High temperature and high pressure acoustic wave acoustic emission sensor and detection method

Abstract

High temperature and high pressure acoustic wave acoustic emission sensor and detection method, related to the field of acoustic wave emission technology. High temperature and high pressure acoustic wave acoustic emission sensor includes a pressure sensor housing, two metal coupling plates connected to the pressure sensor housing, and a PET-based external thermal insulation film wrapped around the pressure sensor housing and the metal coupling plates. The pressure sensor housing and the metal coupling plates enclose a receiving cavity. The two metal coupling plates are respectively connected to temperature calibration piezoelectric ceramics and test piezoelectric ceramics. A signal amplifier and two thermoelectric cooling plates with cooling surfaces attached to the temperature calibration piezoelectric ceramics and the test piezoelectric ceramics are arranged in the receiving cavity. The signal amplifier is electrically connected to the two metal coupling plates, the temperature calibration piezoelectric ceramics and the test piezoelectric ceramics. The pressure sensor housing is connected to a three-core cable connector electrically connected to the signal amplifier and the two thermoelectric cooling plates. High temperature and high pressure acoustic wave acoustic emission sensor and detection method can reduce the detection temperature and realize the decoupling of the temperature effect value and the acoustic emission signal to improve the detection accuracy.

Description

Technical Field

[0001] The present application relates to the field of acoustic wave emission technology, and in particular to a high-temperature and high-pressure acoustic wave acoustic emission sensor and a detection method. Background Art

[0002] Acoustic emission monitoring during rock fracture is an important means to identify crack locations and evaluate rock statistical parameter characteristics. Acoustic emission test results play an important role in improving the monitoring of sudden rock bursts during deep tunnel excavation and realizing advance prediction of engineering geological disasters. However, the high temperature and high pressure (pore pressure and confining pressure) conditions in deep strata make acoustic emission detection extremely difficult, which seriously affects the role of geophysical methods in rock disaster prediction.

[0003] At present, the core component of high-temperature and high-pressure acoustic wave acoustic emission sensors, piezoelectric ceramics, is a piezoelectric material that is extremely sensitive to temperature. The test error caused by temperature changes after exceeding the applicable environment is much larger than the fluctuation range of the test value. Therefore, the existing acoustic wave acoustic emission integrated probe is mainly suitable for normal temperature environment; when used in high temperature environment, some scholars use rigid waveguide rods to reduce the probe ambient temperature by extending the distance between the heat source and the probe to improve the prediction accuracy. However, the waveguide rod cannot withstand shearing during use, and should not contact other sources that can generate sudden signals to avoid the monitoring results being affected by the coupling of waves in multiple directions. In other words, the waveguide rod is suitable for the rigid loading surface of rock, the shear interface or loading surface of rock shear test, but cannot be used for testing in the triaxial confining pressure direction of rock and testing in the broken rock body at the engineering site. In addition, the applicable temperature range of piezoelectric ceramics can be slightly increased by modifying piezoelectric ceramics, but the results obtained are actually still the superposition value of the rock fracture acoustic emission signal and the temperature effect signal.

[0004] Therefore, a high-temperature and high-pressure acoustic wave acoustic emission sensor and detection method are needed to solve the problem of acoustic wave acoustic emission detection in high-temperature and high-pressure environments. Summary of the invention

[0005] The purpose of the present application is to provide a high-temperature and high-pressure acoustic wave acoustic emission sensor and detection method, which can actively reduce the ambient temperature of the piezoelectric ceramic, and adopt dual piezoelectric ceramics that take into account the influence of signal time difference, so as to realize the determination of the temperature effect value of the acoustic wave acoustic emission signal under the same temperature environment and the decoupling of the real burst acoustic wave acoustic emission signal, thereby improving the detection accuracy under high-temperature and high-pressure environment.

[0006] This application is implemented as follows:

[0007] The present application provides a high-temperature and high-pressure acoustic wave acoustic emission sensor, which includes a pressure-resistant sensor housing, two metal coupling sheets respectively connected to the pressure-resistant sensor housing, and a PET-based external thermal insulation film wrapping the pressure-resistant sensor housing and the two metal coupling sheets. The pressure-resistant sensor housing and the two metal coupling sheets enclose a receiving cavity, and the two metal coupling sheets are respectively connected to a temperature calibration piezoelectric ceramic and a test piezoelectric ceramic located in the receiving cavity through a high-temperature resistant coupling adhesive layer. A signal amplifier and two thermoelectric cooling sheets whose cooling surfaces are respectively attached to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are provided in the receiving cavity. The A pole of the signal amplifier is respectively electrically connected to the two metal coupling sheets, and the B pole of the signal amplifier is respectively electrically connected to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic. The pressure-resistant sensor housing is connected to a three-core cable connector that runs through the receiving cavity, and the three-core cable connector is respectively electrically connected to the A pole and the B pole of the signal amplifier and the two thermoelectric cooling sheets.

[0008] In some optional embodiments, the receiving cavity is filled with an aerogel layer.

[0009] In some optional embodiments, the inner wall of the pressure-resistant sensor housing is provided with a PET-based inner thermal insulation film.

[0010] In some optional embodiments, the temperature calibration piezoelectric ceramic and / or the test piezoelectric ceramic are prepared by the following method:

[0011] Bismuth oxide, iron oxide, barium carbonate, titanium dioxide and rare earth oxide are mixed and added with anhydrous ethanol as a solvent for ball milling to obtain a mixed raw material powder;

[0012] pre-sintering the mixed raw material powder to obtain a pre-sintered block;

[0013] Grind the pre-sintered block evenly, add polyvinyl alcohol and stir evenly to obtain a mixed raw material colloid;

[0014] The mixed raw material colloid is pressed into a disc and sintered at high temperature to obtain a ceramic body;

[0015] After cleaning, grinding and polishing, the ceramic body is subjected to polarization treatment by applying an electric field in silicone oil.

[0016] In some optional embodiments, the dosage ratio of bismuth oxide, iron oxide, barium carbonate, titanium dioxide, rare earth oxide and anhydrous ethanol in the mixed raw material powder is: 20-30g: 5-10g: 10-15g: 5-10g: 0.01-0.1g: 50-100mL.

[0017] In some optional embodiments, the pre-sintering temperature is 600-800° C., and the pre-sintering time is 4-8 hours.

[0018] In some optional embodiments, every 35-50 g of the pre-sintered block is ground evenly, and 5-10 mL of polyvinyl alcohol is added and mixed evenly.

[0019] In some optional embodiments, the high temperature sintering temperature is 950-1150° C., and the sintering time is 2-4 hours.

[0020] In some optional embodiments, the electric field strength of the electric field applied for polarization treatment is 10-40 kV / cm, and the polarization treatment time is 30-60 min.

[0021] The present application also provides a detection method for the above-mentioned high temperature and high pressure acoustic wave acoustic emission sensor, which comprises the following steps:

[0022] Connect the three-core cable connector of the high-temperature and high-pressure acoustic wave acoustic emission sensor to the data acquisition instrument;

[0023] The metal coupling piece connected to the test piezoelectric ceramic of the high temperature and high pressure acoustic wave acoustic emission sensor is pasted on the metal plate by means of high temperature resistant coupling glue;

[0024] Determine the initial readings of the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic and record them as T 0t ( t 0, m v0 )、 S 0t ( t 0, S v0 );

[0025] The pencil lead is pressed against the metal plate and broken. The distance between the broken part of the pencil lead and the metal coupling piece connected to the tested piezoelectric ceramic is i. The temperature readings of the calibrated piezoelectric ceramic and the tested piezoelectric ceramic at the beginning of breaking and at a specific time thereafter are recorded and recorded as T respectively. it (t i ,m vi )、S jt (t j ,S vj );

[0026] Use the following formula to calculate the temperature of the calibration piezoelectric ceramic and the test piezoelectric ceramic for the same burst signal k Time difference:

[0027] ;

[0028] Where: For temperature calibration of piezoelectric ceramics and testing of piezoelectric ceramics for burst signals k The time difference, s; t ikFor temperature calibration of piezoelectric ceramics to burst signals k The response time is m vi - m v0 The earliest occurrence time of >0, s; t jk To test the piezoelectric ceramics for burst signals k The response time is S vi - S v0 The earliest occurrence time >0 hours;

[0029] Use the following formula to calculate the temperature calibration of the piezoelectric ceramic to the burst signal k The initial decay ratio S n :

[0030] ;

[0031] Where: S n The temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are used to calibrate the burst signal k The attenuation amplitude of S v(j+n)k for t jk + n ( n ≥0) the test piezoelectric ceramic reading, mv; m v(i+n)k for t ik + n ( n ≥0) when the temperature is used to calibrate the reading of the piezoelectric ceramic, mv;

[0032] After separating the high-temperature and high-pressure acoustic wave acoustic emission sensor from the metal plate, the metal coupling sheet corresponding to the test piezoelectric ceramic is pasted on the rock surface through a high-temperature resistant coupling adhesive;

[0033] The rock is treated with high temperature and high pressure, and the temperature calibration piezoelectric ceramic and test piezoelectric ceramic readings are recorded during the treatment process and recorded as T i ( t , m i )、 S j ( t , S j ); The following formula is used to jointly solve the rock fracture acoustic wave signal value x and temperature effect value R T:

[0034] ;

[0035] Where: x for t Always test the rock fracture acoustic wave signal value of piezoelectric ceramics; R T for t Calibrate the piezoelectric ceramics at the same time and test the temperature effect value of the piezoelectric ceramics; S j for t Always test the piezoelectric ceramic readings; S n For temperature calibration of piezoelectric ceramics to burst signals k The initial attenuation ratio of m i for t + Calibrate the piezoelectric ceramic readings at the temperature at all times.

[0036] The beneficial effects of the present application are as follows: the high-temperature and high-pressure acoustic wave acoustic emission sensor provided by the present application includes a pressure-resistant sensor housing, two metal coupling plates respectively connected to the pressure-resistant sensor housing, and a PET-based external thermal insulation film wrapping the pressure-resistant sensor housing and the two metal coupling plates. The pressure-resistant sensor housing and the two metal coupling plates enclose a receiving cavity. The two metal coupling plates are respectively connected to a temperature calibration piezoelectric ceramic and a test piezoelectric ceramic located in the receiving cavity through a high-temperature resistant coupling adhesive layer. A signal amplifier and two thermoelectric cooling plates whose cooling surfaces are respectively bonded to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are provided in the receiving cavity. The A pole of the signal amplifier is respectively electrically connected to the two metal coupling plates, and the B pole of the signal amplifier is respectively electrically connected to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic. The pressure-resistant sensor housing is connected to a three-core cable connector that runs through the receiving cavity, and the three-core cable connector is respectively electrically connected to the A pole and B pole of the signal amplifier and the two thermoelectric cooling plates. The high-temperature and high-pressure acoustic wave acoustic emission sensor and detection method provided in the present application can actively reduce the ambient temperature of the piezoelectric ceramics, and adopts dual piezoelectric ceramics that take into account the influence of signal time difference, which can realize the determination of the temperature effect value of the acoustic wave acoustic emission signal in the same temperature environment and the decoupling of the real burst acoustic wave acoustic emission signal, thereby improving the detection accuracy in the high-temperature and high-pressure environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 A schematic cross-sectional view of a high-temperature and high-pressure acoustic wave acoustic emission sensor provided in an embodiment of the present application;

[0039] Figure 2 This is a flow chart for preparing temperature calibration piezoelectric ceramics and test piezoelectric ceramics in the high-temperature and high-pressure acoustic wave acoustic emission sensor provided in an embodiment of the present application.

[0040] In the figure: 100, pressure sensor housing; 110, metal coupling plate; 120, accommodating cavity; 130, high temperature resistant coupling adhesive layer; 140, temperature calibration piezoelectric ceramics; 150, test piezoelectric ceramics; 160, signal amplifier; 170, thermoelectric cooling plate; 180, aerogel layer; 190, three-core cable connector; 200, PET-based outer insulation film; 210, PET-based inner insulation film; 220, enameled constantan wire. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0044] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0045] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0046] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] The features and performance of the high-temperature and high-pressure acoustic wave acoustic emission sensor and detection method of the present application are further described in detail below in conjunction with the embodiments.

[0049] like Figure 1As shown, the embodiment of the present application provides a high-temperature and high-pressure acoustic wave acoustic emission sensor, which includes a hollow cylindrical pressure sensor housing 100, two metal coupling sheets 110 respectively connected to the two ends of the pressure sensor housing 100, and a PET-based outer thermal insulation film 200 wrapping the pressure sensor housing 100 and the two metal coupling sheets 110. The inner walls of the pressure sensor housing 100 and the two metal coupling sheets 110 enclose a receiving cavity 120, and the inner wall of the pressure sensor housing 100 is provided with a PET-based inner thermal insulation film 210. The adjacent sides of the two metal coupling sheets 110 are respectively connected to a temperature calibration piezoelectric ceramic 140 and a test piezoelectric ceramic 150 located in the receiving cavity 120 through a high-temperature resistant coupling adhesive layer 130. A signal amplifier 160 and two thermoelectric cooling sheets 170 are also provided in the receiving cavity 120. The two thermoelectric cooling sheets 170 The cooling surfaces are respectively wrapped and attached to the outer walls of the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150. The A pole of the signal amplifier 160 is electrically connected to the inner wall edges of the two metal coupling plates 110 through the enameled constantan wire 220. The sides of the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 away from the corresponding metal coupling plates 110 are electrically connected to the B pole of the signal amplifier 160 through the enameled constantan wire 220. The outer wall of the pressure-resistant sensor housing 100 is connected to a three-core cable connector 190 that penetrates into the accommodating cavity 120. The three-core cable connector 190 is electrically connected to the A pole and B pole of the signal amplifier 160 and the power lines of the two thermoelectric cooling plates 170 through the enameled constantan wire 220. The accommodating cavity 120 is filled with an aerogel layer 180 that wraps the signal amplifier 160 and the two thermoelectric cooling plates 170.

[0050] Among them, optional, such as Figure 2 As shown, the temperature calibration piezoelectric ceramic 140 and / or the test piezoelectric ceramic 150 are prepared by the following method:

[0051] Step 1: Mix bismuth oxide, iron oxide, barium carbonate, titanium dioxide and rare earth oxide, add anhydrous ethanol as a solvent and ball mill to obtain a mixed raw material powder; optionally, the amount ratio of bismuth oxide, iron oxide, barium carbonate, titanium dioxide, rare earth oxide and anhydrous ethanol in the mixed raw material powder is: 20-30g: 5-10g: 10-15g: 5-10g: 0.01-0.1g: 50-100mL.

[0052] Step 2: pre-sinter the mixed raw material powder to obtain a pre-sintered block; optionally, the pre-sintering temperature is 600-800° C. and the pre-sintering time is 4-8 hours.

[0053] Step 3: Grind the pre-sintered block evenly, add polyvinyl alcohol and stir evenly to obtain a mixed raw material colloid; optionally, grind every 35-50g of the pre-sintered block evenly, add 5-10mL of polyvinyl alcohol and mix evenly.

[0054] Step 4: Press the mixed raw material colloid into discs and perform high-temperature sintering to obtain a ceramic body; optionally, the high-temperature sintering temperature is 950-1150° C. and the sintering time is 2-4 hours.

[0055] Step 5: After cleaning, grinding and polishing the ceramic body, an electric field is applied in silicone oil for polarization treatment. Optionally, the electric field strength of the applied electric field for polarization treatment is 10-40 kV / cm, and the polarization treatment time is 30-60 minutes.

[0056] The present application also provides a detection method for the high temperature and high pressure acoustic wave acoustic emission sensor, which comprises the following steps:

[0057] Step 1: Connect the three-core cable connector 190 of the high-temperature and high-pressure acoustic wave acoustic emission sensor to the data acquisition instrument;

[0058] Step 2: Paste the metal coupling sheet 110 connected to the test piezoelectric ceramic 150 of the high-temperature and high-pressure acoustic wave acoustic emission sensor on the metal plate by using a high-temperature resistant coupling adhesive;

[0059] Step 3: Determine the initial readings of the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 and record them as T 0t ( t 0, m v0 )、 S 0t ( t 0, S v0 );

[0060] Step 4: Press the pencil lead against the metal plate and break it. The distance between the broken part of the pencil lead and the metal coupling piece 110 corresponding to the tested piezoelectric ceramic 150 is i. Record the temperature readings of the calibrated piezoelectric ceramic 140 and the tested piezoelectric ceramic 150 at the beginning of breaking and at a specific time thereafter, and record them as T it ( t i , m vi )、 S jt ( t j , S vj );

[0061] Step 5: Use the following formula to calculate the temperature of the calibrated piezoelectric ceramic 140 and the tested piezoelectric ceramic 150 for the same burst signal k Time difference:

[0062] ;

[0063] Where: For temperature calibration of piezoelectric ceramic 140 and testing of piezoelectric ceramic 150 for burst signal k The time difference, s; t ik 140 pairs of burst signals for temperature calibration of piezoelectric ceramics k The response time is m vi - m v0 The earliest occurrence time of >0, s; t jk 150 pairs of burst signals for testing piezoelectric ceramics k The response time is S vi - S v0 The earliest occurrence time >0 hours;

[0064] Step 6: Use the following formula to calculate the temperature calibration of the piezoelectric ceramic 140 pairs of burst signals k The initial decay ratio S n , the formula is:

[0065] ;

[0066] Where: S n For temperature calibration of piezoelectric ceramic 140 and testing of piezoelectric ceramic 150 for burst signal k The attenuation amplitude of S v(j+n)k for t jk + n ( n ≥0) The test piezoelectric ceramic 150 reading at the time, mv; m v(i+n)k for t ik + n ( n ≥0) when the temperature is calibrated to the reading of the piezoelectric ceramic 140, mv;

[0067] Step 7: After separating the high-temperature and high-pressure acoustic wave acoustic emission sensor from the metal plate, the metal coupling sheet 110 connected to the test piezoelectric ceramic 150 is pasted on the rock surface through a high-temperature resistant coupling adhesive;

[0068] Step 8: Treat the rock with high temperature and high pressure, and record the temperature readings of the calibrated piezoelectric ceramic 140 and the tested piezoelectric ceramic 150 during the treatment process as T i ( t, m i )、 S j ( t , S j ); The following formula is used to jointly solve the rock fracture acoustic wave signal value x and temperature effect value R T :

[0069] ;

[0070] Where: x for t Constantly testing the rock fracture acoustic wave signal value of the piezoelectric ceramic 150; R T for t Calibrate the piezoelectric ceramic 140 and test the temperature effect value of the piezoelectric ceramic 150 at the same time; S j for t Always test the reading of the piezoelectric ceramic 150; S n 140 pairs of burst signals for temperature calibration of piezoelectric ceramics k The initial attenuation ratio of m i for t + The reading of the piezoelectric ceramic 140 is calibrated at the temperature at the time.

[0071] The high-temperature and high-pressure acoustic wave acoustic emission sensor and detection method provided in the embodiment of the present application encloses a pressure-resistant sensor housing 100 and two metal coupling sheets 110 to form a housing cavity 120 for accommodating piezoelectric ceramics, and wraps a high-temperature resistant PET-based outer insulation film 200 on the outer walls of the pressure-resistant sensor housing 100 and the two metal coupling sheets 110, and arranges a PET-based inner insulation film 210 on the inner wall of the pressure-resistant sensor housing 100, thereby increasing the temperature resistance range of the piezoelectric ceramic core component arranged in the housing cavity 120. At the same time, two cooling surfaces are arranged in the housing cavity 120 to respectively fit the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 with a thermoelectric cooling sheet 170, which can further actively cool the temperature. The temperature of the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 is cooled to effectively reduce the ambient temperature of the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150, and the high-temperature resistant temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 are prepared by special raw materials and preparation technology, which can effectively improve the detection accuracy of piezoelectric ceramics in high temperature and high pressure environments. Finally, by respectively setting the temperature calibration piezoelectric ceramic 140 and the test piezoelectric ceramic 150 electrically connected to the two metal coupling plates 110, the influence of the signal time difference can be considered, and the detection accuracy in the high temperature and high pressure environment can be achieved by determining the temperature effect value of the acoustic emission signal of the acoustic wave in the same temperature environment and decoupling the real burst acoustic emission signal.

[0072] The embodiments described above are part of the embodiments of the present application, rather than all of the embodiments. The detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

Claims

1. A detection method for a high temperature and high pressure acoustic wave acoustic emission sensor, characterized in that: The high-temperature and high-pressure acoustic wave acoustic emission sensor includes a pressure-resistant sensor housing, two metal coupling sheets respectively connected to the pressure-resistant sensor housing, and a PET-based external thermal insulation film wrapping the pressure-resistant sensor housing and the two metal coupling sheets. The pressure-resistant sensor housing and the two metal coupling sheets enclose a receiving cavity, and the two metal coupling sheets are respectively connected to a temperature calibration piezoelectric ceramic and a test piezoelectric ceramic located in the receiving cavity through a high-temperature resistant coupling adhesive layer. A signal amplifier and two thermoelectric cooling sheets with cooling surfaces respectively attached to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are provided in the receiving cavity. The A pole of the signal amplifier is respectively electrically connected to the two metal coupling sheets, and the B pole of the signal amplifier is respectively electrically connected to the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic. The pressure-resistant sensor housing is connected to a three-core cable connector that runs through the receiving cavity, and the three-core cable connector is respectively electrically connected to the A pole and the B pole of the signal amplifier and the two thermoelectric cooling sheets; The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor comprises the following steps: Connect the three-core cable connector of the high-temperature and high-pressure acoustic wave acoustic emission sensor to the data acquisition instrument; The metal coupling piece connected to the test piezoelectric ceramic of the high temperature and high pressure acoustic wave acoustic emission sensor is pasted on the metal plate by means of a high temperature resistant coupling adhesive; Determine the initial readings of the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic and record them as T 0t ( t 0, m v0 )、 S 0t ( t 0, S v0 ); The pencil lead is pressed against the metal plate and broken. The distance between the broken part of the pencil lead and the metal coupling plate corresponding to the tested piezoelectric ceramic is i. The temperature calibration piezoelectric ceramic and the tested piezoelectric ceramic readings at the beginning of breaking and at a specific time thereafter are recorded and recorded as T respectively. it (t i ,m vi )、S jt (t j ,S vj ); The temperature of the calibration piezoelectric ceramic and the test piezoelectric ceramic for the same burst signal is calculated using the following formula k Time difference: ； Where: The temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are used to calibrate the burst signal k The time difference, s; t ik The temperature calibration of the piezoelectric ceramic for the burst signal k The response time is m vi - m v0 The earliest occurrence time of >0, s; t jk For the test piezoelectric ceramic to the burst signal k The response time is S vj - S v0 The earliest occurrence time >0 hours; Use the following formula to calculate the temperature of the piezoelectric ceramic for the burst signal k The initial decay ratio S n : ； Where: S n The temperature calibration piezoelectric ceramic and the test piezoelectric ceramic are used to calibrate the burst signal k The attenuation amplitude of S v(j+n)k for t jk + n The tested piezoelectric ceramic readings at the moment, n ≥0, mv; m v(i+n)k for t ik + n The temperature at the moment is used to calibrate the reading of the piezoelectric ceramic. n ≥0, mv; After separating the high-temperature and high-pressure acoustic wave acoustic emission sensor from the metal plate, the metal coupling sheet corresponding to the test piezoelectric ceramic is pasted on the rock surface through a high-temperature resistant coupling adhesive; The rock is subjected to high temperature and high pressure treatment, and the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic readings are recorded during the treatment process and recorded as T i ( t , m i )、 S j ( t , S j ); The following formula is used to jointly solve the rock fracture acoustic wave signal value x and temperature effect value R T : ； Where: x for t The rock fracture acoustic wave signal value of the piezoelectric ceramic tested at the time; R T for t The temperature effect value of the temperature calibration piezoelectric ceramic and the test piezoelectric ceramic at the time; S j for t The reading of the piezoelectric ceramic tested at the time; S n The temperature calibration of the piezoelectric ceramic for the burst signal k The initial attenuation ratio of m i for t + The temperature at the moment is used to calibrate the reading of the piezoelectric ceramic.

2. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 1, characterized in that: The accommodating cavity is filled with an aerogel layer.

3. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 1, characterized in that: The inner wall of the pressure-resistant sensor housing is provided with a PET-based inner heat-insulating film.

4. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 1, characterized in that: The temperature calibration piezoelectric ceramic and / or the test piezoelectric ceramic are prepared by the following method: Bismuth oxide, iron oxide, barium carbonate, titanium dioxide and rare earth oxide are mixed and added with anhydrous ethanol as a solvent for ball milling to obtain a mixed raw material powder; Pre-sintering the mixed raw material powder to obtain a pre-sintered block; Grinding the pre-sintered block uniformly, adding polyvinyl alcohol and stirring uniformly to obtain a mixed raw material colloid; Pressing the mixed raw material colloid into a disc and sintering it at high temperature to obtain a ceramic body; The ceramic body is cleaned, ground and polished, and then an electric field is applied in silicone oil for polarization treatment.

5. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 4, characterized in that: The dosage ratio of the bismuth oxide, the iron oxide, the barium carbonate, the titanium dioxide, the rare earth oxide and the anhydrous ethanol in the mixed raw material powder is: 20-30g: 5-10g: 10-15g: 5-10g: 0.01-0.1g: 50-100mL.

6. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 4, characterized in that: The pre-sintering temperature is 600-800° C., and the pre-sintering time is 4-8 hours.

7. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 4, characterized in that: Grind 35-50 g of the pre-sintered block uniformly, add 5-10 mL of polyvinyl alcohol and mix well.

8. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 4, characterized in that: The high temperature sintering temperature is 950-1150° C., and the sintering time is 2-4 hours.

9. The detection method of the high temperature and high pressure acoustic wave acoustic emission sensor according to claim 4, characterized in that: The electric field strength of the applied electric field for polarization treatment is 10-40 kV / cm, and the polarization treatment time is 30-60 min.

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