Microstrip line assembly, microstrip line waveguide conversion structure and electronic device

Abstract

The application discloses a microstrip line assembly, a microstrip line waveguide conversion structure and electronic equipment, and relates to the technical field of microstrip line assemblies.The microstrip line assembly comprises a microstrip transmission line, a dielectric layer and a signal coupling structure; the microstrip transmission line is arranged on the dielectric layer; and the signal coupling structure is arranged on an output end of the microstrip transmission line and is used for coupling the microstrip transmission line and a waveguide assembly.The technical scheme couples the microstrip transmission line and the waveguide assembly through the signal coupling structure, so that the microstrip line assembly and the waveguide assembly can be independently machined, the requirement for structural precision is reduced, only one dielectric layer is used, the number of dielectric layers is reduced, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of radio frequency technology, and in particular to a microstrip line assembly, a microstrip line waveguide conversion structure and an electronic device. BACKGROUND

[0002] Waveguide and microstrip line are two important transmission lines in microwave or millimeter wave. Waveguide and microstrip line are generally used in combination to realize a compact and high-performance microwave or millimeter wave system.

[0003] The current microstrip line waveguide conversion structure includes stepped ridge waveguide transition structure and dipole fin transition structure, etc., and the above structure requires precision, resulting in complex processing technology and high cost. SUMMARY

[0004] The embodiments of the present application provide a microstrip line assembly, a microstrip line waveguide conversion structure and an electronic device to solve the problem of complex processing technology and high cost of the current microstrip line waveguide conversion structure.

[0005] A microstrip line assembly comprises a microstrip transmission line, a dielectric layer and a signal coupling structure.

[0006] The microstrip transmission line is arranged on the dielectric layer.

[0007] The signal coupling structure is arranged on the output end of the microstrip transmission line and is used to couple the microstrip transmission line and the waveguide assembly.

[0008] Further, the microstrip line assembly further comprises a metal ground, the microstrip transmission line is arranged on the front surface of the dielectric layer, and the metal ground is arranged on the back surface of the dielectric layer.

[0009] Further, the microstrip transmission line comprises at least two impedance transformation structures arranged in sequence along the signal transmission direction, and the widths of the at least two impedance transformation structures are sequentially reduced.

[0010] Further, the signal coupling structure comprises two metal pieces arranged in cross.

[0011] The intersection of the two metal pieces is connected to the output end of the microstrip transmission line.

[0012] Further, the two metal pieces are of the same shape, and the metal pieces are in the form of strips.

[0013] Further, a first included angle between the two metal pieces ranges from 80 to 100 degrees, and the first included angle is connected to the output end of the microstrip transmission line.

[0014] Further, the lengths of the two metal pieces are the same.

[0015] Further, the length of the metal piece is 0.15 to 0.35 times of a target wavelength, the target wavelength being determined based on a center frequency of the microstrip line assembly.

[0016] A microstrip line waveguide conversion structure comprises a waveguide assembly and the microstrip line assembly described above.

[0017] The waveguide assembly comprises a transmission body and a waveguide cavity arranged in the transmission body.

[0018] The signal coupling structure of the microstrip line assembly is arranged in the waveguide cavity.

[0019] Further, the transmission body is provided with a first opening communicating with the waveguide cavity, and the signal coupling structure is embedded into the waveguide cavity through the first opening.

[0020] Further, the distance between the signal coupling structure and the closed end of the transmission body is 0.4 to 0.6 times of a target wavelength, the target wavelength being determined based on a center frequency of the microstrip line assembly.

[0021] An electronic device comprises a microstrip line, a waveguide and the microstrip line waveguide conversion structure described above.

[0022] The microstrip line waveguide conversion structure is connected with the microstrip line and the waveguide.

[0023] The microstrip line assembly, the microstrip line waveguide conversion structure and the electronic device described above, the microstrip line assembly comprises a microstrip transmission line, a dielectric layer and a signal coupling structure; the microstrip transmission line is arranged on the dielectric layer; the signal coupling structure is arranged on the output end of the microstrip transmission line and is used for coupling the microstrip transmission line and the waveguide assembly, so that the microstrip line assembly and the waveguide assembly can be independently processed, the requirement for structural precision is reduced, only one dielectric layer is used, the number of dielectric layers is reduced, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0025] Figure 1 is a schematic view of the microstrip line assembly in an embodiment of the present application;

[0026] Figure 2 is another schematic view of the microstrip line assembly in an embodiment of the present application;

[0027] Figure 3 is a schematic diagram of a waveguide assembly in an embodiment of the present application;

[0028] Figure 4 is a schematic diagram of a microstrip line waveguide conversion structure in an embodiment of the present application;

[0029] Figure 5 is an S-parameter simulation plot in an embodiment of the present application.

[0030] In the figure: 1, microstrip line assembly; 11, microstrip transmission line; 111, at least two impedance transformation structures; 12, dielectric layer; 13, signal coupling structure; 131, metal piece; 14, metal ground; 2, waveguide assembly; 21, transmission body; 22, waveguide cavity; 23, first opening. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0032] It should be understood that the present application can be implemented in various forms and should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure will be thorough and complete and will fully convey the scope of the present application to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions can be exaggerated for clarity. The same reference numbers in different drawings denote the same elements.

[0033] It should be understood that when an element or layer is referred to as being "on", "adjacent", "connected to", or "coupled to" another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer, or one or more intervening elements or layers can exist. In contrast, when an element is referred to as being "directly on", "directly adjacent", "directly connected to", or "directly coupled to" another element or layer, then there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0034] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptions used herein interpreted accordingly.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0036] For a thorough understanding of the present application, reference should be made to the following detailed description, in conjunction with the accompanying drawings, in which:

[0037] The present embodiment provides a microstrip line assembly 1, which is applied in a microstrip line to waveguide structure. As shown in the figure, the microstrip line to waveguide structure includes a microstrip line assembly 1 and a waveguide assembly 2, which are coupled to each other to realize the conversion of the radio frequency signal transmission medium. Figure 4 The microstrip line to waveguide structure can be applied in an electronic device, which includes a microwave system. The electronic device includes a microstrip line, a waveguide and the microstrip line to waveguide structure. The microstrip line to waveguide structure is connected to the microstrip line and the waveguide to realize the conversion of the radio frequency signal transmission medium, so as to integrate the microstrip line and the waveguide in the microwave system.

[0038] The present embodiment provides a microstrip line assembly 1, which is applied in a microstrip line to waveguide structure. As shown in the figure, the microstrip line to waveguide structure includes a microstrip line assembly 1 and a waveguide assembly 2, which are coupled to each other to realize the conversion of the radio frequency signal transmission medium.

[0039] The present embodiment provides a microstrip line assembly 1, which is applied in a microstrip line to waveguide structure. As shown in the figure, the microstrip line to waveguide structure includes a microstrip line assembly 1 and a waveguide assembly 2, which are coupled to each other to realize the conversion of the radio frequency signal transmission medium. Figure 1As shown, the microstrip line assembly 1 comprises a microstrip line 11, a dielectric layer 12 and a signal coupling structure 13; the microstrip line 11 is arranged on the dielectric layer 12; the signal coupling structure 13 is arranged on an output end of the microstrip line 11, and is used for coupling the microstrip line 11 and the waveguide assembly 2.

[0040] The dielectric layer 12 is a dielectric substrate. The first side of the dielectric layer 12 can be a front side or a back side of the dielectric layer 12. As an example, the dielectric layer 12 can be a PCB (Printed Circuit Board, PCB for short) board.

[0041] As an example, the microstrip line 11 is arranged on the dielectric layer 12. As an example, the microstrip line 11 can be arranged on the dielectric layer 12 through an etching process. The microstrip line 11 comprises an input end and an output end. The input end is used for receiving a radio frequency signal, and the output end is used for outputting the radio frequency signal. The bandwidth of the radio frequency signal can be set according to actual experience and requirements.

[0042] As an example, the signal coupling structure 13 is arranged on the output end of the microstrip line 11, and is used for coupling the microstrip line 11 and the waveguide assembly 2, so as to ensure that the radio frequency signal output by the output end of the microstrip line 11 can be coupled into the waveguide assembly 2. As an example, the waveguide assembly 2 comprises a transmission body 21 and a waveguide cavity 22 arranged in the transmission body 21, and the signal coupling structure 13 of the microstrip line assembly 1 is arranged in the waveguide cavity 22, so that the transmission medium of the radio frequency signal is converted from the microstrip line 11 to the waveguide assembly 2.

[0043] In this embodiment, the microstrip line assembly 1 comprises a microstrip line 11, a dielectric layer 12 and a signal coupling structure 13; the microstrip line 11 is arranged on the dielectric layer 12; the signal coupling structure 13 is arranged on an output end of the microstrip line 11, and is used for coupling the microstrip line 11 and the waveguide assembly 2, so that the microstrip line assembly 1 and the waveguide assembly 2 can be independently processed through the signal coupling structure 13, the requirement for structural precision is reduced, only one dielectric layer 12 is used, the number of dielectric layers 12 is reduced, and the cost is reduced.

[0044] In an embodiment, as shown in Figure 1 and Figure 2 the microstrip line assembly 1 further comprises a metal ground 14, the microstrip line 11 is arranged on the first side of the dielectric layer 12, and the metal ground 14 is arranged on the second side of the dielectric layer 12.

[0045] As an example, the second side of the dielectric layer 12 is the back or front of the dielectric layer 12. For example, when the microstrip transmission line 11 is arranged on the front of the dielectric layer 12, the metal ground 14 is arranged on the back of the dielectric layer 12; when the microstrip transmission line 11 is arranged on the back of the dielectric layer 12, the metal ground 14 is arranged on the front of the dielectric layer 12.

[0046] Further, the metal ground 14 is arranged on part of the second side of the dielectric layer 12 to reduce the cost.

[0047] In the embodiment, the microstrip transmission line 11 is arranged on the first side of the dielectric layer 12, and the metal ground 14 is arranged on the second side of the dielectric layer 12, so that the microstrip line assembly 1 is simple in structure, easy to structure, and only one dielectric layer 12 is used, reducing the number of dielectric layers 12 and reducing the cost.

[0048] In an embodiment, the microstrip transmission line 11 includes at least two impedance transformation structures 111 arranged in sequence along the signal transmission direction, and the widths of the at least two impedance transformation structures 111 decrease in sequence.

[0049] It can be understood that the signal transmission direction is the transmission direction of the radio frequency signal. For example, the radio frequency signal is transmitted from the input end of the microstrip transmission line 11 to the output end of the microstrip transmission line 11.

[0050] In the embodiment, the microstrip transmission line 11 includes at least two impedance transformation structures 111 arranged in sequence along the signal transmission direction, and the widths of the at least two impedance transformation structures 111 decrease in sequence, so as to adjust the characteristic impedance decreasing in sequence, to realize impedance matching, reduce the reflection and attenuation of the radio frequency signal, improve the transmission efficiency of the radio frequency signal, and widen the transmission bandwidth of the microstrip transmission line 11.

[0051] In an embodiment, as shown in Figure 1 The signal coupling structure 13 includes two metal pieces 131 arranged in cross, and the intersection of the two metal pieces 131 is connected to the output end of the microstrip transmission line 11.

[0052] In the embodiment, the two metal pieces 131 are arranged in cross, and the intersection of the two metal pieces 131 is connected to the output end of the microstrip transmission line 11, so that the two metal pieces 131 arranged in cross can couple the radio frequency signal with wider bandwidth into the waveguide assembly 2, thereby improving the frequency band response performance of the signal coupling structure 13 while reducing the cost of the microstrip line assembly 1, and realizing the microstrip line-waveguide conversion of the radio frequency signal with wider bandwidth.

[0053] In an embodiment, the two metal pieces 131 are of the same shape, and the metal piece 131 is in a strip shape.

[0054] In the embodiment, the two metal pieces 131 are ensured to have the same shape and are in strip shape, so that the loss of the radio frequency signal can be reduced.

[0055] In an embodiment, the first included angle between the two metal pieces 131 ranges from 80 to 100 degrees, and the first included angle is connected to the output end of the microstrip transmission line 11.

[0056] In the embodiment, the first included angle between the two metal pieces 131 ranges from 80 to 100 degrees, so that the two metal pieces 131 can couple a wider bandwidth of the radio frequency signal into the waveguide assembly 2, while having a better impedance matching effect. Preferably, the first included angle between the two metal pieces 131 is 90 degrees.

[0057] In an embodiment, the lengths L of the two metal pieces 131 are the same.

[0058] In the embodiment, the lengths L of the two metal pieces 131 are the same, so that the signal coupling structure 13 has a better characteristic impedance, and the loss of the radio frequency signal in the process of being coupled into the waveguide assembly 2 is reduced.

[0059] In an embodiment, the length L of the metal piece 131 is 0.15 to 0.35 times of a target wavelength, and the target wavelength is determined based on the center frequency of the microstrip line assembly 1.

[0060] As an example, the center frequency of the microstrip line assembly 1 is the center frequency point of the bandwidth of the radio frequency signal. For example, if the bandwidth of the radio frequency signal is 61-98 GHz, the center frequency point of the bandwidth of the radio frequency signal is 79.5 GHz, which is approximately equal to 80 GHz, and the center frequency of the microstrip line assembly 1 is 80 GHz.

[0061] As an example, the target wavelength is determined according to the center frequency of the microstrip line assembly 1. For example, according to the following formula (1):

[0062] c = f λ (Formula 1)

[0063] Wherein, c is the propagation speed of the radio frequency signal in the air, f is the center frequency of the microstrip line assembly 1, and λ is the target wavelength.

[0064] Suppose c is 3*10 8 m / s, and the center frequency of the microstrip line assembly 1 is 80 GHz, then the target wavelength is 3.75 mm. Therefore, the length L of the metal piece 131 is between 0.6 mm and 1.3 mm. It can be understood that the bandwidth of the radio frequency signal is selected according to the actual demand, and then the metal piece 131 with different length L is selected. Preferably, the length L of the metal piece 131 is 0.25 times of the target wavelength, so that the signal coupling structure 13 has lower loss and smaller return loss when the bandwidth of the radio frequency signal is 61-98 GHz.

[0065] This embodiment provides a microstrip waveguide conversion structure, including a waveguide assembly 2 and the aforementioned microstrip assembly 1; the waveguide assembly 2 includes a transmission body 21 and a waveguide cavity 22 disposed within the transmission body 21; the signal coupling structure 13 of the microstrip assembly 1 is disposed within the waveguide cavity 22.

[0066] In this embodiment, by placing the signal coupling structure 13 of the microstrip line component 1 inside the waveguide cavity 22, the signal coupling structure 13 can couple a wider bandwidth radio frequency signal into the waveguide cavity 22, thereby realizing microstrip line waveguide conversion in only one waveguide cavity 22. Furthermore, the waveguide component 2 and the microstrip line component 1 can be fabricated independently, reducing the requirements for structural precision. In addition, only one dielectric layer 12 is used, reducing the number of dielectric layers 12 and lowering costs.

[0067] In one embodiment, the transmission body 21 is provided with a first opening 23 that connects to the waveguide cavity 22, and the signal coupling structure 13 is embedded into the waveguide cavity 22 through the first opening 23.

[0068] The first opening 23 can be T-shaped or other shapes.

[0069] As an example, a first opening 23 is etched on the transmission body 21. The first opening 23 is T-shaped so that the microstrip line assembly 1 can be placed on the long side of the first opening 23. After welding, the microstrip line assembly 1 can be tightly bonded to the waveguide to ensure the overall stability of the structure.

[0070] Furthermore, such as Figure 4 As shown, the dielectric layer 12 of the microstrip line assembly 1 includes a dielectric body and an extension extending along a first side of the dielectric body, the width of which is less than the length of the first side. The output terminal of the microstrip transmission line 11 and the signal coupling structure 13 are located in this extension. The extension is embedded into the waveguide cavity 22 through the long side of the first opening 23. The dielectric layer 12 and the transmission body 21 are perpendicular to each other. After welding, the dielectric layer 12 can be tightly bonded to the waveguide, ensuring the overall stability of the structure. At the same time, the area of ​​the dielectric layer 12 is reduced, minimizing the impact of changes in the parameters of the dielectric layer 12 on the radio frequency signal transmission efficiency.

[0071] In one embodiment, the distance between the signal coupling structure 13 and the closed end of the transmission body 21 is 0.4 to 0.6 times the target wavelength, which is determined based on the center frequency of the microstrip line component 1.

[0072] As an example, when the radio frequency signal is coupled to the waveguide cavity 22 through the signal coupling structure 13, the first radio frequency signal and the second radio frequency signal are formed, the propagation direction of the first radio frequency signal is opposite to that of the second radio frequency signal, the propagation direction of the first radio frequency signal is the waveguide propagation direction, the propagation direction of the second radio frequency signal is along the closed end of the transmission body 21, and the third radio frequency signal is formed after reflection, the propagation direction of the third radio frequency signal is the same as that of the first radio frequency signal. In this embodiment, the distance between the signal coupling structure 13 and the closed end of the transmission body 21 is ensured to be 0.4 to 0.6 times the target wavelength, so that the first radio frequency signal and the third radio frequency signal have the same phase, and the two radio frequency signals, the first radio frequency signal and the third radio frequency signal, are superimposed on each other, thereby realizing the super wideband performance and better matching effect, that is, realizing the super wideband radio frequency signal transmission between the microstrip line waveguides. As preferred, when the distance between the signal coupling structure 13 and the closed end of the transmission body 21 is 0.5 times the target wavelength, the best super wideband radio frequency signal transmission effect is achieved. As shown in Figure 1 , the distance D between the first opening 23 and the closed end of the transmission body 21 is ensured to be 0.4 to 0.6 times the target wavelength, and the medium layer 12 and the transmission body 21 are perpendicular to each other, so that the distance between the signal coupling structure 13 and the closed end of the transmission body 21 is 0.4 to 0.6 times the target wavelength.

[0073] As an example, taking the requirement of 76-77GHz radar as an example, in order to realize wider bandwidth microstrip line waveguide conversion, for example, to realize 61-98GHz bandwidth microstrip line waveguide conversion, the center frequency of the microstrip line assembly 1 is determined to be 80GHz, the target wavelength is 3.75mm, and the length of the two metal pieces 131 is selected to be 0.25 times the target wavelength, that is, 0.94mm, and the S(S Parameter plot 1) parameter plot is obtained through the HFSSDesign16 simulation software, as shown in Figure 5 , wherein the red curve is the radio frequency signal return loss curve, and the purple curve is the radio frequency signal loss curve. When the microstrip line waveguide conversion structure in this embodiment is used for microstrip line waveguide conversion, the radio frequency signal return loss is less than-20dB within the 61-98GHz bandwidth, for example, m9 and m10 in the figure, and the radio frequency signal loss is also close to 0dB, for example, m11 and m12 in the figure.

[0074] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A microstrip line assembly, characterized by The microstrip transmission line, the dielectric layer and the signal coupling structure are included. The microstrip transmission line is arranged on the dielectric layer. The signal coupling structure is arranged on the output end of the microstrip transmission line, and is used for coupling the microstrip transmission line and the waveguide assembly. The signal coupling structure includes two metal pieces arranged in cross; the intersection of the two metal pieces is connected with the output end of the microstrip transmission line; and the first included angle between the two metal pieces is connected with the output end of the microstrip transmission line.

2. The microstrip line assembly of claim 1, wherein, The microstrip line assembly further includes a metal ground. The microstrip transmission line is arranged on the front surface of the dielectric layer, and the metal ground is arranged on the back surface of the dielectric layer.

3. The microstrip line assembly of claim 1, wherein, The microstrip transmission line includes at least two impedance transformation structures arranged in sequence along the signal transmission direction, and the widths of the at least two impedance transformation structures are sequentially reduced.

4. The microstrip line assembly of claim 1, wherein, The two metal pieces are in the same shape, and the metal pieces are in the shape of strips.

5. The microstrip line assembly of claim 1, wherein, The first included angle between the two metal pieces ranges from 80 to 100 degrees.

6. The microstrip line assembly of claim 1, wherein, The lengths of the two metal pieces are the same.

7. The microstrip line assembly of claim 6, wherein, The length of the metal piece is 0.15 to 0.35 times of a target wavelength, and the target wavelength is determined based on the center frequency of the microstrip line assembly.

8. A microstrip line waveguide transition structure, characterized by The waveguide assembly and the microstrip line assembly as claimed in any one of claims 1 to 7 are included. The waveguide assembly includes a transmission body and a waveguide cavity arranged in the transmission body. The signal coupling structure of the microstrip line assembly is arranged in the waveguide cavity.

9. The microstrip-to-waveguide transition structure of claim 8, wherein, The transmission body is provided with a first opening communicating with the waveguide cavity, and the signal coupling structure is embedded into the waveguide cavity through the first opening.

10. The microstrip waveguide transition structure of claim 8, wherein, The distance between the signal coupling structure and the closed end of the transmission body is 0.4 to 0.6 times of a target wavelength, and the target wavelength is determined based on the center frequency of the microstrip line assembly.

11. An electronic device, comprising: The microstrip line, the waveguide and the microstrip line waveguide conversion structure as claimed in any one of claims 8 to 10 are included. The microstrip line waveguide conversion structure is connected with the microstrip line and the waveguide.

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