Electronic packaging and manufacturing method thereof

Abstract

An electronic package and a method for manufacturing the same include disposing a heat dissipation structure covering an electronic component on a carrier board provided with the electronic component. The heat dissipation structure is manufactured by injection molding an insulating material, and is embedded with a phase change material and has at least one opening exposing the phase change material. Thus, by forming the heat dissipation structure with insulating material, the weight of the heat dissipation structure is reduced.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging process, and in particular to an electronic packaging component with a heat dissipation structure and a manufacturing method thereof. Background Art

[0002] As the demand for electronic products in terms of functionality and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher densities of electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat during operation.

[0003] Therefore, in order to quickly dissipate heat to the outside, the industry usually configures a heat sink or heat spreader in the semiconductor package. The heat sink is usually bonded to the back of the semiconductor chip through a thermal adhesive, such as a thermal interface material (TIM). The heat generated by the semiconductor chip is dissipated through the thermal adhesive and the heat sink.

[0004] like Figure 1 As shown, the manufacturing method of the conventional semiconductor package 1 is to first place a semiconductor chip 11 with its active surface 11a on a packaging substrate 10 using a flip chip bonding method (i.e., through conductive bumps 110 and bottom glue 111), and then a heat sink 13 with its top plate 130 is bonded to the inactive surface 11b of the semiconductor chip 11 through a TIM layer 12, and the supporting legs 131 of the heat sink 13 are mounted on the packaging substrate 10 through an adhesive layer 14.

[0005] During operation, heat generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the inactive surface 11 b and the TIM layer 12 to be dissipated to the outside of the semiconductor package 1 .

[0006] However, in the conventional semiconductor package 1, a metal frame is used as the heat sink 13, and thus a complicated process such as etching metal and / or electroplating metal is required to manufacture the heat sink 13. As a result, the heat sink 13 is not only extremely expensive to manufacture but also difficult to reduce in weight, making the semiconductor package 1 unsuitable for meeting the requirement of being lightweight.

[0007] Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the Invention

[0008] In view of the above-mentioned deficiencies in the prior art, the present invention provides an electronic package and a method for manufacturing the same, which can at least partially solve the problems of the prior art.

[0009] The electronic package of the present invention includes: a carrier having at least one circuit layer; an electronic component disposed on the carrier and electrically connected to the circuit layer; and an insulating material heat dissipation structure disposed on the carrier and covering the electronic component, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening for exposing the phase change material object.

[0010] The present invention also provides a method for manufacturing an electronic package, comprising: manufacturing an insulating material heat dissipation structure by injection molding an insulating material, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening for exposing the phase change material object; and placing the insulating material heat dissipation structure on a carrier having at least one circuit layer, wherein at least one electronic component electrically connected to the circuit layer is provided on the carrier, so that the insulating material heat dissipation structure covers the electronic component.

[0011] In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure contacts the electronic component.

[0012] In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure has a shielding layer, so that after the insulating material heat dissipation structure is arranged on the carrier, the shielding layer is located between the phase change material object and the electronic component.

[0013] In the aforementioned electronic package and its manufacturing method, the manufacturing process of the insulating material heat dissipation structure includes: separately manufacturing a first heat dissipation element and a second heat dissipation element by injection molding an insulating material; forming an opening on the first heat dissipation element; and joining the first heat dissipation element and the second heat dissipation element so that the phase change material object is sandwiched between the first heat dissipation element and the second heat dissipation element, wherein the insulating material heat dissipation structure is provided with the second heat dissipation element on the carrier so that the second heat dissipation element covers the electronic component.

[0014] In the aforementioned electronic package and its manufacturing method, the phase change material comprises paraffin, organic acid, inorganic salt or salt water compound.

[0015] As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by molding insulating material, which uses a simple process. Therefore, compared with existing metal heat dissipation parts, the present invention can not only significantly reduce the manufacturing cost of the insulating material heat dissipation structure, but also reduce the weight of the insulating material heat dissipation structure, so that the electronic package can meet the lightweight requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0017] Figures 2A to 2H It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0018] Figure 2D-1 for Figure 2D A top schematic diagram of another embodiment of the present invention is provided.

[0019] Figure 2E-1 for Figure 2E A top schematic diagram of another embodiment of the present invention is provided.

[0020] Figures 3A to 3B It is a cross-sectional schematic diagram of the manufacturing process of the first heat sink of the insulating material heat dissipation structure of the electronic package of the present invention.

[0021] Figures 4A to 4B It is a cross-sectional schematic diagram of the manufacturing process of the second heat dissipation element of the insulating material heat dissipation structure of the electronic package of the present invention.

[0022] The description of the accompanying drawings is as follows:

[0023] 1Semiconductor package

[0024] 10 package substrate

[0025] 11Semiconductor chips

[0026] 11a, 21a working surface

[0027] 11b, 21b non-active surface

[0028] 110, 210 conductive bumps

[0029] 111, 211 primer

[0030] 12TIM layers

[0031] 13 heat sink

[0032] 130 top sheet

[0033] 131,400 support feet

[0034] 14, 24 adhesive layer

[0035] 2Electronic packaging

[0036] 2a insulation material heat dissipation structure

[0037] 2b substrate structure

[0038] 20 carrier boards

[0039] 200 insulation layer

[0040] 201 circuit layer

[0041] 21 electronic components

[0042] 22 Phase change material objects

[0043] 23 shielding layers

[0044] 3 heat dissipation frame

[0045] 3a bracket

[0046] 30 first heat sink

[0047] 30a, 402 insulation material

[0048] 300 openings

[0049] 301 convex part

[0050] 40 second heat sink

[0051] 40a sheet

[0052] 401 recess

[0053] 70, 80 first module

[0054] 71, 81 second module

[0055] 9, 9a bearing member

[0056] S Accommodation Space

[0057] L cutting path. DETAILED DESCRIPTION

[0058] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0059] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those familiar with this technology, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose of the present invention. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0060] Figures 2A to 2H It is a cross-sectional schematic diagram of a method for manufacturing the electronic package 2 of the present invention.

[0061] like Figure 2A As shown, a first heat dissipation element 30 having a plurality of protrusions 301 and a second heat dissipation element 40 having a plurality of concave portions 401 are provided.

[0062] In this embodiment, the first heat sink 30 is a plate, and the second heat sink 40 is a sheet connected to a plurality of supporting legs 400, such that the recess 401 is formed on one side of the supporting legs 400. For example, the second heat sink 40 is surrounded by the plurality of supporting legs 400 to form a cover shape to form an accommodating space S.

[0063] Furthermore, the first heat sink 30 is made of an insulating material, such as prepreg (PP), epoxy resin packaging colloid, molding compound or other plastic materials. For example, the first heat sink 30 can be made by injection molding, such as Figure 3A The first mold 70 and the second mold 71 are shown, and after demoulding, the excess insulating material 30a is removed. Figure 3B shown.

[0064] In addition, the second heat sink 40 is made of insulating material, such as prepreg (PP), epoxy resin (epoxy) packaging colloid, packaging material or other plastic material. For example, the second heat sink 40 can be made by injection molding, such as Figure 4A The first mold 80 and the second mold 81 are shown, and after demoulding, the excess insulating material 402 is removed, as shown in FIG. Figure 4B It should be understood that the materials of the first heat dissipation element 30 and the second heat dissipation element 40 can be the same or different.

[0065] like Figures 2B to 2C As shown, a plurality of openings 300 are first formed on the first heat sink 30. Then, a phase change material (PCM) mass 22 is positioned between the first heat sink 30 and the second heat sink 40 to press the first heat sink 30 and the second heat sink 40 together. This sandwiches the PCM mass 22 between the first heat sink 30 and the second heat sink 40, exposing the PCM mass 22 outside the plurality of openings 300.

[0066] In this embodiment, the openings 300 penetrate the body of the first heat dissipation element 30 , and the protrusion 301 of the first heat dissipation element 30 is inserted into the recess 401 of the second heat dissipation element 40 , so that the first and second heat dissipation elements 30 , 40 are joined.

[0067] Furthermore, the phase change material object 22 is in a sheet-like shape, and the material forming the phase change material object 22 is paraffin, organic acid, inorganic salt, salt water compound, or other phase change materials.

[0068] like Figure 2D As shown, a shielding layer 23 is formed on the second heat dissipation element 40 to form an insulating material heat dissipation structure 2a.

[0069] In this embodiment, the shielding layer 23 is formed on the surface of the sheet 40a and the supporting legs 400 within the accommodation space S of the second heat sink 40. For example, the shielding layer 23 includes a metal material, such as gold (Au), silver (Ag), nickel (Ni), or other metal layers, formed on the second heat sink 40 by electroplating.

[0070] Furthermore, the first heat sink 30 and the second heat sink 40 can be manufactured by injection molding to form a full panel specification or a wafer level specification, such as Figure 2D-1 The heat dissipation frame 3 shown is connected to a plurality of array-arranged insulating material heat dissipation structures 2a via a plurality of brackets 3a.

[0071] Alternatively, the single insulating material heat dissipation structure 2a with its first heat dissipation element 30 can be placed on a single carrier 9 according to the needs, so as to facilitate transportation to the machine used in the subsequent process, such as Figure 2E As shown. It should be understood that Figure 2E-1 As shown, a plurality of insulating material heat dissipation structures 2a may be arrayed on a carrier 9a of full-scale or wafer-level specifications.

[0072] like Figures 2F to 2G As shown, a substrate structure 2b of full-scale or wafer-level specifications is provided, which includes a plurality of adjacent carriers 20, and at least one electronic component 21 is set on each of the carriers 20. Figure 2E-1 In the manufacturing process shown, each of the insulating material heat dissipation structures 2 a is removed from the carrier 9 a so as to be placed on each of the carrier boards 20 .

[0073] In this embodiment, the carrier 20 is, for example, a package substrate having a core layer and a circuit structure, a package substrate having a coreless circuit structure, a through-silicon interposer (TSI) with conductive through-silicon vias (TSVs), or other board types. The carrier 20 includes at least one insulating layer 200 and at least one circuit layer 201 coupled to the insulating layer 200, such as at least one fan-out redistribution layer (RDL). For example, the circuit layer 201 is formed of copper, and the insulating layer 200 is formed of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). It should be understood that the substrate structure 2b may also be in the form of a single carrier 20 (not shown) or other chip-carrying plate, such as a lead frame, a wafer, or other plate with metal routing, etc., and is not limited to the above.

[0074] Furthermore, the electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. In this embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other. The active surface 21a is flip-chip mounted on the circuit layer of the carrier 20 via a plurality of conductive bumps 210 such as solder, metal pillars, or other materials and electrically connected to the circuit layer 201. The conductive bumps 210 are covered with a primer 211. Alternatively, the electronic component 21 can be electrically connected to the circuit layer 201 of the carrier 20 via a plurality of bonding wires (not shown). Alternatively, the electronic component 21 can directly contact the circuit layer 201 of the carrier 20. Therefore, the required type and quantity of electronic components 21 can be placed on the carrier 20 to enhance its electrical function. There are many ways to electrically connect the electronic components 21 to the carrier structure 20, which are not limited to the above.

[0075] Furthermore, the insulating material heat dissipation structure 2a is bonded to the carrier 20 via the adhesive layer 24 using the support legs 400 of its second heat dissipation element 40, so that the electronic component 21 is positioned within the accommodation space S and the second heat dissipation element 40 covers the electronic component 21. For example, the shielding layer 23 is positioned between the second heat dissipation element 40 (the phase change material object 22) and the electronic component 21 to cover the electronic component 21, thereby preventing the electronic component 21 from being subjected to external electromagnetic interference (EMI).

[0076] Furthermore, the insulating heat dissipation structure 2a contacts the inactive surface 21b of the electronic component 21 via the sheet 40a of the second heat dissipation element 40 (or the shielding layer 23). It should be understood that the insulating heat dissipation structure 2a may also not contact the electronic component 21, i.e., the insulating heat dissipation structure 2a is separated from the inactive surface 21b of the electronic component 21.

[0077] like Figure 2H As shown, along Figure 2G The singulation process is performed along the cutting path L shown (ie, the boundary between the carriers 20 ) to obtain the electronic package 2 .

[0078] In this embodiment, the heat generated by the electronic component 21 is dissipated through the second heat sink 40, through the phase-change material 22, and then out to the outside environment through the opening 300. When the phase-change material 22 absorbs heat from the electronic component 21, it transforms from a solid state to a liquid state. When the phase-change material 22 dissipates the heat through the opening 300, it transforms from a liquid state to a solid state.

[0079] Therefore, the manufacturing method of the present invention mainly manufactures the first heat sink 30 and the second heat sink 40 by injection molding an insulating material, which simplifies the manufacturing process. Therefore, compared with the existing metal heat sink, the manufacturing method of the present invention can not only significantly reduce the manufacturing cost of the insulating material heat dissipation structure, but also reduce the weight of the insulating material heat dissipation structure 2a, so that the electronic package 2 meets the lightweight requirement.

[0080] Furthermore, due to the design of the phase change material 22 of the electronic package 2, when the phase change material 22 absorbs heat energy from the electronic component 21, the temperature of the electronic component 21 will remain stable (i.e., maintained at the desired temperature). At this time, the opening 300 of the first heat sink 30 serves as a flow path for the liquid diffusion of the phase change material 22 and a pressure relief space, thereby reducing the pressure exerted by the phase change material 22 on the second heat sink 40 (or the electronic component 21), thereby facilitating the improvement of the reliability of the electronic package 2.

[0081] In addition, the shielding layer 23 not only protects the electronic component 21 from external electromagnetic interference, but also serves as a heat-conducting structure to transfer heat energy from the electronic component 21 to the phase change material 22, causing the phase change material 22 to undergo a phase transformation, that is, the phase change material 22 changes from a solid state to a liquid state.

[0082] The present invention provides an electronic package 2 comprising: a carrier 20 having at least one circuit layer 201 , at least one electronic component 21 disposed on the carrier 20 and electrically connected to the circuit layer 201 , and an insulating material heat dissipation structure 2a disposed on the carrier 20 to cover the electronic component 21 .

[0083] The insulating material heat dissipation structure 2 a is embedded with a phase change material object 22 and has at least one opening 300 exposing the phase change material object 22 .

[0084] In one embodiment, the insulating material heat dissipation structure 2 a contacts the electronic component 21 .

[0085] In one embodiment, the insulating material heat dissipation structure 2 a has a shielding layer 23 , and the shielding layer 23 is located between the phase change material object 22 and the electronic component 21 .

[0086] In one embodiment, the insulating material heat dissipation structure 2a includes a first heat dissipation member 30 and a second heat dissipation member 40 that are joined together, so that the phase change material object 22 is sandwiched between the first heat dissipation member 30 and the second heat dissipation member 40, and the opening 300 is formed on the first heat dissipation member 30, and the second heat dissipation member 40 is disposed on the carrier 20 to cover the electronic component 21.

[0087] In one embodiment, the phase change material 22 includes paraffin, organic acid, inorganic salt, or salt water compound.

[0088] In summary, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by injection molding insulating material, thereby reducing the manufacturing cost of the insulating material heat dissipation structure and reducing the weight of the insulating material heat dissipation structure, so that the electronic package can meet the requirements of being lightweight.

[0089] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. An electronic package comprising: A carrier board having at least one circuit layer; an electronic component disposed on the carrier and electrically connected to the circuit layer; as well as An insulating material heat dissipation structure is provided on the carrier and covers the electronic component, wherein a thin plate-shaped phase change material object is embedded in the insulating material heat dissipation structure, and the insulating material heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that are connected so that the phase change material object is sandwiched between the first heat dissipation member and the second heat dissipation member. The second heat dissipation member is provided on the carrier to cover the electronic component, and a plurality of openings are formed on the first heat dissipation member and penetrate the first heat dissipation member so that the thin plate-shaped phase change material object is exposed through the plurality of openings. The plurality of openings of the first heat dissipation member serve as a flow path and pressure relief space for the liquid diffusion of the thin plate-shaped phase change material object.

2. The electronic package according to claim 1, wherein: The insulating material heat dissipation structure contacts the electronic component.

3. The electronic package according to claim 1, wherein: The insulating material heat dissipation structure has a shielding layer, and the shielding layer is located between the phase change material object and the electronic component.

4. The electronic package according to claim 1, wherein: The phase change material comprises paraffin, organic acid, inorganic salt or salt water compound.

5. A method for manufacturing an electronic package, comprising: An insulating material heat dissipation structure is manufactured by injection molding an insulating material, wherein a thin plate-shaped phase change material object is embedded in the insulating material heat dissipation structure; and The insulating material heat dissipation structure is arranged on a carrier having at least one circuit layer, wherein at least one electronic component electrically connected to the circuit layer is arranged on the carrier, so that the insulating material heat dissipation structure covers the electronic component, wherein the production of the insulating material heat dissipation structure includes: separately producing a first heat dissipation member and a second heat dissipation member by injection molding an insulating material; forming a plurality of openings penetrating the first heat dissipation member; and joining the first heat dissipation member and the second heat dissipation member so that the thin plate-shaped phase change material object is sandwiched between the first heat dissipation member and the second heat dissipation member and exposed to the plurality of openings, wherein the insulating material heat dissipation structure is arranged on the carrier with the second heat dissipation member so that the second heat dissipation member covers the electronic component, and the plurality of openings of the first heat dissipation member serve as a flow path and pressure relief space for the liquid diffusion of the thin plate-shaped phase change material object.

6. The method for manufacturing an electronic package according to claim 5, wherein: The insulating material heat dissipation structure contacts the electronic component.

7. The method for manufacturing an electronic package according to claim 5, wherein: The insulating material heat dissipation structure has a shielding layer, so that after the insulating material heat dissipation structure is arranged on the carrier, the shielding layer is located between the phase change material object and the electronic component.

8. The method for manufacturing an electronic package according to claim 5, wherein: The phase change material comprises paraffin, organic acid, inorganic salt or salt water compound.

Images