An embedded infrared receiving integrated module and infrared receiving system

Abstract

The invention discloses an embedded infrared receiving integrated module and an infrared receiving system, comprising an integrated receiving head IRM and a peripheral circuit structure, wherein the receiving head IRM comprises a receiving head chip C31, and is provided with a Vcc terminal L1, a ground terminal L3 and an output terminal L4 in sequence; wherein a vacant terminal L2 is provided between the Vcc terminal L1 and the ground terminal L3; the peripheral circuit structure comprises a first capacitor P21 connected in parallel between the vacant terminal L2 and the ground terminal L3, a second resistor P22 connected in series between the Vcc terminal L1 and the vacant terminal L2, and a second capacitor P23 connected in parallel between the ground terminal L3 and the output terminal L4; the modules are integrated into one module and combined with a simplified peripheral circuit design to realize an integrated structure, effectively reduce circuit complexity, reduce manufacturing and assembly difficulty, and reduce production cost; in addition, by reasonably configuring capacitor and resistor elements, power supply ripple interference and signal interference are effectively reduced, and the reliability and performance of the entire module are improved.

Description

Technical Field

[0001] The present invention relates to the field of infrared receiving technology, and in particular to an embedded infrared receiving integrated module and an infrared receiving system. Background Art

[0002] With the popularity of electronic products, infrared technology has been widely used in home appliances such as remote controls, televisions, air conditioners, set-top boxes, and projectors. As the core component of these devices, the performance of infrared receiving modules directly affects the response speed of the devices and user experience. Traditional infrared receiving modules are usually composed of multiple independent components and chips, which are connected together through complex peripheral circuits to achieve functions such as receiving, amplifying, and decoding infrared signals.

[0003] Existing infrared receiving modules usually include an infrared receiving head, an amplifier, a filtering circuit and a decoding circuit. These components usually adopt a separate design, and the various parts are connected together through multiple resistors, capacitors and connecting wires. For example, the infrared receiving head usually includes an infrared receiving diode and an independent decoding chip. These components perform signal processing and decoding through peripheral circuits. However, this design method has the following disadvantages: since a large number of discrete components and connecting wires are required, the overall circuit design is complicated, which increases the difficulty of manufacturing and assembly. The use of discrete components increases material costs and production costs. In addition, due to the large number of connecting wires between components, it is susceptible to external electromagnetic interference, which affects the stability of the signal and the reception effect.

[0004] In view of this, it is necessary to improve the structure of the infrared receiving module in the prior art to solve the technical problem of complex and high cost of discrete component wiring. Summary of the invention

[0005] The purpose of the present invention is to provide an embedded infrared receiving integrated module and an infrared receiving system to solve the above technical problems.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] An embedded infrared receiving integrated module, comprising an integrated receiving head IRM and a peripheral circuit structure, wherein the receiving head IRM comprises a receiving head chip C31 for decoding electrical signals;

[0008] The receiving head IRM is provided with a Vcc terminal L1 for providing power, a ground terminal L3 for providing grounding, and an output terminal L4 for outputting a decoded signal in sequence; wherein an empty terminal L2 is provided between the Vcc terminal L1 and the ground terminal L3;

[0009] The receiving head chip C31 and the Vcc terminal L1, the vacant terminal L2, the ground terminal L3 and the output terminal L4 are respectively connected by gold wires;

[0010] The peripheral circuit structure comprises:

[0011] A first capacitor P21, connected in parallel between the vacant terminal L2 and the ground terminal L3, for reducing power ripple interference;

[0012] A second resistor P22, which is connected in series between the Vcc terminal L1 and the vacant terminal L2, for filtering and further reducing power supply interference;

[0013] The second capacitor P23 is connected in parallel between the ground terminal L3 and the output terminal L4 and is used to adjust the rise and fall time of the output signal.

[0014] Optionally, the receiving head IRM further includes an infrared receiving diode C32 for converting infrared light signals into electrical signals;

[0015] The infrared receiving diode C32 is connected to the receiving head chip C31 via a gold wire.

[0016] Optionally, the receiving head chip C31 has a Vcc Pad pin, a Vout Pad pin, a GND Pad pin and an InPad pin;

[0017] The gold wire comprises:

[0018] A first gold wire W61, used to connect the Vcc Pad pin of the receiving head chip C31 and the vacant terminal L2;

[0019] A second gold wire W62, used to connect the Vout Pad pin of the receiving head chip C31 and the output terminal L4;

[0020] A third gold wire W63 is used to connect the GND Pad pin of the receiving head chip C31 and the ground terminal L3;

[0021] The fourth gold wire W64 is used to connect the In Pad pin of the receiving head chip C31 and the infrared receiving diode C32.

[0022] Optionally, the receiving head IRM includes a receiving head body, and the receiving head chip C31 and the infrared receiving diode C32 are arranged on one end surface of the receiving head body;

[0023] The receiving head body is provided with a folding portion M50, and the folding portion M50 is connected to an inner shielding cover I41. The area of ​​the inner shielding cover I41 matches the receiving head body and is used to cover the receiving head chip C31 and the infrared receiving diode C32 to shield external interference.

[0024] Optionally, the receiving head IRM further includes an outer shell M51, and the outer shell M51 covers the inner shielding cover; wherein, an installation space is provided in the outer shell M51, and the receiving head body is installed in the installation space.

[0025] Optionally, the outer shell M51 is a shell made of epoxy resin material, and the outer shell M51 blocks external interference with a wavelength of 300nm to 840nm, and receives normal signals with a wavelength of 840nm to 1100nm.

[0026] Optionally, the capacitance range of the first capacitor P21 is 1 μF to 470 μF, and the capacitance range of the second capacitor P23 is 0.1 nF to 4.7 nF.

[0027] Optionally, the resistance of the second resistor P22 is 47-470KΩ.

[0028] The present invention also provides an infrared receiving system, comprising the embedded infrared receiving integrated module as described above.

[0029] Optionally, the infrared receiving system further includes a mainboard MCU, and the output terminal L4 is connected to the mainboard MCU; and the mainboard MCU is also connected to a power supply terminal and a ground terminal.

[0030] Compared with the prior art, the present invention has the following beneficial effects: the receiving head chip C31 receives the infrared signal and converts it into an electrical signal, the power supply is provided through the Vcc terminal L1, the ground line is connected through the ground line terminal L3, and the decoded signal is transmitted through the output terminal L4; the vacant terminal L2 is used to connect the first capacitor P21, which is connected in parallel between the vacant terminal and the ground line terminal to reduce the power ripple interference; the second resistor P22 is connected in series between the Vcc terminal and the vacant terminal to play a filtering role and further reduce the power supply interference; the second capacitor P23 is connected in parallel between the ground line terminal and the output terminal to adjust the rise and fall time of the output signal, and through the reasonable configuration of these circuit elements, the stable reception and processing of the infrared signal is realized, and the receiving head IRM and the peripheral circuit structure are integrated into a module, and combined with the simplified peripheral circuit design, an integrated structure is realized, which effectively reduces the circuit complexity, reduces the difficulty of manufacturing and assembly, and reduces the production cost; in addition, through the reasonable configuration of capacitors and resistors, the power ripple interference and signal interference are effectively reduced, the signal stability and receiving effect are enhanced, thereby improving the reliability and performance of the entire module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0032] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0033] Figure 1 This is a circuit diagram of an embedded infrared receiving integrated module of the first embodiment;

[0034] Figure 2 This is a schematic diagram of the structure of the receiving head of the embedded infrared receiving integrated module of the first embodiment;

[0035] Figure 3 This is a schematic diagram of the connection circuit between the embedded infrared receiving integrated module and the mainboard MCU of the infrared receiving system of the second embodiment. DETAILED DESCRIPTION

[0036] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0038] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] Embodiment 1:

[0040] Combination Figure 1 to Figure 2 As shown, an embodiment of the present invention provides an embedded infrared receiving integrated module, including an integrated receiving head IRM and a peripheral circuit structure. The receiving head IRM includes a receiving head chip C31 for decoding electrical signals; this is the core component of the entire infrared receiving module and determines the efficiency and accuracy of signal processing.

[0041] The receiving head IRM is provided with a Vcc terminal L1, a vacant terminal L2, a ground terminal L3 and an output terminal L4 in sequence.

[0042] Vcc terminal L1: used to provide power to ensure that the receiving head chip C31 can work normally.

[0043] Ground terminal L3: Provides grounding to ensure the stability and safety of the circuit.

[0044] Output terminal L4: used to output the decoded electrical signal for use by subsequent circuits.

[0045] Unoccupied terminal L2: used to connect the first capacitor P21 and the second resistor P22, to filter and reduce power supply interference.

[0046] The receiving head chip C31 and the Vcc terminal L1, the vacant terminal L2, the ground terminal L3 and the output terminal L4 are respectively connected by gold wires; the gold wires connect the receiving head chip C31 to each terminal to ensure the reliability of signal transmission and a low impedance path.

[0047] The peripheral circuit structure includes:

[0048] The first capacitor P21 is connected in parallel between the vacant terminal L2 and the ground terminal L3 to reduce power ripple interference, effectively filter out high-frequency interference signals, ensure the purity of the power supply, and improve the signal processing stability of the receiving head.

[0049] The second resistor P22 is connected in series between the Vcc terminal L1 and the vacant terminal L2, and is used for filtering and further reducing power supply interference; it forms an RC filtering circuit together with the capacitor P21 to further reduce power supply noise and improve the anti-interference ability of the system.

[0050] The second capacitor P23 is connected in parallel between the ground terminal L3 and the output terminal L4, and is used to adjust the rise and fall time of the output signal, prevent signal overshoot and ringing, ensure the smoothness and stability of the output signal, and improve the integrity and reliability of the signal.

[0051] The working principle of the present invention is as follows: the receiving head chip C31 receives the infrared signal and converts it into an electrical signal, the power supply is provided through the Vcc terminal L1, the ground line is connected through the ground line terminal L3, and the decoded signal is transmitted through the output terminal L4; the vacant terminal L2 is used to connect the first capacitor P21, which is connected in parallel between the vacant terminal and the ground line terminal to reduce the power ripple interference; the second resistor P22 is connected in series between the Vcc terminal and the vacant terminal to play a filtering role and further reduce the power supply interference; the second capacitor P23 is connected in parallel between the ground line terminal and the output terminal to adjust the rise and fall time of the output signal. Through the reasonable configuration of these circuit elements, the stable reception and processing of the infrared signal is realized, and the receiving head IRM and the peripheral circuit structure are integrated into a module, and combined with the simplified peripheral circuit design, an integrated structure is realized, which effectively reduces the circuit complexity, reduces the difficulty of manufacturing and assembly, and reduces the production cost; in addition, through the reasonable configuration of capacitors and resistors, the power ripple interference and signal interference are effectively reduced, the signal stability and receiving effect are enhanced, thereby improving the reliability and performance of the entire module.

[0052] In this embodiment, the receiving head IRM further includes an infrared receiving diode C32 for converting infrared light signals into electrical signals; wherein the infrared receiving diode C32 is connected to the receiving head chip C31 via a gold wire. As the front end of the infrared receiving head, the performance of the infrared receiving diode C32 directly affects the reception quality of the infrared signal.

[0053] When working, the infrared receiving diode C32 receives the infrared light signal and converts it into an electrical signal, which is transmitted to the In Pad pin of the receiving head chip C31 through the fourth gold wire W64. The receiving head chip C31 then amplifies, detects, restores the waveform and decodes the electrical signal.

[0054] In this embodiment, it is specifically explained that the receiving head chip C31 has a Vcc Pad pin, a Vout Pad pin, a GND Pad pin and an In Pad pin;

[0055] Gold wire includes:

[0056] A first gold wire W61 is used to connect the Vcc Pad pin of the receiving head chip C31 and the vacant terminal L2;

[0057] A second gold wire W62 is used to connect the Vout Pad pin of the receiving head chip C31 and the output terminal L4;

[0058] The third gold wire W63 is used to connect the GND Pad pin of the receiving head chip C31 and the ground terminal L3;

[0059] The fourth gold wire W64 is used to connect the In Pad pin of the receiving head chip C31 and the infrared receiving diode C32.

[0060] During operation, power is transmitted from the Vcc terminal L1 to the Vcc Pad pin of the receiving head chip C31 through the first gold wire W61; the decoded signal is transmitted from another Vout Pad pin of the receiving head chip C31 to the output terminal L4 through the second gold wire W62 for use by subsequent circuits.

[0061] The ground is connected from the ground terminal L3 to a Vout Pad pin of the receiving head chip C31 through a third gold wire W63 to ensure the stability and safety of the circuit.

[0062] The beneficial effects are:

[0063] 1. By integrating the infrared receiving diode C32 and the receiving head chip C31, efficient reception and processing of infrared signals are achieved, ensuring the accuracy and reliability of the signals.

[0064] 2. Gold wire is used to connect each pin, which reduces complex circuit wiring, reduces the difficulty of manufacturing and assembly, and simplifies circuit design.

[0065] 3. The gold wire connection method ensures a low impedance path, reduces signal loss and interference, and improves the stability of signal transmission and the reliability of the overall module.

[0066] 4. The integrated design reduces the use of discrete components, reduces material and production costs, and improves economic benefits.

[0067] In this embodiment, the receiving head IRM includes a receiving head body, a receiving head chip C31 and an infrared receiving diode C32 are arranged on one end surface of the receiving head body; the receiving head body is provided with a folding portion M50, and the folding portion M50 is connected to an inner shielding cover I41, the area of ​​the inner shielding cover I41 matches the receiving head body, and is used to cover the receiving head chip C31 and the infrared receiving diode C32, and is used to shield external interference. It provides an additional electromagnetic interference shielding effect and improves the anti-interference ability of the receiving head.

[0068] In this embodiment, the receiving head IRM further includes an outer shell M51, and the outer shell M51 is covered by the inner shielding cover; wherein, an installation space is provided in the outer shell M51, and the receiving head body is installed in the installation space.

[0069] It should be noted that the outer shell M51 covers the inner shielding cover, providing an additional layer of protection to further reduce the impact of external interference on the receiving head IRM. The double protection of the outer shell M51 significantly reduces the impact of ambient light and electromagnetic interference on the infrared receiving head IRM, improving the stability and reliability of signal reception.

[0070] In this embodiment, the outer shell M51 is a shell made of epoxy resin material, and the outer shell M51 is used to block interference light of non-infrared wavelengths and receive light in the infrared wavelength range, wherein the infrared wavelength range is 700~1000nm.

[0071] It should be noted that epoxy resin material has excellent mechanical strength and chemical corrosion resistance, and can effectively protect internal components; in addition, the molding process of epoxy resin is relatively simple, and can achieve high-precision shell manufacturing, ensuring the structural stability and consistency of the receiving head IRM.

[0072] The reason for blocking non-infrared wavelength interference light: Block external interference. This range of light mainly includes ultraviolet light and some visible light, which may interfere with the infrared receiving head. By blocking these wavelengths, the interference of ambient light on the received signal can be effectively reduced.

[0073] Receive normal signals of light in the infrared wavelength range: Infrared remote controls and most infrared communication devices operate within this wavelength range, ensuring that the receiving head IRM can effectively receive and process the required infrared signals.

[0074] To sum up, this embodiment effectively improves the anti-interference ability and signal reception quality of the infrared receiving head IRM by introducing the outer shell M51, especially the outer shell M51 made of epoxy resin, and setting a specific blocking wavelength range, while providing good physical protection and structural stability.

[0075] In this embodiment, the capacitance range of the first capacitor P21 is 1μF~470μF, and the first capacitor P21 is connected in parallel between the vacant terminal L2 and the ground terminal L3 to reduce power ripple interference. The capacitance value range of 1μF~470μF can provide sufficient charge reserve and filtering capability, effectively filter out high-frequency noise and ripple in the power supply, and ensure the power supply stability of the receiving head chip C31 when working.

[0076] The capacitance range of the second capacitor P23 is 0.1nF~4.7nF. The second capacitor P23 is used to be connected in parallel between the ground terminal L3 and the output terminal L4 to adjust the rise and fall time of the output signal. The capacitance value range of 0.1nF~4.7nF can effectively control the rate of change of the output signal, prevent signal overshoot and ringing, ensure the smoothness and stability of the output signal, and improve the quality of signal transmission.

[0077] In this embodiment, the resistance of the second resistor P22 is preferably 47-470KΩ. The second resistor P22 is connected in series between the Vcc terminal L1 and the vacant terminal L2 for filtering and further reducing power supply interference. The resistance of 10KΩ can form an appropriate impedance in the power supply line, and together with the first capacitor P21, form an effective RC filter circuit, further reduce power supply noise and interference, and improve the power supply stability of the receiving head IRM.

[0078] It should be noted that the values ​​of capacitors and resistors are designed as follows:

[0079] The larger capacitance range (1 μF to 470 μF) of the first capacitor P21 ensures effective filtering in a wide frequency range, adapts to the requirements of different power supply ripple characteristics, and enhances the stability of the power supply.

[0080] The smaller capacitance range (0.1nF~4.7nF) of the second capacitor P23 focuses on controlling the rise and fall time of the high-frequency signal, optimizing the quality of signal transmission and preventing high-frequency interference.

[0081] The 47-470Ω resistance of the second resistor P22 cooperates with the value of the first capacitor P21 to form an efficient RC filter circuit, effectively suppressing power supply noise, ensuring the purity of the power supply, and improving the overall performance of the receiving head.

[0082] Embodiment 2:

[0083] Combination Figure 3As shown, the present invention also provides an infrared receiving system, including the embedded infrared receiving integrated module as in the first embodiment.

[0084] In this embodiment, the infrared receiving system also includes a mainboard MCU, and the output terminal L4 is connected to the mainboard MCU; and the mainboard MCU is also connected to the power supply terminal and the ground terminal, wherein preferably, the mainboard MCU is a Micom chip.

[0085] Preferably, the infrared receiving system includes the embedded infrared receiving integrated module in the first embodiment, and further includes a mainboard MCU. The design purpose of the system is to realize the integration of the embedded infrared receiving module and the mainboard MCU, and provide an efficient, stable and highly integrated infrared receiving system, which not only simplifies the circuit design and manufacturing process, reduces the cost, but also significantly improves the stability of signal reception and the reliability of the system, and is suitable for various electronic equipment applications that require infrared signal reception.

[0086] When working, the embedded infrared receiving integrated module receives infrared signals and converts them into electrical signals, which are decoded and processed by the receiving head chip C31 and finally transmitted to the mainboard MCU through the output terminal L4. The mainboard MCU receives the decoded signal from the embedded infrared receiving module and performs further data processing and instruction execution.

[0087] The embedded infrared receiver integrated module obtains power supply and grounding support through the Vcc terminal L1 and the ground terminal L3 to ensure the normal operation of the module. The mainboard MCU is connected to the power supply through its power terminal and ground terminal to ensure the overall power stability of the system and the accuracy of signal processing.

[0088] The beneficial effects are:

[0089] 1. High integration and simplified design: By integrating the embedded infrared receiver integrated module with the mainboard MCU, external connection lines and discrete components are reduced, the system design is simplified, and the overall integration of the system is improved. This design helps to reduce circuit board space and manufacturing costs, and is suitable for the application of miniaturized electronic devices.

[0090] 2. Enhanced signal stability: The reasonable capacitor and resistor configuration of the embedded infrared receiving integrated module effectively suppresses power ripple and signal interference, ensuring high-quality signal reception and processing. The mainboard MCU directly receives and processes the decoded signal, reducing the intermediate links and further improving the signal stability and response speed.

[0091] 3. Improved system reliability and performance: The inner shielding cover design and the outer shell M51 material selection of the embedded infrared receiving integrated module provide excellent physical and electromagnetic shielding effects and enhance the anti-interference ability of the system. The close integration of the mainboard MCU and the embedded module ensures the reliability and stability of the overall system performance, which is suitable for the infrared signal reception needs of a variety of electronic devices.

[0092] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An embedded infrared receiving integrated module, characterized in that: It comprises an integrated receiving head (IRM) and a peripheral circuit structure, wherein the receiving head (IRM) comprises a receiving head chip (C31) for decoding electrical signals; The receiving head (IRM) is provided with a Vcc terminal (L1) for providing power, a ground terminal (L3) for providing grounding, and an output terminal (L4) for outputting a decoded signal in sequence; wherein a vacant terminal (L2) is provided between the Vcc terminal (L1) and the ground terminal (L3); The receiving head chip (C31) and the Vcc terminal (L1), the vacant terminal (L2), the ground terminal (L3) and the output terminal (L4) are respectively connected via gold wires; The peripheral circuit structure comprises: A first capacitor (P21) connected in parallel between the idle terminal (L2) and the ground terminal (L3) for reducing power supply ripple interference; A second resistor (P22) connected in series between the Vcc terminal (L1) and the idle terminal (L2) for filtering and further reducing power supply interference; a second capacitor (P23), connected in parallel between the ground terminal (L3) and the output terminal (L4), for adjusting the rise and fall time of the output signal; The receiving head (IRM) further comprises an infrared receiving diode (C32) for converting infrared light signals into electrical signals; Wherein, the infrared receiving diode (C32) and the receiving head chip (C31) are connected via a gold wire; The receiving head (IRM) comprises a receiving head body, and the receiving head chip (C31) and the infrared receiving diode (C32) are arranged on an end surface of the receiving head body; The receiving head body is provided with a folding portion (M50), the folding portion (M50) is connected to an inner shielding cover (I41), the area of ​​the inner shielding cover (I41) matches that of the receiving head body, and is used to cover the receiving head chip (C31) and the infrared receiving diode (C32) to shield external interference; The receiving head (IRM) further comprises an outer shell (M51), wherein the outer shell (M51) covers the inner shielding cover (I41); wherein an installation space is provided in the outer shell (M51), and the receiving head body is installed in the installation space; The outer shell (M51) is a shell made of epoxy resin material, and the outer shell (M51) is used to block interference light of non-infrared wavelengths and receive light in the infrared wavelength range; The receiving head chip (C31) has a Vcc Pad pin, a Vout Pad pin, a GND Pad pin and an In Pad pin; The gold wire comprises: A first gold wire (W61) is used to connect the Vcc Pad pin of the receiving head chip (C31) and the vacant terminal (L2); A second gold wire (W62) is used to connect the Vout Pad pin of the receiving head chip (C31) and the output terminal (L4); A third gold wire (W63) is used to connect the GND Pad pin of the receiving head chip (C31) and the ground terminal (L3); A fourth gold wire (W64), used to connect the In Pad pin of the receiving head chip (C31) and the infrared receiving diode (C32); The capacitance range of the first capacitor (P21) is 1 μF to 470 μF, and the capacitance range of the second capacitor (P23) is 0.1 nF to 4.7 nF; The resistance of the second resistor (P22) is 47-470Ω.

2. An infrared receiving system, characterized in that: It comprises the embedded infrared receiving integrated module as claimed in claim 1.

3. The infrared receiving system according to claim 2, characterized in that: The infrared receiving system further comprises a mainboard MCU, the output terminal (L4) is connected to the mainboard MCU; and the mainboard MCU is also connected to a power supply terminal and a ground terminal.

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