A high thermal conductivity variable frequency component

Abstract

The present application relates to a high heat-conducting frequency conversion component, which includes a three-layer structure of a bottom case, a middle plate, and an upper cover and a circuit board. A closed chamber for arranging the middle plate and the circuit board is provided between the bottom case and the upper cover. The component further includes: a hollowed-out part, which is located on the middle plate and has a plurality of them, and separates each component module on the circuit board into different isolation chambers; a communication groove, which is located on the middle plate and is used to connect two adjacent hollowed-out parts; a plurality of heat pipes, which penetrate through several adjacent isolation chambers, and the heat pipes are embedded in a plurality of continuously adjacent communication grooves. The heat pipes are flat, and one flat surface thereof is in thermal contact with the upper cover, and the other flat surface is in thermal contact with the heat-generating components on the circuit board; a refrigeration module for refrigerating the condensation end of the heat pipe is arranged in the closed chamber. Through the continuous gasification-liquefaction cycle of the phase change liquid in the heat pipe, the present application can quickly export the heat of each heat-generating component in the closed chamber, effectively ensuring the stability and working performance of the frequency conversion component during operation.

Description

Technical Field

[0001] This application relates to the technical field of frequency conversion components, and particularly to a high thermal conductivity frequency conversion module. Background Art

[0002] In a microwave system, the function of a frequency conversion module is to achieve signal frequency conversion. Specifically, it converts a low-frequency signal into a high-frequency signal, or converts a high-frequency signal into a low-frequency signal. This conversion is very important in both the transmission and reception processes. During the frequency conversion process, only frequency shifting and power level change are involved, and generally the carried signal is not processed. Therefore, during the frequency conversion process, the characteristics of the signal should be affected as little as possible, and strict requirements are imposed on the phase noise, group delay, and gain flatness of the signal.

[0003] With the continuous reduction of the volume of electronic devices, and in some application scenarios, strict requirements are imposed on the weight and volume of the frequency conversion module. Therefore, the miniaturization and light weight of the product are crucial. Therefore, it is very necessary to provide a miniaturized structure of the frequency conversion module with a simple structure, high reliability, small volume, light weight, and convenient installation and connection.

[0004] The Chinese patent with the publication number CN106508089A in the related art proposes a frequency conversion module structure. The frequency conversion structure module of the present invention adopts a three-layer installation structure of layer A, A-B sandwich layer, and layer B. Among them, functional circuit boards with different frequency bands are respectively arranged on layer A and layer B. The functional circuit boards on the same layer are physically isolated from each other, and the signal interaction between them is connected through a high-shielding fine coaxial cable; the signal interaction between the functional circuit boards on layers A and B is connected through signal connection posts arranged on the A-B sandwich layer. And through power transfer board I, power transfer board II, and feedthrough capacitors, the power supply problems of the functional circuit boards that require high isolation are solved. Through the highly integrated functional circuit boards, the volume of the frequency conversion module structure is effectively reduced, the functional circuits of the frequency conversion module are optimally arranged in a limited space, and efficient isolation between the circuits is completed, greatly reducing the crosstalk easily introduced by the connection of signal lines and power lines, and having great practical application value.

[0005] The above-mentioned related technology has the following defects: During the long-term operation of the frequency conversion module, a large amount of heat will be generated. Especially, the upper, middle, and lower three-layer structures of the frequency conversion module are physically isolated from each other, and the heat is difficult to dissipate quickly, which will have a greater impact on the service life of each component in the frequency conversion module. Among them, heat-generating components such as power semiconductor devices, resistors, inductors, and transformers generate a large amount of heat. After being sealed in the middle cavity, their heat is difficult to dissipate in time, which will affect the overall working performance and stability of the frequency conversion module. Summary of the Invention

[0006] To address the problem that heat generated by components encapsulated in the middle-layer cavity of a variable-frequency component is difficult to dissipate in a timely manner during operation, the present application provides a high-thermal-conductivity variable-frequency component.

[0007] The high-thermal-conductivity variable-frequency component provided by the present application adopts the following technical solution:

[0008] A high-thermal-conductivity variable-frequency component includes a three-layer structure of a bottom case, a middle plate, and an upper cover, and a circuit board. A closed chamber for accommodating the middle plate and the circuit board is provided between the bottom case and the upper cover. It further includes:

[0009] Hollow portions, which are located on the middle plate and there are multiple of them. They separate each component module on the circuit board into different isolation chambers;

[0010] Communication grooves, which are located on the middle plate and are used to connect two adjacent hollow portions; [[ID=1...]]

[0011] Heat pipes, there are multiple of them and they penetrate through several adjacent isolation chambers. The heat pipes are embedded in a plurality of continuously adjacent communication grooves, and the heat pipes are flat-shaped, and one flat surface thereof is in thermal contact with the upper cover, and the other flat surface is in thermal contact with the heat-generating components on the circuit board;

[0012] A refrigeration module for cooling the condensation end of the heat pipe is provided in the closed chamber.

[0013] Furthermore, the heat pipe includes:

[0014] A pipe body, both ends of which are closed, and a phase-change liquid is filled inside;

[0015] A capillary structure layer, which is provided on the inner wall of the pipe body.

[0016] Furthermore, the refrigeration module includes:

[0017] A liquid tank, which is filled with a refrigerant inside;

[0018] A refrigeration pipe, both ends of which are communicated with the liquid tank;

[0019] Refrigeration nodes, which are connected to the refrigeration pipe and there are multiple of them corresponding to the multiple heat pipes. The refrigeration nodes are wrapped around the outside of the condensation end of the heat pipe;

[0020] A pumping assembly for promoting the circulation of the refrigerant in the refrigeration pipe.

[0021] Furthermore, the pumping assembly includes:

[0022] An elastic bladder, which is located inside the refrigeration node and is communicated with the inside of the condensation end of the heat pipe;

[0023] One-way valves are provided in plurality on the refrigeration pipes, and the one-way valves are provided on the refrigeration pipes on both sides of the refrigeration section. The directions in which the plurality of one-way valves restrict the fluid flow are the same.

[0024] Furthermore, the opening direction of the elastic bladder faces away from the heat pipe, and in the initial state, the elastic bladder is received in the heat pipe and extends into the cavity between the heat pipe and the refrigeration section after expansion.

[0025] Furthermore, through holes for the two ends of the refrigeration pipe to pass through are formed through the bottom case or the upper cover, and the liquid tank is placed outside the bottom case or the upper cover.

[0026] Furthermore, both the liquid tank and the refrigeration section are made of heat-conducting metal.

[0027] Furthermore, both the liquid tank and the refrigeration section are made of heat-conducting metal.

[0028] In summary, the beneficial technical effects of the present application are as follows:

[0029] 1. When the heating elements in the respective isolation chambers generate heat during operation, the heat is absorbed by the evaporation end of the heat pipe in thermal contact therewith. The phase change liquid in the heat pipe is heated and evaporated into a gas and flows towards the condensation end of the heat pipe, and the heat of the multiple heating elements in multiple continuously adjacent isolation chambers can be carried out; when the vaporized phase change liquid flows to the condensation end of the heat pipe, it is cooled by the refrigeration module and condensed into a liquid again. Due to the capillary force, the liquid will be adsorbed into the capillary structure layer and flow along the capillary structure layer towards the evaporation end of the heat pipe, and this kind of flow is continuous, so that the phase change liquid can continuously carry out the gasification-liquefaction cycle to achieve the continuous heat conduction effect of the heat pipe; thus, through the heat conduction of multiple heat pipes on the circuit board in the closed chamber for each heating element, a large amount of heat generated in the closed chamber can be quickly exported, effectively ensuring the stability and working performance of the frequency conversion component during operation;

[0030] 2. When the heat pipe exports the heat in each isolation chamber, the phase change liquid in the heat pipe evaporates into a gas and flows towards the condensation end of the heat pipe, and the internal pressure in the heat pipe increases, causing the elastic bladder to expand in the cavity between the refrigeration section and the condensation end of the heat pipe, thereby promoting a part of the refrigeration liquid in the refrigeration section to pass through the one-way valve on the side of its downward section and enter the refrigeration pipe in the downward section, or enter the next refrigeration section in the downward section, or return to the liquid tank; and since the refrigeration pipe and the liquid tank are a closed system, the expansion of the elastic bladder after the heat pipe conducts heat can form a pumping force for pumping the refrigeration liquid in the refrigeration section, and there is no need to additionally set a circulation pump with an external power source, which can greatly save the installation space of the frequency conversion component;

[0031] 3. The pumping forces formed after the elastic capsules on multiple heat pipes expand can be superimposed, thus ensuring the stable circulation effect of the refrigerant in the refrigeration pipes. At the same time, the greater the heat generated by the heating element in the isolation chamber, the more frequent the gasification-liquefaction cycle of the phase change liquid in the heat pipe, and the higher the pumping frequency of the elastic capsule. Furthermore, the flow velocity of the refrigerant in the refrigeration pipe can be increased, and the heat conduction efficiency of the heat pipe and the refrigeration module can also be further improved. Brief Description of the Drawings

[0032] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application;

[0033] Figure 2 is a schematic cross-sectional structure diagram of an embodiment of the present application;

[0034] Figure 3 is a schematic diagram of the overall structure of an embodiment of the present application after hiding the upper cover;

[0035] Figure 4 is an exploded structure diagram of an embodiment of the present application;

[0036] Figure 5 is a cross-sectional view of the refrigeration module after the elastic capsule expands in an embodiment of the present application;

[0037] Figure 6 is a cross-sectional view of the refrigeration module after the elastic capsule returns to its original state in an embodiment of the present application.

[0038] Description of the Reference Numerals:

[0039] 1, bottom case; 11, closed chamber; 12, isolation chamber; 13, perforation;

[0040] 2, middle plate; 21, hollowed-out part; 22, communication groove;

[0041] 3, upper cover;

[0042] 4, circuit board;

[0043] 5, heat pipe; 51, pipe body; 52, capillary structure layer;

[0044] 61, liquid tank; 62, refrigeration pipe; 63, refrigeration section;

[0045] 71, elastic capsule; 72, one-way valve. Detailed Embodiment

[0046] Next, the technical solutions of the present application will be described clearly and completely with reference to the drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0047] An embodiment of the present application discloses a high - thermal - conductivity frequency - conversion component. Referring to Figure 1 、 Figure 2 and Figure 3 , a high - thermal - conductivity frequency - conversion component includes a three - layer structure of a bottom case 1, a middle plate 2, and an upper cover 3, and a circuit board 4. A closed chamber 11 for accommodating the middle plate 2 and the circuit board 4 is provided between the bottom case 1 and the upper cover 3. The circuit board 4 is fixed on the bottom case 1. After the upper cover 3 is locked with the bottom case 1, the middle plate 2 is pressed tightly on the circuit board 4.

[0048] The frequency - conversion component further includes:

[0049] Hollow portions 21, which are located on the middle plate 2 and there are multiple of them. They separate each component module on the circuit board 4 into different isolation chambers 12;

[0050] Wiring grooves 22, which are located on the middle plate 2 and are used to connect two adjacent hollow portions 21;

[0051] Heat pipes 5, there are multiple of them and they penetrate through several adjacent isolation chambers 12. The heat pipes 5 are embedded in a plurality of continuously adjacent wiring grooves 22. The heat pipes 5 are flat - shaped, and one flat surface thereof is in thermal contact with the upper cover 3, and the other flat surface is in thermal contact with the heat - generating elements on the circuit board 4. The condensation ends of the heat pipes 5 extend to the edge part of the closed chamber 11, and insulating layers are provided at the parts of the heat pipes 5 that are not in contact with the heat - generating elements on the circuit board 4;

[0052] A refrigeration module for refrigerating the condensation ends of the heat pipes 5 is provided in the closed chamber 11.

[0053] Among them, referring to Figure 4 and Figure 5 , the heat pipe [i]5[ / i] includes:

[0054] A pipe body 51, both ends of which are closed, and a phase - change liquid is filled inside. The phase - change liquid can be water, ether, freon, etc.;

[0055] A capillary structure layer 52, which is arranged on the inner wall of the pipe body 51 and extends along the entire length of the pipe body 51. Specifically, it can be a groove structure, or a cylindrical powder - sintered structure or a multi - metal mesh - hole structure, and it has good capillary force.

[0056] After such a setting, the hollow portions 21 on the middle plate 2 can achieve physical isolation between each functional module on the circuit board 4. When the heat - generating elements in each isolation chamber 12 generate heat during operation, the heat is absorbed by the evaporation ends of the heat pipes 5 in thermal contact with them. There is a temperature difference between the evaporation ends and the condensation ends of the heat pipes 5, and the phase - change liquid in the heat pipes 5 is heated and evaporated into gas and flows towards the condensation ends of the heat pipes 5. Thus, the heat pipes 5 can take out the heat of multiple heat - generating elements in a plurality of continuously adjacent isolation chambers 12. <M

[0057] When the vaporized phase-change liquid flows to the condensation end of the heat pipe 5, it is cooled by the refrigeration module and condenses into a liquid again. After the liquid condenses at the condensation end, due to the capillary force, the liquid will be adsorbed into the capillary structure layer 52 and flow along the capillary structure layer 52 towards the evaporation end of the heat pipe 5. And this kind of flow is continuous, which can ensure that there is always enough liquid supply at the evaporation end of the heat pipe 5 and is not affected by the gravity of the liquid, so that the phase-change liquid can continuously carry out the gasification-liquefaction cycle to achieve the continuous heat conduction effect of the heat pipe 5, thereby realizing the continuous and stable heat conduction work of the heat pipe 5 in the variable-frequency component of the present application in any installation state. In this way, through the heat conduction of multiple heat pipes 5 on each heating element on the circuit board 4 in the closed chamber 11, a large amount of heat generated in the closed chamber 11 can be quickly exported, effectively ensuring the stability and working performance of the variable-frequency component during operation.

[0058] Specifically, considering that the overall structure of the variable-frequency component is relatively small and it is difficult to set up a refrigeration module with a large volume. Therefore, in this embodiment, referring to Figure 4 、 Figure 5 and Figure 6 , the refrigeration module includes:

[0059] A liquid tank 61, which is filled with a refrigerant inside;

[0060] A refrigeration pipe 62, both ends of which are communicated with the liquid tank 61;

[0061] Refrigeration sections 63, which are communicated with the refrigeration pipe 62 and are provided with multiple ones corresponding to multiple heat pipes 5. The refrigeration sections 63 are wrapped outside the condensation ends of the heat pipes 5 and there is a cavity between them;

[0062] A pumping assembly, which is used to promote the circulation of the refrigerant in the refrigeration pipe 62; Specifically, the pumping assembly includes:

[0063] An elastic bladder 71, which is located inside the refrigeration section 63 and is communicated with the inside of the condensation end of the heat pipe 5. And the elastic bladder 71 has an expansion limit to ensure that the phase-change liquid in the heat pipe 5 can stably carry out the gasification-liquefaction cycle, and to avoid excessive pressure reduction in the heat pipe 5 after the elastic bladder 71 expands and affecting the phase-change process of the phase-change liquid;

[0064] Check valves 7^, which are provided with multiple ones on the refrigeration pipe 62, and check valves 72 are provided on the refrigeration pipe 62 on both sides of the refrigeration section 63. The directions of fluid flow restricted by the multiple check valves 72 are the same, for example, flowing from the upward section to the downward section.

[0065] In this way, when the heat pipe 5 exports the heat in each isolation cavity 12, the phase change liquid in the heat pipe 5 evaporates into gas and flows towards the condensation end of the heat pipe 5. The internal pressure in the heat pipe 5 increases, causing the elastic bladder 71 to expand in the cavity between the refrigeration section 63 and the condensation end of the heat pipe 5. As a result, a part of the refrigeration liquid in the refrigeration section 63 is promoted to pass through the one-way valve 72 on the side of its downward section and enter the refrigeration pipe 62 in the downward section, or enter the next refrigeration section 63 in the downward section, or return to the liquid tank 61. Since the refrigeration pipe 62 and the liquid tank 61 form a closed system, the expansion of the elastic bladder 71 after the heat pipe 5 conducts heat can form a pumping force for pumping the refrigeration liquid in the refrigeration section 63, eliminating the need for an additional circulation pump as an external power source.

[0066] Moreover, the pumping forces formed by the expansion of the elastic bladders 71 on multiple heat pipes 5 can be superimposed, ensuring the stable circulation effect of the refrigeration liquid in the refrigeration pipe 62. At the same time, the greater the heat generated by the heating element in the isolation cavity 12, the more frequent the gasification-liquefaction cycle of the phase change liquid in the heat pipe 5, and the higher the pumping frequency of the elastic bladder 71. This can increase the flow velocity of the refrigeration liquid in the refrigeration pipe 62 and further improve the heat conduction efficiency of the heat pipe 5 and the refrigeration module.

[0067] On the other hand, considering that the setting of the elastic bladder 71 may have a certain impact on the reflux of the refrigeration liquid in the heat pipe 5, in some smaller-sized devices, the elastic bladder 71 can be replaced with a diaphragm. By the swinging of the diaphragm, a weak pumping effect on the refrigeration liquid in the refrigeration section 63 can also be achieved, but at the cost of a certain heat conduction capacity.

[0068] In another embodiment, the opening direction of the elastic bladder 71 can be set away from the heat pipe 5, as Figure 5 and Figure 6 shown, and the elastic bladder 71 is initially received inside the heat pipe 5 and extends into the cavity between the heat pipe 5 and the refrigeration section 63 after expansion. In this way, under the action of the self-restoring force of the elastic bladder 71, the phase change liquid at the condensation end of the heat pipe 5 condenses into liquid, the pressure inside the heat pipe 5 decreases, and the elastic bladder 71 can restore its original shape and be received back into the heat pipe 5. On the one hand, no phase change liquid will be stored in the elastic bladder 71. On the other hand, during the process of the elastic bladder 71 restoring its original shape, the refrigeration liquid in the refrigeration section 63 will also follow and fill the elastic bladder 71, thereby improving the refrigeration effect of the refrigeration module on the condensation end of the heat pipe 5.

[0069] As some adaptable settings, referring to Figure 3 and Figure 4, a perforation 13 through which both ends of the refrigeration pipe 62 pass is formed in the bottom case 1 or the upper cover 3. The liquid tank 61 is placed outside the bottom case 1 or the upper cover 3, and both the liquid tank 61 and the refrigeration section 63 are made of heat-conducting metal. In this embodiment, the liquid tank 61 is placed outside the bottom case 1 and is also flat, which can increase the heat exchange area with the outside. Further, in another embodiment, heat dissipation fins can be provided outside the liquid tank 61, and a fan for dissipating heat from the liquid tank 61 can also be provided on the bottom case 1.

[0070] In addition, the thermal contact between the heat pipe 5 and the heat-generating elements on the upper cover 3 and the circuit board 4 is specifically as follows: a heat-conducting sticker is provided on the side of the heat pipe 5 close to the upper cover 3, and a heat-conducting paste layer is provided on the side close to the heat-generating elements on the circuit board 4. Or when the heights of the heat-generating elements on the circuit board 4 are not the same, heat-conducting stickers with corresponding thicknesses can also be used to form the thermal contact between the heat-generating elements and the heat pipe 5. Among them, the heat-conducting sticker can specifically be a non-conductive heat-conducting silica gel pad, and the heat-conducting paste layer can specifically be formed by smearing non-conductive silicone grease; and the heat-conducting sticker itself has a certain flexibility, which can fully fill the gap between the heat pipe 5 and the upper cover 3, and cause less damage to the heat pipe 5, and can prevent the heat pipe 5 from being crushed when the upper cover 3 is buckled on the bottom case 1.

[0071] The implementation principle of a high-heat-conducting frequency conversion component in an embodiment of the present application is as follows:

[0072] The hollow part 21 on the middle plate 2 can achieve physical isolation between the functional modules on the circuit board 4. When the heat-generating elements in each isolation cavity 12 generate heat during operation, the heat is absorbed by the evaporation end of the heat pipe 5 in thermal contact with it. There is a temperature difference between the evaporation end and the condensation end of the heat pipe 5. The phase-change liquid in the heat pipe 5 is heated and evaporated into a gas and flows towards the condensation end of the heat pipe 5, and the heat of the heat-generating elements in multiple continuously adjacent isolation cavities 12 can be taken out.

[0073] When the vaporized phase-change liquid flows to the condensation end of the heat pipe 5, the internal pressure in the heat pipe 5 increases, causing the elastic bladder 71 to expand in the cavity between the refrigeration section 63 and the condensation end of the heat pipe 5. After the heat pipe 5 conducts heat, the expansion of the elastic bladder 71 can form a pumping force for pumping the refrigeration liquid in the refrigeration section 63. There is no need to additionally set a circulation pump with an external power source, enabling the refrigeration liquid to circulate stably in the refrigeration pipe 62 to cool the condensation ends of multiple heat pipes 5. In this way, the vaporized phase-change liquid is cooled and condensed into a liquid at the condensation end of the heat pipe 5. Due to the capillary force, the liquid will be adsorbed into the capillary structure layer 52 and flow along the capillary structure layer 52 towards the evaporation end of the heat pipe 5, and this flow is continuous, ensuring that there is always sufficient liquid supply at the evaporation end of the heat pipe 5 and being unaffected by the liquid gravity, thereby realizing the continuous and stable heat conduction work of the heat pipe 5 in the variable-frequency component of the present application in any installation state. Thus, through the heat conduction of multiple heat pipes 5 on each heating element on the circuit board 4 in the closed chamber 11, a large amount of heat generated in the closed chamber 11 can be quickly exported, effectively ensuring the stability and working performance of the variable-frequency component during operation.

[0074] Unless otherwise defined, the technical terms or scientific terms used in the present application shall have the ordinary meanings understood by those of ordinary skill in the art to which the present application pertains. The terms "first", "second", "third" and similar terms used in the specification and claims of the present application do not denote any order, quantity or importance, but are only used to distinguish different components. The terms such as "a" or "an" do not denote a quantity limitation either, but mean that there is at least one. The terms such as "including" or "comprising" mean that the elements or objects appearing before "including" or "comprising" cover the elements or objects listed after "including" or "comprising" and their equivalents, and do not exclude other elements or objects. The terms such as "upper", "lower", "left", "right" are only used to represent relative position relationships, and when the absolute position of the object being described changes, the relative position relationships may also change accordingly.

[0075] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A high thermal conductivity variable frequency component, comprising a three-layer structure of a bottom shell (1), a middle plate (2), and an upper cover (3), and a circuit board (4). A closed chamber (11) for arranging the middle plate (2) and the circuit board (4) is provided between the bottom shell (1) and the upper cover (3), characterized in that, Further included are: Hollow portions (21), which are located on the middle plate (2) and there are multiple of them, and they separate each component module on the circuit board (4) into different isolation cavities (12); Communication grooves (22), which are located on the middle plate (2) and are used to connect two adjacent hollow portions (21); Heat pipes (5), there are multiple of them and they penetrate through several adjacent isolation cavities (12), the heat pipes (5) are embedded in a plurality of continuously adjacent communication grooves (22), the heat pipes (5) are flat, and one flat surface thereof is in thermal contact with the upper cover (3), and the other flat surface is in thermal contact with the heat-generating components on the circuit board (4); A refrigeration module for refrigerating the condensation end of the heat pipe (5) is provided in the closed chamber (11); The refrigeration module includes: A liquid tank (61), the inside of which is filled with a refrigerant liquid; A refrigeration pipe (62), both ends of which are communicated with the liquid tank (61); Refrigeration nodes (63), which are communicated with the refrigeration pipe (62) and there are multiple of them corresponding to the multiple heat pipes (5), and the refrigeration nodes (63) are wrapped outside the condensation ends of the heat pipes (5); A pumping assembly for promoting the circulation of the refrigerant liquid in the refrigeration pipe (62); The pumping assembly includes: An elastic bladder (71), which is located inside the refrigeration node (6), and is communicated with the inside of the condensation end of the heat pipe (5); 2. A high thermal conductivity variable frequency component according to claim 1, characterized in that, Check valves (72), there are multiple of them provided on the refrigeration pipe (62), and check valves (72) are provided on the refrigeration pipe (62) on both sides of the refrigeration node (63), and the directions of fluid flow restricted by the multiple check valves (72) are the same. The heat pipe (5) includes: A pipe body (51), both ends of which are closed, and the inside is filled with a phase-change liquid; 3. A high thermal conductivity variable frequency component according to claim 1, characterized in that, A capillary structure layer (52), which is arranged on the inner wall of the pipe body (51).

4. A high thermal conductivity variable frequency component according to claim 1, characterized in that The opening direction of the elastic bladder (71) is set away from the heat pipe (5), and in the initial state, the elastic bladder (71) is received inside the heat pipe (5) and extends into the cavity between the heat pipe (5) and the refrigeration node (63) after expansion.

5. A high thermal conductivity variable frequency component according to claim 1, characterized in that Perforations (13) through which both ends of the refrigeration pipe (62) pass are formed through the bottom shell (1) or the upper cover (3), and the liquid tank (61) is placed outside the bottom shell (1) or the upper cover (3).

6. The high thermal conductivity frequency conversion component according to claim 1, wherein Both the liquid tank (61) and the refrigeration node (63) are made of heat-conducting metal. A heat-conducting sticker is provided on the side of the heat pipe (5) close to the upper cover (), and a heat-conducting paste layer is provided on the side close to the heat-generating components on the circuit board (4).

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