably arranged in the corresponding sliding holes, the open end of each sliding cylinder faces the center of the corresponding rotating ring, each abutting rod is slidably arranged in the corresponding sliding cylinder, two guiding grooves are mirror-symmetrically arranged on the inner wall of each sliding cylinder, guiding blocks cooperating with the guiding grooves are mirror-symmetrically arranged on the outer wall of the end of each abutting rod extending into the sliding cylinder, the guiding blocks are slidably arranged in the corresponding guiding grooves, and a pushing spring is further arranged inside each sliding cylinder, the pushing spring is located between the corresponding abutting rod and the inner wall of the bottom of the corresponding sliding cylinder; a limiting ring for restricting the position of the abutting rod is further arranged at the open end of each sliding cylinder; a connecting disc is further arranged at the bottom of each sliding cylinder, a compression spring is sleeved on each sliding cylinder, the compression spring is located between the corresponding connecting disc and the outer wall of the rotating ring, a bull's-eye wheel is further arranged at the end of the connecting disc away from the sliding cylinder, and an annular inclined surface cooperating with the bull's-eye wheel is arranged on the inner wall of each adjusting ring.

[0011] Preferably, each set of connecting members includes a mounting base, a rotating shaft, and a winding wheel; the mounting base is arranged on the synchronous belt, the rotating shaft is rotatably arranged on the mounting base, an adjusting block is arranged at one end of the rotating shaft away from the mounting base, a flipping strip is arranged on the outer wall of each fixing ring, reset rods are arranged on both sides of one end of each flipping strip away from the fixing ring, a rectangular notch is arranged on each adjusting block, receiving holes for receiving the reset rods are arranged on the inner walls of both sides of the rectangular notch, the reset rods are rotatably arranged in the corresponding receiving holes, and a first reset torsion spring is arranged on each reset rod; the winding wheel is arranged on the rotating shaft, guiding plates are arranged on both sides of the rectangular notch, a wire guiding hole is arranged on the guiding plate, traction ropes are arranged on both sides of each flipping strip, and the traction ropes are wound around the winding wheel through the corresponding wire guiding holes. A second reset torsion spring is also arranged on each rotating shaft, and the second reset torsion spring is located between the corresponding winding wheel and the mounting base; two reaction rods are arranged symmetrically at the bottom of each winding wheel, two reaction plates cooperating with the reaction rods are arranged on the horizontal plate, the two reaction plates are arranged on both sides of the conveying direction of the synchronous belt and are centrosymmetric with respect to the center of the horizontal plate; a horizontal ring is further arranged inside the fixing ring, the horizontal ring abuts against the adjusting ring and is located at one end of the rotating ring away from the hinge groove, the axial ring is rotatably arranged inside the horizontal ring, two guiding plates are arranged symmetrically on the outer wall of the horizontal ring, two vertical grooves are arranged symmetrically on the inner wall of the fixing ring, a connecting rod is arranged in each vertical groove, the guiding plate is slidably arranged in the corresponding vertical groove, a guiding hole for the connecting rod to pass through is arranged on the guiding plate, and a telescopic spring for tightly attaching the adjusting ring to the corresponding horizontal ring is sleeved on each connecting rod; a horizontal strip for placing a wafer is further arranged on each sector blade; a rotating mechanism for rotating the adjusting ring is further arranged on each fixing ring.

[0012] Preferably, each set of rotating mechanisms includes a C-shaped mounting frame and a rotating shaft; the C-shaped mounting frame is arranged at the edge of one end of the fixing ring close to the adjusting ring and on the side away from the flipping strip, a rotating hole is arranged at the center of the top of the C-shaped mounting frame, the rotating shaft is rotatably arranged in the rotating hole, a rotating disk is arranged at one end of the rotating shaft inside the C-shaped mounting frame, a plurality of first connecting columns are arranged radially on the outer wall of the rotating disk, a plurality of second connecting columns cooperating with the first connecting columns are arranged along the axial direction at one end of each adjusting ring away from the horizontal ring, and a friction wheel is arranged at one end of the rotating shaft outside the C-shaped mounting frame.

[0013] Preferably, a plurality of water passing holes are arranged radially at one end of the horizontal ring, a plurality of flushing holes are arranged radially on the inner wall of the rotating ring, and the flushing holes are in a flared shape.

[0014] Preferably, the air supply mechanism includes an air supply box and an air heater; bar-shaped inclined grooves for accommodating the air supply box are provided on both sides of one end of the U-shaped square tube close to the plugging mechanism, the air supply box is arranged in the corresponding bar-shaped inclined groove, a bar-shaped air outlet is provided at one end of each air supply box close to the inside of the U-shaped square tube, the air heater is arranged on the mounting frame, and the air heater supplies air into the corresponding air supply box through a connecting pipe.

[0015] Preferably, the plugging mechanism includes a plugging plate; there are two plugging plates, and turning rods are provided at both ends of each plugging plate along the length direction. Mounting holes for accommodating the turning rods are provided on both inner walls of one end of the U-shaped square tube close to the air heater, the turning rods are rotatably arranged in the corresponding mounting holes, and a third return torsion spring is arranged on each turning rod.

[0016] Preferably, two flow guide pipes communicating with both ends of the U-shaped square tube are further provided on the U-shaped square tube, the flow guide pipes are inclined, and a first one-way valve is provided on each flow guide pipe.

[0017] Preferably, a drain pipe is provided at the lower end of the U-shaped square tube, and a second one-way valve is provided on the drain pipe.

[0018] The beneficial effects of this application compared with the prior art are as follows:

[0019] 1. Through the cooperation of the U-shaped square tube, the synchronous belt and the fixing mechanism, this application can continuously convey the wafer into the U-shaped square tube. Through the cooperation of multiple fan-shaped blades, when the wafer contacts the cleaning liquid inside the U-shaped square tube, it can not only disturb the cleaning liquid inside the U-shaped square tube but also drive the wafer to rotate, thereby improving the cleaning effect. And during the cleaning and drying processes, it is in a relatively sealed environment, so as to avoid the situation of secondary contamination of the wafer.

[0020] 2. Through the setting of the U-shaped square tube, the air supply mechanism can not only dry the wafer, but also, with the cooperation of the plugging mechanism, make the cleaning liquid located in the U-shaped square tube sway back and forth, thereby improving the cleaning effect on the wafer. And through the flared flushing holes, the cleaning liquid can be shunted, so that it can clean the edge of the wafer. When it collides with the cleaning liquid swaying back and forth inside the U-shaped square tube, it can further improve the cleaning effect on the wafer.

[0021] 3. By providing the flow guide pipes, the first one-way valves on the flow guide pipes can prevent the leakage of high-temperature gas. When the two plugging plates are opened, the cleaning liquid entering the flow guide pipes can perform secondary flushing on the wafer, thereby avoiding the residue of dirt on the wafer.

[0022] 3. The present application uses the cooperation of the mounting seat, the rotating shaft and the winding wheel to enable the fixing ring to be set in a horizontal state. The multiple horizontal bars on the fan-shaped blades can facilitate the staff to place the wafers. By rotating the adjusting ring, the multiple sliding cylinders can be synchronously moved toward the direction close to the wafer. The claws set on the resistance rod can fix wafers of different specifications, thereby ensuring the stability of the wafers during the cleaning and drying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a front view of a wafer closed drying device;

[0024] Figure 2 It is a three-dimensional diagram of a wafer closed drying device;

[0025] Figure 3 yes Figure 2 A partial enlarged view of the middle part;

[0026] Figure 4 yes Figure 2 A partial enlarged view of point B in the middle;

[0027] Figure 5 is a plan cross-sectional view of a wafer closed drying device;

[0028] Figure 6 It is a three-dimensional fixed mechanism in a wafer closed drying device. Figure 1 ;

[0029] Figure 7 yes Figure 6 A partial enlarged view of point C in the middle;

[0030] Figure 8 It is a three-dimensional fixed mechanism in a wafer closed drying device. Figure 2 ;

[0031] Figure 9 yes Figure 8 A partial enlarged view of point D in the middle;

[0032] Figure 10 yes Figure 8 A partial enlarged view of point E in the middle;

[0033] Figure 11 It is a three-dimensional cross-sectional view of a fixing mechanism in a wafer closed drying device;

[0034] Figure 12 yes Figure 11 A partial enlarged view of point F in the middle;

[0035] Figure 13 It is a partial three-dimensional decomposition of the fixing mechanism in the wafer closed drying device Figure 1 ;

[0036] Figure 14 is Figure 13 The partial enlarged view at position G in

[0037] Figure 15 is Figure 13 The partial enlarged view at position H in

[0038] Figure 16 is a partial three - dimensional exploded view of the fixing mechanism in a wafer airtight drying device Figure 2 ;

[0039] Figure 17 is a three - dimensional view of the air supply mechanism in a wafer airtight drying device

[0040] The reference numerals in the figure are:

[0041] 1 - mounting frame; 11 - horizontal plate; 12 - rectangular groove; 13 - reaction plate;

[0042] 2 - U - shaped square pipe; 21 - U - shaped accommodating groove; 22 - water filling port; 23 - strip - shaped inclined groove; 24 - diversion pipe; 25 - first one - way valve; 26 - mounting hole; 27 - drain pipe; 28 - second one - way valve;

[0043] 3 - synchronous belt;

[0044] 4 - adjusting mechanism; 41 - synchronous pulley; 42 - driving part;

[0045] 5 - fixing mechanism; 51 - fixing ring; 511 - arc - shaped guiding groove; 512 - temporary storage groove; 513 - flipping strip; 5131 - reset rod; 5132 - first reset torsion spring; 514 - towing rope; 515 - horizontal ring; 5151 - guiding plate; 5152 - guiding hole; 5153 - water - passing hole; 516 - vertical groove; 517 - connecting rod; 518 - telescopic spring; 52 - adjusting ring; 521 - guiding column; 522 - annular inclined surface; 523 - second connecting column; 53 - connecting part; 531 - mounting seat; 532 - rotating shaft; 5321 - adjusting block; 5322 - rectangular notch; 5323 - accommodating hole; 5324 - guiding plate; 5325 - rope - guiding hole; 5326 - second reset torsion spring; 533 - winding wheel; 5331 - reaction rod; 54 - rotating ring; 541 - hinged groove; 542 - fan - shaped blade; 5421 - second hinged part; 5422 - hinged rod; 5423 - horizontal strip; 543 - axial ring; 5431 - first hinged part; 544 - sliding hole; 545 - flushing hole; 55 - resisting rod; 551 - claw; 552 - guiding block; 56 - sliding cylinder; 561 - guiding groove; 562 - pushing spring; 563 - limiting ring; 564 - connecting disk; 565 - compression spring; 566 - bull - eye wheel;

[0046] 6 - Air supply mechanism; 61 - Air supply box; 611 - Strip-shaped air outlet; 62 - Air heater; 621 - Connecting pipe;

[0047] 7 - Sealing mechanism; 71 - Sealing plate; 72 - Flipping rod; 73 - Third return torsion spring;

[0048] 8 - Rotating mechanism; 81 - C-shaped mounting frame; 82 - Rotating shaft; 821 - Rotating disk; 822 - First connecting column; 823 - Friction wheel. Detailed implementation manners

[0049] To further understand the features, technical means, specific purposes, and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0050] See Figures 1 to 17 As shown, a wafer airtight drying device includes a mounting frame 1 and a U-shaped square pipe 2 provided on the mounting frame 1. A horizontal plate 11 is provided at the upper end of the mounting frame 1, and two rectangular grooves 12 for accommodating the U-shaped square pipe 2 are provided on the horizontal plate 11. Both ends of the U-shaped square pipe 2 are arranged in the corresponding rectangular grooves 12. It further includes a synchronous belt 3, an adjusting mechanism 4, a fixing mechanism 5, an air supply mechanism 6, and a sealing mechanism 7. A U-shaped accommodating groove 21 for accommodating the synchronous belt 3 is provided inside the U-shaped square pipe 2. The adjusting mechanism 4 is provided on the horizontal plate 11 and is used to drive the synchronous belt 3 to rotate. There are multiple groups of fixing mechanisms 5, and the fixing mechanisms 5 are provided on the synchronous belt 3 and are used to fix the wafers. Each group of fixing mechanisms 5 includes a fixing ring 51, a connecting member 53, and a rotating ring 54. The fixing ring 51 is connected to the synchronous belt 3 through the connecting member 53. The rotating ring 54 is coaxially and rotatably arranged inside the fixing ring 51. An adjusting ring 52 is rotatably arranged between the rotating ring 54 and the fixing ring 51. A plurality of abutting rods 55 that can move synchronously with the rotation of the adjusting ring 52 are radially arranged inside the rotating ring 54. A claw 551 is provided at one end of each abutting rod 55 close to the axis of the rotating ring 54. A plurality of hinge grooves 541 are radially arranged at one end of the rotating ring 54, and a sector blade 542 is hinged in each hinge groove 541. An axial ring 543 is coaxially arranged on the outer wall of the rotating ring 54. A plurality of first hinge parts 5431 are radially arranged at one end of the axial ring 543. A second hinge part 5421 is provided on each sector blade 542, and the first hinge part 5431 and the corresponding second hinge part 5421 are connected by a hinge rod 5422. A water filling port 22 for adding cleaning liquid is provided on one outer wall of the U-shaped square pipe 2. The air supply mechanism 6 is provided on the side of the U-shaped square pipe 2 away from the water filling port 22 and is used to supply gas into the U-shaped square pipe 2. The sealing mechanism 7 is provided at one end of the U-shaped square pipe 2 close to the air supply mechanism 6 and can intermittently seal and open the open end of the U-shaped square pipe 2 as the synchronous belt 3 rotates.

[0051] The U-shaped square tube 2 is vertically arranged on the mounting frame 1, and the U-shaped accommodating groove 21 is arranged on the inner wall of the U-shaped square tube 2 near the center, so that the synchronous belt 3 can rotate inside the U-shaped square tube 2 with the cooperation of the adjusting mechanism 4. The staff conveys the cleaning liquid into the U-shaped square tube 2 through the water filling port 22. After the cleaning liquid is injected, the staff places the wafer at the center of the rotating ring 54 and rotates the adjusting ring 52, so that multiple abutting rods 55 move synchronously towards the axis direction of the rotating ring 54. The claws 551 arranged on the abutting rods 55 can limit the wafer so that the wafer is coaxially arranged inside the rotating ring 54. Subsequently, the staff adjusts the axial ring 543, and the axial ring 543 drives multiple fan-shaped blades 542 to flip through multiple hinge rods 5422, so that multiple fan-shaped blades 542 can form a channel for the cleaning liquid to pass through between the fixed ring 51 and the rotating ring 54. As the synchronous belt 3 rotates, the wafer enters the U-shaped square tube 2 from the end of the U-shaped square tube 2 far away from the blocking mechanism 7, and the cleaning liquid can clean the surface of the wafer. Due to the arrangement of multiple fan-shaped blades 542, the fan-shaped blades 542 can disturb the cleaning liquid and at the same time make the wafer rotate, thereby improving the cleaning effect of the wafer. And because the blocking mechanism 7 blocks one end of the U-shaped square tube 2 close to the air supply mechanism 6, with the cooperation of the air supply mechanism 6 and the blocking mechanism 7, the blocking mechanism 7 intermittently blocks and opens the open end of the U-shaped square tube 2 as the synchronous belt 3 rotates. The air supply mechanism 6 can continuously convey high-temperature nitrogen into the U-shaped square tube 2, so that the cleaning liquid located inside the U-shaped square tube 2 can move back and forth inside the U-shaped square tube 2, and can comprehensively wash both sides of the wafer, thereby further improving the cleaning effect of the wafer. When the cleaned wafer moves to the end of the U-shaped square tube 2 close to the air supply mechanism 6, with the cooperation of the blocking mechanism 7, the wafer can be dried in a relatively airtight state, thereby avoiding secondary pollution of the wafer during the drying process. And because of the arrangement of the fan-shaped blades 542, the wafer can rotate during the drying process, thereby further improving the drying effect of the wafer. As the dried wafer moves to the horizontal plate 11, the staff takes out the dried wafer, thus realizing continuous cleaning and drying of the wafer.

[0052] See Figure 2 and Figure 3 As shown in FIGS. and

[0052] , the adjusting mechanism 4 includes a synchronous pulley 41 and a driving member 42; there are two synchronous pulleys 41, and the two synchronous pulleys 41 are rotatably arranged on the top of the horizontal plate 11 and are mirror-symmetrically arranged relative to the center of the horizontal plate 11. The synchronous belt 3 is sleeved on the two synchronous pulleys 41, and the synchronous belt 3 between the two synchronous pulleys 41 is in a horizontal state; the driving member 42 is arranged on the horizontal plate 11 and is used to drive one of the synchronous pulleys 41 to rotate.

[0053] Both of the two synchronous pulleys 41 are rotatably arranged on the top of the horizontal plate 11. The driving member 42 is used to drive any one of the synchronous pulleys 41 to rotate. The two synchronous pulleys 41 make the synchronous belt 3 located above the horizontal plate 11 be arranged in a horizontal state, so as to facilitate the staff to place and remove the wafers. The driving member 42 is preferably a servo motor, so as to facilitate the control of the movement of the synchronous belt 3.

[0054] See Figure 13 and Figure 16 As shown, each set of fixing mechanisms 5 further includes a sliding cylinder 56; two arc-shaped guiding grooves 511 are mirror-symmetrically arranged on the inner wall of the fixing ring 51, two guiding columns 521 that cooperate with the arc-shaped guiding grooves 511 are mirror-symmetrically arranged on the outer wall of the adjusting ring 52, and the guiding columns 521 are slidably arranged in the corresponding arc-shaped guiding grooves 511. Temporary storage grooves 512 for accommodating the guiding columns 521 are arranged at both ends of each arc-shaped guiding groove 511; a plurality of sliding holes 544 are radially arranged on the inner wall of the rotating ring 54. There are a plurality of sliding cylinders 56, and the sliding cylinders 56 are slidably arranged in the corresponding sliding holes 544. The open end of each sliding cylinder 56 faces the center of the corresponding rotating ring 54. Each abutting rod 55 is slidably arranged in the corresponding sliding cylinder 56. Two guiding grooves 561 are mirror-symmetrically arranged on the inner wall of each sliding cylinder 56. Guide blocks 552 that cooperate with the guiding grooves 561 are mirror-symmetrically arranged on the outer wall of the end of each abutting rod 55 extending into the sliding cylinder 56, and the guide blocks 552 are slidably arranged in the corresponding guiding grooves 561. A pushing spring 562 is further arranged inside each sliding cylinder 56, and the pushing spring 562 is located between the corresponding abutting rod 55 and the inner wall of the bottom of the corresponding sliding cylinder 56; a limiting ring 563 for limiting the position of the abutting rod 55 is further arranged at the open end of each sliding cylinder 56; a connecting disc 564 is further arranged at the bottom of each sliding cylinder 56, and a compression spring 565 is sleeved on each sliding cylinder 56. The compression spring is located between the corresponding connecting disc 564 and the outer wall of the rotating ring 54. A bull's-eye wheel 566 is further arranged at the end of the connecting disc 564 away from the sliding cylinder 56. An annular inclined surface 522 that cooperates with the bull's-eye wheel 566 is arranged on the inner wall of each adjusting ring 52.

[0055] In the state where the wafer is not fixed, the guiding columns on the outer wall of the adjusting ring 52 are located in the temporary storage grooves 512 far from the adjusting ring 52. At this time, the bull's-eye wheels 566 on the sliding cylinders 56 are closely attached to the annular inclined surfaces 522 of the corresponding adjusting rings 52 under the elastic force of the compression springs 565, so that a plurality of clamping jaws can provide an avoidance space for the placement of the wafer. The setting of the limiting ring 563 can prevent the abutting rod 55 from being pushed out of the sliding cylinder 56 by the elastic force of the pushing spring 562;

[0056] When it is necessary to clamp the wafer, the staff places the wafer inside the rotating ring 54 and rotates the adjusting ring 52. The guiding posts 521 provided on the outer wall of the adjusting ring 52 can move along the arc-shaped guiding groove 511 on the inner wall of the fixed ring 51. With the cooperation of the bull's-eye wheel 566, a plurality of sliding cylinders 56 can move synchronously towards the direction close to the axis of the rotating ring 54. The claws 551 provided on the contact rod 55 can contact the wafer, thereby fixing the wafer. And when the claws 551 contact the wafer, the pushing spring 562 can play a certain buffering role for the contact rod 55, avoiding the rigid contact between the claws 551 and the wafer and causing damage to the wafer. As the synchronous belt 3 moves, when the wafer moves into the U-shaped square tube 2, due to the cooperation of the air supply mechanism 6 and the blocking mechanism 7, the cleaning liquid can move back and forth in the U-shaped square tube 2 and wash the surface of the wafer. With the cooperation of the sector blades 542, the rotating ring 54 can rotate, which can not only improve the cleaning effect on the wafer but also disrupt the cleaning liquid in the U-shaped square tube 2, thereby further improving the cleaning effect on the wafer. And by providing the bull's-eye wheel 566, it can assist the rotation of the sliding cylinder 56 to ensure that the rotating ring 54 can rotate after the sector blades 542 contact the cleaning liquid.

[0057] See Figures 8 to 16As shown, each set of connecting members 53 includes a mounting base 531, a rotating shaft 532, and a reel 533; the mounting base 531 is arranged on the synchronous belt 3, the rotating shaft 532 is rotatably arranged on the mounting base 531, an adjusting block 5321 is arranged at one end of the rotating shaft 532 away from the mounting base 531, a flipping strip 513 is arranged on the outer wall of each fixing ring 51, reset rods 5131 are arranged on both sides of one end of each flipping strip 513 away from the fixing ring 51, a rectangular notch 5322 is arranged on each adjusting block 5321, receiving holes 5323 for receiving the reset rods 5131 are arranged on the inner walls of both sides of the rectangular notch 5322, the reset rods 5131 are rotatably arranged in the corresponding receiving holes 5323, and a first reset torsion spring 5132 is arranged on each reset rod 5131; the reel 533 is arranged on the rotating shaft 532, guiding plates 5324 are arranged on both sides of the rectangular notch 5322, a wire guiding hole 5325 is arranged on the guiding plate 5324, traction ropes 514 are arranged on both sides of each flipping strip 513, and the traction ropes 514 are wound around the reel 533 through the corresponding wire guiding holes 5325. A second reset torsion spring 5326 is also arranged on each rotating shaft 532, and the second reset torsion spring 5326 is located between the corresponding reel 533 and the mounting base 531; two reaction rods 5331 are arranged in a mirror image at the bottom of each reel 533, two reaction plates 13 cooperating with the reaction rods 5331 are arranged on the horizontal plate 11, the two reaction plates 13 are arranged on both sides of the conveying direction of the synchronous belt 3 and are centrosymmetric with respect to the center of the horizontal plate 11; a horizontal ring 515 is further arranged inside the fixing ring 51, the horizontal ring 515 abuts against the adjusting ring 52 and is located at one end of the rotating ring 54 away from the hinge groove 541, the axial ring 543 is rotatably arranged inside the horizontal ring 515, two guiding plates 5151 are arranged in a mirror image on the outer wall of the horizontal ring 515, two vertical grooves 516 are arranged in a mirror image on the inner wall of the fixing ring 51, a connecting rod 517 is arranged in each vertical groove 516, the guiding plates 5151 are slidably arranged in the corresponding vertical grooves 516, a guiding hole 5152 for the connecting rod 517 to pass through is arranged on the guiding plate 5151, and a telescopic spring 518 for making the adjusting ring 52 closely adhere to the corresponding horizontal ring 515 is sleeved on each connecting rod 517; a horizontal strip 5423 for placing a wafer is further arranged on each sector blade 542; a rotating mechanism 8 for rotating the adjusting ring 52 is also arranged on each fixing ring 51.

[0058] When cleaning and drying the wafer, under the torsion of the first return torsion spring 5132 and the second return torsion spring 5326, the fixed ring 51 can maintain a vertical state. At this time, the multiple fan-shaped blades 542 provided at the end of the rotating ring 54 always face the conveying direction of the synchronous belt 3, so as to ensure that the cleaning liquid in the U-shaped square tube 2 can effectively contact the surface of the wafer; when the wafer drying is completed, as the synchronous belt 3 moves, the reaction rod 5331 on the winding wheel 533 contacts the reaction plate 13 near the plugging mechanism 7, so that the winding wheel 533 rotates. As the winding wheel 533 rotates, the rotating shaft 532 is driven to rotate. At this time, through the pulling of the traction rope 514, the fixed ring 51 can change from a vertical state to a horizontal state and is located on one side of the synchronous belt 3 along the conveying direction. At this time, the adjusting ring 52 is in a horizontal state and is located at the lowermost end of the fixed ring 51. Subsequently, the adjusting ring 52 is rotated by the rotating mechanism 8, so that the wafer can fall from the inside of the rotating ring 54. The staff can remove the fallen wafer through an external mechanical claw or conveyor belt (not shown in the figure), so as to ensure continuous cleaning of the wafer. After it passes through the reaction plate 13 near the plugging mechanism 7, under the action of the first return torsion spring 5132 and the second return torsion spring 5326, the fixed ring 51 is reset. Subsequently, the reaction rod 5331 on the winding wheel 533 contacts the next reaction plate 13, so that the fixed ring 51 flips towards the other side of the synchronous belt 3. Then, through the rotating mechanism 8, the multiple fan-shaped blades 542 can rotate along the corresponding hinged positions. The horizontal bars 5423 on the multiple fan-shaped blades 542 can form a horizontal plane for placing the wafer inside the rotating ring 54, so as to facilitate the staff to place the wafer. Subsequently, the staff adjusts the adjusting ring 52 to move along the arc-shaped guiding groove 511 through the rotating mechanism 8, so that the horizontal ring 515 in contact with it can move in the direction close to the fan-shaped blades 542. During this process, through the cooperation of the multiple hinge rods 5422, the fan-shaped blades 542 can be opened, and under the action of the annular inclined surface 522, the claw 551 can resist and limit the wafer, so as to facilitate the subsequent cleaning and drying process.

[0059] See Figure 15As shown, each set of rotating mechanisms 8 includes a U-shaped mounting frame 81 and a rotating shaft 82; the U-shaped mounting frame 81 is arranged at the edge of one end of the fixed ring 51 close to the adjusting ring 52 and on the side away from the flipping strip 513. A rotating hole is provided at the center of the top of the U-shaped mounting frame 81. The rotating shaft 82 is rotatably arranged in the rotating hole. One end of the rotating shaft 82 inside the U-shaped mounting frame 81 is provided with a rotating disk 821. A plurality of first connecting columns 822 are radially arranged on the outer wall of the rotating disk 821. One end of each adjusting ring 52 away from the horizontal ring 515 is provided with a plurality of second connecting columns 523 that cooperate with the first connecting columns 822 along the axial direction. One end of the rotating shaft 82 outside the U-shaped mounting frame 81 is provided with a friction wheel 823.

[0060] By providing the friction wheel 823, the staff can adjust the friction wheel 823 so that the friction wheel 823 can drive the rotating disk 821 to rotate. As the rotating disk 821 rotates, the plurality of first connecting columns 822 on the outer wall of the rotating disk 821 mesh with the plurality of second connecting columns 523 on the corresponding adjusting ring 52, thereby driving the adjusting ring 52 to rotate. And due to the arrangement of the two reaction plates 13 on the horizontal plate 11, two friction plates (not shown in the figure) that cooperate with the friction wheel 823 can be arranged on the horizontal plate 11. As the synchronous belt 3 moves, automatic unloading and automatic clamping of the wafer can be carried out, thereby further reducing the labor intensity of the staff.

[0061] See Figure 12 and Figure 13 As shown, a plurality of water passing holes 5153 are radially arranged at one end of the horizontal ring 515, and a plurality of flushing holes 545 are radially arranged on the inner wall of the rotating ring 54. The flushing holes 545 are in a flared shape.

[0062] By providing a plurality of water passing holes 5153, the cleaning liquid is prevented from being blocked by the horizontal ring 515, ensuring the flow effect of the cleaning liquid, so that the fan-shaped blades 542 can rotate as the synchronous belt 3 rotates. By providing a plurality of flushing holes 545, after the cleaning liquid impacts the horizontal ring 515, part of the cleaning liquid can pass through the flushing holes 545 to flush the edge of the wafer, thereby cleaning the wafer comprehensively. And by setting the flushing holes 545 in a flared shape, with the larger end directly located on the outer wall of the rotating ring 54 and the smaller end located on the inner wall of the rotating ring 54, a certain speed-up effect on the cleaning liquid can be achieved, improving the flushing effect of the wafer.

[0063] See Figure 1 、 Figure 2 and Figure 17As shown, the air supply mechanism 6 includes an air supply box 61 and an air heater 62; on both sides of one end of the U-shaped square tube 2 close to the plugging mechanism 7, there are strip-shaped inclined grooves 23 for accommodating the air supply box 61. The air supply box 61 is arranged in the corresponding strip-shaped inclined groove 23. At one end of each air supply box 61 close to the inside of the U-shaped square tube 2, there is a strip-shaped air outlet 611. The air heater 62 is arranged on the mounting rack 1, and the air heater 62 supplies air to the inside of the corresponding air supply box 61 through a connecting pipe 621.

[0064] The nitrogen or air is heated by the air heater 62 and transported to the corresponding air supply box 61 through the connecting pipe 621. The two air supply boxes 61 are respectively located on both sides of the conveying direction of the synchronous belt 3. The high-temperature gas in the air supply box 61 enters the U-shaped square tube 2 through the strip-shaped air outlet 611, so as to dry the washed wafer. And the high-temperature gas ejected from the two strip-shaped air outlets 611 is in a V shape. The high-temperature gas contacts the fan-shaped blades 542, so that the wafer can rotate, and the cleaning liquid attached to the surface of the wafer can be thrown out, thereby improving the drying efficiency. And due to the arrangement of the flushing holes 545, the comprehensiveness of wafer drying can be ensured.

[0065] See Figure 2 and Figure 4 As shown, the plugging mechanism 7 includes a plugging plate 71; there are two plugging plates 71. At both ends of each plugging plate 71 along the length direction, there are turning rods 72. On both sides of the inner wall of one end of the U-shaped square tube 2 close to the air heater 62, there are two mounting holes 26 for accommodating the turning rods 72. The turning rods 72 are rotatably arranged in the corresponding mounting holes 26, and a third return torsion spring 73 is arranged on each turning rod 72.

[0066] Under the torque action of the third return torsion spring 73, the two plugging plates 71 are arranged in a horizontal state to plug the open end of the U-shaped square tube 2. As the synchronous belt 3 rotates, when the washed and dried wafer moves to the lower part of the two plugging plates 71, the fan-shaped blades 542 can contact the plugging plates 71, so that the two plugging plates 71 can be pushed open. At this time, the high-temperature gas inside the U-shaped square tube 2 can be discharged through the gap opened between the two plugging plates 71, thereby reducing the pressure inside the U-shaped square tube 2, and enabling the cleaning liquid inside the U-shaped square tube 2 to move towards the direction close to the plugging plate 71 as the pressure inside the U-shaped square tube 2 decreases, so that the cleaning liquid can sway back and forth, thereby improving the cleaning effect on the wafer.

[0067] See Figure 1 and Figure 2 As shown, two diversion pipes 24 connecting the two ends of the U-shaped square tube 2 are also arranged on the U-shaped square tube 2. The diversion pipes 24 are inclined, and a first one-way valve 25 is arranged on each diversion pipe 24.

[0068] By providing a diversion pipe 24, as the high-temperature gas continues to be input, the cleaning liquid located inside the U-shaped square pipe 2 can be pushed and thus enter the diversion pipe 24. A first one-way valve 25 is provided on each diversion pipe 24, thereby avoiding the leakage of high-temperature gas. When the two plugging plates 71 are opened, due to the discharge of high-temperature gas, the cleaning liquid located in the diversion pipe 24 can re-enter the U-shaped square pipe 2 through the inclined diversion pipe 24, thereby performing a secondary rinse on the wafer, further improving the rinsing effect on the wafer, and the entire rinsing process is in a relatively sealed environment, ensuring the rinsing and drying effects of the wafer.

[0069] See Figure 1 As shown, a drain pipe 27 is provided at the lower end of the U-shaped square pipe 2, and a second one-way valve 28 is provided on the drain pipe 27.

[0070] By providing a drain pipe 27, the staff can easily replace the cleaning liquid inside the U-shaped square pipe 2 by opening the second one-way valve 28.

[0071] The above embodiments only represent one or several implementation manners of the present invention. The description is relatively specific and detailed, but it cannot be understood as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A wafer closed drying device, comprising a mounting frame and a U-shaped square tube arranged on the mounting frame, wherein a horizontal plate is arranged on the upper end of the mounting frame, and two rectangular grooves for accommodating the U-shaped square tube are arranged on the horizontal plate, and two ends of the U-shaped square tube are arranged in corresponding rectangular grooves; characterized in that: It also includes a synchronous belt, an adjusting mechanism, a fixing mechanism, an air supply mechanism and a blocking mechanism; A U-shaped receiving groove for receiving a synchronous belt is arranged inside the U-shaped square tube, an adjusting mechanism is arranged on a horizontal plate and is used to drive the synchronous belt to rotate, and there are multiple sets of fixing mechanisms, which are arranged on the synchronous belt and are used to fix the wafer; each set of fixing mechanisms includes a fixing ring, a connecting piece and a rotating ring; The fixed ring is connected to the synchronous belt through a connecting piece, the rotating ring is coaxially rotatably arranged inside the fixed ring, an adjusting ring is rotatably arranged between the rotating ring and the fixed ring, a plurality of abutment rods which can move synchronously with the rotation of the adjusting ring are radially arranged inside the rotating ring, and a claw is arranged at one end of each abutment rod close to the axis of the rotating ring; A plurality of hinge grooves are radially arranged at one end of the rotating ring, and a fan-shaped blade is hinged in each hinge groove. An axial ring is coaxially arranged on the outer wall of the rotating ring, and a plurality of first hinge parts are radially arranged at one end of the axial ring. A second hinge part is arranged on each fan-shaped blade, and the first hinge part is connected to the corresponding second hinge part through a hinge rod; A water inlet for adding cleaning liquid is arranged on the outer wall of one side of the U-shaped square tube, an air supply mechanism is arranged on the side of the U-shaped square tube away from the water inlet and is used to transport gas to the inside of the U-shaped square tube, and a sealing mechanism is arranged at one end of the U-shaped square tube close to the air supply mechanism and can intermittently seal and open the open end of the U-shaped square tube as the synchronous belt rotates.

2. A wafer closed drying device according to claim 1, characterized in that: The adjusting mechanism includes a synchronous wheel and a driving member; There are two synchronous wheels, which are rotatably arranged on the top of the horizontal plate and are mirror-imaged relative to the center of the horizontal plate. The synchronous belt is sleeved on the two synchronous wheels, and the synchronous belt between the two synchronous wheels is in a horizontal state. The driving member is arranged on the horizontal plate and is used for driving one of the synchronous wheels to rotate.

3. A wafer closed drying device according to claim 2, characterized in that: Each set of fixing mechanisms also includes a sliding cylinder; The inner wall of the fixed ring is mirror-imaged with two arc-shaped guide grooves, and the outer wall of the adjustment ring is mirror-imaged with two guide posts that match the arc-shaped guide grooves. The guide posts can be slidably arranged in the corresponding arc-shaped guide grooves, and temporary storage grooves for accommodating the guide posts are arranged at both ends of each arc-shaped guide groove; The inner wall of the rotating ring is radially provided with a plurality of sliding holes, and there are a plurality of sliding cylinders. The sliding cylinders can be slidably arranged in the corresponding sliding holes, and the open end of each sliding cylinder faces the center of the corresponding rotating ring. Each interference rod can be slidably arranged in the corresponding sliding cylinder. The inner wall of each sliding cylinder is mirror-imaged with two guide grooves, and the outer wall of one end of each interference rod extending into the sliding cylinder is mirror-imaged with a guide block matching the guide groove, and the guide block can be slidably arranged in the corresponding guide groove. A push spring is also arranged inside each sliding cylinder, and the push spring is located between the corresponding interference rod and the inner wall of the bottom of the corresponding sliding cylinder; a limit ring for limiting the position of the interference rod is also arranged at the open end of each sliding cylinder; A connecting disk is also provided at the bottom of each sliding cylinder, and a compression spring is also sleeved on each sliding cylinder. The compression spring is located between the corresponding connecting disk and the outer wall of the rotating ring. A bull's eye wheel is also provided at the end of the connecting disk away from the sliding cylinder, and an annular inclined surface cooperating with the bull's eye wheel is provided on the inner wall of each adjusting ring.

4. The wafer closed drying device according to claim 3, characterized in that: Each set of connecting parts includes a mounting seat, a rotating shaft and a winding wheel; The mounting base is arranged on the synchronous belt, the rotating shaft is rotatably arranged on the mounting base, an adjusting block is arranged at one end of the rotating shaft away from the mounting base, a flipping strip is arranged on the outer wall of each fixing ring, reset rods are arranged on both sides of one end of each flipping strip away from the fixing ring, a rectangular notch is arranged on each adjusting block, and receiving holes for accommodating the reset rods are arranged on the inner walls of both sides of the rectangular notch. The reset rods are rotatably arranged in the corresponding receiving holes, and a first reset torsion spring is arranged on each reset rod; The winding wheel is arranged on the rotating shaft. Guide plates are arranged on both sides of the rectangular notch, and a wire guiding hole is arranged on the guide plate. Traction ropes are arranged on both sides of each flipping strip, and the traction ropes are wound on the winding wheel through the corresponding wire guiding holes. A second reset torsion spring is also arranged on each rotating shaft, and the second reset torsion spring is located between the corresponding winding wheel and the mounting base; Two reaction rods are arranged at the bottom of each winding wheel in a mirror image manner, two reaction plates cooperating with the reaction rods are arranged on the horizontal plate, and the two reaction plates are arranged on both sides of the conveying direction of the synchronous belt and are centrosymmetric with respect to the center of the horizontal plate; A horizontal ring is also arranged inside the fixing ring. The horizontal ring abuts against the adjusting ring and is located at one end of the rotating ring away from the hinge groove. The axial ring is rotatably arranged inside the horizontal ring. Two guide plates are arranged on the outer wall of the horizontal ring in a mirror image manner, two vertical grooves are arranged on the inner wall of the fixing ring in a mirror image manner, a connecting rod is arranged in each vertical groove, the guide plate is slidably arranged in the corresponding vertical groove, a guiding hole for the connecting rod to pass through is arranged on the guide plate, and a telescopic spring for making the adjusting ring closely adhere to the corresponding horizontal ring is also sleeved on each connecting rod; A horizontal strip for placing a wafer is also arranged on each sector blade; A rotating mechanism for rotating the adjusting ring is also arranged on each fixing ring.

5. The wafer closed drying device according to claim 4, characterized in that: Each set of rotating mechanisms includes a U-shaped mounting frame and a rotating shaft; The U-shaped mounting frame is arranged at the edge of one end of the fixing ring close to the adjusting ring and on the side away from the flipping strip. A rotating hole is arranged at the center of the top of the U-shaped mounting frame. The rotating shaft is rotatably arranged in the rotating hole. A rotating disc is arranged at one end of the rotating shaft inside the U-shaped mounting frame. A plurality of first connecting columns are arranged radially on the outer wall of the rotating disc. A plurality of second connecting columns cooperating with the first connecting columns are arranged along the axial direction at one end of each adjusting ring away from the horizontal ring. A friction wheel is arranged at one end of the rotating shaft outside the U-shaped mounting frame.

6. The wafer closed drying device according to claim 4, characterized in that: A plurality of water passing holes are arranged radially at one end of the horizontal ring, and a plurality of flushing holes are arranged radially on the inner wall of the rotating ring. The flushing holes are in a flared shape.

7. The wafer closed drying device according to claim 1, characterized in that: The air supply mechanism includes an air supply box and an air heater; Bar-shaped inclined grooves for accommodating the air supply box are arranged on both sides of one end of the U-shaped square pipe close to the plugging mechanism. The air supply box is arranged in the corresponding bar-shaped inclined groove. A bar-shaped air outlet is arranged at one end of each air supply box close to the inside of the U-shaped square pipe. The air heater is arranged on the mounting frame, and the air heater supplies air to the corresponding air supply box through a connecting pipe.

8. The wafer closed drying device according to claim 7, characterized in that: The plugging mechanism includes a plugging plate; There are two blocking plates, each of which is provided with a flip rod at both ends along the length direction. Two mounting holes for accommodating the flip rod are provided on the inner walls on both sides of one end of the U-shaped square tube close to the air heater. The flip rod can be rotatably arranged in the corresponding mounting holes, and each flip rod is provided with a third reset torsion spring.

9. The wafer closed drying device according to claim 1, characterized in that: The U-shaped square tube is also provided with two flow guide tubes communicating with the two ends of the U-shaped square tube. The flow guide tubes are arranged obliquely, and each flow guide tube is provided with a first one-way valve.

10. The wafer closed drying device according to claim 1, characterized in that: A drainage pipe is arranged at the lower end of the U-shaped square tube, and a second one-way valve is arranged on the drainage pipe.

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