An integrated circuit board quality inspection system based on computer vision

Abstract

The invention discloses an integrated circuit board quality detection system based on computer vision, and relates to the technical field of circuit board quality detection. The invention first uses computer vision technology to detect the appearance of the integrated circuit board. When the appearance is qualified, a functional test is performed to analyze whether the function of the integrated circuit board is qualified, and then a comprehensive analysis is performed to determine whether the production quality of the integrated circuit board is qualified. According to the analysis process of the production quality, it is analyzed whether each production stage needs to be regulated, thereby realizing multi-dimensional detection of the production quality of the integrated circuit board, improving the reliability of the production quality detection of the circuit board, and providing feedback on the production process at the same time, realizing a virtuous cycle of circuit board production and quality inspection, improving the production effect of the circuit board, ensuring the production quality of the circuit board, ensuring the performance stability of the circuit board in electronic products, and improving the customer satisfaction and market competitiveness of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board quality detection, and in particular to an integrated circuit board quality detection system based on computer vision. Background Art

[0002] An integrated circuit board is a substrate used to support and connect electronic components. It is covered with wires and connection points that connect physical components and is used to assemble electronic circuits. Integrated circuit boards play a vital role in electronic devices, such as computers, mobile phones, tablets, etc., and are an important part of electronic devices. In order to ensure the stable performance of electronic devices during use, the quality of integrated circuit boards needs to be tested.

[0003] Prior art, such as the computer vision-based integrated circuit board quality inspection system disclosed in the invention patent application with publication number CN115049653A, includes a processor and a memory, and the processor executes a computer program stored in the memory to implement the following steps: obtaining a solder joint area image according to an optimal segmentation threshold; performing edge extraction on the solder joint area image to obtain edge contours of each initial solder joint area; obtaining each cluster center point according to each initial edge point on the edge contour of each initial solder joint area; obtaining each pixel point to be analyzed, and obtaining a corrected membership between each pixel point to be analyzed and each cluster center point according to each pixel point to be analyzed and each cluster center point; obtaining each target solder joint area according to the corrected membership; obtaining the quality index of the integrated circuit board to be inspected according to the number of abnormal pixels and the near-circularity rate corresponding to each target solder joint area. The present invention can improve the accuracy of solder joint area quality inspection.

[0004] The above scheme has at least the following shortcomings: 1. The production of integrated circuit boards includes processes such as cutting, printing, component mounting and welding. Therefore, the appearance inspection of the circuit board includes many aspects such as size, color, component mounting and welding position. However, the above scheme only inspects the quality of the solder joint area, which has certain limitations and cannot improve the comprehensiveness of the circuit board quality inspection, nor can it improve the accuracy of the circuit board quality inspection, thereby failing to guarantee the qualified rate of the circuit board production quality, reducing the production effect of the circuit board and customer satisfaction.

[0005] Integrated circuit boards need to be used in electronic devices for a long time, so it is necessary to ensure the operating stability of the circuit boards in different environments to ensure the stable performance of the electronic equipment. However, the above scheme does not test the performance of the circuit boards in different environments, and cannot ensure the functional eligibility of the circuit boards under different conditions, which affects the performance of the electronic equipment during use and reduces the use effect of the circuit boards.

[0006] The control of the circuit board production process determines the production quality of the circuit board. The above scheme lacks the regulation and feedback of the production process after the circuit board quality inspection is completed, so it is impossible to effectively optimize the production line, and it is impossible to improve the production quality of the circuit board in a timely manner, and it is impossible to improve the manufacturer's virtuous production cycle, which reduces the market competitiveness of the circuit board. Summary of the invention

[0007] In view of the above-mentioned technical deficiencies, the object of the present invention is to provide an integrated circuit board quality inspection system based on computer vision.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides an integrated circuit board quality inspection system based on computer vision, including: a detection server, a production control module and a display terminal.

[0009] The detection server includes an image detection module, a function test module and a quality analysis module.

[0010] The image detection module is used to collect images of each integrated circuit board after a batch of integrated circuit boards is produced, and to analyze whether the appearance qualification rate of the integrated circuit boards meets the standards.

[0011] The functional test module is used to perform a functional test on the integrated circuit board after the appearance qualification rate of the integrated circuit board meets the standard, and analyze whether the functional test of the integrated circuit board is qualified.

[0012] The quality analysis module is used to analyze whether the production quality of the integrated circuit board is qualified.

[0013] The production control module is used to control and feedback the production of integrated circuit boards after the production quality analysis of integrated circuit boards is completed.

[0014] The display terminal is used to display the qualified status of the production quality of the integrated circuit board.

[0015] The beneficial effects of the present invention are as follows: the present invention provides an integrated circuit board quality inspection system based on computer vision, which first uses computer vision technology to inspect the appearance of the integrated circuit board. When the appearance is qualified, a functional test is performed to analyze whether the function of the integrated circuit board is qualified, and then a comprehensive analysis is made on whether the production quality of the integrated circuit board is qualified. According to the analysis process of the production quality, it is analyzed whether each production stage needs to be regulated, thereby realizing multi-dimensional inspection of the production quality of the integrated circuit board, ensuring the accuracy of the appearance and function inspection results of the integrated circuit board, improving the reliability of the production quality inspection of the circuit board, and providing feedback on the production process at the same time, realizing a virtuous cycle of circuit board production and quality inspection, improving the production effect of the circuit board, ensuring the production quality of the circuit board, ensuring the performance stability of the circuit board in electronic products, and improving the customer satisfaction and market competitiveness of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the system structure connection of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1 As shown, a computer vision-based integrated circuit board quality inspection system includes: an inspection server, a production control module and a display terminal.

[0020] The detection server includes an image detection module, a function test module and a quality analysis module.

[0021] The image detection module is used to collect images of each integrated circuit board after a batch of integrated circuit boards is produced, and to analyze whether the appearance qualification rate of the integrated circuit boards meets the standards.

[0022] In the above, after the integrated circuit boards are produced, the camera is used to collect images of each integrated circuit board according to the preset photographing requirements, wherein the preset photographing requirements include multi-angle photographing of the integrated circuit boards.

[0023] In a specific embodiment, the analysis of whether the appearance qualification rate of the integrated circuit board meets the standard is carried out as follows: based on computer vision technology, the appearance feature parameters are identified from the images of each integrated circuit board, the appearance feature parameters of each integrated circuit board and the preset standard appearance feature parameters are substituted into the appearance recognition model, and the appearance qualification results of each integrated circuit board are output, wherein the appearance qualification results include a value containing 1 or -1.

[0024] Among them, the expression of the appearance recognition model is: , where a represents the appearance feature parameter, b represents the standard appearance feature parameter, Indicates a qualified appearance result.

[0025] It should be noted that during the design phase of the integrated circuit board, a design drawing of the integrated circuit board will be designed according to production requirements, and standard appearance characteristic parameters will be obtained from the design drawing. In addition, the appearance characteristic parameters include but are not limited to size, color and the position of each solder joint.

[0026] When the appearance qualified result is 1, it indicates that the appearance of the integrated circuit board is qualified; when the appearance qualified result is -1, it indicates that the appearance of the integrated circuit board is unqualified; the number of integrated circuit boards with qualified appearance is counted, and then divided by the total number of integrated circuit boards to obtain the appearance qualified rate of the integrated circuit boards.

[0027] The appearance pass rate of the integrated circuit board is compared with a preset appearance pass rate threshold. When the appearance pass rate of the integrated circuit board is greater than or equal to the appearance pass rate threshold, the appearance pass rate of the integrated circuit board meets the standard; otherwise, the appearance pass rate of the integrated circuit board does not meet the standard.

[0028] It should be noted that image recognition based on computer vision technology is an existing conventional technical solution, and the specific recognition steps will not be repeated in this application.

[0029] It should also be noted that the appearance qualification rate threshold is set by managers based on the specific production process.

[0030] The functional test module is used to perform a functional test on the integrated circuit board after the appearance qualification rate of the integrated circuit board meets the standard, and analyze whether the functional test of the integrated circuit board is qualified.

[0031] In a specific embodiment, the integrated circuit board is subjected to a functional test, and the specific testing process is as follows: S11, the functional test includes an impact test and an environmental test.

[0032] S12. Randomly select a number of integrated circuit boards from the integrated circuit boards with qualified appearance as impact circuit boards, and obtain the preset limit impact force of the integrated circuit boards. At the same time, set each test impact force with a preset impact force difference, and sort them in ascending order to obtain the test order of each test impact force.

[0033] It should be noted that, assuming the preset limit impact force is 30N and the preset impact force difference is 3N, the test impact forces can be set to 21, 24, 27, 30, 33, etc., where N represents the unit, Newton. When the actual impact force borne by the integrated circuit board is greater than the preset limit impact force, it indicates that the integrated circuit board can actually withstand a greater impact, the greater the strength, and the better the quality.

[0034] S13, connecting each impact circuit board to the test platform, applying a preset rated power to each impact circuit board, and detecting initial output data at the output end of each impact circuit board. After waiting for a preset time, respectively apply a first test impact force to each impact circuit board. After the application is completed, immediately detect the first output data at the output end of each impact circuit board, and take an impact image of each impact circuit board; if a certain impact circuit board does not output data, then end the test of the impact circuit board, and use the first test impact force as the maximum impact force that the impact circuit board can withstand; repeat the operation until each test impact force is completed or each impact circuit board does not output data, then end the impact test.

[0035] It should be noted that when performing the impact test, the test environment of all impact circuit boards is the same, and the output data includes but is not limited to voltage and current, which can be detected by a voltmeter and an ammeter. No output data means that the output data cannot be detected; a camera is used to capture the impact image of each impact circuit board.

[0036] In the above, if a certain impact circuit board can still output information after being subjected to the maximum test impact force, the maximum test impact force is taken as the maximum impact force that the impact circuit board can withstand.

[0037] S14. Randomly select a number of integrated circuit boards from the integrated circuit boards with qualified appearance as environmental circuit boards, obtain preset extreme environmental data of the integrated circuit boards, and set various test environmental data with preset environmental data differences.

[0038] It should be noted that the environmental data include but are not limited to temperature and humidity. The setting method of each test environmental data is the same as the setting method of each test impact force, which will not be repeated here.

[0039] S15. Place each environmental circuit board evenly in each environmental chamber, detect the initial output data at the output end of each environmental circuit board, and then start the environmental control equipment in each environmental chamber to make the environmental data in each environmental chamber reach each test environmental data; after each preset time interval, collect the apparent image of each environmental circuit board in each environmental chamber and the output data of the output end until the preset test time is over, and then end the temperature test.

[0040] It should be noted that the environmental control equipment includes but is not limited to air conditioners and humidifiers. The environmental box contains temperature sensors and humidity sensors to detect the environmental data in the environmental box in real time; the output data includes but is not limited to voltage and current, which can be detected by a voltmeter and an ammeter. Use a camera to capture the apparent image of each environmental circuit board.

[0041] In another specific embodiment, the analysis of whether the function test of the integrated circuit board is qualified is specifically performed as follows: S21, summarizing the impact images of each impact circuit board, analyzing the appearance limit impact force of each impact circuit board, and analyzing the impact circuit board's bearing force characteristic value according to the maximum impact force of each impact circuit board; outputting the output stability characteristic value of the impact circuit board according to the initial output data and each output data of each impact circuit board, and then analyzing whether the integrated circuit board's tolerance function meets the standard;

[0042] In the above, the specific process of step S21 is as follows: S211, summarize the impact images of each impact circuit board, identify the appearance feature parameters in each impact image of each impact circuit board according to computer vision technology, substitute them into the appearance recognition model, output the appearance qualified results in each impact image of each impact circuit board, extract the impact image corresponding to each impact circuit board when the first appearance qualified result is -1, and obtain the test impact force corresponding to each impact circuit board when the first appearance qualified result is -1, as the appearance limit impact force of each impact circuit board.

[0043] S212, summarizing the initial output data and each output data of each impact circuit board, substituting them into the stability analysis model, and outputting the output stability characteristic value of the impact circuit board, wherein the output stability characteristic value includes a value including 1 or -1.

[0044] It should be noted that the expression of the stability analysis model is:

[0045] In the formula, Indicates the output stable characteristic value of the impact circuit board, represents the initial output data of the ith impact circuit board, represents the jth output data of the i-th impact circuit board, i represents the number of each impact circuit board, j represents the number of each output data, i=1,2,......,m, j=1,2,......,n, m and n represent the number of impact circuit boards and the number of output data respectively, m and n are both positive integers, It is a preset permissible output data difference, wherein the permissible output data difference is determined by the circuit board manufacturer.

[0046] S213, substituting the apparent limit impact force and the maximum impact force of each impact circuit board into the impact identification model, and outputting the impact force characteristic value of the impact circuit board, wherein the impact force characteristic value includes a value of 1 or -1.

[0047] It should be noted that the expression of the shock identification model is:

[0048] , where , They represent the apparent limit impact force and the maximum impact force of the i-th impact circuit board, respectively. Indicates the preset limit impact force, where the preset limit impact force is set by the circuit board manufacturer.

[0049] S214. When the output stability characteristic value of the impact circuit board is 1 and the bearing capacity characteristic value is 1, the tolerance function of the integrated circuit board meets the standard; when the output stability characteristic value of the impact circuit board is -1 or the bearing capacity characteristic value is -1, the tolerance function of the integrated circuit board does not meet the standard.

[0050] S22, summarizing the environmental images and output data of each environmental circuit board in each environmental chamber, analyzing the qualified appearance results and output stable characteristic values ​​of each environmental circuit board in each environmental chamber, and then analyzing whether the temperature test of the integrated circuit board is qualified.

[0051] In the above, the specific process of step S22 is as follows: S221. Identify the appearance feature parameters of each environmental circuit board in each environmental box corresponding to each impact image from each environmental image of each environmental circuit board in each environmental box, substitute them into the appearance recognition model, and output the appearance qualified results of each environmental circuit board in each environmental box corresponding to each impact image. If the appearance qualified result of a certain environmental circuit board in a certain environmental box corresponding to a certain impact image is -1, then the appearance qualified result of the environmental circuit board in the environmental box is -1. If the appearance qualified results of a certain environmental circuit board in a certain environmental box corresponding to each impact image are all 1, then the appearance qualified result of the environmental circuit board in the environmental box is 1. In this way, the appearance qualified results of each environmental circuit board in each environmental box are obtained, and the number of environmental circuit boards with qualified appearance in each test environment data is counted.

[0052] S222. Summarize the initial output data and each output data of each environmental circuit board in each environmental chamber, substitute them into the stability analysis model, and output the output stability characteristic value of each environmental circuit board in each environmental chamber; thereby counting the environmental circuit board data whose output stability characteristic value is 1 in each test environment data.

[0053] S223. When the appearance qualification result of a certain environmental circuit board in a certain environmental box is 1 and the output stable characteristic value is 1, it indicates that the environmental circuit board has passed the temperature test in the test environment data of the environmental box. The number of environmental circuit boards that have passed the temperature test in each test environment data is counted and divided by the total number of environmental circuit boards in each test environment data to obtain the temperature test qualification rate of each test environment data.

[0054] S224. When the temperature test pass rate of each test environment data is greater than or equal to the preset temperature test pass rate, it indicates that the temperature test of the integrated circuit board is qualified. When the temperature test pass rate of a certain test environment data is less than the preset temperature test pass rate, it indicates that the temperature test of the integrated circuit board is unqualified.

[0055] S23. When the integrated circuit board's tolerance function meets the standard and the temperature test is qualified, the integrated circuit board's functional test is qualified. When the integrated circuit board's tolerance function does not meet the standard or the temperature test is unqualified, the integrated circuit board's functional test is unqualified.

[0056] The quality analysis module is used to analyze whether the production quality of the integrated circuit board is qualified.

[0057] In the above, the analysis of whether the production quality of the integrated circuit board is qualified is specifically carried out as follows: when the appearance qualification rate of the integrated circuit board meets the standard and the functional test is qualified, it indicates that the production quality of the integrated circuit board is qualified; when the appearance qualification rate of the integrated circuit board does not meet the standard, or the appearance qualification rate of the integrated circuit board meets the standard but the functional test is unqualified, it indicates that the production quality of the integrated circuit board is unqualified.

[0058] The production control module is used to control and feedback the production of integrated circuit boards after the production quality analysis of integrated circuit boards is completed.

[0059] In a specific embodiment, the production of integrated circuit boards is regulated and feedback is provided, and the specific process is as follows: statistics are collected on each integrated circuit board with unqualified appearance, and each integrated circuit board with unqualified appearance in functional testing is analyzed, and recorded as each Class I integrated circuit board, and the appearance characteristic parameters of each Class I integrated circuit board are analyzed according to the production stage to obtain the appearance characteristic parameters of each Class I integrated circuit board corresponding to each production stage.

[0060] It should be noted that the production stages of integrated circuit boards include cutting, printing, component mounting and welding. The appearance characteristic parameters corresponding to the cutting stage are size parameters such as length and width; the appearance characteristic parameters corresponding to the printing stage are color parameters such as chromaticity and brightness; the appearance characteristic parameters corresponding to component mounting and welding are component position parameters such as the mounting and welding positions of components.

[0061] The preset standard appearance feature parameters of each production stage are obtained, substituted into the production deviation identification model, the production deviation feature values ​​of each production stage are output, and the production stages that need to be regulated are screened out, and then the regulation feedback is performed.

[0062] The expression of the production deviation identification model is:

[0063] , where represents the production deviation characteristic value of the rth production stage, represents the appearance characteristic parameters of the yth type I integrated circuit board corresponding to the rth production stage, It represents the preset standard appearance characteristic parameters of the r-th production stage, r represents the number of each production stage, r is a positive integer, y represents the number of each type of integrated circuit board, y=1,2,......,q, y and q are both positive integers, q represents the total number of integrated circuit boards of a type. The preset standard appearance characteristic parameters of each production stage are extracted from the integrated circuit board quality inspection system and are formulated by the circuit board manufacturer.

[0064] In addition, the production deviation characteristic value contains a value of 1 or -1. When the production deviation characteristic value of a production stage is 1, it indicates that the deviation of the appearance parameters produced in this production stage is small, and this production stage does not need to be regulated. When the production deviation characteristic value of a production stage is -1, it indicates that the deviation of the appearance parameters produced in this production stage is large, and this production stage needs to be regulated, so as to screen out the production stages that need to be regulated.

[0065] This application tests the appearance of the products produced at each production stage. When the appearance parameter deviation in the production stage is large or small, feedback is given to the production stage to remind the staff to adjust the production and improve the quality pass rate of future circuit board production.

[0066] It should be noted that the specific process of analyzing the integrated circuit boards that fail the appearance test in the functional test is as follows: comparing the appearance limit impact force of each impact circuit board with the preset limit impact force, and taking the impact circuit boards whose appearance limit impact force is less than the preset limit impact force as the integrated circuit boards that fail the appearance in the functional test; taking the environmental circuit boards whose appearance qualified result in each environmental chamber is -1 as the integrated circuit boards that fail the appearance in the functional test.

[0067] The display terminal is used to display the qualified status of the production quality of the integrated circuit board.

[0068] The embodiment of the present invention first uses computer vision technology to detect the appearance of the integrated circuit board. When the appearance is qualified, a functional test is performed to analyze whether the function of the integrated circuit board is qualified, and then a comprehensive analysis is performed to determine whether the production quality of the integrated circuit board is qualified. According to the production quality analysis process, it is analyzed whether each production stage needs to be regulated, thereby realizing multi-dimensional detection of the production quality of the integrated circuit board, ensuring the accuracy of the appearance and function detection results of the integrated circuit board, and improving the reliability of the production quality detection of the circuit board. At the same time, feedback is provided on the production process to realize a virtuous cycle of circuit board production and quality inspection, improve the production effect of the circuit board, ensure the production quality of the circuit board, ensure the performance stability of the circuit board in electronic products, and improve the customer satisfaction and market competitiveness of the circuit board.

[0069] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined in this specification, they shall all fall within the protection scope of the present invention.

Claims

1. An integrated circuit board quality inspection system based on computer vision, characterized in that: include: Detection server, production control module and display terminal; The detection server includes an image detection module, a function test module and a quality analysis module; The image detection module is used to collect images of each integrated circuit board after a batch of integrated circuit boards is produced, and analyze whether the appearance qualification rate of the integrated circuit boards meets the standards; The function test module is used to perform a function test on the integrated circuit board after the appearance qualification rate of the integrated circuit board meets the standard, and analyze whether the function test of the integrated circuit board is qualified; The quality analysis module is used to analyze whether the production quality of the integrated circuit board is qualified; The production control module is used to control and feedback the production of integrated circuit boards after the production quality analysis of integrated circuit boards is completed; A display terminal, used to display the qualified status of the production quality of the integrated circuit board; The specific process of analyzing whether the appearance qualification rate of the integrated circuit board meets the standard is as follows: Based on computer vision technology, the appearance feature parameters are identified from the images of each integrated circuit board, the appearance feature parameters of each integrated circuit board and the preset standard appearance feature parameters are substituted into the appearance recognition model, and the appearance qualified result of each integrated circuit board is output, wherein the appearance qualified result includes a value containing 1 or -1; When the appearance qualified result is 1, it means that the appearance of the integrated circuit board is qualified, and when the appearance qualified result is -1, it means that the appearance of the integrated circuit board is unqualified; the number of integrated circuit boards with qualified appearance is counted, and then divided by the total number of integrated circuit boards to obtain the appearance qualified rate of the integrated circuit boards; Compare the appearance qualification rate of the integrated circuit board with the preset appearance qualification rate threshold value; when the appearance qualification rate of the integrated circuit board is greater than or equal to the appearance qualification rate threshold value, the appearance qualification rate of the integrated circuit board meets the standard; otherwise, the appearance qualification rate of the integrated circuit board does not meet the standard; The functional test of the integrated circuit board is carried out, and the specific test process is as follows: S11, the functional test includes impact test and environmental test; S12, randomly selecting a number of integrated circuit boards from each integrated circuit board with qualified appearance as each impact circuit board, and obtaining a preset limit impact force of the integrated circuit board, and at the same time setting each test impact force according to a preset impact force difference, and sorting them in ascending order to obtain a test order of each test impact force; S13, connecting each impact circuit board to the test platform, applying a preset rated power to each impact circuit board, detecting initial output data at the output end of each impact circuit board, and after waiting for a preset time, applying a first test impact force to each impact circuit board respectively, and immediately detecting the first output data at the output end of each impact circuit board after the application is completed, and taking an impact image of each impact circuit board; if a certain impact circuit board does not output data, then the test of the impact circuit board is terminated, and the first test impact force is used as the maximum impact force that the impact circuit board can withstand; repeating the operation until each test impact force is completed or each impact circuit board does not output data, then the impact test is terminated; S14, randomly selecting a number of integrated circuit boards from each integrated circuit board with qualified appearance as each environmental circuit board, and obtaining preset extreme environmental data of the integrated circuit board, and setting each test environmental data with the preset environmental data difference; S15, placing each environmental circuit board evenly in each environmental box, detecting the initial output data at the output end of each environmental circuit board, and then starting the environmental control equipment in each environmental box so that the environmental data in each environmental box reaches each test environmental data; after each preset time interval, collecting the apparent image of each environmental circuit board in each environmental box and the output data of the output end until the preset test time is reached, and then ending the temperature test; The specific analysis process of analyzing whether the integrated circuit board is qualified in the functional test is as follows: S21, summarizing the impact images of each impact circuit board, analyzing the appearance limit impact force of each impact circuit board, and analyzing the impact circuit board's bearing force characteristic value according to the maximum impact force of each impact circuit board; outputting the output stability characteristic value of the impact circuit board according to the initial output data and each output data of each impact circuit board, and then analyzing whether the integrated circuit board's tolerance function meets the standard; S22, summarizing the environmental images and output data of each environmental circuit board in each environmental chamber, analyzing the qualified appearance results and output stable characteristic values ​​of each environmental circuit board in each environmental chamber, and then analyzing whether the temperature test of the integrated circuit board is qualified; S23. When the integrated circuit board's tolerance function meets the standard and the temperature test is qualified, the integrated circuit board's functional test is qualified; when the integrated circuit board's tolerance function does not meet the standard or the temperature test is unqualified, the integrated circuit board's functional test is unqualified; The specific process of step S21 is as follows: S211, summarizing the impact images of each impact circuit board, identifying the appearance feature parameters in each impact image of each impact circuit board according to computer vision technology, substituting them into the appearance recognition model, outputting the appearance qualified results in each impact image of each impact circuit board, extracting the impact image corresponding to each impact circuit board when the first appearance qualified result is -1, and obtaining the test impact force corresponding to each impact circuit board when the first appearance qualified result is -1, as the appearance limit impact force of each impact circuit board; S212, summarizing the initial output data and each output data of each impact circuit board, and substituting them into the stability analysis model, and outputting the output stability characteristic value of the impact circuit board, wherein the output stability characteristic value includes a value including 1 or -1; S213, substituting the appearance limit impact force and the maximum impact force of each impact circuit board into the impact identification model, and outputting the impact force characteristic value of the impact circuit board, wherein the impact force characteristic value includes a value including 1 or -1; S214, when the output stability characteristic value of the impact circuit board is 1 and the bearing capacity characteristic value is 1, the bearing capacity function of the integrated circuit board meets the standard; when the output stability characteristic value of the impact circuit board is -1 or the bearing capacity characteristic value is -1, the bearing capacity function of the integrated circuit board does not meet the standard; The expression of the stability analysis model is: In the formula, α represents the output stable characteristic value of the impact circuit board, G i ′ represents the initial output data of the ith impact circuit board, G ij represents the jth output data of the i-th impact circuit board, i represents the number of each impact circuit board, j represents the number of each output data, i=1,2,......,m, j=1,2,......,n, m and n represent the number of impact circuit boards and the number of output data respectively, m and n are both positive integers, and ΔG is a preset allowable output data difference; The expression of the shock identification model is: Where wF i ,cF i They represent the appearance limit impact force and the maximum impact force of the i-th impact circuit board, respectively. max Indicates the preset limit to withstand the impact force; The specific process of regulating and feedback on the production of integrated circuit boards is as follows: Counting the integrated circuit boards that fail to meet the appearance standards, and analyzing the integrated circuit boards that fail to meet the appearance standards in the functional test, recording them as Class I integrated circuit boards, analyzing the appearance characteristic parameters of the Class I integrated circuit boards according to the production stages, and obtaining the appearance characteristic parameters of the Class I integrated circuit boards corresponding to the production stages; Obtain the preset standard appearance feature parameters of each production stage, substitute them into the production deviation identification model, output the production deviation feature values ​​of each production stage, and screen out the production stages that need to be regulated, and then provide regulation feedback; The expression of the production deviation identification model is: In the formula, Z r represents the production deviation characteristic value of the rth production stage, a ry represents the appearance characteristic parameters of the yth type I integrated circuit board corresponding to the rth production stage, b r represents the preset standard appearance characteristic parameters of the r-th production stage, r represents the number of each production stage, r is a positive integer, y represents the number of each type of integrated circuit board, y=1, 2, ..., q, y and q are both positive integers, q represents the total number of the type of integrated circuit boards; The production deviation characteristic value contains a value of 1 or -1. When the production deviation characteristic value of a certain production stage is 1, it indicates that the deviation of the appearance parameters produced in this production stage is small, and this production stage does not need to be regulated. When the production deviation characteristic value of a certain production stage is -1, it indicates that the deviation of the appearance parameters produced in this production stage is large, and this production stage needs to be regulated, so as to screen out the production stages that need to be regulated.

2. The computer vision-based integrated circuit board quality inspection system according to claim 1, characterized in that: The specific analysis process of analyzing whether the production quality of the integrated circuit board is qualified is as follows: when the appearance qualification rate of the integrated circuit board meets the standard and the functional test is qualified, it indicates that the production quality of the integrated circuit board is qualified; when the appearance qualification rate of the integrated circuit board does not meet the standard, or the appearance qualification rate of the integrated circuit board meets the standard but the functional test is unqualified, it indicates that the production quality of the integrated circuit board is unqualified.

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