Wafer storage container cleaning apparatus

Abstract

A wafer container cleaning device of the present invention suppresses contamination of a wafer container being cleaned in a cleaning tank. The wafer container cleaning device includes: a cleaning tank main body that is a container having an opening portion in an upper surface and capable of housing the wafer container inside; a cover portion provided to the cleaning tank main body; a placement portion provided inside the cleaning tank main body and capable of placing the housing; a first cleaning liquid ejection portion provided inside the housing in a housing placement state and ejecting cleaning liquid to an inner surface of the housing; and a second cleaning liquid ejection portion provided outside the housing in the housing placement state and ejecting cleaning liquid to an outer surface of the housing, a spray outlet of the first cleaning liquid ejection portion and a spray outlet of the second cleaning liquid ejection portion facing each other in a manner that cleaning liquid can be ejected from one of the spray outlets toward the other spray outlet.

Description

Technical Field

[0001] Embodiments of the present invention relate to a wafer storage container cleaning apparatus. Background Technology

[0002] There are wafer storage containers such as front-opening unified pods (FOUPs) or front-opening shipping boxes (FOSBs) for housing wafers (semiconductor wafers). For example, an FOUP includes a housing with an opening and a door installed in the opening. Inside the housing, multiple shelves are formed to hold multiple wafers.

[0003] Furthermore, semiconductor devices are formed on wafers through various processes. Wafers are transported within wafer storage containers as they move between processes. If a wafer storage container is repeatedly used across multiple processes, particles or chemical contaminants may sometimes adhere to the inside of the container (e.g., inside the housing). If these contaminants re-adhere to the wafers housed within the container, the yield of the semiconductor devices will decrease. Therefore, if a wafer storage container is repeatedly used, it needs to be cleaned to restore it to a clean state.

[0004] For example, as a technique for cleaning FOUPs, an apparatus has been proposed that houses the housing and doors in a cleaning tank and cleans and dries the housing and doors. After cleaning and drying, the housing and doors are removed from the cleaning tank, and the next housing and door is moved into the cleaning tank.

[0005] [Existing Technical Documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2005-109523 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] As described above, contaminants adhere to the inside of the wafer storage container. Therefore, there is a concern that when the inside of the wafer storage container is cleaned, these contaminants may adhere to the cleaning solution supply section that supplies the cleaning solution to the inside of the wafer storage container. If the next wafer storage container is cleaned while the cleaning solution supply section is contaminated, there is a concern that the contaminants on the cleaning solution supply section may adhere to the wafer storage container and contaminate it.

[0010] The present invention was made to solve the aforementioned problem, and its purpose is to provide a wafer storage container cleaning device that can suppress contamination of the wafer storage container.

[0011] [Technical means to solve the problem]

[0012] To address the aforementioned issues and achieve the objective, one aspect of the present invention provides a wafer storage container cleaning apparatus for cleaning a wafer storage container. The wafer storage container includes: a housing with an opening; and a door installed at the opening. The wafer storage container cleaning apparatus further includes: a cleaning tank body, which is a container with an opening on its upper surface and capable of housing the wafer storage container internally; a cover provided on the opening side of the cleaning tank body for opening / closing the opening; and a mounting portion provided inside the cleaning tank body. The housing is provided with a mounting section that allows the housing to be placed with its opening facing downwards; a first cleaning fluid spraying section is disposed inside the housing when the housing is mounted by the mounting section, i.e., in the housing mounting state, and sprays cleaning fluid onto the inner surface of the housing; and a second cleaning fluid spraying section is disposed outside the housing in the housing mounting state and sprays cleaning fluid onto the outer surface of the housing, wherein the nozzles of the first cleaning fluid spraying section and the nozzles of the second cleaning fluid spraying section face each other in such a way that cleaning fluid can be sprayed from one nozzle towards the other nozzle.

[0013] [The effects of the invention]

[0014] According to one aspect of the present invention, a wafer storage container cleaning device can be provided that can suppress contamination of the wafer storage container. Attached Figure Description

[0015] Figure 1 This is a plan view illustrating an example of the schematic structure of a wafer storage container cleaning apparatus according to an embodiment.

[0016] Figure 2 This is a diagram schematically illustrating an example of the structure of the cleaning tank 5 in the embodiment.

[0017] Figure 3A This diagram illustrates an example of the location of the third cleaning fluid supply unit during the removal, installation, and drying of the housing in the embodiment.

[0018] Figure 3B This diagram illustrates an example of the location of the third cleaning fluid supply unit used for cleaning the casing of the embodiment.

[0019] Figure 4 This is a diagram showing an example of the structure of the control unit in the first embodiment.

[0020] Figure 5 This is a flowchart illustrating the self-cleaning process of the cleaning tank 5 performed by the wafer storage container cleaning apparatus of the embodiment.

[0021] [Explanation of Symbols]

[0022] 1: Wafer Storage Container Cleaning Device

[0023] 1a: Enclosure

[0024] 1b, 1c: Opening

[0025] 2: Loading port

[0026] 2a, 7a: baffles

[0027] 2b, 7b: Arrows

[0028] 3: Robot

[0029] 3a: Robotic arm

[0030] 3b: Robotic Hand

[0031] 4: Disassemble / Connect Platform

[0032] 4a: Latch key

[0033] 5: Cleaning tank

[0034] 5a: Main body of the cleaning tank

[0035] 5b: Cover

[0036] 5c: Mounting section

[0037] 5c_1: Through hole

[0038] 5d: First cleaning fluid supply unit (first cleaning fluid spraying unit)

[0039] 5e: Second cleaning fluid supply unit (second cleaning fluid spraying unit)

[0040] 5f: Drying section

[0041] 5g: First discharge section

[0042] 5h: Second discharge section

[0043] 5i: Maintenance Department (Maintenance Mechanism)

[0044] 5j, 5k: Motor

[0045] 5l: Shaft

[0046] 5m, 5n, 5o, 5r: Nozzle

[0047] 5p: Third cleaning fluid supply unit (third cleaning fluid spraying unit)

[0048] 5s: Fixed part

[0049] 5s_1: Taiwan

[0050] 5s_2: Fixed shaft

[0051] 5t: hollow part

[0052] 6: Vacuum bath

[0053] 7: Unloading port

[0054] 8: Control Department

[0055] 8a: CPU

[0056] 8b: ROM

[0057] 8c: RAM

[0058] 8d: HDD

[0059] 8e: Communication Interface

[0060] 20: FOUP

[0061] 20a: Shell (FOUP main body)

[0062] 20b: Door (Lid)

[0063] 20c: Flange

[0064] S101, S102, S103, S104, S105, S106, S107, S108: Steps Detailed Implementation

[0065] Hereinafter, embodiments of the wafer storage container cleaning apparatus disclosed in this application will be described in detail with reference to the accompanying drawings. Furthermore, the wafer storage container cleaning apparatus disclosed in this application is not limited to the embodiments described below. Additionally, various embodiments and modifications can be appropriately combined without causing contradictions. Furthermore, in the following embodiments, the case where the wafer storage container to be cleaned is a FOUP is described, but the wafer storage container to be cleaned is not limited to this. For example, the wafer storage container to be cleaned may also be a FOSB.

[0066] (Implementation Method)

[0067] Figure 1 This is a plan view illustrating an example of the schematic structure of the wafer storage container cleaning apparatus 1 according to an embodiment. The wafer storage container cleaning apparatus 1 is installed, for example, in a semiconductor wafer manufacturing factory, to clean wafer storage containers. Figure 1As shown, the wafer storage container cleaning device 1 includes a loading port 2, a robot 3, a disassembly / connection platform 4, a cleaning tank 5, a vacuum tank 6, an unloading port 7, and a control unit 8.

[0068] Robot 3, disassembly / connection table 4, cleaning tank 5, vacuum tank 6, and control unit 8 are disposed inside the housing 1a of the wafer storage container cleaning apparatus 1. On the other hand, loading port 2 and unloading port 7 are disposed across the inside and outside of the housing 1a of the wafer storage container cleaning apparatus 1.

[0069] Loading port 2 moves the FOUP 20, which is to be cleaned, from the outer part of the housing 1a placed in loading port 2 into the interior of housing 1a. FOUP 20 includes a housing (FOUP body) 20a and a door (cover) 20b. Housing 20a has an opening (housing opening) and a storage space for storing semiconductor wafers. The storage space exists further inward than the housing opening and communicates with the housing opening. Door 20b can be disassembled / connected to housing 20a. In addition, a flange 20c is provided on housing 20a. The flange 20c is the part that is held (held) when FOUP 20 is transported by an overhead hoist transport (OHT) or robot 3, etc.

[0070] For example, on the portion outside the housing 1a of the loading port 2, a FOUP 20 is placed and conveyed while being held by the OHT flange 20c. For example, as Figure 1As shown, the FOUP 20 is placed with its door 20b facing the baffle 2a provided in the opening 1b of the housing 1a. When the FOUP 20 is placed in the loading port 2 in this manner, the baffle 2a provided in the opening 1b of the housing 1a rises. This allows the FOUP 20 to be moved from the opening 1b into the interior of the housing 1a. That is, the FOUP 20 can be moved into the interior of the wafer storage container cleaning apparatus 1. Furthermore, the FOUP 20 slides along the direction of arrow 2b via the sliding device of the loading port 2. Thus, the FOUP 20 is moved into the interior of the housing 1a. The sliding using the sliding device will be explained. For example, by inserting a pin provided with the sliding device into a hole provided in the bottom (placement surface) of the FOUP 20, the placement surface of the FOUP 20 is fixed to the sliding device. In this state, by sliding the sliding device along the direction of arrow 2b, the FOUP 20 also slides. Thus, FOUP 20 is placed on a designated portion inside the housing 1a of the loading port 2. If FOUP 20 is moved into the housing 1a in the manner described, the baffle 2a descends, and the opening 1b of the housing 1a closes. The sliding device, together with the pin, descends to a position lower than the lower end of the baffle 2a (the mounting surface of FOUP 20), and returns to its original position outside the housing 1a.

[0071] Robot 3, while holding the flange 20c of FOUP 20, transports FOUP 20 to various parts. Robot 3 includes a robot arm 3a and a robot hand 3b. Robot 3, while the robot hand 3b holds the flange 20c, moves the robot arm 3a by extending, retracting, or rotating, thereby transporting FOUP 20 to various parts.

[0072] The disassembly / connection platform 4 disassembles the FOUP 20 into a housing 20a and a door 20b, or connects the housing 20a and the door 20b. A latch key 4a is provided on the disassembly / connection platform 4. By rotating the latch key 4a while it is inserted into the keyhole formed on the door 20b of the FOUP 20, the FOUP 20 is disassembled (separated) into the housing 20a and the door 20b, or connected to the housing 20a and the door 20b. For example, at the disassembly / connection platform 4, the FOUP 20, which is being moved into the interior of the housing 1a, is transported by the robot 3. In this case, the disassembly / connection platform 4 disassembles the FOUP 20 into the housing 20a and the door 20b. Furthermore, disassembly can be interpreted as unlocking, and connection can be interpreted as locking.

[0073] Cleaning tank 5 is a tank used for cleaning FOUP 20. Cleaning tank 5 is an example of a cleaning unit. Figure 2 This is a schematic diagram illustrating one example of the structure of the cleaning tank 5 in the embodiment. (See diagram below.) Figure 2As shown, for example, the cleaning tank 5 includes a cleaning tank body 5a, a cover 5b, a holding part 5c, a first cleaning liquid supply part (first cleaning liquid spraying part) 5d, a second cleaning liquid supply part (second cleaning liquid spraying part) 5e, a drying part 5f, a first discharge part 5g, a second discharge part 5h, a third cleaning liquid supply part (third cleaning liquid spraying part) 5p, a fixing part 5s, and a hollow part 5t.

[0074] The cleaning tank body 5a is a container capable of housing the FOUP 20. The cleaning tank body 5a has an opening at the top (body opening) and a cleaning space communicating with the body opening. The cleaning space exists further inside than the body opening. The shell 20a is moved into the cleaning space via the robot 3 through the body opening. Thus, the shell 20a is moved into the interior of the cleaning tank body 5a. Then, the moved-in shell 20a is placed in the placement part 5c provided in the cleaning space of the cleaning tank body 5a. The placement part 5c is located inside the cleaning tank body 5a, as shown in the image. Figure 2 As shown, this is a platform (placement stage) for placing the housing 20a with its opening facing downwards. A positioning pin is provided in the placement section 5c. The placement position of the housing 20a is determined by the positioning pin. Figure 2 As shown, a plurality of through holes 5c_1 are formed in the mounting portion 5c. The through holes 5c_1 communicate (connect) with the first discharge portion 5g. In addition, an opening is provided at the center of the mounting portion 5c.

[0075] The hollow portion 5t is connected to an opening located at the center of the mounting portion 5c, and is configured to rotate about the fixing portion 5s about a shaft 5l extending in the vertical direction. Rotation of the hollow portion 5t causes the mounting portion 5c to rotate in conjunction. The fixing portion 5s is a component fixed relative to the cleaning tank body 5a. The fixing portion 5s is configured to penetrate the hollow portion 5t in the vertical direction, supporting the hollow portion 5t in a way that allows it to rotate. The fixing portion 5s includes a fixed platform 5s_1 and a fixed shaft 5s_2.

[0076] The fixed platform 5s_1 has a larger outer shape than the hollow portion 5t. This prevents the cleaning fluid, after cleaning the interior of the housing 20a and flowing towards the upper surface of the fixed platform 5s_1, from flowing into the hollow portion 5t. Furthermore, it prevents the cleaning fluid, after cleaning the first cleaning fluid supply unit 5d or the third cleaning fluid supply unit 5p and flowing towards the upper surface of the fixed platform 5s_1, from flowing into the hollow portion 5t during the self-cleaning process of the cleaning tank 5 (described later).

[0077] Alternatively, a downwardly extending protrusion can be provided on the outer periphery of the fixed platform 5s_1. In this case, it is preferable to position the upper end of the hollow portion 5t higher than the upper surface of the mounting portion 5c. This allows a labyrinth structure to be formed by the protrusion of the fixed platform 5s_1 and the upper end of the hollow portion 5t. As a result, it further prevents cleaning water used for cleaning the interior of the housing 20a or for self-cleaning processes from flowing into the hollow portion 5t. Furthermore, when the hollow portion 5t is connected to the lower surface of the mounting portion 5c, a protrusion can be provided around the opening of the mounting portion 5c to surround its opening. In this case, it is sufficient that the outer shape of the fixed platform 5s_1 is larger than the outer shape of the protrusion.

[0078] The cover 5b is located above the main body 5a of the cleaning tank (on the side of the main body opening), and is opened and closed relative to the main body opening of the cleaning tank 5a by means of a cylinder. A retaining part (retaining mechanism) 5i is provided on the inner side of the cover 5b, which can hold the door 20b in an adhesive manner.

[0079] In this embodiment, when cleaning FOUP 20 in the cleaning tank 5, the robot 3 transports the housing 20a and door 20b from the disassembly / connection table 4 to the cleaning tank 5. For example, the robot 3 transports the housing 20a from the opening of the cleaning tank body 5a to the interior of the cleaning tank body 5a with the opening of the housing 20a facing downwards. Then, as... Figure 2 As shown, the housing 20a is placed on the mounting portion 5c with its opening facing downwards. Furthermore, the robot 3 moves the door 20b to the holding portion 5i, so that the outer surface of the door 20b is held by the holding portion 5i of the cover portion 5b. Thus, as... Figure 2 As shown, with the cover 5b closed, the inner surface (inner surface) of the door 20b faces downward.

[0080] In addition, a first cleaning fluid supply unit 5d, a second cleaning fluid supply unit 5e, and a third cleaning fluid supply unit 5p are provided in the cleaning space of the main body 5a of the cleaning tank. The first cleaning fluid supply unit 5d, the second cleaning fluid supply unit 5e, and the third cleaning fluid supply unit 5p are supplied with the cleaning fluid (e.g., deionized water, or other pure water) used for cleaning the housing 20a and the door 20b. Then, the first cleaning fluid supply unit 5d cleans the housing 20a (inner surface of the housing 20a) by supplying (spraying) cleaning fluid into the housing 20a's storage space (inner surface of the housing 20a). The second cleaning fluid supply unit 5e cleans the outer side of the housing 20a by supplying (spraying) cleaning fluid into the outer side of the housing 20a. In addition, the third cleaning fluid supply unit 5p cleans the upper surface of the outer side of the housing 20a and the inner surface of the door 20b by supplying (spraying) cleaning fluid to the upper surface of the outer side of the housing 20a and the inner surface of the door 20b held by the holding part 5i of the cover part 5b.

[0081] The first cleaning fluid supply unit 5d is positioned to supply cleaning fluid to the receiving space of the housing 20a placed in the mounting portion 5c. For example, the first cleaning fluid supply unit 5d includes: at least one rod-shaped tube extending upward from the upper surface of the platform 5s_1 of the fixing portion 5s, at least one rod-shaped tube extending horizontally, and a plurality of nozzles 5m provided on each tube. The nozzles 5m are, for example, two-fluid nozzles. When the nozzles 5m are two-fluid nozzles, they mix air (an example of gas) with the cleaning fluid, utilize the airflow to atomize the cleaning fluid, and supply the atomized cleaning fluid to the receiving space of the housing 20a. Furthermore, this type of nozzle 5m can supply cleaning fluid to the receiving space without mixing air and cleaning fluid. That is, the nozzles 5m can supply un-atomized cleaning fluid to the receiving space without atomizing the cleaning fluid. In addition, air and cleaning fluid are supplied to nozzle 5m via a pipe installed in the fixed shaft 5s_2, which is connected to a rod-shaped pipe extending upward from the upper surface of the platform 5s_1 of the fixed part 5s.

[0082] like Figure 2 As shown, the first cleaning fluid supply unit 5d includes a nozzle 5m that sprays cleaning fluid horizontally and a nozzle 5m that sprays cleaning fluid upwards. The nozzle 5m that sprays cleaning fluid horizontally cleans the inner side surface of the housing 20a. The nozzle 5m that sprays cleaning fluid upwards cleans the upper inner surface of the housing 20a. That is, the first cleaning fluid supply unit 5d is disposed inside the housing 20a when the housing 20a is mounted by the mounting unit 5c, i.e., in the housing mounting state, and sprays cleaning fluid onto the inner surface of the housing 20a.

[0083] The second cleaning fluid supply unit 5e is positioned to supply cleaning fluid to the outer side of the housing 20a. For example, the second cleaning fluid supply unit 5e includes at least one rod-shaped tube extending in the vertical direction and a plurality of nozzles 5o disposed on the tube. The nozzles 5o are, for example, single-fluid nozzles. When the nozzles 5o are single-fluid nozzles, the nozzles 5o supply cleaning fluid to the outer side of the housing 20a. That is, in the housing-mounted state, the second cleaning fluid supply unit 5e is positioned on the outside of the housing 20a and sprays cleaning fluid onto the outer surface of the housing 20a.

[0084] In this embodiment, when the housing 20a is not supported by the mounting portion 5c (i.e., when the housing 20a is not in the cleaning tank 5), the nozzle 5m of the first cleaning fluid supply portion 5d, which sprays cleaning fluid in a horizontal direction, faces the nozzle 5o of the second cleaning fluid supply portion 5e. That is, the nozzles of the first cleaning fluid supply portion 5d and the second cleaning fluid supply portion 5e face each other in such a way that cleaning fluid can be sprayed from one nozzle towards the other in the housing-unmounted state.

[0085] The third cleaning fluid supply unit 5p is positioned to supply cleaning fluid to the upper outer surface of the housing 20a and the inner surface of the door 20b held by the retaining portion 5i of the cover 5b. For example, the third cleaning fluid supply unit 5p includes at least one horizontally extending and rotatable rod-shaped tube and a plurality of nozzles 5r or 5n disposed on the tube. The nozzles 5n are, for example, dual-fluid nozzles similar to nozzle 5m, designed to spray towards the inner surface of the door 20b. When nozzle 5n is a dual-fluid nozzle, it supplies atomized cleaning fluid to the inner surface of the door 20b. Alternatively, nozzle 5r may be, for example, a single-fluid nozzle. When nozzle 5r is a single-fluid nozzle, it supplies cleaning fluid to the upper outer surface of the housing 20a. Thus, the third cleaning fluid supply unit 5p sprays cleaning fluid when the housing is in a mounted state and the door 20b is held by the retaining portion 5i of the cover 5b, i.e., in a door-held state. The cleaning fluid sprayed from the third cleaning fluid supply unit 5p is sprayed onto the upper surface of the outer surface of the housing 20a and the inner surface of the door 20b facing the upper surface of the housing 20a.

[0086] Figure 3A This diagram illustrates an example of the position of the third cleaning fluid supply unit 5p during the removal, installation, and drying of the housing 20a in the embodiment. Figure 3B This diagram illustrates an example of the position of the third cleaning fluid supply unit 5p used for cleaning the housing 20a of the embodiment. Furthermore, in Figure 3A In the diagram, the drying section 5f indicates the position of the housing 20a in the embodiment when it is moved out or moved in. For example, in Figure 2 In the middle, the nozzle 5r of the third cleaning fluid supply unit 5p, which is located between the housing 20a and the door 20b, is used during the removal, installation, and drying of the housing 20a, such as... Figure 3A As shown, the nozzle 5r of the third cleaning fluid supply unit 5p is moved to a position where it does not interfere with the housing 20a (retreat position). Then, after moving the housing 20a into the cleaning space and closing the cover 5b with the door 20b held by the holding part 5i, the nozzle 5r of the third cleaning fluid supply unit 5p... Figure 3B The nozzle 5r of the third cleaning fluid supply unit 5p rotates and moves to a position above the housing 20a placed on the mounting part 5c and below the door 20b held by the holding part 5i (cleaning position). If cleaning is complete, the nozzle 5r of the third cleaning fluid supply unit 5p rotates and returns to the retracted position. Furthermore, regarding the nozzle 5n, although... Figure 3A and Figure 3B Not shown in the diagram, but moves in the same way as nozzle 5r.

[0087] In this embodiment, when the housing is not in a mounted state and the door 20b is not held by the holding part 5i (i.e., the door is not held), and the nozzle 5r of the third cleaning fluid supply part 5p is in the cleaning position, the nozzle outlet of the nozzle 5r faces the nozzle outlet of the nozzle 5m that sprays cleaning fluid upwards. That is, the nozzle outlets of the first cleaning fluid supply part 5d and the third cleaning fluid supply part 5p face each other in a manner that allows cleaning fluid to be sprayed from one nozzle outlet towards the other when the housing is not mounted and the door is not held.

[0088] The drying section 5f is positioned to supply hot air (hot air) to the inner surface of the housing 20a, the outer surface of the housing 20a, and the inner surface of the door 20b. For example, the drying section 5f includes at least two rod-shaped tubes extending vertically, at least two rod-shaped tubes extending horizontally, and multiple hot air nozzles provided on each tube. In this embodiment, at least one tube extending upward from the upper surface of the platform 5s_1 of the fixing part 5s and connected to the upper surface of the platform 5s_1 of the fixing part 5s, and at least one tube extending horizontally, is provided to supply hot air to the inner surface of the housing 20a when the housing 20a is mounted. Additionally, at least one tube extending vertically and at least one tube extending horizontally and rotatable are provided to supply hot air to the outer portion of the housing 20a. The hot air nozzles provided on these tubes supply hot air to the inner surface of the housing 20a, the outer surface of the housing 20a, and the inner surface of the door 20b.

[0089] For example, Figure 2In this process, the drying unit 5f, positioned between the housing 20a and the door 20b, retracts to a position that does not interfere with the housing 20a when the housing 20a is moved out, moved in, or cleaned (retracted position). Then, after cleaning, it rotates and moves to a position above the housing 20a placed on the mounting part 5c and below the door 20b held by the holding part 5i (drying position). After drying, the drying unit 5f rotates and returns to the retracted position.

[0090] Furthermore, the main body 5a of the cleaning tank includes a first rotating part, which includes a motor 5k. During the cleaning and drying of the housing 20a, the first rotating part rotates the hollow portion 5t around a shaft 5l extending in the vertical direction, thereby rotating the mounting portion 5c. As the mounting portion 5c rotates, the housing 20a mounted on the mounting portion 5c also rotates. Additionally, the cover portion 5b includes a second rotating part, which includes a motor 5j. During the cleaning and drying of the door 20b, the second rotating part rotates the holding portion 5i around a shaft 5l. As the holding portion 5i rotates, the door 20b held by the holding portion 5i also rotates. Therefore, during the cleaning of the FOUP 20, cleaning fluid is uniformly supplied to the FOUP 20. Furthermore, during the drying of the FOUP 20, hot air is uniformly supplied to the FOUP 20. Alternatively, instead of supplying hot air from the hot air nozzle, the liquid adhering to the housing 20a and the door 20b can be dried by rotating the first rotating part and the second rotating part.

[0091] The first discharge section 5g discharges the cleaning fluid supplied (sprayed) to the receiving space of the housing 20a. As described above, the first discharge section 5g is connected to the through hole 5c_1. Therefore, the cleaning fluid supplied to the receiving space of the housing 20a flows into the first discharge section 5g through the through hole 5c_1.

[0092] The second discharge section 5h discharges the cleaning fluid that passes through the outside of the housing 20a. The cleaning fluid that passes through the outside of the housing 20a is the cleaning fluid supplied (sprayed) to the outer surface of the housing 20a and the inner surface of the door 20b. For example, the second discharge section 5h is a discharge port provided at the bottom of the cleaning tank body 5a.

[0093] Furthermore, once the FOUP 20 has been cleaned in the cleaning tank 5, the robot 3 will transfer the housing 20a and the door 20b from the cleaning tank 5 to the vacuum tank 6 respectively.

[0094] Return to Figure 1The vacuum tank 6 is a tank for vacuum drying FOUP 20. Inside the vacuum tank 6 are: a holding unit to hold the housing 20a and door 20b that are transported into the vacuum tank 6; a halogen lamp; and a vacuum pump, such as a dry pump or a mechanical booster pump, to evacuate the interior of the vacuum tank 6. With the housing 20a and door 20b held in place by the holding unit, the vacuum tank 6 is evacuated using the vacuum pump while simultaneously heated by the halogen lamp, thereby vacuum drying the housing 20a and door 20b.

[0095] Furthermore, after the FOUP 20 has been vacuum dried in the vacuum chamber 6, the robot 3 transfers the housing 20a and the door 20b from the vacuum chamber 6 to the disassembly / connection stage 4. Then, the disassembly / connection stage 4 connects the housing 20a and the door 20b.

[0096] The unloading port 7 will remove the FOUP 20, which has been cleaned and vacuum dried and placed inside the housing 1a by the robot 3, to the outside of the housing 1a.

[0097] For example, after vacuum drying, the FOUP 20, formed by connecting the housing 20a and the door 20b in the decomposition / connection stage 4, is transported by the robot 3 and placed inside the cover 1a of the unloading port 7. Thus, when the FOUP 20 is placed in the unloading port 7, the baffle 7a provided in the opening 1c of the cover 1a rises. This allows the FOUP 20 to be moved out of the cover 1a from the opening 1c. That is, the FOUP 20 can be moved out of the wafer storage container cleaning apparatus 1. Furthermore, the FOUP 20 is moved out of the cover 1a by sliding the unloading port 7 in the direction of arrow 7b using the sliding mechanism (which has the same mechanism as the sliding mechanism of the loading port 2). Thus, when the FOUP 20 is moved out of the cover 1a, the baffle 7a descends, and the opening 1c of the cover 1a closes.

[0098] The control unit 8 controls the overall operation of the wafer storage container cleaning apparatus 1. For example, the control unit 8 controls the loading port 2, robot 3, disassembly / connection stage 4, cleaning tank 5, vacuum tank 6, and unloading port 7 to operate as described above.

[0099] Figure 4 This is a diagram illustrating an example of the structure of the control unit 8 in an embodiment. (See diagram for example.) Figure 4As shown, the control unit 8 includes a central processing unit (CPU) 8a, a read-only memory (ROM) 8b, a random access memory (RAM) 8c, a hard disk drive (HDD) 8d, and a communication interface 8e. These are connected via an internal bus.

[0100] CPU 8a performs various processes while using the storage area of ​​RAM 8c as a temporary storage area for data used in various processes. The processes performed by CPU 8a will be described later. ROM 8b and HDD 8d store programs for performing various processes, various databases or tables used during the execution of these processes, etc. For example, ROM 8b or HDD 8d stores a program for performing the self-cleaning process of cleaning tank 5.

[0101] Communication interface 8e is an interface used for communicating with the various parts of the wafer storage container cleaning apparatus 1 and with external devices connected to the wafer storage container cleaning apparatus 1 via a network. For example, communication interface 8e is a network interface card.

[0102] Next, the self-cleaning process performed in the cleaning tank 5 by the wafer storage container cleaning apparatus 1 of this embodiment will be described. Figure 5 This is a flowchart illustrating the self-cleaning process of the cleaning tank 5 performed by the wafer storage container cleaning apparatus 1 according to the embodiment. During maintenance of the wafer storage container cleaning apparatus 1, when a user inputs an instruction to perform the self-cleaning process to the control unit 8 via an input interface such as a mouse, keyboard, or touch panel included in the control unit 8, the process is executed. Figure 5 The self-cleaning process is shown. Furthermore, the self-cleaning process is performed when the housing 20a and door 20b are removed from the cleaning tank 5 and the housing 20a and door 20b are not in the cleaning tank 5.

[0103] like Figure 5 As shown, the CPU 8a of the control unit 8 moves the nozzle 5r of the third cleaning fluid supply unit 5p to the cleaning position (see reference). Figure 3B (Step S101). Thus, the nozzle 5r's outlet faces the nozzle 5m's outlet, which sprays cleaning fluid upwards.

[0104] Next, CPU 8a controls the first cleaning fluid supply unit 5d to begin cleaning the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p using the first cleaning fluid supply unit 5d (step S102). As a result, the nozzle 5m of the first cleaning fluid supply unit 5d, which sprays cleaning fluid horizontally, begins to clean the second cleaning fluid supply unit 5e. Meanwhile, the nozzle 5m of the first cleaning fluid supply unit 5d, which sprays cleaning fluid upwards, begins to clean the third cleaning fluid supply unit 5p.

[0105] In step S102, CPU 8a controls the first cleaning fluid supply unit 5d such that the flow rate of the cleaning fluid ejected from the nozzle 5m when cleaning the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p is greater than the flow rate of the cleaning fluid ejected from the nozzle 5m when cleaning the housing 20a. The reason for this is explained. For example, it is sufficient that the cleaning fluid ejected from the nozzle 5m reaches the inner surface of the housing 20a when cleaning the housing 20a. On the other hand, when cleaning the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p, the cleaning fluid ejected from the nozzle 5m needs to reach the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p, which are farther away than the housing 20a. Therefore, by increasing the flow rate, the cleaning fluid ejected from the nozzle 5m reaches the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p.

[0106] Next, CPU 8a determines whether a first cleaning time has elapsed since the first cleaning fluid supply unit 5d began cleaning the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p in step S102 (step S103). The first cleaning time is a predetermined time through experiments or simulations during which the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p can be expected to be sufficiently cleaned.

[0107] If the first cleaning time has not elapsed since the start of cleaning of the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p (step S103: No), the CPU 8a performs the determination in step S103 again. On the other hand, if the first cleaning time has elapsed since the start of cleaning of the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p (step S103: Yes), the CPU 8a controls the first cleaning fluid supply unit 5d to end the cleaning of the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p (step S104). That is, the CPU 8a controls the first cleaning fluid supply unit 5d to stop spraying cleaning fluid from the nozzle 5m of the first cleaning fluid supply unit 5d. In this way, the first cleaning fluid supply unit 5d cleans the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p within the first cleaning time.

[0108] Next, CPU 8a controls the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p to begin cleaning the first cleaning fluid supply unit 5d using the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p (step S105). As a result, the nozzle 5o of the second cleaning fluid supply unit 5e begins to clean the portion of the first cleaning fluid supply unit 5d that includes the nozzle 5m which sprays cleaning fluid horizontally. Meanwhile, the nozzle 5r of the third cleaning fluid supply unit 5p begins to clean the portion of the first cleaning fluid supply unit 5d that includes the nozzle 5m which sprays cleaning fluid upwards. Cleaning fluid is not sprayed from the nozzle 5n of the third cleaning fluid supply unit 5p.

[0109] In step S105, CPU 8a controls the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p such that the flow rate of cleaning fluid ejected from nozzles 5o and 5r when cleaning the first cleaning fluid supply unit 5d is greater than the flow rate of cleaning fluid ejected from nozzles 5o and 5r when cleaning the housing 20a. The reason given is the same as the reasoning for the flow rate of cleaning fluid ejected from nozzle 5m when cleaning the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p being greater than the flow rate of cleaning fluid ejected from nozzle 5m when cleaning the housing 20a.

[0110] Next, CPU 8a determines whether a second cleaning time has elapsed since the first cleaning fluid supply unit 5d was cleaned using the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p in step S105 (step S106). The second cleaning time is a predetermined time during which the first cleaning fluid supply unit 5d can be expected to be sufficiently cleaned through experiments or simulations.

[0111] If no second cleaning time has elapsed after the start of cleaning of the first cleaning fluid supply unit 5d (step S106: No), the CPU 8a performs the determination in step S106 again. On the other hand, if a second cleaning time has elapsed after the start of cleaning of the first cleaning fluid supply unit 5d (step S106: Yes), the CPU 8a controls the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p to end the cleaning of the first cleaning fluid supply unit 5d (step S107). That is, the CPU 8a controls the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p to stop spraying cleaning fluid from the nozzle 5o of the second cleaning fluid supply unit 5e and the nozzle 5r of the third cleaning fluid supply unit 5p. Thus, the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p clean the first cleaning fluid supply unit 5d during the second cleaning time.

[0112] Then, CPU 8a moves the nozzle 5r of the third cleaning fluid supply unit 5p to the retracted position (step S108), ending the self-cleaning process.

[0113] The wafer storage container cleaning apparatus 1 of this embodiment has been described above. In this embodiment, in step S105, the control unit 8 controls the second cleaning liquid supply unit 5e to spray cleaning liquid onto the first cleaning liquid supply unit 5d when the housing is not in a non-mounted state. More specifically, in step S105, the control unit 8 controls the second cleaning liquid supply unit 5e and the third cleaning liquid supply unit 5p to spray cleaning liquid onto the first cleaning liquid supply unit 5d when the housing is not in a non-mounted state and the door is not held. As a result, the contaminants that adhered to the first cleaning liquid supply unit 5d in step S102 can be removed from the first cleaning liquid supply unit 5d in step S105. Therefore, contamination of the FOUP 20 cleaned in the cleaning tank 5 after self-cleaning treatment can be suppressed.

[0114] Furthermore, in this embodiment, before controlling the second cleaning fluid supply unit 5e to spray cleaning fluid from the first cleaning fluid supply unit 5d, the control unit 8 controls the first cleaning fluid supply unit 5d to spray cleaning fluid from the second cleaning fluid supply unit 5e in step S102. More specifically, before controlling the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p to spray cleaning fluid from the first cleaning fluid supply unit 5d, the control unit 8 controls the first cleaning fluid supply unit 5d to spray cleaning fluid from the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p in step S102. Therefore, even if contaminants adhere to the first cleaning fluid supply unit 5d due to cleaning fluid containing pollutants dripping from the third cleaning fluid supply unit 5p located above the first cleaning fluid supply unit 5d, the first cleaning fluid supply unit 5d is still cleaned afterward, thus preventing contamination of the first cleaning fluid supply unit 5d. Furthermore, from the aforementioned perspective, contamination of the FOUP 20, which is cleaned in the cleaning tank 5 after self-cleaning treatment, can also be suppressed.

[0115] Furthermore, there is a concern that when the interior of the housing 20a is cleaned, contaminants may also adhere to the drying section 5f connected to the fixing section 5s. Therefore, in the self-cleaning process, the CPU 8a can clean not only the first cleaning fluid supply section 5d but also the hot air nozzle of the drying section 5f connected to the fixing section 5s by oscillating the third cleaning fluid supply section 5p. This prevents contaminants adhering to the hot air nozzle from adhering to the FOUP 20. Furthermore, contamination of the FOUP 20 can be suppressed.

[0116] Furthermore, during the self-cleaning process, when the CPU 8a oscillates the third cleaning fluid supply unit 5p, multiple first cleaning fluid supply units 5d can be arranged facing each other near the outer edge of the platform 5s_1 of the fixed unit 5s. That is, multiple first cleaning fluid supply units 5d can also be arranged in a separated position. Even if the first cleaning fluid supply units 5d are arranged in a separated position by oscillating the third cleaning fluid supply unit 5p, the multiple first cleaning fluid supply units 5d are still cleaned by the third cleaning fluid supply unit 5p. In addition, by arranging the multiple first cleaning fluid supply units 5d near the outer edge of the platform 5s_1 of the fixed unit 5s, the distance to the second cleaning fluid supply unit 5e is shortened. Therefore, the increase in the flow rate of the cleaning fluid ejected from the nozzle 5m or nozzle 5o during the self-cleaning process can be suppressed.

[0117] Furthermore, the area near the outer edge of the platform 5s_1 of the fixing part 5s is defined as the range from the outer edge of the hollow part 5t inwards, by a length corresponding to the diameter of the rod-shaped tube constituting the first cleaning fluid supply part 5d, to the outer edge of the platform 5s_1 of the fixing part 5s. Additionally, the rod-shaped tube constituting the first cleaning fluid supply part 5d can be not only upwardly elongated but also horizontally elongated. For example, the case where the rod-shaped tube constituting the first cleaning fluid supply part 5d is not near the outer edge of the platform 5s_1 of the fixing part 5s, but the nozzle 5m is located near the outer edge of the platform 5s_1 of the fixing part 5s, also includes the case where multiple first cleaning fluid supply parts 5d are located near the outer edge of the platform 5s_1 of the fixing part 5s.

[0118] Furthermore, the fixing part 5s is provided not only with a first cleaning fluid supply part 5d facing the second cleaning fluid supply part 5e, but also with a drying part 5f that supplies hot air to the outer side of the housing 20a. In this case, the drying parts 5f on the fixing part 5s only need to be provided between the first cleaning fluid supply parts 5d. In this way, the drying parts 5f that supply hot air to the outer side of the housing 20a can also be cleaned during the self-cleaning process.

[0119] Alternatively, a particle counter can be installed in the flow path where the cleaning liquid flows as waste liquid, further downstream of the first discharge section (5g). The particle counter measures the number of particles contained in a predetermined unit volume (e.g., 10ml) of waste liquid at predetermined time intervals. Furthermore, the CPU 8a can replace the determination in step S106 by determining whether the number of particles is less than a threshold each time the particle counter measures the number of particles in the predetermined unit volume of waste liquid. Moreover, if the number of particles is not less than the threshold, the CPU 8a again determines whether the number of particles is less than the threshold. Furthermore, if the number of particles is less than the threshold, the CPU 8a can proceed to step S107.

[0120] Furthermore, the process of successively moving the FOUP 20, which is to be cleaned, into the wafer storage container cleaning apparatus 1 will be explained. In this case, the CPU 8a can compare the time (timing) at which vacuum drying begins in the vacuum tank 6 with the time T2 at which cleaning of the housing 20a and door 20b ends in the cleaning tank 5. If the time T3 (T1-T2) obtained by subtracting time T2 from time T1 is longer than the time T4 required for self-cleaning, the CPU 8a automatically performs self-cleaning after removing the housing 20a and door 20b from the cleaning tank 5. In addition, the time T2 at which cleaning of the housing 20a and door 20b ends in the cleaning tank 5 also includes the time at which the housing 20a and door 20b are removed from the cleaning tank 5.

[0121] As described above, when the self-cleaning process is performed automatically, the housing 20a and door 20b removed from the cleaning tank 5 are transferred to the disassembly / connection table 4 before the vacuum drying of the other FOUP 20 in the vacuum tank 6 is completed, and standby on the disassembly / connection table 4. In this way, the robot 3 can transfer the other FOUP 20 during the self-cleaning process. In addition, although the robot 3 cannot be used for transferring the other FOUP 20, it can standby while the door 20b removed from the cleaning tank 5 is transferred to the disassembly / connection table 4 and the housing 20a removed from the cleaning tank 5 is held by the robot 3. Alternatively, it can standby while the housing 20a is transferred to the disassembly / connection table 4 and the door 20b is held by the robot 3.

[0122] Alternatively, the self-cleaning process can also be performed by having the user operate an input interface such as a mouse, keyboard, or touch panel to activate the components within the cleaning tank 5. That is, the self-cleaning process can also be performed without the control of the control unit 8.

[0123] Furthermore, in step S102, the flow rate of the cleaning fluid ejected from nozzle 5m can be the same as the flow rate of the cleaning fluid ejected from nozzle 5m when cleaning the housing 20a. For example, the flow rate of the cleaning fluid ejected from nozzle 5m reaching the second cleaning fluid supply unit 5e and the third cleaning fluid supply unit 5p can be calculated in advance. Then, the housing 20a can be cleaned using the calculated flow rate.

[0124] Furthermore, in step S105, the flow rate of the cleaning fluid ejected from nozzles 5o and 5r when cleaning the first cleaning fluid supply unit 5d can be the same as the flow rate of the cleaning fluid ejected from nozzles 5o and 5r when cleaning the housing 20a. For example, the flow rate of the cleaning fluid ejected from nozzles 5o and 5r reaching the first cleaning fluid supply unit 5d can be calculated in advance. Then, the housing 20a can be cleaned using the calculated flow rate.

[0125] While several embodiments of the present invention have been described above, these embodiments are merely illustrative and not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments or variations thereof are included in the scope or spirit of the invention, and are encompassed within the scope of the claims and their equivalents.

Claims

1. A wafer storage container cleaning apparatus for cleaning a wafer storage container, the wafer storage container having: a shell having a shell opening; and a door installed in the shell opening, the wafer storage container cleaning apparatus comprising: The main body of the cleaning tank is a container with an opening on its upper surface and capable of accommodating the wafer storage container inside; A cover is provided on the opening side of the main body of the cleaning tank to open / close the opening of the main body of the cleaning tank; The mounting part is provided inside the main body of the cleaning tank, and can mount the housing with the housing opening facing downwards; The first cleaning fluid spraying unit is disposed inside the housing when the housing is placed by the mounting unit, i.e., in the housing-placed state, and sprays cleaning fluid onto the inner surface of the housing. A second cleaning fluid spraying section is provided on the outside of the housing in the housing-mounted state, and sprays cleaning fluid onto the outer surface of the housing; and, The control unit controls the first cleaning fluid spraying unit and the second cleaning fluid spraying unit. The nozzles of the first cleaning fluid ejection section and the second cleaning fluid ejection section are positioned opposite each other in such a way that cleaning fluid can be ejected from one nozzle towards the other. When the housing is not placed by the mounting section, i.e., when the housing is not mounted, the control section controls the second cleaning fluid spraying section to spray cleaning fluid from the first cleaning fluid spraying section.

2. The wafer storage container cleaning device according to claim 1, wherein, Before controlling the second cleaning fluid spraying section to spray cleaning fluid from the first cleaning fluid spraying section, the control unit controls the first cleaning fluid spraying section to spray cleaning fluid from the second cleaning fluid spraying section.

3. The wafer storage container cleaning device according to claim 1, wherein, The cover has a retaining mechanism for holding the door in place. The wafer storage container cleaning device further includes a third cleaning liquid spraying unit. When the housing is in a mounted state and the door is held in a door-holding state by the holding mechanism, the third cleaning liquid spraying unit sprays cleaning liquid onto the upper surface of the outer surface of the housing and the inner surface of the door facing the upper surface of the housing. The first cleaning fluid spraying part includes a spraying port that sprays the cleaning fluid onto the upper surface of the inner surface of the housing when the housing is mounted. The nozzle of the first cleaning fluid ejection section that ejects the cleaning fluid to the upper surface of the inner surface of the housing and the nozzle of the third cleaning fluid ejection section are facing each other in such a way that cleaning fluid can be ejected from one nozzle towards the other nozzle.

4. The wafer storage container cleaning apparatus according to claim 3, wherein, The control unit also controls the third cleaning fluid spraying unit. When the housing is not in a loaded state and the door is not held by the holding mechanism (i.e., when the door is not held), the control unit controls the second cleaning fluid spray section and the third cleaning fluid spray section in such a way that cleaning fluid is sprayed from the first cleaning fluid spray section.

5. The wafer storage container cleaning apparatus according to claim 4, wherein, Before controlling the second and third cleaning fluid spraying sections to spray cleaning fluid into the first cleaning fluid spraying section, the control unit controls the first cleaning fluid spraying section to spray cleaning fluid into the second and third cleaning fluid spraying sections.

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