A heat dissipation component layout system based on data processing

Abstract

The present invention relates to the field of optical technology, and in particular to a heat dissipation element layout system based on data processing, comprising an initial laser, a temperature acquisition device, a processor and a memory storing a computer program, wherein a third number of heat dissipation elements is calculated in combination with a preset heat dissipation volume set, a preset volume of the heat dissipation element and a preset heat generation level, and a second temperature set is obtained according to an initial temperature list set to characterize the heat generation of the initial laser at a position where a first temperature sensor is located, and a heat dissipation demand degree corresponding to each candidate heat dissipation area is obtained in combination with a distance between a candidate heat dissipation area and the first temperature sensor, and a corresponding third number of target heat dissipation areas are screened out according to the heat dissipation demand degree, a heat dissipation element is arranged in each target heat dissipation area, and a third target laser is obtained, thereby improving the accuracy of heat dissipation element quantity calculation and position placement, and thereby improving the heat dissipation effect, working quality and life of the third target laser.

Description

Technical Field

[0001] The invention relates to the field of optical technology, and in particular to a heat dissipation element layout system based on data processing. Background Art

[0002] Lasers are powered by power sources or light sources, perform energy conversion based on pump sources, gain media, and optical resonant cavities, and ultimately output high-power lasers. During the laser generation process of fiber lasers, heat is generated at the pump source, gain fiber, optical power stripper, fiber fusion point, etc., affecting the working quality and life of the laser. Therefore, adding heat dissipation elements to the laser plays an important role.

[0003] As an important heat dissipation method for lasers, convection heat dissipation can diffuse the heat generated by the laser to the heat sink, and then use the temperature difference between the heat sink and the ambient air, and the forced convection of heat dissipation components such as general fans to dissipate heat, thereby ensuring the working stability and life of the laser. When setting parameters such as the number and position of heat dissipation components based on experience, it is difficult to ensure a good heat dissipation effect in the actual use of the laser. Therefore, how to reasonably arrange the heat dissipation components to improve the heat dissipation effect of the laser has become an urgent problem to be solved. Summary of the invention

[0004] In view of the above technical problems, the technical solution adopted by the present invention is a heat dissipation component layout system based on data processing, which includes an initial laser, a temperature acquisition device, a processor and a memory storing a computer program, wherein the memory also stores an initial temperature list set U1={U 11 , U 12 , ..., U 1j , ..., U 1C}, the preset heat generation level DJ corresponding to the initial laser, the preset H candidate heat dissipation areas in the initial laser, the preset heat dissipation volume set r = {r1, r2, ..., r y ,……,r H}, distance set F = {F1, F2, ..., F y , ..., F H}, where U 1j ={t 11j , t 12j ,……,t 1ij ,……,t 1Nj}, t 1ij It refers to the initial temperature of the initial laser collected by the jth first temperature sensor at the i-th preset time point, r yIt refers to the preset heat dissipation capacity corresponding to the yth candidate heat dissipation area, F y ={F y1 , F y2 , ..., F yj , ..., T yC}, F yj It refers to the distance between the yth candidate heat dissipation area and the jth first temperature sensor, i=1, 2, ..., N, j=1, 2, ..., C, y=1, 2, ..., H. When the computer program is executed by the processor, the following steps are implemented:

[0005] S1000: Acquire a third number M3 of heat dissipation elements according to DJ, r, and a preset volume V0 of the heat dissipation element, where M3 is an integer greater than 0.

[0006] S2000: According to U, obtain a second temperature set V corresponding to C first temperature sensors = {V1, V2, ..., V j , ..., V C}, where the second temperature V corresponding to the jth first temperature sensor j =(Σ i＝1 N t 1ij ) / N.

[0007] S3000: Based on V and F, obtain a heat dissipation requirement set X corresponding to H candidate heat dissipation areas = {X1, X2, ..., X y , ..., X H}, where the heat dissipation requirement level X corresponding to the yth candidate heat dissipation area y =Σ j＝1 C (V j ×e^(-F yj )).

[0008] S4000 selects M3 candidate cooling areas with the greatest cooling requirements as target cooling areas.

[0009] S5000: Set a heat dissipation element in each target heat dissipation area of ​​the initial laser to obtain a third target laser.

[0010] The present invention has at least the following beneficial effects: according to the preset heat generation level DJ, the preset heat dissipation volume set r and the preset volume V0 of the heat dissipation element, a third number M3 of the heat dissipation element is obtained, and according to U, a second temperature set V corresponding to C first temperature sensors is obtained = {V1, V2, ..., V j , ..., V C}, according to V and F, obtain the heat dissipation requirement set X corresponding to the H candidate heat dissipation areas = {X1, X2, ..., Xy , ..., X H}, taking the M3 candidate heat dissipation areas with the greatest heat dissipation demand as the target heat dissipation areas, setting a heat dissipation element in each target heat dissipation area of ​​the initial laser, and obtaining the third target laser, by calculating the third number M3 of heat dissipation elements required under the restriction of the preset heat dissipation volume set r, combining the preset volume V0 of the heat dissipation element and the preset heat generation level DJ, and characterizing the heat generation of the initial laser at the corresponding position of the first temperature sensor according to the second temperature, and obtaining the heat dissipation demand corresponding to each candidate heat dissipation area in combination with the distance between the candidate heat dissipation area and the first temperature sensor, to characterize the matching between each candidate heat dissipation area and the heat dissipation element, thereby improving the accuracy of the placement of the heat dissipation element, and thereby improving the heat dissipation effect, working quality and life of the third target laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 A structural block diagram of a heat dissipation component layout system provided in Embodiment 1 of the present invention;

[0013] Figure 2 A flow chart of a heat dissipation component layout method provided in Embodiment 2 of the present invention;

[0014] Figure 3 A flow chart of a heat dissipation component layout system based on data processing provided in Embodiment 3 of the present invention;

[0015] Figure 4 This is a structural flow chart of a heat dissipation component layout device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0017] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0018] Embodiment 1

[0019] The first embodiment provides a heat dissipation component layout system, which includes an initial laser, a temperature acquisition device, a processor, and a memory storing a computer program, wherein the memory also stores a trained first prediction model. When the computer program is executed by the processor, Figure 1 As shown, implement the following steps:

[0020] S1, collecting the temperature of the initial laser at N preset time points according to a temperature collection device to obtain a first temperature set, wherein N is an integer greater than 0.

[0021] Among them, the initial laser may include a pump source, a gain medium, an optical resonant cavity, a tuner, an output coupler and other elements constituting the laser except for the heat dissipation element. The heat dissipation element may refer to a fan. In this embodiment, the heat dissipation element is assembled into the initial laser to form a target laser on the basis of the initial laser, so as to improve the heat dissipation effect of the laser, thereby improving the working quality and service life of the laser.

[0022] The preset time point can start from the moment when the initial laser starts working, and the preset time interval JK is used as the time interval between two adjacent preset time points. The temperature at each position in the initial laser is collected by the temperature collection device to provide a data basis for the layout of the heat dissipation element.

[0023] In a specific implementation, the temperature acquisition device includes C first temperature sensors, where C is an integer greater than 0.

[0024] Each first temperature sensor can be arranged at a different position in the initial laser to provide more temperature data with a wider range for the layout of the heat dissipation element.

[0025] S2, inputting the first temperature set into a first prediction model to obtain a first heat generation level of an initial laser.

[0026] Among them, the first prediction model is used to extract and map features of the first temperature set, and output the first heat generation level corresponding to the initial laser, which is used to characterize the amount of heat generated by the initial laser during the working process. Correspondingly, the larger the first heat generation level, the more heat the initial laser generates during the working process.

[0027] The specific level of the first heat generation level can be set by the implementer according to actual conditions. For example, the first heat generation level can be 1, 2, ... CR1, where CR1 refers to the maximum value of the first heat generation level.

[0028] As described above, the first temperature set is feature analyzed according to the first prediction model, and the first heat generation level of the initial laser is obtained to characterize the amount of heat generated by the initial laser during operation, which serves as the basis for determining the number of heat dissipation elements, thereby improving the accuracy of determining the number of heat dissipation elements.

[0029] In a specific implementation, the memory further stores a first initial prediction model, P first temperature set samples, and a first heat generation level sample corresponding to each first temperature set sample. When the computer program is executed by the processor, the following steps are also implemented:

[0030] S10, inputting the vth first temperature set sample into the first initial prediction model to obtain the vth predicted first heat generation level corresponding to the vth first temperature set sample, where v=1, 2, ..., P.

[0031] S20, obtaining the vth first model sub-loss according to the first heat generation level sample corresponding to the vth first temperature set sample and the vth predicted first heat generation level.

[0032] S30, traverse v=1, 2, ..., P, and obtain P first model sub-losses.

[0033] S40: Obtain a first model total loss of the first initial prediction model according to the P first model sub-losses.

[0034] S50, updating the parameters of the first initial prediction model according to the total loss of the first model until the total loss of the first model meets a preset first training condition, thereby obtaining a trained first prediction model.

[0035] In the above, the first initial prediction model is trained according to the P first temperature set samples and the corresponding P first heat generation level samples to obtain a trained first prediction model, thereby improving the accuracy of the first prediction model and further improving the accuracy of the first heat generation level.

[0036] In a specific implementation, the preset first training condition refers to the total loss of the first model converging.

[0037] In a specific implementation, the preset first training condition means that the total loss of the first model is less than a preset first loss threshold.

[0038] The specific value of the preset first loss threshold can be set by the implementer according to actual conditions.

[0039] In a specific implementation, the number of temperatures in the first temperature set sample is W, where W≥N, and S2 further includes the following steps:

[0040] S21, if W>N, then WN preset values ​​are added to the first temperature set to obtain a target temperature set, and the target temperature set is input into the first prediction model to obtain a first heat generation level of the initial laser.

[0041] S22: If W=N, input the first temperature set into the first prediction model to obtain a first heat generation level of the initial laser.

[0042] Among them, the preset value can refer to zero. Since the first prediction model is trained based on the first temperature set sample, based on the number of temperatures W in the first temperature set sample and the number of temperatures N in the first temperature set, WN preset values ​​can be added to the first temperature set, thereby ensuring that the length of the target temperature set matches the first prediction model, and the added value does not affect the output result of the first prediction model, thereby improving the accuracy of the first heat generation level.

[0043] S3, obtaining a first number M1 of heat dissipation elements according to the first heat generation level, a preset heat dissipation volume in the initial laser, and a preset volume of the heat dissipation element, wherein M1 is an integer greater than 0.

[0044] The preset heat dissipation volume refers to the volume of the area reserved for the heat dissipation element in the initial laser, and the preset volume refers to the preset volume of each heat dissipation element.

[0045] The larger the first heat generation level is, the more heat the initial laser generates during operation, and correspondingly, the more heat dissipation elements are required. Therefore, under the limitation of the preset heat dissipation volume, this embodiment combines the preset volume of the heat dissipation element and the first heat generation level to calculate the first number M1 of the required heat dissipation elements, providing a basis for the layout of the heat dissipation elements.

[0046] In a specific implementation, M1 meets the following conditions:

[0047] M1=(2 / (1+e^A1)-1)×(R / V0), wherein e refers to a natural constant, A1 refers to a first heat generation level, R refers to a preset heat dissipation volume in the initial laser, and V0 refers to a preset volume of the heat dissipation element.

[0048] In a specific embodiment, A∈{1, 2, ..., B}, where B refers to the maximum value of the first heat generation level.

[0049] As described above, based on the first heat generation level, the preset heat dissipation volume in the initial laser and the preset volume of the heat dissipation element, the first number M1 of heat dissipation elements is obtained, the number of heat dissipation elements required for the initial laser is clarified, and the minimum number of heat dissipation elements is selected for heat dissipation while ensuring a good heat dissipation effect, thereby reducing the consumption cost while ensuring the working quality and life of the laser.

[0050] S4, assembling M1 heat dissipation elements with the initial laser to obtain a first target laser.

[0051] Among them, in the reserved area corresponding to the preset heat dissipation volume, M1 heat dissipation elements are installed to ensure the heat dissipation effect of the laser, so that the first target laser has a better heat dissipation effect, ensuring the working quality and life of the first target laser.

[0052] The placement direction of the heat dissipation element in the first target laser can be set by the implementer according to actual conditions. For example, when the heat dissipation element refers to a fan, the implementer needs to ensure that the heat dissipation element has a convective heat dissipation effect in the first target laser to improve the heat dissipation effect of the first target laser.

[0053] In this embodiment, the temperature of the initial laser at N preset time points is collected by a temperature collection device to obtain a first temperature set, the first temperature set is input into a first prediction model, and a first heat generation level of the initial laser is obtained. According to the first heat generation level, a preset heat dissipation volume in the initial laser and a preset volume of the heat dissipation element, a first number M1 of heat dissipation elements is obtained, and M1 heat dissipation elements are assembled with the initial laser to obtain a first target laser. The first heat generation level of the initial laser is measured by the temperature data of the initial laser to characterize the ability of the initial laser to generate heat when working, and under the limitation of the preset heat dissipation volume, the number of heat dissipation elements required by the initial laser is clarified in combination with the preset volume of the heat dissipation element, thereby improving the heat dissipation effect of the first target laser, and further improving the working quality and life of the first target laser.

[0054] Embodiment 2

[0055] Based on the above embodiment 1, this embodiment 2 provides a heat dissipation component layout method, such as Figure 2 As shown, the heat dissipation component layout method includes the following steps:

[0056] S100, obtaining a first temperature set T1 corresponding to the initial laser at N preset time points = {T 11, T 12 , ..., T 1i , ..., T 1N} and the ambient temperature set T2 corresponding to N preset time points = {T 21 , T 22 , ..., T 2i , ..., T 2N}, where T 1i It refers to the first temperature of the initial laser at the i-th preset time point, T 2i It refers to the ambient temperature corresponding to the i-th preset time point, i=1, 2, ..., N.

[0057] Among them, the first temperature can characterize the temperature condition inside the initial laser, and the ambient temperature can characterize the temperature condition outside the initial laser. When the ambient temperature is different, it will affect the temperature inside the laser. Therefore, this embodiment obtains the first temperature set and the ambient temperature set as the basis for the layout of the heat dissipation element.

[0058] In a specific implementation, S100 further includes the following steps:

[0059] S110, collecting the temperature of the initial laser at the i-preset time point according to C first temperature sensors, and obtaining a first temperature list t corresponding to the initial laser at the i-preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC}, where t 1ij It refers to the initial temperature of the initial laser at the i-th preset time point collected by the j-th first temperature sensor, where j=1, 2, ..., C, and C refers to the number of the first temperature sensors.

[0060] S120, according to t 1i Get the first temperature T of the initial laser at the i-th preset time point 1i =(Σ j＝ 1 C t 1ij ) / C.

[0061] S130, traverse i=1, 2, ..., N, and obtain a first temperature set T1.

[0062] Among them, at the i-th preset time point, each first temperature sensor can collect the corresponding initial temperature, and the average value of the initial temperatures of C first temperature sensors at the i-th preset time point is used as the first temperature of the initial laser at the i-th preset time point to characterize the internal temperature of the initial laser at the i-th preset time point. In the accidental case where a few first temperature sensors produce measurement errors, the impact on the first temperature corresponding to the i-th preset time point can be reduced, thereby improving the accuracy of each first temperature in the first temperature set.

[0063] In a specific implementation, S100 further includes the following steps:

[0064] S140, collecting the temperature of the preset area at the i-th preset time point according to the D second temperature sensors, and obtaining the ambient temperature list t corresponding to the i-th preset time point 2i ={t 2i1 , t 2i2 ,……,t 2ik ,……,t 2iD}, where t 2ik It refers to the initial ambient temperature of the preset area at the i-th preset time point collected by the k-th second temperature sensor, where k=1, 2, ..., D, and D refers to the number of the second temperature sensors.

[0065] S150, according to t 2i Get the ambient temperature T corresponding to the i-th preset time point 2i =(Σ k＝1 D t 2ik ) / D.

[0066] S160, traverse i=1, 2, ..., N, and obtain a second temperature set T2.

[0067] Among them, at the i-th preset time point, each second temperature sensor can collect the corresponding initial ambient temperature, and the average value of the initial ambient temperatures of D second temperature sensors at the i-th preset time point is used as the ambient temperature of the initial laser at the i-th preset time point to characterize the external temperature of the initial laser at the i-th preset time point. In the accidental case where a few second temperature sensors produce measurement errors, the impact on the ambient temperature corresponding to the i-th preset time point can be reduced, thereby improving the accuracy of each ambient temperature in the ambient temperature set.

[0068] In a specific embodiment, the preset area refers to the area corresponding to area p minus area q, wherein area p refers to the area with the center of the initial laser as the sphere center and r0 as the radius, and area q refers to the area corresponding to the initial laser.

[0069] In a specific embodiment, r0>max(L), wherein L refers to the distance between any point of the initial laser and the center of the sphere, and man() refers to the maximum value function.

[0070] It can be understood that the preset area refers to an area within a certain range outside the initial laser. The specific value of r0 can be set by the implementer according to actual conditions.

[0071] As described above, the temperature condition inside the initial laser is characterized by the first temperature, and the temperature condition outside the initial laser is characterized by the ambient temperature. When the ambient temperature affects the first temperature inside the initial laser, the change of the first temperature can be analyzed in combination with the ambient temperature set, thereby providing a data basis for the layout of the heat dissipation element.

[0072] S200 , according to T1 , obtaining a first temperature gradient set D1 corresponding to the initial laser.

[0073] In a specific implementation, S200 further includes the following steps:

[0074] S210, when i=1, according to T 12 Get T 11 The corresponding first temperature gradient D 11 =T 12 -T 11 .

[0075] S220, when i ≥ 2, according to T 1(i-1) and T 1(i+1) , get T 1i The corresponding first temperature gradient D 1i =(T 1(i+1) -T 1(i-1) ) / 2.

[0076] S230, traverse i=1, 2, ..., N, and obtain a first temperature gradient set D1.

[0077] As described above, the change of the first temperature in the first temperature set is characterized according to the first temperature gradient set D1, thereby characterizing the temperature change inside the initial laser, and further characterizing the heat generation of the initial laser, providing a data basis for the layout of the heat dissipation element.

[0078] S300, based on T1 and T2, obtain the temperature difference set T3 corresponding to the initial laser = {T 31 , T 32 , ..., T 3i , ..., T 3N}, where the i-th temperature difference T 3i =T 1i -T 2i.

[0079] Among them, when the ambient temperature is different, it will affect the temperature inside the laser. Therefore, the ambient temperature and the heat generated by the initial laser jointly affect the first temperature inside the initial laser. Therefore, when arranging the heat dissipation element to dissipate heat for the laser, the difference between the ambient temperature and the first temperature is comprehensively considered to characterize the heat generation of the initial laser, providing a data basis for the layout of the heat dissipation element.

[0080] As described above, on the basis that the ambient temperature affects the temperature inside the laser, the difference between the ambient temperature and the first temperature is comprehensively considered to characterize the heat generation of the initial laser, thereby reducing the influence of the ambient temperature on the heat generation of the initial laser, providing more accurate temperature change data for the layout of the heat dissipation element, and ultimately improving the layout quality of the heat dissipation element.

[0081] S400, obtaining a second temperature gradient set D2 corresponding to the initial laser according to T3.

[0082] In a specific implementation, S400 further includes the following steps:

[0083] S410, when i=1, according to T 32 Get T 31 The corresponding second temperature gradient D 21 =T 32 -T 31 .

[0084] S420, when i ≥ 2, according to T 3(i-1) and T 3(i+1) , get T 3i The corresponding second temperature gradient D 2i =(T 3(i+1) -T 3(i-1) ) / 2.

[0085] S430, traverse i=1, 2, ..., N, and obtain a second temperature gradient set D1.

[0086] As described above, on the basis of reducing the influence of ambient temperature on the heat generation of the initial laser, the temperature change of the internal temperature of the laser is characterized according to the second temperature gradient set D2, thereby characterizing the heat generation of the initial laser, providing more accurate temperature change data for the layout of the heat dissipation element, and ultimately improving the layout quality of the heat dissipation element.

[0087] S500 , inputting D1 and D2 into the trained second prediction model to obtain the second heat generation level of the initial laser.

[0088] Among them, the second prediction model is used to extract and map features of the first temperature gradient set D1 and the second temperature gradient set D2, and output the second heat generation level of the initial laser, which is used to characterize the amount of heat generated by the initial laser during the working process. Correspondingly, the larger the second heat generation level, the more heat the initial laser generates during the working process.

[0089] The specific level of the second heat generation level can be set by the implementer according to actual conditions. For example, the second heat generation level can be 1, 2, ... CR2, where CR2 refers to the maximum value of the second heat generation level.

[0090] As described above, the first temperature gradient set D1 and the second temperature gradient set D2 are feature analyzed according to the second prediction model, and the second heat generation level of the initial laser is obtained to characterize the amount of heat generated by the initial laser during operation, which serves as the basis for determining the number of heat dissipation elements, thereby improving the accuracy of determining the number of heat dissipation elements.

[0091] S600, obtaining a second number M2 of heat dissipation elements according to the second heat generation level, a preset heat dissipation volume in the initial laser, and a preset volume of the heat dissipation element, wherein M2 refers to an integer greater than 0.

[0092] The larger the second heat generation level is, the more heat the initial laser generates during operation, and correspondingly, the more heat dissipation elements are required. Therefore, under the limitation of the preset heat dissipation volume, this embodiment combines the preset volume of the heat dissipation element and the second heat generation level to calculate the second number M2 of heat dissipation elements required, providing a basis for the layout of the heat dissipation elements.

[0093] In a specific implementation, M2 meets the following conditions:

[0094] M2=(2 / (1+e^A2)-1)×(R / V0), wherein e refers to a natural constant, A2 refers to a second heat generation level, R refers to a preset heat dissipation volume in the initial laser, and V0 refers to a preset volume of the heat dissipation element.

[0095] S700: Assemble M2 heat dissipation elements with the initial laser to obtain a second target laser.

[0096] Among them, in the reserved area corresponding to the preset heat dissipation volume, M2 heat dissipation elements are installed to ensure the heat dissipation effect of the laser, so that the second target laser has a better heat dissipation effect, ensuring the working quality and life of the second target laser.

[0097] In this embodiment, the first temperature set T1 corresponding to the initial laser at N preset time points is obtained = {T 11 , T 12 , ..., T 1i, ..., T 1N} and the ambient temperature set T2 corresponding to N preset time points = {T 21 , T 22 , ..., T 2i , ..., T 2N}, according to T1, the first temperature gradient set D1 corresponding to the initial laser is obtained, and according to T1 and T2, the temperature difference set T3 corresponding to the initial laser is obtained = {T 31 , T 32 , ..., T 3i , ..., T 3N}, according to T3, a second temperature gradient set D2 corresponding to the initial laser is obtained, D1 and D2 are input into the trained second prediction model, and a second heat generation level of the initial laser is obtained. According to the second heat generation level, the preset heat dissipation volume in the initial laser and the preset volume of the heat dissipation element, a second number M2 of heat dissipation elements is obtained, and M2 heat dissipation elements are assembled with the initial laser to obtain a second target laser. The temperature condition inside the initial laser is characterized by the first temperature, the temperature condition outside the initial laser is characterized by the ambient temperature, and then the temperature change inside the initial laser is characterized by the first temperature gradient set. On the basis of reducing the influence of the ambient temperature on the heat generation condition of the initial laser, the temperature change of the internal temperature of the laser is characterized according to the second temperature gradient set, and then the heat generation condition of the initial laser is characterized, thereby improving the characterization accuracy of the heat generation condition of the initial laser, thereby improving the heat dissipation effect of the second target laser, as well as the working quality and life of the second target laser.

[0098] Embodiment 3

[0099] On the basis of the above-mentioned Embodiments 1 and 2, this Embodiment 3 provides a heat dissipation component layout system based on data processing, and the heat dissipation component layout system based on data processing includes an initial laser, a temperature acquisition device, a processor, and a memory storing a computer program, wherein the memory also stores an initial temperature list set U1={U 11 , U 12 , ..., U 1j , ..., U 1C}, the preset heat generation level DJ corresponding to the initial laser, the preset H candidate heat dissipation areas in the initial laser, the preset heat dissipation volume set r = {r1, r2, ..., r y ,……,r H}, distance set F = {F1, F2, ..., F y , ..., F H}, where U 1j ={t11j , t 12j ,……,t 1ij ,……,t 1Nj}, t 1ij It refers to the initial temperature of the initial laser collected by the jth first temperature sensor at the i-th preset time point, r y It refers to the preset heat dissipation capacity corresponding to the yth candidate heat dissipation area, F y ={F y1 , F y2 , ..., F yj , ..., T yC}, F yj It refers to the distance between the yth candidate heat dissipation area and the jth first temperature sensor, i = 1, 2, ..., N, j = 1, 2, ..., C, y = 1, 2, ..., H. When the computer program is executed by the processor, Figure 3 As shown, implement the following steps:

[0100] S1000: Acquire a third number M3 of heat dissipation elements according to DJ, r, and a preset volume V0 of the heat dissipation element, where M3 is an integer greater than 0.

[0101] The preset heat generation level DJ is used to characterize the amount of heat generated by the initial laser during operation. Correspondingly, the larger the DJ is, the more heat is generated by the initial laser during operation.

[0102] The candidate heat dissipation area refers to the area reserved for the heat dissipation element in the initial laser. The distance F between the yth candidate heat dissipation area and the jth first temperature sensor is yj It may refer to the distance between the center of the yth candidate heat dissipation area and the center of the jth first temperature sensor.

[0103] Therefore, under the limitation of the preset heat dissipation volume set r, this embodiment combines the preset volume V0 of the heat dissipation element and the preset heat generation level DJ to calculate the third number M3 of the required heat dissipation elements, providing a basis for the layout of the heat dissipation elements.

[0104] In a specific implementation, the memory also stores a trained first prediction model, and when the computer program is executed by the processor, the following steps are implemented:

[0105] S01, according to U1, obtain the first temperature list t corresponding to the initial laser at the i-th preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC}.

[0106] S02, according to t1i Get the first temperature T of the initial laser at the i-th preset time point 1i =(Σ j＝1 C t 1ij ) / C.

[0107] S03, traverse i=1, 2, ..., N, and obtain the first temperature set T1.

[0108] S04 , input T1 into a first prediction model to obtain a first heat generation level A1 of an initial laser.

[0109] S05 , setting the first heat generation level A1 as the preset heat generation level DJ.

[0110] As described above, the first heat generation level of the initial laser is measured by the temperature data inside the initial laser to characterize the ability of the initial laser to generate heat during operation, thereby improving the accuracy of the preset heat generation level, thereby improving the heat dissipation effect of the third target laser, and further improving the working quality and life of the third target laser.

[0111] In a specific embodiment, the memory also stores the trained second prediction model and the ambient temperature set T2 corresponding to N preset time points = {T 21 , T 22 , ..., T 2i , ..., T 2N}, where T 2i It refers to the ambient temperature corresponding to the i-th preset time point. When the computer program is executed by the processor, the following steps are implemented:

[0112] S11, according to U1, obtain the first temperature list t corresponding to the initial laser at the i-th preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC}.

[0113] S12, according to t 1i Get the first temperature T of the initial laser at the i-th preset time point 1i =(Σ j＝1 C t 1ij ) / C.

[0114] S13, traverse i=1, 2, ..., N, and obtain the first temperature set T1.

[0115] S14, according to T1, obtaining a first temperature gradient set D1 corresponding to the initial laser.

[0116] S15, based on T1 and T2, obtain the temperature difference set T3 corresponding to the initial laser = {T 31 , T 32 , ..., T 3i , ..., T 3N}, where the i-th temperature difference T 3i =T 1i -T 2i .

[0117] S16, obtaining a second temperature gradient set D2 corresponding to the initial laser according to T3.

[0118] S17, inputting D1 and D2 into the trained second prediction model to obtain the second heat generation level A2 of the initial laser.

[0119] S18, setting the second heat generation level A2 as the preset heat generation level DJ.

[0120] In the above, the temperature condition inside the initial laser is characterized by the first temperature, the temperature condition outside the initial laser is characterized by the ambient temperature, and then the temperature change condition inside the initial laser is characterized by the first temperature gradient set. On the basis of reducing the influence of the ambient temperature on the heat generation condition of the initial laser, the temperature change condition of the internal temperature of the laser is characterized according to the second temperature gradient set, and then the heat generation condition of the initial laser is characterized, thereby improving the accuracy of the preset heat generation level of the initial laser, thereby improving the heat dissipation effect of the third target laser, as well as the working quality and life of the third target laser.

[0121] In a specific embodiment, the memory further stores a second initial prediction model, Z first temperature gradient set samples, Z second temperature gradient set samples, and corresponding Z second heat generation level samples. When the computer program is executed by the processor, the following steps are also implemented:

[0122] S21, inputting the αth first temperature gradient set sample and the αth second temperature gradient set sample into a second initial prediction model to obtain the αth predicted second heat generation level, where α=1, 2, ..., Z.

[0123] S22, obtaining the αth second model sub-loss according to the αth second heat generation level sample and the αth predicted second heat generation level.

[0124] S23, traverse α=1, 2, ..., Z, and obtain Z second model sub-losses.

[0125] S24: Obtain the second model total loss of the second initial prediction model according to the Z second model sub-losses.

[0126] S25, updating the parameters of the second initial prediction model according to the total loss of the second model until the total loss of the second model meets the preset second training condition, and obtaining the trained second prediction model.

[0127] Among them, the closer the second heat generation level sample and the corresponding predicted second heat generation level are, the higher the accuracy of the second initial prediction model is. Therefore, the second model sub-loss is calculated according to the second heat generation level sample and the corresponding predicted second heat generation level, and then the second model total loss is obtained to train the second initial prediction model, so as to obtain a trained second prediction model with higher accuracy.

[0128] As described above, the second initial prediction model is trained according to Z first temperature gradient set samples, Z second temperature gradient set samples and corresponding Z second heat generation level samples to obtain a trained second prediction model, which improves the accuracy of the second prediction model and further improves the accuracy of the preset heat generation level DJ.

[0129] In a specific implementation, the preset second training condition refers to the total loss of the second model converging.

[0130] In a specific implementation, the preset second training condition means that the total loss of the second model is less than a preset second loss threshold.

[0131] The specific value of the preset second loss threshold can be set by the implementer according to actual conditions.

[0132] In a specific implementation, S1000 further includes the following steps:

[0133] S1100, according to r, when r y >V0, the yth candidate heat dissipation area is determined as the optional heat dissipation area.

[0134] S1200 , traverse y=1, 2, ..., H, and obtain h optional heat dissipation areas, where h≤H.

[0135] S1300: According to DJ and h, obtain the third number of heat dissipation components M3=(2 / (1+e -DJ )-1)×h, where e refers to a natural constant.

[0136] Among them, when the preset heat dissipation volume of the candidate heat dissipation area is larger than the preset volume of the heat dissipation component, the corresponding candidate heat dissipation area can be used as an optional heat dissipation area as a basis for placing the heat dissipation component to complete the screening of the candidate heat dissipation area and improve the accuracy of the placement of the heat dissipation component.

[0137] As described above, based on the comparison between the preset heat dissipation volume of the candidate heat dissipation area and the preset volume of the heat dissipation element, the candidate heat dissipation area is screened, the accuracy of the placement of the heat dissipation element is improved, and then the heat dissipation effect, working quality and life of the third target laser are improved.

[0138] S2000: According to U, obtain a second temperature set V corresponding to C first temperature sensors = {V1, V2, ..., V j , ..., V C}, where the second temperature V corresponding to the jth first temperature sensor j =(Σ i＝1 N t 1ij ) / N.

[0139] The average value of the initial temperatures corresponding to the jth first temperature sensor at N preset time points is taken as the second temperature V corresponding to the jth first temperature sensor. j , to characterize the heat generation of the initial laser at the location of the jth first temperature sensor. Correspondingly, the second temperature V j The higher it is, the more heat the initial laser generates at the location of the jth first temperature sensor, which serves as the basis for determining the placement position of the heat dissipation element.

[0140] As described above, the heat generation of the initial laser at the position where the corresponding first temperature sensor is located is characterized according to the second temperature, which provides a data basis for determining the placement position of the heat dissipation element, improves the accuracy of the placement of the heat dissipation element, and further improves the heat dissipation effect, working quality and life of the third target laser.

[0141] S3000: Based on V and F, obtain a heat dissipation requirement set X corresponding to H candidate heat dissipation areas = {X1, X2, ..., X y , ..., X H}, where the heat dissipation requirement level X corresponding to the yth candidate heat dissipation area y =Σ j＝1 C (V j ×e^(-F yj )).

[0142] Among them, the heat dissipation requirement degree corresponding to each candidate heat dissipation area is obtained according to the distance between each candidate heat dissipation area and the N first temperature sensors, and the second temperature corresponding to each first temperature sensor. Correspondingly, the heat dissipation requirement degree is negatively correlated with the distance and positively correlated with the second temperature.

[0143] In the above, combined with the distance between each candidate heat dissipation area and the N first temperature sensors, and the second temperature corresponding to each first temperature sensor, the heat dissipation requirement degree corresponding to each candidate heat dissipation area is obtained to characterize the matching between each candidate heat dissipation area and the heat dissipation element, which serves as the basis for determining the placement position of the heat dissipation element, improves the accuracy of the placement of the heat dissipation element, and thus improves the heat dissipation effect, working quality and life of the third target laser.

[0144] S4000 uses M3 candidate cooling areas with the greatest cooling requirements as target cooling areas.

[0145] In a specific implementation, M3 optional heat dissipation areas with the greatest heat dissipation requirements are selected as target heat dissipation areas.

[0146] S5000: Set a heat dissipation element in each target heat dissipation area of ​​the initial laser to obtain a third target laser.

[0147] A heat dissipation element is installed in each target heat dissipation area to ensure the heat dissipation effect of the laser, so that the third target laser has a better heat dissipation effect, ensuring the working quality and life of the third target laser.

[0148] In this embodiment, according to the preset heat generation level DJ, the preset heat dissipation volume set r and the preset volume V0 of the heat dissipation element, a third number M3 of heat dissipation elements is obtained, and according to U, a second temperature set V corresponding to C first temperature sensors is obtained = {V1, V2, ..., V j , ..., V C}, according to V and F, obtain the heat dissipation requirement set X corresponding to the H candidate heat dissipation areas = {X1, X2, ..., X y , ..., X H}, taking the M3 candidate heat dissipation areas with the greatest heat dissipation demand as the target heat dissipation areas, setting a heat dissipation element in each target heat dissipation area of ​​the initial laser, and obtaining the third target laser, by calculating the third number M3 of heat dissipation elements required under the restriction of the preset heat dissipation volume set r, combining the preset volume V0 of the heat dissipation element and the preset heat generation level DJ, and characterizing the heat generation of the initial laser at the corresponding position of the first temperature sensor according to the second temperature, and obtaining the heat dissipation demand corresponding to each candidate heat dissipation area in combination with the distance between the candidate heat dissipation area and the first temperature sensor, to characterize the matching between each candidate heat dissipation area and the heat dissipation element, thereby improving the accuracy of the placement of the heat dissipation element, and thereby improving the heat dissipation effect, working quality and life of the third target laser.

[0149] Embodiment 4

[0150] Based on the above-mentioned embodiment 2, this embodiment 4 provides a heat dissipation component layout device, such as Figure 4 As shown, the heat dissipation element layout device includes:

[0151] The temperature data acquisition module 41 is used to acquire the first temperature set T1 corresponding to the initial laser at N preset time points = {T 11 , T 12 , ..., T 1i , ..., T 1N} and the ambient temperature set T2 corresponding to N preset time points = {T 21 , T 22 , ..., T 2i , ..., T 2N}, where T 1i It refers to the first temperature of the initial laser at the i-th preset time point, T 2i It refers to the ambient temperature corresponding to the i-th preset time point, i=1, 2, ..., N.

[0152] The first temperature gradient acquisition module 42 is used to acquire a first temperature gradient set D1 corresponding to the initial laser according to T1.

[0153] The temperature difference data acquisition module 43 is used to acquire the temperature difference set T3 corresponding to the initial laser according to T1 and T2 = {T 31 , T 32 , ..., T 3i , ..., T 3N}, where the i-th temperature difference T 3i =T 1i -T 2i .

[0154] The second temperature gradient acquisition module 44 is used to acquire a second temperature gradient set D2 corresponding to the initial laser according to T3.

[0155] The second heat generation level acquisition module 45 is used to input D1 and D2 into the trained second prediction model to acquire the second heat generation level of the initial laser.

[0156] The second quantity acquisition module 46 is used to acquire a second quantity M2 of heat dissipation elements according to the second heat generation level, the preset heat dissipation volume in the initial laser and the preset volume of the heat dissipation element, wherein M2 refers to an integer greater than 0.

[0157] The second target laser acquisition module 47 is used to assemble M2 heat dissipation elements with the initial laser to acquire the second target laser.

[0158] In a specific implementation, the temperature data acquisition module 41 further includes:

[0159] The first temperature list acquisition submodule is used to collect the temperature of the initial laser at the i-preset time point according to C first temperature sensors, and obtain the first temperature list t corresponding to the initial laser at the i-preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC}, where t 1ij It refers to the initial temperature of the initial laser at the i-th preset time point collected by the j-th first temperature sensor, where j=1, 2, ..., C, and C refers to the number of the first temperature sensors.

[0160] The first temperature acquisition submodule is used to obtain the temperature according to t 1i Get the first temperature T of the initial laser at the i-th preset time point 1i =(Σ j＝1 C t 1ij ) / C.

[0161] The first data traversal submodule is used to traverse i=1, 2, ..., N to obtain a first temperature set T1.

[0162] In a specific implementation, the temperature data acquisition module 41 further includes:

[0163] The ambient temperature list acquisition submodule is used to collect the temperature of the preset area at the i-th preset time point according to the D second temperature sensors, and obtain the ambient temperature list t corresponding to the i-th preset time point 2i ={t 2i1 , t 2i2 ,……,t 2ik ,……,t 2iD}, where t 2ik It refers to the initial ambient temperature of the preset area at the i-th preset time point collected by the k-th second temperature sensor, where k=1, 2, ..., D, and D refers to the number of the second temperature sensors.

[0164] The ambient temperature acquisition submodule is used to obtain the ambient temperature according to t 2i Get the ambient temperature T corresponding to the i-th preset time point 2i =(Σ k＝1 D t 2ik ) / D.

[0165] The second data traversal submodule is used to traverse i=1, 2, ..., N to obtain a second temperature set T2.

[0166] In a specific embodiment, the preset area refers to the area corresponding to area p minus area q, wherein area p refers to the area with the center of the initial laser as the sphere center and r0 as the radius, and area q refers to the area corresponding to the initial laser.

[0167] In a specific embodiment, r0>max(L), wherein L refers to the distance between any point of the initial laser and the center of the sphere, and man() refers to the maximum value function.

[0168] In a specific implementation, the first temperature gradient acquisition module 42 further includes:

[0169] The first temperature gradient acquisition submodule is used to obtain the temperature gradient according to T when i=1. 12 Get T 11 The corresponding first temperature gradient D 11 =T 12 -T 11 .

[0170] The second temperature gradient acquisition submodule is used to obtain the temperature gradient according to T when i ≥ 2. 1(i-1) and T 1(i+1) , get T 1i The corresponding first temperature gradient D 1i =(T 1(i+1) -T 1(i-1) ) / 2.

[0171] The first temperature gradient set acquisition submodule is used to traverse i=1, 2, ..., N to acquire the first temperature gradient set D1.

[0172] In a specific implementation, the second temperature gradient acquisition module 44 further includes:

[0173] The third temperature gradient acquisition submodule is used to obtain the temperature gradient according to T when i=1. 32 Get T 31 The corresponding second temperature gradient D 21 =T 32 -T 31 .

[0174] The fourth temperature gradient acquisition submodule is used to obtain the temperature gradient according to T when i ≥ 2. 3(i-1) and T 3(i+1) , get T 3i The corresponding second temperature gradient D 2i =(T 3(i+1) -T 3(i-1) ) / 2.

[0175] The second temperature gradient set acquisition submodule is used to traverse i=1, 2, ..., N to acquire the second temperature gradient set D1.

[0176] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory, programmable, electrically programmable, electrically erasable programmable or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM, dynamic RAM, synchronous DRAM, double data rate SDRAM, enhanced SDRAM, synchronous link DRAM, memory bus (Rambus) direct RAM, direct memory bus dynamic RAM, and memory bus dynamic RAM.

[0177] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0178] Embodiment 5

[0179] A fifth embodiment of the present invention provides an electronic device, which includes a processor and the non-transitory computer-readable storage medium in the fourth embodiment of the present invention.

[0180] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will also be appreciated by those skilled in the art that various modifications may be made to the embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat dissipation component layout system based on data processing, characterized in that: The heat dissipation element layout system based on data processing includes an initial laser, a temperature acquisition device, a processor and a memory storing a computer program, wherein the memory also stores a list of initial temperatures corresponding to the initial laser at N preset time points acquired by C first temperature sensors U1={U 11 , U 12 , ..., U 1j , ..., U 1C }, a preset heat generation level DJ corresponding to the initial laser, H candidate heat dissipation areas preset in the initial laser, a preset heat dissipation volume set r = {r1, r2, ..., r y ,……,r H }, distance set F = {F1, F2, ..., F y , ..., F H }, where U 1j ={t 11j , t 12j ,……,t 1ij ,……,t 1Nj }, t 1ij refers to the initial temperature of the initial laser at the i-th preset time point collected by the j-th first temperature sensor, r y It refers to the preset heat dissipation capacity corresponding to the yth candidate heat dissipation area, F y ={F y1 , F y2 , ..., F yj , ..., T yC }, F yj It refers to the distance between the yth candidate heat dissipation area and the jth first temperature sensor, i=1, 2, ..., N, j=1, 2, ..., C, y=1, 2, ..., H. When the computer program is executed by the processor, the following steps are implemented: S1000, according to DJ, r and the preset volume V0 of the heat dissipation element, a third number M3 of the heat dissipation elements is obtained, wherein M3 is an integer greater than 0, and S1000 further includes the following steps: S1100, according to r, when r y >V0, the yth candidate heat dissipation area is determined as the optional heat dissipation area; S1200, traverse y=1, 2, ..., H, and obtain h optional heat dissipation areas, where h≤H; S1300: According to DJ and h, obtain the third number of heat dissipation components M3=(2 / (1+e -DJ )-1)×h, where e refers to a natural constant; S2000: According to U, obtain a second temperature set V corresponding to the C first temperature sensors = {V1, V2, ..., V j , ..., V C }, wherein the second temperature V corresponding to the jth first temperature sensor j =(Σ i＝1 N t 1ij ) / N; S3000: According to V and F, a heat dissipation requirement set X corresponding to the H candidate heat dissipation areas is obtained, which is X={X1, X2, . . . , X y , ..., X H }, where the heat dissipation requirement level X corresponding to the yth candidate heat dissipation area y =Σ j＝1 C (V j ×e^(-F yj )); S4000, selects M3 candidate cooling areas with the greatest cooling requirements as target cooling areas; S5000: Dispose a heat dissipation element in each target heat dissipation area of ​​the initial laser to obtain a third target laser.

2. The heat dissipation component layout system based on data processing according to claim 1, characterized in that: The memory also stores a trained first prediction model. When the computer program is executed by the processor, the following steps are implemented: S01, according to U1, obtain the first temperature list t corresponding to the initial laser at the i-th preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC }; S02, according to t 1i The first temperature T of the initial laser at the i-th preset time point is obtained. 1i =(Σ j＝1 C t 1ij ) / C; S03, traverse i=1, 2, ..., N, and obtain the first temperature set T1; S04, inputting T1 into the first prediction model to obtain a first heat generation level A1 of the initial laser; S05 : setting the first heat generation level A1 as the preset heat generation level DJ.

3. The heat dissipation component layout system based on data processing according to claim 1, characterized in that: The memory also stores the trained second prediction model and the ambient temperature set T2 corresponding to the N preset time points = {T 21 , T 22 , ..., T 2i , ..., T 2N }, where T 2i refers to the ambient temperature corresponding to the i-th preset time point. When the computer program is executed by the processor, the following steps are implemented: S11, according to U1, obtain the first temperature list t corresponding to the initial laser at the i-th preset time point 1i ={t 1i1 , t 1i2 ,……,t 1ij ,……,t 1iC }; S12, according to t 1i The first temperature T of the initial laser at the i-th preset time point is obtained. 1i =(Σ j＝1 C t 1ij ) / C; S13, traverse i=1, 2, ..., N, and obtain the first temperature set T1; S14, according to T1, obtaining a first temperature gradient set D1 corresponding to the initial laser; S15, according to T1 and T2, obtain the temperature difference set T3 corresponding to the initial laser = {T 31 , T 32 , ..., T 3i , ..., T 3N }, where the i-th temperature difference T 3i =T 1i -T 2i ; S16, acquiring a second temperature gradient set D2 corresponding to the initial laser according to T3; S17, inputting D1 and D2 into the trained second prediction model to obtain the second heat generation level A2 of the initial laser; S18, setting the second heat generation level A2 as the preset heat generation level DJ.

4. The heat dissipation component layout system based on data processing according to claim 3, characterized in that: The memory also stores a second initial prediction model, Z first temperature gradient set samples, Z second temperature gradient set samples, and corresponding Z second heat generation level samples. When the computer program is executed by the processor, the following steps are also implemented: S21, inputting the αth first temperature gradient set sample and the αth second temperature gradient set sample into the second initial prediction model to obtain the αth predicted second heat generation level, where α=1, 2, ..., Z; S22, obtaining an αth second model sub-loss according to the αth second heat generation level sample and the αth predicted second heat generation level; S23, traverse α=1, 2, ..., Z, and obtain Z second model sub-losses; S24, obtaining a second model total loss of the second initial prediction model according to the Z second model sub-losses; S25, updating the parameters of the second initial prediction model according to the total loss of the second model until the total loss of the second model meets the preset second training condition, and obtaining the trained second prediction model.

5. The heat dissipation component layout system based on data processing according to claim 4, characterized in that: The preset second training condition refers to the convergence of the total loss of the second model.

6. The heat dissipation component layout system based on data processing according to claim 4, characterized in that: The preset second training condition means that the total loss of the second model is less than a preset second loss threshold.

7. The heat dissipation component layout system based on data processing according to claim 1, characterized in that: The M3 optional cooling areas with the greatest cooling requirements are selected as target cooling areas.

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