A rapid wafer slicing and cleaning apparatus

Abstract

The application discloses a kind of quick wafer slice cleaning equipment, it is related to wafer cleaning technical field, including cleaning chamber, the bottom of cleaning chamber is equipped with first motor, the output end of first motor is connected with rotating shaft, rotating shaft is equipped with rotary disc, rotary disc is equipped with the circumferential array of four support arms, each support arm is equipped with clamping seat, and the inner wall of clamping seat is placed with mounting ring by recessed groove, wafer is placed in mounting ring, and the upper and lower sides of cleaning chamber corresponding clamping seat are respectively equipped with cleaning mechanism and drying mechanism, and cleaning chamber extends out external plate, and external plate is equipped with collecting cylinder at clamping seat, clamping seat is equipped with top block, external plate is equipped with blocking rod, and cleaning chamber is equipped with drop cylinder, and cleaning chamber is equipped with support seat at drop cylinder.The application is simple in structure, and wafer is cleaned and dried by rotary disc, high in work efficiency, can be filled, released and collected automatically, can avoid contact with wafer surface in the process of collection, avoid secondary pollution, and is suitable for promotion.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wafer cleaning, and particularly relates to a quick wafer slice cleaning device. BACKGROUND

[0002] In the whole manufacturing process of semiconductor devices, up to 20% of the process steps are cleaning processes, so that the cleaning degree of the wafer surface becomes an important factor affecting the reliability of semiconductor devices. After chemical mechanical polishing processing, the pollutants (residues) composed of particles of polishing liquid, chemicals added to the polishing liquid, and reaction products of the polishing liquid will be left on the surface of the wafer, and these pollutants must be completely cleaned before entering the next process.

[0003] The wafer cleaning machine is usually composed of a cleaning tank, a spraying system, a brushing system, a drying system and a control system. The cleaning tank is used to contain cleaning liquid and wafers, the spraying system uniformly sprays cleaning liquid through high-pressure nozzles, the brushing system is equipped with special brushes to physically brush the wafers, and the drying system rapidly dries the wafers through hot air, infrared rays and the like. In the cleaning process, the wafers need to be placed in the cleaning tank, and the wafers need to be taken out after cleaning, which is easy to cause secondary pollution to the wafers in the process of taking out, and the cleaned wafers are stacked together, which is not convenient for single taking down. SUMMARY

[0004] The purpose of the present application is to provide a quick wafer slice cleaning device with simple structure, which can drive the wafer cleaning and drying through the rotating disc, has high work efficiency, can automatically fill and release the wafer collection, can avoid contact with the wafer surface in the process of collection, avoid secondary pollution, and is suitable for promotion.

[0005] The application provides the following technical scheme: a quick wafer slice cleaning device, comprising a cleaning chamber, a first motor is fixedly arranged at the bottom of the cleaning chamber, a rotating shaft extending upwards into the cleaning chamber is connected to the output end of the first motor, a sleeve is fixedly arranged on the lower half of the rotating shaft, a rotating disc is fixedly arranged above the rotating shaft, four support arms in a circumferential array are fixedly arranged on the side of the rotating disc, and a clamping seat is fixedly arranged on each support arm.

[0006] The clamping seat is a ring type greater than half, the middle part is a truncated part, first extension plates which are symmetrical to each other and face outward are fixedly arranged at the truncated part, a sliding rod penetrating between the two first extension plates is arranged, the sliding rod is an arc-shaped rod with edges, the arc degree of the sliding rod matches the diameter of the clamping seat, a first spring is sleeved on the sliding rod, an installation ring is clamped on the inner wall of the clamping seat through an inner recessed groove, and a wafer is clamped in the installation ring.

[0007] The cleaning chamber is provided with a cleaning mechanism and a drying mechanism on the upper and lower sides of the clamping seat respectively, an external plate is fixed outside the cleaning chamber and extends outward, a collecting cylinder is fixed at the position corresponding to the clamping seat of the external plate, a top block is fixed at the outermost end of the clamping seat, and a blocking rod corresponding to the position of the top block is fixed on the side of the external plate close to the collecting cylinder.

[0008] A dropping cylinder is fixed between the collecting cylinder and the cleaning mechanism of the cleaning chamber, the cross-sectional diameter of the dropping cylinder matches the mounting ring, the position of the dropping cylinder is opposite to the clamping seat, a supporting seat is fixed at the position corresponding to the dropping cylinder at the bottom of the cleaning chamber, an extension block is arranged on the side of the supporting seat close to the cleaning mechanism, and a spring mechanism is arranged in the extension block.

[0009] Preferably, the mounting ring is provided with a first half ring and a second half ring which are symmetrical, the second half ring is fixed to the inner wall of the mounting ring, the first half ring is provided with a pull rod, the pull rod penetrates the mounting ring and is provided with a pull ring, the upper and lower edges of the first half ring and the second half ring are provided with a second sliding surface, the inner wall of the first half ring and the second half ring is provided with a clamping groove, the wafer is arranged in the clamping groove, the side opposite to the first half ring and the second half ring is provided with a second extension plate which is symmetrical, the second extension plate on the second half ring is provided with a spring column, the spring column penetrates the second extension plate of the first half ring and is provided with a second spring behind it.

[0010] Preferably, a sleeve ring is fixed above the first half ring and the second half ring of the mounting ring, the cross-sectional diameter of the sleeve ring matches the wafer, the lower surface edge of the wafer is opposite to the second sliding surface, the clamping groove of the first half ring is tightly connected with the side edge of the wafer, and a top rod is fixed on both sides of the mounting ring and penetrates into the first half ring and is opposite to the position of the clamping groove.

[0011] Preferably, the cleaning mechanism comprises a driving cavity, the bottom of the driving cavity is provided with a rotating pipe penetrating through, the bottom of the rotating pipe is provided with a brush disc fixedly, the brush disc is provided with a brush plate on the side facing the clamping seat, the brush plate is provided with a brush, the brush plate is provided with a hole penetrating through, the driving cavity is provided with a liquid inlet pipe penetrating through the cleaning chamber, one end of the liquid inlet pipe in the driving cavity is provided with a sealing seat fixedly, the rotating pipe is clamped in the sealing seat and is connected with the sealing seat in rotation, the outer wall of the rotating pipe is provided with a gear ring fixedly, the driving cavity is provided with a second motor fixedly, and the output end of the second motor is connected with a gear meshing with the gear ring.

[0012] Preferably, the collecting cylinder and the dropping cylinder are provided with openings on the side corresponding to the pull ring, the top block is provided with a first sliding surface on the side facing the blocking rod, and the shape of the top block satisfies that when the top block is pressed by the blocking rod, the clamping seat is opened to a state that the mounting ring can fall off.

[0013] Preferably, clamping seats extend from the upper and lower sides of the mounting ring, and the height of the support seat is such that the height of the mounting ring placed on it matches the height of the clamping seat.

[0014] Preferably, the drying mechanism includes a heater, and the drying plate of the heater is located on the upper and lower sides of the mounting ring. The position of the drying plate is such that when the wafer and the brush plate are opposite each other, the drying plate is opposite to the position of the washed wafer. The cleaning chamber is provided with a through opening on the side wall facing the collection cylinder corresponding to the clamping seat, and the cleaning chamber is provided with an observation window.

[0015] The beneficial effects of this invention are: simple structure, high working efficiency, automatic wafer filling, release and collection, and avoidance of contact with the wafer surface during collection to prevent secondary contamination, as detailed below:

[0016] (1) The present invention is provided with a rotating disk. When cleaning the wafer, the rotating disk is driven to rotate by the first motor. The clamping seat on the rotating disk moves and engages with the mounting ring at the support seat, and drives the mounting ring to the brush plate. The brush plate brushes the wafer on the mounting ring from both the top and bottom sides at the same time. After brushing, the rotating disk continues to rotate, driving the mounting ring to the drying plate for drying. At this time, the next mounting ring is located at the brush plate for cleaning. After the wafer on the mounting ring is dried and the wafer on the next mounting ring is cleaned, the rotating disk continues to rotate. When the mounting ring moves to the collection cylinder, the mounting ring is automatically put down, thus forming a streamlined wafer cleaning process and speeding up the work efficiency.

[0017] (2) The present invention is provided with a clamping seat. When the clamping seat moves to the support seat, its opening is located on both sides of the mounting ring on the support seat. Due to the obstruction of the telescopic block, the opening of the clamping seat is squeezed, the first spring is compressed, the clamping seat opening opens, and the mounting ring is inserted into the clamping seat and clamped by the clamping seat. When the clamping seat continues to move, the telescopic block that blocks the mounting ring is squeezed and retracted into the support seat, allowing the clamping seat and the mounting ring to pass through, thereby realizing automatic feeding of the wafer cleaning. When the clamping seat moves to the collection cylinder, the top block on it is stuck on the blocking rod, and the first spring is squeezed again, causing the clamping seat to open and the mounting ring to fall into the collection cylinder. As the clamping opening becomes larger, the top block gradually separates from the blocking rod, allowing the clamping seat to pass through, thereby realizing automatic release of the wafer.

[0018] (3) The present invention is provided with a mounting ring. When cleaning the wafer, the wafer is pressed down, which squeezes the second sliding surface, causing the first half ring and the second half ring to open, allowing the wafer to pass through to the clamping groove and be clamped by the mounting ring. During cleaning, both sides of the wafer are cleaned at the same time. After cleaning, the wafer is supported in the mounting ring, so that each wafer is stored independently. When picking up and putting down, it is done through the mounting ring to avoid direct contact with the wafer. When it is necessary to remove the wafer, pull the pull ring to make the first half ring move outward. Since the holding force on the first half ring is greater than that on the second half ring, the wafer separates from the second half ring, and the push rod on the first half ring pushes into the clamping groove, pushing the wafer out from the first half ring, thereby releasing the wafer. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is an overall schematic diagram of the present invention;

[0021] Figure 2 This is a diagram of the internal structure of the present invention;

[0022] Figures 3-4 This is a cross-sectional view of the present invention;

[0023] Figure 5 This is a structural diagram of the clamping seat in this invention;

[0024] Figure 6 This is a diagram of the internal structure of the mounting ring in this invention;

[0025] Figure 7 This is an enlarged view of point A in this invention;

[0026] Figure 8 This is a cross-sectional view of the clamping seat in this invention.

[0027] The diagram is labeled as follows: 1. Cleaning chamber; 2. Observation window; 3. Through port; 4. First motor; 5. Rotary disc; 6. Sleeve; 7. Rotating shaft; 8. Support arm; 9. Clamping seat; 10. Mounting ring; 11. External plate; 12. Collection cylinder; 13. Dispensing cylinder; 14. Blocking rod; 15. Top block; 16. Opening; 17. Support seat; 18. Drive chamber; 19. Brush disc; 20. Liquid inlet pipe; 21. Second motor; 22. Sealing seat; 23. Rotating pipe; 2 4. Gear ring; 25. Brush plate; 26. Brush; 27. Heater; 28. Drying plate; 29. ​​First extension plate; 30. Sliding rod; 31. First spring; 32. First sliding surface; 33. First half ring; 34. Second half ring; 35. Second extension plate; 36. Spring post; 37. Second spring; 38. Second sliding surface; 39. Grip groove; 40. Pull-out rod; 41. Top rod; 42. Telescopic block; 43. Collar; 44. Wafer; 45. Pull-out ring. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] The structural features of the present invention will now be described in detail with reference to the accompanying drawings.

[0032] See Figures 1-2A quick wafer slicing cleaning device includes a cleaning chamber 1. A first motor 4 is fixedly installed at the bottom of the cleaning chamber 1. The output end of the first motor 4 is connected to a rotating shaft 7 extending upward into the cleaning chamber 1. A sleeve 6 is fixedly installed in the cleaning chamber 1 and fitted onto the lower half of the rotating shaft 7. A rotating disk 5 is fixedly installed above the sleeve 6 on the rotating shaft 7. The rotating disk 5 is supported by the sleeve 6 and driven to rotate by the rotating disk 5. Four support arms 8 in a circumferential array are fixedly installed on the side of the rotating disk 5. A clamping seat 9 is fixedly installed on each support arm 8.

[0033] See Figure 2 , 5 8. The clamping seat 9 is a ring shape with more than half of it. The middle part is a cut-off part. The cut-off part is fixed with a first extension plate 29 that is symmetrical and facing outward. A sliding rod 30 is provided between the two first extension plates 29. The sliding rod 30 is an arc-shaped rod with edges. The edges prevent the outer half ring from rotating. Its curvature matches the diameter of the clamping seat 9, so that the first extension plate 29 moves along the sliding rod 30. A first spring 31 is sleeved on the sliding rod 30. An installation ring 10 is placed in the inner wall of the clamping seat 9 through a concave groove. The wafer 44 is placed in the installation ring 10.

[0034] See Figures 5-8The mounting ring 10 has a symmetrical first half-ring 33 and a second half-ring 34. The second half-ring 34 is fixed to the inner wall of the mounting ring 10. The first half-ring 33 is fixedly provided with a pull rod 40, which passes through the mounting ring 10 and is fixedly provided with a pull ring 45. The first half-ring 33 is pulled by the pull ring 45. The upper and lower edges of the first half-ring 33 and the second half-ring 34 are provided with second sliding surfaces 38. The wafer 44 is pressed down on the second sliding surfaces 38, so that the first half-ring 33 and the second half-ring 34 are stretched. The first half-ring 33 and the second half-ring 34 have clamping grooves 39 on their inner walls. The wafer 44 is located in the clamping grooves 39. A symmetrical second extension plate 35 is fixedly provided on the opposite side of the first half-ring 33 and the second half-ring 34. A spring post 36 is fixedly provided on the second extension plate 35 on the second half-ring 34. The spring post 36 passes through the second extension plate 35 of the first half-ring 33, and a second spring 37 is sleeved behind it. The second spring 37 pushes the second extension plate 35 of the first half-ring 33. When the first half-ring 33 and the second half-ring 34 are closed together and subjected to external pressure, the second spring 37 is compressed, and the first half-ring 33 and the second half-ring 34 open to allow the wafer 44 to pass through. A collar 43 is fixedly mounted above the first half-ring 33 and the second half-ring 34 on the mounting ring 10. The cross-sectional diameter of the collar 43 matches that of the wafer 44. The lower edge of the wafer 44 is opposite to the second sliding surface 38. When the wafer 44 is located inside the collar 43, it is parallel to the mounting ring 10 and aligned with the second sliding surface 38. The two sliding surfaces 38 and the clamping groove 39 of the first half ring 33 are tightly connected to the side of the wafer 44, so that the holding force on the first half ring 33 is greater than that on the second half ring 34. The wafer 44 can move with the first half ring 33 and separate from the second half ring 34. The mounting ring 10 is fixedly provided with push rods 41 on both sides of the pull rod 40. The push rods 41 penetrate into the first half ring 33 and are opposite to the clamping groove 39. When the second half ring 34 is pulled, the push rods 41 push into the clamping groove 39 and push the wafer 44 out from the first half ring 33.

[0035] See Figure 1 , 24. The cleaning chamber 1 is equipped with a cleaning mechanism and a drying mechanism on the upper and lower sides of the clamping seat 9, respectively. An outwardly extending outer plate 11 is fixedly installed on the outer side of the cleaning chamber 1. A collection cylinder 12 is fixedly installed on the outer plate 11 at the clamping seat 9. The collection cylinder 12 collects the fallen mounting rings 10. A top block 15 is fixedly installed at the outermost end of the clamping seat 9. A blocking rod 14 corresponding to the position of the top block 15 is fixedly installed on the outer plate 11 on one side of the collection cylinder 12. When the clamping seat 9 moves to the collection cylinder 12, the top block 15 on it is locked onto the blocking rod 14, causing the clamping seat 9 to open. A delivery cylinder 13 is fixedly installed in the cleaning chamber 1 between the collection cylinder 12 and the cleaning mechanism. The cross-sectional diameter of the delivery cylinder 13 matches that of the mounting rings 10. The mounting rings 10 are stacked inside the delivery cylinder 13. The position of the delivery cylinder 13 is opposite to that of the clamping seat 9. The collection cylinder 12 and the delivery cylinder 13 have openings 16 on one side of the pull ring 45. The bottom of the cleaning chamber 1 is fixedly provided with a support base 17 corresponding to the delivery cylinder 13. The support base 17 has a telescopic block 42 on the side near the cleaning mechanism. The telescopic block 42 is provided with a spring mechanism inside the support base 17. The top block 15 has a first sliding surface 32 on the side facing the blocking rod 14. The shape of the top block 15 is such that when it is squeezed by the blocking rod 14, the clamping seat 9 opens to the state where the mounting ring 10 can fall off. When the squeezing force increases, the telescopic block 42 retracts into the support base 17 to allow the clamping seat 9 and the mounting ring 10 to pass through. The clamping seat 9 extends from the upper and lower sides of the mounting ring 10. The height of the support base 17 is such that the height of the mounting ring 10 placed on it matches the height of the clamping seat 9, so that the groove of the clamping seat 9 can be locked on the protruding outer wall of the mounting ring 10.

[0036] See Figures 1-4The cleaning mechanism includes a drive chamber 18, with a through-hole rotating tube 23 at the bottom of the drive chamber 18. A brush plate 19 is fixedly mounted at the bottom of the rotating tube 23. A brush plate 25 is mounted on the side of the brush plate 19 facing the clamping seat 9, and brushes 26 are mounted on the brush plate 25. The upper and lower sides of the wafer are cleaned by rotating the brush plate 19. The brush plate 25 has through holes for the cleaning fluid to be sprayed out. An inlet pipe 20 is provided inside the drive chamber 18, extending out of the cleaning chamber 1. A sealing seat 22 is fixedly mounted at one end of the inlet pipe 20 inside the drive chamber 18. The rotating tube 23 is clamped in the sealing seat 22 and rotatedly connected to it. A gear ring 24 is fixedly mounted on the outer wall of the rotating tube 23. A second motor 21 is fixedly mounted inside the drive chamber 18. The output end of the second motor 21 is connected to a gear that meshes with the gear ring 24. The second motor 21 drives the gear ring 24 to rotate, which in turn drives the brush plate 19 to rotate for cleaning. The drying mechanism includes a heater 27. The drying plate 28 of the heater 27 is located on the upper and lower sides of the mounting ring 10. The position of the drying plate 28 is such that when the wafer 44 and the brush plate 25 are opposite each other, the drying plate 28 is opposite to the position of the cleaned wafer 44, so that the mounting ring 10 is dried at the drying plate 28. At this time, the next mounting ring 10 is located at the brush plate 25 for cleaning. The cleaning chamber 1 has a through-hole 3 on the side wall facing the collection cylinder 12 corresponding to the clamping seat 9, so that the clamping seat 9 can rotate out of the cleaning chamber 1. The cleaning chamber 1 is provided with an observation window 2.

[0037] The quick wafer slicing cleaning equipment of the present invention has a simple structure. It drives the wafer cleaning and drying through a rotating disk, which has high working efficiency. It can automatically fill, release and collect wafers. During the collection process, it can avoid contact with the wafer surface and avoid secondary pollution, making it suitable for widespread application.

[0038] For specific usage, please refer to... Figures 1-4 During wafer cleaning, the first motor 4 drives the rotating disk 5 to rotate. The clamping seat 9 on the rotating disk 5 moves past the support seat 17 and engages with the mounting ring 10, which in turn moves the mounting ring 10 to the brush plate 25. The brush plate 25 simultaneously brushes the wafer on the mounting ring 10 from both the top and bottom. After brushing, the rotating disk 5 continues to rotate, moving the mounting ring 10 to the drying plate 28 for drying. At this time, the next mounting ring 10 is located at the brush plate 25 for cleaning. After the wafer on the mounting ring 10 is dried and the wafer on the next mounting ring 10 is cleaned, the rotating disk 5 continues to rotate. When the mounting ring 10 moves to the collection cylinder 12, the mounting ring 10 is automatically lowered, thus forming a standardized wafer cleaning process.

[0039] See Figure 6 , 8During wafer cleaning, wafer 44 is pressed down, which compresses the second sliding surface 38, causing the first half-ring 33 and the second half-ring 34 to open, allowing wafer 44 to pass through to the clamping groove 39 where it is clamped by the mounting ring 10. During cleaning, both sides of wafer 44 are cleaned simultaneously. After cleaning, wafer 44 is supported in the mounting ring 10, allowing each wafer to be stored independently. Removal is done through the mounting ring 10 to avoid direct contact with the wafer. When wafer 44 needs to be removed, the pull ring 45 is pulled, causing the first half-ring 33 to move outward. Since the holding force on the first half-ring 33 is greater than that on the second half-ring 34, wafer 44 separates from the second half-ring 34, and the push rod 41 on the first half-ring 33 pushes into the clamping groove 39, pushing wafer 44 out from the first half-ring 33, thereby releasing wafer 44.

[0040] See Figures 5-8 When the clamping seat 9 moves to the support seat 17, its opening is located on both sides of the mounting ring 10 on the support seat 17. Due to the obstruction of the telescopic block 42, the opening of the clamping seat 9 is squeezed, the first spring 31 is compressed, the opening of the clamping seat 9 opens, and the mounting ring 10 is inserted into the clamping seat 9 and clamped by the clamping seat 9. When the clamping seat 9 continues to move, the telescopic block 42 that obstructs the mounting ring 10 is squeezed and retracted into the support seat 17, allowing the clamping seat 9 and the mounting ring 10 to pass through for automatic feeding of the wafer cleaning. When the clamping seat 9 moves to the collection cylinder 12, the top block 15 on it is stuck on the blocking rod 14, and the first spring 31 is squeezed again, causing the clamping seat 9 to open, and the mounting ring 10 falls into the collection cylinder 12. As the clamping opening becomes larger, the top block 15 gradually separates from the blocking rod 14, allowing the clamping seat 9 to pass through for automatic release of the wafer.

[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A rapid wafer slicing cleaning device, comprising a cleaning chamber (1), characterized in that, The bottom of the cleaning chamber (1) is fixedly provided with a first motor (4), the output end of the first motor (4) is connected to a rotating shaft (7) extending upward into the cleaning chamber (1), the cleaning chamber (1) is fixedly provided with a sleeve (6) fitted on the lower half of the rotating shaft (7), the rotating shaft (7) is fixedly provided with a rotating disk (5) above the sleeve (6), the side of the rotating disk (5) is fixedly provided with four support arms (8) in a circular array, and each support arm (8) is fixedly provided with a clamping seat (9); The clamping seat (9) has a cut-off section in the middle. The cut-off section is fixed with symmetrical first extension plates (29) facing outwards. A sliding rod (30) is provided between the two first extension plates (29). The sliding rod (30) is an arc-shaped rod with edges. Its curvature matches the diameter of the clamping seat (9). A first spring (31) is sleeved on the sliding rod (30). An installation ring (10) is placed in the inner wall of the clamping seat (9) through a concave groove. The wafer (44) is placed in the installation ring (10). The cleaning chamber (1) is provided with a cleaning mechanism and a drying mechanism on the upper and lower sides of the clamping seat (9), respectively. An outwardly extending outer plate (11) is fixedly provided on the outer side of the cleaning chamber (1). A collection tube (12) is fixedly provided on the outer plate (11) corresponding to the clamping seat (9). A top block (15) is fixedly provided at the outermost end of the clamping seat (9). A blocking rod (14) corresponding to the position of the top block (15) is fixedly provided on the side of the outer plate (11) located on the collection tube (12). The cleaning chamber (1) is fixedly provided with a delivery cylinder (13) between the collection cylinder (12) and the cleaning mechanism. The cross-sectional diameter of the delivery cylinder (13) matches that of the mounting ring (10). The position of the delivery cylinder (13) is opposite to that of the clamping seat (9). A support seat (17) is fixedly provided at the bottom of the cleaning chamber (1) corresponding to the delivery cylinder (13). A telescopic block (42) is provided on the side of the support seat (17) near the cleaning mechanism. A spring mechanism is provided in the telescopic block (42) inside the support seat (17). The collecting cylinder (12) and the dispensing cylinder (13) have an opening (16) on one side of the pull ring (45). The top block (15) has a first sliding surface (32) on the side facing the blocking rod (14). The shape of the top block (15) satisfies that when it is squeezed by the blocking rod (14), the clamping seat (9) opens to the state where the mounting ring (10) can fall off.

2. The rapid wafer slicing cleaning equipment according to claim 1, characterized in that, The mounting ring (10) is provided with a first half ring (33) and a second half ring (34) that are symmetrically arranged. The second half ring (34) is fixed to the inner wall of the mounting ring (10). The first half ring (33) is fixedly provided with a pull rod (40). The pull rod (40) passes through the mounting ring (10) and is fixedly provided with a pull ring (45). The upper and lower edges of the first half ring (33) and the second half ring (34) are provided with second sliding surfaces (38). The inner walls of the first half ring (33) and the second half ring (34) are provided with clamping grooves (39). The wafer (44) is located in the clamping grooves (39). The opposite side of the first half ring (33) and the second half ring (34) is fixedly provided with a symmetrical second extension plate (35). The second extension plate (35) on the second half ring (34) is fixedly provided with a spring post (36). The spring post (36) passes through the second extension plate (35) of the first half ring (33) and is fitted with a second spring (37) at a distance behind it.

3. The rapid wafer slicing cleaning equipment according to claim 2, characterized in that, The mounting ring (10) is fixedly provided with a collar (43) above the first half ring (33) and the second half ring (34). The cross-sectional diameter of the collar (43) matches that of the wafer (44). The lower surface edge of the wafer (44) is opposite to the second sliding surface (38). The clamping groove (39) of the first half ring (33) is tightly connected to the side of the wafer (44). The mounting ring (10) is fixedly provided with a top rod (41) on both sides of the pull rod (40). The top rod (41) penetrates the first half ring (33) and is opposite to the clamping groove (39).

4. The rapid wafer slicing cleaning equipment according to claim 1, characterized in that, The cleaning mechanism includes a drive chamber (18), a rotating tube (23) passing through the bottom of the drive chamber (18), a brush plate (19) fixedly provided at the bottom of the rotating tube (23), a brush plate (25) provided on the side of the brush plate (19) facing the clamping seat (9), a brush (26) provided on the brush plate (25), a through hole provided on the brush plate (25), an inlet pipe (20) passing through the cleaning chamber (1) provided in the drive chamber (18), a sealing seat (22) fixedly provided at one end of the inlet pipe (20) located in the drive chamber (18), the rotating tube (23) is clamped in the sealing seat (22) and rotatedly connected to it, a gear ring (24) fixedly provided on the outer wall of the rotating tube (23), a second motor (21) fixedly provided in the drive chamber (18), and a gear meshing with the gear ring (24) connected to the output end of the second motor (21).

5. A rapid wafer slicing cleaning device according to claim 2, characterized in that, The mounting ring (10) extends into clamping seats (9) on its upper and lower sides. The height of the support seat (17) is such that the height of the mounting ring (10) placed on it matches the height of the clamping seat (9).

6. The rapid wafer slicing cleaning equipment according to claim 4, characterized in that, The drying mechanism includes a heater (27), and the drying plate (28) of the heater (27) is located on the upper and lower sides of the mounting ring (10). The position of the drying plate (28) is such that when the wafer (44) and the brush plate (25) are opposite each other, the drying plate (28) is opposite to the position of the washed wafer (44). The cleaning chamber (1) has a through opening (3) on the side wall facing the collection cylinder (12) corresponding to the clamping seat (9). The cleaning chamber (1) has an observation window (2).

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