Ultra-thin micro-electrostatic module and production method

Abstract

The present invention provides an ultra-thin micro-electrostatic module and a production method, comprising: a micro-electrostatic module core, the micro-electrostatic module core including a plurality of air channels for air circulation and a fixing slot; a frame including a plurality of frames corresponding to the micro-electrostatic module core, the frame housing the micro-electrostatic module core; and a fixing component embedded in the fixing slot and connected to the frame and the micro-electrostatic module core to secure the micro-electrostatic module core. The ultra-thin micro-electrostatic module of the present invention solves the technical problem in related arts that the micro-electrostatic module suffers from loss of purification efficiency and dust holding capacity due to the outer frame occupying the thickness dimension.

Description

Technical Field

[0001] The present invention relates to the field of micro-electrostatic technology, and in particular to an ultra-thin micro-electrostatic module and a production method thereof. Background Art

[0002] Currently, mainstream air purification technologies are divided into media filtration and electrostatic purification. While media filtration is mature and relatively stable, it suffers from high wind resistance, high fan energy consumption, a high risk of bacterial and viral growth, inability to sterilize, the generation of odors, and the need for frequent replacement. This creates a large number of consumables, resulting in high operating and maintenance costs, making it both energy-efficient and environmentally friendly. Electrostatic purification technology removes particulate matter, sterilizes, and disinfects, offering low resistance and repeated washing. However, its low purification efficiency, relatively high power consumption, susceptibility to ignition, high ozone levels, poor safety, short service life, heavy weight, and high maintenance costs hinder its widespread application in lightly polluted air purification, limiting its application to limited scenarios. Micro-electrostatic technology combines the advantages of media filtration and electrostatic purification, offering both efficient purification and dust removal, sterilization, and disinfection, while also offering the advantages of ultra-low power consumption, low resistance, high humidity resistance, high safety, repeated washing, no consumables, and a service life of up to 10 years.

[0003] However, the micro-electrostatic module used in the existing micro-electrostatic technology has an outer frame, which occupies the dimension in the thickness direction. In scenarios where the installation space is limited, the core thickness of the micro-electrostatic module is reduced. Since it cannot be fully utilized in the thickness direction, it leads to efficiency loss and dust holding capacity loss.

[0004] Therefore, the prior art needs to be further developed. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above-mentioned technical deficiencies and provide an ultra-thin micro-electrostatic module and a production method to solve the technical problem in the related art that the micro-electrostatic module loses purification efficiency and dust holding capacity due to the outer frame occupying the thickness direction.

[0006] In order to achieve the above-mentioned technical objectives, the present invention adopts the following technical solutions: an ultra-thin micro-electrostatic module is provided, comprising: a micro-electrostatic module core, the micro-electrostatic module core comprising a plurality of air channels for air circulation, and the micro-electrostatic module core is provided with a fixing groove; a frame, the frame comprising a plurality of frames corresponding to the micro-electrostatic module core, and the micro-electrostatic module core is accommodated inside the frame; a fixing component, the fixing component is embedded in the fixing groove, and the fixing component is connected to the frame and the micro-electrostatic module core to fix the micro-electrostatic module core.

[0007] Furthermore, the fixing component includes a boss integrally formed with the frame, the boss is extended in a direction close to the core of the micro-electrostatic module, and the boss is embedded in the fixing groove.

[0008] Furthermore, the fixing groove includes a first connecting surface and a second connecting surface connected to each other, and the extension directions of the first connecting surface and the second connecting surface are perpendicular to each other; or, the second connecting surface is an arc-shaped surface.

[0009] Furthermore, the fixing groove includes a first connecting surface, and the first connecting surface is an inclined surface; or, the first connecting surface is an arcuate surface.

[0010] Furthermore, the core of the micro-electrostatic module includes a first dust collecting surface and a second dust collecting surface arranged opposite to each other, and a plurality of air channels for air circulation are provided between the first dust collecting surface and the second dust collecting surface; the first dust collecting surface protrudes from the frame along the extension direction of the air channel; and / or the second dust collecting surface protrudes from the frame along the extension direction of the air channel.

[0011] Furthermore, the fixing component includes insulating glue, and the insulating glue is filled between the frame and the fixing groove.

[0012] Furthermore, the core of the micro-electrostatic module includes several stacked dust collecting sheets and several isolating members arranged between the dust collecting sheets. An air channel is formed between the dust collecting sheets and the isolating members. The dust collecting sheets are wrapped with conductive material, and the conductive material includes an avoidance groove, which is arranged corresponding to the fixed groove.

[0013] Furthermore, the conductive material is electrically connected to the high-voltage power supply through the electrode strips, and the high-voltage power supply is a high-voltage power supply installed in the frame or a high-voltage power supply installed outside the frame.

[0014] Furthermore, the fixing components include a plurality of fixing components, and the plurality of fixing components are arranged in a one-to-one correspondence with the plurality of frames; and a plurality of fixing grooves are correspondingly provided.

[0015] Furthermore, the fixing component includes a first fixing component and a second fixing component arranged at intervals, the first fixing component is connected to one end of the frame, and the second fixing component is connected to an end of the frame away from the first fixing component; the fixing groove includes a first fixing groove and a second fixing groove arranged at intervals, the first fixing groove is arranged corresponding to the first fixing component, and the second fixing groove is arranged corresponding to the second fixing component.

[0016] Furthermore, the fixing groove includes a first fixing groove provided on the leeward side of the micro-electrostatic module core, and the boss is embedded in the first fixing groove to support the micro-electrostatic module core.

[0017] A production method is applicable to the above-mentioned ultra-thin micro-electrostatic module, and the production method includes: obtaining a micro-electrostatic module core; processing a fixing groove on the micro-electrostatic module core, and the high temperature generated during the processing causes melting in the fixing groove; connecting multiple frames to the micro-electrostatic module core in sequence; embedding a fixing component in the fixing groove; and completing the assembly of the ultra-thin micro-electrostatic module.

[0018] Furthermore, the method for machining the fixing groove on the micro-electrostatic module core includes: fixing the micro-electrostatic module core on a thermal cutting device, and machining the fixing groove by thermal cutting.

[0019] Beneficial effects:

[0020] 1. The ultra-thin micro-electrostatic module in this embodiment improves the dust holding capacity and purification efficiency of the micro-electrostatic module, reduces the use cost of the filter element, solves the sealing problem of the micro-electrostatic module by adopting a thermal cutting process, and ensures that the ultra-thin micro-electrostatic module of this embodiment has a more ideal waterproof effect.

[0021] 2. By setting a fixing component, embedding the fixing component in the fixing groove, and connecting it to the frame and the micro-electrostatic module core respectively, the micro-electrostatic module core is fixed on the frame to complete the installation of the micro-electrostatic module core. By opening a fixing groove on the micro-electrostatic module core and forming a step structure on the frame, the step structure and the fixing groove are engaged and fixed with each other to achieve the fixation of the micro-electrostatic module core, reducing the dust holding surface required for fixing the micro-electrostatic module core, reducing the connection area between the outer frame and the micro-electrostatic module core, reducing the overall thickness of the outer frame, realizing the structural design of the ultra-thin frame, increasing the dust holding capacity of the micro-electrostatic module, reducing the use cost of the filter element, and improving the purification efficiency, it solves the technical problem in the related technology that the micro-electrostatic module loses purification efficiency and dust holding capacity due to the thickness dimension occupied by the outer frame.

[0022] 3. In the ultra-thin micro-electrostatic module of this embodiment, the air first passes through the windward side of the micro-electrostatic module and then passes through the leeward side. In order to increase the structural strength of the micro-electrostatic module core, the fixing component adopts a boss structure design, that is, a first fixing groove is opened on the leeward side of the micro-electrostatic module core, and the boss is engaged with the first fixing groove. The wind pressure pushes the micro-electrostatic module core onto the boss structure, which plays a good supporting role, reduces the use of frame materials, reduces the difficulty of assembly, and at the same time prevents the micro-electrostatic module core from deformation and detachment from the frame, thereby ensuring the assembly strength and stability of the micro-electrostatic module core. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a partial view of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0024] Figure 2 1 is a schematic structural diagram of a first embodiment of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0025] Figure 3 1 is a schematic structural diagram of a second embodiment of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0026] Figure 41 is a schematic structural diagram of a third embodiment of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0027] Figure 5 1 is a schematic structural diagram of a fourth embodiment of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0028] Figure 6 1 is a schematic structural diagram of a fifth embodiment of an ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0029] Figure 7 Schematic diagram of the structure of the dust collecting sheet of the ultra-thin micro-electrostatic module used in an embodiment of the present invention;

[0030] Figure 8 It is a structural schematic diagram of the first fixing component of the ultra-thin micro-electrostatic module used in an embodiment of the present invention.

[0031] The above drawings include the following reference numerals:

[0032] 10. Air channel; 1. Micro-electrostatic module core; 11. First dust-collecting surface; 13. Second dust-collecting surface; 2. Fixing groove; 21. First fixing groove; 211. First connecting surface; 212. Second connecting surface; 22. Second fixing groove; 3. Frame; 31. Frame; 4. Fixing component; 41. Boss; 411. First fixing component; 412. Second fixing component; 42. Insulating glue; 100. Dust collecting sheet; 101. Isolation piece; 103. Conductive material; 104. Avoidance groove. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0034] According to an embodiment of the present invention, an ultra-thin micro electrostatic module is provided. Figures 1 to 8 , including: a micro-electrostatic module core 1, the micro-electrostatic module core 1 includes several air channels 10 for air circulation, and the micro-electrostatic module core 1 is provided with a fixing groove 2; a frame 3, the frame 3 includes a plurality of frames 31 arranged corresponding to the micro-electrostatic module core 1, and the micro-electrostatic module core 1 is accommodated inside the frame 3; a fixing component 4, the fixing component 4 is embedded in the fixing groove 2, and the fixing component 4 is connected to the frame 3 and the micro-electrostatic module core 1 to fix the micro-electrostatic module core 1.

[0035] By setting a fixing component 4, embedding the fixing component 4 in the fixing groove 2, and connecting with the frame 3 and the micro-electrostatic module core 1 respectively, the micro-electrostatic module core 1 is fixed on the frame 3, and the installation of the micro-electrostatic module core 1 is completed. By opening a fixing groove 2 on the micro-electrostatic module core 1, and forming a step structure on the frame 3, the step structure and the fixing groove 2 are engaged and fixed with each other, so as to realize the fixation of the micro-electrostatic module core 1, reduce the dust holding surface occupied by the fixed micro-electrostatic module core, reduce the connection area between the outer frame and the micro-electrostatic module core, reduce the overall thickness of the outer frame, realize the structural design of the ultra-thin frame, improve the dust holding capacity of the micro-electrostatic module, reduce the use cost of the filter element, improve the purification efficiency, and solve the technical problem in the related technology that the micro-electrostatic module loses purification efficiency and dust holding capacity due to the thickness dimension occupied by the outer frame.

[0036] The ultra-thin micro-electrostatic module in this embodiment improves the dust holding capacity and purification efficiency of the micro-electrostatic module, reduces the use cost of the filter element, and solves the sealing problem of the micro-electrostatic module by adopting a thermal cutting process, ensuring that the ultra-thin micro-electrostatic module of this embodiment has a more ideal waterproof effect.

[0037] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 2 The fixing component 4 includes a boss 41 integrally formed with the frame 31. The boss 41 extends in a direction close to the micro-electrostatic module core 1 and is embedded in the fixing groove 2. By providing the boss 41 and embedding it in the fixing groove 2, the boss 41 and the fixing groove 2 engage with each other to increase the supporting force of the fixing component 4 on the micro-electrostatic module core 1. The boss 41 stops and fixes the micro-electrostatic module core, reducing the dust-holding surface of the micro-electrostatic module core occupied by the frame 31 and reducing the thickness of the frame.

[0038] In some embodiments, the boss 41 is an L-shaped boss.

[0039] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 2-3 The fixing groove 2 includes a first connecting surface 211 and a second connecting surface 212 connected to each other.

[0040] Specifically, the fixing groove 2 is opened on the side wall of the micro-electrostatic module core 1 to increase the wrapping of the frame 3 and the fixing component 4 on the micro-electrostatic module core and improve the fixing strength of the micro-electrostatic module core.

[0041] It is understandable that the fixing groove 2 can also be opened on the end face of the micro-electrostatic module core 1, and spaced apart from the electrode groove located on the end face. In this case, the dust holding surface of the micro-electrostatic module core can be maximized.

[0042] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 2The extension directions of the first connecting surface 211 and the second connecting surface 212 are perpendicular to each other.

[0043] Specifically, the fixing groove 2 is an L-shaped structure that interlocks and secures with the boss 41. The L-shaped fixing groove 2 can reduce the area of the fixing groove 2 and increase the dust holding surface of the micro-electrostatic module core 1. Furthermore, the boss 41 fits closely with the L-shaped fixing groove 2, reducing the possibility of deformation of the frame 31 and improving the structural strength of the frame 31.

[0044] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 3 , the second connecting surface 212 is an arc-shaped surface.

[0045] Specifically, by setting the second connecting surface 212 as an arc-shaped surface, after the frame 3 and the micro-electrostatic module core 1 are assembled, there is a gap in the fixing groove 2 except for the boss 41. At this time, insulating glue can be injected to increase the stability of the assembly and at the same time increase the sealing effect of the micro-electrostatic module core to prevent leakage discharge of the conductive material in the micro-electrostatic module core.

[0046] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 4-6 The fixing groove 2 includes a first connecting surface 211, and the first connecting surface 211 is an inclined surface.

[0047] Specifically, the fixing groove 2 is opened on the side wall of the micro-electrostatic module core 1. By adopting a single-sided fixing groove 2, the cross-sectional area and capacity of the fixing groove 2 can be reduced, the filling amount of insulating glue can be reduced, and the size of the avoidance groove 104 can be reduced, thereby increasing the available area of the conductive material 103.

[0048] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 6 , the first connecting surface 211 is an arc-shaped surface.

[0049] Specifically, by setting the first connecting surface 211 as an arc-shaped surface, relative to the first connecting surface 211 with an inclined surface structure, when the insulating glue is filled in the fixing groove 2, the adhesion of the insulating glue can be increased, thereby increasing the assembly strength of the micro-electrostatic module core 1 and the frame 3.

[0050] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 4 The micro-electrostatic module core 1 includes a first dust collecting surface 11 and a second dust collecting surface 13 arranged opposite to each other, and a plurality of air channels 10 for air circulation are arranged between the first dust collecting surface 11 and the second dust collecting surface 13; the first dust collecting surface 11 is protruding from the frame 31 along the extension direction of the air channel 10; and / or the second dust collecting surface 13 is protruding from the frame 31 along the extension direction of the air channel 10.

[0051] It can be understood that by adopting the micro-electrostatic module core assembly structure of the present invention, the thickness of the micro-electrostatic module core can be adaptively thickened or a frame with a smaller width specification can be used to stably realize the assembly of the micro-electrostatic module core. The increase in the thickness of the micro-electrostatic module core can increase the length of the air channel, thereby increasing the dust collection efficiency of the micro-electrostatic module core 1.

[0052] In some embodiments, a structural design in which the thickness of a single side of the micro-electrostatic module core is increased can be adopted to thicken the first dust collecting surface 11 or the second dust collecting surface 13 on a single side.

[0053] In some embodiments, a structural design in which both sides of the micro-electrostatic module core are thickened can be simultaneously adopted to thicken both the first dust collecting surface 11 and the second dust collecting surface 13 .

[0054] In some embodiments of the ultra-thin micro-electrostatic module, see Figure 4-6 The fixing component 4 includes an insulating glue 42 , and the insulating glue 42 is filled between the frame 31 and the fixing groove 2 .

[0055] Specifically, by filling insulating glue 42 in the fixing groove 2, the frame 31 is firmly connected to the fixing groove 2, and at the same time a sealing effect is played to prevent the problem of conductive material discharge caused by the edges of the fixing groove 2 and the conductive material 103 being too thin or too close, thereby improving electrical safety.

[0056] In the ultra-thin micro-electrostatic module of this embodiment, see Figure 7 The micro-electrostatic module core 1 includes a plurality of stacked dust collecting sheets 100 and a plurality of isolating members 101 arranged between the dust collecting sheets 100. An air channel 10 is formed between the dust collecting sheets 100 and the isolating members 101. The dust collecting sheets 100 are wrapped with conductive material 103. The conductive material 103 includes an avoidance groove 104. The avoidance groove 104 is arranged corresponding to the fixed groove 2.

[0057] It should be noted that the micro-electrostatic module forms an electrode plate by wrapping the conductive material 103 with a dielectric material, and uses the strong electric field formed inside the electrode plate after the electrode plate is energized to capture charged particles in the air.

[0058] Specifically, an electrode strip is installed in the electrode slot, and the electrode strip is electrically connected to the conductive material 103 located in the dust collecting sheet 100 after contacting the conductive material 103.

[0059] Specifically, after the fixed groove 2 is opened as a whole on the core body 1 of the micro-electrostatic module, in order to prevent the fixed groove 2 from being too close to the conductive material inside the dust collecting sheet and to prevent discharge problems between the conductive material and the external conductor, the conductive material is adaptively shrunk and an avoidance groove 104 is opened on the conductive material 103 to avoid the fixed groove 2. The shape of the avoidance groove 104 is adapted to the shape of the fixed groove 2 to ensure that the distance between the edge of the conductive material 103 and the edge of the dust collecting sheet meets the electrical safety distance, thereby ensuring electrical safety. At the same time, in order to ensure the purification effect of the micro-electrostatic module, the larger the area of the conductive material 103, the greater the purification effect and dust holding capacity of the micro-electrostatic module. Therefore, the distance between the edge of the avoidance groove 104 and the edge of the dust collecting sheet is ≥ the distance between the conductive material 103 and the edge of the dust collecting sheet at the non-avoidance groove 104, thereby ensuring electrical safety and maximizing the purification effect and dust holding capacity.

[0060] In the ultra-thin micro-electrostatic module of this embodiment, see Figure 7 The conductive material 103 is electrically connected to the high-voltage power supply through the electrode strips. The high-voltage power supply is a high-voltage power supply installed in the frame 3 or a high-voltage power supply installed outside the frame 3.

[0061] In the charging device of this embodiment, the electrode body is connected to a high-voltage power supply, and the high-voltage power supply is a built-in high-voltage power supply or an external high-voltage power supply.

[0062] Specifically, by adopting a built-in high-voltage power supply, a power supply compartment is added to any one of the frames 31 of the frame 3, and the high-voltage power supply is placed in the power supply compartment. Since a strong electric field needs to be generated in the micro-electrostatic module, a high-voltage power supply is required. When the high-voltage power supply is external, the high-voltage electrode box is exposed to the air for a long time. Due to the dirtiness of the high-voltage electrode box, the electrode box may creep and arc, thereby affecting the discharge efficiency of the electrode head, and even causing damage to the charging device or the high-voltage power supply. The built-in power supply can improve the reliability of the charging device.

[0063] In the ultra-thin micro-electrostatic module of this embodiment, the frame 3 includes multiple connecting components, each of which is connected to two adjacent frames 31 to connect the multiple frames 31 end to end. Specifically, the connecting components are corner tenons, and the multiple frames 31 are assembled through the multiple connecting components.

[0064] In the ultra-thin micro-electrostatic module of this embodiment, see Figure 1 The fixing components 4 include multiple fixing components 4, and the multiple fixing components 4 are arranged in a one-to-one correspondence with the multiple frames 31; and the fixing grooves 2 are correspondingly arranged in multiples.

[0065] It can be understood that each frame 31 is provided with a fixing component 4, and the micro-electrostatic module core 1 is provided with a corresponding fixing groove 2. The above arrangement improves the stability of the assembly between the micro-electrostatic module core 1 and the frame 3.

[0066] In the ultra-thin micro-electrostatic module of this embodiment, see Figure 8 The fixing part 4 includes a first fixing part 411 and a second fixing part 412 arranged at intervals, the first fixing part 411 is connected to one end of the frame 31, and the second fixing part 412 is connected to the end of the frame 31 away from the first fixing part 411; the fixing groove 2 includes a first fixing groove 21 and a second fixing groove 22 arranged at intervals, the first fixing groove 21 is arranged corresponding to the first fixing part 411, and the second fixing groove 22 is arranged corresponding to the second fixing part 412.

[0067] Specifically, the assembly structure of this embodiment is provided on the first dust collecting surface 11 and the second dust collecting surface 13 of the micro-electrostatic module core. The above arrangement improves the stability of the assembly between the micro-electrostatic module core 1 and the frame 3.

[0068] It should be noted that the first fixing member 411 and the second fixing member 412 as well as the first fixing groove 21 and the second fixing groove 22 may adopt a symmetrical structural design or an asymmetrical structural design.

[0069] In the ultra-thin micro-electrostatic module of this embodiment, the fixing slot 2 includes a first fixing slot 21 opened on the leeward side of the micro-electrostatic module core 1 , and the boss 41 is embedded in the first fixing slot 21 to support the micro-electrostatic module core 1 .

[0070] Specifically, the air first passes through the windward side of the micro-electrostatic module and then through the leeward side. In order to increase the structural strength of the micro-electrostatic module core, the fixing component adopts a boss structural design, that is, a first fixing groove 21 is opened on the leeward side of the micro-electrostatic module core 1, and a boss 41 is used to engage with the first fixing groove 21. The wind pressure pushes the micro-electrostatic module core onto the boss structure, which plays a good supporting role, reduces the use of frame materials, reduces the difficulty of assembly, and at the same time prevents the micro-electrostatic module core from deformation and detachment from the frame 3, thereby ensuring the assembly strength and stability of the micro-electrostatic module core.

[0071] Example 1

[0072] See also Figure 2 The first fixing part 411 and the second fixing part 412 and the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structural design. The first fixing part 411 and the second fixing part 412 are boss structures. The first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211 and a second connecting surface 212. The extension directions of the first connecting surface 211 and the second connecting surface 212 are perpendicular to each other.

[0073] It can be understood that, with the above embodiment, the micro-electrostatic module core 1 is fixed to each other by the bosses on both sides, and at this time, the support strength of the frame 3 on the micro-electrostatic module core 1 is relatively high.

[0074] Example 2

[0075] See also Figure 3 The first fixing part 411 and the second fixing part 412 and the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structural design. The first fixing part 411 and the second fixing part 412 are boss structures. The first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211 and a second connecting surface 212. The second connecting surface 212 is an arc-shaped surface.

[0076] It is understandable that when using the above embodiment, the fixing groove can continue to be filled with insulating glue to increase the fixing strength and sealing of the micro-electrostatic module core 1. At this time, the frame 3 has a higher supporting strength for the micro-electrostatic module core 1.

[0077] Example 3

[0078] See also Figure 4 The first fixing part 411 and the second fixing part 412 as well as the first fixing groove 21 and the second fixing groove 22 adopt an asymmetric structural design. The first fixing part 411 is insulating glue, the second fixing part 412 is a boss structure, the first fixing groove 21 is an inclined surface, and the second fixing groove 22 includes a first connecting surface 211 and a second connecting surface 212, and the second connecting surface 212 is an arc surface.

[0079] It can be understood that when the above embodiment is adopted, the structure in which the boss and the fixing groove are engaged on the leeward side can play a good supporting role.

[0080] Preferably, the thickness of the first dust collecting surface 11 is thickened to increase the dust collecting efficiency of the micro-electrostatic module core. At this time, the first fixed groove 21 is designed as an inclined surface, which can reduce the occupied area of the first fixed groove 21 and increase the dust holding surface of the micro-electrostatic module core 1.

[0081] Example 4

[0082] See also Figure 5 The first fixing part 411 and the second fixing part 412 adopt an asymmetric structural design, and the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structural design. The first fixing part 411 is insulating glue, and the second fixing part 412 is a boss structure. The first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211 and a second connecting surface 212, and the second connecting surface 212 is an arc surface.

[0083] It can be understood that when the above embodiment is adopted, the structure in which the boss and the fixing groove are engaged on the leeward side can play a good supporting role.

[0084] It is understandable that when the above embodiment is adopted, the second fixing groove 22 can also be further filled with insulating glue. Both fixing grooves are filled with insulating glue, which can increase the sealing performance of the micro-electrostatic module core.

[0085] Example 5

[0086] See also Figure 6 The first fixing part 411 and the second fixing part 412 and the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structural design. The first fixing part 411 and the second fixing part 412 are insulating glue. The first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211, and the first connecting surface 211 is an arc surface.

[0087] It can be understood that when the above embodiment is adopted, the dust collecting surfaces on both sides of the micro-electrostatic module core 1 adopt a structural design without bosses. At this time, the thickness of the frame is the thinnest, and the dust holding surface of the micro-electrostatic module core 1 reaches the maximum.

[0088] In the production method of this embodiment, see Figure 1 The production method is applicable to the above-mentioned ultra-thin micro-electrostatic module, and the production method includes: obtaining a micro-electrostatic module core 1; processing a fixing groove 2 on the micro-electrostatic module core 1, and the high temperature generated during the processing causes melting in the fixing groove 2; connecting multiple frames 31 to the micro-electrostatic module core 1 in sequence; embedding the fixing component 4 in the fixing groove 2; and completing the assembly of the ultra-thin micro-electrostatic module.

[0089] In some embodiments, after the micro-electrostatic module core 1 is formed as a whole, the fixing groove 2 is processed. The high temperature generated during the processing causes melting in the fixing groove 2. After the fixing groove 2 is processed, the frame 31 is connected one by one to the micro-electrostatic module core 1, so that the boss 41 is engaged in the corresponding fixing groove 2, and the connecting component is connected to each frame 31, thereby completing the assembly of the ultra-thin micro-electrostatic module.

[0090] In some embodiments, after the micro-electrostatic module core 1 is formed as a whole, the fixing groove 2 is processed. After the fixing groove 2 is processed, the frame 31 is connected one by one to the corresponding micro-electrostatic module core 1, the connecting parts are connected to each frame 31, and the insulating glue is filled in the fixing groove 2, thereby completing the assembly of the ultra-thin micro-electrostatic module.

[0091] The ultra-thin micro-electrostatic module of this embodiment solves the sealing problem of the micro-electrostatic module by adopting a thermal cutting process. The high temperature generated by the processing process causes melting in the fixing groove 2, and the micro-electrostatic module core 1 is hot-melted and liquefied to form a curled edge. After cooling, the layers and the cut edges between the layers blend together, and the conductive material 103 can be completely covered without damage, thereby producing a sealing effect between the dust collecting pieces of the micro-electrostatic module core 1, avoiding the occurrence of electrical safety problems, and ensuring that the ultra-thin micro-electrostatic module of this embodiment has a more ideal waterproof effect.

[0092] In some embodiments, when the frame 31 is fixed to the micro-electrostatic module core 1, a layer of colloid can be applied around the inside of the frame 31, or a layer of colloid can be applied along the first side wall 12 of the micro-electrostatic module core to increase the firmness and sealing of the connection between the frame 31 and the micro-electrostatic module core.

[0093] In the production method of some embodiments, see Figure 1 The method for machining the fixing groove 2 on the micro-electrostatic module core 1 includes: fixing the micro-electrostatic module core 1 on a thermal cutting device, and machining the fixing groove 2 by thermal cutting.

[0094] Specifically, the edge of the micro-electrostatic module core 1 is melted and cut off by directional movement of the electrode wire. After melting and cutting, a seal is formed between adjacent stacked isolation parts, and the conductive material is completely sealed in the isolation parts, ensuring that the ultra-thin micro-electrostatic module of this embodiment can be repeatedly washed and soaked.

[0095] The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. An ultra-thin micro-electrostatic module, characterized in that: include: A micro-electrostatic module core (1), the micro-electrostatic module core (1) comprising a plurality of air channels (10) for air circulation, and the micro-electrostatic module core (1) being provided with a fixing groove (2); A frame (3), the frame (3) comprising a plurality of frames (31) arranged corresponding to the micro-electrostatic module core (1), the micro-electrostatic module core (1) being accommodated within the frame (3); A fixing component (4), the fixing component (4) being embedded in the fixing groove (2), the fixing component (4) being connected to the frame (3) and the micro-electrostatic module core (1) to fix the micro-electrostatic module core (1); The fixing components (4) include a plurality of fixing components (4), and the plurality of fixing components (4) are arranged in a one-to-one correspondence with the plurality of frames (31); and the fixing grooves (2) are correspondingly arranged in a plurality of ways; The fixing component (4) comprises a first fixing component (411) and a second fixing component (412) which are spaced apart from each other, the first fixing component (411) being connected to one end of the frame (31), and the second fixing component (412) being connected to an end of the frame (31) away from the first fixing component (411); The fixing groove (2) comprises a first fixing groove (21) and a second fixing groove (22) arranged at intervals, the first fixing groove (21) being arranged corresponding to the first fixing component (411), and the second fixing groove (22) being arranged corresponding to the second fixing component (412).

2. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The fixing component (4) comprises a boss (41) formed integrally with the frame (31), the boss (41) extending in a direction close to the micro-electrostatic module core (1), and the boss (41) is embedded in the fixing groove (2).

3. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The fixing groove (2) comprises a first connecting surface (211) and a second connecting surface (212) connected to each other, and the extension directions of the first connecting surface (211) and the second connecting surface (212) are perpendicular to each other; or, The second connecting surface (212) is an arc-shaped surface.

4. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The fixing groove (2) comprises a first connecting surface (211), and the first connecting surface (211) is an inclined surface; or, The first connecting surface (211) is an arc-shaped surface.

5. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The micro-electrostatic module core (1) comprises a first dust collecting surface (11) and a second dust collecting surface (13) arranged opposite to each other, and a plurality of air passages (10) for air circulation are provided between the first dust collecting surface (11) and the second dust collecting surface (13); The first dust collecting surface (11) is arranged to protrude from the frame (31) along the extension direction of the air channel (10); and / or, The second dust collecting surface (13) is arranged to protrude from the frame (31) along the extension direction of the air channel (10).

6. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The fixing component (4) comprises insulating glue (42), and the insulating glue (42) is filled between the frame (31) and the fixing groove (2).

7. The ultra-thin micro-electrostatic module according to claim 1, characterized in that: The micro-electrostatic module core (1) comprises a plurality of dust collecting sheets (100) arranged in a stacked manner and a plurality of isolating members (101) arranged between the dust collecting sheets (100), wherein the air channel (10) is formed between the dust collecting sheets (100) and the isolating members (101), and the dust collecting sheets (100) are wrapped with a conductive material (103), wherein the conductive material (103) comprises an avoidance groove (104), and the avoidance groove (104) is arranged corresponding to the fixing groove (2).

8. The ultra-thin micro-electrostatic module according to claim 7, characterized in that: The conductive material (103) is electrically connected to a high-voltage power supply via electrode strips, and the high-voltage power supply is a high-voltage power supply installed in the frame (3) or a high-voltage power supply installed outside the frame (3).

9. The ultra-thin micro-electrostatic module according to claim 2, characterized in that: The fixing groove (2) comprises a first fixing groove (21) provided on the leeward side of the micro-electrostatic module core (1), and the boss (41) is embedded in the first fixing groove (21) to support the micro-electrostatic module core (1).

10. A production method, applicable to the ultra-thin micro-electrostatic module according to any one of claims 1 to 9, comprising: Obtaining the micro-electrostatic module core (1); Processing the fixing groove (2) on the micro-electrostatic module core (1), wherein the high temperature generated during the processing causes melting in the fixing groove (2); Connecting the plurality of frames (31) to the micro-electrostatic module core (1) in sequence; Embedding the fixing component (4) in the fixing groove (2); Complete the assembly of the ultra-thin micro-electrostatic module.

11. The production method according to claim 10, characterized in that The method for machining the fixing groove (2) on the micro-electrostatic module core (1) comprises: The micro-electrostatic module core (1) is fixed on a thermal cutting device, and the fixing groove (2) is processed by thermal cutting.

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